JPH0595062A - Air-cooling mechanism for lsi - Google Patents
Air-cooling mechanism for lsiInfo
- Publication number
- JPH0595062A JPH0595062A JP3253333A JP25333391A JPH0595062A JP H0595062 A JPH0595062 A JP H0595062A JP 3253333 A JP3253333 A JP 3253333A JP 25333391 A JP25333391 A JP 25333391A JP H0595062 A JPH0595062 A JP H0595062A
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- air
- cooling mechanism
- cooling
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はエンジニアリングワーク
ステーション等に装備された特定のＬＳＩを冷却するた
めのＬＳＩ空冷機構に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LSI air cooling mechanism for cooling a specific LSI mounted on an engineering workstation or the like.
【０００２】[0002]
【従来の技術】図３(a) と(b) は従来のＬＳＩ空冷機構
の一構造例を示す斜視図、図４は従来のＬＳＩ空冷機構
を装備したＬＳＩの一実装例を示す模式的要部側断面図
をそれぞれ示す。2. Description of the Related Art FIGS. 3 (a) and 3 (b) are perspective views showing a structural example of a conventional LSI air cooling mechanism, and FIG. 4 is a schematic diagram showing a mounting example of an LSI equipped with a conventional LSI air cooling mechanism. Sectional sectional views are respectively shown.
【０００３】図３(a) と(b) に示すように、従来のＬＳ
Ｉ空冷機構70は、放熱フィン60の上にファン65を積み重
ねるように配置してこれらを固定ネジ63で結合した構造
になっている。このＬＳＩ空冷機構70は図３(b) に示す
ように、特定のＬＳＩ（以下ＬＳＩと称する）50の上面
に装着されて当該ＬＳＩ50のみを選択的に冷却する。こ
のように１個のＬＳＩ50を１台のファン65によって冷却
するようにしているのは当該ＬＳＩ50が大規模のＬＳＩ
でその発熱量が特に大きいためである。図中、66は固定
ネジ63が遊嵌状態で係入するネジ挿通孔、61は固定ネジ
63が螺入されるねじ孔をそれぞれ示す。As shown in FIGS. 3 (a) and 3 (b), a conventional LS is used.
The I-air cooling mechanism 70 has a structure in which the fan 65 is arranged so as to be stacked on the radiating fins 60, and these are joined by a fixing screw 63. As shown in FIG. 3B, this LSI air cooling mechanism 70 is mounted on the upper surface of a specific LSI (hereinafter referred to as LSI) 50 and selectively cools only the LSI 50. In this way, one LSI 50 is cooled by one fan 65 because the LSI 50 is a large-scale LSI.
This is because the calorific value is particularly large. In the figure, reference numeral 66 is a screw insertion hole into which the fixing screw 63 is loosely fitted, and 61 is a fixing screw.
63 shows screw holes into which 63 is screwed.
【０００４】このＬＳＩ空冷機構70は放熱フィン60の熱
吸収面（下側の平面部分）をＬＳＩ50の放熱面（上側の
平面部分）に接触させる形で当該ＬＳＩ50に装着され
る。図３(a) はこのＬＳＩ空冷機構70の構成を示す分解
図であり、図３(b) はこのＬＳＩ空冷機構70をＬＳＩ50
に装着した状態を示す組立図である。なお、このＬＳＩ
空冷機構70は例えば接着剤或いは専用の取付け部材（図
示せず）を用いてＬＳＩ50に装着される。The LSI air-cooling mechanism 70 is mounted on the LSI 50 so that the heat absorption surface (lower flat surface portion) of the heat radiation fin 60 is in contact with the heat radiation surface (upper flat surface portion) of the LSI 50. FIG. 3 (a) is an exploded view showing the configuration of this LSI air cooling mechanism 70, and FIG. 3 (b) shows this LSI air cooling mechanism 70 as an LSI50.
It is an assembly drawing showing the state where it was attached to. This LSI
The air cooling mechanism 70 is attached to the LSI 50 by using, for example, an adhesive or a dedicated mounting member (not shown).
【０００５】図４はこのＬＳＩ空冷機構70を装着したＬ
ＳＩ50の一実装例を示す図である。最近の電子機器は複
数枚の基板を所定の基板間隔Ｋを隔てて配置するのが通
例になっている。図４に示す例は、基板20及びその上に
重なる形で配置された他の基板20Ａに点線矢印で示す空
気流40を送ってこれら各基板20，20Ａに実装されている
ＬＳＩ50と電子部品５を冷却している例である。なお、
基板20に搭載されているＬＳＩ50のみは専用のファン65
と前記空気流40とによって冷却されることになる。FIG. 4 shows an L equipped with this LSI air cooling mechanism 70.
It is a figure which shows one mounting example of SI50. In recent electronic devices, it is customary to arrange a plurality of substrates at a predetermined substrate interval K. In the example shown in FIG. 4, an air flow 40 indicated by a dotted arrow is sent to the board 20 and another board 20A arranged so as to overlap the board 20 and the LSI 50 and the electronic component 5 mounted on these boards 20, 20A. This is an example of cooling. In addition,
Only the LSI 50 mounted on the board 20 has a dedicated fan 65
And is cooled by the air flow 40.
【０００６】この場合、基板20Ａに実装されている電子
部品５を冷却する空気流40は途中に何ら障害物が無いこ
とからスムーズに流れる。しかしＬＳＩ50が搭載されて
いる基板20に実装されている電子部品５を冷却する空気
流40はＬＳＩ50を冷却するファン65の回転によって生じ
る循環流（実線矢印で示す）45によって流れを妨害され
るため正常には流れない。このため、基板20Ａ側に実装
されている電子部品５に比して基板20側に実装されてい
る電子部品５の冷却度は極めて悪い。In this case, the airflow 40 for cooling the electronic components 5 mounted on the board 20A flows smoothly because there is no obstacle in the middle. However, the air flow 40 that cools the electronic component 5 mounted on the substrate 20 on which the LSI 50 is mounted is obstructed by the circulation flow 45 (shown by the solid arrow) generated by the rotation of the fan 65 that cools the LSI 50. It does not flow normally. Therefore, the degree of cooling of the electronic component 5 mounted on the substrate 20 side is extremely poor as compared with the electronic component 5 mounted on the substrate 20A side.
【０００７】[0007]
【発明が解決しようとする課題】以上の説明から明らか
なように、前記従来のＬＳＩ空冷機構70の場合は、基板
20側の電子部品５を冷却する空気流40がファン65の回転
によって生じる循環流45に妨害されて正常な流れ方をし
ないために当該基板20に実装されている電子部品５の冷
却度は極めて悪い。また、このＬＳＩ空冷機構70は、放
熱フィン60の上にファン65が配置されていることからそ
の背丈が高い上，循環流45と空気流40の流れを確保する
ための空間Ｇをファン65と基板20Ａ間に設けなければな
らないことから基板間隔Ｋが大きくなる。As is apparent from the above description, in the case of the conventional LSI air cooling mechanism 70, the substrate
Since the air flow 40 for cooling the electronic component 5 on the 20 side is disturbed by the circulation flow 45 generated by the rotation of the fan 65 and does not flow normally, the cooling degree of the electronic component 5 mounted on the substrate 20 is extremely high. bad. Further, the LSI air cooling mechanism 70 is tall because the fan 65 is arranged on the heat radiation fins 60, and the space G for ensuring the flow of the circulation flow 45 and the air flow 40 is provided as the fan 65. Since it has to be provided between the substrates 20A, the substrate distance K becomes large.
【０００８】本発明はＬＳＩを選択的に冷却する専用の
ダクト部を備えることによって同一基板に実装された他
の電子部品を含む全体的な冷却効率を格段に向上させた
ＬＳＩ空冷機構を実現しようとする。The present invention intends to realize an LSI air-cooling mechanism which is remarkably improved in overall cooling efficiency including other electronic components mounted on the same substrate by providing a dedicated duct portion for selectively cooling the LSI. And
【０００９】[0009]
【課題を解決するための手段】本発明によるＬＳＩ空冷
機構１は、図１に示すように、特定のＬＳＩ50に装着さ
れた放熱フィン60が遊嵌状態で係入するフィン経通孔２
をその底面部分に備えると共に、当該放熱フィン60の幅
Ｗと背丈ｈに対応する断面形状を有するダクト部10を備
え、かつこのダクト部10の両側端部分に設けられた空気
送入口９と空気排出口11の少なくともその一方に、当該
ＬＳＩ50を選択的に冷却するための空気流80を発生させ
るファン65を装備する。As shown in FIG. 1, the LSI air-cooling mechanism 1 according to the present invention has a fin through hole 2 into which a radiation fin 60 mounted on a specific LSI 50 is loosely fitted.
And a duct portion 10 having a cross-sectional shape corresponding to the width W and the height h of the radiating fin 60, and an air inlet 9 and an air inlet provided at both end portions of the duct portion 10. At least one of the exhaust ports 11 is equipped with a fan 65 for generating an air flow 80 for selectively cooling the LSI 50.
【００１０】[0010]
【作用】このＬＳＩ空冷機構１は、ＬＳＩ50を冷却する
ための空気流80のみが流れるダクト部10を独立的に装備
していることからＬＳＩ50に対する冷却効率が極めて良
い。また、このＬＳＩ空冷機構１はＬＳＩ50を冷却する
ための空気流80と他の電子部品５を冷却する空気流40が
互いに干渉し合うことが無いために他の電子部品５の冷
却効率も必然的に向上する。This LSI air-cooling mechanism 1 is equipped with the duct part 10 through which only the air flow 80 for cooling the LSI 50 flows independently, so that the cooling efficiency for the LSI 50 is extremely good. Further, in the LSI air cooling mechanism 1, the airflow 80 for cooling the LSI 50 and the airflow 40 for cooling the other electronic components 5 do not interfere with each other, so that the cooling efficiency of the other electronic components 5 is also inevitable. To improve.
【００１１】[0011]
【実施例】以下実施例図に基づいて本発明を詳細に説明
する。図１(a) と(b) は本発明の一実施例を示す斜視図
と模式的要部側断面図、図２は本発明によるＬＳＩ空冷
機構の構成を示す斜視図であるが、前記図３，図４と同
一部分にはそれぞれ同一符号を付している。The present invention will be described in detail below with reference to the drawings of the embodiments. 1 (a) and 1 (b) are a perspective view and a schematic side sectional view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing the structure of an LSI air cooling mechanism according to the present invention. 3, the same parts as those in FIG. 4 are denoted by the same reference numerals.
【００１２】図１(a) と(b) に示すように、本発明によ
るＬＳＩ空冷機構１は、ＬＳＩ50に装着された放熱フィ
ン60が遊嵌状態で係入するフィン経通孔２をその底面部
分に備えると共に、前記放熱フィン60の幅Ｗと高さｈに
対応する断面形状と基板20或いは基板20Ａの幅α（以下
基板幅αと称する）よりも長いダクト長さＬを有するダ
クト部10を備え、かつこのダクト部10の両端部分に設け
られた空気送入口９と空気排出口11にＬＳＩ50を選択的
に冷却する空気流80を発生させる一対のファン65を装備
する。図中、1aはダクト部10と空気送入口９と空気排出
口11とから成る本体部、1bはこの本体部1aを上から覆う
蓋部、1cはこの蓋部1bを本体部1aに固定するネジ、25は
基板20とダクト部10間の寸法を調整するために設けられ
た支柱、26は基板20をダクト部10に固定するためのネジ
をそれぞれ示す。As shown in FIGS. 1 (a) and 1 (b), the LSI air-cooling mechanism 1 according to the present invention has a fin through hole 2 into which a heat radiation fin 60 mounted on an LSI 50 is inserted in a loosely fitted state. The duct portion 10 which is provided in a portion and has a cross-sectional shape corresponding to the width W and the height h of the radiation fin 60 and a duct length L longer than the width α of the substrate 20 or the substrate 20A (hereinafter referred to as substrate width α). In addition, a pair of fans 65 for generating an air flow 80 for selectively cooling the LSI 50 are provided at the air inlet 9 and the air outlet 11 provided at both ends of the duct portion 10. In the figure, 1a is a main body composed of a duct portion 10, an air inlet 9 and an air outlet 11, 1b is a lid that covers the main body 1a from above, and 1c is a lid that fixes the lid 1b to the main body 1a. A screw, 25 is a column provided to adjust the dimension between the substrate 20 and the duct portion 10, and 26 is a screw for fixing the substrate 20 to the duct portion 10.
【００１３】このＬＳＩ空冷機構１は、ＬＳＩ50に装備
された放熱フィン60のみをダクト部10内に収容する形で
基板20に装着される。なお、このＬＳＩ空冷機構１は、
ファン65によって発生させた空気流80で前記放熱フィン
60を選択的に冷却する構成になっていることからＬＳＩ
50の冷却効率が極めて良い。なお、このＬＳＩ空冷機構
１はＬＳＩ50を選択的に冷却するものであるから、基板
20，20Ａに搭載されている他の電子部品５の冷却は装置
内を流動する空気流40（図４参照）によって冷却される
が、この場合，ＬＳＩ50冷却用の空気流80と電子部品５
冷却用の空気流40が互いに干渉し合うことがないので冷
却効率は両方共に向上する。The LSI air-cooling mechanism 1 is mounted on the substrate 20 so that only the radiation fins 60 mounted on the LSI 50 are accommodated in the duct portion 10. In addition, this LSI air cooling mechanism 1
The heat radiation fins are generated by the air flow 80 generated by the fan 65.
LSI is configured to selectively cool 60
Cooling efficiency of 50 is extremely good. Since this LSI air-cooling mechanism 1 selectively cools the LSI 50,
The other electronic components 5 mounted on the 20 and 20A are cooled by the air flow 40 (see FIG. 4) flowing in the apparatus. In this case, the LSI 50 cooling air flow 80 and the electronic component 5 are cooled.
Both cooling efficiencies are improved because the cooling air streams 40 do not interfere with each other.
【００１４】このＬＳＩ空冷機構１は、放熱フィン60の
みをダクト部10内に収容する方式であることからダクト
部の背丈Ｈが極めて低い。このようにダクト部の背丈Ｈ
が低いと基板20，20Ａ間の基板間隔Ｋを小さくすること
ができるので装置の小型化を図る上で有利である。この
ＬＳＩ空冷機構１の特徴は、放熱フィン60だけをダクト
部10内に収容する形でＬＳＩ50を冷却するようにしてい
る点と、ダクト長さＬが基板幅α〔図１参照〕よりも若
干大きい点に集約される。このダクト長さＬが基板幅α
よりも大きいと基板間隔Ｋをファン65のサイズとは無関
係に縮小することができることから装置の小型化を図る
上で極めて有利である。Since this LSI air cooling mechanism 1 is a system in which only the radiation fins 60 are accommodated in the duct portion 10, the height H of the duct portion is extremely low. As you can see, the height of the duct is H
If it is low, the substrate distance K between the substrates 20 and 20A can be made small, which is advantageous for downsizing the device. This LSI air cooling mechanism 1 is characterized in that only the radiation fins 60 are accommodated in the duct portion 10 to cool the LSI 50, and the duct length L is slightly smaller than the board width α (see FIG. 1). It is summarized in a big point. This duct length L is the substrate width α
If it is larger than this, the substrate interval K can be reduced regardless of the size of the fan 65, which is extremely advantageous in downsizing the device.
【００１５】以下図２に基づいて本発明によるＬＳＩ空
冷機構の構成を説明する。このＬＳＩ空冷機構１は、底
面部分にフィン経通孔２が形成されたダクト部10を備
え，かつそのダクト部10の両側端部分に空気送入口９と
空気排出口11を装備してなる本体部1aと、これら空気送
入口９と空気排出口11にそれぞれ対となる形で配置され
たファン65と、前記ダクト部10と空気送入口９と空気排
出口11を覆う形で配置される蓋部1bとによって構成され
る。このＬＳＩ空冷機構１は、縫合ネジ（図示せず）を
用いてファン65を空気送入口９と空気排出口11に装着し
た後、ネジ1c（図１参照）を用いて蓋部1bを本体部1aに
取りつけることによって完成品となる。なお、この実施
例は２台のファン65を空気送入口９と空気排出口11にそ
れぞれ配置した構成になっているが、このファン65を空
気送入口９或いは空気排出口11の何れか一方に配置する
形にしてもかまわない。The structure of the LSI air cooling mechanism according to the present invention will be described below with reference to FIG. This LSI air cooling mechanism 1 is provided with a duct portion 10 having a fin through hole 2 formed in a bottom surface portion thereof, and an air inlet 9 and an air outlet 11 provided at both end portions of the duct portion 10. A portion 1a, a fan 65 arranged in a pair with the air inlet 9 and the air outlet 11, and a lid arranged so as to cover the duct portion 10, the air inlet 9 and the air outlet 11. And part 1b. In this LSI air cooling mechanism 1, after attaching the fan 65 to the air inlet 9 and the air outlet 11 using a suture screw (not shown), the lid 1b is attached to the main body using a screw 1c (see FIG. 1). It becomes a finished product by attaching it to 1a. In this embodiment, two fans 65 are arranged at the air inlet 9 and the air outlet 11, respectively. However, the fan 65 is provided at either the air inlet 9 or the air outlet 11. It does not matter if they are arranged.
【００１６】このＬＳＩ空冷機構１は、ＬＳＩ50の冷却
のみを選択的に行う構造になっていることからＬＳＩ50
に対する冷却効率が高い上、同一基板に実装されている
他の電子部品５の冷却効率を阻害することが無いために
全体的な冷却効率が著しく向上する。Since this LSI air cooling mechanism 1 has a structure for selectively cooling only the LSI 50, the LSI 50
The cooling efficiency is high and the cooling efficiency of other electronic components 5 mounted on the same substrate is not impaired, so that the overall cooling efficiency is significantly improved.
【００１７】[0017]
【発明の効果】以上の説明から明らかなように、本発明
によるＬＳＩ空冷機構は、対象となるＬＳＩの冷却を選
択的に行う構造になっていることから当該ＬＳＩに対す
る冷却効率が高い上、同一基板に実装されている他の電
子部品の冷却効率を阻害することが無いためにこのＬＳ
Ｉ空冷機構を用いると全体的な冷却効率が著しく向上す
る。As is apparent from the above description, the LSI air-cooling mechanism according to the present invention has a structure that selectively cools the target LSI, so that the cooling efficiency for the LSI is high and the same. This LS does not interfere with the cooling efficiency of other electronic components mounted on the board.
Using the I air cooling mechanism significantly improves the overall cooling efficiency.
【図１】 本発明の一実施例を示す斜視図と模式的要部
側断面図である。FIG. 1 is a perspective view and a schematic side sectional view showing an embodiment of the present invention.
【図２】 本発明によるＬＳＩ空冷機構の構成を示す斜
視図である。FIG. 2 is a perspective view showing a configuration of an LSI air cooling mechanism according to the present invention.
【図３】 従来のＬＳＩ空冷機構の一構造例を示す斜視
図である。FIG. 3 is a perspective view showing a structural example of a conventional LSI air cooling mechanism.
【図４】 従来のＬＳＩ空冷機構を装備したＬＳＩの一
実装例を示す模式的要部側断面図である。FIG. 4 is a schematic side sectional view of an essential part showing an example of mounting of an LSI equipped with a conventional LSI air cooling mechanism.
１，70 ＬＳＩ空冷機構 1a 本体部 1b 蓋部 1c，26 ネジ ２ フィン経通孔 ５ 電子部品 ９ 空気送入口 10 ダクト部 11 空気排出口 20，20Ａ 基
板 25 支柱 40，80 空気
流 45 循環流 50 ＬＳＩ 60 放熱フィン 61 ねじ孔 63 固定ネジ 65 ファン 66 ネジ挿通孔 Ｋ 基板間隔 Ｗ 放熱フィン60の幅 ｈ 放熱フィ
ン60の背丈 Ｌ ダクト長さ Ｈ ダクト部
10の背丈 α 基板幅 Ｇ 空気の流れを確保するための空間1,70 LSI air cooling mechanism 1a Main body 1b Lid 1c, 26 Screw 2 Fin through hole 5 Electronic component 9 Air inlet 10 Duct 11 Air outlet 20, 20A substrate 25 Strut 40, 80 Air flow 45 Circulation flow 50 LSI 60 Radiation fin 61 Screw hole 63 Fixing screw 65 Fan 66 Screw insertion hole K Board space W Radiation fin 60 width h Radius fin 60 height L Duct length H Duct part
10 height α Substrate width G Space to secure air flow
Claims (1)
するためのＬＳＩ空冷機構であって、 前記ＬＳＩ(50)に装着された放熱フィン(60)が遊嵌状態
で係入するフィン経通孔(2) をその底面部分に備えると
共に当該放熱フィン(60)の幅(W) と高さ(H) に対応する
断面形状を有するダクト部(10)を備え、かつこのダクト
部(10)の両側端部分に設けられた空気送入口(9) と空気
排出口(11)の少なくともその一方に当該ＬＳＩ(50)を選
択的に冷却するための空気流(80)を発生させるファン(6
5)を装備してなることを特徴とするＬＳＩ空冷機構。1. An LSI air cooling mechanism for cooling an LSI (50) mounted on a substrate (20), wherein a radiation fin (60) mounted on the LSI (50) is engaged in a loosely fitted state. The fin through hole (2) is provided on the bottom surface thereof, and the duct section (10) having a cross-sectional shape corresponding to the width (W) and height (H) of the heat radiation fin (60) is provided. An air flow (80) for selectively cooling the LSI (50) is generated at at least one of an air inlet (9) and an air outlet (11) provided at both ends of the section (10). Let fan (6
5) An LSI air cooling mechanism characterized by being equipped with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3253333A JPH0595062A (en) | 1991-10-01 | 1991-10-01 | Air-cooling mechanism for lsi |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3253333A JPH0595062A (en) | 1991-10-01 | 1991-10-01 | Air-cooling mechanism for lsi |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0595062A true JPH0595062A (en) | 1993-04-16 |
Family
ID=17249857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3253333A Withdrawn JPH0595062A (en) | 1991-10-01 | 1991-10-01 | Air-cooling mechanism for lsi |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0595062A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5597035A (en) * | 1995-08-18 | 1997-01-28 | Dell Usa, L.P. | For use with a heatsink a shroud having a varying cross-sectional area |
| US5630469A (en) * | 1995-07-11 | 1997-05-20 | International Business Machines Corporation | Cooling apparatus for electronic chips |
| US5810072A (en) * | 1995-09-08 | 1998-09-22 | Semipower Systems, Inc. | Forced air cooler system |
| US5815371A (en) * | 1996-09-26 | 1998-09-29 | Dell U.S.A., L.P. | Multi-function heat dissipator |
| US5828549A (en) * | 1996-10-08 | 1998-10-27 | Dell U.S.A., L.P. | Combination heat sink and air duct for cooling processors with a series air flow |
| GB2347020B (en) * | 1999-02-02 | 2003-05-14 | 3Com Technologies Ltd | Cooling equipment |
| JP2008091885A (en) * | 2006-10-04 | 2008-04-17 | Taida Electronic Ind Co Ltd | Heat radiation module and its fan |
| CN101959391A (en) * | 2010-06-02 | 2011-01-26 | 苏州工业园区胜欣电子有限公司 | Heat-dissipating device |
| JP2014048201A (en) * | 2012-08-31 | 2014-03-17 | Advantest Corp | Electronic component tester |
| JP2019165187A (en) * | 2018-03-20 | 2019-09-26 | 新電元工業株式会社 | Electronic equipment unit and electronic apparatus device |
| US10856444B2 (en) | 2018-05-18 | 2020-12-01 | Fujitsu Limited | Cooling device and electronic apparatus |
-
1991
- 1991-10-01 JP JP3253333A patent/JPH0595062A/en not_active Withdrawn
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5630469A (en) * | 1995-07-11 | 1997-05-20 | International Business Machines Corporation | Cooling apparatus for electronic chips |
| US5597035A (en) * | 1995-08-18 | 1997-01-28 | Dell Usa, L.P. | For use with a heatsink a shroud having a varying cross-sectional area |
| US5810072A (en) * | 1995-09-08 | 1998-09-22 | Semipower Systems, Inc. | Forced air cooler system |
| US5815371A (en) * | 1996-09-26 | 1998-09-29 | Dell U.S.A., L.P. | Multi-function heat dissipator |
| US5828549A (en) * | 1996-10-08 | 1998-10-27 | Dell U.S.A., L.P. | Combination heat sink and air duct for cooling processors with a series air flow |
| GB2347020B (en) * | 1999-02-02 | 2003-05-14 | 3Com Technologies Ltd | Cooling equipment |
| JP2008091885A (en) * | 2006-10-04 | 2008-04-17 | Taida Electronic Ind Co Ltd | Heat radiation module and its fan |
| CN101959391A (en) * | 2010-06-02 | 2011-01-26 | 苏州工业园区胜欣电子有限公司 | Heat-dissipating device |
| JP2014048201A (en) * | 2012-08-31 | 2014-03-17 | Advantest Corp | Electronic component tester |
| JP2019165187A (en) * | 2018-03-20 | 2019-09-26 | 新電元工業株式会社 | Electronic equipment unit and electronic apparatus device |
| US10856444B2 (en) | 2018-05-18 | 2020-12-01 | Fujitsu Limited | Cooling device and electronic apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990107 |