JPH0236098U - - Google Patents
Info
- Publication number
- JPH0236098U JPH0236098U JP11471688U JP11471688U JPH0236098U JP H0236098 U JPH0236098 U JP H0236098U JP 11471688 U JP11471688 U JP 11471688U JP 11471688 U JP11471688 U JP 11471688U JP H0236098 U JPH0236098 U JP H0236098U
- Authority
- JP
- Japan
- Prior art keywords
- board
- shield
- printed circuit
- circuit board
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
第１図は実施例に係る多重シールド板とこれが
結合されるプリント基板の関係を説明する斜視図
、第２図は多重シールド板をプリント基板のフレ
ームグランドに半田付けした部分の断面図、第３
図は同シグナルグランドに半田付けした部分の断
面図、第４図は爪の形成状態を示す斜視図、第５
図はプリント基板側の爪の差し込み穴と半田付け
用パターンの形成状態の斜視図、第６図は多重シ
ールド板の他の例を示す斜視図である。
１０……多重シールド板、１２……プリント基
板、１４Ａ，１４Ｂ……シールド板、１６Ａ，１
６Ｂ……絶縁層、１８Ａ，１８Ｂ……爪。
FIG. 1 is a perspective view illustrating the relationship between the multiple shield plate and the printed circuit board to which it is coupled according to the embodiment, FIG. 2 is a sectional view of the portion where the multiple shield plate is soldered to the frame ground of the printed circuit board, and FIG.
The figure is a cross-sectional view of the part soldered to the signal ground, Figure 4 is a perspective view showing how the claws are formed, and Figure 5 is a cross-sectional view of the part soldered to the signal ground.
The figure is a perspective view showing the formation of the claw insertion hole and the soldering pattern on the printed circuit board side, and FIG. 6 is a perspective view showing another example of the multiple shield plate. 10...Multiple shield plate, 12...Printed circuit board, 14A, 14B...Shield plate, 16A, 1
6B...Insulating layer, 18A, 18B...Claw.
Claims (1)
各シールド板をプリント基板のシグナルグランド
とフレームグランドとに電気的接続をして前記基
板に装着したことを特徴とする多重シールド板。 Multiple shield plates are joined via an insulating layer,
A multi-shield board, characterized in that each shield board is electrically connected to a signal ground and a frame ground of a printed circuit board, and is mounted on the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11471688U JPH0236098U (en) | 1988-08-31 | 1988-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11471688U JPH0236098U (en) | 1988-08-31 | 1988-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236098U true JPH0236098U (en) | 1990-03-08 |
Family
ID=31355720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11471688U Pending JPH0236098U (en) | 1988-08-31 | 1988-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236098U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003078279A (en) * | 2001-09-04 | 2003-03-14 | Konica Corp | Shielding method of printed board and device mounting printed board using that method |
-
1988
- 1988-08-31 JP JP11471688U patent/JPH0236098U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003078279A (en) * | 2001-09-04 | 2003-03-14 | Konica Corp | Shielding method of printed board and device mounting printed board using that method |