JPH05196431A - Measuring apparatus for state of base plate - Google Patents

Abstract

PURPOSE:To enable highly-precise three-dimensional measurement of a base plate to be measured even when it has a warp or a curve, by fixing the base plate by a base plate holding means and by measuring the base plate by a state measuring means. CONSTITUTION:A base plate 1 to be measured is conveyed in a direction A by a base plate conveyor 2. A base plate stopper 6 rises to a measuring position, the base plate l is stopped by the stopper and a drive motor of the conveyor 2 stops. A positioning pin 7 rises and pierces a positioning hole 8 provided in the base plate 1, so as to execute accurate positioning for measurement and inspection. Moreover, a holder plate 9 approaches the base plate 1 on the conveyor 2 and rises to hold the base plate 1 and, simultaneously, the base plate l is sucked and fixed on the plate 9 by a low pneumatic pressure generating device 12 such as a vacuum pump by sucking it at a plurality of suction holes 10 of the plate through an air hose 11. When a warp of the base plate 1 is conspicuous, it is pressed down by DELTAZ at an arbitrary position from above by a pressing mechanism 13, so that it be brought into close contact with the plate 9. Thereafter an X-Y table 5 and a Z shaft 4 are driven by motors and measurement is executed by a base plate state measuring head 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board condition measuring device for measuring the condition of a printed circuit board.

[0002]

2. Description of the Related Art In recent years, a board condition measuring device has reached the limit of visual inspection due to higher density mounting accompanying downsizing of equipment, and the automation is the most delayed due to a demand for automation of equipment to compensate for worker shortage. It is about to be introduced actively in order to automate the inspection process.

An example of the above-mentioned conventional substrate state measuring apparatus will be described below with reference to the drawings. FIG. 4 is a perspective view showing the configuration of a conventional substrate state measuring device, and FIG. 5 is a detailed side view thereof.

Reference numeral 51 denotes a substrate to be measured whose state is to be inspected, which is made of glass epoxy, ceramics or the like. 52
The substrate can be stopped at the substrate measuring position by the substrate stopper 56 on the substrate transfer conveyor. Also, 57
Is a positioning pin used to accurately stop the substrate to be measured at the measurement position. Further, reference numeral 58 is a positioning hole formed in the substrate to be measured and through which the positioning pin 57 penetrates. Reference numeral 53 denotes a substrate state measuring head including a camera or a laser scanner, which is attached to an XY table 55 capable of moving and positioning in XY two dimensions, and fixed to a Z axis capable of moving vertically and positioning. With this, it is possible to perform a state measurement inspection of an arbitrary place on the substrate 51 to be measured.

The operation of the printed circuit board measuring device configured as described above will be described below.

First, the substrate 51 to be measured and inspected is loaded in the direction A by the substrate conveyor 52. Along with the loading of the substrate to be measured 51, the substrate stopper 56 moves upward to stop the substrate to be measured 51 at the measurement position, and the substrate to be measured 51 is stopped at its predetermined measurement position by the substrate stopper 56. Immediately after that, the motor driving the substrate transfer conveyor 52 is stopped. Further, after that, the positioning pin 57 rises and penetrates the positioning hole 58 provided in the substrate 51 to be measured, thereby performing accurate positioning for measurement inspection. When the substrate 51 to be measured is accurately positioned at the measurement location, the XY table 55 and the Z-axis 54 are moved as previously taught by driving the motors of their respective axes by a controller (not shown). The state measuring head 53 moves to a predetermined place, captures the state of the substrate using a camera or a laser scanner, and performs measurement inspection. When all the measurement inspections taught in advance are completed, the positioning pin 57 descends and moves away from the positioning hole 58, and the substrate stopper 56 also descends so that the substrate 51 to be measured is no longer blocked. Then, the motor of the substrate transfer conveyor 52 is driven again to eject the substrate 51 to be measured in the B direction. After that, the substrate transfer conveyor 52 guides the next substrate to be measured to the measurement place by the same method. This series of operations is continued,
Measurement inspections are continuously performed one after another.

[0007]

However, in the above configuration, when the state of the substrate 51 to be measured must be measured three-dimensionally (for example, the thickness of the cream solder printed on the substrate to be measured, etc.). (Measurement), the positioning pin 57 and the positioning hole 58 can perform high-precision positioning in the XY two-dimensional directions, but in the Z-axis direction, warpage or bending is often present on each of the substrates to be measured. There is a problem that highly accurate measurement cannot be performed, which is significantly different from the state taught in advance. For example, as shown in FIG. 6, when the substrate 51 to be inspected is warped in a convex shape toward the substrate state measuring head 53, as shown in FIG.
As shown in FIG. 5, an error of ΔZ occurs in the Z-axis direction than when it is on a flat surface, so that highly accurate measurement cannot be performed.

SUMMARY OF THE INVENTION In order to solve the above problems, it is an object of the present invention to provide a substrate state measuring device capable of highly accurately three-dimensionally measuring a substrate to be measured.

[0009]

In order to achieve the above object, the substrate condition measuring device of the present invention measures the condition of the substrate to be measured and the position to be measured by passing the condition measuring device. Transferring means for transferring substrates one after another, measurement processing means for analyzing each state of the inspected substrates obtained by the state measuring means and measuring each inspected substrate, and measuring the inspected substrates by the state measuring means. For this purpose, it is provided with a positioning means, a measured substrate holding means for holding the measured substrate, and a measured substrate fixing means for eliminating deformation of the measured substrate, and the measured substrate fixing means fixes the inspected substrate. Then, the state of the substrate to be measured is measured by the state measuring means.

[0010]

According to the substrate state measuring apparatus of the present invention, even when the substrate to be measured is warped or bent, the substrate to be measured is fixed to the holding surface of the substrate to be measured holding means by the means to fix the substrate to be measured, By obtaining the flatness of the measured surface,
It eliminates substrate deformation and enables highly accurate three-dimensional measurement.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a perspective view showing the height of the substrate condition measuring apparatus according to this embodiment, and FIG. 2 is a detailed side view thereof.

Reference numeral 1 denotes a substrate to be measured whose state is to be inspected, which is made of glass epoxy, ceramics or the like. Reference numeral 2 denotes a substrate transfer conveyor, which can stop the substrate at the substrate measurement position by the substrate stopper 6. Reference numeral 7 is a positioning pin used to accurately stop the substrate to be measured at the measurement position, and 8 is a positioning hole provided in the substrate to be measured and through which the positioning pin 7 penetrates. Reference numeral 9 denotes a holder plate for holding the substrate 1 to be measured, which has a plurality of suction holes 9 for fixing the substrate 1 to be measured at an appropriate place, and generates a low pressure such as a vacuum pump 12 through an air hose 11. The substrate to be measured 1 is connected to the device and the holder plate 9
It is to be adsorbed and fixed on the holding surface of. A pressing mechanism 13 can press the substrate from the outside at an arbitrary position. Reference numeral 3 denotes a substrate state measuring head including a camera or a laser scanner, which is attached to an XY table 5 capable of moving and positioning in XY two dimensions, and fixed to a Z axis capable of moving vertically and positioning. With this, it is possible to perform a state measurement inspection of an arbitrary place on the substrate to be measured.

The operation of the substrate condition measuring device configured as described above will be described below. First, the substrate to be measured 1 to be measured and inspected is a substrate transfer conveyor 2
Loaded in the A direction. As the substrate 1 to be measured is loaded, the substrate stopper 6 is moved to the substrate 1 to be measured.
To the measurement position, the movement of the substrate 1 to be measured is stopped by the substrate stopper 6 at a predetermined measurement position, and immediately thereafter, the motor driving the substrate transfer conveyor 2 is stopped. Further, thereafter, the positioning pin 7 rises and penetrates the positioning hole 8 provided in the substrate 1 to be measured, thereby performing accurate positioning for measurement inspection. Next, the substrate to be measured 1 is held by being raised by a cylinder or the like (not shown) until the holder plate 9 comes into contact with the substrate to be measured 1 on the substrate transport conveyor 2, and at the same time the substrate to be measured 1 is fixed. Through a plurality of suction holes 9 provided for the purpose of suction, a low pressure generating device 12 such as a vacuum pump connected through an air hose 11 sucks the substrate 1 to be measured onto a holding surface of a holder plate 9. Fixed. Further, as shown in FIG. 3, when the warp of the substrate to be measured 1 is remarkable, the pressing mechanism 13 pushes an arbitrary position from above by ΔZ, so that the substrate to be measured 1 is placed on the holding surface of the holder plate 9.
It can be adsorbed and fixed by bringing them into close contact. If the substrate to be measured 1 is adsorbed and fixed to the holding surface, the deformation of the substrate is corrected and there are no factors that hinder high-accuracy measurement, so high-accuracy three-dimensional measurement is possible. It is needless to say that the pressing mechanism 13 is lifted again when it is fixed by suction, so that the measurement operation is not affected. When the substrate 1 to be measured is accurately positioned at the measurement location and fixed by suction, the XY table 5 and the Z-axis 4 drive the motors of the respective axes by the control device (not shown), and are taught in advance. As described above, the substrate state measuring head 3 is moved to a place determined to be measured by the head, the state of the substrate is captured by using a camera or a laser scanner, and measurement inspection is performed. When all the measurement tests taught in advance are completed, the suction from the low pressure generating device 12 is cut off, the fixation is released, the positioning pin 7 descends and separates from the positioning hole 8, and the support holder 9 descends. The substrate stopper 6 also descends and does not block the substrate 1 to be measured. Then, the motor of the substrate transfer conveyor 2 is driven again, and the substrate to be measured 1 is discharged in the B direction. After that, the substrate transfer conveyor 2 guides the next substrate to be measured to the measurement place by the same method. By continuing this series of operations, measurement and inspection are continuously performed one after another.

Although the positioning pins and the positioning holes are assumed for the positioning of the substrate to be inspected in this embodiment, the same effect can be expected in the outer circumference regulating method in which the outer circumference of the substrate to be measured is pressed against the positioning reference to perform the positioning regulation. .. Further, in the present embodiment, the pressing mechanism is attached to the substrate state measuring head, but it may have the same function even if it is attached in the vicinity of the substrate transfer conveyor or in a completely different place. The type does not matter.

Further, as the state measuring means, for example,
There is an image measuring means consisting of one or more cameras. The image measuring means may be, for example, a video camera having a CCD tip difference for detecting laser light which is irradiation light, but is not limited to this, and X for detecting irradiation X-rays can be used.
It may be a line video camera. It goes without saying that in the former case, the laser light irradiating means is provided in each of the substrate state measuring devices and the substrate to be measured is irradiated with laser light or X-rays. In the case of the image measuring means composed of a plurality of cameras, it is possible to adopt a multi-camera system in which 5 to 6 cameras are simultaneously used and three-dimensional measurement is possible.

As the means for transferring the substrate to be measured, various methods such as a belt conveyor method and a moving table method are used.

The measurement processing section is mainly composed of a memory for storing the measurement program and the like, and a CPU for executing the measurement program.

As a positioning means, a moving table system for positioning by driving a feed screw with a pulse motor or the like,
Various types are used, including a direct linear drive system in which a linear motor is directly driven.

As the means for holding the substrate to be measured, there is used a means for holding the surface of the substrate to be measured so that the measuring surface of the substrate to be measured can have flatness according to the shape of the substrate to be measured. Generally, the holding surface is often kept flat, but it depends on the shape of the substrate to be measured.

As the substrate to be measured fixing means, a suction hole is provided in the holding surface of the substrate to be measured holding means, suction is performed from a low pressure generating device such as a vacuum pump, and the substrate to be measured is fixed by adsorbing to the holding surface. Shall be.

As the measured substrate correcting means, the measured substrate is held on the holding surface by the measured substrate holding means when the measured substrate is deformed so much that it is difficult to fix the measured substrate only by the fixing means. At this time, within a range that does not affect the measurement on the measurement surface of the substrate to be measured, for example, a substrate pressing mechanism provided near the camera unit, which is a state measuring means, is brought into close contact with the holding surface. As long as it does not hinder the state measurement, it may be in the vicinity of the substrate transfer means to be measured.

[0023]

As described above, in the substrate condition measuring device of the present invention, since the substrate to be measured is adsorbed and fixed on the holding surface of the support holder, the high-precision measurement caused by the deformation of the substrate. As a result, the factors that hinder the measurement are eliminated, and highly accurate three-dimensional measurement becomes possible.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a substrate state measuring device according to an embodiment of the present invention.

FIG. 2 is a side view showing details of substrate holding shown in FIG.

FIG. 3 is a side view showing an example in which the substrate to be inspected in FIG. 2 is largely deformed.

FIG. 4 is a schematic perspective view of a conventional substrate state measuring device.

FIG. 5 is a side view showing details of substrate holding shown in FIG.

6 is a side view showing an example in which the substrate to be inspected in FIG. 5 is largely deformed.

[Explanation of symbols]

 1 substrate to be measured 2 substrate conveyer 3 substrate state measuring head 4 Z axis 5 XY table 9 support holder 12 low pressure generator 13 pressing mechanism

Claims (3)

[Claims] 1. A state measuring means for measuring the state of a substrate to be measured, a transfer means for successively transferring the substrate to be measured through the installation position of the state measuring means, and a substrate obtained by the state measuring means. Measurement processing means for analyzing the state of the measurement substrate to measure each measured substrate, and positioning means for measuring the measured substrate by the state measuring means,
The substrate to be measured holding means for holding the substrate to be measured and the substrate to be measured substrate fixing means to eliminate deformation of the substrate to be measured, and the substrate to be inspected are fixed by the substrate to be measured fixing state, A substrate condition measuring device, characterized in that the condition of a substrate to be measured is measured by a measuring means. 2. The substrate to be measured fixing means fixes the substrate to be measured on the substrate holding surface of the substrate to be measured holding the substrate to be measured by suction by a suction force from a low pressure generating device. The substrate condition measuring device according to claim 1, wherein 3. The substrate condition measuring device according to claim 1, further comprising a measured substrate correcting means for accelerating the operation of the measured substrate fixing means.