JP7390570B2 - Manufacturing method of solid electrolytic capacitor - Google Patents

Description

The present disclosure generally relates to a method of manufacturing a solid electrolytic capacitor, and more particularly, to a method of manufacturing a solid electrolytic capacitor using a foil-like capacitor element having a dielectric layer.

The solid electrolytic capacitor described in Patent Document 1 is manufactured by mounting a capacitor element on an anode lead frame and a cathode lead frame, and molding the capacitor element with molding resin so as to expose a portion of the lead frame.

Japanese Patent Application Publication No. 2005-311216

However, in the solid electrolytic capacitor described in Patent Document 1, for example, when trying to increase the number of laminated capacitor elements in order to improve capacitance, productivity sometimes decreases.

The present disclosure has been made in view of the above reasons, and an object thereof is to provide a method for manufacturing a solid electrolytic capacitor that can improve productivity.

A method for manufacturing a solid electrolytic capacitor according to one embodiment of the present disclosure includes a step of forming an element assembly, a step of forming a plurality of laminates, and a step of singulating. In the step of forming an element assembly, an element assembly is formed in which a plurality of flat capacitor elements including a dielectric layer are connected in a direction parallel to one surface of the capacitor element. In the step of forming a plurality of laminates, a plurality of the element assemblies are stacked in the thickness direction of the capacitor element, thereby forming a plurality of laminates including the plurality of capacitor elements stacked in the thickness direction. In the step of singulating, the plurality of laminates are singulated into individual laminates.

According to the present disclosure, there is an advantage that productivity can be improved.

1A, FIG. 1B, and FIG. 1C are explanatory diagrams illustrating the manufacturing process of an element assembly in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIGS. 2A, 2B, and 2C are explanatory diagrams illustrating the manufacturing process of a cathode assembly in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIG. 3A is a plan view showing a lamination step in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIG. 3B is a cross-sectional view of the same as above. FIG. 3C is a perspective view of the same as above. FIG. 4A is a plan view showing a resin sealing step in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIG. 4B is a sectional view of the same as above. FIG. 5A is a plan view showing a dicing step in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIG. 5B is a cross-sectional view of the same as above. FIG. 6A is a plan view showing a resin sealing step in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIG. 6B is a cross-sectional view of the same as above. FIG. 7A is a plan view showing a dicing process in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIG. 7B is a cross-sectional view of the same as above. FIG. 8A is an explanatory diagram showing a plating process in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIG. 8B is a cross-sectional view of the laminate after plating same as above. FIG. 9A is a plan view showing a step of dividing into pieces in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIG. 9B is a cross-sectional view of the same as above. 10A and 10B are cross-sectional views showing an electrode forming step in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIG. 11A is an explanatory diagram showing an electrode forming step in an embodiment of the solid electrolytic capacitor manufacturing method according to the present disclosure. FIG. 11B is a cross-sectional view showing a solid electrolytic capacitor. FIG. 12 is a sectional view showing a modified example of a solid electrolytic capacitor obtained by the method for manufacturing a solid electrolytic capacitor according to the present disclosure. FIG. 13 is a plan view showing a modified example of a solid electrolytic capacitor obtained by the method for manufacturing a solid electrolytic capacitor according to the present disclosure. FIG. 14 is a plan view showing a modified example of a solid electrolytic capacitor obtained by the method for manufacturing a solid electrolytic capacitor according to the present disclosure. 15A to 15D are partially enlarged plan views showing modified examples of the element assembly and the cathode assembly, respectively. 16A to 16C are partially enlarged plan views showing modified examples of the element assembly and the cathode assembly, respectively. FIGS. 17A and 17B are cross-sectional views each showing a modification of the dicing process.

(Embodiment)
1 to 11A show a method of manufacturing a solid electrolytic capacitor 1 according to this embodiment. FIG. 11B shows a cross-sectional view of the solid electrolytic capacitor 1 manufactured by the above manufacturing method.

Hereinafter, a method for manufacturing the solid electrolytic capacitor 1 according to the present embodiment will be described with reference to the drawings.

(1) Element assembly forming process FIGS. 1A to 1C show the element assembly forming process. The element assembly forming process is a process of forming an element assembly 100 in which a plurality of foil-shaped (including plate-shaped) capacitor elements 10 each having a dielectric layer 12 are connected in a direction parallel to one surface of the capacitor elements 10. be. That is, the element assembly forming process is a process for forming the element assembly 100. The element assembly 100 has a plurality of foil-shaped capacitor elements 10 including a dielectric layer 12. The plurality of capacitor elements 10 are formed in a plurality connected in a direction parallel to one surface of the capacitor element 10. Note that one surface of the capacitor element 10 is a surface lined up in the thickness direction of the capacitor element 10, and is a surface that is visually recognized in a plan view (viewing the capacitor element 10 from the thickness direction).

The element assembly forming step includes a resist forming step and a hole forming step.

(1-1) Resist Formation Process Resist formation is a process of forming a resist 102 on the element substrate 101. As shown in FIG. 1A, the element substrate 101 is a metal plate (metal foil) that is rectangular in plan view, has a porous layer on substantially the entire surface, and has conductivity. A dielectric layer 103 made of a dielectric is formed on the surface of the porous layer of metal foil. The element substrate 101 includes a valve metal. Valve metals include, for example, aluminum, tantalum, niobium, titanium, hafnium, zirconium, zinc, tungsten, and alloys containing these. The dielectric layer 103 is formed on at least one surface of the element substrate 101 in the thickness direction. In this embodiment, the dielectric layer 103 is formed on both sides of the element substrate 101 in the thickness direction.

In this embodiment, the valve metal included in the metal plate (metal foil) of the element substrate 101 is aluminum. In this case, a porous layer is formed on the surface of the element substrate 101 by etching, and a dielectric layer 103 of aluminum oxide (Al ₂ O ₃ ), which is an oxide of aluminum, is formed along the porous surface. has been done. The anode side conductive part 11 of the capacitor element 10 is formed of a metal plate (metal foil) made of aluminum (Al), and the dielectric layer 12 of the capacitor element 10 is formed on the surface of the anode side conductive part 11. , contains aluminum oxide.

As shown in FIG. 1B, the resist 102 is formed on at least one surface of the element substrate 101 in plan view. In this embodiment, resists 102 are formed on both sides of the element substrate 101 in the thickness direction. The resist 102 is formed in a grid shape, as shown in FIG. 1B. The resist 102 is formed, for example, by impregnating a portion of a porous layer with resin. The resist 102 is a portion of the element substrate 101 that has lower conductivity than the portion other than the resist 102 . Therefore, the resist 102 becomes a portion of the element substrate 101 that has higher electrical insulation than the portion other than the resist 102.

The resist 102 includes a plurality of (long) linear portions 112 extending along the first direction X and a plurality of (long) linear portions 122 extending along the second direction Y in plan view. . The plurality of linear portions 112 and the plurality of linear portions 122 are orthogonal to each other, thereby forming a grid-like resist 102 as a whole. Note that the first direction X and the second direction Y are two directions along one surface of the capacitor element 10 and orthogonal to each other.

The element assembly 100 is partitioned by a resist 102. That is, the element assembly 100 is divided into a plurality of parts by the resist 102, and each of the plurality of parts divided by the resist 102 corresponds to one capacitor element 10. The resist 102 includes a portion that will become the end surface of the capacitor element 10. Therefore, by forming the resist 102 in the resist forming step, an electrically insulated end portion of the capacitor element 10 is formed.

When the resist 102 is formed by resin impregnation, the resin can be supplied to the surface of the dielectric layer 103 by, for example, screen printing, inkjet, transfer, tape attachment, or the like. As the resist, for example, insulating resins such as epoxy resin, phenol resin, silicone resin, melamine resin, urea resin, alkyd resin, polyurethane, polyamide, polyimide, polyamideimide, and unsaturated polyester can be used.

(1-2) Hole Forming Step The hole forming step is a step of forming holes 104 in the element substrate 101 on which the resist 102 is formed, as shown in FIG. 1C, after the resist forming step. In the hole forming step, the hole 104 can be formed by punching out a part of the element substrate 101 by, for example, press molding. A plurality of holes 104 are formed on one element substrate 101. The hole 104 is formed in a part of the resist 102 in plan view. That is, each hole 104 penetrates the resist 102 and the element substrate 101 in the thickness direction. That is, the hole 104 is open to both the surface of the resist 102 formed on one surface of the element substrate 101 in the thickness direction and the surface of the resist 102 formed on the other surface of the element substrate 101 in the thickness direction.

Each of the plurality of holes 104 is a long hole extending along the first direction X. Each hole 104 is formed on a linear portion 112 extending along the first direction X. The dimension of each hole 104 in the second direction Y is smaller than the dimension of the linear portion 112 in the second direction Y. Each hole 104 is formed on the intersection P of the linear portion 112 and the linear portion 122. Most of the holes 104 among the plurality of holes 104 are formed so as to straddle two intersections P. Some of the holes 104 among the plurality of holes 104 are formed on one intersection P. In other words, the holes 104 located at the ends of the element assembly 100 in the first direction X are formed on one intersection P, and the other holes 104 are formed so as to span two intersections P. .

The plurality of holes 104 are arranged such that two holes 104 adjacent to each other in the second direction Y are shifted from each other at a predetermined pitch in the first direction X when viewed from above. That is, the plurality of holes 104 lined up in the second direction Y are lined up so that the line connecting the centers of each hole 104 forms a zigzag pattern in plan view, and the plurality of holes 104 lined up in the second direction Y are lined up in a straight line. Not lined up. That is, in plan view, the two holes 104 that are adjacent in the second direction Y have their ends in the first direction X facing each other. In other words, in plan view, the two holes 104 that are adjacent in the second direction Y do not face each other at their centers in the first direction X.

The plurality of holes 104 include a first hole 105 and a second hole 106. The first hole 105 is located on the odd-numbered linear portion 112 among the plurality of linear portions 112 when counted from one end side in the second direction Y (the upper part of FIG. 1C) in the plan view of FIG. 1C. is formed. In the plan view of FIG. 1C, the second hole 106 is located on the even-numbered linear portion 112 among the plurality of linear portions 112 counting from one end side in the second direction Y (the upper part of FIG. 1C). is formed.

Note that when using metal foil on which the dielectric layer 103 is not formed, the dielectric layer 103 may be formed on the exposed surface of the metal foil that was exposed when the plurality of holes 104 were punched out after the punching process. good.

(1-3) Element assembly By performing the above-described resist forming process and hole forming process, an element assembly 100 as shown in FIG. 1C is formed. In the element assembly 100, the plurality of capacitor elements 10 are two-dimensionally arranged along one surface of the capacitor element 10 and lined up in both a first direction X and a second direction Y that are orthogonal to each other. . That is, in the element assembly 100, a grid-like resist 102 is formed with linear portions 112 extending along the first direction X and linear portions 122 extending along the second direction Y. A portion surrounded by two linear portions 122 adjacent in the first direction X and two linear portions 112 adjacent in the second direction Y is formed as one capacitor element 10. Therefore, a plurality of capacitor elements 10 are formed in the element assembly 100, and the plurality of capacitor elements 10 are formed side by side in both the first direction X and the second direction Y.

Each of the plurality of capacitor elements 10 has an anode section 13 and a cathode section 14. In the plurality of capacitor elements 10 , the positions of the anode portions 13 and cathode portions 14 of adjacent capacitor elements 10 in a direction parallel to one surface of the element assembly 100 are opposite to each other in the element assembly 100 . That is, each capacitor element 10 has an anode part 13 and a cathode part 14, and the positions of the anode part 13 and the cathode part 14 of adjacent capacitor elements 10 are opposite in plan view. The anode portion 13 is an end portion of the solid electrolytic capacitor 1 on the side where an electrode serving as an anode is formed. The cathode portion 14 is an end portion of the solid electrolytic capacitor 1 on the side where an electrode serving as a cathode is formed.

Each capacitor element 10 has an anode portion 13 at one end in a direction parallel to the second direction Y, and a cathode portion 14 at the other end in a direction parallel to the second direction Y. There is. That is, in each capacitor element 10, one of the end portions aligned in a direction parallel to the second direction Y is formed as the anode portion 13, and the other is formed as the cathode portion 14. In the capacitor elements 10 that are adjacent to each other in the first direction ). Similarly, in the capacitor elements 10 that are adjacent to each other in the first direction opposite). Therefore, in the capacitor elements 10 adjacent in the first direction X, the anode portion 13a of one capacitor element 10a is adjacent to the cathode portion 14b of the other capacitor element 10b. Further, in the capacitor elements 10 that are adjacent to each other in the first direction X, the cathode portion 14a of one capacitor element 10a is adjacent to the anode portion 13b of the other capacitor element 10b.

The anode portion 13 of each capacitor element 10 is formed with corresponding end portions of two holes 104 aligned in the first direction X. One hole 104 is formed in the cathode portion 14 of each capacitor element 10 .

A resist 102 is formed on at least one opening edge of the hole 104 of the element assembly 100 . That is, in plan view, the resist 102 is formed to surround the hole 104. When the resist 102 is formed only on one side of the element assembly 100 in the thickness direction, the resist 102 is formed at the opening edge of the hole 104 on that one side.

The element assembly 100 has holes 104 filled with resin 50. That is, the holes 104 of the element assembly 100 are filled with resin 50 by a resin sealing process described later. In this case, the resin 50 flows into the inside of the hole 104 from the opening of the hole 104 formed in the resist 102 and is filled.

(2) Cathode assembly forming step FIGS. 2A to 2C show the cathode assembly forming step. In this embodiment, the cathode body 20 forms a cathode assembly 200 in which a plurality of cathode bodies 20 are connected in a direction parallel to one surface of the cathode body 20 . That is, the cathode assembly forming step is a step of forming the cathode assembly 200. The cathode assembly 200 is configured by a plurality of cathode bodies 20 connected in a direction parallel to one surface of the cathode bodies 20. In other words, the cathode assembly forming step is a step of forming the cathode assembly 200, and the cathode assembly 200 is a state in which a plurality of flat cathode bodies 20 are connected in a direction parallel to one surface of the cathode body 20. It is formed of. Note that one surface of the cathode body 20 is a surface lined up in the thickness direction of the cathode body 20, and is a surface that is visually recognized in a plan view (viewing the cathode body 20 from the thickness direction).

The cathode assembly forming step includes a resist forming step and a hole forming step.

(2-1) Resist Forming Process The resist forming process is a process of forming a resist on the surface of the cathode assembly 200.
That is, the resist forming process is a process of forming a resist 202 on the cathode substrate 201. As shown in FIG. 2A, the cathode substrate 201 is rectangular in plan view and is a conductive metal plate (metal foil). The cathode substrate 201 includes, for example, aluminum and an alloy containing aluminum. Further, a carbon layer 203 may be formed as a conductive material over the entire surface of the cathode substrate 201. Thereby, the cathode body 20 is a flat metal foil having a carbon layer 203 on its surface. Note that the layer of conductive material does not need to be formed on the surface of the cathode substrate 201. Further, instead of the carbon layer 203, it is also possible to form a titanium layer.

As shown in FIG. 2B, the resist 202 is formed in a grid pattern on at least one surface of the cathode substrate 201 in plan view. In this embodiment, resists 202 are formed on both sides of the cathode substrate 201 in the thickness direction. The resist 202 is formed of a resin film having electrical insulation properties. The resist 202 contains, for example, epoxy resin.

The resist 202 includes a plurality of (long) linear portions 212 extending along the first direction X and a plurality of (long) linear portions 222 extending along the second direction Y in a plan view. . The linear portions 212 and 222 are perpendicular to each other, thereby forming a grid-like resist 202 as a whole. Note that the first direction X and the second direction Y are two directions along one surface of the cathode body 20 and orthogonal to each other.

Cathode assembly 200 is partitioned by resist 202. That is, the cathode assembly 200 is divided into a plurality of parts by the resist 202, and each of the plurality of parts divided by the resist 202 corresponds to one cathode body 20. The resist 202 includes a portion that will become the end surface of the cathode body 20.

The resist 202 can be formed by supplying resin to the cathode substrate 201 by, for example, screen printing, inkjet, transfer, tape pasting, or the like.

(2-2) Hole Forming Step The hole forming step is a step of forming holes 204 in the cathode substrate 201 on which the resist 202 is formed, as shown in FIG. 2C, after the resist forming process. In the hole forming step, the hole 204 can be formed by punching out a part of the cathode substrate 201 by, for example, press molding. A plurality of holes 204 are formed in one cathode substrate 201. The hole 204 is formed in a part of the resist 202 in plan view. That is, each hole 204 penetrates the resist 202 and the cathode substrate 201 in the thickness direction. That is, the holes 204 are open to both the surface of the resist 202 formed on one surface of the cathode substrate 201 in the thickness direction and the surface of the resist 202 formed on the other surface of the cathode substrate 201 in the thickness direction.

Each of the plurality of holes 204 is a long hole extending along the first direction X. Each hole 204 is formed on a linear portion 212 extending along the first direction X. The dimension of each hole 204 in the second direction Y is smaller than the dimension of the linear portion 212 in the second direction Y. Each hole 204 is formed on the intersection P of the linear portion 212 and the linear portion 222. Among the plurality of holes 204, most of the holes 204 are formed so as to span two intersections P. Some of the holes 204 among the plurality of holes 204 are formed on one intersection P. In other words, the holes 204 located at the ends of the cathode assembly 200 in the first direction X are formed on one intersection P, and the other holes 204 are formed so as to span two intersections P. Ru.

The plurality of holes 204 are arranged such that two holes 204 adjacent to each other in the second direction Y are shifted at a predetermined pitch in the first direction X when viewed from above. That is, the plurality of holes 204 lined up in the second direction Y are lined up so that the line connecting the centers of each hole 204 forms a zigzag pattern in plan view, and the plurality of holes 204 lined up in the second direction Y are lined up in a straight line. Not lined up. That is, in plan view, the ends of the two holes 204 adjacent in the second direction Y face each other in the first direction X. In other words, in plan view, the two holes 204 that are adjacent in the second direction Y do not face each other at their centers in the first direction X. The plurality of holes 204 include a third hole 205 and a fourth hole 206. In the plan view of FIG. 2C, the third hole 205 is located on an even-numbered linear portion 212 among the plurality of linear portions 212 counting from one end side in the second direction Y (the upper part of FIG. 2C). is formed. In the plan view of FIG. 2C, the fourth hole 206 is located on the odd-numbered linear portion 212 among the plurality of linear portions 212 when counted from one end side in the second direction Y (the upper part of FIG. 2C). is formed.

(2-3) Cathode Assembly A cathode assembly 200 as shown in FIG. 2C is formed by performing the above resist forming process and hole forming process. In the cathode assembly 200, the plurality of cathode bodies 20 are two-dimensionally arranged along one surface of the cathode body 20 so as to be lined up in both a first direction X and a second direction Y that are orthogonal to each other. That is, in the cathode assembly 200, a grid-like resist 202 is formed with linear portions 212 extending along the first direction X and linear portions 222 extending along the second direction Y. A portion surrounded by the linear portions 222 adjacent in the first direction X and the linear portions 212 adjacent in the second direction Y is formed as one cathode body 20. Therefore, a plurality of cathode bodies 20 are formed in the cathode assembly 200, and the plurality of cathode bodies 20 are formed side by side in both the first direction X and the second direction Y.

Each of the plurality of cathode bodies 20 has an anode section 23 and a cathode section 24. The anode portion 23 is an end portion of the solid electrolytic capacitor 1 on the side where an electrode serving as an anode is formed. The cathode portion 24 is an end portion of the solid electrolytic capacitor 1 on the side where an electrode serving as a cathode is formed. In the cathode assembly 200, the positions of the anode part 23 and the cathode part 24 of the cathode bodies 20 adjacent to each other in a direction parallel to one surface of the cathode assembly 200 are reversed. That is, each cathode body 20 has an anode part 23 and a cathode part 24, and the positions of the anode part 23 and the cathode part 24 of adjacent cathode bodies 20 are opposite in plan view.

Each cathode body 20 has an anode portion 23 at one end in a direction parallel to the second direction Y, and a cathode portion 24 at the other end in a direction parallel to the second direction Y. There is. That is, in each cathode body 20, one of the ends aligned in the direction parallel to the second direction Y is formed as the anode section 23, and the other end is formed as the cathode section 24. In the cathode bodies 20 adjacent in the first direction ). Similarly, in the cathode bodies 20 adjacent in the first direction opposite). Therefore, in the cathode bodies 20 adjacent in the first direction X, the anode portion 23a of one cathode body 20a is adjacent to the cathode portion 24b of the other cathode body 20b. Furthermore, among the cathode bodies 20 that are adjacent to each other in the first direction X, the cathode portion 24a of one cathode body 20a is adjacent to the anode portion 23b of the other cathode body 20b.

One hole 104 is formed in the anode portion 23 of each cathode body 20 . The cathode portion 24 of each cathode body 20 is formed with corresponding ends of two holes 104 aligned in the first direction X.

A resist 202 is formed at the opening edge of at least one of the holes 204 of the cathode assembly 200 . That is, the resist 202 is formed so as to surround the hole 204 in plan view. When the resist 202 is formed only on one side of the cathode assembly 200 in the thickness direction, the resist 202 is formed at the opening edge of the hole 204 on that one side.

Cathode assembly 200 has holes 204 filled with resin 50. In other words, the holes 204 of the cathode assembly 200 are filled with the resin 50 by a resin sealing process described below. In this case, the resin 50 flows into the inside of the hole 204 from the opening of the hole 204 formed in the resist 202 and is filled.

(3) Lamination process The lamination process is a process of forming a plurality of laminates 30 including a plurality of capacitor elements 10 stacked in the thickness direction by stacking a plurality of element assemblies 100 in the thickness direction of the capacitor element 10. include. That is, the lamination process includes a process of forming a laminated body 30 in which a plurality of capacitor elements 10 including dielectric layers 12 are laminated in a facing manner. The element assembly 100 includes a plurality of capacitor elements 10. Further, the cathode assembly 200 includes a plurality of cathode bodies 20. Therefore, in the lamination process, by laminating a plurality of element assemblies 100 and a plurality of cathode assemblies 200 such that each capacitor element 10 and each cathode body 20 face each other in the thickness direction, a plurality of laminates 30 can be formed in a state where they are connected in the first direction X and the second direction Y.

Further, the lamination step includes a step of forming a cathode body 20 serving as a cathode between capacitor elements 10 adjacent in the thickness direction. In other words, the lamination step includes a step of providing a cathode body 20 serving as a cathode between the capacitor elements 10 facing each other.

Therefore, as shown in FIGS. 3A to 3C, in the lamination process, a plurality of element assemblies 100 and a plurality of cathode assemblies 200 are alternately laminated. Before this lamination, a polymer layer 40 made of conductive polymer is formed on the surface of the element assembly 100. Further, the element assembly 100 and the cathode assembly 200, which are stacked next to each other, are aligned so that the capacitor element 10 and the cathode body 20 face each other. Further, the capacitor element 10 and the cathode body 20 are arranged such that the anode part 13 of the capacitor element 10 and the anode part 23 of the cathode body 20 face each other, and the cathode part 14 of the capacitor element 10 and the cathode part 24 of the cathode body 20 face each other. are facing each other. That is, in plan view, the capacitor element 10 and the cathode body 20 are at the same position.

In the lamination process, the holes 104 of the element assembly 100 and the holes 204 of the cathode assembly 200 are arranged so that at least a portion thereof overlaps in the thickness direction. That is, in plan view, a portion of the hole 104 of the element assembly 100 and a portion of the hole 204 of the cathode assembly 200 are located at the same position. In this case, the end of the first hole 105 of the element assembly 100 in the first direction X and the end of the fourth hole 206 of the cathode assembly 200 in the first direction X overlap in the thickness direction. will be placed in Further, the end portion of the second hole 106 of the element assembly 100 in the first direction X and the end portion of the third hole 205 of the cathode assembly 200 in the first direction X are arranged so as to overlap in the thickness direction. be done.

In short, two first holes 105 are formed on one side of one capacitor element 10 in the second direction Y (see FIG. 1C). Further, a fourth hole 206 is formed on one side of one cathode body 20 in the second direction Y (see FIG. 2C). Then, when the capacitor element 10 and the cathode body 20 are overlapped in the thickness direction, the end of one of the two first holes 105 and the end of both ends of the fourth hole 206 One end overlaps in the thickness direction. Further, the end of the other of the two first holes 105 and the other end of both ends of the fourth hole 206 overlap in the thickness direction.

A second hole 106 is formed on the other side of one capacitor element 10 in the second direction Y (see FIG. 1C). Furthermore, two third holes 205 are formed on the other side of one cathode body 20 in the second direction Y (see FIG. 2C). Then, when the capacitor element 10 and the cathode body 20 are overlapped in the thickness direction, the end of one of the two third holes 205 and the end of the second hole 106 are overlapped in the thickness direction. One end overlaps in the thickness direction. Further, the end of the other of the two third holes 205 and the other end of both ends of the second hole 106 overlap in the thickness direction.

In the lamination process, the lattice-shaped resist 102 of the element assembly 100 and the lattice-shaped resist 202 of the cathode assembly 200 are arranged so that at least a portion thereof overlaps in the thickness direction. That is, in plan view, the resist 102 of the element assembly 100 and the resist 202 of the cathode assembly 200 are at the same position. Therefore, the linear portions 112 of the resist 102 and the linear portions 212 of the resist 202 are arranged so as to overlap in the thickness direction. Furthermore, the linear portions 122 of the resist 102 and the linear portions 222 of the resist 202 are arranged so as to overlap in the thickness direction.

In the stacking step, the plurality of element assemblies 100 are stacked on the substrate 60. That is, in the lamination step, a plurality of element assemblies 100 and a plurality of cathode assemblies 200 are alternately laminated on the substrate 60. The substrate 60 is formed into a rectangular shape when viewed from above. As the substrate 60, an electrically insulating substrate including a glass cloth epoxy resin impregnated base material is used.

In the lamination process, the plurality of element assemblies 100 and the plurality of cathode assemblies 200 may be bonded together with adhesive 41. Further, in the lamination process, the cathode portion 14 of the capacitor element 10 and the cathode body 20 are connected via carbon paste. That is, the carbon paste connects the cathode section 14 of the capacitor element 10 and the cathode section 24 of the cathode body 20.

(4) First resin sealing process As shown in FIGS. 4A and 4B, the first resin sealing process includes a process of molding a plurality of stacked element assemblies 100 with resin 50. That is, the first resin sealing step is a step of sealing the stacked plurality of element assemblies 100 and plurality of cathode assemblies 200 with the resin 50. Such a molding step is performed at least twice, before and after the step of forming grooves, which will be described later. That is, the first resin sealing step is resin sealing performed before the step of forming the groove.

The first resin sealing step is performed, for example, by molding a resin 50 such as epoxy resin by transfer molding or the like. The resin 50 may contain filler. In the first resin sealing step, the plurality of element assemblies 100 and the plurality of cathode assemblies 200 in a stacked state are covered with resin 50. That is, the plurality of element assemblies 100 and the plurality of cathode assemblies 200 are stacked and their end surfaces (peripheral surfaces) are covered with the resin 50. Further, the upper surface of the cathode assembly 200 stacked at the top (the farthest position from the substrate 60) is also covered with the resin 50.

Further, in the first resin sealing step, the holes 104 and 204 are filled with the resin 50. In other words, the first hole 105 and the second hole 106 of the element assembly 100 and the third hole 205 and the fourth hole 206 of the cathode assembly 200 are filled with the resin 50. The resin 50 flows into and fills the plurality of holes 104 and the plurality of holes 204 that overlap in the thickness direction of the capacitor element 10 . That is, in the anode part 13 of the capacitor element 10 and the anode part 23 of the cathode body 20, the plurality of first holes 105 and the plurality of fourth holes 206 overlap in the thickness direction, so that the plurality of first holes 105 and the plurality of fourth holes 206 are filled with resin 50 . Further, in the cathode section 14 of the capacitor element 10 and the cathode section 24 of the cathode body 20, the plurality of second holes 106 and the plurality of third holes 205 overlap in the thickness direction, so that the plurality of second holes 106 and the plurality of third holes 205 are filled with resin 50.

(5) First dicing process As shown in FIGS. 5A and 5B, in the first dicing process, the element assembly 100 is cut leaving a part of the thickness of the substrate 60 to form the groove 70. Including process. That is, it includes a step of cutting the plurality of element assemblies 100 and the plurality of cathode assemblies 200 stacked in the stacking process and forming grooves 70 like cuts at the cutting positions. Further, in the first dicing step, the substrate 60 is cut so as not to be divided into parts. That is, the groove 70 is formed to reach the substrate 60, but does not reach the back surface of the substrate 60 (the surface on which the element assembly 100 and the cathode assembly 200 are not stacked). The groove 70 is formed to reach a part of the thickness of the substrate 60 (for example, half the thickness of the substrate 60). Therefore, the bottom surface 71 of the groove 70 is formed within the thickness of the substrate 60.

The groove 70 is formed along the second direction Y. That is, the stacked plurality of element assemblies 100, plurality of cathode assemblies 200, and substrate 60 are cut along the cut line C1 shown by the arrow in FIG. 5A. Further, the groove 70 is formed over the entire length of the stacked plurality of element assemblies 100 and the plurality of cathode assemblies 200 in the second direction Y. That is, the groove 70 is open to both end faces of the plurality of element assemblies 100 and the plurality of cathode assemblies 200 perpendicular to the second direction Y. Furthermore, the groove 70 is formed along the linear portion 122 of the resist 102 extending along the second direction Y and the linear portion 222 of the resist 202 extending along the second direction Y. That is, the plurality of element assemblies 100, the plurality of cathode assemblies 200, and the substrate 60 are cut to form the groove 70 at a position where the linear portions 122 and the linear portions 222 overlap in plan view.

Then, both side surfaces of the stacked body 30 are exposed by the groove 70. Both side surfaces of the laminate 30 are two end surfaces aligned in the first direction X. That is, the side surface of the laminate 30 formed by overlapping the capacitor element 10 and the cathode body 20 in the thickness direction is exposed as the inner surface 72 of the groove 70 . The inner surface 72 is located above the bottom surface 71 and is aligned in the first direction X. Further, the opening facing the bottom surface 71 of the groove 70 is formed in the surface of the resin 50 covering the upper surface of the laminate 30 (the surface opposite to the substrate 60).

The plurality of element assemblies 100 and the plurality of cathode assemblies 200 in a stacked state are cut by, for example, dicing. Further, a dicing blade such as a diamond blade can be used for dicing. In the first dicing step, for example, a dicing tape 501 is placed on a dicing ring 500, and a substrate 60, a plurality of element assemblies 100, and a plurality of cathode assemblies 200 are laminated on the dicing tape 501. do.

(6) Second resin sealing process As shown in FIGS. 6A and 6B, the second resin sealing process is a molding process after the process of forming the grooves 70. Filled inside. The second resin sealing process is resin sealing performed after the process of forming the groove 70. The second resin sealing step is performed, for example, by molding resin 51 such as epoxy resin by transfer molding or the like. The resin 51 may contain filler. In the second resin sealing step, the outside of the resin 50 covering the plurality of element assemblies 100 and the plurality of cathode assemblies 200 in a stacked state is further covered with a resin 51. Further, the resin 51 enters into the groove 70, and the groove 70 is filled with the resin 51. The resin 51 is formed to protect the side and top surfaces of the solid electrolytic capacitor 1.

(7) Second dicing process The second dicing process includes a process of forming an electrode to serve as a cathode or an anode on the end face of the laminate 30. That is, the second dicing step is a step of forming at least an electrode to serve as a cathode or an anode on the end face of the laminate 30, and as shown in FIG. 7A and FIG. This includes an electrode forming step of forming the formed body 80. That is, the second dicing step 2 includes a step of forming an electrode forming body 80 in which a plurality of laminates 30 are connected, and forming an electrode to serve as a cathode or an anode on this electrode forming body 80.

In the step of forming the electrode formation body 80, the plurality of laminates 30 connected in both the first direction X and the second direction Y are cut along a cut line C2 along the first direction X. disconnect. Further, the cut line C2 is located at a position where the linear portion 112 of the resist 102 and the linear portion 212 of the resist 202 overlap in the thickness direction. Therefore, the step of exposing at least one end surface of the laminate 30 includes the step of cutting at the position of the hole 104 on the cut line C2. Thereby, the stacked body 30 exposes two adjacent end faces in a plan view. That is, each end face of the stacked bodies 30 adjacent in the second direction Y is exposed, but the end face 33 of one stacked body 30 is an end face that becomes an anode, and the end face 34 of the other stacked body 30 is an end face that becomes a cathode. is exposed.

The second dicing step partially includes a step of dividing into pieces. The step of separating into pieces includes a step of cutting the element assembly 100 and the cathode assembly 200 at the positions of the holes 104 of the element assembly 100 and the holes 204 of the cathode assembly 200. That is, in the second dicing step, a plurality of electrode formation bodies 80 are formed by cutting. The second dicing step further includes a step of cutting the stacked body 30 at a position away from the edges of the holes 104 and 204. That is, when cutting the laminate 30, the opening edges of the first hole 105, second hole 106, third hole 205, and fourth hole 206 remain. As a result, the end face of the anode-side conductive portion 11 of the capacitor element 10 is exposed at the end face 33 of the laminate 30 that becomes the anode, and the end face of the cathode substrate 201 of the cathode body 20 is not exposed. Further, at the end face 34 of the laminate 30 that becomes the cathode, the end face of the anode-side conductive portion 11 of the capacitor element 10 is not exposed, but the end face of the cathode substrate 201 of the cathode body 20 is exposed.

In the second dicing process, a dicing blade such as a diamond blade is used as in the first dicing process, but the dicing blade has a width dimension (dimension in the first direction X) that is larger than that in the first dicing process. A small one is used. In addition, the second dicing process is performed by placing the dicing tape 501 on the dicing ring 500 in the same way as the first dicing process, but the dicing blade 502 extends from the top surface of the resin 51 to the dicing tape 501. It is cut into a plurality of electrode formation bodies 80 in such a manner that the electrode formation bodies 80 reach each other.

(8) First electrode layer forming step In the first electrode layer forming step, first electrode layers 90, 91, which are metal layers, are applied to the electrodes that will become the cathode or anode of the electrode formed body 80 obtained in the second dicing step. This is the process of forming. In the first electrode layer forming step, the first electrode layers 90 and 91 may be formed by, for example, a plating method such as electroless plating or electrolytic plating, a vapor phase method such as a vapor deposition method or a sputtering method, or a cold spray method. can.

8A and 8B show an electroless plating method as the first electrode layer forming step. In this first electrode layer forming step, a plurality of electrode formation bodies 80 are collectively subjected to electroless plating. That is, electroless plating is performed by immersing a plurality of electrode formation bodies 80 in a plating bath 504 in a container 503. By this electroless plating, a first electrode layer 90 such as Ni (nickel) plating is formed on the end face of the anode-side conductive part 11 of the capacitor element 10 on the anode side of the laminate 30, and a cathode layer 90 on the cathode side of the laminate 30 is formed. A first electrode layer 91 such as Ni (nickel) plating is formed on the end surface of the cathode substrate 201 of No. 20. In this case, when forming the first electrode layers 90 and 91, Ni plating may be substituted after Zn (zinc) treatment. Note that the first electrode layers 90 and 91 can be formed not only as a single layer but also as a plurality of layers. In this case, the above-described plating method can be repeatedly performed, or a metal film can be further attached to the plated film formed by the plating method using another method (for example, a vapor deposition method).

(9) Third dicing step FIGS. 9A and 9B include a step of dividing the plurality of laminates 30 into individual pieces. That is, the electrode formed body 80 after the first electrode layer forming step is further cut into pieces. The step of singulating includes the step of cutting along the cut line C3 along the groove 70. That is, the electrode formation body 80 is cut into pieces along the longitudinal direction of the groove 70. The step of separating into pieces includes a step of cutting along a cut line C3 within the width of the groove 70. That is, although the groove 70 is filled with the resin 51, it is cut so that the resin 51 remains in the laminate 30.

In the third dicing process, a dicing blade such as a diamond blade is used in the same way as in the first and second dicing processes, but a dicing blade with a width dimension smaller than that in the first dicing process is used for dicing. Ru. In addition, the third dicing process is performed by placing the dicing tape 501 on the dicing ring 500 in the same way as the first and second dicing processes, but the dicing blade 505 moves the dicing tape 501 from the top surface of the resin 51. 501, and is cut into a plurality of laminates 30.

(10) Second electrode layer forming step As shown in FIGS. 10A and 10B and FIGS. 11A and 11B, in the second electrode layer forming step, at least an electrode serving as a cathode or an anode is formed on the end surfaces 33 and 34 of the laminate 30. It includes a step of forming. That is, an electrode serving as an anode is formed on one end face 33 of the laminate 30, and an electrode serving as a cathode is formed on the other end face 34 of the laminate 30. The electrode formed in this manner includes a current collecting structure in which both the electrode serving as a cathode and the electrode serving as an anode are joined to the exposed end surfaces 33 and 34 of the laminate 30. That is, on the end surface 33 of the laminate 30 on the anode side, the first electrode layer 90 is electrically connected to the first external electrode section 94 and the second external electrode section 96 to form a current collecting structure. . In addition, on the end surface 34 of the laminate 30 on the cathode side, the first electrode layer 91 is electrically connected to the first external electrode section 95 and the second external electrode section 97 to form a current collecting structure. The first external electrode parts 94, 95 and the second external electrode parts 96, 97 are each formed of a cured conductive paste such as Ag (silver) paste.

After forming the first external electrode parts 94 and 95 and the second external electrode parts 96 and 97 as described above, a surface electrode layer is formed on the laminate 30. The surface electrode layer includes first terminal layers 98, 99 formed on the outer surfaces of the second external electrode parts 96, 97, and second terminal layers 981, 991 formed on the outer surfaces of the first terminal layers 98, 99. It consists of The first terminal layers 98, 99 and the second terminal layers 981, 991 are each formed of a conductive metal layer.

The first terminal layers 98, 99 and the second terminal layers 981, 991 can be formed by, for example, a plating method such as electroless plating or electrolytic plating, a vapor phase method such as a vapor deposition method or a sputtering method, or a cold spray method. can. For example, when forming the first terminal layers 98, 99 and the second terminal layers 981, 991 by electrolytic plating, the first terminal layers 98, 99 are formed in a layered manner using, for example, Ni (nickel) plating. Further, the second terminal layers 981 and 991 are formed, for example, in a layered manner using Ni (nickel) plating or the like, or formed in a layered manner using tin (Sn) plating or the like. As shown in FIG. 11A, the electrolytic plating method is performed by, for example, placing a plurality of laminates 30 in a barrel 508 and rotating the barrel 508 in a plating bath 507 stored in a container 506 while applying electricity.

As described above, solid electrolytic capacitor 1 having a cross-sectional shape as shown in FIG. 11B is formed.

(Modified example)
The embodiment is only one of various embodiments of the present disclosure. The embodiments can be modified in various ways depending on the design, etc., as long as the objective of the present disclosure can be achieved.

In the above embodiment, the case where the capacitor elements 10 are laminated in three layers has been described, but the number of laminated capacitor elements 10 is not particularly limited, and depends on the performance such as the capacitance of the solid electrolytic capacitor to be manufactured. It can be set as appropriate. For example, as shown in FIGS. 12 and 13, a solid electrolytic capacitor in which eight layers of capacitor elements 10 are stacked may be used.

In the above embodiment, in the element assembly 100, a plurality of capacitor elements 10 are two-dimensionally arranged along one surface of the capacitor element 10 and lined up in both the first direction and the second direction that are orthogonal to each other. However, it is not limited to this. For example, the element assembly 100 may be formed by arranging a plurality of capacitor elements 10 so as to line up along one surface of the capacitor element 10 in one direction. In this case, in adjacent capacitor elements 10, the anode part 13 of one capacitor element 10 is connected to the cathode part 14 of the other capacitor element 10. Further, one capacitor element 10 may be formed in one element assembly 100.

The modification shown in FIG. 14 includes a laminate 30 having at least one capacitor element 10 including a dielectric layer. The laminate 30 has a structure in which a corner formed by two adjacent sides in a plan view is missing. That is, the first hole 105 in the element assembly 100 is formed to include the intersection of the linear portions 112 and 122 of the resist 102. Further, the third hole 205 in the cathode assembly 200 is formed to include the intersection of the linear portions 212 and 222 of the resist 202. Therefore, the position corresponding to the first hole 105 and the third hole 205 of the laminate 30, that is, the corner of the laminate 30 is missing.

15A to 15D and FIGS. 16A to 16C show modified examples of the element assembly 100 and modified examples of the cathode assembly 200. In these modified examples, the holes 104 of the element assembly 100 and the holes 204 of the cathode assembly 200, which overlap in the thickness direction, have different shapes. That is, in these modified examples, the shape and number of holes 104 and holes 204 are different from the element assembly 100 of FIG. 1C and the cathode assembly 200 of FIG. 2C, and the other configurations are the same as the embodiment. 15A to 15D and 16A to 16C show only a portion of the element assembly 100 and the cathode assembly 200, with one capacitor element 10 and one cathode body 20 located in the center of each portion. overlap each other in the thickness direction.

In the modification shown in FIG. 15A, one hole 114 is further formed between adjacent holes 104 in the first direction X in the element assembly 100. Further, in the cathode assembly 200, one hole 214 is further formed between the holes 204 adjacent in the first direction X. The hole 114 and the hole 214 are each formed in a circular shape in plan view.

In the modification shown in FIG. 15B, two holes 114 and two holes 214 similar to those shown in FIG. 15A are each formed side by side in the first direction X.

In the modified example of FIG. 15C, three holes 114 and three holes 214 similar to those in FIG. 15A are each formed in line in the first direction X.

In the modified example of FIG. 15D, holes 114 and holes 214 similar to those in FIG. 15A are each divided into two rows in the second direction Y, and a plurality (3 or 4) of holes are lined up in the first direction X in each row. It is formed like this. In this case, the number of cathodes or anodes of the solid electrolytic capacitors 1 formed adjacent to each other in the second direction Y can be made different.

In the modified example of FIG. 16A, the hole 114 and the hole 214 are each formed as a long hole extending in the second direction Y in plan view. Further, a plurality (four) of the holes 114 and the holes 214 are formed side by side between the holes 104 and the holes 204 that are adjacent to each other in the first direction X.

In the modification shown in FIG. 16B, the shapes of the holes 114 and holes 214 shown in FIGS. 15C, 15D, and 16A are formed in a mixed manner.

In the modification shown in FIG. 16C, the first hole 105 and the third hole 205 are formed into rectangular shapes extending along the first direction X in plan view. Further, the shapes of the second hole 106 and the fourth hole 206 are circular in plan view, and are formed at the intersection P position. By using the element assembly 100 and the cathode assembly 200 of this modification, the solid electrolytic capacitor 1 of the modification shown in FIG. 14 can be formed.

A modification of the first dicing process is shown in FIGS. 17A and 17B. In FIG. 5, a case has been described in which one groove 70 is formed, but two grooves 73 whose width dimension (dimension in the first direction X) is smaller than the groove 70 are formed side by side in the first direction X. Good too. In this case, a wall portion 74 is formed between adjacent grooves 73 in the first direction X. Alternatively, the wall portion 74 may be removed by cutting. Furthermore, the number of such grooves 73 is not limited to two, and three or more grooves may be formed in line in the first direction X.

When two grooves 73 are formed, two dicing blades 509 can simultaneously cut the stacked plurality of element assemblies 100 and plurality of cathode assemblies 200. Alternatively, two grooves 73 may be formed by cutting twice with one dicing blade 509. Further, when cutting twice with one dicing blade 509, the first cutting position and the second cutting position may be overlapped. In this case, one thick groove 70 as shown in FIG. 5B can be formed. As the dicing blade 509, a dicing having the same size (width dimension) as the dicing blade 502 used in the second dicing process can be used.

In the second dicing step, before forming the electrode formation body 80, marking is provided to provide a marker to enable confirmation of the position of at least one of the cathode and anode of the solid electrolytic capacitor 1, that is, the orientation of the solid electrolytic capacitor 1. may be performed after the second resin sealing step. Marking may be performed for each electrode formation body 80 or for each laminated body 30 (finally formed into one solid electrolytic capacitor 1). The marker can be applied by any method such as printing or engraving. Furthermore, the markings can be made of characters such as symbols, alphanumeric characters, kanji, and hiragana.

In the above embodiment, the order of the second dicing process (see FIGS. 7A and 7B), the first electrode layer forming process (see FIG. 8A), and the third dicing process (see FIGS. 9A and 9B) (see FIGS. 9A and 9B) (in this order), but it is not limited to this. For example, the second dicing step, the third dicing step, and the first electrode layer forming step may be performed in this order (second order). In the case of the first order, the first electrode layer forming step can be performed using the electrode forming body 80 including the plurality of laminates 30, which is efficient. On the other hand, in the case of the second order, the steps common to the second dicing step and the third dicing step (a series of steps of pasting, cutting, and peeling off the dicing tape 501) can be omitted.

In the embodiment described above, one plating layer is formed in the first electrode layer forming step, but a plurality of plating layers may be formed. In the case of multiple plating layers, the composition and type of plating in each layer may be the same or different. Further, instead of electroless plating, the metal film may be formed by a sputtering method, a cold spray method, or the like.

The substrate 60 is not limited to one formed of a glass cloth epoxy resin-impregnated base material, and a substrate 60 made of electrically insulating resin, ceramic, or the like can be used. Further, the substrate 60 is not essential and may be omitted.

In the embodiment described above, in a state in which a plurality of laminates 30 are connected (the state shown in FIG. 3A), the plurality of laminates 30 lined up in the second direction Y are formed so that the anodes and cathodes alternate. However, it is not limited to this. That is, the plurality of laminates 30 arranged in the second direction Y may have the same anode and cathode. However, when the anode and cathode alternate as in the embodiment, the anode and cathode can be formed at the same time by cutting adjacent laminates 30 into individual pieces, which is easy to manufacture. .

(summary)
As explained above, the method for manufacturing the solid electrolytic capacitor (1) according to the first aspect includes the steps of forming an element assembly (100), forming a plurality of laminates (30), and singulating. and a step of doing so. The step of forming an element assembly (100) is to form an element assembly (100) in which a plurality of foil-shaped capacitor elements (10) having a dielectric layer (12) are connected in a direction parallel to one surface of the capacitor element (10). 100). The step of forming a plurality of laminates (30) includes a plurality of capacitor elements (10) stacked in the thickness direction by stacking a plurality of element assemblies (100) in the thickness direction of the capacitor element (10). A plurality of laminates (30) are formed. In the step of singulating, the plurality of laminates (30) are singulated into individual laminates (30).

According to this aspect, there is an advantage that a plurality of laminates (30) can be handled in a connected state, and productivity can be improved.

A method for manufacturing a solid electrolytic capacitor (1) according to a second aspect is the first aspect, in which in each element assembly (100), a plurality of capacitor elements (10) are arranged on one side of the capacitor element (10). They are two-dimensionally arranged so as to be lined up in both a first direction (X) and a second direction (Y) which are along and orthogonal to each other.

According to this aspect, there is an advantage that a plurality of laminates (30) can be handled in a connected state in a two-dimensional arrangement, and productivity can be improved.

In the method for manufacturing a solid electrolytic capacitor (1) according to the third aspect, in the first or second aspect, each of the plurality of capacitor elements (10) has an anode part (13) and a cathode part (14). In the element assembly (100), the positions of the anode part (13) and the cathode part (14) of adjacent capacitor elements (10) in a direction parallel to one surface of the element assembly (100) are reversed.

According to this aspect, there is an advantage that a plurality of capacitor elements (10) can be efficiently formed in the element assembly (100), and productivity can be improved.

In the method for manufacturing a solid electrolytic capacitor (1) according to a fourth aspect, in any one of the first to third aspects, the element assembly (100) is divided by a resist (102).

According to this aspect, there is an advantage that a plurality of capacitor elements (10) partitioned by the resist (102) can be efficiently formed in the element assembly (100), and productivity can be improved. .

In the method for manufacturing a solid electrolytic capacitor (1) according to a fifth aspect, in any one of the first to fourth aspects, a cathode body (20) serving as a cathode is placed between adjacent capacitor elements (10) in the thickness direction. The method further includes the step of forming. A plurality of cathode bodies (20) are connected in a direction parallel to one surface of the cathode body (20) to form a cathode assembly (200).

According to this aspect, there is an advantage that a plurality of cathode bodies (20) can be handled as a cathode assembly (200) in a connected state, and productivity can be improved.

The method for manufacturing a solid electrolytic capacitor (1) according to the sixth aspect further includes the step of forming a resist (202) on the surface of the cathode assembly (200).

According to this aspect, there is an advantage that a plurality of cathode bodies (20) partitioned by the resist (202) can be efficiently formed in the cathode assembly (200), and productivity can be improved. .

In the method for manufacturing a solid electrolytic capacitor according to a seventh aspect, in the sixth aspect, the cathode assembly (200) is partitioned by a resist (202).

According to this aspect, there is an advantage that a plurality of cathode bodies (20) partitioned by the resist (202) can be efficiently formed in the cathode assembly (200), and productivity can be improved. .

In the method for manufacturing a solid electrolytic capacitor (1) according to an eighth aspect, in any one of the first to seventh aspects, a plurality of element assemblies (100) are stacked on a substrate (60); The method further includes the step of cutting the element assembly (100) leaving a portion of the thickness of the groove (70).

According to this aspect, even if the laminates (30) are cut by the grooves (70), the plurality of laminates (30) cut by the substrate (60) can be handled in a connected state, improving productivity. The advantage is that it can be done.

A method for manufacturing a solid electrolytic capacitor (1) according to a ninth aspect is a method for manufacturing a solid electrolytic capacitor (1) according to any one of the first to eighth aspects, in which a plurality of stacked element assemblies (100) are coated with resins (50) and (51). The method further includes a step of molding.

According to this aspect, there is an advantage that the plurality of laminates (30) included in the plurality of element assemblies (100) can be molded with the resin (50, 51), and productivity can be improved. .

In the method for manufacturing a solid electrolytic capacitor (1) according to a tenth aspect, in the ninth aspect, the molding step is performed at least twice, before and after the step of forming the groove (70).

According to this aspect, the laminate (30) can be reinforced in the step of molding the resin (50) before the step of forming the grooves (70), and the laminate (30) can be reinforced in the step of forming the grooves (70). 30) is advantageous in that damage can be reduced and productivity can be improved.

In the method for manufacturing a solid electrolytic capacitor (1) according to an eleventh aspect, in the tenth aspect, the resin (51) to be molded in the molding step after the step of forming the grooves (70) is Filled inside.

According to this aspect, there is an advantage that the surface of the laminate (30) exposed by the groove (70) can be covered with the resin (51), and the laminate (30) can be sealed.

In the method for manufacturing a solid electrolytic capacitor (1) according to a twelfth aspect, in any one of the eighth to eleventh aspects, the step of dividing into pieces includes cutting at a cut line (C2) along the groove (70). including the step of

According to this aspect, there is an advantage that cutting can be performed along the cut line (C2) along the groove (70), making it easier to cut each laminate (30).

In the method for manufacturing a solid electrolytic capacitor according to a thirteenth aspect, in any one of the eighth to twelfth aspects, the step of dividing into pieces includes cutting at a cut line (C2) within the width of the groove (70). Including process.

According to this aspect, there is an advantage that each laminate can be separated into individual pieces with the surface of the laminate (30) covered with the resin (51), and productivity can be improved.

In the method for manufacturing a solid electrolytic capacitor (1) according to a fourteenth aspect, in any one of the fifth to seventh aspects, the element assembly (100) and the cathode assembly (200) are each made of a resin (50). It has holes (104, 204) filled with.

According to this aspect, both the holes (104) of the element assembly (100) and the holes (204) of the cathode assembly (200) can be filled with the resin (50), and productivity can be improved. The advantage is that it can be done.

A method for manufacturing a solid electrolytic capacitor (1) according to a fifteenth aspect is a method for manufacturing a solid electrolytic capacitor (1) according to a fourteenth aspect, in which at least one of the holes (104) of the element assembly (100) and the holes (204) of the cathode assembly (200) is provided. A resist (102, 202) is formed at the edge of the opening.

According to this aspect, the opening edges of each of the hole (104) of the element assembly (100) and the hole (204) of the cathode assembly (200) can be formed with the resist (102, 202), and the It has the advantage that insulation can be improved.

In the method for manufacturing a solid electrolytic capacitor (1) according to a sixteenth aspect, in the fourteenth or fifteenth aspect, the hole (104) of the element assembly (100) and the hole (204) of the cathode assembly (200) are , are arranged so that at least a portion thereof overlaps in the thickness direction.

According to this aspect, the resin (50) can be easily filled into the holes (104) of the element assembly (100) and the holes (204) of the cathode assembly (200), and productivity can be improved. , there is an advantage.

In the method for manufacturing a solid electrolytic capacitor according to a seventeenth aspect, in the sixteenth aspect, the hole (104) of the element assembly (100) and the hole (204) of the cathode assembly (200) overlap in the thickness direction. Different shapes.

According to this aspect, electrical insulation between the capacitor element (10) and the cathode body (20) can be easily obtained due to the difference in shape between the holes (104) and the holes (204), and productivity can be improved. The advantage is that it can be done.

In the method for manufacturing a solid electrolytic capacitor (1) according to an eighteenth aspect, in any one of the fourteenth to seventeenth aspects, the step of dividing into pieces includes the step of separating the holes (104) of the element assembly (100) and the cathode assembly. The method includes cutting the element assembly (100) and the cathode assembly (200) at the position of the hole (204) in the body (200).

According to this aspect, electrical insulation between the capacitor element (10) and the cathode body (20) can be easily obtained by cutting the holes (104) and (204), and productivity can be improved. There is an advantage.

A method for manufacturing a solid electrolytic capacitor (1) according to a nineteenth aspect includes a step of forming a laminate (30), a step of exposing end surfaces (33, 34), and electrodes (90 to 99,981,991). A step of forming. In the step of forming the laminate (30), a laminate (30) is formed by stacking a plurality of capacitor elements (10) including dielectric layers (12) in a facing manner. The step of exposing the end surfaces (33, 34) exposes at least one end surface (33, 34) of the laminate (30). In the step of forming the electrodes (90 to 99,981,991), the electrodes (90 to 99,981,991), which serve as at least a cathode or an anode, are formed on the end faces (33, 34).

According to this aspect, the step of exposing the end surfaces (33, 34) of the laminate (30) in which a plurality of capacitor elements (10) are stacked facing each other, and the step of forming the electrodes (90 to 99,981,991). This has the advantage that productivity can be improved.

In the method for manufacturing a solid electrolytic capacitor (1) according to the 20th aspect, in the 19th aspect, the laminate (30) exposes two end surfaces (33, 34) adjacent to each other in plan view, and one end surface ( 33) are formed with electrodes (90, 94, 96, 98, 981) serving as anodes, and electrodes (91, 95, 97, 99, 991) serving as cathodes are formed on the other end surface (34).

According to this aspect, the electrodes (90, 94, 96, 98, 981) that will serve as anodes and the electrodes (91, 95, 97, 99, 991) that will serve as cathodes can be efficiently formed, improving productivity. The advantage is that it can be done.

A method for manufacturing a solid electrolytic capacitor (1) according to a twenty-first aspect includes an electrode (91, 95, 97, 99, 991) serving as a cathode and an electrode (90, 94, 96, 98, 981) both include current collecting structures joined to the exposed end faces (33, 34) of the laminate (30).

According to this aspect, the current collecting structure allows the electrodes (91, 95, 97, 99, 991) to become cathodes and the electrodes (90, 94, 96, 98, 981) to become anodes to be efficiently formed. This has the advantage that productivity can be improved.

A method for manufacturing a solid electrolytic capacitor (1) according to a twenty-second aspect, in any one of the nineteenth to twenty-first aspects, includes a cathode body (20) serving as a cathode between opposing capacitor elements (10).

According to this aspect, there is an advantage that a cathode can be easily formed from the cathode body (20), and productivity can be improved.

In the method for manufacturing a solid electrolytic capacitor (1) according to a twenty-third aspect, in the twenty-second aspect, the cathode body (20) is a flat metal foil having a carbon layer (203) or a titanium layer on the surface.

According to this embodiment, there is an advantage that the conductivity of the cathode can be improved by the carbon layer (203) or the titanium layer, and the ESR of the solid electrolytic capacitor (1) can be reduced.

In the method for manufacturing a solid electrolytic capacitor (1) according to a twenty-fourth aspect, in the twenty-second or twenty-third aspect, the cathode part (14) of the capacitor element (10) and the cathode body (20) are bonded to each other through carbon paste. connected.

According to this aspect, the cathode part (14) and the cathode body (20) can be bonded together using carbon paste, improving productivity and reducing ESR of the solid electrolytic capacitor (1). There are advantages.

The method for manufacturing a solid electrolytic capacitor according to the twenty-fifth aspect, in any one of the nineteenth to twenty-fourth aspects, further includes a step of molding the laminate (30) with a resin (50).

According to this aspect, there is an advantage that the laminate (30) can be molded with the resin (50), and productivity can be improved.

In the method for manufacturing a solid electrolytic capacitor (1) according to a twenty-sixth aspect, in the twenty-fifth aspect, the laminate (30) has holes (104, 204) filled with the resin (50).

According to this aspect, there is an advantage that both the holes (104, 204) of the laminate (30) can be filled with the resin (50), and productivity can be improved.

The method for manufacturing a solid electrolytic capacitor (1) according to the twenty-seventh aspect, in the twenty-sixth aspect, further includes the step of cutting the laminate (30) at a position away from the edge of the hole (104, 204).

According to this aspect, there is an advantage that the step of forming the layers (90 to 99, 981, 991) to become electrodes can be easily performed, and productivity can be improved.

In the method for manufacturing a solid electrolytic capacitor (1) according to a twenty-eighth aspect, in any one of the nineteenth to twenty-seventh aspects, the step of forming at least an electrode serving as a cathode or an anode on the end face includes a plurality of laminates (30 ) includes a first electrode forming process of forming an electrode forming body (80) in a state where the electrode forming bodies (80) are connected, and a second plating process of plating a plurality of electrode forming bodies (80) at once.

According to this aspect, there is an advantage that a plurality of electrode formation bodies (80) can be plated at once, and productivity can be improved.

A solid electrolytic capacitor (1) according to a twenty-ninth aspect includes a laminate (30) having at least one capacitor element (10) including a dielectric layer (12). The laminate (30) has a structure in which a corner formed by two adjacent sides in a plan view is missing.

According to this aspect, there is an advantage that the step of forming the laminate (30) can be easily performed and productivity can be improved. Additionally, the lack of corners of the laminate (30) has the advantage that stress from the exterior resin covering the laminate (30) is alleviated, improving the reliability of the solid electrolytic capacitor (1). be.

1 Solid electrolytic capacitor 10 Capacitor element 12 Dielectric layer 20 Cathode body 30 Laminated body 50 Resin 51 Resin 60 Substrate 70 Groove 100 Element assembly 104 Hole 200 Cathode assembly 204 Hole X First direction Y Second direction C2 Cut line

Claims (15)

forming an element assembly in which a plurality of foil-shaped capacitor elements having a dielectric layer are connected in a direction parallel to one surface of the capacitor element;
forming a plurality of laminates including a plurality of capacitor elements stacked in the thickness direction by stacking a plurality of the element aggregates in the thickness direction of the capacitor element;
A step of dividing the plurality of laminates into individual pieces for each laminate ,
further comprising a step of forming a cathode body serving as a cathode between the capacitor elements adjacent in the thickness direction,
The cathode body forms a cathode assembly in which a plurality of cathode bodies are connected in a direction parallel to one surface of the cathode body,
further comprising the step of forming a resist on the surface of the cathode assembly,
the cathode assembly is partitioned by the resist;
Method of manufacturing solid electrolytic capacitors. In each of the element aggregates, the plurality of capacitor elements are two-dimensionally arranged along one surface of the capacitor element so as to be lined up in both a first direction and a second direction that are perpendicular to each other.
A method for manufacturing a solid electrolytic capacitor according to claim 1. Each of the plurality of capacitor elements has an anode part and a cathode part,
In the element assembly, the positions of the anode portion and the cathode portion of adjacent capacitor elements in a direction parallel to one surface of the element assembly are reversed;
A method for manufacturing a solid electrolytic capacitor according to claim 1 or 2. the element assembly is partitioned by a resist,
A method for manufacturing a solid electrolytic capacitor according to any one of claims 1 to 3. The method further includes the step of stacking the plurality of element assemblies on a substrate, and cutting the element assemblies leaving a part of the thickness of the substrate to form a groove.
A method for manufacturing a solid electrolytic capacitor according to any one of claims 1 to 4. further comprising the step of molding the plurality of stacked element assemblies with resin;
A method for manufacturing a solid electrolytic capacitor according to any one of claims 1 to 5. further comprising the step of molding the plurality of stacked element assemblies with resin,
The molding step is performed at least twice before and after the groove forming step.
The method for manufacturing a solid electrolytic capacitor according to claim 5 . After the step of forming the groove, the resin to be molded in the molding step is filled into the groove.
The method for manufacturing a solid electrolytic capacitor according to claim 7 . The step of dividing into pieces includes the step of cutting along the grooves,
The method for manufacturing a solid electrolytic capacitor according to claim 5 . The step of dividing into pieces includes the step of cutting along a cut line within the width of the groove.
The method for manufacturing a solid electrolytic capacitor according to claim 5 . further comprising the step of molding the plurality of stacked element assemblies with resin,
The element assembly and the cathode assembly each have a hole filled with the resin,
A method for manufacturing a solid electrolytic capacitor according to claim 1 . a resist is formed on an opening edge of at least one of the hole of the element assembly and the hole of the cathode assembly;
The method for manufacturing a solid electrolytic capacitor according to claim 11 . The hole of the element assembly and the hole of the cathode assembly are arranged so that at least a portion thereof overlaps in the thickness direction,
The method for manufacturing a solid electrolytic capacitor according to claim 11 or 12 . The pores of the element assembly and the pores of the cathode assembly, which overlap in the thickness direction, have different shapes;
The method for manufacturing a solid electrolytic capacitor according to claim 13 . The step of separating into pieces includes the step of cutting the element assembly and the cathode assembly at the positions of the holes of the element assembly and the holes of the cathode assembly.
The method for manufacturing a solid electrolytic capacitor according to any one of claims 11 to 14 .

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