JPH05214074A - Liquid epoxy resin material for molding - Google Patents

Abstract

PURPOSE:To prepare the title material capable of giving a high-performance sealed article by using an allylated novolac phenol resin as a curative. CONSTITUTION:The title material contains a liquid allylated novolac phenol resin, pref. in an amt. of 10-80wt.% of the total amt. of curatives compounded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to electric parts, electronic parts,
The present invention relates to a liquid epoxy resin molding material for sealing semiconductor chips and the like.

[0002]

2. Description of the Related Art With the rapid development of electronics in recent years, semiconductor elements such as IC and LSI are used in various fields, and the trend of low cost and high integration gives rise to various new mounting forms, and conventional metal molds are used. Instead of a dual in-line package by transfer molding using, without a die such as hybrid IC, chip on board, tape carrier package, plastic pin grid array,
The mounting form is formed by spot sealing of the bear chip. And, as a curing agent for these liquid epoxy resin molding materials, amine compounds such as dicyandiamide and dihydrazide amine imide compounds, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylhymic acid anhydride, dodecynylsuccinic anhydride futar. An acid anhydride such as an acid is used. However, the former had strong polarities and deteriorated the physical properties of bias, and the latter had the drawbacks of high hydrolyzability in a pressure cooker test and weak adhesive strength. Therefore, it has been attempted to use a solid novolac type phenol resin as a curing agent, but it has a drawback that it has a high viscosity and that an organic solvent must be used in combination.

[0003]

As described in the prior art, the conventional liquid epoxy resin molding material has merits and demerits, and there is a problem that a high-performance sealed product cannot be obtained. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide a liquid epoxy resin molding material capable of obtaining a high-performance sealed product.

[0004]

The present invention is a liquid epoxy resin molding material characterized by containing an allyl group-containing novolak type phenolic resin, and therefore, the above object can be achieved. Will be described in detail.

The epoxy resin used in the present invention is 1
If it is a curable epoxy resin having two or more epoxy groups in the molecule, bisphenol A type epoxy resin, novolac type epoxy resin, flexible epoxy resin,
It may be any of halogenated epoxy resin, glycidyl ester type epoxy resin, polymer type epoxy resin and the like, and is not particularly limited. As the curing agent, it is necessary to use an allyl group-containing novolac-type phenol resin, and other curing agents such as aliphatic polyamines, polyamide resins, amine-based curing agents such as aromatic diamines, acid anhydride curing agents, Lewis acid complex compounds, etc. Is used. The allyl group-containing novolac type phenol resin is preferably liquid, and the amount thereof is preferably 10 to 80% by weight (hereinafter simply referred to as%) of the amount of the curing agent. That is, if it is less than 10%, the adhesive strength and reliability tend to decrease, and if it exceeds 80%, the viscosity tends to increase. As the curing accelerator, phosphorus-based and / or tertiary amine-based curing accelerators and the like are used and are not particularly limited. As the modifier, silicone oil, reactive silicone gel, reactive diluent, defoaming agent, coloring agent, etc. are used. The epoxy resin, the curing agent, the curing accelerator, and the modifier may be solid or liquid, but a mixture of these needs to be liquid. The filler is an inorganic powder filler such as silica, calcium carbonate or aluminum hydroxide. If necessary, the surface of the filler can be surface-treated with a coupling agent. Thus, the above materials are mixed and kneaded, and then vacuum degassing is performed to obtain a liquid epoxy resin molding material. For molding the molding material, casting, pouring, dipping, drip coating, coating, etc. are used.

The present invention will be described below based on examples.

[0007]

[Examples 1 to 3 and Comparative Example] Liquid epoxy resin molding materials were obtained by mixing, mixing, kneading and defoaming the materials based on the mixing table of Table 1. As the bisphenol type epoxy resin, A type having an epoxy equivalent of 189 and a viscosity of 135 PS is used, as the allyl novolac resin, allyl phenol novolac resin is used, as the silica, spherical fused silica having an average particle diameter of 10 microns is used, and as the curing accelerator, A DBU curing accelerator was used, and A187 of Nippon Unicar Co., Ltd. was used as a coupling agent.

[0008]

[Table 1]
Parts by weight The performances of the liquid epoxy resin molding materials of Examples 1 to 3 and Comparative Example are shown in Table 2. The viscosity is at 25 ° C., the adhesive force is A5052P aluminum plate, the adhesive area is 7 × 7 × 1.6 mm, and the tensile shear force is Kg / cm ² . Reliability is chip size 2x3mm as an evaluation element
, COB mounting on a glass epoxy board without passivation using 14 gold wires with a diameter of 25 microns,
In the PCT test, the number of defects generated at each temperature at 121 ° C. and 2 atm was observed.

[0009]

[Table 2]

[0010]

The present invention is constructed as described above.
It has been confirmed that the liquid epoxy resin molding material having the constitution described in the claims has a low viscosity, a good adhesive force and a high reliability, and is excellent in the present invention.

Claims (2)

[Claims] 1. A liquid epoxy resin molding material containing an allyl group-containing novolac-type phenol resin. 2. The liquid epoxy resin molding material according to claim 1, wherein the allyl group-containing novolac-type phenol resin is liquid and the amount thereof is 10 to 80% by weight of the curing agent.