JPH03271792A - Structure for packaging driving circuit of liquid crystal display device or the like - Google Patents

Abstract

PURPOSE:To shorten the time for works by subjecting an IC chip to face-down packaging to the electrode input terminal part on an electrode substrate and the input wirings to the IC chip. CONSTITUTION:The IC chip 4 is packaged in the face-down state on the input terminal part 12a of the transparent electrodes 12 disposed on the electrode substrate 1B and the input wirings 15 to the IC chip 4. The input terminal part 12a is wired toward the three sides on the output terminals 4b side of the IC chip 4 of a square shape. The input terminal part 12a and the output terminals 4b are conducted and connected by a conductive adhesive, etc. The input wirings 15 to the IC chip 4 are formed in the direction approximately perpendicular to the side on the input terminal 4a side of the IC chip 4. The input wirings 15 and the input terminals 4a are similarly conducted and connected. The input wirings 15 are connected by wire bonding 5 to the circuit substrate 2. The time for works is shortened in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a drive circuit mounting structure in a liquid crystal display device or the like.

[Conventional technology]

For example, various configurations have been proposed as mounting structures for drive circuits in liquid crystal display devices.

Figures 2 (a) and (b) show an example of the drive circuit mounting structure in a conventional liquid crystal display device.
A liquid crystal layer 13 is interposed between a pair of electrode substrates IA and 18 on which a liquid crystal layer 13 is disposed, and a sealing member 14 is provided around the liquid crystal layer 13.

4 in the figure is an IC chip for driving a liquid crystal such as an LSI, and input/output terminals 4a and 4b are placed on the side opposite to the electrode substrate IB (facing upward).
It is placed and fixed on the electrode substrate IB in a so-called face-up state.

Input terminal portion 12a of transparent electrode 12 on electrode substrate IB
are wired toward the three sides of the output terminal 4b side of the planar square IC chip 4, and the output terminal 4b and the input terminal section 1 are connected to each other.
2a are connected by wire bonding 5b.

Further, on the electrode substrate IB on the side of the IC chip 4, there are input terminals 4 of the plurality of IC chips 4 disposed on the substrate.
Human wiring 15 to the IC chip that commonly connects a is the IC
It is provided parallel to the side on the input terminal 4a side of the chip, and its input wiring 15 and the input terminal 4a of the IC chip are connected by wire bonding 5a. The input wiring 15 is connected to a drive control circuit board (not shown) via a flexible wiring connection member (not shown).

However, as mentioned above, the IC chip 4 is placed on the electrode substrate IB.
When the input wiring 15 is provided parallel to the side of the input terminal 4a of the IC chip, the display area S is as shown in FIG. 3(a).
The length from the end of the electrode substrate IB to the end of the electrode substrate IB increases, resulting in an increase in the size of the device. In addition, as mentioned above, connecting all the input/output terminals 4a and 4b of the IC chip 4 using wire bonding 5a and 5b takes time to connect, and in particular, the more pins there are, the longer the work takes and the manufacturing cost increases. There is a problem.

Therefore, for example, as shown in FIGS. 3(a) and 3(b), the input terminal portion 12a of the electrode 12 on the electrode substrate IB is wired toward the three sides of the output terminal 4b side of the IC chip 4, which is rectangular in plan. , the input wiring 15 to the IC chip 4 is formed in a direction perpendicular to the side on the input terminal 4a side of the IC chip 4.
It is also known to mount the chip 4 in a so-called face-down state with its input/output terminals facing the board side, and to connect the input wiring 15 and the control circuit board 12 with a flexible wiring connection member 3 such as an FPC. ing. 30 is a wiring board of the connection member 31, 3a is a connection wiring, 6a and 6b are anisotropic am
It is an adhesive.

However, in the case of mounting as described above, since the input terminal portion of the electrode substrate is multilayer wiring, the cost increases and the number of connecting members is increased by one.

[Problem to be solved by the invention]

The present invention was proposed in view of the above-mentioned problems, and aims to minimize the size of the electrode substrate, use single-layer wiring, and reduce the number of man-hours.

[Means for Solving the Problems] In order to achieve the above object, a drive circuit mounting structure in a liquid crystal display device or the like according to the present invention has the following configuration.

That is, an electrode input terminal section and input wiring to the IC chip are provided on an electrode substrate such as a liquid crystal panel, the IC chip is mounted face down on these, and the input wiring to the IC chip is connected to the circuit board. It is characterized by being connected by wire bonding.

[For production]

By mounting the IC chip face-down on the electrode input terminal section on the electrode substrate and the input wiring to the IC chip, all input and output terminals of the IC chip can be connected by wire bonding as shown in the example in Figure 2 above. It is possible to shorten the working time compared to the case where the input wiring is wire-bonded to the circuit board, and the connection can be made without using a flexible wiring connection member as in the example shown in Fig. 3. becomes possible.

〔Example〕

Hereinafter, the present invention will be specifically explained based on embodiments shown in the drawings.

FIG. 1 is a perspective view showing an example of a drive circuit mounting structure in a liquid crystal display device or the like according to the present invention, and FIG. 2 is a longitudinal cross-sectional view of the main parts. Reference numerals are given to omit further explanation.

The IC chip 4 has an input terminal portion 12a of the transparent electrode 12 arranged on the electrode substrate IB, and an input terminal tIl1 to the IC chip 4.
It is implemented face down on top of 15. The input terminal portion 12a is wired toward three sides of the rectangular IC chip 4 on the output terminal 4b side, and the input terminal portion 12a and the output terminal 4b are electrically connected with each other using a conductive adhesive or the like.

In addition, the input wiring 15 to the IC chip 4 is connected to the IC chip 4.
The input terminal 4a is formed substantially perpendicularly to the side on the input terminal 4a side, and the human wiring 15 and the input terminal 4a are conductively connected in the same manner as described above. The input wiring 15 is connected to the circuit board 2 by wire bonding 5. The circuit board 12 is fixed to the lower surface of the electrode board IB with an adhesive 7 or the like. 8 is IC chip 4 and wire bonding 5
Shows the coating resin that covers etc.

Note that for the upper electrode substrate IA in FIG.
The electrode input terminal portion 11a and the input wiring &1l15 are provided on the substrate IA as in the case of the lower electrode substrate, and the IC chip 4
is mounted face down, and the input wiring 15 is connected to the wiring on the flexible wiring connecting member 3l such as FPC by wire bonding 5, and the flexible wiring connecting member 31 is connected to the circuit board 2.
is connected to.

Although the above embodiment has been explained using a liquid crystal display as an example, it is also applicable to a plasma display, an EL display, a thermal head, etc., and is particularly effective in the field of multi-pin high-density terminal connection.

〔Effect of the invention〕

As explained above, in the present invention, since the IC chip is mounted face-down on the electrode input terminal portion on the electrode substrate and the input wiring to the IC chip, the IC chip can be mounted face-down as shown in the example in FIG. Compared to connecting all output terminals with wire bonding, the work time can be significantly shortened, and the input wiring to the IC chip can be wire bonded to an extremely small size, making the electrode board smaller. can.

In addition, since the input wiring described above is connected to the circuit board by wire bonding, it is possible to connect it without using a flexible wiring connection member as in the example shown in Fig. 3, and the number of parts and assembly man-hours are reduced. It has the effect of being mass-produced at low cost.

[Brief explanation of drawings]

FIG. 1(a) is a perspective view showing an example of a drive circuit mounting structure in a liquid crystal display device or the like according to an embodiment of the present invention;
b) is a vertical sectional view of the main part, Figure 2(a) and (b)
) are a perspective view and a vertical cross-sectional view showing an example of a drive circuit mounting structure in a conventional liquid crystal display device, and FIG. 3(a).
b) is a perspective view and a vertical sectional view of another conventional example. 1 is a liquid crystal panel, IA and IB are electrode substrates, 11 and 12 are electrodes, 12a is an input terminal section, 2 is an IC chip, 5 is a wire bonding, and 15 is an input wiring.

Claims (1)

[Claims] (1) Provide electrode input terminals and input wiring to the IC chip on an electrode substrate such as a liquid crystal panel, mount the IC chip face down on top of these, and connect the input wiring to the IC chip to the circuit. A drive circuit mounting structure in a liquid crystal display device, etc., characterized by being connected to a substrate by wire bonding.