JPH0498780A - Ic socket - Google Patents
Ic socketInfo
- Publication number
- JPH0498780A JPH0498780A JP2216293A JP21629390A JPH0498780A JP H0498780 A JPH0498780 A JP H0498780A JP 2216293 A JP2216293 A JP 2216293A JP 21629390 A JP21629390 A JP 21629390A JP H0498780 A JPH0498780 A JP H0498780A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- circuit board
- printed circuit
- debugging
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Connecting Device With Holders (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＣソケットに関し、特にデバッグ用ＩＣをプ
リント基板に仮実装するとき用いられるＩＣソケットに
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC socket, and particularly to an IC socket used when temporarily mounting a debugging IC on a printed circuit board.
従来、この種のデバッグ用ＩＣをプリント基板に仮実装
するときに用いられるＩＣソケットは、第４図に示すよ
うに、ＩＣリードを挿入するソケット部と、ソケット部
をプリント基板に実装するためのリード部とが一体化し
たコンタクトを有した構造になっており、リード部がプ
リント基板の取付穴に挿入され直接はんだ付けされてい
た。Conventionally, an IC socket used when temporarily mounting this type of debugging IC on a printed circuit board has a socket part into which an IC lead is inserted, and a socket part for mounting the socket part on a printed circuit board, as shown in Figure 4. It has a structure with a contact integrated with a lead part, and the lead part is inserted into a mounting hole of a printed circuit board and directly soldered.
上述した従来のＩＣソケットは、ＩＣＩＪ−ドを挿入す
るソケット部と、ソケット部をプリント基板に実装する
ためのリード部とが一体化したコンタクトを有し、モー
ルド樹脂により本体を形成しているため、外形が大きく
デバッグ用ＩＣを実装したとき、実装の高さが高く、装
置の小型会軽量化を図るための部品としては不向きであ
るという問題点があった。The conventional IC socket described above has a contact in which the socket part into which the ICIJ card is inserted and the lead part for mounting the socket part on the printed circuit board are integrated, and the main body is formed of molded resin. When a debugging IC with a large external shape is mounted, there is a problem in that the mounting height is high, making it unsuitable as a component for reducing the size and weight of a device.
また、従来のＩＣソケットは、プリント基板に直接はん
だ付けして実装するため、デバッグ終了後、ＩＣを直接
はんだ付けするときに、はんだを取外してＩＣソケット
を除去しなければならず、手間がかかるという問題点が
あった。In addition, conventional IC sockets are mounted by soldering directly to the printed circuit board, so when directly soldering the IC after debugging, the solder must be removed and the IC socket must be removed, which is time-consuming. There was a problem.
本発明の目的は、上記の問題を解決し、装置の小型・軽
量化を図るための部品として有用で、かつデバッグ終了
後、簡単にプリント基板にＩＣの本付は実装ができるＩ
Ｃソケットを提供することにある。The purpose of the present invention is to solve the above problems, to be useful as a component for making devices smaller and lighter, and to be able to easily mount an IC on a printed circuit board after debugging.
The aim is to provide a C socket.
本発明のＩＣソケットは、絶縁物によりシート状に形成
された本体の、ＩＣのそれぞれのリードに対応した位置
に、十字にスリットが設けられた箔状の導体部を有し、
前記ＩＣをプリント基板に取付けるとき、前記導体部を
、前記プリント基板上の前記ＩＣの取付穴位置にそれぞ
れ合せ、前記ＩＣのリードを対応する前記導体部を貫通
させ前記プリント基板上の前記ＩＣの取付穴に挿入する
ことにより、前記十字に設けられたスリットにより分割
された導体を介して、前記ＩＣのリードが前記プリント
基板上の前記ＩＣの取付穴の内面に圧接され固定される
ように構成されている。The IC socket of the present invention has a main body formed in a sheet shape of an insulating material, and has a foil-like conductor portion with cross-shaped slits at positions corresponding to each lead of the IC,
When attaching the IC to a printed circuit board, the conductor parts are aligned with the mounting holes of the IC on the printed circuit board, and the leads of the IC are passed through the corresponding conductor parts to attach the IC on the printed circuit board. By inserting the lead into the mounting hole, the lead of the IC is pressed against the inner surface of the mounting hole of the IC on the printed circuit board through the conductor divided by the slit provided in the cross shape, and is fixed. has been done.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の外観斜視図であり、第２図
は第１図に示すＩＣソケットのＡ部拡大斜視図である。FIG. 1 is an external perspective view of an embodiment of the present invention, and FIG. 2 is an enlarged perspective view of section A of the IC socket shown in FIG.
第１図に示すＩＣソケット２は、絶縁シートにデバッグ
用ＩＣＩのリード部４と同間隔の位置にパッド部５を有
し、パッド部５は、第２図に示すように、箔状の導体部
８と導体部８を４分割している十字スリブ）１０とから
構成されている。The IC socket 2 shown in FIG. 1 has a pad part 5 on an insulating sheet at the same distance as the lead part 4 of the debugging ICI, and the pad part 5 is made of a foil-like conductor as shown in FIG. It is composed of a section 8 and a cross-shaped rib (10) that divides the conductor section 8 into four parts.
次に、第１図に示すＩＣソケット２を使用して行うデバ
ッグ用ＩＣのプリント基板への実装方法を説明する。Next, a method of mounting a debugging IC onto a printed circuit board using the IC socket 2 shown in FIG. 1 will be described.
デバッグ用ＩＣ１をプリント基板３に仮実装するには、
ＩＣソケット２のパッド部５とプリント基板３の取付穴
７を合せ、プリント基板３上に置き、ＩＣソケット２の
絶縁シート面の両面粘着剤６により仮接着される。なお
、両面粘着剤６は絶縁シートの表面及裏面に塗布されて
いる。To temporarily mount the debug IC 1 on the printed circuit board 3,
The pad portion 5 of the IC socket 2 and the mounting hole 7 of the printed circuit board 3 are aligned, placed on the printed circuit board 3, and temporarily adhered to the insulating sheet surface of the IC socket 2 with the double-sided adhesive 6. Note that the double-sided adhesive 6 is applied to the front and back surfaces of the insulating sheet.
次ニ、デバッグ用ＩＣＩのリード部４ｔ−ＩＣ７ケツト
２のパッド部５に挿入する。デバッグ用ＩＣ１を挿入す
ることにより、第３図に示すように、十字スリット１０
により四分割されたＩＣソケット２の導体部８は、デバ
ッグ用ＩＣ１のリード部４と共に、プリント基板３の取
付穴７に挿入される。Next, the lead part 4t of the debugging ICI is inserted into the pad part 5 of the IC7 socket 2. By inserting the debugging IC 1, the cross slit 10 is opened as shown in FIG.
The conductor portion 8 of the IC socket 2 divided into four parts is inserted into the mounting hole 7 of the printed circuit board 3 together with the lead portion 4 of the debugging IC 1.
取付穴７に挿入された導体部８は、デバッグ用ＩＣＩの
リード部４とプリント基板３の取付穴７との間隙を埋め
、はんだ付けをしなくても、確実な接触を得ることがで
きる。The conductor portion 8 inserted into the mounting hole 7 fills the gap between the lead portion 4 of the debugging ICI and the mounting hole 7 of the printed circuit board 3, and reliable contact can be obtained without soldering.
なお、デバッグ用ＩＣＩは、ＩＣソケット２の絶縁シー
トに塗布されている両面粘着剤６により仮接着される。Note that the debugging ICI is temporarily adhered with a double-sided adhesive 6 applied to the insulating sheet of the IC socket 2.
また、デバッグ終了後は、従来、行っていたような、Ｉ
Ｃソケットのはんだ付は部のはんだ除去作業もなく、プ
リント基板に仮接着されているＩＣソケットを取除き、
直接ＩＣを実装することができる。In addition, after debugging is completed, the I
Soldering the C socket requires no soldering work, just remove the IC socket temporarily glued to the printed circuit board,
IC can be directly mounted.
以上説明したように、本発明は、ＩＣソケ、ソト本体を
シート状に構成することにより、装置の小型・軽量化を
図るための部品として有用であるという効果を有する。As explained above, the present invention has the effect that it is useful as a component for reducing the size and weight of the device by configuring the IC socket and the main body in a sheet shape.
また、デバッグ用ＩＣを箔状の導体パッドにより、ＩＣ
リードとともに、プリント基板の取付は穴に挿入し、圧
接により、デバッグＩＣを一時仮実装することができ、
デバッグ終了後、ＩＣを取付穴から取外し、次にＩＣソ
ケットを除去することにより、簡単にプリント基板にＩ
Ｃの本付は実装ができるという効果を有する。In addition, the debug IC can be connected to the IC using a foil-like conductor pad.
To attach the printed circuit board along with the leads, you can temporarily mount the debug IC by inserting it into the hole and press-fitting it.
After debugging, remove the IC from the mounting hole and then remove the IC socket to easily attach the IC to the printed circuit board.
The addition of C has the effect of being easy to implement.
第１図は本発明の一実施例の外観斜視図、第２図は第１
図に示すＩＣソケットのＡ部拡大斜視図、第３図は第１
図に示すＩＣソケットを用いてデバッグ用ＩＣをプリン
ト基板に実装したときの取付は状態を示す断面図、第４
図は従来のＩＣソケットの外観斜視図である。
１・・・・・・デバッグ用ＩＣ１２・・・・・・ＩＣソ
ケット、３・・・・・・プリント基板、４・・・・・・
リード部、５・・・・・・パッド部、６・・・・・・両
面粘着剤、７・・・・・・取付穴、８・・・・・・導体
部、１０・・・・・・十字スリット。
代理人 弁理士 内 原 晋FIG. 1 is an external perspective view of one embodiment of the present invention, and FIG.
Figure 3 is an enlarged perspective view of part A of the IC socket shown in Figure 1.
The mounting state when the debug IC is mounted on a printed circuit board using the IC socket shown in the figure is a cross-sectional view.
The figure is an external perspective view of a conventional IC socket. 1...Debug IC12...IC socket, 3...Printed circuit board, 4...
Lead part, 5...Pad part, 6...Double-sided adhesive, 7...Mounting hole, 8...Conductor part, 10...・Cross slit. Agent Patent Attorney Susumu Uchihara
Claims (1)
ぞれのリードに対応した位置に、十字にスリットが設け
られた箔状の導体部を有し、前記ＩＣをプリント基板に
取付けるとき、前記導体部を、前記プリント基板上の前
記ＩＣの取付穴位置にそれぞれ合せ、前記ＩＣのリード
を対応する前記導体部を貫通させ前記プリント基板上の
前記ＩＣの取付穴に挿入することにより、前記十字に設
けられたスリットにより分割された導体を介して、前記
ＩＣのリードが前記プリント基板上の前記ＩＣの取付穴
の内面に圧接され固定されるように構成されたことを特
徴とするＩＣソケット。The main body, which is formed into a sheet shape of an insulating material, has a foil-like conductor section with cross-shaped slits at positions corresponding to the respective leads of the IC, and when the IC is attached to a printed circuit board, the conductor section by aligning the leads of the IC with the mounting holes of the IC on the printed circuit board, passing the leads of the IC through the corresponding conductor parts, and inserting them into the mounting holes of the IC on the printed circuit board. An IC socket, characterized in that the leads of the IC are press-contacted and fixed to the inner surface of the mounting hole of the IC on the printed circuit board through conductors divided by provided slits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2216293A JPH0498780A (en) | 1990-08-16 | 1990-08-16 | Ic socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2216293A JPH0498780A (en) | 1990-08-16 | 1990-08-16 | Ic socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0498780A true JPH0498780A (en) | 1992-03-31 |
Family
ID=16686268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2216293A Pending JPH0498780A (en) | 1990-08-16 | 1990-08-16 | Ic socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0498780A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9584520B2 (en) | 2012-09-22 | 2017-02-28 | Google Inc. | Multi-tiered authentication methods for facilitating communications amongst smart home devices and cloud-based servers |
| US9679454B2 (en) | 2015-02-06 | 2017-06-13 | Google Inc. | Systems, methods, and devices for managing coexistence of multiple transceiver devices using control signals |
-
1990
- 1990-08-16 JP JP2216293A patent/JPH0498780A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9584520B2 (en) | 2012-09-22 | 2017-02-28 | Google Inc. | Multi-tiered authentication methods for facilitating communications amongst smart home devices and cloud-based servers |
| US9679454B2 (en) | 2015-02-06 | 2017-06-13 | Google Inc. | Systems, methods, and devices for managing coexistence of multiple transceiver devices using control signals |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0498780A (en) | Ic socket | |
| JPH01166545A (en) | Zigzag type ic | |
| JPH03129866A (en) | Semiconductor device | |
| JPS62160290A (en) | Soldering mask | |
| JPH01161707A (en) | Chip component | |
| JPH0134291Y2 (en) | ||
| JPS587655Y2 (en) | Parts mounting hole structure | |
| JPH0341967U (en) | ||
| JPH04167585A (en) | Mounting method of electric component | |
| JPS61168666U (en) | ||
| JPS59171393U (en) | Equipment for attaching parts to printed circuit boards | |
| JPS63119213A (en) | Structure of double-sided mount chip component | |
| JPS6418775U (en) | ||
| JPS62120100A (en) | Method of mounting chip parts on printed wiring board | |
| JPH0334596A (en) | Hybrid integrated circuit | |
| JPS59164178U (en) | Multi-pin electrical components | |
| JPS60180194A (en) | Device for mounting part on circuit board | |
| JPH01297882A (en) | Printed board | |
| JPS58155862U (en) | Printed board | |
| JPH04309255A (en) | Semiconductor device | |
| JPS59185874U (en) | Chip component wiring body | |
| JPS6188267U (en) | ||
| JPH02120862U (en) | ||
| JPS63252454A (en) | Surface mounting component package | |
| JPS6144878U (en) | Soldering plate for mounting parts |