JPH0330494A - Through-hole forming method for flexible circuit board - Google Patents
Through-hole forming method for flexible circuit boardInfo
- Publication number
- JPH0330494A JPH0330494A JP16621989A JP16621989A JPH0330494A JP H0330494 A JPH0330494 A JP H0330494A JP 16621989 A JP16621989 A JP 16621989A JP 16621989 A JP16621989 A JP 16621989A JP H0330494 A JPH0330494 A JP H0330494A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- resin film
- flexible circuit
- sides
- metal foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000011888 foil Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000000843 powder Substances 0.000 claims abstract description 15
- 238000003466 welding Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、フレキシブル回路基板に低抵抗のスルーホー
ル部を形成する方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of forming a low resistance through-hole portion in a flexible circuit board.
（従来の技術）
従来より、フレキシブル回路基板にスルーホール部を形
成する場合は、フレキシブル回路基板ニ透孔を設けてそ
の内面をメツキ処理する方法や、該透孔に導電インクを
充填する方法が採用されていた。(Prior Art) Conventionally, when forming a through-hole portion in a flexible circuit board, there have been methods such as providing a through-hole in the flexible circuit board and plating its inner surface, or filling the through-hole with conductive ink. He had been hired.
しかし、上記の方法は加工工数が多く煩瑣である。その
ため、最近では超音波振動を利用してスルーホール部を
形成する方法が採用されるようになってきた。この方法
は、樹脂フィルム１０両面に金属箔を貼り合わせてエツ
チングにより回路を形成したフレキシブル回路基板に対
し、超音波ホーン等を用いて超音波振動を局部的に与え
、第５図に示すように、超音波振動を与えた部分の樹脂
フィルム１を溶融させると共に、両面の金属箔２．２を
内側へ凹曲させながら溶接してスルーホール部３を形成
するものである。尚、第５図中、４は金属箔２．２を樹
脂フィルムｌに貼り合わせる接着剤である。However, the above method requires a large number of processing steps and is cumbersome. Therefore, recently, a method of forming through-hole portions using ultrasonic vibration has been adopted. In this method, ultrasonic vibrations are locally applied using an ultrasonic horn or the like to a flexible circuit board on which metal foils are bonded to both sides of a resin film 10 and circuits are formed by etching. The through-hole portion 3 is formed by melting the resin film 1 at the portion subjected to ultrasonic vibration, and welding the metal foils 2.2 on both sides while concavely bending them inward. In addition, in FIG. 5, 4 is an adhesive for bonding the metal foil 2.2 to the resin film l.
〈発明が解決しようとする課題）
超音波振動を利用する上述のスルーホール部形成方法は
、単一工程でスルーホール部を形成テきる利点を有する
が、その反面、溶融樹脂が双方の金１箔２．２の間に侵
入して金属箔２．２の溶接を妨げるため、低抵抗のスル
ーホール部を形成することが難しく、場合によっては導
通不良を生じるという問題があった。(Problem to be Solved by the Invention) The above-mentioned method for forming a through-hole using ultrasonic vibration has the advantage that the through-hole can be formed in a single step. Since the metal foil 2.2 enters between the metal foils 2.2 and prevents welding of the metal foil 2.2, it is difficult to form a through-hole portion with low resistance, and there is a problem in that poor conduction occurs in some cases.
本発明は上記問題に鑑みてなされたもので、その目的と
するところは、フレキシブル回路基板ノ両面の金属箔を
確実に導通させて低抵抗のスルーホール部を形成できる
方法を提供することにある。The present invention has been made in view of the above problems, and its purpose is to provide a method that can form a low-resistance through-hole portion by ensuring conduction between metal foils on both sides of a flexible circuit board. .
（１１題を解決するための手段）
本発明のスルーホール部の形成方法は、導電性粉末が分
散された電気絶縁性の樹脂フィルムの両面に金属箔を貼
り合わせてエツチングにより回路を形成したフレキシブ
ル回路基板に超音波振動を局部的に与え、その部分の樹
脂フィルムを溶融させながら両面の金属箔を内側に凹曲
させて溶接することを特徴としており、これによって上
記目的が達成される。(Means for Solving Problem 11) The method for forming a through hole portion of the present invention is a flexible film in which a circuit is formed by bonding metal foil to both sides of an electrically insulating resin film in which conductive powder is dispersed and etching it. The method is characterized in that ultrasonic vibrations are locally applied to the circuit board to melt the resin film in that area while concavely bending the metal foils on both sides inward for welding, thereby achieving the above object.
（作用）
本発明のように、樹脂フィルム中に導電性粉末が分散さ
れているフレキシブル回路基板を使用すると、超音波振
動を与九て樹脂フィルムを局部的に溶融させながら両面
の金属箔を凹曲させて溶接するときに、導電性粉末が金
属箔に突き刺さり、この突き刺さった金属箔を介して両
面の金属箔が確実に導通する。(Function) When using a flexible circuit board in which conductive powder is dispersed in a resin film as in the present invention, ultrasonic vibrations are applied to locally melt the resin film while denting the metal foils on both sides. When welding by bending, the conductive powder pierces the metal foil, and the metal foils on both sides are reliably electrically connected through the pierced metal foil.
（実施例） 以下、図面に基づいて本発明の実施例を詳述する。(Example) Embodiments of the present invention will be described in detail below based on the drawings.
本実施例で用いるフレキシブル回路基板は、第１図に示
すように、導電性粉末５が分散された電気絶縁性の樹脂
フィルム６の両面に接着剤４．４を介して金属箔２．２
を貼り合わせ、第２図に示すように、金属箔２．２の不
要部分をエツチングして両面に回路を形成したものであ
る。As shown in FIG. 1, the flexible circuit board used in this embodiment is made of a metal foil 2.2 that is bonded to both sides of an electrically insulating resin film 6 in which conductive powder 5 is dispersed via an adhesive 4.4.
As shown in FIG. 2, unnecessary portions of the metal foil 2.2 are etched to form circuits on both sides.
上記樹脂フィルム６は、例えばポリエステル樹脂やポリ
イミド樹脂等の樹脂液に導電性粉末５を混合して攪拌し
、これを一定の厚さになるよう展伸して導電性粉末５を
均一に分散させたものであり、導電性粉末５としてはカ
ーボン粉末や種々の金属粉末が使用されるが、特に、金
属箔２に突き刺さりやすい硬いニッケル粉末等が好適に
使用される。この導電性粉末５の配合量は、樹脂フィル
ム６の電気絶縁性が失われない範囲内とする必要がある
。また、金属箔２としてはアルミニウム箔や銅箔等の凹
曲しやすい比較的軟質の金属箔が好適に使用され、この
金属箔２．２を貼り合わせる接着剤４．４としては、上
記樹脂フィルム６と金属箔２の双方に対して良好な接着
力を有するウレタン系やエポキシ系等の樹脂接着剤が好
適に使用される。尚、金属箔２．２をエツチングして回
路を形成する方法としては、従来公知のフォトプロセス
法やスクリーン印刷法などが採用される。The resin film 6 is made by mixing the conductive powder 5 with a resin liquid such as polyester resin or polyimide resin, stirring the mixture, and stretching the mixture to a certain thickness to uniformly disperse the conductive powder 5. Carbon powder and various metal powders can be used as the conductive powder 5, but hard nickel powder or the like that easily pierces the metal foil 2 is particularly preferably used. The amount of the conductive powder 5 needs to be within a range that does not cause the resin film 6 to lose its electrical insulation properties. In addition, as the metal foil 2, a relatively soft metal foil that is easily bent, such as aluminum foil or copper foil, is suitably used, and as the adhesive 4.4 for bonding the metal foil 2.2, the above-mentioned resin film is used. A resin adhesive such as urethane-based or epoxy-based adhesive that has good adhesion to both the metal foil 2 and the metal foil 2 is preferably used. Incidentally, as a method of etching the metal foil 2.2 to form a circuit, a conventionally known photo process method, screen printing method, or the like is employed.
本実施例では、上記のようなフレキシブル回路基板を用
いて、第３図に示すように突起７を有する受台８に該基
板を載置し、その上から超音波ホーン９を押し当てて、
該基板のスルーホール部を形成すべき個所（通常は回路
のランド部）を突起７と超音波ホーン９で挟んだのち、
超音波発振して超音波振動を局部的に与え、その部分の
樹脂フィルム６を超音波振動による摩擦熱で溶融させな
がら両面の金属箔２．２を内側に凹曲させて互いに溶接
することにより、スルーホール部１０（第４図）が形成
される。尚、超音波ホーン９の振動数は従来と同様でよ
く、例えば１８ｋＨｚ程度が好適である。In this embodiment, using a flexible circuit board as described above, the board is placed on a pedestal 8 having a protrusion 7 as shown in FIG. 3, and an ultrasonic horn 9 is pressed from above.
After sandwiching the portion of the board where the through-hole portion is to be formed (usually the land portion of the circuit) between the protrusion 7 and the ultrasonic horn 9,
By oscillating ultrasonic waves to locally apply ultrasonic vibrations, and melting the resin film 6 in that area by the frictional heat caused by the ultrasonic vibrations, the metal foils 2.2 on both sides are bent inward and welded together. , a through hole portion 10 (FIG. 4) is formed. Incidentally, the frequency of the ultrasonic horn 9 may be the same as the conventional one, and is preferably about 18 kHz, for example.
このようにしてスルーホール部１０を形成すると、第４
図に示すように、樹脂フィルム６の溶融部分の導電性粉
末５が金属箔２に突き刺さり、この突き刺さった導電性
粉末５を介して両面の金属箔２．２が確実に導通するの
で、導通不良を生じる恐れがなくなり、抵抗値が低く且
つ安定したスルーホール部ｌＯが形成される。When the through-hole portion 10 is formed in this way, the fourth
As shown in the figure, the conductive powder 5 in the melted part of the resin film 6 pierces the metal foil 2, and the metal foils 2.2 on both sides are reliably electrically connected through the pierced conductive powder 5, resulting in poor conduction. This eliminates the possibility of the occurrence of turbulence, and a stable through-hole portion 10 with a low resistance value is formed.
（発明の効果）
以上の説明から明らかなように、本発明のスルーホール
部の形成方法によれば、抵抗値が低く且つ安定したスル
ーホール部を単一の工程で極く簡単に形成できるといっ
た顕著な効果が得られる。(Effects of the Invention) As is clear from the above explanation, according to the method for forming a through-hole portion of the present invention, a through-hole portion with a low resistance value and stable value can be formed extremely easily in a single process. Remarkable effects can be obtained.
４、゛ の、１単な言Ｉ
第１図は本発明の一実施例で用いるフレキシブル回路基
板の回路形成前の状態を示す部分断面図、第２図はフレ
キシブル回路基板の部分断面図、第３図はフレキシブル
回路基板にスルーホール部を形成しているところを示す
部分断面図、第４図は形成されたスルーホール部を拡大
して示す断面図、第５図は超音波振動を利用する従来の
方法でスルーホール部を形成したフレキシブル回路基板
の部分断面図である。4. 1 Simple statement I Fig. 1 is a partial sectional view showing a state before circuit formation of a flexible circuit board used in an embodiment of the present invention; Fig. 2 is a partial sectional view of the flexible circuit board; Figure 3 is a partial cross-sectional view showing through-holes being formed on a flexible circuit board, Figure 4 is an enlarged cross-sectional view of the formed through-holes, and Figure 5 is a method using ultrasonic vibration. FIG. 2 is a partial cross-sectional view of a flexible circuit board in which through-hole portions are formed using a conventional method.
２・・・金層箔、５・・・導電性粉末、６・・・樹脂フ
ィルム、９・・・＋［ｌ［ホーン、ｌＯ・・・スルーホ
ール部。2... Gold layer foil, 5... Conductive powder, 6... Resin film, 9... +[l[horn, lO... Through hole part.
以上that's all
Claims (1)
の両面に金属箔を貼り合わせてエッチングにより回路を
形成したフレキシブル回路基板に超音波振動を局部的に
与え、その部分の樹脂フィルムを溶融させながら両面の
金属箔を内側に凹曲させて溶接するフレキシブル回路基
板のスルーホール部の形成方法。1. Ultrasonic vibrations are locally applied to a flexible circuit board, in which a circuit is formed by etching metal foil pasted on both sides of an electrically insulating resin film in which conductive powder is dispersed, melting the resin film in that area. A method for forming through holes in flexible circuit boards by concavely bending metal foil on both sides inward and welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16621989A JPH0330494A (en) | 1989-06-28 | 1989-06-28 | Through-hole forming method for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16621989A JPH0330494A (en) | 1989-06-28 | 1989-06-28 | Through-hole forming method for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330494A true JPH0330494A (en) | 1991-02-08 |
Family
ID=15827321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16621989A Pending JPH0330494A (en) | 1989-06-28 | 1989-06-28 | Through-hole forming method for flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330494A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19522338A1 (en) * | 1995-06-20 | 1997-01-02 | Fraunhofer Ges Forschung | Deformable substrate through-contact production method for chip carrier |
| WO2007053606A2 (en) * | 2005-11-01 | 2007-05-10 | Sandisk Corporation | Multiple die integrated circuit package |
| US7352058B2 (en) * | 2005-11-01 | 2008-04-01 | Sandisk Corporation | Methods for a multiple die integrated circuit package |
| US7511371B2 (en) | 2005-11-01 | 2009-03-31 | Sandisk Corporation | Multiple die integrated circuit package |
| JP2014120568A (en) * | 2012-12-14 | 2014-06-30 | Showa Denko Packaging Co Ltd | Front and back conduction method for wiring board |
| CN109216266A (en) * | 2018-09-10 | 2019-01-15 | 华南理工大学 | The production method of via hole, the production method of array substrate and array substrate |
| WO2019039454A1 (en) * | 2017-08-25 | 2019-02-28 | 株式会社フジクラ | Printed wiring board and manufacturing method thereof |
-
1989
- 1989-06-28 JP JP16621989A patent/JPH0330494A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19522338A1 (en) * | 1995-06-20 | 1997-01-02 | Fraunhofer Ges Forschung | Deformable substrate through-contact production method for chip carrier |
| DE19522338B4 (en) * | 1995-06-20 | 2006-12-07 | Pac Tech-Packaging Technologies Gmbh | Chip carrier assembly with a via |
| US7514297B2 (en) | 2005-11-01 | 2009-04-07 | Sandisk Corporation | Methods for a multiple die integrated circuit package |
| WO2007053606A3 (en) * | 2005-11-01 | 2007-09-07 | Sandisk Corp | Multiple die integrated circuit package |
| US7352058B2 (en) * | 2005-11-01 | 2008-04-01 | Sandisk Corporation | Methods for a multiple die integrated circuit package |
| US7511371B2 (en) | 2005-11-01 | 2009-03-31 | Sandisk Corporation | Multiple die integrated circuit package |
| WO2007053606A2 (en) * | 2005-11-01 | 2007-05-10 | Sandisk Corporation | Multiple die integrated circuit package |
| US7939920B2 (en) | 2005-11-01 | 2011-05-10 | Sandisk Corporation | Multiple die integrated circuit package |
| US8030135B2 (en) | 2005-11-01 | 2011-10-04 | Sandisk Technologies Inc. | Methods for a multiple die integrated circuit package |
| JP2014120568A (en) * | 2012-12-14 | 2014-06-30 | Showa Denko Packaging Co Ltd | Front and back conduction method for wiring board |
| WO2019039454A1 (en) * | 2017-08-25 | 2019-02-28 | 株式会社フジクラ | Printed wiring board and manufacturing method thereof |
| JP2019041019A (en) * | 2017-08-25 | 2019-03-14 | 株式会社フジクラ | Printed wiring board and manufacturing method of the same |
| CN109216266A (en) * | 2018-09-10 | 2019-01-15 | 华南理工大学 | The production method of via hole, the production method of array substrate and array substrate |
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