JPH021699A - Image pickup device - Google Patents

Abstract

PURPOSE:To improve precision by providing a cover glass with an anti-static means for an external exposed surface. CONSTITUTION:An image pickup element 4 is formed inside the an image pickup element package 5. The cover glass 6 is fitted on a surface in order to protect the element 4. The glass 6 is constituted by vapor deposition a transparent and electrical conductive thin film 6b (antistatic means) containing SnO2 or In2O3, etc., on the surface of optical glass 6a. Since the film 6b is connected to a case body, the device is constituted so that the potential of a glass surface and the potential of the case body come equal to each other. The static electricity of the surface of the glass 6 can be removed by the film 6b. Thus, since dust, etc., does not stick on the glass surface, the precision can be improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an imaging device that includes an imaging device having a photoelectric conversion function and a cover glass that protects the surface of the imaging device, and is particularly applicable to image recognition and image sensing. The present invention relates to an imaging device that is used by being incorporated into a device that requires a needle ALJ or the like.

[Conventional technology]

Two-dimensional solid-state image sensors have little graphic distortion, low voltage,
It has low power consumption, is small and lightweight, has high reliability, is resistant to vibration and shock, and is not easily affected by magnetic fields, so it is being considered for a wide range of applications.

FIG. 4 shows a conventional imaging device.

The CCD element 1 is formed within a CCD cell package 2. In order to protect the CCD element 1, an optical glass 3 is attached to the surface of the CCD element 1. In this way, by covering the CCD element 1, which is an imaging element, with the optical glass 3, it is possible to prevent dust, flakes, etc. from entering from the outside from adhering to the CCD element 1. This is because if foreign matter adheres to the image sensor, the image becomes unclear and may cause malfunction.

[Problem to be solved by the invention]

However, since the optical glass 3 is a ferroelectric material, it generates static electricity and attracts dirt and dust, which adheres to the surface, resulting in a disadvantage that the image becomes unclear and the accuracy deteriorates.

Particularly when this imaging device is incorporated into other equipment, it is difficult to remove dust and the like adhering to the optical glass 3. In this case, since there is not enough space for work, there is a risk that the work (cleaning) may damage the glass surface.

Therefore, an object of the present invention is to improve the accuracy of an imaging device by preventing foreign matter such as dirt and dust from adhering to it.

[Means to solve the problem]

In order to achieve the above object, the present invention provides an imaging device that includes an imaging device having a photoelectric conversion function and a cover glass that protects the surface of the imaging device, in which the cover glass has antistatic means for protecting the externally exposed surface. It is characterized by having the following.

[Effect]

Since the present invention is configured as described above, the action of the cover glass provided with the antistatic means can prevent foreign matter such as dirt and dust from adhering to the glass surface.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS An imaging device according to an embodiment of the present invention will be described below with reference to the accompanying drawings. In the description, the same elements are denoted by the same reference numerals, and redundant description will be omitted.

FIG. 1 shows an imaging device according to an embodiment of the present invention. This embodiment basically includes an image sensor 4, an image sensor package 5, and a cover glass 6. The image sensor 4 is formed within an image sensor package 5. In order to protect the image sensor 4, a cover glass 6 is attached to the surface of the image sensor 4. The image sensor 4 may be any device as long as it has at least a photoelectric conversion function. The cover glass 6 is the surface (exposed surface) of the optical glass 6a.1. : S n O2 or I
A transparent conductive thin film 6b (antistatic means) containing n2O3 or the like is deposited. Since this thin film 6b is connected to a casing (not shown), it is configured so that the potential of the glass surface and the potential of the casing are equal. This thin film 6b
Accordingly, static electricity generated on the surface of the cover glass 6 can be removed.

FIG. 2 shows another embodiment of the invention. The difference from the embodiment shown in FIG. 1 is that a transparent conductive thin film 6b is not formed on the surface of the optical glass 7a (6a), but a conductive film 7b is attached to the surface facing the image sensor 4. This will be explained below based on FIG. This conductive film 7b
This corresponds to antistatic means. This conductive film 7b is arranged around the image sensor 4. Therefore, a hole a larger than at least the image sensor 4 is formed in the center so that light can enter the light receiving section of the image sensor 4 without any problem. In this case, since the conductive film 7b does not have to be transparent, the selection range of materials is widened, and more suitable materials, such as those with high strength and low cost, can be used.

In this embodiment, the conductive film 7b is connected to the casing (not shown) by the platinum wire 8, so that the potential of the glass surface is equal to the potential of the casing.

Therefore, accumulation of static charges generated on the glass surface can be suppressed.

Note that the image sensor to which the present invention is applied is not limited to the CCD element used in the prior art, but may be any solid-state image sensor. For example, MOS type image sensor, charge transfer diode array type image sensor, CID type image sensor,
There is an R3G type image sensor, a stacked type image sensor, and the like. What is important is to prevent static electricity from occurring on the optical glass.

FIG. 3 shows an example of application of this invention.

This device includes a CCD camera head section 9 using the present invention.
This is a combination of an optical microscope comprising an objective lens 10 and a mirror 11.11. CCD
The camera head section 9 is installed with the light-receiving surface of the image sensor 4 facing downward in order to prevent dust, debris, etc. from falling and accumulating. The optical microscope is housed in a case in which mirrors 11, 11 are arranged in order to keep the length of the objective lens 10 and the lens barrel necessary to increase the magnification of the lens small.

When the conventional imaging device is compactly stored as shown in 2, when static electricity is generated on the cover glass, dirt and dust floating in the case are attracted to the glass surface, adversely affecting the image. In this case, since the imaging device according to the present invention is used, the generation of static electricity is suppressed as much as possible, and dust and the like do not adhere to the glass surface.

〔Effect of the invention〕

Since this invention is configured as explained above,
The accuracy of the imaging device can be improved.

Particularly when used in equipment that cannot be prevented from generating dust, or equipment whose glass surfaces are difficult to clean, dust can be prevented from adhering to the screen, preventing image misidentification and image measurement. etc. can be prevented from decreasing in accuracy. Therefore, the reliability of the imaging device is improved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an imaging device according to one embodiment of the present invention, FIG. 2 is a perspective view of an imaging device according to another embodiment, and FIG. 3 is a perspective view of an imaging device according to another embodiment of the invention. FIG. 4, which is a diagram showing an example of application, is a perspective view showing a conventional imaging device. 1...COD element 2...CCD cell package 3...Optical glass 4...Image sensor 5...Image sensor package 6.7...Cover glass 8...Platinum wire 9... CCD camera head section 10...Objective lens 11...Mirror imaging device Fig. 1 Other embodiments Fig. 2 Application examples Fig. 3 Prior art

Claims (1)

[Claims] 1. An imaging device including an imaging device having a photoelectric conversion function and a cover glass that protects the surface of the imaging device, wherein the cover glass has antistatic means for an externally exposed surface. An imaging device comprising: 2. The imaging device according to claim 1, wherein the antistatic means is a transparent conductive film. 3. The imaging device according to claim 1, wherein the antistatic means is a conductor placed around the imaging element and attached so as to be in contact with the cover glass.