JPH03167913A - Seal base and production of electronic component - Google Patents

Abstract

PURPOSE:To reduce troublesome adhesives coating process and to improve the productivity by coating an adhesives whose film thickness is below nearly 10% of the maximum value of the required gap between a base provided with a function element and a seal base to nearly the entire face of the seal base toward the cavity forming side. CONSTITUTION:An adhesives 5 is coated to the entire face of vibration space forming recessed parts 2a, 3a of seal bases 2, 3 with a thickness of nearly 10% or below of the maximum value of the gap required between a piezoelectric base 4 and the seal bases 2, 3. Thus, the film thickness of the adhesives 5 is sufficiently thin with respect to the depth of the vibration space forming recessed parts 2a, 3a and even when the adhesives 5 is more or less moved due to its fluidity, the gap is not buried. As the coating method of the adhesives 5, the spray method, the dipping method or the spinner method or the like is used. The bases 2, 3, 4 thus obtained are adhered by the adhesives 5 and fixed to obtain the piezoelectric resonator component 1 with the vibration space.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a sealing substrate used for chip-type electronic components having a cavity structure, such as piezoelectric resonant components.

Prior Art and Problems Chip-type electronic components having a cavity structure, for example, a piezoelectric substrate 36 and a sealing substrate 37 of a piezoelectric resonant component 35 shown in FIG.
．． Adhesive 39 is used for bonding with 38. Generally, the adhesive 39 is applied to the sealing substrates 37 and 38, and a screen printing method has been adopted as the application method. This screen printing method cannot be said to have excellent leveling properties, and there may be problems with the vibration space forming recesses 37a,
38a has the disadvantage that an adhesive film with good thickness accuracy cannot be formed, so the vibration space forming recess 37a.
38a had sealed the corresponding part of the screen mask from the beginning so as not to apply the adhesive. Therefore, the sealing substrate 37. 38 vibration space forming recesses 37a, 38a
When the shape of the sealing substrate 37. changes, the screen mask must be replaced each time. 38 and the screen mask also required a long time, resulting in low workability.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a sealing substrate and a method for manufacturing an electronic component that have high adhesive application workability.

In order to solve the problems beyond the means for solving the problems, the sealing substrate according to the present invention has the following features:
In the cavity, an adhesive film having a thickness of approximately 10% or less of the maximum gap dimension required between the substrate with the functional element and the sealing substrate is formed on substantially the entire surface on the cavity formation side. It is characterized by the presence of Further, in the method for manufacturing an electronic component according to the present invention, a film of a release agent is formed on a portion of the surface of the sealing substrate on the cavity formation side that is to become a cavity wall, and a film of adhesive is further formed on the entire surface of the cavity formation side. It is characterized by the formation of The thickness of the adhesive applied to the encapsulation substrate was set to approximately 10% or less of the maximum gap dimension required between the substrate with functional elements and the encapsulation substrate. Even if the adhesive is applied to the cavity-forming recesses and the portions that are to become the cavity walls, the changes in their shape are slight, and the changes in the dimensions of the cavity do not pose a practical problem.

Moreover, even if the adhesive flows to some extent, it will not fill the cavity forming recess. Therefore, no problem occurs even if the adhesive is applied to almost the entire surface of the cavity formation side of the sealing substrate.
A sealing substrate in which an adhesive having a film thickness of about 10% or less of the maximum gap dimension required between the substrate with a functional element and the sealing substrate is coated on almost the entire surface of the cavity forming side has no function. It is bonded to a substrate equipped with an element to form a cavity. On the other hand, since the release agent film is pre-formed on the cavity wall of the cavity forming side of the sealing substrate, the adhesive can be applied to the entire surface of the cavity forming side with any thickness. In this case, the adhesive is not repelled and applied to the part where the mold release agent is formed, and the adhesive is formed only in the part to be bonded to the substrate having the functional element.

Hereinafter, embodiments of the method for manufacturing a sealing substrate and electronic components according to the present invention will be described. [First Example, FIG. 1] FIG. 1 shows a piezoelectric resonant component 1 using two sealing substrates according to the present invention. As the sealing substrate 2.3, an insulating substrate such as a ceramic substrate, a glass substrate, a heat-resistant resin substrate, etc. having high strength, heat resistance, solvent resistance, etc. is used. A vibration space forming recess 2 a is formed on the lower surface of the sealing substrate 2 . A vibration space forming recess 3 a is formed on the upper surface of the sealing substrate 3 .

The piezoelectric substrate 4 has a vibrating electrode formed on its surface (
(not shown). In the actual mass production process, these substrates 2, 3, and 4 have a wide area and are cut into predetermined dimensions after being bonded.

Now, the sealing substrate 2.3 has its vibration space forming recess 2a.
An adhesive 5 is applied to the entire surface of the side where the piezoelectric substrate 4 and the sealing substrate 2.3 are provided at a thickness of about 10% or less of the maximum gap dimension required between the piezoelectric substrate 4 and the sealing substrate 2.3. In the case of this embodiment, the adhesive 5 is applied to the sealing substrates 2 and 3 to a thickness of about 10 μm or less. Since the film thickness of the adhesive 5 is approximately 10% or less of the maximum value of the gap dimension required between the piezoelectric substrate 4 and the sealing substrates 2 and 3, the vibration space forming recess 2
It is sufficiently thin relative to the depth of the recesses 2a and 3a, and even if the adhesive 5 flows to some extent, the recesses 2a. This will not end up filling in 3a.

Methods for applying the adhesive 5 include a spray method, a dipping method, a spinner method, and the like. The substrates 2, 3.4 thus obtained are bonded and fixed together with an adhesive 5, forming a piezoelectric resonant component 1 having a vibration space.

[Second Embodiment, Figures 2 and 3] Figure 2 shows a piezoelectric resonant component 8 using one sealing substrate according to the present invention. A flat insulating substrate is used as the sealing substrate 9, and an adhesive whose film thickness is approximately 10% or less of the maximum gap dimension required between the piezoelectric substrate 11 and the sealing substrate 9 is applied to the entire bottom surface of the substrate. 12 is applied and bonded and fixed to the open end of the insulating container 10 containing the piezoelectric substrate 11, forming a piezoelectric resonant component 8 having a vibration space. FIG. 3 shows a piezoelectric resonant component 15 using two sealing substrates having the same specifications as the sealing substrate 9. Sealing substrate 16. 1
7 is a flat insulating substrate, and a piezoelectric substrate 18 and a sealing substrate 16 .
The adhesive 20.20 is applied in an amount less than about 10% of the maximum value of the required gap size between the adhesive 20.20 and 17. The sealing substrates 16 and 17 are bonded and fixed to the piezoelectric substrate 18 via the spacers 19, 19, thereby forming a piezoelectric resonant component 15 having a vibration space.

[Third Embodiment, Figure 4] Figure 4 shows a piezoelectric resonant component 25 using one sealing substrate on which a mold release agent is formed. As the sealing substrate 26, a flat insulating substrate is used. A mold release agent 29 is applied to a portion of the lower surface of the sealing substrate 26 that is to become a cavity wall. As a method for applying the mold release agent 29, a simple method such as a drip method is adopted. Adhesive 30 is applied on top of this to an arbitrary thickness, but release agent 2
The portion where 9 is formed is repelled and no adhesive is applied, and the adhesive 30 is formed only on the portion to be bonded to the insulating container 27 containing the piezoelectric substrate 28.

[Fourth Embodiment, FIG. 5] FIG. 5 shows an example in which a mold release agent is formed on a sealing substrate 31 having a cavity forming recess 31a. A mold release agent 32 is formed at the bottom of the cavity forming recess 31a, and an adhesive 33 is applied to an arbitrary thickness except for this part.

[Other Examples] Note that the method for manufacturing a sealing substrate and an electronic component according to the present invention is not limited to the above-mentioned examples, and can be variously modified within the scope of the gist.

In the above embodiment, a piezoelectric resonant component was described, but the present invention is not limited thereto, and similar effects can be obtained even when applied to chip-type electronic components having a cavity structure such as IC components and chip transformers. .

The present invention provides adhesion with a film thickness that is approximately 10% or less of the maximum gap dimension required between the substrate with a functional element and the sealing substrate on substantially the entire surface of the cavity formation side of the sealing substrate. Since the adhesive is applied, there is no need for a screen mask, which frees the user from the complicated adhesive application process. Easy application methods such as spraying, dipping, and spinner methods can be used, resulting in highly productive encapsulation substrates. It will be done. In addition, since a release agent film was formed on the part of the sealing substrate that should become the cavity wall on the cavity formation side, even if adhesive was subsequently applied to the entire surface of the cavity formation side to any desired thickness, the cavity would still remain. Adhesive is not applied to the part that should become the wall, and the adhesive film can be formed only in the necessary areas with a simple application process, and the restrictions on the adhesive film thickness are relaxed.

[Brief explanation of the drawing]

FIG. 1 is a vertical sectional view of a piezoelectric resonant component using a sealing substrate according to a first embodiment of the present invention. 2 and 3 are vertical sectional views of a piezoelectric resonant component using a sealing substrate according to a second embodiment of the present invention. FIG. 4 is a vertical sectional view of a piezoelectric resonant component using a sealing substrate according to a third embodiment of the present invention. FIG. 5 is a vertical sectional view of a sealing substrate according to a fourth embodiment of the present invention. FIG. 6 is a vertical cross-sectional view of a piezoelectric resonant component using a conventional sealing substrate. 2, 3... Sealing substrate, 5... Adhesive, 9... Sealing substrate, 12... Adhesive, 16. 17... Sealing substrate, 20... Adhesive, 26... Sealing substrate, 29...
Mold release agent, 30... Adhesive, 31... Sealing substrate, 32
...Mold release agent, 33...Adhesive. Figure Rattan Figure 5 Figure 2 Day 2 Figure 6

Claims (2)

[Claims] 1. In a sealing substrate that is bonded to a substrate provided with a functional element to form a cavity, the cavity has a gap size of about 10% of the maximum gap dimension required between the substrate provided with the functional element and the sealing substrate. 1. A sealing substrate characterized in that an adhesive film having a film thickness of % or less is formed on substantially the entire surface of the cavity forming side. 2. In a method for manufacturing an electronic component in which a substrate provided with a functional element and a sealing substrate are bonded together with a cavity provided therein, a part of the surface of the sealing substrate on the side where the cavity is formed that is to become a cavity wall is separated. An electronic component comprising the steps of: forming a molding agent film; and forming an adhesive film on the entire surface of the cavity forming side of the sealing substrate on which the mold release agent film is formed. Production method.