JPH05299963A - Electronic parts housing container - Google Patents

Electronic parts housing container

Info

Publication number
JPH05299963A
JPH05299963A JP9924792A JP9924792A JPH05299963A JP H05299963 A JPH05299963 A JP H05299963A JP 9924792 A JP9924792 A JP 9924792A JP 9924792 A JP9924792 A JP 9924792A JP H05299963 A JPH05299963 A JP H05299963A
Authority
JP
Japan
Prior art keywords
wiring layer
piezoelectric vibrator
metal support
metallized wiring
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9924792A
Other languages
Japanese (ja)
Inventor
Kiyoshi Tone
澄 登根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP9924792A priority Critical patent/JPH05299963A/en
Publication of JPH05299963A publication Critical patent/JPH05299963A/en
Pending legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:To provide a piezoelectric vibrator housing container in which a piezoelectric vibrator can be normally and stably operated for a long time by increasing the strength of the attachment of a metallize wiring layer provided on an insulating substrate to a metallic supporting body which supports the piezoelectric vibrator. CONSTITUTION:The piezoelectric vibrator housing container is constituted of the insulating substrate 1 having a metallize wiring layer 5 derived from an upper face to a bottom face, the metallic supporting body 6 attached to the metallize wiring layer 5 by a local part heating method, which supports the piezoelectric vibrator 4, and a cover body 2. The thickness of the part of the metal supporting body 6 attached to the metallize wiring layer 5 is 20-500mum.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は水晶や圧電セラミックス
等から成る圧電振動子を収容するための圧電振動子収納
用容器の改良に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a piezoelectric vibrator housing container for housing a piezoelectric vibrator made of crystal or piezoelectric ceramics.

【0002】[0002]

【従来の技術】従来、圧電振動子を収容するための圧電
振動子収納用容器は図2に示すように、アルミナセラミ
ックス等の電気絶縁材料から成り、その上面から側面を
介し底面にかけて導出されたメタライズ配線層12を有す
る絶縁基体11と、前記メタライズ配線層12にポリイミド
樹脂等から成る導電性接着剤13を介し接着された圧電振
動子14を支持するための一対の金属支持体15と、椀状の
蓋体16とから構成されており、一対の金属支持体15の両
端を導電性接着剤により接着し、圧電振動子14を金属支
持体15に支持させた後、真空中において蓋体16の下面を
絶縁基体11に樹脂、ガラス等から成る封止部材を介して
接合させ、圧電振動子14を絶縁基体11と蓋体16とから成
る容器内部に気密に封止することによって最終製品とし
ての圧電振動素子となる。
2. Description of the Related Art Conventionally, as shown in FIG. 2, a piezoelectric vibrator housing container for housing a piezoelectric vibrator is made of an electrically insulating material such as alumina ceramics, and is led out from the upper surface to the side surface to the bottom surface. An insulating substrate 11 having a metallized wiring layer 12, a pair of metal supports 15 for supporting a piezoelectric vibrator 14 adhered to the metallized wiring layer 12 via a conductive adhesive 13 made of a polyimide resin or the like, and a bowl. The pair of metal supports 15 are bonded to each other with a conductive adhesive to support the piezoelectric vibrator 14 on the metal supports 15, and then the lids 16 are placed in vacuum. The lower surface of the is bonded to the insulating substrate 11 via a sealing member made of resin, glass or the like, and the piezoelectric vibrator 14 is hermetically sealed inside the container made of the insulating substrate 11 and the lid body 16 to obtain a final product. Of the piezoelectric vibrating element.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、この従
来の圧電振動子収納用容器においては、金属支持体15が
ポリイミド樹脂等から成る導電性接着剤13を介して絶縁
基体11に設けたメタライズ配線層12に接着されているこ
と、及び金属支持体15は通常、コバール金属や42アロイ
等の金属から成り、該コバール金属等はポリイミド樹脂
から成る導電性接着剤に対し接合性が若干劣ること等か
ら金属支持体15をメタライズ配線層12に強固に接着させ
ることができず、圧電振動子に外部より大きな振動が繰
り返し印加されると金属支持体15が絶縁基体11のメタラ
イズ配線層12より外れて圧電振動素子としての機能が喪
失するという欠点を有していた。
However, in this conventional container for accommodating the piezoelectric vibrator, the metallized wiring layer in which the metal support 15 is provided on the insulating substrate 11 via the conductive adhesive 13 made of polyimide resin or the like is used. Since it is adhered to 12, and the metal support 15 is usually made of a metal such as Kovar metal or 42 alloy, the Kovar metal or the like has a slightly inferior bondability to a conductive adhesive made of a polyimide resin. When the metal support 15 cannot be firmly adhered to the metallized wiring layer 12 and the piezoelectric vibrator is repeatedly subjected to a vibration larger than the outside, the metal support 15 is dislocated from the metallized wiring layer 12 of the insulating substrate 11 and the piezoelectric element is removed. It has a drawback that the function as a vibration element is lost.

【0004】そこで上記欠点を解消するために金属支持
体15を絶縁基体11に設けたメタライズ配線層12に銀ロウ
等のロウ材を介しロウ付けすることが考えられる。
Therefore, in order to solve the above-mentioned drawbacks, it is conceivable to braze the metal support 15 to the metallized wiring layer 12 provided on the insulating substrate 11 via a brazing material such as silver brazing.

【0005】しかしながら、絶縁基体11のメタライズ配
線層12上に銀ロウ材を間に挟んで金属支持体15を載置さ
せるとともにこれを約900 ℃の温度の炉中に通し、銀ロ
ウ材を加熱溶融させることによって金属支持体15を絶縁
基体11に設けたメタライズ配線層12にロウ付けした場
合、ロウ付け時の熱が金属支持体15の全体に印加されて
金属支持体15のバネ性が劣化し、その結果、圧電振動子
14の振動周波数にバラツキが発生したり、圧電振動子15
に外部より振動が繰り返し印加されるとその振動がその
まま圧電振動子14に伝達され、圧電振動子14に破損を生
じたり、圧電振動子14の金属支持体15からの外れを発生
して圧電振動素子としての機能が喪失するという欠点を
誘発する。
However, the metal brazing material 15 is placed on the metallized wiring layer 12 of the insulating substrate 11 with the silver brazing material sandwiched therebetween, and this is passed through a furnace at a temperature of about 900 ° C. to heat the silver brazing material. When the metal support 15 is melted and brazed to the metallized wiring layer 12 provided on the insulating substrate 11, heat at the time of brazing is applied to the entire metal support 15 to deteriorate the springiness of the metal support 15. As a result, the piezoelectric vibrator
There are variations in the vibration frequency of 14 or the piezoelectric vibrator 15
When vibration is repeatedly applied from the outside to the piezoelectric vibrator 14, the vibration is transmitted to the piezoelectric vibrator 14 as it is, the piezoelectric vibrator 14 is damaged, or the piezoelectric vibrator 14 is disengaged from the metal support 15 to cause piezoelectric vibration. It causes a defect that the function as an element is lost.

【0006】[0006]

【発明の目的】本発明は上記欠点に鑑み案出されたもの
で、その目的は絶縁基体に設けたメタライズ配線層と圧
電振動子を支持する金属支持体との取着強度を強いもの
として圧電振動子を長期間にわたり正常、且つ安定に作
動させることができる圧電振動子収納用容器を提供する
ことにある。
SUMMARY OF THE INVENTION The present invention has been devised in view of the above drawbacks, and an object of the present invention is to provide a piezoelectric material having a strong attachment strength between a metallized wiring layer provided on an insulating substrate and a metal support for supporting a piezoelectric vibrator. An object of the present invention is to provide a container for accommodating a piezoelectric vibrator, which can operate the vibrator normally and stably for a long period of time.

【0007】[0007]

【課題を解決するための手段】本発明は上面から底面に
かけて導出されたメタライズ配線層を有する絶縁基体
と、前記メタライズ配線層に局部加熱法によって取着さ
れた圧電振動子を支持する金属支持体と、蓋体とから成
る圧電振動子収納用容器であって、前記金属支持体はメ
タライズ配線層に取着される部位の厚みが20乃至500 μ
m であることを特徴とするものである。
According to the present invention, there is provided an insulating substrate having a metallized wiring layer extending from a top surface to a bottom surface, and a metal support for supporting a piezoelectric vibrator attached to the metallized wiring layer by a local heating method. And a lid for storing the piezoelectric vibrator, wherein the metal support has a thickness of 20 to 500 μm at a portion attached to the metallized wiring layer.
It is characterized by being m.

【0008】[0008]

【作用】本発明の圧電振動子収納用容器によれば、圧電
振動子を支持する金属支持体に厚みが20乃至500 μm の
領域を設けるとともに該領域を絶縁基体に設けたメタラ
イズ配線層に局部加熱法により取着するようになしたこ
とから金属支持体を絶縁基体に設けたメタライズ配線層
に強固に取着するのを可能として、且つ金属支持体のバ
ネ性劣化を有効に防止することができ、その結果、外部
より振動が繰り返し印加されたとしてもその振動の一部
は金属支持体で吸収され、圧電振動子に破損を発生させ
たり、圧電振動子の金属支持体からの外れを皆無として
圧電振動子を長期間にわたり一定の振動周波数で安定に
作動させることが可能となる。
According to the container for accommodating the piezoelectric vibrator of the present invention, the metal support supporting the piezoelectric vibrator is provided with a region having a thickness of 20 to 500 μm, and the region is locally formed on the metallized wiring layer provided on the insulating substrate. Since the metal support is attached by the heating method, it is possible to firmly attach the metal support to the metallized wiring layer provided on the insulating substrate, and to effectively prevent the spring deterioration of the metal support. As a result, even if vibrations are repeatedly applied from the outside, some of the vibrations are absorbed by the metal support, causing no damage to the piezoelectric vibrator and no detachment of the piezoelectric vibrator from the metal support. As a result, the piezoelectric vibrator can be stably operated at a constant vibration frequency for a long period of time.

【0009】[0009]

【実施例】次に本発明を添付図面に基づき詳細に説明す
る。図1は本発明の圧電振動子収納用容器の一実施例を
示し、1 は電気絶縁材料より成る絶縁基体、2 は同じく
電気絶縁材料より成る椀状の蓋体である。この絶縁基体
1 と蓋体2 とで圧電振動子4 を収容するための容器3 が
構成される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a container for accommodating a piezoelectric vibrator of the present invention, in which 1 is an insulating base made of an electrically insulating material, and 2 is a bowl-shaped lid made of the same electrically insulating material. This insulating substrate
A container 3 for housing the piezoelectric vibrator 4 is constituted by 1 and the lid 2.

【0010】前記絶縁基体1 は酸化アルミニウム質焼結
体、酸化ジルコニウム質焼結体、ムライト質焼結体、窒
化アルミニウム質焼結体等のセラミックスから成り、例
えば酸化アルミニウム質焼結体から成る場合は、アルミ
ナ(Al 2 O 3 ) 、シリカ(SiO2 ) 、カルシア(CaO) 、マ
グネシア(MgO) 等の原料粉末に適当な有機溶剤、溶媒を
添加混合して泥漿状となすとともにこれを従来周知のド
クターブード法やカレンダーロール法を採用することに
よってシート状のセラミックグリーンシートと成し、次
に前記セラミックグリーンシートに適当な打ち抜き加工
を施し、所定形状となすとともに適当な径の貫通孔を形
成し、最後に前記所定形状のセラミックグリーンシート
を複数枚積層し、高温( 約1600℃) で焼成することによ
って製作される。
The insulating substrate 1 is made of a ceramic such as an aluminum oxide sintered body, a zirconium oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, for example, an aluminum oxide sintered body. Is an alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), magnesia (MgO), etc. The sheet-shaped ceramic green sheet is formed by adopting the doctor budo method or the calendar roll method, and then the ceramic green sheet is appropriately punched to form a predetermined shape and a through hole having an appropriate diameter. Then, finally, a plurality of the ceramic green sheets having the predetermined shape are laminated and fired at a high temperature (about 1600 ° C.).

【0011】前記絶縁基体1 はその上面から内部を介し
底面にかけてメタライズ配線層5 が被着されており、該
メタライズ配線層5 の絶縁基体1 上面部には一対の金属
支持体6 が電気的導通をもって取着固定され、また絶縁
基体1 の底面部には外部電気回路基板の配線導体部に半
田等のロウ材を介し接合される。
The insulating base 1 is covered with a metallized wiring layer 5 from the upper surface to the bottom through the inside, and a pair of metal supports 6 are electrically connected to the upper surface of the insulating base 1 of the metallized wiring layer 5. Is attached and fixed, and the bottom surface of the insulating substrate 1 is joined to the wiring conductor portion of the external electric circuit board via a brazing material such as solder.

【0012】前記絶縁基体1 に被着されたメタライズ配
線層5 はタングステン、モリブデン、マンガン等の高融
点金属粉末から成り、該タングステン等の高融点金属粉
末に適当な有機溶剤、溶媒を添加混合して得た金属ペー
ストを絶縁基体1 となるセラミックグリーンシートの上
下面及び貫通孔内に従来周知のスクリーン印刷法等によ
り予め印刷塗布しておくことによって絶縁基体1 の上面
から内部を介し底面にかけて被着される。
The metallized wiring layer 5 deposited on the insulating substrate 1 is made of a refractory metal powder such as tungsten, molybdenum, or manganese. The refractory metal powder such as tungsten is mixed with an appropriate organic solvent or solvent. The metal paste thus obtained is applied by printing in advance on the upper and lower surfaces of the ceramic green sheet to be the insulating substrate 1 and in the through-holes by a conventionally known screen printing method or the like to cover the insulating substrate 1 from the upper surface to the bottom through the inside. Be worn.

【0013】また前記メタライズ配線層5 は絶縁基体1
の上面に位置する部位に一対の金属支持体6 が取着され
ており、該一対の金属支持体6 は圧電振動子4 を支持す
るとともに圧電振動子4 の電極をメタライズ配線層5 に
電気的に接続する作用を為し、一対の金属支持体6 には
圧電振動子4 の両端がポリイミド導電性樹脂等の接着剤
を介し接着固定され、同時に圧電振動子4 の電極が金属
支持体6 に電気的に導通される。
The metallized wiring layer 5 is an insulating substrate 1
A pair of metal supports 6 is attached to a portion located on the upper surface of the metal support 6, and the pair of metal supports 6 support the piezoelectric vibrator 4 and electrically connect the electrodes of the piezoelectric vibrator 4 to the metallized wiring layer 5. Both ends of the piezoelectric vibrator 4 are bonded and fixed to the pair of metal supports 6 via an adhesive such as polyimide conductive resin, and at the same time, the electrodes of the piezoelectric vibrator 4 are fixed to the metal support 6. It is electrically conducted.

【0014】前記金属支持体6 は洋白(Cu-Zn-Ni 合金)
、コバール金属(Fe-Ni-Co 合金) 、42アロイ(Fe-Ni合
金) 等の弾性を持つ金属から成り、例えばコバール金属
から成る場合には、鉄、ニッケル、コバルトを所定値に
秤量し、これを加熱溶融し合金化させてコバールのイン
ゴット( 塊) を作るとともに該インゴットを圧延加工法
により薄板状と成し、最後に前記コバール金属の薄板を
従来周知の打ち抜き加工法により所定形状に打ち抜くこ
とによって形成される。
The metal support 6 is nickel silver (Cu-Zn-Ni alloy)
, Kovar metal (Fe-Ni-Co alloy), 42 alloy (Fe-Ni alloy) and other elastic metals.For example, in the case of Kovar metal, iron, nickel, cobalt are weighed to a specified value. This is melted by heat and alloyed to form an ingot (lump) of Kovar, and the ingot is formed into a thin plate by a rolling method, and finally the thin sheet of Kovar metal is punched into a predetermined shape by a conventionally known punching method. Formed by.

【0015】また前記金属支持体6 のメタライズ配線層
5 への取着は、例えばまずメタライズ配線層5 表面にニ
ッケルメッキ層、金メッキ層を被着させ、次にその上面
に銀ロウ等のロウ材と金属支持体6 を順次載置し、最後
に前記金属支持体6 とメタライズ配線層5 間に100 〜50
0VA の電気を5 〜100msec 間印加し、ロウ材を局部的
に、且つ瞬間的に溶融させることによって行われる。こ
の場合、ロウ材の加熱溶融が局部的で、且つ瞬間的であ
ることから金属支持体6 の全体が加熱されて金属支持体
6 のバネ性( 弾性) が劣化することは一切なく、その結
果、外部より振動が繰り返し印加されたとしてもその振
動の一部は金属支持体6 が吸収し、金属支持体6 に接着
されている圧電振動子4 に破損を発生させたり、圧電振
動子4 の金属支持体6 からの外れを皆無となすことが可
能となる。
Further, the metallized wiring layer of the metal support 6
For example, first, a nickel plating layer and a gold plating layer are deposited on the surface of the metallized wiring layer 5, then a brazing material such as silver brazing and a metal support 6 are sequentially placed on the upper surface, and finally, 100 to 50 between the metal support 6 and the metallized wiring layer 5
It is performed by applying 0 VA of electricity for 5 to 100 msec to locally and instantaneously melt the brazing material. In this case, since the melting and heating of the brazing material is local and instantaneous, the entire metal support 6 is heated and the metal support 6 is heated.
The elasticity (elasticity) of 6 does not deteriorate at all, and as a result, even if vibration is repeatedly applied from the outside, part of the vibration is absorbed by metal support 6 and is bonded to metal support 6. It is possible to cause damage to the existing piezoelectric vibrator 4 and to prevent the piezoelectric vibrator 4 from being detached from the metal support 6.

【0016】尚、前記金属支持体6 のメタライズ配線層
5 への取着にあたっては金属支持体6 の取着部の厚みが
20μm 未満であると金属支持体6 とメタライズ配線層5
間に、例えば電気を印加して両者を取着する際、金属支
持体6 の取着部に孔が開き、取着面積が狭いものとなっ
て金属支持体6 をメタライズ配線層5 に強固に取着させ
ることができなくなったり、金属支持体6 に変形を発生
したりしてしまい、また500 μm を越えると金属支持体
6 の全体に該金属支持体6 をメタライズ配線層5 に取着
する際の熱が広がり、金属支持体6 のバネ性( 弾性) が
劣化する。従って、前記金属支持体6 はメタライズ配線
層5 に取着される取着部の厚みが20乃至500 μm の範囲
に特定される。
The metallized wiring layer of the metal support 6
When attaching to metal 5, the thickness of the metal support 6
When the thickness is less than 20 μm, the metal support 6 and the metallized wiring layer 5
In the meantime, for example, when electricity is applied to attach the both, a hole is opened in the attachment part of the metal support 6 and the attachment area becomes narrow, so that the metal support 6 is firmly attached to the metallized wiring layer 5. It becomes impossible to attach it, or the metal support 6 is deformed. If it exceeds 500 μm, the metal support 6
The heat generated when the metal support 6 is attached to the metallized wiring layer 5 spreads over the entire surface of the metal 6, and the spring property (elasticity) of the metal support 6 deteriorates. Therefore, the metal support 6 is specified such that the thickness of the attachment portion attached to the metallized wiring layer 5 is in the range of 20 to 500 μm.

【0017】また前記金属支持体6 をメタライズ配線層
5 に取着する際、メタライズ配線層5 の表面にニッケル
メッキ層、金メッキ層を被着させるのは金属支持体6 と
メタライズ配線層5 の取着をより強固とするためであ
り、その厚みは10.0〜100 μmとしておくことが好まし
い。
Further, the metal support 6 is a metallized wiring layer.
When attaching the metallized wiring layer 5, the metallized wiring layer 5 is coated with a nickel-plated layer or a gold-plated layer in order to strengthen the attachment of the metal support 6 and the metallized wiring layer 5. It is preferably set to 10.0 to 100 μm.

【0018】更に前記金属支持体6 をメタライズ配線層
5 に取着する際、メタライズ配線層5 の表面に予めニッ
ケルメッキ層、金メッキ層及びロウ材を被着させてお
き、更にロウ材の表面に0.5 乃至2.0 μm の金から成る
膜を被着させておくと、金属支持体6 とメタライズ配線
層5 との接触抵抗が均一となり、金属支持体6 をメタラ
イズ配線層5 に強固に取着させることができる。従っ
て、前記金属支持体6 をメタライズ配線層5 に取着する
際にはメタライズ配線層5 の表面にニッケルメッキ層、
金メッキ層とロウ材及び金から成る膜を順次、被着させ
ておくことが好ましい。
Further, the metal support 6 is a metallized wiring layer.
When attaching to 5, the metallized wiring layer 5 surface is pre-deposited with a nickel-plated layer, a gold-plated layer and a brazing material, and then a 0.5-2.0 μm gold film is deposited on the surface of the brazing material. If so, the contact resistance between the metal support 6 and the metallized wiring layer 5 becomes uniform, and the metal support 6 can be firmly attached to the metallized wiring layer 5. Therefore, when attaching the metal support 6 to the metallized wiring layer 5, a nickel plating layer,
It is preferable to sequentially deposit a gold plating layer, a brazing material, and a film made of gold.

【0019】また更に前記金属支持体6 を取着する際、
金属支持体6 の外表面、特にメタライズ配線層5 に取着
される面に金をメッキにより0.5 〜2.0 μm の厚みに被
着させておくと金属支持体6 とメタライズ配線層5 の取
着を更に強固となすことができる。従って、前記金属支
持体6 はその外表面、特にメタライズ配線層5 に取着さ
れる面に0.5 〜2.0 μm の金メッキ層を被着させておく
ことが好ましい。
Further, when the metal support 6 is attached,
When gold is applied by plating to a thickness of 0.5 to 2.0 μm on the outer surface of the metal support 6, especially the surface to be attached to the metallized wiring layer 5, the metal support 6 and the metallized wiring layer 5 are attached. It can be made even stronger. Therefore, it is preferable to deposit a gold plating layer of 0.5 to 2.0 μm on the outer surface of the metal support 6, particularly the surface attached to the metallized wiring layer 5.

【0020】更にまた上述の金属支持体6 をメタライズ
配線層5 に取着する場合において、金属支持体6 とメタ
ライズ配線層5 間に介在されるロウ材は銀ロウ等を厚さ
10.0〜100.0 μm 程度の箔状としたものを両者間に配す
る、或いはメタライズ配線層5 の表面に予め溶融ロウ材
を被着させておくことによって、更にはロウ材を金属支
持体6 に予め圧接させておくことによって金属支持体6
とメタライズ配線層5の間に配される。
Furthermore, when the metal support 6 is attached to the metallized wiring layer 5 as described above, the brazing material interposed between the metal support 6 and the metallized wiring layer 5 is silver braze or the like.
By placing a foil-shaped foil of about 10.10 to 100.0 μm between them, or by pre-depositing a molten brazing material on the surface of the metallized wiring layer 5, the brazing material is further preliminarily attached to the metal support 6. Metal support 6 by pressing
And metallized wiring layer 5.

【0021】される。[0021]

【0022】一方、前記絶縁基体1 はその上面外周部に
椀状の蓋体がガラス、樹脂、ロウ材等の封止部材によっ
て接合され、これによって絶縁基体1 と蓋体2 とから成
る容器3 内部に圧電振動子4 が気密に封止される。
On the other hand, the insulating base body 1 has a bowl-shaped lid body joined to the outer peripheral surface of the upper surface thereof by a sealing member such as glass, resin or brazing material, whereby a container 3 composed of the insulating base body 1 and the lid body 2 is formed. The piezoelectric vibrator 4 is hermetically sealed inside.

【0023】前記蓋体2 は絶縁基体1 と同様、酸化アル
ミニウム質焼結体や窒化アルミニウム質焼結体等の電気
絶縁材料から成り、例えば酸化アルミニウム質焼結体か
ら成る場合、アルミナ、シリカ、カルシア、マグネシア
等の原料粉末に適当な有機溶剤、溶媒を添加混合し、次
にこれを椀状の型内に充填するとともに所定圧力を印加
して所定形状に成形し、最後に前記成形したものを約16
00℃の温度で焼成することによって製作される。
Similar to the insulating substrate 1, the lid 2 is made of an electrically insulating material such as an aluminum oxide sintered body or an aluminum nitride sintered body. For example, in the case of an aluminum oxide sintered body, alumina, silica, Appropriate organic solvent and solvent are added to and mixed with raw material powder such as calcia and magnesia, and then this is filled in a bowl-shaped mold and is molded into a predetermined shape by applying a predetermined pressure, and finally the above-mentioned molded product About 16
It is manufactured by firing at a temperature of 00 ° C.

【0024】かくして本発明の圧電振動子収納用容器に
よれば、一対の金属支持体6 に圧電振動子4 の両端を導
電性接着剤により固定し、圧電振動子4 を金属支持体6
に支持させた後、真空中において椀状蓋体2 の下面を絶
縁基体1 に半田等のロウ材やエポキシ樹脂、アクリル樹
脂、或いは低融点ガラス等から成る封止部材を介して接
合させ、圧電振動子4 を絶縁基体1 と蓋体2 とから成る
容器3 内部に気密に封入することによって最終製品とし
ての圧電振動素子となる。
Thus, according to the container for accommodating the piezoelectric vibrator of the present invention, both ends of the piezoelectric vibrator 4 are fixed to the pair of metal supports 6 by the conductive adhesive, and the piezoelectric vibrator 4 is fixed to the metal support 6.
Then, the lower surface of the bowl-shaped lid body 2 is bonded to the insulating base body 1 in vacuum by a brazing material such as solder, an epoxy resin, an acrylic resin, or a sealing member made of low-melting glass, etc. The vibrator 4 is hermetically sealed in the container 3 composed of the insulating base 1 and the lid 2 to form a piezoelectric vibrating element as a final product.

【0025】尚、本発明は上述した実施例に限定される
ものではなく、本発明の要旨を逸脱しない範囲であれば
種々の変更は可能であり、例えば上述の実施例では金属
支持体6 とメタライズ配線層5 との取着を金属支持体6
とメタライズ配線層5 間に100 〜500VA の電気を5 〜10
0msec 間印加することによって行ったが、高周波誘導加
熱やハロゲンランプの熱を集光した局部加熱、或いはレ
ーザー光線を用いた局部加熱を採用することによって行
ってもよい。
The present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the scope of the present invention. For example, in the above-mentioned embodiments, the metal support 6 and Attach metallization wiring layer 5 to metal support 6
And 100 to 500 VA of electricity between 5 and 10
Although it was performed by applying for 0 msec, high frequency induction heating, local heating by concentrating heat of a halogen lamp, or local heating using a laser beam may be adopted.

【0026】また上述の実施例においては絶縁基体1 に
設けたメタライズ配線層5 をタングステン、モリブデン
等の高融点金属粉末で形成した例で説明したが、メタラ
イズ配線層5 はタングステン等の高融点金属粉末に限ら
れるものではなく銀ーパラジウム(Ag-Pd) や銅(Cu)等で
あってもい。
In the above-described embodiments, the metallized wiring layer 5 provided on the insulating substrate 1 is made of a high melting point metal powder such as tungsten or molybdenum. However, the metallized wiring layer 5 is formed of a high melting point metal such as tungsten. The powder is not limited, and silver-palladium (Ag-Pd), copper (Cu), or the like may be used.

【0027】更に上述の実施例においては金属支持体6
とメタライズ配線層5 とをその間に介在させたロウ材を
局部的に加熱溶融させることによって取着する例で説明
したが、前記ロウ材は必ずしも必要ではなく、ニッケル
メッキ層や金メッキ層を被着させたメタライズ配線層5
に金属支持体6 を直接取着することも、またメタライズ
配線層5 と金属支持体6 との間に他の金属を介在させて
取着することもできる。
Furthermore, in the above embodiment, the metal support 6
The brazing material having the metallized wiring layer 5 and the metallized wiring layer 5 interposed therebetween is locally heated and melted for attachment, but the brazing material is not always necessary, and a nickel plating layer or a gold plating layer is applied. Metallized wiring layer 5
The metal support 6 can be directly attached to the metal support 6, or can be attached with another metal interposed between the metallized wiring layer 5 and the metal support 6.

【0028】[0028]

【発明の効果】本発明の圧電振動子収納用容器によれば
絶縁基体に被着させたメタライズ配線層に圧電振動子を
支持する金属支持体を局部加熱法によって取着したこと
から金属支持体とメタライズ配線層との取着は局部的
で、且つ瞬間的となり、その結果、金属支持体はその全
体が加熱されてバネ性劣化を招来することは一切なくな
る。そのため本発明の圧電振動子収納用容器では、圧電
振動子の振動周波数を常に一定とし、且つ圧電振動子に
外部より振動が繰り返し印加されたとしてもその振動の
一部は金属支持体が吸収し、金属支持体に接着されてい
る圧電振動子に破損を発生させたり、圧電振動子の金属
支持体からの外れが皆無となる。
According to the container for accommodating the piezoelectric vibrator of the present invention, the metal support for supporting the piezoelectric vibrator is attached to the metallized wiring layer adhered to the insulating substrate by the local heating method. The attachment between the metallized wiring layer and the metallized wiring layer is local and instantaneous, and as a result, the metal support is never heated and its spring property is deteriorated. Therefore, in the piezoelectric vibrator housing container of the present invention, the vibration frequency of the piezoelectric vibrator is always constant, and even if vibration is repeatedly applied to the piezoelectric vibrator from outside, a part of the vibration is absorbed by the metal support. Therefore, the piezoelectric vibrator bonded to the metal support is damaged, and the piezoelectric vibrator is never detached from the metal support.

【0029】また本発明の圧電振動子収納用容器によれ
ば絶縁基体に被着させたメタライズ配線層に金属支持体
を局部加熱法により取着するにあたり、金属支持体の取
着部の厚みを20〜500 μm としたことから金属支持体を
メタライズ配線層にバネ性を劣化させることなく強固に
取着することができ、これによっても内部に収容する圧
電振動子を長期間わたり正常、且つ安定に作動させるこ
とが可能となる。
Further, according to the piezoelectric vibrator accommodating container of the present invention, when the metal support is attached to the metallized wiring layer attached to the insulating substrate by the local heating method, the thickness of the attachment portion of the metal support is Since it is 20 to 500 μm, the metal support can be firmly attached to the metallized wiring layer without deteriorating the spring property, which also keeps the piezoelectric vibrator housed inside for a long time and is stable. Can be activated.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の圧電振動子収納用容器の一実施例を示
す断面図である。
FIG. 1 is a cross-sectional view showing an example of a container for accommodating a piezoelectric vibrator of the present invention.

【図2】従来の圧電振動子収納用容器の断面図である。FIG. 2 is a cross-sectional view of a conventional piezoelectric vibrator housing container.

【符号の説明】[Explanation of symbols]

1・・・・・・・絶縁基板 2・・・・・・・蓋体 3・・・・・・・容器 4・・・・・・・圧電振動子 5・・・・・・・メタライズ配線層 6・・・・・・・金属支持体 1 ... Insulating substrate 2 ... Lid 3 ... Container 4 ... Piezoelectric vibrator 5 ... Metallized wiring Layer 6 ... Metal support

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】上面から底面にかけて導出されたメタライ
ズ配線層を有する絶縁基体と、前記メタライズ配線層に
局部加熱法によって取着された圧電振動子を支持する金
属支持体と、蓋体とから成る圧電振動子収納用容器であ
って、前記金属支持体はメタライズ配線層に取着される
部位の厚みが20乃至500μmであることを特徴とす
る圧電振動子収納用容器。
1. An insulating substrate having a metallized wiring layer extending from a top surface to a bottom surface, a metal support for supporting a piezoelectric vibrator attached to the metallized wiring layer by a local heating method, and a lid. A container for storing a piezoelectric vibrator, wherein the metal support has a thickness of 20 to 500 μm at a portion attached to the metallized wiring layer.
JP9924792A 1992-04-20 1992-04-20 Electronic parts housing container Pending JPH05299963A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9924792A JPH05299963A (en) 1992-04-20 1992-04-20 Electronic parts housing container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9924792A JPH05299963A (en) 1992-04-20 1992-04-20 Electronic parts housing container

Publications (1)

Publication Number Publication Date
JPH05299963A true JPH05299963A (en) 1993-11-12

Family

ID=14242377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9924792A Pending JPH05299963A (en) 1992-04-20 1992-04-20 Electronic parts housing container

Country Status (1)

Country Link
JP (1) JPH05299963A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008001908A1 (en) * 2006-06-30 2008-01-03 Sony Corporation Oscillation gyro sensor
JP2009512369A (en) * 2005-10-20 2009-03-19 エプコス アクチエンゲゼルシャフト Housing with hollow chamber for mechanically sensitive electronic components and method for manufacturing the housing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009512369A (en) * 2005-10-20 2009-03-19 エプコス アクチエンゲゼルシャフト Housing with hollow chamber for mechanically sensitive electronic components and method for manufacturing the housing
WO2008001908A1 (en) * 2006-06-30 2008-01-03 Sony Corporation Oscillation gyro sensor

Similar Documents

Publication Publication Date Title
JPH11126847A (en) Package for electronic component
JPH05299963A (en) Electronic parts housing container
JP3046148B2 (en) Electronic component storage package
JPH05144956A (en) Package for receiving semiconductor element
JP2883235B2 (en) Package for storing semiconductor elements
JPH11126836A (en) Piezoelectric vibrator housing package
JP2962924B2 (en) Electronic component storage package
JPH05226955A (en) Package for housing piezoelectric vibrator
JP2703482B2 (en) Wiring board
JP3176251B2 (en) Package for storing semiconductor elements
JP2948991B2 (en) Package for storing semiconductor elements
JP4105968B2 (en) Electronic component mounting substrate and electronic device using the same
JP2710893B2 (en) Electronic components with leads
JP3372812B2 (en) Electronic component storage package
JPH06169025A (en) Semiconductor element housing package
JP2746813B2 (en) Package for storing semiconductor elements
JPH08115990A (en) Semiconductor device package
JPH05167377A (en) Package for accommodating electronic component
JP3236836B2 (en) Electronic equipment
JPH05167378A (en) Package for accommodating electronic component
JPH0613479A (en) Housing package for surface mount electronic part
JP2514911Y2 (en) Package for storing semiconductor devices
JP2784094B2 (en) Package for storing semiconductor elements
JP2783735B2 (en) Package for storing semiconductor elements
JP3176246B2 (en) Package for storing semiconductor elements