JPH0521977A - Electronic apparatus - Google Patents

Abstract

PURPOSE:To prevent heat stay by constituting a part of the rear plate of a chassis of the upper rear plate and the lower plate each having an appropriate predetermined angle to a vertical direction into an octahedral chassis and by providing a chassis cooling blower. CONSTITUTION:Each chassis 3 is formed into an octahedral chassis 3 by constituting a part of its rear plate 5 of the upper rear plate 5a and the lower rear plate 5b each having an appropriate predetermined angle, and further the upper rear plate 5a is provided with a chassis cooling blower 6. A flow of exhaust heat from each chassis is given upward directivity by the inclination of the rotary shaft 9 of the chassis cooling blower 6 due to the angle of the upper rear plate 5a. Heat exhausted 7 flows to a housing blower 8 without stay in the housing 4 by an upward flow 7 due to the chassis cooling blower 6 in addition to a natural convection 10 in the housing 4 and a flow 11 due to the housing blower 8 and is exhausted out of the housing 4 by the housing blower 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a structure in which a plurality of chassis in which an electronic device body is housed are stacked inside a casing,
The present invention relates to an electronic device configured to cool the electronic device body by ventilation with air and then exhaust the air with a chassis cooling blower, and exhaust the exhaust gas from each chassis to the outside of the chassis with a chassis blower. The present invention relates to an electronic device capable of improving the cooling efficiency of the device main body and downsizing, labor saving, and noise reduction of a housing blower.

[0002]

2. Description of the Related Art Generally, in electronic equipment such as computers, the heat generation density per unit area of an electronic module has been increasing year by year due to the improvement of processing capacity and the integration density of semiconductors. When the electronic device is used at a high temperature, its reliability is significantly reduced. Therefore, in terms of ensuring reliability and improving performance of electronic devices, the cooling configuration for electronic devices is
It is becoming a very important part.

By the way, as a method of cooling this kind of electronic equipment, a plurality of chassis in which the electronic equipment main body is housed are stacked inside the casing, and the electronic equipment main body is cooled by ventilation. A general cooling configuration is a method in which exhaust is performed by a rear chassis cooling blower and the exhaust from each chassis is exhausted to the outside of the casing by a casing blower.

5 to 8 are views showing a configuration example of an electronic device having a conventional cooling configuration of this type, FIG. 5 is a perspective view showing a chassis, and FIG. 6 is an AA cross section arrow of FIG. View, Figure 7
Is a perspective view showing the housing of the electronic device, and FIG. 8 is a cross-sectional view taken along the line BB of FIG.

5 to 8, a rectangular parallelepiped chassis 3 in which an electronic device body 1 is housed and an intake hole 2 for sucking cooling air is provided on the front surface of a chassis 4 of the electronic device. A plurality of (three in the figure) layers are stacked in the vertical direction as shown in the drawing, and the electronic device body 1 is cooled by ventilation from the intake holes 2, and then the rear plate 5 of each chassis 3 is cooled.
The chassis cooling blower 6 provided in the chassis 4 exhausts the exhaust 7, and the chassis 7 blower 8 provided on the rear side of the chassis 4 exhausts the exhaust 7 from the chassis 4. ing.

In this case, the exhaust 7 from each chassis 3 is
Since the air is exhausted in the direction of the rotating shaft 9 of the chassis cooling blower 6, the chassis 3 having a rectangular parallelepiped shape is first exhausted in the horizontal direction, and then the natural convection 10 in the housing 4 and the flow 11 by the housing blower 8 are performed. As a result, the air is raised to the position of the housing blower 8 and then exhausted by the housing blower 8.

However, the electronic device having such a cooling structure has the following problems. That is, the direction of the exhaust 7 from each chassis 3 (horizontal direction) and the direction of the flow from each chassis 3 to the housing blower 8 (vertical direction).
10 and 11 are different from each other, a cooling problem such as heat retention in the housing 1 occurs, and the electronic device body 1 in the housing 4
However, there is a problem that the cooling cannot be performed efficiently. Further, in order to solve such a problem, it is conceivable to increase the capacity of the casing blower 8, but the casing blower 8 becomes large and the noise thereof becomes large, and not only does the user feel uncomfortable. However, there is a problem that it is not preferable in terms of labor saving.

[0008]

As described above, in the conventional electronic equipment, not only the cooling efficiency of the electronic equipment main body in the housing is poor, but also the housing blower becomes large in size, the noise is large, and the labor saving is required. There is a problem that it is not preferable in terms of chemical conversion.

An object of the present invention is to improve the cooling efficiency of the electronic equipment body in the housing without increasing the capacity of the housing blower more than necessary, and to make the housing blower compact, labor-saving and reduce noise. It is to provide an extremely reliable electronic device capable of achieving the above.

[0010]

In order to achieve the above object, according to the present invention, a chassis having a rectangular parallelepiped shape, in which an electronic device main body is housed, and an intake hole for intake of cooling air is provided on the front surface. Multiple vertical stacks are placed inside the housing, and the electronic equipment body is cooled by ventilation with air from the intake holes, and then exhausted from the back of each chassis with a chassis cooling blower. In an electronic device configured to exhaust the exhaust air to the outside of the housing by a housing blower provided on the rear surface side of the housing, each chassis has a rear plate part of which has a proper inclination with respect to the vertical direction. It is composed of an upper back plate and a lower back plate with an angle of 8
The chassis is a face-shaped chassis, and the chassis cooling blower is provided on either the upper back plate or the lower back plate depending on the installation position of the chassis blower.

Here, particularly when the case blower is provided in the upper part on the rear side of the case, the chassis cooling blower is provided on the upper back plate, and the case blower is provided on the lower part on the rear side of the case. In this case, a blower for cooling the chassis is provided on the lower back plate.

Further, the tilt angles of the upper back plate and the lower back plate are configured to be variable, and the tilt of the upper back plate and the lower back plate depends on the stacking position of the chassis (relative relationship with the installation position of the chassis blower). I try to change the angle.

[0013]

Therefore, in the electronic apparatus of the present invention, when the chassis mounted in the housing is cooled, the flow of exhaust gas from the chassis is given an appropriate upward or downward direction by the chassis cooling blower. As a result, it is possible to prevent heat from staying in the housing and realize extremely efficient cooling. In addition, this allows
Since it is not necessary to increase the capacity of the housing blower more than necessary, it is possible to achieve downsizing, labor saving, and noise reduction of the housing blower.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

1 to 4 are views showing a configuration example of an electronic apparatus according to the present invention, FIG. 1 is a perspective view showing a chassis, FIG. 2 is a sectional view taken along the line CC of FIG. 1, and FIG. FIG. 4 is a perspective view showing the housing of the electronic device, and FIG. 4 is a sectional view taken along the line DD in FIG. 1 to 4, the same elements as those in FIGS. 5 to 8 are designated by the same reference numerals, and the description thereof will be omitted. Here, only different portions will be described.

That is, the electronic equipment of this embodiment is shown in FIGS.
As shown in FIG. 4, each chassis 3 is provided with a rear plate 5
A part of the upper back plate 5a and the lower back plate 5b having an appropriate predetermined inclination angle with respect to the vertical direction.
The chassis 3'has a planar shape, and the chassis cooling blower 6 is further provided on the upper back plate 5a.

Here, the inclination angle of the upper back plate 5a with respect to the vertical direction is a proper upward direction from the chassis 3'to the housing blower 8 due to the flow of the exhaust gas 7 from the chassis cooling blower 6 provided therein. The tilt angle is set to give directionality. Further, the inclination of the lower back plate 5b with respect to the vertical direction is such that when a plurality of chassis 3'is stacked, the flow of the exhaust gas 7 from the chassis 3'located below the chassis 3'is prevented. It has a proper inclination so that it does not exist.

Next, in the electronic device configured as described above, the three chassis 3 ′ mounted in the housing 4 draw in cooling air from the intake holes 2 provided in the front surface, After cooling the electronic device body 1 housed inside 3 ′, the chassis cooling blower 6 provided on the back plate 5 of each chassis 3 ′ exhausts the air into the housing 4. On this occasion,
The flow of the exhaust gas 7 from each chassis 3 ′ is the upper back plate 5a.
The upward directionality is given by the inclination of the rotation shaft 9 of the chassis cooling blower 6 depending on the inclination angle of. As a result, the heat exhausted from each chassis 3'is added to the natural convection 10 in the housing 4 and the flow 11 by the housing blower 8 as well as the chassis cooling blower obtained by the application of this embodiment. The upward flow 7 by 6 causes the air to flow to the housing blower 8 without staying inside the housing 4, and is discharged to the outside of the housing 4 by the housing blower 8.

As described above, in this embodiment, the chassis 3 of the rectangular parallelepiped shape is housed inside the electronic device body 1 and provided with the intake hole 2 for sucking the cooling air in the front surface. After vertically stacking three units inside, the electronic device body 1 is cooled by ventilation with air from the air intake holes 2 and then exhausted from the rear surface of each chassis 3 by a chassis cooling blower 6. In an electronic device configured to exhaust the exhaust 7 of the chassis 4 to the outside of the chassis 4 by a chassis blower 8 provided on the upper part of the chassis 4 on the rear side, each chassis 3 is provided with a part of its rear plate 5. An upper rear plate 5a and a lower rear plate 5b having a proper inclination angle with respect to the vertical direction.
And an octahedron-shaped chassis 3 ', and the chassis cooling blower 6 is provided on the upper back plate 5a.

Therefore, the chassis 3 mounted in the housing 4
When cooling the ′ ′, the chassis cooling blower 6 imparts an appropriate upward direction to the flow of the exhaust gas from the chassis 3 ′, so that heat is prevented from staying in the housing 4 and the electronic device is prevented. It is possible to significantly improve the cooling efficiency of the main body 1. As a result, the reliability of the electronic device can be secured and the performance can be improved. Further, as described above, since it is not necessary to increase the capacity of the housing blower 8 more than necessary as in the conventional case, it is possible to reduce the size of the housing blower 8, save labor, and reduce noise.

In the above embodiment, the case where the housing blower 8 is provided on the upper portion on the rear surface side of the housing 4 has been described, but the present invention is not limited to this, and the housing blower 8 is provided on the lower portion on the rear surface side of the housing. If it is, the chassis cooling blower 6
By providing the lower rear plate 5b with a proper downward directionality to the flow of the exhaust gas 7 from each chassis 3 ', heat accumulation in the housing 4 is prevented as described above. As a result, the cooling efficiency of the electronic device body 1 can be significantly improved.

In the above embodiment, the case where three chassis are provided inside the housing 4 has been described, but the present invention is not limited to this, and two chassis or four or more chassis are provided inside the housing 4. Also in this case, the present invention can be applied in the same manner to obtain the same effect as the above case.

Further, in the above embodiment, the upper back plate 5a is
The case where the tilt angle between the lower back plate 5b and the lower back plate 5b is fixed to an appropriate predetermined tilt angle has been described. However, the tilt angle between the upper back plate 5a and the lower back plate 5b is not limited to this, and can be freely changed by, for example, a hinge or the like. According to the relative position between the stacking position of the chassis 3 ′, that is, the installation position of the chassis 3 ′ and the chassis blower 8, the flow of the exhaust gas 7 from each chassis 3 ′ is directly directed to the chassis blower 8. The inclination angles of the upper back plate 5a and the lower back plate 5b may be changed for each chassis 3'to face each other. In this case, the cooling efficiency of the electronic device body 1 can be further improved. Become.

[0024]

As described above, according to the present invention, a rectangular parallelepiped chassis having an electronic device main body housed therein and an intake hole for sucking cooling air is provided on the front surface of the chassis. In the vertical direction, a plurality of layers are stacked and the main body of the electronic equipment is cooled by ventilation with air from the intake holes, and then exhaust is performed from the back of each chassis with a chassis cooling blower, and the exhaust from each chassis In an electronic device configured to exhaust air to the outside of the casing by a casing blower provided on the rear side, each chassis has an upper part with a predetermined inclination angle with respect to the vertical direction with a part of its rear plate. Since an octahedral chassis is configured by the rear plate and the lower rear plate, the chassis cooling blower is provided on either the upper rear plate or the lower rear plate according to the installation position of the chassis blower. It is possible to improve the cooling efficiency of the electronic device body inside the housing without increasing the capacity of the housing blower more than necessary, and to make the housing blower compact, labor-saving, and reduce noise. High-quality electronic equipment can be provided.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a chassis in an electronic device according to the present invention.

FIG. 2 is a sectional view taken along the line CC in FIG.

FIG. 3 is a perspective view showing a housing of an electronic device according to the present invention.

FIG. 4 is a sectional view taken along the line DD in FIG.

FIG. 5 is a perspective view showing an example of a chassis of a conventional electronic device.

6 is a cross-sectional view taken along the line AA in FIG.

FIG. 7 is a perspective view showing a housing of a conventional electronic device.

8 is a cross-sectional view taken along the line BB in FIG.

[Explanation of symbols]

1 ... Electronic device main body, 2 ... Intake hole, 3 '... Chassis, 4 ...
Case, 5 ... Rear plate, 6 ... Chassis cooling blower, 7 ... Exhaust, 8 ... Case blower, 9 ... Chassis cooling blower 6 rotating shaft, 10 ... Natural convection in case 4, 11 ... Case Blower 8
Flow by.

Claims (3)

[Claims] 1. A plurality of rectangular parallelepiped chassis in which an electronic device body is housed inside and an intake hole for sucking cooling air is provided in a front surface of the chassis, and the chassis is vertically stacked. After cooling the electronic device main body with the ventilation from the intake holes, the chassis cooling blower exhausts air from the rear surface of each chassis, and the exhaust air from each chassis is provided on the rear surface side of the housing. In an electronic device configured to exhaust air to the outside of a casing by a casing blower, each of the chassis has an upper rear plate and a lower rear plate with a part of the rear plate having an appropriate predetermined inclination angle with respect to the vertical direction. An octahedral chassis is configured by a face plate, and the chassis cooling blower is provided on either the upper back plate or the lower back plate depending on the installation position of the chassis blower. An electronic device. 2. The chassis blower is provided on an upper back plate when the case blower is provided on an upper part on the back side of the case, and the chassis blower is provided on a lower part on the back side of the case. 2. The electronic device according to claim 1, wherein the blower for cooling the chassis is provided on the lower back plate, if any. 3. An inclination angle between the upper back plate and the lower back plate is variable so that the upper back plate and the lower back plate can be changed according to the stacking position of the chassis (relative relationship with the installation position of the casing blower). The electronic device according to claim 1, wherein the angle of inclination of the face plate is changed.