JPH01289667A - Manufacture of electrodeposition type grinding element - Google Patents

Abstract

PURPOSE:To prevent exfoliation of a plating film, which fastens abrasive grains to a base metal, and slipping-off of the abrasive grains when a grinder element is stretched up, by allowing a compression stress to remain in the plating film. CONSTITUTION:A plating bath is prepared by adding either or both of phosphorous acid and hypophosphorous acid to a sulfamin acid bath containing chlorides, and a plating film 12 with residual stress is educted on the surface of a base metal 10 while the pH of this plating bath is maintained within the extent 0.8-1.2 by one or more pH adjusting agents selected from a group consisting of sulfamin acid, chloric acid, and sulfuric acid. Thus exfoliation of the plating film 12 and slipping-off of abrasive grains can be prevented when the grinder element is stretched up, by allowing compression stress to remain in the plating film 12.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing an electrodeposited grindstone.

[Prior art] A conventional method for manufacturing an electrodeposited grindstone is disclosed in, for example, Japanese Patent Application Laid-Open No. 58-45.
Diamond and cubic nitridation are applied to the base metal by electronickel plating using a chloride-containing sulfamic acid bath as shown in Japanese Patent Application No. 871, or using a Watts bath as shown in Japanese Patent Application Laid-Open No. 58-66668. This is made by electrodepositing abrasive grains such as boron.

[Problems to be solved by the invention] In the case of cutting blades (grinding wheels) used in slicing machines such as internal blade type and multi-blade type that cut hard and brittle materials such as silicon, crystal, and ferrite into thin pieces, The thickness of the cutting blade should be made as thin as possible to reduce the cutting allowance. For this reason, the cutting resistance per unit area of the cutting blade increases, but in order to withstand this, a preliminary tensile stress is applied to the cutting blade in the direction perpendicular to the cutting direction (so-called tensioning). Gives plastic deformation in the tensile direction.

However, tensile stress remains in the plating film obtained by the conventional method as described above from the beginning.

Nickel plating from a chloride bath has particularly high tensile stress.
For this reason, in addition to the residual tensile stress caused by the plating, tensile stress due to tensioning of the cutting blade is applied to the plating film, resulting in a tensile stress that is larger than necessary and causing the plating film to peel off from the base metal. or the abrasive grains may easily fall off from the plating film. Furthermore, since tensile stress is applied during cutting, the plating film may undergo fatigue failure at an early stage, stress may be concentrated there, and the base metal may also break.

Therefore, the present invention aims to solve these problems.

[Means for Solving the Problems] That is, the present invention provides a method for manufacturing an electrodeposition type grindstone in which abrasive grains are electrodeposited on a base metal, in which phosphorous acid and hypophosphorous acid are added to a C1 chloride-containing sulfamic acid bath. The pH of the plating bath is adjusted to 0.8 to 1 using 1fI or two or more pH adjusters selected from the group consisting of sulfamic acid, hydrochloric acid, and sulfuric acid. ．．
The present invention relates to a method for producing an electrodeposited grindstone characterized by depositing a plating film in which compressive stress remains on the surface of the base metal while maintaining the stress within the range of 2.

[Function] The present invention can impart compressive stress to a plating film obtained by electrodeposition in a plating bath containing abrasive grains under plating bath conditions that leave compressive stress in the plating film. .

The method of the present invention will be explained in detail below.

The plating bath used in the present invention is mainly a chloride-containing sulfamate plating bath.

The chloride-containing sulfamate plating bath consists of nickel sulfamate, nickel chloride, and boric acid.

Additive formulation 1 of nickel sulfamate is 300 to 650
y/1, preferably within the range of 35ON450g#. If the amount added is less than 300 g/1, the current efficiency will be low and productivity will deteriorate, which is undesirable.Furthermore, compressive stress cannot remain in the resulting plating film.
Moreover, if the amount added exceeds 650 g/l, pores will be generated in the plating film, making it impossible to obtain a high-quality plating film, and furthermore, the plating bath will become expensive, which is not preferable.

The amount of nickel chloride added is in the range of 5 to 15 g/l, preferably 8 to 12 g/l. The added amount is 59
/l If there is no groove, the dissolution of the anode will be poor, the bath voltage will increase, and the anode will eventually become passivated, which is undesirable. Also, if the amount added exceeds 159/i', it will be difficult to dissolve the anode. This is not preferable because a large tensile stress remains in the film.

The amount of boric acid added is 30-50y/j! , preferably within the range of 35 to 45 tt/1. The added amount is 3
If it is less than 0g, #, it is not preferable because it will not be possible to prevent a sudden pH change in the plating bath, and if the amount added exceeds 50y/1, a plated film with a uniform color tone will not be obtained. , which is undesirable because it causes burnt spots and poor adhesion.

The plating bath used in the present invention is prepared by adding either or both of phosphorous acid and hypophosphorous acid to a chloride-containing sulfamic acid bath having the composition described above. The amount of phosphorous acid and/or hypophosphorous acid added is in the range of 5 to 5 oy/l, preferably 8 to 30 g/l. If the amount added is less than 5 g/1, it is not preferable because it becomes difficult to control the residual stress generated in the plating film due to pH changes.
However, if the added amount exceeds 50 fI/N, the current efficiency decreases, productivity deteriorates, and the quality of the plating film also deteriorates, which is not preferable.

A pHFJu agent is added to the plating bath having the above composition to adjust the pH of the plating bath to within the range of 0.8 to 1.2.

Usable pH adjusters include sulfamic acid, hydrochloric acid,
Examples include sulfuric acid. In addition, two or more types of these pH adjusters can also be used in combination.

However, the method of attaching the abrasive grains to the base metal is not particularly limited, and examples include a suspension method in which the abrasive grains are suspended in a plating bath,
A sedimentation method in which stirring of the bath is stopped at the start of plating and the abrasive grains are allowed to settle using the base metal as a receiving plate, a tacking method in which the abrasive grains are attached to the base metal in advance, etc. can be used.

The plating bath temperature when carrying out the method of the present invention is 40 to 60°C1
Preferably it is within the range of 45 to 55°C.

If the temperature is less than 40°C, the current efficiency will decrease and productivity will deteriorate, which is undesirable.
If the temperature exceeds .degree. C., the plating bath becomes unstable, easily decomposed, and operability deteriorates, which is not preferable.

In addition, the current density is within the range of 3 to 30 A/dwa'', preferably 5 to 15 A/dm2.
If the current density is less than 30 A/dm2, the current efficiency will be low and the productivity will be poor, so it is not preferable.
If it exceeds 'dm', pores will occur in the plating film, making it impossible to obtain a good quality plating film, which is not preferable.

By performing electrodeposition under the above plating bath composition and plating conditions, compressive stress remains in the plating film that fixes the abrasive grains to the base metal. Since compressive stress remains in the plating film, the tensile stress caused by tensioning is reduced. This can prevent the abrasive grains from falling off, the plating film from peeling off, and fatigue failure from occurring.

[Examples] The present invention will be further explained by giving examples (hereinafter simply referred to as "examples" unless otherwise specified) below.

Figure 1 shows a partial cross-sectional view of an electrodeposited grindstone (0 base metal (10))
A plating film (12) is provided on the plating film III (12), and abrasive grains (14) such as diamond are held by this plating film III (12). Electroplating for this purpose is performed, for example, under the following conditions.

Tatsu-1 A base metal (material 5K5) with a thickness of 0.21m, a width of 61m, and a length of 420III111 was subjected to pretreatment processes such as degreasing and pickling, and then electroplated in a plating bath with the following composition. Ta.

``Kuiko'''' previous ■ trial 2 Nickel sulfamate 450g/l Nigel chloride 10y/j! Boric acid
40y/1 phosphorous acid
10g/l'sulfamic acid
30g/ll moxibustion tip bath temperature 50℃ pH 1.1 Current band 10A/d 2-wheel plating thickness 40μm Note that 40~
Diamond abrasive grains with a size of 60 μm were temporarily attached to the base metal, the excess was removed, and then the diamond abrasive grains were finally fixed.

The residual compressive stress of the resulting plating film was O, 8ky/a.
It was m2. The grindstone obtained in this way was attached to a tensile testing machine, and tensile force was applied to plastically deform the base metal.
I tensioned it up to kFI. As a result, peeling of the plating film and falling off of the abrasive grains did not occur. Further, this grindstone was attached to a multi-blade type slicing machine, and single crystal silicon was cut at a cutting speed of 2.5 mm/hour. Even after cutting, peeling of the plating film and falling off of the abrasive grains did not occur.

Using the same base metal as that described in Sen-J Example 1, plating was carried out under the following plating bath composition and electrolytic conditions.

Ginko Shikan JLt Nickel sulfamate 4.50g/l Nickel chloride 10g/l Boric acid
40g/l phosphorous acid
10g/l sulfamic acid
60y/Ili1 Bath temperature: 50°C pHO, 8 Current band: 10A/d 2 Plating thickness: 40 μm The residual compressive stress of the electroplated coating on the electrodeposited grinding wheel thus obtained was 12 k
g/am2. Regarding this electrodeposited whetstone, 20
Although tensioning was carried out to 0 kt, no peeling of the plating film or falling off of the abrasive grains occurred. Furthermore, when actual cutting was performed under the same conditions as in Example 1, no peeling or falling off of the plating film occurred.

For comparison with Examples 1 and 2 (Example) described above, plating was performed using the same material as the base metal and the following plating bath composition and electrolytic conditions.

Heunido IJL Nickel sulfamate 450g/l Nickel chloride 10i/1 boric acid
40g/l phosphorous acid
10y/1 electric Jli hill - Bath temperature 50℃pH 1.4 Current density 10A/d@" Plating thickness 40μ Ugly The plating film of the electrodeposited grinding wheel obtained in this way has not compressive stress, but
On the contrary, a tensile stress of 30 kg/sn" remained. When this electrodeposited grindstone was attached to a tensile testing machine and tensioned, the abrasive grains began to fall off at a tensioning cuff of 0 kg, and the plating film failed at a tensioning force of 120 kg. started peeling off.

Plating was carried out using the same base metal as in Comparative Example 1 with the following plating bath composition and electrolytic conditions.

ΔIL direct sulfamate nickel 450f/i' nickel chloride 10y/l boric acid
40g/l phosphorous acid
10y/l nickel carbonate
30 g/l (1 East 1 Bath temperature 50℃ pH 1.6 Current density 10 A/dm2 Plating thickness 40 μ - The residual tensile stress of the electroplated grinding wheel thus obtained is 40 k
g/ +em". When this electrodeposited grindstone was attached to a tensile testing machine and tensioned, the tensioning force was 60k.
The abrasive grains began to fall off at a pressure of 110 kg, and the plating film began to peel off at a tensioning force of 110 kg.

[Effects of the Invention] As explained above, according to the present invention, compressive stress is left in the plating film that fixes the abrasive grains to the base metal, which prevents peeling of the plating film when tensioning the whetstone and preventing the grinding wheel from peeling off. It is possible to prevent the grindstone from falling off, and also to prevent the grindstone from breaking due to fatigue during cutting. Furthermore, since the tensioning force can be increased, the cutting speed can be increased and productivity can be improved.

[Brief explanation of the drawing]

Figure 1 is a partial cross-sectional view of an electrodeposited grindstone.
... Base metal, 12... Plating film, 14... Abrasive grain. Patent applicant: Japan Steel Works, Ltd.

Claims (1)

[Claims] In a method for manufacturing an electrodeposited grindstone in which abrasive grains are electrodeposited on a base metal, a plating bath in which one or both of phosphorous acid and hypophosphorous acid is added to a chloride-containing sulfamic acid bath is used. , the pH of the plating bath is adjusted to sulfamic acid,
Precipitating a plating film with residual compressive stress on the surface of the base metal while maintaining the pH within the range of 0.8 to 1.2 using one or more pH adjusters selected from the group consisting of hydrochloric acid and sulfuric acid. A method for manufacturing an electrodeposited grindstone characterized by the following.