JPH01184930A - Connection of semiconductor device - Google Patents

Abstract

PURPOSE:To augment the connecting precision between a semiconductor chip and a wiring substrate by a method wherein the semiconductor chip is aligned with the wiring substrate by an alignment mark made on the rear side of the semiconductor chip. CONSTITUTION:Connecting terminals 2 connecting to a semiconductor chip 3 are arranged on a wiring substrate 1 whereon bumps are normally formed. The semiconductor chip 3 is arranged upside down making the surface oppose to the wiring substrate 1 while an alignment mark 4 is made on the rear side. A position detector 5 detects the positions of the alignment mark 4 and the connecting terminals 2 to feed position data to a position controller 6. The position controller 6 controls the position of the semiconductor chip 3 to pressure fix it on the wiring substrate 1. Firstly, the position detector 5 detects the position of the connecting terminals 2 to store the position in the position controller 6. Finally, the semiconductor chip 3 is sucked up and aligned with any specified position thereof while detecting the position of the alignment mark 4 to be pressure fixed on the wiring substrate 1 for heating and connection.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method of connecting a semiconductor chip and a wiring board,
In particular, it relates to alignment methods for flip-chip technology.

[Conventional technology]

Conventionally, when aligning the connection terminals of a semiconductor chip and the connection terminals of a wiring board using flip-chip technology, in which the connection terminals of the semiconductor chip and the connection terminals of the wiring board face each other and are bonded by thermocompression, it is necessary to detect each wiring pattern or to perform alignment based on the external shape of the semiconductor chip. I was going.

[Problem that the invention seeks to solve]

In the conventional alignment method described above, which detects the wiring patterns on both the semiconductor chip and the wiring board, the surfaces with the respective patterns are in opposite directions, making the detection device complicated and making it difficult to align the outer shape of the semiconductor chip. The disadvantage of using this method is that the accuracy decreases.

[Means for solving problems]

In the method for connecting a semiconductor device of the present invention, a wafer chip-shaped semiconductor device has an alignment pattern on the back side, a position detection section detects the alignment pattern and the wiring pattern of the wiring board, and a position detection section detects the alignment pattern and the wiring pattern of the wiring board. and a position control section that moves the semiconductor chip.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view showing a partial block diagram for explaining one embodiment of the present invention. Connection terminals 2 connected to semiconductor chips 3 are arranged on the wiring board 1, and usually have bumps formed thereon. The semiconductor chip 3 faces downward so that its front surface faces the semiconductor chip 3, and alignment marks 4 are formed on its back surface. The position detector 5 detects the positions of the alignment mark 4 and the connection terminal 2 and sends the position information to the position control section 6. Position control unit 6
controls the position of the semiconductor chip 3 and presses it onto the wiring board l.

First, the position detection section 5 detects the position of the connection terminal 2 and causes the position control section 6 to store it. Then, the semiconductor chip 3 is sucked, the position of the semiconductor chip 3 is adjusted to a desired position while detecting the position of the alignment mark 4, and the semiconductor chip 3 is crimped onto the wiring board 1.
Heat and connect.

Then, suction of the semiconductor chip is finished, and if there are other semiconductor chips to be connected, similar operations are performed one after another to mount the semiconductor chips on the wiring board.

Although the above embodiments described alignment in flip-chip technology, tape automatic bonding (TAB
), when the front surface of the chip faces the wiring board, that is, in the case of face-down connection, alignment can be performed using alignment marks on the back surface of the semiconductor chip.

〔Effect of the invention〕

As described above, the present invention can easily improve the accuracy of connection with the wiring board by aligning the semiconductor chip with the wiring board using alignment marks on the back surface of the semiconductor chip.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a partial block diagram for explaining one embodiment of the present invention. ■・・・Wiring board, 2・・・Connection terminal, 3
... Semiconductor chip, 4 ... Alignment mark, 5 ... Position detection section, 6 ... Position control section. Agent Patent Attorney Oto Uchihara

Claims (1)

[Claims] 1. A method for connecting a semiconductor device, characterized in that, in connecting a wafer chip-shaped semiconductor device and a wiring board, positioning is performed using marks on the back side of the semiconductor device.