JPH0228339A - Method and apparatus for wire bonding - Google Patents

Method and apparatus for wire bonding

Info

Publication number
JPH0228339A
JPH0228339A JP63179717A JP17971788A JPH0228339A JP H0228339 A JPH0228339 A JP H0228339A JP 63179717 A JP63179717 A JP 63179717A JP 17971788 A JP17971788 A JP 17971788A JP H0228339 A JPH0228339 A JP H0228339A
Authority
JP
Japan
Prior art keywords
bonding
lead frame
chips
wire
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63179717A
Other languages
Japanese (ja)
Inventor
Masahisa Ogura
正久 小倉
Hiroshi Honda
本田　坦
Haruo Yoshida
吉田　治男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP63179717A priority Critical patent/JPH0228339A/en
Publication of JPH0228339A publication Critical patent/JPH0228339A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable simultaneous wire-bonding of two chips on a lead frame by mounting two bonding heads capable of moving individually on one table. CONSTITUTION:A table 1 is moved to the bonding position of the chips and the lead of a lead frame 3, bonding heads 2 are moved, and capillaries 6 are set at the bonding positions. Stages 5 installed at the tip of capillary horns 4 move according to divergence of the bonding positions to correct the position of the capillaries 6. The two bonding heads 2 are mounted on the table 1 for wire bonding of the two chips on the lead frame 3. The stages 5 installed at the tips of each capillary horns 4 move according to the position of the two chips. This enables simultaneous wire bonding of the chips of the lead frame 3 even if the ranges of the divergence of the position of the chips of the lead frame 3 are different from each other.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明に、ワイヤポンディング方法トその装置の改良
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in a wire bonding method and apparatus.

〔従来の技術〕[Conventional technology]

！３図は従来のワイヤポンディング方法トソの装置のボ
ンディングヘッド部を示す上面図であり、図において、
ＩＩＩＨＸ−Ｙテーブル、１２１にＸ−Ｙテーブル（１
）の上面に搭載したボンディングヘッド、（３）ハボン
デイングヘッド（２）でワイヤポンドされるリードフレ
ームである。! FIG. 3 is a top view showing the bonding head part of the conventional wire bonding method.
IIIHX-Y table, 121 has an X-Y table (1
) and (3) a lead frame that is wire-bonded by the bonding head (2).

次に動作について説明する。Ｘ−ＹテーブルＩｌ＋にリ
ードフレーム（３）のチップとリード間のボンディング
位置に、ボンディングヘッド（２）を移動し、ボンディ
ングヘッド＋２１　ｎ　、所定のワイヤボンドを行なう
。Next, the operation will be explained. The bonding head (2) is moved to the bonding position between the chip and the leads of the lead frame (3) on the X-Y table I1+, and a predetermined wire bond is performed using the bonding head +21n.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のワイヤボンディング方法とその装Ｗｔハ以上のよ
うに構成されており、１台の装置でリードフレーム上の
１チツプずつワイヤボンドして行くので、チップのピン
故が多くなるにつむ４、ｌチップ当りの生産時間が長く
なり、大量生産のためには、多くの装ψが必要であり、
装置の設サスペース、設備コストなどの面において、不
経済であったＯ この発明は、上記のような問題を解消するためになされ
たもので、リードフレーム上のチップを２チップ同時に
ワイヤボンドできるワイヤボンディング方法とその装置
ｔを得ることを目的とする。The conventional wire bonding method and its equipment are configured as described above, and one device wire-bonds each chip on the lead frame, so the number of pin failures on the chip increases. The production time per chip is longer and more equipment is required for mass production.
This invention was made to solve the above-mentioned problems, and it is possible to wire-bond two chips on a lead frame at the same time. An object of the present invention is to obtain a wire bonding method and apparatus t.

〔課題を解決するための手段〕[Means to solve the problem]

この発明におけるワイヤボンディング方法に、リードフ
レーム上のチップと、上記リードフレームのリードとを
′ワイヤボンディングするワイヤボンディング方法にお
いて、１個のＸ−Ｙテーブルに搭載された２個のボンデ
ィングヘッドを同時に駆動させると共に、上記チップ相
互間のずれは、キャピラリ軸又は上記ボンディングヘッ
ドに設けたＸ−Ｙステージを用いて補正するようにした
ものであり、また、この発明のワイヤポンディング９１
１Ｈ１Ｕ−ドフレーム上のチップと、上記リードフレー
ムのリードとをワイヤーボンディングするワイヤーボン
ディング装置において、１個のＸ−Ｙテーブルと、この
Ｘ−Ｙテーブル上に２個のボンディングヘッドを搭載し
、各々の上記ボンディングヘッドに取付けたキャピラリ
ホーン軸、又は上記ボンディングヘッドにｘ−Ｙ２軸の
ステージを備えたものである。The wire bonding method according to the present invention involves wire bonding a chip on a lead frame and the leads of the lead frame, in which two bonding heads mounted on one X-Y table are simultaneously driven. In addition, the deviation between the chips is corrected using a capillary axis or an X-Y stage provided on the bonding head.
A wire bonding device that wire-bonds a chip on a 1H1U-board frame and a lead of the lead frame, includes one X-Y table, two bonding heads mounted on this X-Y table, and each A capillary horn shaft is attached to the above-mentioned bonding head, or the above-mentioned bonding head is provided with a stage for two axes of x and y.

〔作用〕[Effect]

この発明におけるワイヤボンディング方法とその装置は
、１個のＸ−Ｙテーブルに２個のボンディングヘッドと
、各々のヘッドのキャピラリホーンにｘ−ｙステージを
取付けたことにより、２個のボンディングヘッドは同時
に動き、しかもワイヤボンディングも行なうキャピラリ
は、単独に動き得る。The wire bonding method and device of the present invention include two bonding heads on one X-Y table and an x-y stage attached to the capillary horn of each head, so that the two bonding heads can be operated simultaneously. Capillaries that move and also perform wire bonding can move independently.

〔発明の実施例〕[Embodiments of the invention]

以下この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第１図ないし＠２図において、（１１はＸ−Ｙテーブル
、（２）はＸ−Ｙテーブルｆｉｌの上に搭載したボンデ
ィング、ラド、（３１Ｈリードフレーム、ｆ４１Ｈボン
ディングヘッド（２）に取付けたキャピラリホーン、（
５）はキャピラリホーン（４）の先端に設けたｘ−ｙス
テージ、１６１１：ｔこの１−３＋ステージ（５１に取
付けたキャピラリである。In Figures 1 and 2, (11 is an X-Y table, (2) is a bonding device mounted on the Horn,(
5) is the x-y stage provided at the tip of the capillary horn (4), and 1611:t is the capillary attached to this 1-3+ stage (51).

次に動作について説明する。リードフレーム（３）のチ
ップとリードのボンディング位置に、Ｘ−Ｙテーブル１
ｌｌｉ移動しボンディングヘッド（２）を動かし、キャ
ビ９１月６）をボンディング点にセットする。Next, the operation will be explained. Place the X-Y table 1 at the bonding position of the chip and leads of the lead frame (3).
Move the bonding head (2) and set the cavity 91 (6) to the bonding point.

次に、ホンディング位置のズレに応じて、キャピラリホ
ーン（４）の先端に取付けｆｔ　ｘ　−ｙステージ（５
）が動き、キャビ９１月６）の位ｆｆｌ補正する。Ｘ−
Ｙテーブル（１）には２個のボンディングヘッド（２）
を搭載しており、リードフレーム（３１の上の２個のチ
ップをワイヤポンディングするが、２個のチップの位置
に応じて、各々のキャピラリホーン（４）先端に取付け
たｘ−ｙステージ（５）が動くため、リードフレーム（
３）のチップが異なった位置ズレであっても同時にワイ
ヤボンデングできる。Next, depending on the deviation of the honding position, attach the ft x - y stage (5) to the tip of the capillary horn (4).
) moves and the cabi 91/6) position ffl is corrected. X-
Two bonding heads (2) on the Y table (1)
The two chips on the lead frame (31) are wire bonded, and depending on the position of the two chips, an x-y stage ( 5) moves, so the lead frame (
3) Wire bonding can be performed at the same time even if the chips are misaligned in different positions.

なお、上記実施例では、キャピラリホーン（４）にＸ−
７ステージ（６）を設けたものを示したが、Ｘ−Ｙテー
ブル（１１上のボンディングヘッド（２）の下面にそれ
ぞれＸ−ｙステージ（６１を設けても良い。In the above embodiment, the capillary horn (4) is
Although seven stages (6) are shown, an X-Y stage (61) may be provided on the lower surface of the bonding head (2) on the X-Y table (11).

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば、１個のＸ−Ｙテーブ
ル上に２個の独立した動きができるボンディングヘッド
を搭載したので、安価で省スペース、高生産性のワイヤ
ホンダ装置が得られる効果がある。As described above, according to the present invention, since two bonding heads capable of independent movement are mounted on one X-Y table, an inexpensive, space-saving, and highly productive wire honda device can be obtained. effective.

【図面の簡単な説明】[Brief explanation of the drawing]

＠１図は、この発明の一実施例によるワイヤボンダ装置
の平面図、第２図に、そのキャピラリホーン先端部を示
す要部拡大平面図、第３図に従来袋＠を示す平面図であ
る。 図において、ｔｌｌはＸ−Ｙテーブル、（２）ニボンデ
イングヘッド、（３）はリードフレーム、１４１Ｈキヤ
ピラリホーン、（５１にＸ−ｙステージ、（６１にキャ
ピラリ。 なお、図中、同一符号は同−又は相当部分を示す。 ′−Ｎｃ＋＞１ｄつ→む × 味 ＝＋Fig. 1 is a plan view of a wire bonder device according to an embodiment of the present invention, Fig. 2 is an enlarged plan view of the main part showing the tip of the capillary horn, and Fig. 3 is a plan view showing a conventional bag. In the figure, tll is an X-Y table, (2) a bonding head, (3) a lead frame, a 141H capillary horn, an X-y stage (51), and a capillary (61). Or the corresponding portion. ′-Nc+＞1dTsu→mu× Taste=+

Claims (2)

【特許請求の範囲】[Claims] （１）リードフレーム上のチップと、上記リードフレー
ムのリードとをワイヤボンディングするワイヤボンディ
ング方法において、１個のＸ−Ｙテーブルに搭載された
２個のボンディングヘッドを同時に駆動させると共に、
上記チップ相互間のずれは、キャピラリ軸又は上記ボン
ディングヘッドに設けたＸ−Ｙステージを用いて補正す
るようにしたことを特徴とするワイヤボンディング方法
。(1) In a wire bonding method of wire bonding a chip on a lead frame and a lead of the lead frame, two bonding heads mounted on one X-Y table are simultaneously driven, and
A wire bonding method characterized in that the deviation between the chips is corrected using a capillary axis or an X-Y stage provided on the bonding head. （２）リードフレーム上のチップと、上記リードフレー
ムのリードとをワイヤーボンディングするワイヤーボン
ディング装置において、１個のＸ−Ｙテーブルと、この
Ｘ−Ｙテーブル上に２個のボンディングヘッドを搭載し
、各々の上記ボンディングヘッドに取付けたキャピラリ
ホーン軸又は上記ボンディングヘッドにＸ−Ｙ２軸のス
テージを備えたことを特徴とするワイヤボンディング装
置。(2) In a wire bonding device for wire bonding a chip on a lead frame and a lead of the lead frame, one X-Y table and two bonding heads are mounted on the X-Y table, A wire bonding apparatus characterized in that a capillary horn shaft attached to each of the bonding heads or a stage of two X-Y axes is provided on the bonding head.
JP63179717A 1988-07-18 1988-07-18 Method and apparatus for wire bonding Pending JPH0228339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63179717A JPH0228339A (en) 1988-07-18 1988-07-18 Method and apparatus for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63179717A JPH0228339A (en) 1988-07-18 1988-07-18 Method and apparatus for wire bonding

Publications (1)

Publication Number Publication Date
JPH0228339A true JPH0228339A (en) 1990-01-30

Family

ID=16070641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63179717A Pending JPH0228339A (en) 1988-07-18 1988-07-18 Method and apparatus for wire bonding

Country Status (1)

Country Link
JP (1) JPH0228339A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7021521B2 (en) * 1998-10-28 2006-04-04 International Business Machines Corporation Bump connection and method and apparatus for forming said connection
US8008183B2 (en) * 2007-10-04 2011-08-30 Texas Instruments Incorporated Dual capillary IC wirebonding
US20120085812A1 (en) * 2010-10-08 2012-04-12 Orthodyne Electronics Corporation Solar substrate ribbon bonding system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7021521B2 (en) * 1998-10-28 2006-04-04 International Business Machines Corporation Bump connection and method and apparatus for forming said connection
US8008183B2 (en) * 2007-10-04 2011-08-30 Texas Instruments Incorporated Dual capillary IC wirebonding
US20120085812A1 (en) * 2010-10-08 2012-04-12 Orthodyne Electronics Corporation Solar substrate ribbon bonding system
US8196798B2 (en) * 2010-10-08 2012-06-12 Kulicke And Soffa Industries, Inc. Solar substrate ribbon bonding system
US8251274B1 (en) 2010-10-08 2012-08-28 Orthodyne Electronics Corporation Solar substrate ribbon bonding system

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