JP7208495B2 - Light source device - Google Patents

Description

The present disclosure relates to a light source device.

Patent Document 1 discloses a light source device including a substrate and a plurality of light emitting devices arranged on the substrate.

JP 2010-225842 A

However, in the light source device of Patent Document 1, the fixing strength between the light emitting device and the substrate may be insufficient.

Accordingly, an object of one embodiment of the present invention is to provide a light source device in which the bonding strength between the light emitting device and the substrate is improved.

A light source device according to an embodiment of the present invention includes a mounting substrate having a pair of first wirings and a pair of second wirings adjacent to the pair of first wirings on the upper surface, a first upper surface serving as a light emitting surface, and a first upper surface. and a first side surface connected to the first upper surface and the first lower surface, the first lower surface being the upper surface of the pair of first wirings. a first light emitting device arranged to face each other; a second upper surface serving as a light emitting surface; a second lower surface located opposite to the second upper surface and having a pair of second electrodes arranged thereon; a second light emitting device having a second side surface connected to two lower surfaces and arranged so that the second lower surface faces the upper surfaces of the pair of second wirings; a pair of first electrodes and a pair of first wirings; arranged between a pair of first conductive members for electrically connecting the pair of first electrodes and the pair of first wirings, and between the pair of second electrodes and the pair of second wirings, a pair of second conductive members electrically connecting the pair of second electrodes and the pair of second wirings, wherein the first light emitting device and the second light emitting device have the first side face facing the second side face; A first adhesive member is arranged between the first side surface and the second side surface and is in contact with both the first light emitting device and the second light emitting device, and the first adhesive member is arranged between the pair of first wirings or the pair of second wirings. Between the wirings, a second adhesive member is arranged in contact with the first lower surface of the first light emitting device or the second lower surface of the second light emitting device and separated from the first adhesive member.

A light source device according to one embodiment of the present invention includes a mounting substrate having a pair of first wirings and a pair of second wirings adjacent to the pair of first wirings on the upper surface, a first front surface serving as a light emitting surface, and a first front surface. and a first side surface connected to the first front surface and the first bottom surface, the first bottom surface being opposed to the top surfaces of the pair of first wirings. a first light-emitting device arranged in the first light-emitting device, a second front surface serving as a light-emitting surface, a second lower surface orthogonal to the second front surface and having a pair of second electrodes arranged thereon, and a second surface connecting the second front surface and the second lower surface a second light emitting device having two side surfaces and arranged such that the second lower surface faces the upper surfaces of the pair of second wirings; and the pair of first electrodes and the pair of first wirings; a pair of first conductive members electrically connecting the pair of first electrodes and the pair of first wirings; a pair of second conductive members electrically connecting the pair of second wirings, wherein the first light emitting device and the second light emitting device are arranged such that the first side face and the second side face face each other; Between the first side surface and the second side surface, a first adhesive member is arranged in contact with both the first light emitting device and the second light emitting device, and between the pair of first wirings or between the pair of second wirings, A second adhesive member is disposed in contact with the first lower surface of the first light emitting device or the second lower surface of the second light emitting device and separated from the first adhesive member.

According to one embodiment of the present invention, it is possible to provide a light source device with improved fixing strength between the light emitting device and the substrate.

1 is a schematic top view of a light source device according to Embodiment 1. FIG. 1 is a schematic side view of a light source device according to Embodiment 1. FIG. 1 is a schematic top view of a mounting substrate according to Embodiment 1. FIG. 1 is a schematic perspective view of a light emitting device according to Embodiment 1. FIG. 1 is a schematic perspective view of a light emitting device according to Embodiment 1. FIG. 1 is a schematic top view of a light emitting device according to Embodiment 1. FIG. 2 is a schematic bottom view of the light emitting device according to Embodiment 1. FIG. 3E is a schematic end view along line 3E-3E in FIG. 3C; FIG. It is a schematic top view which shows the process of arrange|positioning a conductive material and a resin material. It is a schematic top view which shows the process of arrange|positioning a conductive material and a resin material. It is a schematic top view which shows the process of arrange|positioning a conductive material and a resin material. It is a schematic top view which shows the process of arrange|positioning a conductive material and a resin material. FIG. 10 is a schematic side view of a light source device according to Embodiment 2; 3 is a schematic top view of a light emitting device according to Embodiment 2. FIG. 3 is a schematic bottom view of a light emitting device according to Embodiment 2. FIG. FIG. 10 is a schematic side view of a light emitting device according to Embodiment 2; FIG. 11 is a schematic top view of a light source device according to Embodiment 3; FIG. 11 is a schematic side view of a light source device according to Embodiment 3; FIG. 11 is a schematic perspective view of a light emitting device according to Embodiment 3; FIG. 11 is a schematic perspective view of a light emitting device according to Embodiment 3;

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The following embodiments are examples, and the light source device according to the present disclosure is not limited to the following embodiments. For example, numerical values, shapes, materials, etc. shown in the following embodiments are merely examples, and various modifications are possible as long as there is no technical contradiction.

The dimensions, shapes, etc. of the components shown in the drawings may be exaggerated for clarity, and may not reflect the dimensions, shapes, and size relationships between the components in the actual light source device. Also, some elements may be omitted to avoid over-complicating the drawing.

In the following description, constituent elements having substantially the same functions are denoted by common reference numerals, and their description may be omitted. The following description may use terms (eg, "upper", "lower" and other terms that include those terms) that indicate particular directions or positions. However, these terms are used only for clarity of relative orientation or position in the referenced drawings. If the relative direction or positional relationship of terms such as “upper” and “lower” in the referenced drawings is the same, drawings other than the present disclosure, actual products, manufacturing equipment, etc. are the same as the referenced drawings. It does not have to be placement.

(Embodiment 1)
1A is a schematic top view of the light source device 500, and FIG. 1B is a schematic side view of the light source device 500. FIG. FIG. 1B is a diagram of the light source device 500 viewed from the direction D shown in FIG. 1A. A light source device 500 according to Embodiment 1 includes a mounting board 50 and a first light emitting device 11 and a second light emitting device 12 arranged on the mounting board 50 . Also, the first light emitting device 11 and the second light emitting device 12 are attached to the upper surface 50 a of the mounting board 50 by the pair of first conductive members 5 , the pair of second conductive members 6 , the first adhesive member 7 and the second adhesive member 8 . be adhered.
Each member will be described in detail with reference to FIGS. 2 to 3E.

[Mounting board 50]
FIG. 2 is a schematic top view of the mounting substrate 50. FIG. FIG. 2 is a diagram of the light source device 500 shown in FIG. 1A with the light emitting device, the conductive member, and the adhesive member omitted. The mounting substrate 50 has a pair of first wirings 51 and a pair of second wirings 52 adjacent to the pair of first wirings 51 on the upper surface 50a. A plurality of light emitting devices are arranged on the upper surface 50a of the mounting substrate 50, and power is supplied to the light emitting devices through wiring. The mounting board 50 is, for example, an elongated member having a longitudinal direction and a lateral direction. A plurality of light emitting devices are preferably arranged on the mounting board 50 along the longitudinal direction of the mounting board 50 . In addition to the pair of first wirings 51 and the pair of second wirings 52, the mounting substrate 50 can include one or more wirings.

[First Light Emitting Device 11, Second Light Emitting Device 12]
3A is a schematic perspective view of the light emitting device (the first light emitting device 11 and the second light emitting device 12) viewed from above, FIG. 3B is a schematic perspective view of the light emitting device viewed from the bottom, and FIG. 3C. is a schematic top view of the light emitting device, FIG. 3D is a schematic bottom view of the light emitting device, and FIG. 3E is a schematic end view taken along line 3E-3E in FIG. 3C. The first light emitting device 11 and the second light emitting device 12 function as light sources of the light source device 500 . The first light emitting device 11 and the second light emitting device 12 can be light emitting devices having the same structure. The first light emitting device 11 is arranged on the pair of first wirings 51 of the mounting substrate 50 , and the second light emitting device 12 is arranged on the pair of second wirings 52 of the mounting substrate 50 . The light source device 500 can include another light emitting device in addition to the first light emitting device 11 and the second light emitting device 12 . In Embodiment 1, the first light emitting device 11 and the second light emitting device 12 are top emission type (top view type) light emitting devices that emit light from the upper surface.

Each light emitting device can be a substantially rectangular parallelepiped light emitting device having a pair of long sides and a pair of short sides. Each light emitting device is arranged, for example, so that the long side surfaces of each light emitting device are parallel to the longitudinal direction of the mounting substrate 50, and the short side surfaces of each light emitting device are arranged to face each other. Thereby, the light source device 500 can be made thin.

The first light-emitting device 11 and the second light-emitting device 12 each include a light-emitting element 1 and a light reflecting member 30 that covers the side surface of the light-emitting element 1 and efficiently reflects the light from the light-emitting element 1 . The light-emitting element 1 includes a semiconductor laminated structure 1b including a light-emitting layer, and an element electrode 1c connected to the semiconductor laminated structure 1b. The light emitting device 1 can further include a translucent substrate 1a. The light reflecting member 30 may be in direct contact with the side surface of the light emitting element 1, or may indirectly cover the side surface of the light emitting element 1 via another member. 3A and 3B, the light reflecting members 30 are positioned on the top surface, the bottom surface, and the outer surfaces of the first light emitting device 11 and the second light emitting device 12, respectively. The light reflecting member 30 is made of, for example, a resin material whose base material is epoxy resin or silicone resin.

The first light emitting device 11 includes a first upper surface 11a that serves as a light emitting surface, a first lower surface 11b that is located on the opposite side of the first upper surface 11a and on which a pair of first electrodes 15 are arranged, the first upper surface 11a and the first It has a first side surface 11c that connects with the lower surface 11b. The second light emitting device 12 includes a second upper surface 12a that serves as a light emitting surface, a second lower surface 12b that is located on the opposite side of the second upper surface 12a and on which a pair of second electrodes 16 are arranged, the second upper surface 12a and the second electrode 12b. It has a second side surface 12c that connects with the lower surface 12b.

The first light emitting device 11 and the second light emitting device 12 are arranged adjacent to each other on the upper surface 50a of the mounting substrate 50 with the first side surface 11c and the second side surface 12c facing each other. In the light source device 500 shown in FIG. 1A, the short sides of the first light emitting device 11 and the second light emitting device 12 are arranged to face each other. The shortest distance between the first side surface 11c and the second side surface 12c is 300 μm or less, preferably 100 μm or less. As a result, for example, when the light source device 500 is used as the light source of an edge-type liquid crystal display device, it is possible to prevent the space between the first light emitting device 11 and the second light emitting device 12 from becoming a dark portion. Further, by reducing the separation distance between the first side surface 11c and the second side surface 12c, the first adhesive member 7, which will be described later, is arranged so as to be easily in contact with both the first light emitting device 11 and the second light emitting device 12. be able to.

The first electrode 15 and the second electrode 16 are members for electrically connecting the light emitting device to wiring of the mounting substrate 50 . The first electrode 15 and the second electrode 16 are formed in contact with the device electrode 1c of the light emitting device 1, as shown in FIGS. 3D and 3E. The plane areas of the first electrode 15 and the second electrode 16 are preferably formed larger than the plane area of the device electrode 1c. As a result, the bonding area between the conductive member such as the first conductive member 5 and the light emitting device is increased, so the bonding strength between the conductive member and the light emitting device is improved. Moreover, the heat generated by the light emitting element 1 can be efficiently radiated to the outside. The first electrode 15 and the second electrode 16 can be formed by ALD, CVD, sputtering, plating, conductive paste, vapor deposition, or the like. Moreover, it is preferable that the first electrode 15 and the second electrode 16 contain a high-melting-point metal such as Ru, Mo, or Ta. Thereby, the heat resistance of the first electrode 15 and the second electrode 16 can be effectively improved. In addition, by forming the first electrode 15 and the second electrode 16 from a plurality of metal layers and providing these high melting point metals inside the outermost layer of the first electrode 15 and the second electrode 16, solder can reduce the diffusion of Sn contained in the light emitting device. The first electrode 15 and the second electrode 16 can have a laminated structure such as Ni/Ru/Au or Ti/Pt/Au. Also, the thickness of the metal layer containing a high melting point metal such as Ru is preferably about 10 Å to 1000 Å.

The first light emitting device 11 and the second light emitting device 12 can be provided with a translucent member 25 and a light guiding member 35 in addition to the light emitting element 1 and the light reflecting member 30, as shown in FIG. 3E.

A translucent member 25 is provided on the light emitting element 1 . By disposing the translucent member 25 on the light emitting element 1, the light emitting element 1 can be protected from external stress. The side surface of the translucent member 25 is covered with the light reflecting member 30 . As a result, the contrast between the light-emitting region and the non-light-emitting region can be increased, and the light-emitting device can be made to have good visibility. In FIG. 3E, the light reflecting member 30 is provided around the translucent member 25, and the upper surface of the translucent member 25 and the upper surface of the light reflecting member 30 are substantially flush.

The translucent member 25 can have a phosphor layer 25a and/or a transparent layer 25b. The translucent member 25 preferably has a phosphor layer 25a containing a phosphor. As a result, the light emitted by the light emitting element 1 and the light emitted by the phosphor can be mixed to output desired mixed color light. The phosphor may be uniformly dispersed in the phosphor layer 25a, or the phosphor may be unevenly distributed on the light emitting element 1 side of the upper surface of the phosphor layer 25a. By unevenly distributing the phosphor closer to the light emitting element 1 than the upper surface of the phosphor layer 25a, it is possible to easily suppress deterioration of the phosphor, which is sensitive to moisture, due to moisture. Examples of phosphors that are sensitive to moisture include manganese-activated fluoride-based phosphors. Manganese-activated fluoride-based phosphors are preferable phosphors from the viewpoint of color reproducibility because they can emit light with a relatively narrow spectral line width. The phosphor may be one type of phosphor, or may be a plurality of types of phosphors.

The phosphor layer 25a can have multiple phosphor layers. For example, the phosphor layer 25a can include a phosphor layer containing a manganese-activated fluoride-based phosphor and a phosphor layer containing a β-sialon-based phosphor. The phosphor layer 25a may be a single layer, and the single layer phosphor layer 25a may contain the manganese-activated fluoride-based phosphor and the β-sialon-based phosphor.

The light emitting device can arrange the light guide member 35 between the light emitting element 1 and the translucent member 25 . The light guide member 35 covers the side surface of the light emitting element 1 and guides the light emitted from the side surface of the light emitting element 1 toward the upper surface of the light emitting device. By arranging the light guide member 35 on the side surface of the light emitting element 1 , it is possible to suppress part of the light reaching the side surface of the light emitting element 1 from being reflected by the side surface and attenuating within the light emitting element 1 . The light guide member 35 can cover the top and side surfaces of the light emitting element 1 . Thereby, the adhesion strength between the light emitting element 1 and the light guide member 35 can be improved. The light guide member 35 is, for example, a member containing a resin material as a base material. As the resin material, translucent resins such as silicone resins, silicone-modified resins, epoxy resins, and phenol resins can be suitably used. In addition, it is preferable that the light guide member 35 has a high light transmittance. Therefore, it is preferable that the light guide member 35 does not have a substance that reflects, absorbs, or scatters light. For the light guide member 35, a member having a higher transmittance of light from the light emitting element 1 than the light reflecting member 30 is selected.

The light guide member 35 has, for example, a thermal expansion coefficient difference between the light guide member 35 and the light emitting element 1 (this is referred to as a “first thermal expansion coefficient difference ΔT30”) and a thermal expansion coefficient difference between the light reflecting member 30 and the light emitting element 1. It is preferable to select the material of the light guide member 35 so that ΔT40<ΔT30 when compared with the difference in thermal expansion coefficient (referred to as a “second difference in thermal expansion coefficient ΔT40”). This can prevent the light guide member 35 from peeling off from the light emitting element 1 .

Next, returning to FIGS. 1A and 1B, the first conductive member 5, the second conductive member 6, the first adhesive member 7 and the second adhesive member 8 will be described.
The first light emitting device 11 is arranged such that the pair of first electrodes 15 located on the first lower surface 11 b faces the pair of first wirings 51 of the mounting board 50 . A pair of first conductive members 5 are arranged between the pair of first electrodes 15 and the pair of first wirings 51 , and the pair of first electrodes 15 and the pair of first wirings 51 connect the first conductive members 5 . are electrically connected via The first conductive member 5 is solder, for example.

The second light emitting device 12 is arranged such that the pair of second electrodes 16 located on the second lower surface 12 b faces the pair of second wirings 52 of the mounting board 50 . A pair of second conductive members 6 are arranged between the pair of second electrodes 16 and the pair of second wirings 52 , and the pair of second electrodes 16 and the pair of second wirings 52 connect the second conductive members 6 . are electrically connected via The second conductive member 6 is solder, for example.

The first light emitting device 11 and the second light emitting device 12 are further fixed onto the mounting board 50 using the first adhesive member 7 and the second adhesive member 8 . By using the first adhesive member 7 and the second adhesive member 8 in addition to the conductive member such as solder, the bonding strength between the light emitting device and the mounting substrate can be improved. The first conductive member 5 and the second conductive member 6 are conductive members, and the first adhesive member 7 and the second adhesive member 8 are members made of an insulating resin material. The first adhesive member 7 and the second adhesive member 8 are made of a resin material containing epoxy as a base material, for example.

The first adhesive member 7 is positioned between the first side surface 11c of the first light emitting device 11 and the second side surface 12c of the second light emitting device 12, and is in contact with both the first light emitting device 11 and the second light emitting device 12. . In other words, one adhesive member (first adhesive member 7) is positioned between the first light emitting device 11 and the second light emitting device 12, and the first adhesive member 7 is positioned between the first light emitting device 11 and the second light emitting device 12. are fixed to the mounting board 50 . As a result, the separation distance between the light emitting devices can be reduced compared to the case where the adhesive member is arranged at the edge of each light emitting device. As a result, when viewed from above, it is possible to effectively suppress luminance unevenness between the luminance of light emitted upward from each light emitting device and the luminance of light emitted between the light emitting devices. Moreover, since the number of processes for arranging the adhesive member can be reduced, the lead time of the manufacturing process can be shortened. Furthermore, the bonding strength between each light emitting device and the mounting substrate can be improved.

The first adhesive member 7 contacts at least the first side surface 11 c of the first light emitting device 11 and the second side surface 12 c of the second light emitting device 12 . Preferably, the first adhesive member 7 is attached to the first side face 11c of the first light emitting device 11, one or two side faces adjacent to the first side face 11c, the second side face 12c of the second light emitting device 12 and the second side face. abut one or two sides adjacent to 12c. Since the first adhesive member 7 is in contact with two or more side surfaces of each light emitting device, it is possible to further improve the bonding strength between each light emitting device and the mounting substrate.

In the first adhesive member 7, as shown in FIG. 1B, the highest part of the upper surface 70 of the first adhesive member 7 is the same height as the upper surface of each light emitting device or lower than the upper surface of each light emitting device. is preferred. As a result, for example, when the light source device 500 is arranged in the liquid crystal display device, when the upper surface of each light emitting device and the light incident surface of the light guide plate are arranged close to each other, the light incident surface of the light guide plate and the first It is possible to suppress the occurrence of cracks in the first adhesive member 7 due to unintentional contact of the adhesive member 7 . For example, the first adhesive member 7 can have a curved surface on the upper surface that curves in a direction from the upper surface to the lower surface. Thereby, the top surface of the first adhesive member 7 can be easily made lower than the top surface of each light emitting device. The upper surface of the first bonding member 7 may be a flat surface or may have a curved surface that curves in the direction from the lower surface to the upper surface.

The first adhesive member 7 can be made of a translucent resin material as a base material. The first adhesive member 7 can contain a light-reflecting substance or a light-absorbing substance in a translucent resin material. For example, the first adhesive member 7 can be a white member containing a light-reflecting substance such as titanium oxide. Since the first adhesive member 7 contains a light-reflecting substance, part of the light reflected toward the light emitting device from the light incident surface of the light guide plate or the like can be reflected upward by the first adhesive member 7 . Also, the first adhesive member 7 can be a black member containing a light absorbing member such as carbon black. Since the first adhesive member 7 includes a light absorbing member, the first adhesive member 7 absorbs part of the light reflected toward the light emitting device from the light incident surface of the light guide plate, etc. It is possible to suppress the deterioration of the resin material that is the material. In addition, the first adhesive member 7 may not contain a light-reflecting substance or a light-absorbing member.

The second bonding member 8 is arranged between the pair of first wirings 51 and between the pair of second wirings 52 when viewed from above. The second adhesive member 8, like the first adhesive member 7, is a member that improves the bonding strength between each light emitting device and the mounting substrate. In addition, since the second adhesive member 8 is positioned between the pair of wirings, it is possible to prevent the conductive members arranged on the wirings from coming into contact with each other. The second adhesive member 8 contacts the first lower surface 11 b of the first light emitting device 11 and the second lower surface 12 b of the second light emitting device 12 . Specifically, the second adhesive member 8 arranged between the pair of first wirings 51 is in contact with the first lower surface 11b of the first light emitting device 11, and the second bonding member 8 arranged between the pair of second wirings 52 is in contact with the first lower surface 11b of the first light emitting device 11. The second adhesive member 8 contacts the second lower surface 12 b of the second light emitting device 12 . Further, the second adhesive member 8 is arranged apart from the first adhesive member 7 as shown in FIG. 1B.

As shown in FIG. 1B, the second adhesive member 8 is preferably in contact with one or two side surfaces adjacent to the bottom surface in addition to the bottom surface of each light emitting device. One or two side surfaces adjacent to the lower surface refer to side surfaces positioned in a direction perpendicular to the direction in which the first light emitting device 11 and the second light emitting device 12 are arranged. The bonding strength between each light emitting device and the mounting substrate 50 can be improved by the second adhesive member 8 being in contact with the side surfaces thereof.

Next, the arrangement of the first conductive member 5, the second conductive member 6, the first adhesive member 7 and the second adhesive member 8 and the mounting of each light emitting device will be described with reference to FIGS. 4A to 4D.

First, as shown in FIG. 4A, a mounting substrate 50 having a pair of first wirings 51 and a pair of second wirings 52 on an upper surface 50a is prepared. In the subsequent step of mounting the light emitting device, the first light emitting device 11 is arranged on the upper surface of the pair of first wirings 51, and the second light emitting device 12 is arranged on the upper surface of the pair of second wirings 52. . The pair of first wirings 51 and the pair of second wirings 52 can use copper as a base material. As a result, the cost of the mounting substrate 50 can be reduced, and the heat generated from each light emitting device can be efficiently radiated. The pair of first wirings 51 and the pair of second wirings 52 can have plating on the copper surface of the base material. Thereby, the wettability of the bonding material on the wiring can be improved.

Next, as shown in FIG. 4B , the conductive material 5 a that will become the first conductive member 5 is placed on the first wiring 51 , and the conductive material 6 a that will become the second conductive member 6 is placed on the second wiring 52 . In FIG. 4B, the regions where the conductive material 5a and the conductive material 6a are formed are hatched. Conductive material 5a and conductive material 6a are, for example, solder. The conductive material 5a and the conductive material 6a can be formed, for example, only on the wiring by placing a mask on the mounting substrate 50 and using a printing method or the like.

Next, as shown in FIG. 4C, a resin material (hereinafter referred to as resin material 7a) that will become the first adhesive member 7 after being solidified is placed between the first wiring 51 and the second wiring 52 . Further, a resin material (hereinafter referred to as resin material 8a) that becomes the second adhesive member 8 after being solidified is arranged between the pair of first wirings 51 and between the pair of second wirings 52 . The step of disposing the resin material 7a and the step of disposing the resin material 8a may be the same step or different steps. The step of forming the resin material (resin material 7a and resin material 8a) may be performed before or after the step of forming the conductive material (conductive material 5a and conductive material 6a).

The step of arranging the resin material 7a and the resin material 8a can be formed by coating the mounting board 50 with a dispenser, for example. The resin material 7a and the resin material 8a are spaced apart so as not to contact each other. As a result, it is possible to reduce the possibility that the resin material 7a and the resin material 8a will come into contact with each other unintentionally and one resin material will be pulled by the other resin material, resulting in displacement of the resin materials. The step of arranging the resin material 7a and the resin material 8a can be carried out by, for example, spraying the resin material by an inkjet method or printing the resin material using a mask by a printing method, in addition to the method using a dispensing device. You can When the printing method is used, first, a conductive member mask is placed on the mounting substrate 50, and a conductive material is printed. Next, the conductive member mask is removed, the resin member mask is placed on the mounting substrate 50, and the resin material is printed. In this case, a concave portion is provided in a region where the printed conductive material is positioned on the mounting surface of the resin member mask. Thereby, the resin material can be arranged in a desired region while suppressing contact between the resin member mask and the previously printed conductive material.

The resin material 7a is preferably arranged so as to be separated from the first wiring 51 and the second wiring 52 adjacent to each other when viewed from above. Thereby, it is possible to prevent a portion of the resin material 7 a from being positioned on the first wiring 51 and the second wiring 52 . As a result, the electrode located on the lower surface of the light emitting device and the wiring of the mounting substrate are metal-to-metal joint mainly through the conductive material. This strengthens the bonding between the light emitting device and the mounting substrate. In addition, by not arranging an insulating resin material between the electrodes of the light emitting device and the wiring of the mounting substrate, it is possible to prevent the light emitting device from going out. Part of the resin material 7a may be arranged on the first wiring 51 and the second wiring 52 adjacent to each other.

The planar shapes of the resin material 7a and the resin material 8a can be various shapes. The planar shape of the resin material 7a and the resin material 8a can be, for example, elliptical or circular.

Next, as shown in FIG. 4D , the first light emitting device 11 is arranged on the pair of first wirings 51 and the second light emitting device 12 is arranged on the pair of second wirings 52 . The pair of first electrodes 15 of the first light emitting device 11 are in contact with the pair of conductive materials 5a on the pair of first wirings 51, and the first lower surface 11b of the first light emitting device 11 is in contact with the resin material 8a on the mounting substrate 50. come into contact with The pair of second electrodes 16 of the second light emitting device 12 are in contact with the pair of conductive materials 6a on the pair of second wirings 52, and the second lower surface 12b of the second light emitting device 12 is in contact with the resin material 8a on the mounting board 50. come into contact with

Next, a heating step of applying heat to the resin material and the conductive material is performed. When the resin material is a material having a thermosetting resin as a base material, the resin material and the conductive material should be selected so that the temperature T1 at which the resin material is completely solidified is lower than the temperature T2 at which the conductive material melts. is preferred. In other words, it is preferable that the conductive material is melted and the light emitting device and the mounting substrate are bonded together while the light emitting device is temporarily fixed by the previously solidified resin member. As a result, when the conductive material melts, it is possible to prevent the light-emitting device from being pulled by the conductive material and moving or rotating in an unintended direction. As a result, it is possible to improve the mounting accuracy of the light emitting device on the mounting substrate. By performing the heating process, the first conductive member 5, the second conductive member 6, the first adhesive member 7 and the second adhesive member 8 are formed.

Each member used in the light source device 500 of the present invention will be described below.

(First Light Emitting Device 11, Second Light Emitting Device 12)
The first light emitting device 11 and the second light emitting device 12 function as light sources of the light source device 500 . The light source device 500 can include one or more other light emitting devices in addition to the first light emitting device 11 and the second light emitting device 12 . Each light-emitting device includes at least a light-emitting element 1 and a light reflecting member 30 that covers the side surface of the light-emitting element 1 and efficiently reflects the light from the light-emitting element 1 .

(Light emitting element 1)
The light emitting element 1 is, for example, an LED chip. The light-emitting element 1 has a semiconductor laminated structure including, for example, a nitride semiconductor (In _x Al _y Ga _1-x-y N, 0≦x, 0≦y, x+y≦1) capable of emitting light in the ultraviolet to visible range. can have The emission peak wavelength of the light emitting element 1 is preferably 400 nm or more and 530 nm or less, more preferably 420 nm or more and 490 nm or less, and 450 nm or more and 475 nm or less, in consideration of the luminous efficiency of the light emitting device, the excitation spectrum of the wavelength conversion particles, the color mixing property, and the like. More preferred.

The number of light emitting elements may be one, or two or more. When there are a plurality of light-emitting elements, the plurality of light-emitting elements may be, for example, a plurality of blue light-emitting elements that emit blue light, three light-emitting elements that emit blue light, green light, and red light, respectively, or blue light-emitting elements. A combination of a light emitting element that emits green light and a light emitting element that emits green light can be used. When the light-emitting device is used as a light source for a liquid crystal display device or the like, the light-emitting elements include one light-emitting element that emits blue light, two light-emitting elements that emit blue light, three or more light-emitting elements that emit blue light, or It is preferable to use a combination of a light emitting element that emits blue light and a light emitting element that emits green light. A light-emitting element that emits blue light and a light-emitting element that emits green light preferably have a half-value width of 40 nm or less, and more preferably have a half-value width of 30 nm or less. This allows blue light and green light to easily have sharp peaks. As a result, for example, when the light-emitting device is used as a light source for a liquid crystal display device, the liquid crystal display device can achieve high color reproducibility. Also, the plurality of light emitting elements can be electrically connected in series, in parallel, or in a connection method combining series and parallel.

(Light reflecting member 30)
The light reflecting member 30 preferably has a light reflectance of 70% or more, more preferably 80% or more, at the emission peak wavelength of the light emitting element 1 from the viewpoint of the light extraction efficiency in the upper surface direction of the light emitting device. Preferably, it is more preferably 90% or more. Furthermore, the light reflecting member 30 is preferably white. The light-reflecting member 30 can contain a light-reflecting substance in a resin material serving as a base material. The light reflecting member 30 can be obtained by solidifying a liquid resin material. The light reflecting member 30 can be formed by transfer molding, injection molding, compression molding, potting, or the like.

The light reflecting member 30 can contain a resin material as a base material. A thermosetting resin, a thermoplastic resin, or the like can be used as the resin material that serves as the base material. Specifically, epoxy resin, silicone resin, modified epoxy resin such as silicone-modified epoxy resin, modified silicone resin such as epoxy-modified silicone resin, modified silicone resin, unsaturated polyester resin, saturated polyester resin, polyimide resin, modified polyimide resin resin such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, and PBT resin. In particular, as the resin material of the light reflecting member 30, it is preferable to use a thermosetting resin such as an epoxy resin or a silicone resin, which has excellent heat resistance and light resistance.

Epoxy resin can be selected as the base material of the light reflecting member 30 . By selecting an epoxy resin that is stronger than a silicone resin when solidified, the strength of the light-emitting device can be improved. Further, when the resin material that is the base material of the first adhesive member 7 and the second adhesive member 8 is an epoxy resin, the fixing strength of the first adhesive member 7, the second adhesive member 8 and the light reflecting member 30 can be improved. can be done.

It is preferable that the light reflecting member 30 contains a light reflecting substance in the above-described base resin material. As the light-reflecting substance, it is preferable to use a member that hardly absorbs light from the light-emitting element and that has a large difference in refractive index with respect to the resin material serving as the base material. Such light-reflecting substances are, for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, aluminum nitride and the like.

(translucent member 25)
The translucent member 25 is provided on the light emitting element 1 to protect the light emitting element 1 . The translucent member 25 may be a single layer or multiple layers. When the translucent member 25 has a plurality of layers, the base material of each layer may be the same or different.

As the base material of the light-transmitting member 25, a material having light-transmitting properties with respect to the light from the light-emitting element 1 is used. In this specification, having translucency means that the light transmittance at the emission peak wavelength of the light emitting element 1 is 60% or more, preferably 70% or more, and more preferably 80% or more. . As the base material of the translucent member 25, for example, silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, or modified resin thereof can be used. Also, the base material of the translucent member 25 may be glass. In particular, silicone resins and epoxy resins are preferably used because of their excellent heat resistance and light resistance. Examples of silicone resins include dimethylsilicone resin, phenyl-methylsilicone resin, and diphenylsilicone resin. In addition, the modified resin in this specification includes a hybrid resin.

The translucent member 25 may contain light diffusing particles. Light diffusing particles include silicon oxide, aluminum oxide, zirconium oxide, zinc oxide, and the like. The light diffusing particles can be used singly or in combination of two or more of them. In particular, it is preferable to use silicon oxide, which has a small linear expansion coefficient, as the light diffusing particles. Moreover, it is preferable to use nanoparticles as the light diffusing particles. As a result, the scattering of light emitted by the light emitting element is increased, and the amount of wavelength conversion particles used can be reduced. Note that nanoparticles refer to particles with a particle size of 1 nm or more and 100 nm or less. Moreover, the particle size in this specification is mainly defined by D50.

The translucent member 25 may include a phosphor layer 25a containing phosphor. A phosphor is a member that absorbs at least part of the primary light emitted by the light emitting element and emits secondary light with a wavelength different from that of the primary light. As the phosphor, one of the phosphors shown below can be used alone, or two or more of them can be used in combination.

Examples of phosphors include yttrium-aluminum-garnet-based phosphors (eg, Y ₃ (Al, Ga) ₅ O ₁₂ :Ce), lutetium-aluminum-garnet-based phosphors (eg, Lu ₃ (Al, Ga) ₅ O ₁₂ : Ce), terbium-aluminum-garnet-based phosphors (e.g., Tb3 ₍ Al, Ga) _5O12 :Ce), silicate-based phosphors (e.g., ₍ Ba, Sr) _2SiO4 :Eu), chlorosilicate _- based phosphors (e.g. Ca ₈ Mg(SiO ₄ ) ₄ Cl ₂ :Eu), β-sialon phosphors (e.g. Si _6-z Al _z O _z N _8-z :Eu (0<z<4.2)), SGS-based Phosphors (eg SrGa ₂ S ₄ :Eu), alkaline earth aluminate phosphors (eg (Ba,Sr,Ca)Mg _x Al ₁₀ O _17-x :Eu,Mn), α-sialon phosphors (eg M _z (Si, Al) ₁₂ (O, N) ₁₆ (where 0 < z ≤ 2 and M is a lanthanide element excluding Li, Mg, Ca, Y, and La and Ce), nitrogen-containing calcium aluminosilicate phosphors (for example, (Sr, Ca)AlSiN ₃ :Eu), manganese-activated fluoride phosphors (phosphors represented by the general formula (I) A ₂ [M _{1-a Mna} F ₆ ] (provided that In the above general formula (I), A is at least one selected from the group consisting of K, Li, Na, Rb, Cs and NH4, and M is the group consisting of Group ₄ elements and Group 14 elements. is at least one element selected from, and a satisfies 0 < a < 0.2)) The yttrium-aluminum-garnet-based phosphor emits light by substituting part of Y with Gd The peak wavelength can be shifted to the long wavelength side, and a representative example of the manganese-activated fluoride-based phosphor is a manganese-activated potassium fluorosilicate phosphor (for example, K ₂ SiF ₆ :Mn).
Also, the translucent member 25 may be a sintered body of a phosphor and an inorganic material such as alumina, or a plate crystal of the phosphor.

(Light guide member 35)
The light guide member 35 covers the side surface of the light emitting element 1 and guides the light emitted from the side surface of the light emitting element 1 toward the upper surface of the light emitting device. In other words, part of the light that reaches the side surface of the light emitting element 1 is reflected by the side surface and attenuated inside the light emitting element 1 , but the light guide member 35 guides the light into the light guide member 35 and directs it to the outside of the light emitting element 1 . can be taken out. The resin material exemplified for the light reflecting member 30 can be used for the light guide member 35 . In particular, it is preferable to use a thermosetting translucent resin such as silicone resin, silicone-modified resin, epoxy resin, or phenol resin as the light guide member 35 . In addition, it is preferable that the light guide member 35 has a high light transmittance. Therefore, it is usually preferable that the light guide member 35 does not substantially contain additives that reflect, absorb, or scatter light. “Substantially free of additives” means that unavoidable contamination of additives is not excluded. The light guide member 35 may contain light diffusing particles and/or wavelength converting particles similar to those of the translucent member 25 described above.

(Mounting board 50)
The mounting substrate 50 has a plate-like base material made of glass epoxy resin, ceramic, polyimide, or the like. Moreover, the mounting substrate 50 has land portions and wiring patterns made of copper, gold, silver, nickel, palladium, tungsten, chromium, titanium, or alloys thereof on the base material. The land portion and the wiring pattern are formed using methods such as plating, lamination press-bonding, pasting, sputtering, vapor deposition, and etching.

(First conductive member 5, second conductive member 6)
For the first conductive member 5 and the second conductive member 6, any material known in the art can be used. Specifically, the first conductive member 5 and the second conductive member 6 are solders such as tin-bismuth-based, tin-copper-based, tin-silver-based, and gold-tin-based solders (specifically, Ag and Cu alloys containing Sn as main components, alloys containing Cu and Sn as main components, alloys containing Bi and Sn as main components, etc.), eutectic alloys (alloys containing Au and Sn as main components, Au and alloys mainly composed of Si, alloys mainly composed of Au and Ge, etc.), conductive pastes such as silver, gold, palladium, bumps, anisotropic conductive materials, brazing materials such as low melting point metals, etc. mentioned.

(First adhesive member 7, second adhesive member 8)
For the first adhesive member 7 and the second adhesive member 8, for example, resin materials such as epoxy resins listed for the translucent member 25 can be used. The first adhesive member 7 and the second adhesive member 8 may be made of the same material or different materials.

(Embodiment 2)
FIG. 5 is a schematic side view of a light source device 600 according to Embodiment 2. FIG. The light source device 600 is mainly different from the light source device 500 according to the first embodiment in that recesses are formed in the first side surface 11c of the first light emitting device 11 and the second side surface 12c of the second light emitting device 12 . Therefore, the depressions formed in the first side surface 11c of the first light emitting device 11 and the second side surface 12c of the second light emitting device 12 will be mainly described. In FIG. 5, the region where the first adhesive member 7 is arranged is hatched for clarity.

The first light emitting device 11 has a first recess 13a that opens to the first side surface 11c and the first lower surface 11b and recesses in the direction opposite to the second side surface 12c. The second light emitting device 12 also has a second recess 13b that opens to the second side surface 12c and the second lower surface 12b and recesses in the direction opposite to the first side surface 11c. In FIG. 5, the light reflecting member 30 is positioned on the inner surface of the first recess 13a and the inner surface of the second recess 13b. A first adhesive member 7 is arranged in the first recess 13a and the second recess 13b.

6A is a schematic top view of the first light emitting device 11 according to Embodiment 2, FIG. 6B is a schematic bottom view of the first light emitting device 11, and FIG. 6C is a schematic side view of the first light emitting device 11. is. FIG. 6C is a view of the first light emitting device 11 viewed from the direction E shown in FIG. 6A. The length T1 of the opening of the first recess 13a is, for example, 0.2 times or more and 0.8 times or less, or 0.4 times or more and 0.6 times the maximum thickness T2 of the first light emitting device 11 in the height direction. The following are preferable. This makes it easier for the first adhesive member 7 to stay in the first recess 13a, and for example, it is possible to prevent the first adhesive member 7 from reaching the upper surface of each light emitting device. Further, in the direction from the first side surface 11c to the second side surface 12c, the width W1 of the first recessed portion 13 is, for example, 0.01 to 0.5 times the maximum width W2 of the first light emitting device 11. , 0.03 times or more and 0.1 times or less. Thereby, the fixation between the first depression 13a and the first adhesive member 7 is improved. By setting the width W1 of the first recess 13 to the above value, the first light emitting device 11 is easily pulled toward the mounting substrate 50 when the resin material that forms the first adhesive member 7 is solidified. Become. This makes it easier to equalize minute errors in the separation distance from the mounting board 50 over the entire lower surface of the first light emitting device 11 .

In addition to the first side surface 11c, the first light emitting device 11 may have depressions on other side surfaces 11d and 11e adjacent to the first side surface 11c. As a result, the first bonding member 7 enters the recesses on the other side surfaces 11d and 11e in addition to the first recess 13a, so that the bonding strength between the first light emitting device 11 and the mounting substrate 50 can be further improved. . Also, as shown in FIG. 6C, the first light emitting device 11 may have a recess on the side surface 11f opposite to the first side surface 11c. Accordingly, when the light source device 600 has three or more light emitting devices and another light emitting device is arranged to face the side face 11f of the first light emitting device 11, the first light emitting device 11 and the second light emitting device The arrangement of the first adhesive member 7 between the first light-emitting device 11 and another light-emitting device is facilitated in the same manner as between 12 . Note that the first light emitting device 11 may have a recess only on the first side surface 11c among the plurality of side surfaces.

The shape or arrangement of the second depression 13b in the second light emitting device 12 can also be changed in various ways similarly to the first depression 13a in the first light emitting device 11. FIG.

Since the first light-emitting device 11 and the second light-emitting device 12 have the first recess 13a and the second recess 13b, the first adhesive member 7 and the second side surface 12c are flat compared to the case where the first side surface 11c and the second side surface 12c are flat surfaces. The contact area is increased, and the bonding strength of the first light emitting device 11, the second light emitting device 12 and the first adhesive member 7 is improved. Further, by arranging the first bonding member 7 in the first recess 13a and the second recess 13b, the first bonding member 7 can easily stay in the first recess 13a and the second recess 13b. It is possible to prevent the member 7 from reaching the upper surface of each light emitting device. As a result, for example, when the light source device 600 is arranged in the liquid crystal display device, when the upper surface of each light emitting device and the light incident surface of the light guide plate are arranged close to each other, the light incident surface of the light guide plate and the first It is possible to suppress the occurrence of cracks in the first adhesive member 7 due to unintentional contact of the adhesive member 7 .

(Embodiment 3)
7A is a schematic top view of a light source device 700 according to Embodiment 3, and FIG. 7B is a schematic front view of the light source device 700. FIG. A light source device 700 according to Embodiment 3 is mainly different from the light source device 500 according to Embodiment 1 in that the first light emitting device 11 and the second light emitting device 12 are side light emitting devices (side view type). Therefore, in the light source device 700 of Embodiment 3, the first light emitting device 11 and the second light emitting device 12 will be mainly described.

8A and 8B are schematic perspective views of the first light emitting device 11. FIG. The first light emitting device 11 has a first front surface 21a serving as a light emitting surface, a first lower surface 21b orthogonal to the first front surface 21a and on which a pair of first electrodes 15 are arranged, the first front surface 21a and the first lower surface 21b. It has a connecting first side surface 21c. Also, the first light emitting device 11 shown in FIGS. 8A and 8B has a first rear surface 21d located on the opposite side of the first front surface 21a. The first light-emitting device 11 is a side-light-emitting (side-view) light-emitting device whose mounting surface is the first lower surface 21b.

In the first light emitting device 11 according to Embodiment 3, as shown in FIG. 8B, the first electrode 15 may have a lower surface electrode 15a positioned on the first lower surface 21b and a rear surface electrode 15b positioned on the first rear surface 21d. can. Since the first electrode 15 includes the lower surface electrode 15a and the rear surface electrode 15b, the heat generated by the light emitting element 1 can be efficiently dissipated from the lower surface side and the rear surface side. In addition, since the conductive member (first conductive member 5) is in contact with the rear electrode 15b in addition to the lower electrode 15a, the bonding strength between the conductive member and the light emitting device can be improved.

The second light emitting device 12 can also have the same configuration as the first light emitting device 11 . The second light emitting device 12 is connected to a second front surface 22a serving as a light emitting surface, a second lower surface orthogonal to the second front surface 22a and having a pair of second electrodes 16 arranged thereon, and the second front surface 22a and the second lower surface. and a second side surface 22c. The second light emitting device 12 also has a second rear surface located opposite to the second front surface 22a.

Further, as shown in FIGS. 7A and 7B, the first light emitting device 11 is arranged such that the first lower surface 21b faces the upper surfaces of the pair of first wirings 51 of the mounting substrate 50. As shown in FIGS. A pair of first electrodes 15 positioned on the first lower surface 21 b are electrically connected to a pair of first wirings 51 via a pair of first conductive members 5 . Also, the second light emitting device 12 is arranged such that the second lower surface faces the upper surface of the pair of second wirings 52 of the mounting substrate 50 . A pair of second electrodes 16 positioned on the second lower surface are electrically connected to a pair of second wirings 52 via a pair of second conductive members 6 .

The first light emitting device 11 and the second light emitting device 12 are further fixed onto the mounting board 50 by the first adhesive member 7 and the second adhesive member 8 . The first adhesive member 7 is in contact with both the first light emitting device 11 and the second light emitting device 12 between the first side surface 21c of the first light emitting device 11 and the second side surface 22c of the second light emitting device 12. placed. In addition, the second adhesive member 8 is in contact with the first lower surface 21b of the first light emitting device 11 or the second lower surface of the second light emitting device 12 between the pair of first wirings 51 or between the pair of second wirings 52. , are spaced apart from the first adhesive member 7 . By fixing the first light emitting device 11 and the second light emitting device 12 using the first adhesive member 7 and the second adhesive member 8, the fixing strength between each light emitting device and the mounting substrate 50 can be improved. .

1 light emitting element 5 first conductive member 6 second conductive member 7 first adhesive member 7a upper surface 8 second adhesive member 11 first light emitting device 11a first upper surface 11b first lower surface 11c first side surface 12 second light emitting device 13a first Recess 13b Second recess 15 First electrode 16 Second electrode 21a First front surface 21b First lower surface 21c First side surface 22a Second front surface 22b Second lower surface 22c Second side surface 25 Translucent member 25a Phosphor layer 25b Transparent layer 30 Light reflecting member 35 Light guide member 50 Mounting substrate 50a Upper surface 51 First wiring 52 Second wiring 70 Upper surface 600 Light source device 700 Light source device 800 Light source device

Claims (10)

a mounting substrate having a pair of first wirings and a pair of second wirings adjacent to the pair of first wirings on its upper surface;
a first upper surface that serves as a light-emitting surface; a first lower surface that is located on the opposite side of the first upper surface and on which a pair of first electrodes are arranged; and a first side surface that connects the first upper surface and the first lower surface. a first light emitting device having the first lower surface and arranged so as to face the upper surfaces of the pair of first wirings;
a second upper surface that serves as a light emitting surface; a second lower surface that is located on the opposite side of the second upper surface and on which a pair of second electrodes are arranged; and a second side surface that connects the second upper surface and the second lower surface. a second light emitting device having the second lower surface and arranged so as to face the upper surfaces of the pair of second wirings;
a pair of first conductive members disposed between the pair of first electrodes and the pair of first wirings and electrically connecting the pair of first electrodes and the pair of first wirings;
a pair of second conductive members disposed between the pair of second electrodes and the pair of second wirings and electrically connecting the pair of second electrodes and the pair of second wirings; ,
The first light emitting device and the second light emitting device are arranged such that the first side face and the second side face face each other,
A first adhesive member is disposed between the first side surface and the second side surface and is in contact with both the first light emitting device and the second light emitting device;
Contact with the first lower surface of the first light emitting device or the second lower surface of the second light emitting device between the pair of first wirings or between the pair of second wirings, and is separated from the first adhesive member A second adhesive member is arranged to
The first light emitting device has a first recess that opens to the first side surface and the first bottom surface and is recessed in a direction opposite to the second side surface,
The second light emitting device has a second recessed portion that opens to the second side surface and the second lower surface and is recessed in a direction opposite to the first side surface,
The light source device , wherein the first adhesive member is in contact with both the inner surface of the first recess and the inner surface of the second recess, and is arranged in the first recess and the second recess . 2. The light source device according to claim 1, wherein the top surface of said first adhesive member is lower than said first top surface of said first light emitting device and said second top surface of said second light emitting device in a height direction. in the height direction,
The length of the opening of the first recess is 0.4 times or more and 0.6 times or less the maximum thickness of the first light emitting device,
3. The light source device according to claim 1 , wherein the length of the opening of said second recess is 0.4 to 0.6 times the maximum thickness of said second light emitting device. In the direction from the first side toward the second side,
The width of the first recess is 0.03 times or more and 0.1 times or less the maximum width of the first light emitting device,
4. The light source device according to claim 1 , wherein the width of said second recess is 0.03 to 0.1 times the maximum width of said second light emitting device. The first adhesive member is positioned between the first wiring and the second wiring adjacent to the first wiring when viewed from above,
5. The light source device according to claim 1 , wherein said first adhesive member is separated from said first wiring and said second wiring when viewed from above. 6. The light source device according to any one of claims 1 to 5 , wherein the first adhesive member has a curved surface on the top surface that curves in a direction from the top surface to the bottom surface. The light source device according to any one of claims 1 to 6 , wherein the first adhesive member is white. 7. The light source device according to claim 1, wherein said first adhesive member is black. a mounting substrate having a pair of first wirings and a pair of second wirings adjacent to the pair of first wirings on its upper surface;
a first front surface serving as a light-emitting surface; a first lower surface orthogonal to the first front surface on which a pair of first electrodes are arranged; and a first side surface connected to the first front surface and the first lower surface, a first light emitting device arranged such that the first lower surface faces the upper surfaces of the pair of first wirings;
a second front surface serving as a light-emitting surface; a second lower surface orthogonal to the second front surface and having a pair of second electrodes arranged thereon; and a second side surface connected to the second front surface and the second lower surface; a second light emitting device arranged such that the second lower surface faces the upper surfaces of the pair of second wirings;
a pair of first conductive members disposed between the pair of first electrodes and the pair of first wirings and electrically connecting the pair of first electrodes and the pair of first wirings;
a pair of second conductive members disposed between the pair of second electrodes and the pair of second wirings and electrically connecting the pair of second electrodes and the pair of second wirings; ,
the first light emitting device and the second light emitting device are arranged such that the first side face and the second side face face each other;
A first adhesive member is disposed between the first side surface and the second side surface and is in contact with both the first light emitting device and the second light emitting device. a second adhesive member that is in contact with the first lower surface of the first light emitting device or the second lower surface of the second light emitting device and is separated from the first adhesive member between two wirings ;
The first adhesive member is positioned between the first wiring and the second wiring adjacent to the first wiring when viewed from above,
The light source device , wherein the first adhesive member is separated from the first wiring and the second wiring when viewed from above . The first light emitting device has a first recess that opens to the first side surface and the first bottom surface and is recessed in a direction opposite to the second side surface,
The second light emitting device has a second recessed portion that opens to the second side surface and the second lower surface and is recessed in a direction opposite to the first side surface,
10. The light source according to claim 9, wherein the first adhesive member contacts both the inner surface of the first recess and the inner surface of the second recess, and is arranged within the first recess and the second recess. Device.

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