JPH07100766B2 - Epoxy resin powder coating composition - Google Patents
Epoxy resin powder coating compositionInfo
- Publication number
- JPH07100766B2 JPH07100766B2 JP62158638A JP15863887A JPH07100766B2 JP H07100766 B2 JPH07100766 B2 JP H07100766B2 JP 62158638 A JP62158638 A JP 62158638A JP 15863887 A JP15863887 A JP 15863887A JP H07100766 B2 JPH07100766 B2 JP H07100766B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- epoxy resin
- powder
- parts
- powder coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/934—Powdered coating composition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、エポキシ樹脂粉体塗料組成物に関するもので
あり、特に低温（90〜100℃）において塗装できるので
例えばフィルムコンデンサー、半導体部品等の被覆塗装
に好適に用いることができる。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin powder coating composition, which can be applied particularly at low temperatures (90 to 100 ° C.), and thus can be applied to, for example, film capacitors and semiconductor parts. It can be suitably used for coating.
従来、フィルムコンデンサーを被覆できる粉体塗料とし
て、エポキシ樹脂（融点80〜100℃）70〜80％、硬化剤
（酸無水物）30〜20％その他（フィラー、難燃剤、促進
剤など）１〜30％からなる組成物が知られている（特開
昭58−194324号）。Conventionally, as powder coatings that can coat film capacitors, epoxy resin (melting point 80-100 ° C) 70-80%, curing agent (acid anhydride) 30-20% Others (filler, flame retardant, accelerator, etc.) 1 A composition comprising 30% is known (Japanese Patent Laid-Open No. 194324/1983).
しかし、このような従来のエポキシ粉体塗料は、貯蔵安
定性や塗装時の粉体流動性に優れているが、該粉体塗料
を、例えば、ポリプロピレンフィルム、ポリエステルフ
ィルム等の誘電体と、その誘電体を介在させた電極とリ
ード線のみから成るフィルムコンデンサー素子の表面に
被覆塗装して得られるフィルムコンデンサーは、耐湿性
は良いが粉体塗装のために素子を120℃に加熱したとき
誘電体フィルムが熱変形を受けやすく、その結果、電気
容量が上らないという問題があった。However, although such a conventional epoxy powder coating material is excellent in storage stability and powder fluidity at the time of coating, the powder coating material is formed of, for example, a dielectric material such as a polypropylene film or a polyester film, and Film capacitor consisting of only electrodes and lead wires with a dielectric intervening The film capacitor obtained by coating and coating the surface of the element has good moisture resistance, but when the element is heated to 120 ° C for powder coating, the dielectric There is a problem that the film is susceptible to thermal deformation, and as a result, the electric capacity does not increase.
一方、フィルムコンデンサー素子を上記温度よりも20〜
30℃下げて90〜100℃で粉体塗装したとき、誘電体フィ
ルムが変形するという問題は解消するが、フィルムコン
デンサー素子の表面に粉体塗料が十分に溶融付着せず、
その上、溶融塗膜の硬化が遅いという問題があった。そ
こで、耐湿性、粉体の貯蔵安定性、粉体流動性を維持し
ながら、90〜100℃で塗装が可能な粉体塗料が望まれて
いた。On the other hand, if the film capacitor element is
When powder coating at 90-100 ° C with 30 ° C reduction, the problem that the dielectric film is deformed is solved, but the powder coating does not melt and adhere sufficiently to the surface of the film capacitor element,
In addition, there is a problem that the curing of the molten coating film is slow. Therefore, there has been a demand for a powder coating which can be coated at 90 to 100 ° C while maintaining the moisture resistance, the storage stability of the powder, and the fluidity of the powder.
本発明の目的は、電気電子部品の被覆塗装において、耐
湿性、粉体の貯蔵安定性、粉体の流動性及び硬化速度に
ついては従来のものと同程度の性能を維持しながら、例
えば、フィルムコンデンサーのように熱容量が比較的小
さく、しかも熱変形を受やすい部品を低温（90〜100
℃）にて塗装することができる粉体塗料を提供すること
にある。An object of the present invention is to coat electric and electronic parts with moisture resistance, powder storage stability, powder flowability and curing rate while maintaining the same performance as conventional ones, for example, a film. Parts that have a relatively small heat capacity, such as a condenser, and are susceptible to thermal deformation can be used at low temperatures (90 to 100
It is to provide a powder coating material that can be coated at (° C).
本発明によれば、 （Ａ）平均分子量900〜1200のビスフェノールＡ型エポ
キシ樹脂50〜70重量％とクレゾールノボラックエポキシ
樹脂50〜30重量％からなる軟化点60〜75℃の混合エポキ
シ樹脂100重量部、 （Ｂ）フェノールノボラック樹脂５〜80重量部、 （Ｃ）トリフェニルホスフィン0.5〜５重量部、 （Ｄ）無機粉末60〜200重量部、 （Ｅ）シリカ超微粉末0.01〜２重量部、 とから成るエポキシ樹脂粉体塗料組成物が提供される。According to the present invention, (A) 100 parts by weight of a mixed epoxy resin having a softening point of 60 to 75 ° C., which comprises 50 to 70% by weight of a bisphenol A type epoxy resin having an average molecular weight of 900 to 1200 and 50 to 30% by weight of a cresol novolac epoxy resin. , (B) phenol novolac resin 5 to 80 parts by weight, (C) triphenylphosphine 0.5 to 5 parts by weight, (D) inorganic powder 60 to 200 parts by weight, (E) ultrafine silica powder 0.01 to 2 parts by weight, An epoxy resin powder coating composition is provided.
本発明の粉体塗料に用いるエポキシ樹脂は、平均分子量
900〜1200のビスフェノールＡ型エポキシ樹脂50〜70重
量％とクレゾールノボラックエポキシ樹脂50〜30重量％
からなる軟化点60〜75℃の混合エポキシ樹脂である。ビ
スフェノールＡ型エポキシ樹脂の平均分子量は900〜120
0、好ましくは950〜1100であり、900未満では得られた
粉体塗料はブロッキングが起って塗装時に粉体流動性が
悪くなり、1200超では塗装して得られた電気電子部品等
の耐湿性が低下する。クレゾールノボラックエポキシ樹
脂は、軟化点が通常60〜100℃のものがあり、好ましく
は軟化点が65〜80℃のものを用いるとよい。本発明の粉
体塗料には上記ビスフェノールＡ型エポキシ樹脂とクレ
ゾールノボラックエポキシ樹脂からなる混合エポキシ樹
脂を用いるが、混合エポキシ樹脂中にはビスフェノール
Ａ型エポキシ樹脂が50〜70重量％含まれ、50重量％未満
ではできた塗膜の密着性が徐々に低下し、70重量％超で
は塗装して得られた電気電子部品等の耐湿性が低下す
る。クレゾールノボラツクエポキシ樹脂は混合エポキシ
中に50〜30重量％含まれ、50重量％超では得られた粉体
塗料の貯蔵安定性が低下し、30重量％未満では塗膜の硬
化速度が遅くなり、そのうえ塗装して得られた電気電子
部品等の耐湿性が低下する。混合エポキシ樹脂の軟化点
は60〜75℃、好ましくは62〜70℃であり、軟化点が60℃
未満のとき、できた粉体塗料は粉体流動性が悪くなり、
75℃超ではフィルムコンデンサーのように熱容量の小さ
い部品を低温（90〜100℃）で塗装しても、粉体塗料が
被塗装物に付着しにくく、所望の膜厚が得られない。The epoxy resin used in the powder coating of the present invention has an average molecular weight
900-1200 bisphenol A type epoxy resin 50-70% by weight and cresol novolac epoxy resin 50-30% by weight
Is a mixed epoxy resin having a softening point of 60 to 75 ° C. The average molecular weight of bisphenol A type epoxy resin is 900-120
0, preferably 950 to 1100, and when less than 900, the powder coating obtained has poor powder fluidity during coating, and when it exceeds 1200, it has moisture resistance of electric and electronic parts etc. obtained by coating. Sex decreases. The cresol novolac epoxy resin has a softening point of usually 60 to 100 ° C, and preferably a softening point of 65 to 80 ° C is used. A mixed epoxy resin composed of the bisphenol A type epoxy resin and the cresol novolac epoxy resin is used in the powder coating material of the present invention, and the mixed epoxy resin contains 50 to 70% by weight of the bisphenol A type epoxy resin. If it is less than 100% by weight, the adhesion of the coating film formed will gradually decrease, and if it exceeds 70% by weight, the moisture resistance of the electric and electronic parts etc. obtained by coating will decrease. Cresol novolac epoxy resin is contained in the mixed epoxy in an amount of 50 to 30% by weight. If it exceeds 50% by weight, the storage stability of the resulting powder coating will be reduced, and if it is less than 30% by weight, the curing speed of the coating film will be slow. In addition, the moisture resistance of the electric and electronic parts etc. obtained by coating is deteriorated. The softening point of the mixed epoxy resin is 60 to 75 ° C, preferably 62 to 70 ° C, and the softening point is 60 ° C.
When it is less than, the resulting powder coating has poor powder fluidity,
When the temperature exceeds 75 ° C, even if a component having a small heat capacity such as a film capacitor is coated at a low temperature (90 to 100 ° C), the powder coating is difficult to adhere to the object to be coated, and the desired film thickness cannot be obtained.
本発明の粉体塗料には、エポキシ樹脂用硬化剤としてフ
ェノールノボラック樹脂を配合する。その軟化点は通常
70〜120℃であるが、好ましくは70〜100℃である。その
使用量はエポキシ樹脂100重量部当り、５〜80重量部で
あり、この範囲を外れたときは塗装して得られた電気電
子部品等の耐湿性が徐々に低下する。特に耐湿性が高度
に要求される場合には、10〜30重量部が好ましい。The powder coating composition of the present invention contains a phenol novolac resin as a curing agent for epoxy resin. Its softening point is usually
The temperature is 70 to 120 ° C, preferably 70 to 100 ° C. The amount used is 5 to 80 parts by weight per 100 parts by weight of the epoxy resin, and when the amount is out of this range, the moisture resistance of the electric and electronic parts etc. obtained by coating gradually decreases. Particularly when moisture resistance is highly required, 10 to 30 parts by weight is preferable.
本発明の粉体塗料には、硬化触媒としてトリフェニルホ
スフィンをエポキシ樹脂100重量部当り0.5〜５重量部用
いる。0.5重量部未満では硬化速度が遅く、５重量部超
では塗装して得られた電気電子部品等の耐湿性が低下す
る。特に、耐湿性が高度に求要される電気電子部品には
0.5〜２重量部が好ましい。In the powder coating material of the present invention, 0.5 to 5 parts by weight of triphenylphosphine is used as a curing catalyst per 100 parts by weight of the epoxy resin. If it is less than 0.5 part by weight, the curing speed is slow, and if it exceeds 5 parts by weight, the moisture resistance of the electric and electronic parts obtained by coating is deteriorated. Especially for electric and electronic parts that require high humidity resistance
0.5 to 2 parts by weight is preferable.
本発明の粉体塗料には、無機粉末が配合されるが、この
無機粉末としては、慣用のもの、例えば、シリカ、炭酸
カルシウム、ドロマイト（Ca・Mg（CO3）２）、ケイ酸
カルシウム、アルミナ、クレー、マイカ、タルク、ガラ
ス繊維粉末等が使用可能であるが、耐湿性の良好な電気
電子部品等を製造するために好適な被覆塗装用粉体塗料
を得るには、例えば、シリカ粉末がよい。無機粉末の平
均粒径は、0.5〜75μｍ、好ましくは３〜50μｍであ
る。上記無機粉末の使用量は、エポキシ樹脂100重量部
当り60〜200重量部、好ましくは70〜90重量部である。6
0重量部未満では塗装して得られた電気電子部品の耐湿
性が徐々に低下し、200重量部超では塗装時に粉体塗料
の被塗装物への付着性が悪くなり、所望の厚みの塗膜が
得られない。Inorganic powder is blended in the powder coating material of the present invention. As the inorganic powder, conventional ones such as silica, calcium carbonate, dolomite (Ca · Mg (CO 3 ) 2 ) and calcium silicate, Alumina, clay, mica, talc, glass fiber powder and the like can be used, but in order to obtain a powder coating material suitable for coating for producing electric / electronic parts having good moisture resistance, for example, silica powder Is good. The average particle size of the inorganic powder is 0.5 to 75 μm, preferably 3 to 50 μm. The amount of the inorganic powder used is 60 to 200 parts by weight, preferably 70 to 90 parts by weight, per 100 parts by weight of the epoxy resin. 6
If it is less than 0 parts by weight, the moisture resistance of the electric and electronic parts obtained by coating will gradually decrease, and if it exceeds 200 parts by weight, the adhesion of the powder coating material to the object to be coated will become poor at the time of coating, and a coating of the desired thickness will be obtained. No film can be obtained.
本発明の粉体塗料にはシリカ超微粉末をエポキシ樹脂10
0重量当り0.01〜２重量部、好ましくは0.3〜２重量部配
合する。シリカ超微粉末の平均粒径は１〜100nmであ
り、配合量が0.01重量部未満では粉体塗料としたときの
粉体流動性が低下し、２重量部超では塗膜にピンホール
が発生したり、塗膜の光沢が無くなったりする。For the powder coating of the present invention, silica ultrafine powder is used as the epoxy resin 10
The amount is 0.01 to 2 parts by weight, preferably 0.3 to 2 parts by weight per 0 parts by weight. The silica ultrafine powder has an average particle size of 1 to 100 nm. If the blending amount is less than 0.01 parts by weight, the powder fluidity when used as a powder coating is reduced, and if it exceeds 2 parts by weight, pinholes occur in the coating film. Or the gloss of the coating film disappears.
本発明の粉体塗料には、前記成分の他、この種粉体塗料
に慣用の補助成分、例えば、シランカップリング剤、ア
クリル酸エステルオリゴマー等のレベリング剤、顔料、
各種硬化促進剤等を適量配合することができる。In the powder coating material of the present invention, in addition to the above-mentioned components, auxiliary components commonly used in this seed powder coating material, for example, a silane coupling agent, a leveling agent such as an acrylate ester oligomer, a pigment,
An appropriate amount of various curing accelerators and the like can be blended.
本発明のエポキシ樹脂粉体塗料を調製するには、通常の
方法を用いればよく、例えば、配合成分をミキサー等に
よって混合した後、ニーダ等による混合処理を施すか、
エクストルーダ等による溶融混合処理を施した後、混合
物を冷却固化し、微粉砕すればよい。In order to prepare the epoxy resin powder coating material of the present invention, a usual method may be used, for example, after mixing the blended components with a mixer or the like, a mixing treatment with a kneader or the like, or
After the melt-mixing treatment with an extruder or the like, the mixture may be solidified by cooling and finely pulverized.
〔効果〕 本発明の粉体塗料は、電気電子部品の被覆塗装におい
て、耐湿性、粉体の貯蔵安定性、粉末の流動性、及び硬
化速度については従来のものと同程度の性能を維持しな
がら、例えば、フィルムコンデンサーのように熱容量が
比較的小さく、しかも熱変形を受けやすい部品を低温
（90〜100℃）にて塗装することができる。[Effect] The powder coating material of the present invention maintains the same performance as the conventional coating material in coating coating of electric and electronic parts with respect to moisture resistance, powder storage stability, powder fluidity, and curing speed. However, for example, a component such as a film capacitor having a relatively small heat capacity and easily subjected to thermal deformation can be coated at a low temperature (90 to 100 ° C.).
次に本発明を実施例によりさらに詳細に説明する。 Next, the present invention will be described in more detail with reference to Examples.
表−１に示す成分組成（重量部）の樹脂組成物を調製
し、その性能評価を行い、その結果を表−１に示す。な
お、表−１に示した配合成分は１の内容を有する。A resin composition having the component composition (parts by weight) shown in Table 1 was prepared, its performance was evaluated, and the results are shown in Table 1. The blending components shown in Table-1 have the content of 1.
エピコート1007・・・・・油化シェルエポキシ社製（ビ
スフェノールＡ型エポキシ樹脂、分子量2900） エピコート1002・・・・油化シェルエポキシ社製（ビス
フェノールＡ型エポキシ樹脂、分子量1200） エピコート1001・・・・油化シェルエポキシ社製（ビス
フェノールＡ型エポキシ樹脂、分子量900） EOCN 102S・・・・日本化薬社製（オルソクレゾールノ
ボラックエポキシ樹脂、軟化点65℃） フェノールノボラック樹脂・・・・軟化点90℃ シリカ・・・・結晶シリカ、平均粒径６μｍ シランカップリング剤・・・・３−グリシドキシプロピ
ルトリメトキシシラン アエロジル・・・・日本アエロジル社製（シリカ超微粉
末、平均粒径約7nm） また、エポキシ樹脂組成物の評価方法及び評価基準は次
の通りである。Epicoat 1007: Made by Yuka Shell Epoxy Co. (bisphenol A type epoxy resin, molecular weight 2900) Epicoat 1002 ... Made by Yuka Shell Epoxy Co. (bisphenol A type epoxy resin, molecular weight 1200) Epicoat 1001 ...・ Yukaka Shell Epoxy Co., Ltd. (bisphenol A type epoxy resin, molecular weight 900) EOCN 102S ... ・ Nippon Kayaku Co., Ltd. (Orthocresol novolac epoxy resin, softening point 65 ° C.) Phenol novolac resin ... ℃ Silica ... ・ Crystalline silica, average particle size 6 μm Silane coupling agent ・ ・ ・ ・ 3-Glycidoxypropyltrimethoxysilane Aerosil ・ ・ ・ ・ Nippon Aerosil Co., Ltd. (Ultrafine silica powder, average particle size about 7 nm ) Moreover, the evaluation method and evaluation criteria of the epoxy resin composition are as follows.
粉体塗料のゲルタイムをJIS C−2104によって熱板温度1
00℃で測定し、ゲルタイムが200秒以上600秒未満は硬化
性「良」と判定した。Determine the gel time of powder coating according to JIS C-2104, hot plate temperature 1
The gel time was measured at 00 ° C., and the curability was judged to be “good” when the gel time was 200 seconds or more and less than 600 seconds.
粉体塗料を40℃、相対湿度80％の恒温恒湿室に７日間貯
蔵したときにゲルタイム（JIS C−2104、熱板温度150
℃）測定し、その値を粉体製造直後のゲルタイム（上記
と同じ条件）を100としたとき、30以上を貯蔵性「良」
と判定した。When the powder coating was stored in a constant temperature and humidity room at 40 ° C and 80% relative humidity for 7 days, gel time (JIS C-2104, hot plate temperature 150
(° C), and the value is set to 100 for gel time immediately after powder production (same conditions as above), 30 or more indicates good storability.
It was determined.
縦200mm、横90mm、深さ130mmの流動浸漬槽の中に粉体塗
料700gを投入し、上記流動浸漬槽の底面から実質的に均
一に空気を噴射し、その噴射開始後、粉体がその見掛上
の嵩が最大になりかつ安定流動化するまでの所要時間を
測定し、その所要時間で流動性を表わした。この場合、
粉体が安定流動化している時の空気流量は室温で10.5
／分とした。所要所間が10秒以下のものは粉体の流動性
「良」と判断した。200 mm in length, 90 mm in width, and 700 g of powder coating in a fluid immersion tank with a depth of 130 mm, and substantially uniformly air is jetted from the bottom surface of the fluidized dipping tank, and the powder is The time required until the apparent bulk was maximized and stable fluidization was measured, and the fluidity was expressed by the time required. in this case,
The air flow rate is 10.5 at room temperature when the powder is fluidized stably.
/ Min. If the required distance was 10 seconds or less, the fluidity of the powder was judged to be “good”.
メタライズポリエステルフィルムとリード線のみから成
るコンデンサー素子を100℃に加熱し、この素子の上に
粉体塗料を用いて流動侵漬法によって塗装し、得られた
塗膜にピンホールが無く、塗膜は光沢に優れ、塗膜の厚
みが0.5mm以上であったとき、粉体塗装性は「良」と判
断した。A capacitor element consisting of a metallized polyester film and lead wires is heated to 100 ° C, and a powder coating is applied to this element by the fluid immersion method. Was excellent in gloss, and when the thickness of the coating film was 0.5 mm or more, the powder coatability was judged to be “good”.
粉体塗料を用いて被覆塗装したフィルムコンデンサーを
85℃、相対湿度95％の恒温恒槽内に240時間入れ、加湿
テスト前及びその直後のフィルムコンデンサーの電気容
量を測定し、それぞれの値をX,Yとしたとき、Y/Xの値が
0.95以上ならばフィルムコンデンサーの耐湿性は「良」
と判断した。A film capacitor coated with powder coating
Put the capacitors in a constant temperature bath at 85 ℃ and 95% relative humidity for 240 hours, measure the electric capacity of the film capacitor before and immediately after the humidification test. When the respective values are defined as X and Y, the value of Y / X is
Moisture resistance of film capacitor is "good" if 0.95 or more
I decided.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 今井 邦雄 埼玉県久喜市南２丁目１番33号 (56)参考文献 特開 昭55−156341（ＪＰ，Ａ) 特開 昭59−226065（ＪＰ，Ａ) 特開 昭60−250075（ＪＰ，Ａ) 特開 昭57−212225（ＪＰ，Ａ) 特開 昭58−113267（ＪＰ，Ａ) 「塗装と塗料」’83．９（Ｎｏ．371) 第50〜51頁 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kunio Imai 2-31 Minami 2-chome, Kuki City, Saitama Prefecture (56) References JP 55-156341 (JP, A) JP 59-226065 (JP, A) JP-A-60-250075 (JP, A) JP-A-57-212225 (JP, A) JP-A-58-113267 (JP, A) "Paint and paint" '83 .9 (No. 371) No. Pages 50-51
Claims (2)
ルＡ型エポキシ樹脂50〜70重量％とクレゾールノボラッ
クエポキシ樹脂50〜30重量％からなる軟化点60〜75℃の
混合エポキシ樹脂100重量部、 （Ｂ）フェノールノボラック樹脂５〜80重量部、 （Ｃ）トリフェニルホスフィン0.5〜５重量部、 （Ｄ）無機粉末60〜200重量部、 （Ｅ）シリカ超微粉末0.01〜２重量部、 とから成るエポキシ樹脂粉体塗料組成物。(A) 100 parts by weight of a mixed epoxy resin having a softening point of 60 to 75 ° C., which is composed of 50 to 70% by weight of a bisphenol A type epoxy resin having an average molecular weight of 900 to 1200 and 50 to 30% by weight of a cresol novolac epoxy resin. , (B) phenol novolac resin 5 to 80 parts by weight, (C) triphenylphosphine 0.5 to 5 parts by weight, (D) inorganic powder 60 to 200 parts by weight, (E) ultrafine silica powder 0.01 to 2 parts by weight, An epoxy resin powder coating composition comprising
囲第（１）項のエポキシ樹脂粉体塗料組成物。2. The epoxy resin powder coating composition according to claim 1, wherein the inorganic powder is silica.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62158638A JPH07100766B2 (en) | 1987-06-25 | 1987-06-25 | Epoxy resin powder coating composition |
| KR1019880007635A KR960008475B1 (en) | 1987-06-25 | 1988-06-24 | Epoxy resin based powder coating composition |
| CA000570433A CA1325299C (en) | 1987-06-25 | 1988-06-24 | Epoxy resin based powder coating composition |
| US07/437,134 US5049596A (en) | 1987-06-25 | 1989-11-16 | Epoxy resin based powder coating composition with mixed filler including microfine silica |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62158638A JPH07100766B2 (en) | 1987-06-25 | 1987-06-25 | Epoxy resin powder coating composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPS641771A JPS641771A (en) | 1989-01-06 |
| JPH011771A JPH011771A (en) | 1989-01-06 |
| JPH07100766B2 true JPH07100766B2 (en) | 1995-11-01 |
Family
ID=15676085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62158638A Expired - Lifetime JPH07100766B2 (en) | 1987-06-25 | 1987-06-25 | Epoxy resin powder coating composition |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5049596A (en) |
| JP (1) | JPH07100766B2 (en) |
| KR (1) | KR960008475B1 (en) |
| CA (1) | CA1325299C (en) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5143950A (en) * | 1987-02-07 | 1992-09-01 | Somar Corporation | Power coating of epoxy resin mixture and polyvinyl butyral or formal resin |
| DE3913966B4 (en) * | 1988-04-28 | 2005-06-02 | Ibiden Co., Ltd., Ogaki | Adhesive dispersion for electroless plating, and use for producing a printed circuit |
| JPH0493362A (en) * | 1990-08-10 | 1992-03-26 | Toshiba Ceramics Co Ltd | Filler for sealing electronic part and production thereof |
| JP2668289B2 (en) * | 1991-01-25 | 1997-10-27 | ソマール 株式会社 | Epoxy resin composition for powder coating |
| JP2524011B2 (en) * | 1991-05-23 | 1996-08-14 | 株式会社日立製作所 | Thermosetting resin composition for high-voltage coil casting, mold coil and panel obtained by casting and curing with the composition |
| JP2600029B2 (en) * | 1991-06-25 | 1997-04-16 | 住友デュレズ株式会社 | Epoxy resin composition suitable for carbon dioxide laser printing |
| DE4204266C2 (en) * | 1992-02-13 | 1996-04-18 | Basf Lacke & Farben | Powder coating and process for the interior coating of packaging containers |
| DE4322437C1 (en) * | 1993-07-06 | 1995-03-30 | Basf Lacke & Farben | Powder coating, process for the external coating of metal pipes and use of the powder coating for single-layer external coating of metal pipes |
| US6710105B1 (en) | 1993-07-09 | 2004-03-23 | Jens Awe | Curable epoxy resin composition comprising fillers |
| EP0633286A1 (en) * | 1993-07-09 | 1995-01-11 | Ciba-Geigy Ag | Curable filled epoxy resin composition |
| JPH09255896A (en) * | 1996-03-26 | 1997-09-30 | Nippon Paint Co Ltd | Powdery coating material composition to be readily screened |
| US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
| US6168859B1 (en) | 1998-01-29 | 2001-01-02 | The Dow Chemical Company | Filler powder comprising a partially coated alumina powder and process to make the filler powder |
| US6410615B1 (en) * | 1998-06-09 | 2002-06-25 | Nitto Denko Corporation | Semiconductor sealing epoxy resin composition and semiconductor device using the same |
| DE19857317A1 (en) * | 1998-12-11 | 2000-06-15 | Inst Neue Mat Gemein Gmbh | domestic appliances |
| KR100554352B1 (en) * | 1998-12-31 | 2006-12-19 | 주식회사 케이씨씨 | Method for producing a noblock modified epoxy resin and powder coating composition using the same |
| WO2001013686A1 (en) * | 1999-08-12 | 2001-02-22 | Ibiden Co., Ltd. | Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device |
| DE10152829A1 (en) * | 2001-10-25 | 2003-05-15 | Basf Coatings Ag | Powdery coating material and functional coatings for high long-term use temperatures |
| US6548576B1 (en) | 2001-11-07 | 2003-04-15 | Bourns, Inc. | Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| KR100501798B1 (en) * | 2002-02-09 | 2005-07-20 | 서해조 | epoxy resin composite and manufacturing method for covering forming of electromagnetic parts |
| US7052541B2 (en) * | 2002-06-19 | 2006-05-30 | Board Of Regents, The University Of Texas System | Color compositions |
| US20050048700A1 (en) * | 2003-09-02 | 2005-03-03 | Slawomir Rubinsztajn | No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance |
| AT412555B (en) * | 2003-01-24 | 2005-04-25 | Tigerwerk Lack Und Farbenfabri | PLASTIC BINDER FOR PRODUCING POWDER COATS |
| JP4250996B2 (en) * | 2003-03-28 | 2009-04-08 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
| CN100371403C (en) * | 2003-04-21 | 2008-02-27 | 索玛株式会社 | mfg. method of soaking adaptable liquid epoxy resin compound, and generator thereof |
| JP4003780B2 (en) * | 2004-09-17 | 2007-11-07 | カシオ計算機株式会社 | Semiconductor device and manufacturing method thereof |
| US7425235B2 (en) * | 2005-02-11 | 2008-09-16 | The Board Of Regents Of The University Of Texas System | Color compositions and methods of manufacture |
| JP4799883B2 (en) * | 2005-03-01 | 2011-10-26 | 日東電工株式会社 | Epoxy resin composition cured body, method for producing the same, and optical semiconductor device using the same |
| US10041176B2 (en) | 2005-04-07 | 2018-08-07 | Momentive Performance Materials Inc. | No-rinse pretreatment methods and compositions |
| WO2006138566A2 (en) * | 2005-06-17 | 2006-12-28 | The Board Of Regents Of The University Of Texas System | Organic/inorganic lewis acid composite materials |
| NO327763B1 (en) * | 2006-09-15 | 2009-09-21 | Elkem As | Procedure for cementing gas and oil wells and cement slurry |
| KR101708941B1 (en) * | 2009-10-14 | 2017-02-21 | 스미토모 베이클리트 컴퍼니 리미티드 | Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device |
| CN105073918A (en) * | 2013-03-02 | 2015-11-18 | 朋诺股份有限公司 | Heat-dissipating powder coating composition, heat-dissipating coating film, and coated article |
| JP6218265B2 (en) * | 2013-03-02 | 2017-10-25 | 荒川化学工業株式会社 | Heat dissipating powder coating composition and heat dissipating coating film |
| JP6902839B2 (en) * | 2016-09-16 | 2021-07-14 | ソマール株式会社 | Powder paint |
| US20230340291A1 (en) * | 2020-06-17 | 2023-10-26 | Nippon Steel Corporation | Coating composition for electrical steel sheet, electrical steel sheet, laminated core and rotary electric machine |
| JP6888748B1 (en) * | 2020-07-31 | 2021-06-16 | 住友ベークライト株式会社 | Powder paint |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2338430C3 (en) * | 1973-07-28 | 1978-10-12 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Heat-curable, thickened epoxy resin compounds |
| CH606252A5 (en) * | 1977-01-07 | 1978-10-31 | Ciba Geigy Ag | |
| JPS55156341A (en) * | 1979-05-23 | 1980-12-05 | Matsushita Electric Ind Co Ltd | Resin composition for realing electronic parts |
| JPS59226065A (en) * | 1983-06-08 | 1984-12-19 | Sumitomo Deyurezu Kk | Epoxy resin powder coating composition |
| JPS60250075A (en) * | 1984-05-28 | 1985-12-10 | Dainippon Toryo Co Ltd | Powder coating composition for reinforcing iron rod |
| JPS60260611A (en) * | 1984-06-08 | 1985-12-23 | Mitsubishi Petrochem Co Ltd | Production of high-molecular weight cresol novolak resin |
| US4720515A (en) * | 1985-05-17 | 1988-01-19 | Denki Kagaku Kogyo Kabushiki Kaisha | Epoxy resin composition for encapsulating semiconductor |
| JPH0676474B2 (en) * | 1986-12-23 | 1994-09-28 | 住友ベークライト株式会社 | Insulating resin paste for semiconductors |
-
1987
- 1987-06-25 JP JP62158638A patent/JPH07100766B2/en not_active Expired - Lifetime
-
1988
- 1988-06-24 CA CA000570433A patent/CA1325299C/en not_active Expired - Fee Related
- 1988-06-24 KR KR1019880007635A patent/KR960008475B1/en not_active IP Right Cessation
-
1989
- 1989-11-16 US US07/437,134 patent/US5049596A/en not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
|---|
| 「塗装と塗料」’８３．９（Ｎｏ．３７１）第５０〜５１頁 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS641771A (en) | 1989-01-06 |
| KR890000613A (en) | 1989-03-15 |
| US5049596A (en) | 1991-09-17 |
| CA1325299C (en) | 1993-12-14 |
| KR960008475B1 (en) | 1996-06-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH07100766B2 (en) | Epoxy resin powder coating composition | |
| JPH011771A (en) | Epoxy resin powder coating composition | |
| JPH0710958B2 (en) | Epoxy resin powder coating suitable for slot insulation | |
| JPS61259552A (en) | Semiconductor sealing device | |
| JPH02300230A (en) | Electrical part and casting material for it | |
| US5112888A (en) | Epoxy resin composition containing long chain aliphatic diacids and/or diphenylol derivatives | |
| JPH02227451A (en) | Filler for resins and liquid epoxy resin composition | |
| JPH05287219A (en) | Epoxy resin powder coating material | |
| JPS6088079A (en) | Powdered epoxy resin paint composition | |
| JPH0493343A (en) | Powdered resin composition | |
| JP2697510B2 (en) | Epoxy resin composition for semiconductor encapsulation | |
| JPH0977958A (en) | Epoxy resin composition and semiconductor device | |
| JPH07103343B2 (en) | Epoxy resin powder coating suitable for slot insulation | |
| JPH10182941A (en) | Epoxy resin composition | |
| JPS63193970A (en) | Epoxy resin powder coating | |
| JPH0223584B2 (en) | ||
| JP2000256618A (en) | Resin composition and film-forming material comprising same | |
| JP3312485B2 (en) | Powder epoxy resin composition | |
| JP3528925B2 (en) | Epoxy resin composition for semiconductor encapsulation | |
| KR950005345B1 (en) | Epory resin powder coating composition | |
| JPS63193969A (en) | Epoxy resin powder coating suitable for coil fixation | |
| JPS6189271A (en) | Epoxy resin composition for powder coating | |
| JPS6369872A (en) | Composition for electrically conductive epoxy resin coating | |
| JPH0579266B2 (en) | ||
| KR960000973B1 (en) | Epoxy powder paint for electric insulation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071101 Year of fee payment: 12 |