JPH04212277A - Method of connecting terminal to printed wiring board - Google Patents
Method of connecting terminal to printed wiring boardInfo
- Publication number
- JPH04212277A JPH04212277A JP5004491A JP5004491A JPH04212277A JP H04212277 A JPH04212277 A JP H04212277A JP 5004491 A JP5004491 A JP 5004491A JP 5004491 A JP5004491 A JP 5004491A JP H04212277 A JPH04212277 A JP H04212277A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- printed wiring
- wiring board
- conductor circuit
- metal diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 11
- 238000009792 diffusion process Methods 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims description 56
- 239000002184 metal Substances 0.000 claims description 56
- 239000004020 conductor Substances 0.000 claims description 55
- 238000005219 brazing Methods 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、半導体パッケージなど
に用いられるプリント配線板に外部接続用の端子を接続
する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting external connection terminals to printed wiring boards used in semiconductor packages and the like.
【０００２】0002
【従来の技術】プリント配線板１に形成される金属の導
体回路２に金属で形成される外部接続用の端子３を取り
付けるにあたっては、従来から各種の方法が提供されて
いるが、例えば図６に示すように、プリント配線板１の
表面の導体回路２に端子３を半田や銀ろうなどのろう材
８を用いてろう付けすることによって、導体回路２に端
子３を接続するようにするのが一般的である。2. Description of the Related Art Various methods have been conventionally provided for attaching external connection terminals 3 made of metal to a metal conductor circuit 2 formed on a printed wiring board 1. For example, as shown in FIG. As shown in the figure, the terminal 3 is connected to the conductive circuit 2 by brazing the terminal 3 to the conductive circuit 2 on the surface of the printed wiring board 1 using a brazing material 8 such as solder or silver solder. is common.
【０００３】0003
【発明が解決しようとする課題】しかしこのようにろう
付けすることによって接続をおこなうと、溶融させたろ
う材８の高熱がプリント配線板１に作用することになり
、プリント配線板に変形、層間剥離等の機械的劣化や、
回路間の抵抗の低下等の電気特性劣化など、プリント配
線板に劣化が発生するおそれがあり、特にプリント配線
板１を樹脂積層板等の樹脂材で作成した場合にこの劣化
が大きく発生するおそれがある。またろう材８の使用に
伴う問題、例えば半田ブリッジや半田ボールの発生、半
田に含まれるフラックスによる導通不良等の問題もあり
、プリント配線板の導通信頼性が低下するおそれがある
。However, when the connection is made by brazing in this way, the high heat of the melted brazing filler metal 8 acts on the printed wiring board 1, causing deformation and delamination of the printed wiring board. Mechanical deterioration such as
There is a risk that deterioration may occur in the printed wiring board, such as deterioration of electrical characteristics such as a decrease in resistance between circuits, and this deterioration may occur particularly when the printed wiring board 1 is made of a resin material such as a resin laminate. There is. Further, there are also problems associated with the use of the brazing filler metal 8, such as the generation of solder bridges and solder balls, and poor conductivity due to flux contained in the solder, which may reduce the conductivity reliability of the printed wiring board.
【０００４】本発明は上記の点に鑑みてなされたもので
あり、ろう材を用いて高温を作用させるような必要なく
、プリント配線板の導体回路に端子を接続することがで
きる方法を提供することを目的とするものである。The present invention has been made in view of the above points, and provides a method by which a terminal can be connected to a conductor circuit of a printed wiring board without the need for applying high temperature using a brazing material. The purpose is to
【０００５】[0005]
【課題を解決するための手段】本発明に係るプリント配
線板への端子の接続法は、接続用の端子３をプリント配
線板１に接続するにあたって、プリント配線板１の導体
回路２に端子３を密着させて金属拡散接合させることを
特徴とするものである。本発明において、金属拡散接合
は、超音波を加えながら、あるいは熱を加えながらおこ
なうようにするのがよい。また導体回路２への端子３の
金属拡散接合は個々の導体回路２に端子３を１本づつお
こなう他に、複数の導体回路２に複数の端子３を同時に
金属拡散接合させることもできる。[Means for Solving the Problems] A method for connecting a terminal to a printed wiring board according to the present invention is that when connecting a connecting terminal 3 to a printed wiring board 1, the terminal 3 is connected to a conductor circuit 2 of the printed wiring board 1. This is characterized by metal diffusion bonding by bringing the metal parts into close contact with each other. In the present invention, metal diffusion bonding is preferably performed while applying ultrasonic waves or while applying heat. In addition to metal diffusion bonding of the terminals 3 to the conductor circuits 2, one terminal 3 can be bonded to each conductor circuit 2 one by one, or a plurality of terminals 3 can be metal diffusion bonded to a plurality of conductor circuits 2 at the same time.
【０００６】[0006]
【作用】本発明にあっては、プリント配線板１の導体回
路２に端子３を密着させて金属拡散接合させるようにし
ているために、ろう付けをおこなう場合のような高温を
作用させる必要なく導体回路２に端子３を接続すること
ができる。[Operation] In the present invention, since the terminal 3 is brought into close contact with the conductor circuit 2 of the printed wiring board 1 and metal diffusion bonding is performed, there is no need to apply high temperature as in the case of brazing. A terminal 3 can be connected to the conductor circuit 2.
【０００７】[0007]
【実施例】以下本発明を実施例によって詳述する。プリ
ント配線板１としては、ガラス布基材エポキシ樹脂積層
板やガラス布基材ポリイミド樹脂積層板、ガラス布基材
フッ素樹脂積層板、ガラス布基材ポリフェニレンオキサ
イド樹脂積層板などの樹脂積層板で絶縁基板１ａを作成
すると共に、その表面に導体回路２を、銅箔やアルミニ
ウム箔などの金属箔をサブトラクティブ法で加工して設
けたり、アディティブ法でメッキして設けたりして形成
されるプラスチック基板のものや、あるいはセラミック
板で絶縁基板１ａを作成すると共にその表面に金属導体
ペースト等で導体回路２を設けたセラミック基板のもの
など、任意のものを使用することができる。これら導体
回路２の表面には金や銀、ニッケル等のメッキを施すよ
うにしてもよい。上記プリント配線板１にはこの導体回
路２に電気的に接続した状態でＩＣチップなどの半導体
チップが実装されるものである。また、端子３としては
、例えば銅や銅合金、４２アロイ、鉄、鉄合金、アルミ
ニウムなどで作成されたリードフレームや、電子部品の
端子などを用いることができる。端子３の表面にも金や
銀、ニッケル等のメッキを施すようにしてもよい。EXAMPLES The present invention will be explained in detail by way of examples. The printed wiring board 1 is insulated with a resin laminate such as a glass cloth-based epoxy resin laminate, a glass cloth-based polyimide resin laminate, a glass cloth-based fluororesin laminate, or a glass cloth-based polyphenylene oxide resin laminate. A plastic substrate formed by creating a substrate 1a and providing a conductor circuit 2 on its surface by processing metal foil such as copper foil or aluminum foil using a subtractive method, or by plating it using an additive method. Any suitable material can be used, such as a ceramic substrate made of an insulating substrate 1a made of a ceramic plate and a conductor circuit 2 formed of a metal conductor paste or the like on the surface of the insulating substrate 1a. The surfaces of these conductive circuits 2 may be plated with gold, silver, nickel, or the like. A semiconductor chip such as an IC chip is mounted on the printed wiring board 1 while being electrically connected to the conductive circuit 2. Further, as the terminal 3, for example, a lead frame made of copper, copper alloy, 42 alloy, iron, iron alloy, aluminum, etc., a terminal of an electronic component, etc. can be used. The surface of the terminal 3 may also be plated with gold, silver, nickel, or the like.
【０００８】そして、図１に示すように、導体回路２の
表面に端子３の一部を重ねて密着させて、導体回路２の
金属と端子３の金属の密着部分の金属拡散現象に基づく
接合をおこなわせることによって、導体回路２に端子３
を接合一体化して接続することができるものである。こ
のようにして導体回路２に端子３を接合した後に、プリ
ント配線板１の外側に樹脂成形をおこなって樹脂被覆す
ることによって、ＱＦＰ等の半導体パッケージを作成す
ることができる。Then, as shown in FIG. 1, a part of the terminal 3 is overlapped and brought into close contact with the surface of the conductor circuit 2, and the metal of the conductor circuit 2 and the metal of the terminal 3 are bonded based on the metal diffusion phenomenon at the close contact part. By performing this, terminal 3 is connected to conductor circuit 2.
It is possible to connect them by joining them together. After the terminals 3 are joined to the conductor circuit 2 in this manner, a semiconductor package such as a QFP can be produced by performing resin molding on the outside of the printed wiring board 1 and covering it with resin.
【０００９】このように導体回路２に端子３を金属拡散
接合するにあたっては、超音波を作用させたり、熱を作
用させたり、さらに超音波と熱を併用して作用させたり
しておこなうのが好ましい。図２は超音波と加熱とを作
用させて金属拡散接合をおこなうようにした実施例を示
すものであり、エポキシ樹脂積層板等の絶縁基板１ａの
表面に銅箔のエッチングで導体回路２を設けることによ
って形成したプラスチック基板のプリント配線板１を用
い、導体回路２の端部の表面には金のバンプ９が設けて
ある。また端子３としては４２アロイで作成した導体幅
０．１〜０．５ｍｍ、導体厚み０．０５〜０．５ｍｍの
リードフレームを用い、この端子３の表面には金メッキ
１０が施してある。そして金属拡散接合をおこなうにあ
たっては、導体回路２のバンプ９に端子３を重ねて密着
させ、熱板１１の上にプリント配線板１をセットして加
熱しつつ、端子３の上に超音波振動子の振動伝達ツール
１２を圧接させて超音波振動を作用させる。このように
加熱しつつ超音波振動を導体回路２と端子３に作用させ
ることによって、導体回路２の金属と端子３の金属の密
着部分において金属拡散現象が容易に起こり、導体回路
２と端子３とを金属拡散接合させることができるもので
ある。ここで、熱板１１による加熱温度は１３０〜３０
０℃の範囲が好ましい。また超音波の振動数は５０〜１
２０ｋＨｚ、望ましくは５５〜１１５ｋＨｚの範囲が好
ましい。超音波の出力は装置によってまちまちであるた
めに特に限定されない。さらに圧接することによって導
体回路２と端子３の金属面を密着させることができると
共に振動伝達ツール１２の先端を端子３に食い込ませて
超音波の伝達効率を高めることができるものであり、こ
の際の加圧力は振動伝達ツール１２の先端面が０．１５
ｍｍ四方の面積で、端子３が幅０．２ｍｍで厚み０．１
５ｍｍの場合において、２００〜５００ｇ程度の範囲が
好ましい。[0009] When metal diffusion bonding the terminal 3 to the conductor circuit 2 as described above, it is possible to perform the metal diffusion bonding by applying ultrasonic waves, applying heat, or using a combination of ultrasonic waves and heat. preferable. FIG. 2 shows an embodiment in which metal diffusion bonding is performed by applying ultrasonic waves and heating, and a conductor circuit 2 is provided on the surface of an insulating substrate 1a such as an epoxy resin laminate by etching copper foil. A printed wiring board 1 made of a plastic substrate is used, and gold bumps 9 are provided on the surface of the end of the conductor circuit 2. As the terminal 3, a lead frame made of 42 alloy with a conductor width of 0.1 to 0.5 mm and a conductor thickness of 0.05 to 0.5 mm is used, and the surface of the terminal 3 is plated with gold 10. To perform metal diffusion bonding, the terminals 3 are overlapped and brought into close contact with the bumps 9 of the conductor circuit 2, and while the printed wiring board 1 is set on the hot plate 11 and heated, ultrasonic vibration is applied to the terminals 3. The secondary vibration transmission tool 12 is brought into pressure contact to apply ultrasonic vibration. By applying ultrasonic vibration to the conductor circuit 2 and the terminal 3 while heating in this way, a metal diffusion phenomenon easily occurs in the close contact between the metal of the conductor circuit 2 and the metal of the terminal 3. It is possible to perform metal diffusion bonding between the two. Here, the heating temperature by the hot plate 11 is 130 to 30
A range of 0°C is preferred. Also, the frequency of ultrasonic waves is 50 to 1
A range of 20 kHz, preferably 55-115 kHz is preferred. The output of ultrasonic waves varies depending on the device, so it is not particularly limited. Further, by press-welding, the metal surfaces of the conductor circuit 2 and the terminal 3 can be brought into close contact, and the tip of the vibration transmission tool 12 can be bitten into the terminal 3 to increase the transmission efficiency of ultrasonic waves. The pressing force is 0.15 on the tip surface of the vibration transmission tool 12.
Terminal 3 has a width of 0.2 mm and a thickness of 0.1 mm.
In the case of 5 mm, a range of about 200 to 500 g is preferable.
【００１０】図３は加熱の作用で金属拡散接合をおこな
うようにした実施例を示すものであり、セラミック板の
絶縁基板１ａの表面に銀‐パラジウム導体ペーストで導
体回路２を設けることによって形成したセラミック基板
のプリント配線板１を用い、導体回路２の表面には金メ
ッキ１３が設けてある。また端子３としては４２アロイ
で作成したリードフレームを用い、この端子３の表面に
は銀メッキ１４が施してある。そして金属拡散接合をお
こなうにあたっては、導体回路２に端子３を重ねて密着
させ、熱板１１の上にプリント配線板１をセットして加
熱しつつ端子３を導体回路２に押さえて加圧することに
よって、導体回路２の金属と端子３の金属の密着部分に
おいて金属拡散現象が容易に起こり、導体回路２と端子
３とを金属拡散接合させることができるものである。こ
こで、熱板１１による加熱温度は１３０〜５００℃の範
囲が好ましい。超音波を併用しないために、加熱温度は
第２図の実施例のものよりも高目に設定する必要がある
。また加圧力は既述した程度に設定するのが好ましい。FIG. 3 shows an embodiment in which metal diffusion bonding is performed by the action of heating, and is formed by providing a conductor circuit 2 with silver-palladium conductor paste on the surface of an insulating substrate 1a made of a ceramic plate. A printed wiring board 1 made of a ceramic substrate is used, and a gold plating 13 is provided on the surface of a conductive circuit 2. A lead frame made of 42 alloy is used as the terminal 3, and the surface of the terminal 3 is coated with silver plating 14. To perform metal diffusion bonding, the terminals 3 are stacked and brought into close contact with the conductor circuit 2, and the printed wiring board 1 is set on the hot plate 11 and while heating, the terminals 3 are pressed against the conductor circuit 2 and pressure is applied. Accordingly, a metal diffusion phenomenon easily occurs in the close contact portion between the metal of the conductor circuit 2 and the metal of the terminal 3, and the conductor circuit 2 and the terminal 3 can be bonded by metal diffusion. Here, the heating temperature by the hot plate 11 is preferably in the range of 130 to 500°C. Since ultrasonic waves are not used in combination, the heating temperature must be set higher than that of the embodiment shown in FIG. Further, it is preferable to set the pressing force to the level described above.
【００１１】図４は超音波を作用させて金属拡散接合を
おこなうようにした実施例を示すものであり、エポキシ
樹脂積層板等の絶縁基板１ａの表面にアルミニウム箔の
エッチングで導体回路２を設けることによって形成した
プラスチック基板のプリント配線板１を用いる。また端
子３としては４２アロイで作成したリードフレームを用
い、この端子３の表面には金メッキ１０が施してある。
そして金属拡散接合をおこなうにあたっては、プリント
配線板１を加工台１５にセットして導体回路２に端子３
を重ねて密着させ、端子３の上に超音波振動子の振動伝
達ツール１２を圧接させて超音波振動を作用させる。こ
のように超音波振動を導体回路２と端子３に作用させる
ことによって、導体回路２の金属と端子３の金属の密着
部分において金属拡散現象が容易に起こり、導体回路２
と端子３とを金属拡散接合させることができるものであ
る。この実施例では加熱を併用しないために、超音波の
出力は図２の実施例のものよりも高目に設定する必要が
ある。また圧接する際の加圧力も既述した程度が好まし
い。FIG. 4 shows an embodiment in which metal diffusion bonding is performed by applying ultrasonic waves, in which a conductor circuit 2 is provided on the surface of an insulating substrate 1a such as an epoxy resin laminate by etching aluminum foil. A printed wiring board 1 made of a plastic substrate is used. A lead frame made of 42 alloy is used as the terminal 3, and the surface of the terminal 3 is plated with gold 10. When performing metal diffusion bonding, the printed wiring board 1 is set on the processing table 15 and the terminals 3 are connected to the conductor circuit 2.
are placed in close contact with each other, and a vibration transmission tool 12 of an ultrasonic vibrator is pressed onto the terminal 3 to apply ultrasonic vibration. By applying ultrasonic vibration to the conductor circuit 2 and the terminal 3 in this way, a metal diffusion phenomenon easily occurs in the close contact area between the metal of the conductor circuit 2 and the metal of the terminal 3, and the conductor circuit 2
and the terminal 3 can be bonded by metal diffusion bonding. Since heating is not used in this embodiment, the ultrasonic output must be set higher than that of the embodiment shown in FIG. Further, it is preferable that the pressure applied during pressure contact be at the level described above.
【００１２】上記各実施例において、導体回路２に端子
３を金属拡散接合する操作は個々の端子３について一本
づつおこなう他に、プリント配線板１に複数設けられる
導体回路２，２…にそれぞれ端子３，３…を密着させて
、各導体回路２，２…に各端子３，３…を同時に金属拡
散接合させるようにしてもよい。この場合、超音波振動
を与えて、あるいは超音波振動に加熱を併用して、金属
拡散接合をおこなうときには、図５に示すように超音波
振動子の振動伝達ツール１２として幅長のものを用い、
複数の導体回路２，２…にそれぞれ密着させて重ねた各
端子３，３…の上に渡して振動伝達ツール１２を圧接さ
せることによって、超音波振動を複数の各端子３，３…
に同時に作用させて各導体回路２，２…に各端子３，３
…を同時に金属拡散接合させることができる。In each of the above embodiments, the operation of metal diffusion bonding the terminals 3 to the conductor circuit 2 is performed not only for each terminal 3 one by one, but also for each of the conductor circuits 2, 2, . . . provided on the printed wiring board 1. The terminals 3, 3... may be brought into close contact with each other, and each terminal 3, 3... may be simultaneously metal diffusion bonded to each conductor circuit 2, 2.... In this case, when performing metal diffusion bonding by applying ultrasonic vibration or by using heating in combination with ultrasonic vibration, a wide one is used as the vibration transmission tool 12 of the ultrasonic vibrator, as shown in FIG. ,
By pressing the vibration transmission tool 12 over the terminals 3, 3, which are stacked in close contact with the plurality of conductor circuits 2, 2, respectively, ultrasonic vibrations are transmitted to the terminals 3, 3, and so on.
simultaneously act on each conductor circuit 2, 2... to each terminal 3, 3.
...can be simultaneously metal diffusion bonded.
【００１３】上記図２、図３、図４、図５のようにして
導体回路２に端子３を金属拡散接合したものについて、
回路２から端子３を１８０°の方向に引き剥がす剪断引
き剥がし試験をしたところ、いずれのものも引き剥がし
に要する力は５００ｇ〜１０００ｇであり（端子３はそ
の導体幅が０．２ｍｍ、導体厚みが０．１５ｍｍのもの
を用い、重ね代１ｍｍで導体回路２に端子３を接合した
）、半田付けした場合とほぼ同等の実用上十分な強度が
得られた。またこれらを半田浴に浸漬したところ、半田
付けした場合には接合は剥がれるが、図２、図３、図４
、図５のものではいずれも接合強度に変化はなかった。Regarding the terminal 3 bonded to the conductor circuit 2 by metal diffusion bonding as shown in FIGS. 2, 3, 4, and 5,
When we conducted a shear peeling test in which terminal 3 was peeled off from circuit 2 in a 180° direction, the force required to peel off each case was 500 g to 1000 g (terminal 3 had a conductor width of 0.2 mm and a conductor thickness of 0.15 mm, and the terminal 3 was joined to the conductor circuit 2 with an overlap margin of 1 mm), a practically sufficient strength almost equivalent to that obtained by soldering was obtained. Furthermore, when these were immersed in a solder bath, the joints peeled off when soldered, but as shown in Figures 2, 3, and 4.
There was no change in bonding strength in any of the cases shown in FIG.
【００１４】尚、金属拡散接合させる導体回路２の表面
と端子３の表面の金属は、同種金属、異種金属のいずれ
の組み合わせでもよく、特に限定されるものではないが
、超音波と加熱を併用して金属拡散接合させる場合や加
熱して金属拡散接合させる場合は、銅と金の組み合わせ
などが、また超音波のみを作用させて金属拡散接合させ
る場合は、アルミニウムとアルミニウムの組み合わせや
、アルミニウムと金の組み合わせなどが好ましい。[0014] The metals on the surface of the conductor circuit 2 and the surface of the terminal 3 to be metal diffusion bonded may be a combination of the same kind of metal or different kinds of metals, and are not particularly limited. When metal diffusion bonding is performed by heating or by heating, a combination of copper and gold is used, and when metal diffusion bonding is performed using only ultrasonic waves, a combination of aluminum and aluminum or a combination of aluminum and aluminum is used. A combination of gold is preferred.
【００１５】[0015]
【発明の効果】上記のように本発明は、接続用の端子を
プリント配線板に接続するにあたって、プリント配線板
の導体回路に端子を密着させて金属拡散接合させるよう
にしているので、ろう付けをおこなう場合のような高温
を作用させる必要なく導体回路に端子を接続することが
でき、高温の作用によるプリント配線板の劣化のおそれ
がないものであり、しかもろう付けの場合のようなろう
材を用いることによる問題もなくなるものである。Effects of the Invention As described above, in the present invention, when connecting a connecting terminal to a printed wiring board, the terminal is brought into close contact with the conductor circuit of the printed wiring board and metal diffusion bonding is performed, so that brazing is not required. Terminals can be connected to conductor circuits without the need to apply high temperatures as in the case of brazing, there is no risk of deterioration of the printed wiring board due to the action of high temperatures, and there is no need to use a brazing material as in the case of brazing. This also eliminates the problems caused by using .
【００１６】また、超音波を加えながら、さらに熱を加
えながら金属拡散接合させるようにしているので、導体
回路と端子の密着部分において金属拡散現象が容易に起
こり、導体回路と端子とを強固に金属拡散接合させるこ
とができるものである。さらに、プリント配線板の複数
の導体回路にそれぞれ端子を密着させて、各端子に同時
に超音波を加えることによって各導体回路に各端子を同
時に金属拡散接合させるようにすれば、導体回路への端
子の接続の作業性を高めることができるものである。[0016] Furthermore, since metal diffusion bonding is performed while applying ultrasonic waves and further applying heat, the metal diffusion phenomenon easily occurs in the areas where the conductor circuit and the terminal are in close contact, thereby strengthening the conductor circuit and the terminal. It can be metal diffusion bonded. Furthermore, if the terminals are brought into close contact with multiple conductor circuits on a printed wiring board and ultrasonic waves are applied to each terminal at the same time, each terminal can be metal diffusion bonded to each conductor circuit at the same time. It is possible to improve the workability of connection.
【図１】本発明の一実施例の一部の断面図である。FIG. 1 is a cross-sectional view of a portion of an embodiment of the invention.
【図２】本発明の他の実施例を示す一部の断面図である
。FIG. 2 is a partial sectional view showing another embodiment of the present invention.
【図３】本発明のさらに他の実施例を示す一部の断面図
である。FIG. 3 is a partial cross-sectional view showing still another embodiment of the present invention.
【図４】本発明のさらに他の実施例を示す一部の断面図
である。FIG. 4 is a partial cross-sectional view showing still another embodiment of the present invention.
【図５】本発明のさらに他の実施例を示す一部の断面図
である。FIG. 5 is a partial sectional view showing still another embodiment of the present invention.
【図６】従来例の一部の断面図である。FIG. 6 is a cross-sectional view of a part of a conventional example.
１ プリント配線板 ２ 導体回路 ３ 端子 １２ 超音波の振動伝達ツール 1 Printed wiring board 2 Conductor circuit 3 Terminal 12 Ultrasonic vibration transmission tool
Claims (4)
するにあたって、プリント配線板の導体回路に端子を密
着させて金属拡散接合させることを特徴とするプリント
配線板への端子の接続法。1. A method for connecting a terminal to a printed wiring board, characterized in that when connecting the terminal to the printed wiring board, the terminal is brought into close contact with a conductor circuit of the printed wiring board and metal diffusion bonded.
ることを特徴とする請求項１に記載のプリント配線板へ
の端子の接続法。2. The method for connecting terminals to a printed wiring board according to claim 1, wherein metal diffusion bonding is performed while applying ultrasonic waves.
とを特徴とする請求項１又は２に記載のプリント配線板
への端子の接続法。3. The method for connecting a terminal to a printed wiring board according to claim 1, wherein metal diffusion bonding is performed while applying heat.
れぞれ端子を密着させて、各端子に同時に超音波を加え
ることによって各導体回路に各端子を同時に金属拡散接
合させることを特徴とする請求項２又は３に記載のプリ
ント配線板への端子の接続法。[Claim 4] A claim characterized in that the terminals are brought into close contact with each of the plurality of conductor circuits of the printed wiring board, and ultrasonic waves are applied to each terminal at the same time so that each terminal is metal diffusion bonded to each conductor circuit at the same time. 2. The method for connecting a terminal to a printed wiring board according to 2 or 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/063,059 US5403785A (en) | 1991-03-03 | 1993-05-19 | Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24306590 | 1990-09-12 | ||
| JP2-243065 | 1990-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04212277A true JPH04212277A (en) | 1992-08-03 |
Family
ID=17098276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5004491A Pending JPH04212277A (en) | 1990-09-12 | 1991-03-15 | Method of connecting terminal to printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04212277A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002164461A (en) * | 2000-11-24 | 2002-06-07 | Kyocera Corp | Ceramic circuit board |
| JP2002239752A (en) * | 2001-02-15 | 2002-08-28 | Yazaki Corp | Method for joining metal to metal |
| JP2006519471A (en) * | 2003-03-03 | 2006-08-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | X-ray tube cathode assembly and interfacial reaction bonding process |
| KR100689574B1 (en) * | 2000-03-14 | 2007-03-02 | 마츠시타 덴끼 산교 가부시키가이샤 | Secondary cell and method for bonding lead thereof, and battery power supply |
| WO2010150351A1 (en) * | 2009-06-23 | 2010-12-29 | 東芝三菱電機産業システム株式会社 | Electrode base |
| JP2012004289A (en) * | 2010-06-16 | 2012-01-05 | Toshiba Mitsubishi-Electric Industrial System Corp | Member joining method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63122135A (en) * | 1986-11-11 | 1988-05-26 | Matsushita Electric Ind Co Ltd | Electrically connecting method for semiconductor chip |
-
1991
- 1991-03-15 JP JP5004491A patent/JPH04212277A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63122135A (en) * | 1986-11-11 | 1988-05-26 | Matsushita Electric Ind Co Ltd | Electrically connecting method for semiconductor chip |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100689574B1 (en) * | 2000-03-14 | 2007-03-02 | 마츠시타 덴끼 산교 가부시키가이샤 | Secondary cell and method for bonding lead thereof, and battery power supply |
| JP2002164461A (en) * | 2000-11-24 | 2002-06-07 | Kyocera Corp | Ceramic circuit board |
| JP2002239752A (en) * | 2001-02-15 | 2002-08-28 | Yazaki Corp | Method for joining metal to metal |
| JP2006519471A (en) * | 2003-03-03 | 2006-08-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | X-ray tube cathode assembly and interfacial reaction bonding process |
| WO2010150351A1 (en) * | 2009-06-23 | 2010-12-29 | 東芝三菱電機産業システム株式会社 | Electrode base |
| JPWO2010150351A1 (en) * | 2009-06-23 | 2012-12-06 | 東芝三菱電機産業システム株式会社 | Electrode substrate |
| JP2012004289A (en) * | 2010-06-16 | 2012-01-05 | Toshiba Mitsubishi-Electric Industrial System Corp | Member joining method |
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