JPH01166545A - Zigzag type ic - Google Patents
Zigzag type icInfo
- Publication number
- JPH01166545A JPH01166545A JP32618387A JP32618387A JPH01166545A JP H01166545 A JPH01166545 A JP H01166545A JP 32618387 A JP32618387 A JP 32618387A JP 32618387 A JP32618387 A JP 32618387A JP H01166545 A JPH01166545 A JP H01166545A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- zigzag type
- surface mounting
- zigzag
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 4
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 239000006071 cream Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はジグザグ型IC1特に、電子機器に使用される
ジグザグ型ICに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a zigzag type IC 1, particularly to a zigzag type IC used in electronic equipment.
従来のジグザグ型ICは第2図に示すようにプリント基
板に接続するものにも半田付用リードで接続していた。Conventional zigzag type ICs are also connected to the printed circuit board using soldering leads, as shown in FIG.
しかしながらこのような上述した従来のジグザグ型IC
は半田付用リードのため、実装パターンが引きすらいと
いう欠点がある。However, the above-mentioned conventional zigzag type IC
Because it is a lead for soldering, it has the disadvantage that the mounting pattern is uneven.
本発明のジグザグ型ICは表面実装技術用リードを含ん
で構成される。The zigzag type IC of the present invention includes leads for surface mounting technology.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
第1図に示すジグザグ型ICは、IC本体10両端のリ
ードが半田付用リード2となり、ICの転倒を防いでい
る。In the zigzag type IC shown in FIG. 1, the leads at both ends of the IC body 10 serve as soldering leads 2 to prevent the IC from falling over.
他のリードは表面実装技術用リード3,4であり、これ
らは互いに千鳥状となるように配置されている。The other leads are surface mount technology leads 3 and 4, which are arranged in a staggered manner.
プリント基板にジグザグ型ICを実装する時は、スルー
ホールに半田付用リード2を挿入し、ICの転倒を防ぎ
、他のリードはプリント基板上につくられたパッド上に
クリーム半田により半田接続される。When mounting a zigzag IC on a printed circuit board, insert the soldering lead 2 into the through hole to prevent the IC from falling over, and connect the other leads to the pads made on the printed circuit board using cream solder. Ru.
本発明のジグザグ型ICは表面実装技術に対応したリー
ドの構造にすることによりプリント基板上でのパターン
を作成しやすいという効果がある。The zigzag type IC of the present invention has the effect of making it easy to create a pattern on a printed circuit board by having a lead structure compatible with surface mounting technology.
第1図は本発明の一実施例を示す斜視図、第2図は従来
の一例を示す斜視図である。
1・・・・・・IC本体、2,2′・・・・・・半田付
用リード、3.4・・・・・・表面実装技術用リード。
代理人 弁理士 内 原 音
、1f51 @
352図FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional example. 1...IC body, 2,2'...lead for soldering, 3.4...lead for surface mounting technology. Agent Patent attorney Oto Uchihara, 1f51 @352 drawing
Claims (1)
用リードと、表面実装のために千鳥状に配置された表面
実装技術用リードとを含むことを特徴とするジグザグ型
IC。A zigzag IC characterized in that it includes an IC body, soldering leads provided at both ends of the IC body, and leads for surface mounting technology arranged in a staggered manner for surface mounting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32618387A JPH01166545A (en) | 1987-12-22 | 1987-12-22 | Zigzag type ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32618387A JPH01166545A (en) | 1987-12-22 | 1987-12-22 | Zigzag type ic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01166545A true JPH01166545A (en) | 1989-06-30 |
Family
ID=18184963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32618387A Pending JPH01166545A (en) | 1987-12-22 | 1987-12-22 | Zigzag type ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01166545A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5319755A (en) * | 1990-04-18 | 1994-06-07 | Rambus, Inc. | Integrated circuit I/O using high performance bus interface |
US5446317A (en) * | 1992-03-09 | 1995-08-29 | Fujitsu Limited | Single in-line package for surface mounting |
US5574310A (en) * | 1991-05-17 | 1996-11-12 | Fujitsu Limited | Semiconductor package for surface mounting with reinforcing members on support legs |
US5831332A (en) * | 1991-05-17 | 1998-11-03 | Fujitsu Limited | Semiconductor package for surface mounting |
US6002589A (en) * | 1997-07-21 | 1999-12-14 | Rambus Inc. | Integrated circuit package for coupling to a printed circuit board |
US6007357A (en) * | 1995-05-26 | 1999-12-28 | Rambus Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
US6234820B1 (en) | 1997-07-21 | 2001-05-22 | Rambus Inc. | Method and apparatus for joining printed circuit boards |
US8096812B2 (en) | 1995-05-26 | 2012-01-17 | Rambus Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
-
1987
- 1987-12-22 JP JP32618387A patent/JPH01166545A/en active Pending
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5657481A (en) * | 1990-04-18 | 1997-08-12 | Rambus, Inc. | Memory device with a phase locked loop circuitry |
US5983320A (en) * | 1990-04-18 | 1999-11-09 | Rambus, Inc. | Method and apparatus for externally configuring and modifying the transaction request response characteristics of a semiconductor device coupled to a bus |
US5473575A (en) * | 1990-04-18 | 1995-12-05 | Rambus, Inc. | Integrated circuit I/O using a high performance bus interface |
US5499385A (en) * | 1990-04-18 | 1996-03-12 | Rambus, Inc. | Method for accessing and transmitting data to/from a memory in packets |
US5513327A (en) * | 1990-04-18 | 1996-04-30 | Rambus, Inc. | Integrated circuit I/O using a high performance bus interface |
US5319755A (en) * | 1990-04-18 | 1994-06-07 | Rambus, Inc. | Integrated circuit I/O using high performance bus interface |
US5606717A (en) * | 1990-04-18 | 1997-02-25 | Rambus, Inc. | Memory circuitry having bus interface for receiving information in packets and access time registers |
US5861669A (en) * | 1991-05-17 | 1999-01-19 | Fujitsu Limited | Semiconductor package for surface mounting |
US5831332A (en) * | 1991-05-17 | 1998-11-03 | Fujitsu Limited | Semiconductor package for surface mounting |
US5574310A (en) * | 1991-05-17 | 1996-11-12 | Fujitsu Limited | Semiconductor package for surface mounting with reinforcing members on support legs |
US5728601A (en) * | 1992-03-09 | 1998-03-17 | Fujitsu Limited | Process for manufacturing a single in-line package for surface mounting |
US5446317A (en) * | 1992-03-09 | 1995-08-29 | Fujitsu Limited | Single in-line package for surface mounting |
US6007357A (en) * | 1995-05-26 | 1999-12-28 | Rambus Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
US6352435B1 (en) | 1995-05-26 | 2002-03-05 | Rambus, Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
US6589059B2 (en) | 1995-05-26 | 2003-07-08 | Rambus, Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
US6619973B2 (en) | 1995-05-26 | 2003-09-16 | Rambus, Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
US8096812B2 (en) | 1995-05-26 | 2012-01-17 | Rambus Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
US6002589A (en) * | 1997-07-21 | 1999-12-14 | Rambus Inc. | Integrated circuit package for coupling to a printed circuit board |
US6234820B1 (en) | 1997-07-21 | 2001-05-22 | Rambus Inc. | Method and apparatus for joining printed circuit boards |
US6447321B1 (en) | 1997-07-21 | 2002-09-10 | Rambus, Inc. | Socket for coupling an integrated circuit package to a printed circuit board |
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