JPH01109702A - Chip resistor - Google Patents
Chip resistorInfo
- Publication number
- JPH01109702A JPH01109702A JP62267839A JP26783987A JPH01109702A JP H01109702 A JPH01109702 A JP H01109702A JP 62267839 A JP62267839 A JP 62267839A JP 26783987 A JP26783987 A JP 26783987A JP H01109702 A JPH01109702 A JP H01109702A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrodes
- substrate
- chip resistor
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 13
- 238000007639 printing Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
この発明は、チップ状の絶縁体基板の表面に抵抗体が設
けられ、この基板の両端部に電極が形成されたチップ抵
抗器に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a chip in which a resistor is provided on the surface of a chip-shaped insulating substrate, and electrodes are formed on both ends of this substrate. Regarding resistors.
（従来の技術）
従来、チップ抵抗器の電極の構造は、ガラスをバインダ
に用いてＡｇ −Ｐｔ等を成分とするいわゆるメタルグ
レーズペーストを塗布し焼成して形成したものであった
。(Prior Art) Conventionally, the electrode structure of a chip resistor has been formed by applying a so-called metal glaze paste containing Ag--Pt or the like as a component using glass as a binder and firing the paste.
また、特公昭５８−４６１６１号公報に開示されている
ように、メタルグレーズによる電極を、熱硬化性樹脂中
にＡｇを混入したＡｇ−レジン系の導電性ペーストによ
って内包し加熱硬化させて電極を形成したものもある。Furthermore, as disclosed in Japanese Patent Publication No. 58-46161, an electrode made of metal glaze is encapsulated in an Ag-resin conductive paste containing Ag mixed into a thermosetting resin, and the electrode is heated and hardened. Some have formed.
（発明が解決しようとする問題点）
上記従来の技術の前者の場合、ハンダ付けの際にメタル
グレーズ中のＡｇ粒子がハンダと合金し、いわゆるハン
ダ（われが生じ、ハンダ強度が低下するとともに、ハン
ダの付は直しもできないという問題点がある。さらに、
この場合電極は抵抗体が設けられた側にのみ形成されて
いるので、回路基板にハンダ付けした際の固着力強度が
低いという問題点がある。(Problems to be Solved by the Invention) In the former case of the above-mentioned conventional technology, the Ag particles in the metal glaze alloy with the solder during soldering, resulting in so-called solder cracking, which reduces the solder strength. There is a problem that soldering cannot be repaired.Furthermore,
In this case, since the electrode is formed only on the side where the resistor is provided, there is a problem that the strength of the adhesive force when soldering to the circuit board is low.
また、上記従来の技術の後者の場合、メタルグレーズの
電極をｈｇ−レジンペーストで全体的に被わなけけばな
らず、極めて小さいチップ抵抗器の電極部を正確に内包
するように塗布するのは比較的離しい上、樹脂で電極全
体を被うため電極をハンダ付けした後のハンダ強度が弱
いという問題点がある。In addition, in the latter case of the above-mentioned conventional technology, the metal glaze electrode must be completely covered with the HG-resin paste, and it is difficult to apply it so as to precisely cover the electrode part of the extremely small chip resistor. In addition to being relatively far apart, there is a problem in that the solder strength after soldering the electrodes is weak because the entire electrode is covered with resin.
この発明は、上記従来の技術の問題点に鑑みて成された
もので、ハンダくわれに強く、回路基板にハンダ付けし
た際の固着力が大きく、製造も容易なチップ抵抗器を提
供することを目的とする。The present invention has been made in view of the problems of the conventional technology described above, and an object of the present invention is to provide a chip resistor that is resistant to solder cracks, has a large adhesion force when soldered to a circuit board, and is easy to manufacture. With the goal.
（問題点を解決するための手段）
この発明は、絶縁体の基板表面の両端部に抵抗体と直接
に接続しているメタルグレーズ系の第１電極を設け、こ
の第１電極とは基板をはさんで反対側にもメタルグレー
ズ系の第２電極を設け、この第１、第２電極の一部を覆
い互いに電気的に接続するＡｇ−レジン系の第３電極を
基板の両端面に設け、さらに前記第１、第２、第３電極
を覆うメッキ層を形成したチップ抵抗器である。(Means for Solving the Problems) This invention provides a metal glaze-based first electrode directly connected to the resistor at both ends of the surface of the insulating substrate, and the first electrode is connected to the substrate. A second electrode made of metal glaze is provided on the opposite side, and a third electrode made of Ag-resin is provided on both end surfaces of the substrate, covering a part of the first and second electrodes and electrically connecting them to each other. The chip resistor further includes a plating layer covering the first, second, and third electrodes.
（作用）
この発明のチップ抵抗器は、基板表面の両端部の両側に
第１、第２電極を設け、さらに基板の両端面にＡｇ−レ
ジン系の第３電極を設けて、ノλンダくわれに強く、回
路基板に取り付けた際の固着力が大きくなるようにした
ものである。(Function) The chip resistor of the present invention has first and second electrodes on both ends of the substrate surface, and a third electrode made of Ag-resin on both end surfaces of the substrate. It is designed to be resistant to corrosion and has a large adhesion force when attached to a circuit board.
（実施例）
以下この発明の一実施例について図面に基づいて説明す
る。(Example) An example of the present invention will be described below based on the drawings.
この実施例のチップ抵抗器１は、第１図に示すように、
セラミックの基板２の表面に凸型の抵抗体３が印刷形成
され、この両端に電極４が設けられている。抵抗体３は
、酸化ルテニウムを約１０μの厚みに設け、レーザー又
はサンドブラストにより凸型の底辺から上方に向ってト
リミング溝５を形成し、抵抗値のトリミングが成されて
いる。The chip resistor 1 of this embodiment, as shown in FIG.
A convex resistor 3 is printed on the surface of a ceramic substrate 2, and electrodes 4 are provided at both ends of the convex resistor 3. The resistor 3 is made of ruthenium oxide with a thickness of about 10 μm, and a trimming groove 5 is formed upward from the bottom of the convex shape by laser or sandblasting to trim the resistance value.
このチップ抵抗器１の電極４は、抵抗体３が直接に接続
している第１電極６と、この第１電極６と基板２をはさ
んで対向して形成された第２電極７を有し、この第１、
第２電極６，７は、Ａｇ−Ｐｄ。The electrode 4 of this chip resistor 1 has a first electrode 6 to which the resistor 3 is directly connected, and a second electrode 7 formed to face the first electrode 6 with the substrate 2 in between. And this first one,
The second electrodes 6 and 7 are made of Ag-Pd.
Ａｇ −Ｐｔ等のメタルグレーズペーストを印刷形成し
たものである。さらに、第１、第２電極６，７をはさん
で基板２の端面に、キシレン又はエポキシフェノール樹
脂にＡｇを混入したＡｇ−レジン系の導電性ペーストに
よる第３電極８が設けられ、この第３電極８は、第１、
第２電極６，７を一部被覆するように設けられ、両者の
導通を図っている。It is formed by printing a metal glaze paste such as Ag-Pt. Furthermore, a third electrode 8 is provided on the end surface of the substrate 2 with the first and second electrodes 6 and 7 in between, and is made of an Ag-resin conductive paste made of xylene or epoxy phenol resin mixed with Ag. The three electrodes 8 are the first,
It is provided so as to partially cover the second electrodes 6 and 7, and is intended to provide electrical continuity between the two.
そして、この第１、第２、第３電極全体を覆ってＮｉメ
ッキ９及びハンダメッキＩＯが施されている。Then, Ni plating 9 and solder plating IO are applied to cover the entire first, second, and third electrodes.
また、抵抗体３の表面には、ガラスコート１１及びレジ
ンコート１２を施して保護している。Further, the surface of the resistor 3 is protected by applying a glass coat 11 and a resin coat 12.
この実施例のチップ抵抗器の製造方法は、第３図（Ａ）
ないしくＦ）に示すように、先ず、基板となるセラミッ
ク板１３のスリット１４をはさんで所定間隔で第１電極
６となるメタルグレーズペーストを複数列印刷し、９０
０°Ｃ近い温度で焼成する。さらに同様にして第２電極
７も第１電極６と対向する位置に形成する。次に、第３
図（Ｂ）に示すように、第１電極６の間のセラミック板
１３上にマトリクス状に抵抗体３を印刷形成し、平均８
５０℃の温度で焼成する。そして、第３図（Ｃ）に示す
ように、抵抗体３の表面にガラスコート１１を施し平均
６５０℃の温度で焼成する。この後、セラミック板１３
を各チップ抵抗器毎に縦横に設けられたスリット１４に
沿って切断し、第３図（Ｄ）に示すように、基板２の端
面にＡｇ−レジン系の導電性ペーストの第３電極８を２
０μ程度の厚みに塗布し、２００°Ｃ程度の温度で硬化
させる。そして第３図（Ｅ） 、（Ｆ）に示すように、
Ｎｉメッキ９、ハンダメッキ１０を各々順次族し、第１
、第２、第３電極６．７．８を被覆する。The manufacturing method of the chip resistor of this example is shown in Fig. 3(A).
As shown in F), first, a plurality of rows of metal glaze paste, which will become the first electrode 6, are printed at predetermined intervals across the slits 14 of the ceramic plate 13, which will become the substrate.
Fire at a temperature close to 0°C. Furthermore, the second electrode 7 is also formed at a position facing the first electrode 6 in the same manner. Next, the third
As shown in Figure (B), the resistors 3 are printed in a matrix on the ceramic plate 13 between the first electrodes 6, and
Calcinate at a temperature of 50°C. Then, as shown in FIG. 3(C), a glass coat 11 is applied to the surface of the resistor 3 and fired at an average temperature of 650°C. After this, the ceramic plate 13
is cut along the slits 14 provided vertically and horizontally for each chip resistor, and a third electrode 8 made of Ag-resin conductive paste is placed on the end surface of the substrate 2, as shown in FIG. 2
It is applied to a thickness of about 0μ and cured at a temperature of about 200°C. And as shown in Figure 3 (E) and (F),
Ni plating 9 and solder plating 10 are sequentially applied to the first
, covering the second and third electrodes 6.7.8.
最後に、各チップ抵抗器の抵抗体３をトリミングして抵
抗値を調整し、エポキシ樹脂等のレジンコート１２を施
し２００°Ｃ付近の温度で硬化させる。Finally, the resistor 3 of each chip resistor is trimmed to adjust the resistance value, and a resin coat 12 such as epoxy resin is applied and cured at a temperature of around 200°C.
また、トリミングは、第３図（のの状態で行うこともあ
り、この場合はその後レジンコート１２を施して第３図
（Ｄ）以下の工程を行う。これによって、セラミック板
１３をチップ毎に分離しない状態で抵抗値のトリミング
を行うので効率良くトリミング作業を行うことができ、
しかもレジンコート１２によって、後のメッキ作業時に
転紙抗体に悪影響を与えることもない。In addition, trimming may be performed in the state shown in FIG. 3 (in this case, the resin coating 12 is then applied and the steps shown in FIG. Since the resistance value is trimmed without separation, trimming work can be done efficiently.
Furthermore, the resin coat 12 does not adversely affect the paper-transferred antibody during subsequent plating work.
この実施例のチップ抵抗器によれば、ハンダくわれに対
して電極４の耐性が向上し、しかも、回路基板の曲げに
対しても、メタルグレーズ系のみでできた電極と比べ柔
軟性が高いので強い。また、ハンダ付けの際の回路基板
に対する固着力も、第１、第２電極６，７が回路基板に
強固にハンダ付けされるので、極めて強く、第３電極を
Ａｇ−レジン系にしたことによる固着力の低下は生じな
い。According to the chip resistor of this example, the resistance of the electrode 4 to solder cracks is improved, and moreover, it is more flexible than electrodes made only of metal glaze type against bending of the circuit board. So strong. In addition, the adhesion to the circuit board during soldering is extremely strong because the first and second electrodes 6 and 7 are firmly soldered to the circuit board, and the third electrode is made of Ag-resin. No decrease in adhesion force occurs.
尚、この発明のチップ抵抗器の抵抗体は、金属皮膜抵抗
体、炭素皮膜抵抗体等その用途に合わせて適宜選定し得
るものである。またメタルグレーズペースト、Ａｇ−レ
ジン系導電性ペーストの成分は、適宜能の添加物が入っ
ていても良く、この実施例のものに限定されるものでは
ない。The resistor of the chip resistor of the present invention may be appropriately selected depending on the intended use, such as a metal film resistor or a carbon film resistor. Further, the components of the metal glaze paste and the Ag-resin conductive paste may contain appropriate additives, and are not limited to those of this embodiment.
この発明のチップ抵抗器は、基板の両面に設けたメタル
グレーズ系の第１、第２電極にまたがって基板の端面に
Ａｇ−レジン系の第３電極を設け、この第１、第２、第
３電極を覆うメッキ層を形成したので、ハンダくわれに
強く、回路基板への付は直しが可能であり、しかも回路
基板へハンダ付けした際の固着力が強く、回路基板の曲
げに対しても十分に耐え得るものである。従って、今日
の実装密度の高度化の要求によりチップ抵抗器も小型化
しているが、電極部が小さくても十分な固着力が得られ
、電気製品の小型軽量化、信頼性、耐久性の向上に大き
く寄与するものである。In the chip resistor of the present invention, a third electrode made of Ag-resin is provided on the end surface of the substrate, spanning the first and second electrodes made of metal glaze provided on both sides of the substrate, and the third electrode made of Ag-resin is provided on the end surface of the substrate, and Since a plating layer is formed to cover the three electrodes, it is resistant to solder cracks and can be repaired when attached to the circuit board.Furthermore, it has strong adhesion when soldered to the circuit board, and is resistant to bending of the circuit board. is also quite durable. Therefore, although chip resistors are also becoming smaller due to today's demands for higher packaging density, sufficient adhesion force can be obtained even with small electrode parts, making electrical products smaller and lighter, and improving reliability and durability. This will greatly contribute to the
第１図はこの発明のチップ抵抗器の一実施例の平面図、
第２図は第１図のＡ−Ａ断面図、第３図（Ａ） （Ｂ）
（Ｃ） （Ｄ） （Ｅ） （Ｆ）はこの実施例のチッ
プ抵抗器の製造工程を示す縦断面図である。
１・・・チップ抵抗器、２・・・基板、３・・・抵抗体
、４・・・電極、６・・・第１電極、７・・・第２電極
、８・・・第３電極、９・・・Ｎｉメッキ、１０・・・
ハンダメッキ
第 １ 図
第２図
第３２FIG. 1 is a plan view of an embodiment of the chip resistor of the present invention.
Figure 2 is a sectional view taken along line A-A in Figure 1, Figure 3 (A) (B)
(C) (D) (E) (F) are longitudinal sectional views showing the manufacturing process of the chip resistor of this example. DESCRIPTION OF SYMBOLS 1... Chip resistor, 2... Substrate, 3... Resistor, 4... Electrode, 6... First electrode, 7... Second electrode, 8... Third electrode , 9...Ni plating, 10...
Solder plating Figure 1 Figure 2 Figure 32
Claims (1)
層構造の電極が設けられたチップ抵抗器において、前記
基板表面の両端部に抵抗体と直接に接続したメタルグレ
ーズ系の第１電極を形成するとともに、前記基板をはさ
んでこの第１電極と対向する位置の基板表面にもメタル
グレーズ系の第２電極を形成し、この第１、第２電極と
直接に接続したＡｇ−レジン系の第３電極を前記基板の
両端面に設け、さらに前記第１、第２、第３電極を覆う
メッキ層を設けて成ることを特徴とするチップ抵抗器。In a chip resistor in which multilayered electrodes are provided at both ends of a resistor printed on the surface of an insulating substrate, a metal glaze-based first electrode is connected directly to the resistor at both ends of the substrate surface. At the same time, a metal glaze-based second electrode is also formed on the substrate surface at a position opposite to the first electrode across the substrate, and an Ag-resin-based electrode is directly connected to the first and second electrodes. A chip resistor characterized in that a third electrode is provided on both end surfaces of the substrate, and a plating layer is further provided to cover the first, second, and third electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62267839A JPH01109702A (en) | 1987-10-22 | 1987-10-22 | Chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62267839A JPH01109702A (en) | 1987-10-22 | 1987-10-22 | Chip resistor |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6158706A Division JP2806802B2 (en) | 1994-07-11 | 1994-07-11 | Chip resistor |
| JP8004988A Division JP3012875B2 (en) | 1996-01-16 | 1996-01-16 | Manufacturing method of chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01109702A true JPH01109702A (en) | 1989-04-26 |
| JPH0553281B2 JPH0553281B2 (en) | 1993-08-09 |
Family
ID=17450336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62267839A Granted JPH01109702A (en) | 1987-10-22 | 1987-10-22 | Chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01109702A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03165501A (en) * | 1989-10-20 | 1991-07-17 | Sfernice Soc Fr Des Electro Resistance | Chip type electric resistor and its manufacture |
| JPH0629102A (en) * | 1992-07-10 | 1994-02-04 | Alps Electric Co Ltd | Chip resistor and its manufacturing method |
| JPH07211504A (en) * | 1994-10-19 | 1995-08-11 | Hokuriku Electric Ind Co Ltd | Terminal electrode for surface-mounting type electronic parts and its production |
| JPH09246013A (en) * | 1996-03-13 | 1997-09-19 | Matsushita Electric Ind Co Ltd | Chip ptc thermistor |
| KR20030052196A (en) * | 2001-12-20 | 2003-06-26 | 삼성전기주식회사 | Thin film chip resistor and method of fabricating the same |
| US7190252B2 (en) | 2005-02-25 | 2007-03-13 | Vishay Dale Electronics, Inc. | Surface mount electrical resistor with thermally conductive, electrically insulative filler and method for using same |
| JP2016213352A (en) * | 2015-05-11 | 2016-12-15 | Koa株式会社 | Chip resistor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59185801U (en) * | 1983-05-26 | 1984-12-10 | アルプス電気株式会社 | chip resistance |
| JPS61210601A (en) * | 1985-03-14 | 1986-09-18 | 進工業株式会社 | Chip resistor |
| JPS61268001A (en) * | 1984-12-28 | 1986-11-27 | コーア株式会社 | Chip-shaped electronic component |
-
1987
- 1987-10-22 JP JP62267839A patent/JPH01109702A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59185801U (en) * | 1983-05-26 | 1984-12-10 | アルプス電気株式会社 | chip resistance |
| JPS61268001A (en) * | 1984-12-28 | 1986-11-27 | コーア株式会社 | Chip-shaped electronic component |
| JPS61210601A (en) * | 1985-03-14 | 1986-09-18 | 進工業株式会社 | Chip resistor |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03165501A (en) * | 1989-10-20 | 1991-07-17 | Sfernice Soc Fr Des Electro Resistance | Chip type electric resistor and its manufacture |
| JPH0629102A (en) * | 1992-07-10 | 1994-02-04 | Alps Electric Co Ltd | Chip resistor and its manufacturing method |
| JPH07211504A (en) * | 1994-10-19 | 1995-08-11 | Hokuriku Electric Ind Co Ltd | Terminal electrode for surface-mounting type electronic parts and its production |
| JPH09246013A (en) * | 1996-03-13 | 1997-09-19 | Matsushita Electric Ind Co Ltd | Chip ptc thermistor |
| KR20030052196A (en) * | 2001-12-20 | 2003-06-26 | 삼성전기주식회사 | Thin film chip resistor and method of fabricating the same |
| US7190252B2 (en) | 2005-02-25 | 2007-03-13 | Vishay Dale Electronics, Inc. | Surface mount electrical resistor with thermally conductive, electrically insulative filler and method for using same |
| KR100923808B1 (en) * | 2005-02-25 | 2009-10-27 | 비쉐이 데일 일렉트로닉스, 인코포레이티드 | Surface mount electrical resistor with thermally conductive, electrically non-conductive filler and method for producing the same |
| JP2016213352A (en) * | 2015-05-11 | 2016-12-15 | Koa株式会社 | Chip resistor |
| US10192659B2 (en) | 2015-05-11 | 2019-01-29 | Koa Corporation | Chip resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0553281B2 (en) | 1993-08-09 |
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