JPH01220494A - Multilayer interconnection substrate - Google Patents
Multilayer interconnection substrateInfo
- Publication number
- JPH01220494A JPH01220494A JP4625988A JP4625988A JPH01220494A JP H01220494 A JPH01220494 A JP H01220494A JP 4625988 A JP4625988 A JP 4625988A JP 4625988 A JP4625988 A JP 4625988A JP H01220494 A JPH01220494 A JP H01220494A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- gold
- aperture
- copper foil
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title description 8
- 239000011888 foil Substances 0.000 claims abstract description 3
- 229910000765 intermetallic Inorganic materials 0.000 claims description 4
- 239000004020 conductor Substances 0.000 abstract description 24
- 239000000463 material Substances 0.000 abstract description 20
- 238000000034 method Methods 0.000 abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 12
- 239000011889 copper foil Substances 0.000 abstract description 12
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 10
- 239000010931 gold Substances 0.000 abstract description 8
- 229910052737 gold Inorganic materials 0.000 abstract description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 7
- 239000010409 thin film Substances 0.000 abstract description 6
- 239000004642 Polyimide Substances 0.000 abstract description 5
- 229920001721 polyimide Polymers 0.000 abstract description 5
- 239000000919 ceramic Substances 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010408 film Substances 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- QUCZBHXJAUTYHE-UHFFFAOYSA-N gold Chemical compound [Au].[Au] QUCZBHXJAUTYHE-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- -1 gold-aluminum Chemical compound 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電気機器等に使用される多層配線基板に関する
ものであり、さらに詳細に述べるとフレキシブル配線基
板とリジッド配線基板とよりなる多層配線基板において
、両配線基板上に形成された導体層を電気的に接続する
構造に特徴を有するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a multilayer wiring board used in electrical equipment, etc. More specifically, in a multilayer wiring board consisting of a flexible wiring board and a rigid wiring board, It is characterized by a structure in which conductor layers formed on both wiring boards are electrically connected.
従来の技術
近年、高密度実装の要求が増大した結果、配線基板間を
フレキシブル配線基板で接続する方法が増加している。2. Description of the Related Art In recent years, as a result of increasing demands for high-density packaging, methods of connecting wiring boards using flexible wiring boards have been increasing.
また、フレキシブル配線基板を基板間の接続だけでなく
、多層配線基板および部品実装基板としても利用する要
求が強くなっている。Furthermore, there is an increasing demand for flexible wiring boards to be used not only for connections between boards, but also as multilayer wiring boards and component mounting boards.
特に多層配線基板としての使用は、リジッドな別の基板
、例えば、ガラスエポキシ配線基板、セラミック・ハイ
ブリッドＩＣ基板等の上に、フレキシブル配線基板を接
着し、そのフレキシブル配線基板の導体とリジッド配線
基板の導体を電気的に接続する必要がある。従来のリジ
ッド配線基板上に接着されたフレキシブル配線基板上の
導体と前記リジッド配線基板上の導体とを電気的に接合
する方法は、第６図に断面構造を示した如く、リジッド
基材１上に形成された所定のパターンの導体層２を有す
る配線基板と、フレキシブルな基材３の上に所定の導電
層パターン４が接着剤已により接合された配線板とを接
着剤８で接着し、フレキシブル配線板にあけられた孔を
通して前記両溝体層パターン２と６を半田７により接続
する事により達成されている。なお８はフレキシブル配
線板の表面に予じめ形成されたオーバーコート層であり
、前記孔の周辺部は除去され、導電層パターン４が露出
したランド部を形成している。In particular, when used as a multilayer wiring board, a flexible wiring board is bonded onto another rigid board, such as a glass epoxy wiring board or a ceramic hybrid IC board, and the conductors of the flexible wiring board and the rigid wiring board are bonded together. It is necessary to electrically connect conductors. A conventional method for electrically bonding a conductor on a flexible wiring board bonded to a rigid wiring board and a conductor on the rigid wiring board is based on a method of electrically bonding a conductor on a rigid base material 1 as shown in the cross-sectional structure in FIG. A wiring board having a conductive layer 2 of a predetermined pattern formed on the substrate and a wiring board having a predetermined conductive layer pattern 4 bonded to a flexible base material 3 by an adhesive strip are bonded together with an adhesive 8. This is achieved by connecting both groove layer patterns 2 and 6 with solder 7 through holes made in the flexible wiring board. Note that 8 is an overcoat layer formed in advance on the surface of the flexible wiring board, and the peripheral portion of the hole is removed to form a land portion where the conductive layer pattern 4 is exposed.
発明が解決しようとする課題
上述の半田づけによる方法は、具体的には、フレキシブ
ル基板に１ 、 Ｏｍｍφ以上の孔をあけ、その孔を通
して手ノ・ンダ方式によシ半田づけ接合していた。この
孔径が、１．０ｍｍφ以下になると半田による接合が出
来にくくなシ、信頼性が急激に低下し、かつ、作業性も
悪くなり、不可能に近かった。また、フレキシブル基板
上には半田づけのための導体ランドが必要で、その直径
は１．５ｍｍφ以上は是非必要であった。高密度配線の
要求が強い昨今、接続のために１．５ｍｍφ以上の面積
を必要とする事は致命的欠点であシ、また、半田づけ方
法で接続する場合、表面より見ただけでは真に内部で接
合しているか否かの確認が出来ないという欠点を有して
いる。Problems to be Solved by the Invention Specifically, in the soldering method described above, a hole with a diameter of 1.0 mm or more is made in a flexible substrate, and soldering is performed through the hole by hand soldering. When the hole diameter is less than 1.0 mmφ, it becomes difficult to join by soldering, the reliability rapidly decreases, and the workability deteriorates, making it almost impossible. Further, a conductive land for soldering is required on the flexible substrate, and its diameter must be 1.5 mm or more. Nowadays, there is a strong demand for high-density wiring, and requiring an area of 1.5 mm or more for connection is a fatal drawback. This has the disadvantage that it is not possible to confirm whether or not they are joined internally.
そのためフレキシブル基板の基板内で上下導体を半田づ
けする方法は特別な場合以外性なわれておらず、通常は
フレキシブル基板の端部まで配線を引き廻し端面にて半
田づけする方法が一般的である。この一般的方法は、配
線密度、部品の実装密度を極端に悪くするという大きな
欠点を有している。Therefore, the method of soldering the upper and lower conductors within the board of a flexible board is not used except in special cases, and the common method is to route the wiring to the edge of the flexible board and solder it at the end surface. . This general method has the major drawback of extremely poor wiring density and component mounting density.
本発明は前記記載の欠点を解決する上下導体の接合構造
を提供することを目的とする。An object of the present invention is to provide a joining structure for upper and lower conductors that solves the above-mentioned drawbacks.
課題を解決するための手段
本発明の多層配線基板はフレキシブル配線基板上の所定
の位置にあけられた透孔上に形成した導体箔と下部リジ
ッド配線基板上の導体とを、例えば超音波あるいは熱、
または超音波と熱を同時に作用せしめ両溝体界面間で金
属結合あるいは金属間化合物を形成せしめて接合したも
のである。Means for Solving the Problems The multilayer wiring board of the present invention connects a conductive foil formed on a through hole formed at a predetermined position on a flexible wiring board and a conductor on a lower rigid wiring board by, for example, ultrasonic waves or heat. ,
Alternatively, ultrasonic waves and heat may be applied simultaneously to form a metallic bond or an intermetallic compound between the interfaces of both grooves, thereby bonding them.
作 用
上記構造によ多接合する場合、接合したい導体表面積は
０．１〜０．３ ｍｍφあれば充分であシ、結合面積が
微少なので高密度な配線基板が作成出来、その接合強度
は５ｏｐ以上の引張シ強度を示す。Function When multiple junctions are made in the above structure, it is sufficient that the surface area of the conductors to be joined is 0.1 to 0.3 mmφ, and since the bonding area is small, a high-density wiring board can be created, and the bonding strength is 5op. It shows a tensile strength of
また、その信頼性については、半導体ＩＣチップを結線
しているワイヤ・ボンディング技術で実証済である。更
に、超音波、熱溶着を行なう場合に使用するボンディン
グ治具は、接合ケ所全てを１つの治具で作成出来るため
一部ボンデイングが出来大巾な作業性の向上になる。Furthermore, its reliability has been proven using the wire bonding technology used to connect semiconductor IC chips. Furthermore, since the bonding jig used for ultrasonic and thermal welding can make all the joints with one jig, it is possible to perform partial bonding, which greatly improves workability.
実施例
以下本発明の実施例について図面を参照しながら説明す
る。第１図および第２図は本発明の第１の実施例の斜視
図および断面図である。図において、９６％アルミナ・
セラミック基材１ｏの表面にＡｑ／Ｐｄ導体層１１が厚
膜印刷・焼成法で所定のパターンに形成され、その表面
に金薄膜１２がメツキされた剛性の配線基板上に、所定
の位置に開孔１了をもうけたポリイミド基材１３上に所
定のパターンの銅箔１４を接着剤１６で接着したフレキ
シブル配線基板が接着剤１９によ多接合されている。前
記ポリイミド基材１３の開孔部１７には前記銅箔１４の
一部が橋絡するよう配置されておシ、その裏面には、ニ
ッケル下地−金メツキ薄膜１８が形成されている。次に
ポリイミド基材１３の開孔１７を橋絡している銅箔１４
上に先端径が開孔径より細いボンディング・ツールを押
しあて加圧して、上下導体面を密着させる。この時下部
リジッド基材は１６０〜１８０’Ｃに加熱しておき、こ
の状態でボンディング・ツールに超音波を印加し、熱溶
着して上下導体界面に金−金量金属結合を形成し接合す
る。EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings. 1 and 2 are a perspective view and a sectional view of a first embodiment of the present invention. In the figure, 96% alumina
An Aq/Pd conductor layer 11 is formed in a predetermined pattern on the surface of the ceramic base material 1o by a thick film printing/sintering method, and is opened at a predetermined position on a rigid wiring board whose surface is plated with a gold thin film 12. A flexible wiring board is formed by adhering copper foil 14 in a predetermined pattern onto a polyimide base material 13 with holes 1 formed therein using an adhesive 16, and is bonded to the polyimide base material 13 using an adhesive 19. A portion of the copper foil 14 is placed so as to bridge the opening 17 of the polyimide base material 13, and a nickel base-gold plating thin film 18 is formed on the back surface thereof. Next, the copper foil 14 bridging the openings 17 of the polyimide base material 13
A bonding tool whose tip diameter is smaller than the diameter of the opening is pressed onto the top and pressure is applied to bring the upper and lower conductor surfaces into close contact. At this time, the lower rigid base material is heated to 160 to 180'C, and in this state, ultrasonic waves are applied to the bonding tool to thermally weld and form a gold-gold metal bond at the interface of the upper and lower conductors. .
第３図および第４図に本発明の別の実施例を示した。リ
ジッド配線基板とフレキシブル配線基板の構成は前述の
実施例とほぼ同じであり、同一構成部品には同一符号を
付して示している。本実施例ではフレキシブル配線基板
側の銅箔１４の形状が異っておシ、前述の実施例では両
端がそれぞれ回路パターンにつながった銅箔の途中で上
下導体間を接続する構成について示したが、ここでは−
端のみが回路パターンにつながった銅箔１４の先端部（
フィンガー状部）で下の基板上の導体１２と接続する構
造である。Another embodiment of the present invention is shown in FIGS. 3 and 4. The configurations of the rigid wiring board and the flexible wiring board are almost the same as those of the previous embodiment, and the same components are designated by the same reference numerals. In this embodiment, the shape of the copper foil 14 on the flexible wiring board side is different, and in the previous embodiment, the upper and lower conductors are connected in the middle of the copper foil whose both ends are connected to the circuit pattern. , here −
The tip of the copper foil 14 where only the edge is connected to the circuit pattern (
It has a structure in which it is connected to the conductor 12 on the lower substrate by the finger-shaped portion).
本実施例の構成では、接合面が外部より見えるという特
徴、および、フレキシブル配線基板上の銅箔を接合時に
変形させねばならないが、その変形が自由であシ、応力
の発生が少ないという別の特徴も有する。The configuration of this embodiment has the advantage that the bonding surface is visible from the outside, and that the copper foil on the flexible wiring board must be deformed during bonding, but the deformation is free and there is less stress generation. It also has characteristics.
前述の両実施例では接合部を金−金の金属結合方法につ
いて記述したが、接合部金属が全以外のものも使用出来
る。すなわち、フレキシブル基板側の導体表面にスズメ
ツキを施し、リジッド基板画の導体表面に金メツキを施
しだものであれば、スズー金間の金属間化合物を形成し
接合することが出来る。同様な事は、銅−銅、金−アル
ミニウム、銅−金、ニッケルー金、ニッケルーアルミニ
ウム（逆も出来る）の組み合せも接合出来ることは勿論
のことである。また、接合すべき各々の導体表面に半田
メツキを施し、半田−半田あるいはスズ−半田、半田−
Ａｇ／Ｐｄ、半田−銅の組み合せも本発明の構造、方法
で全く同様に接合できるまた、金−金の金属結合による
接合以外の接合法においては、接合前の表面層の酸化物
を除去する目的で、水素ガスを１〜１０％含有したチッ
素ガス雰囲気中で、熱および超音波を作用させる接合法
を用いる事により完全なる接合が出来る。In both of the above-mentioned embodiments, the bonding portion was described using a gold-gold metal bonding method, but it is also possible to use a method in which the bonding portion is made of other than all metals. That is, if the conductor surface on the flexible substrate side is tin-plated and the conductor surface on the rigid substrate side is gold-plated, an intermetallic compound between tin and gold can be formed and bonded. It goes without saying that similar combinations of copper-copper, gold-aluminum, copper-gold, nickel-gold, and nickel-aluminum (the reverse is also possible) can also be bonded. Also, apply solder plating to the surface of each conductor to be joined, solder-solder, tin-solder, solder-
Ag/Pd and solder-copper combinations can be bonded in exactly the same way using the structure and method of the present invention. In addition, in bonding methods other than gold-gold metal bonding, oxides on the surface layer are removed before bonding. For this purpose, complete bonding can be achieved by using a bonding method in which heat and ultrasonic waves are applied in a nitrogen gas atmosphere containing 1 to 10% hydrogen gas.
発明の効果
以上のように本発明によれば、金属−金属間の金属結合
あるいは金属間化合物形成による接合法を用いているた
め、短時間に多数のポイントが一括で接合でき、接合面
積も微少なもののため高密度配線が可能となり、高信頼
性の多層配線基板が得られるものである。Effects of the Invention As described above, according to the present invention, since a joining method based on metal-to-metal metal bonding or intermetallic compound formation is used, a large number of points can be joined at once in a short time, and the joining area is small. Because of this, high-density wiring is possible and a highly reliable multilayer wiring board can be obtained.
第１図は本発明の多層配線基板の１実施例を示す斜視図
、第２図は同側断面図、第３図は第２の実施例を示す斜
視図、第４図は同側断面図、第６図は従来の多層配線基
板の断面図である。
１０・・・・・リジッド基材、１１・・・・・リジッド
基板上の配線導体、１２・・・・・・金属薄膜、１３・
・・・・・フレキシブル基材、１４・・・・・・フレキ
シブル基材上の配線導体、１６・・・・・・フレキシブ
ル基材・配線導体の接着剤、１９・・・・・フレキシブ
ル基材・リジッド基材の接着剤。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名１０
−４材
第２図Fig. 1 is a perspective view showing one embodiment of the multilayer wiring board of the present invention, Fig. 2 is a sectional view on the same side, Fig. 3 is a perspective view showing the second embodiment, and Fig. 4 is a sectional view on the same side. , FIG. 6 is a sectional view of a conventional multilayer wiring board. 10... Rigid base material, 11... Wiring conductor on rigid substrate, 12... Metal thin film, 13...
...Flexible base material, 14... Wiring conductor on flexible base material, 16... Adhesive for flexible base material/wiring conductor, 19... Flexible base material・Adhesive for rigid base materials. Name of agent: Patent attorney Toshio Nakao and 1 other person10
-4 material Figure 2
Claims (1)
所定の位置に透孔が形成されたフレキシブル配線基板の
裏面を、表面に所定の第２の導電層パターンが形成され
た剛性の配線基板に接合するとともに、少なくとも一端
が前記第１の導電層パターンに電気的に接続されて前記
透孔に突出して位置するように配置された導電箔を前記
第２の導電層パターンとの間で前記透孔を通して金属結
合あるいは金属間化合物を形成して電気的に接続した多
層配線基板。A predetermined first conductive layer pattern is formed on the surface, and
The back side of the flexible wiring board with through holes formed at predetermined positions is bonded to a rigid wiring board having a predetermined second conductive layer pattern formed on the front surface, and at least one end is connected to the first conductive layer pattern. A conductive foil arranged to protrude into the through hole and electrically connected to the second conductive layer pattern forms a metallic bond or an intermetallic compound through the through hole to form an electrical connection. Multilayer wiring board connected to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4625988A JPH01220494A (en) | 1988-02-29 | 1988-02-29 | Multilayer interconnection substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4625988A JPH01220494A (en) | 1988-02-29 | 1988-02-29 | Multilayer interconnection substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01220494A true JPH01220494A (en) | 1989-09-04 |
Family
ID=12742203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4625988A Pending JPH01220494A (en) | 1988-02-29 | 1988-02-29 | Multilayer interconnection substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01220494A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09283881A (en) * | 1996-04-12 | 1997-10-31 | Yamaichi Electron Co Ltd | Interlayer connecting structure in circuit board |
| DE19924654A1 (en) * | 1999-05-28 | 2000-12-21 | Kostal Leopold Gmbh & Co Kg | Electronic circuit has printed circuit conducting track sections for connection to conducting track structure fed via lateral boundary of thin dielectric layer or through thin dielectric layer |
| EP1094693A2 (en) * | 1999-10-18 | 2001-04-25 | Sony Chemicals Corporation | Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| JP2012146353A (en) * | 2011-01-07 | 2012-08-02 | Sumitomo Electric Printed Circuit Inc | Flexible wiring board, connection structure of wiring board and method of manufacturing thereof |
| JP2012198974A (en) * | 2010-07-15 | 2012-10-18 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with head, hard disk drive, method for manufacturing substrate for suspension, and method for manufacturing suspension |
| CN110366327A (en) * | 2019-04-29 | 2019-10-22 | 深圳市捷邦电子科技有限公司 | The method for improving Rigid Flex dry film binding force |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62117391A (en) * | 1985-11-18 | 1987-05-28 | ブラザー工業株式会社 | Connection of circuit substrate |
-
1988
- 1988-02-29 JP JP4625988A patent/JPH01220494A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62117391A (en) * | 1985-11-18 | 1987-05-28 | ブラザー工業株式会社 | Connection of circuit substrate |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09283881A (en) * | 1996-04-12 | 1997-10-31 | Yamaichi Electron Co Ltd | Interlayer connecting structure in circuit board |
| DE19924654A1 (en) * | 1999-05-28 | 2000-12-21 | Kostal Leopold Gmbh & Co Kg | Electronic circuit has printed circuit conducting track sections for connection to conducting track structure fed via lateral boundary of thin dielectric layer or through thin dielectric layer |
| DE19924654C2 (en) * | 1999-05-28 | 2001-05-31 | Kostal Leopold Gmbh & Co Kg | Printed circuit board with an integrated metallic conductor structure and a printed circuit electrically connected to the conductor structure |
| EP1094693A2 (en) * | 1999-10-18 | 2001-04-25 | Sony Chemicals Corporation | Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| EP1094693A3 (en) * | 1999-10-18 | 2003-08-27 | Sony Chemicals Corporation | Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| US6812060B1 (en) | 1999-10-18 | 2004-11-02 | Sony Chemicals Corporation | Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| JP2012198974A (en) * | 2010-07-15 | 2012-10-18 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with head, hard disk drive, method for manufacturing substrate for suspension, and method for manufacturing suspension |
| JP2012146353A (en) * | 2011-01-07 | 2012-08-02 | Sumitomo Electric Printed Circuit Inc | Flexible wiring board, connection structure of wiring board and method of manufacturing thereof |
| CN110366327A (en) * | 2019-04-29 | 2019-10-22 | 深圳市捷邦电子科技有限公司 | The method for improving Rigid Flex dry film binding force |
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