JP2020120057A - Light source device - Google Patents

Abstract

To provide a light source device capable of improving fixing strength between a light-emitting device and a substrate.SOLUTION: A light source device 500 comprises: a mounting substrate 50 including a pair of first wirings 51 and a pair of second wirings 52 on the upper surface thereof; a first light-emitting device 11 arranged so as to face an upper surface serving as a light-emitting surface and upper surfaces of the pair of first wirings 51; a second light-emitting device 12 arranged so as to face the upper surfaces of the pair of second wirings 52; a pair of first conductive members 5 electrically connecting between a pair of first electrodes 15 and the pair of first wirings 51; and a pair of second conductive members 6 electrically connecting between a pair of second electrodes and the pair of second wirings. In the first light-emitting device 11 and the second light-emitting device 12, a first adhesive member 7 in contact with both the first light-emitting device 11 and the second light-emitting device 12 is arranged between a first side surface 11c and a second side surface 12c arranged to face to each other. A second adhesive member 8 in contact with a first lower surface of the first light-emitting device 11 or a second lower surface of the second light-emitting device 12 and separated from the first adhesive member 7 is arranged between the pair of first wirings or between the pair of second wirings.SELECTED DRAWING: Figure 1B

Description

The present disclosure relates to a light source device.

Patent Document 1 discloses a light source device including a substrate and a plurality of light emitting devices arranged on the substrate.

JP, 2010-225842, A

However, in the light source device of Patent Document 1, the bonding strength between the light emitting device and the substrate may be insufficient.

Therefore, it is an object of one embodiment of the present invention to provide a light source device in which the fixing strength between the light emitting device and the substrate is improved.

A light source device according to an embodiment of the present invention includes a mounting substrate having a pair of first wirings and a pair of second wirings adjacent to the pair of first wirings on the upper surface, a first upper surface serving as a light emitting surface, and a first upper surface. A first lower surface on the opposite side of the first electrode on which the pair of first electrodes are arranged, a first upper surface and a first side surface connected to the first lower surface, and the first lower surface is an upper surface of the pair of first wirings. A first light emitting device arranged to face each other, a second upper surface serving as a light emitting surface, a second lower surface on the opposite side of the second upper surface on which a pair of second electrodes are arranged, a second upper surface and a second upper surface. 2 a second light emitting device having a second side surface connected to the lower surface, the second lower surface being arranged so as to face the upper surfaces of the pair of second wirings, a pair of first electrodes, and a pair of first wirings. And a pair of first conductive members that electrically connect the pair of first electrodes and the pair of first wirings, and between the pair of second electrodes and the pair of second wirings, A pair of second conductive members that electrically connect the pair of second electrodes and the pair of second wirings, and the first side surface and the second side surface of the first light emitting device and the second light emitting device face each other. And a first adhesive member that is in contact with both the first light emitting device and the second light emitting device is disposed between the first side surface and the second side surface, and is disposed between the pair of first wirings or the pair of second wirings. A second adhesive member that is in contact with the first lower surface of the first light emitting device or the second lower surface of the second light emitting device and is separated from the first adhesive member is disposed between the wirings.

A light source device according to an embodiment of the present invention includes a mounting substrate having a pair of first wirings and a pair of second wirings adjacent to the pair of first wirings on an upper surface, a first front surface serving as a light emitting surface, and a first front surface. A first lower surface on which a pair of first electrodes are arranged orthogonally to and a first side surface connecting the first front surface and the first lower surface, and the first lower surface faces the upper surfaces of the pair of first wirings. A first light emitting device disposed on the second front surface, a second front surface serving as a light emitting surface, a second lower surface on which a pair of second electrodes are arranged orthogonal to the second front surface, and a second front surface and a second lower surface connected to each other. A second light emitting device having two side surfaces and a second lower surface facing the upper surfaces of the pair of second wirings; and a second light emitting device disposed between the pair of first electrodes and the pair of first wirings, A pair of first conductive members that electrically connect the pair of first electrodes and the pair of first wirings, and a pair of second electrodes that are arranged between the pair of second electrodes and the pair of second wirings. A pair of second conductive members electrically connecting the pair of second wirings, and the first light emitting device and the second light emitting device are arranged so that the first side surface and the second side surface face each other, A first adhesive member that is in contact with both the first light emitting device and the second light emitting device is disposed between the first side surface and the second side surface, and between the pair of first wirings or between the pair of second wirings. A second adhesive member that is in contact with the first lower surface of the first light emitting device or the second lower surface of the second light emitting device and is separated from the first adhesive member is disposed.

According to one embodiment of the present invention, it is possible to provide a light source device in which the bonding strength between the light emitting device and the substrate is improved.

FIG. 3 is a schematic top view of the light source device according to the first embodiment. FIG. 3 is a schematic side view of the light source device according to the first embodiment. FIG. 3 is a schematic top view of the mounting board according to the first embodiment. FIG. 3 is a schematic perspective view of the light emitting device according to the first embodiment. FIG. 3 is a schematic perspective view of the light emitting device according to the first embodiment. FIG. 3 is a schematic top view of the light emitting device according to the first embodiment. FIG. 3 is a schematic bottom view of the light emitting device according to the first embodiment. FIG. 3E is a schematic end view taken along line 3E-3E in FIG. 3C. It is a schematic top view which shows the process of arrange|positioning a conductive material and a resin material. It is a schematic top view which shows the process of arrange|positioning a conductive material and a resin material. It is a schematic top view which shows the process of arrange|positioning a conductive material and a resin material. It is a schematic top view which shows the process of arrange|positioning a conductive material and a resin material. 6 is a schematic side view of a light source device according to a second embodiment. FIG. 5 is a schematic top view of a light emitting device according to a second embodiment. FIG. 5 is a schematic bottom view of the light emitting device according to the second embodiment. FIG. 6 is a schematic side view of a light emitting device according to a second embodiment. FIG. FIG. 6 is a schematic top view of a light source device according to a third embodiment. 7 is a schematic side view of a light source device according to a third embodiment. FIG. 7 is a schematic perspective view of a light emitting device according to a third embodiment. FIG. 7 is a schematic perspective view of a light emitting device according to a third embodiment. FIG.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The following embodiments are exemplifications, and the light source device according to the present disclosure is not limited to the following embodiments. For example, the numerical values, shapes, materials, etc. shown in the following embodiments are merely examples, and various modifications are possible as long as there is no technical contradiction.

The dimensions, shapes, etc. of the constituent elements shown in the drawings may be exaggerated for the sake of clarity, and may not reflect the dimensions, shapes, and size relationships between the constituent elements in the actual light source device. In addition, in order to avoid making the drawings excessively complicated, some of the elements may not be shown.

In the following description, constituent elements having substantially the same function are designated by common reference numerals, and description thereof may be omitted. In the following description, a term indicating a specific direction or position (for example, “upper”, “lower” and another term including those terms) may be used. However, those terms only use the relative orientation or position in the referenced figures for clarity. In the drawings other than the present disclosure, the actual product, the manufacturing apparatus, etc., the same as the referenced drawings, as long as the relative directions or positions in terms of “upper”, “lower”, etc. in the referenced drawings are the same. It does not have to be arranged.

(Embodiment 1)
1A is a schematic top view of the light source device 500, and FIG. 1B is a schematic side view of the light source device 500. FIG. 1B is a view of the light source device 500 viewed from the direction D shown in FIG. 1A. The light source device 500 according to the first embodiment includes the mounting substrate 50, and the first light emitting device 11 and the second light emitting device 12 arranged on the mounting substrate 50. The first light emitting device 11 and the second light emitting device 12 are provided on the upper surface 50a of the mounting substrate 50 by the pair of first conductive members 5, the pair of second conductive members 6, the first adhesive member 7 and the second adhesive member 8. It is fixed.
Each member will be described in detail with reference to FIGS. 2 to 3E.

[Mounting board 50]
FIG. 2 is a schematic top view of the mounting board 50. FIG. 2 is a diagram in which a light emitting device, a conductive member, and an adhesive member are omitted from the light source device 500 shown in FIG. 1A. The mounting substrate 50 has a pair of first wirings 51 and a pair of second wirings 52 adjacent to the pair of first wirings 51 on the upper surface 50a. A plurality of light emitting devices are arranged on the upper surface 50a of the mounting substrate 50, and power is supplied to the light emitting devices via wiring. The mounting substrate 50 is, for example, a long member having a longitudinal direction and a lateral direction. The plurality of light emitting devices are preferably arranged on the mounting board 50 along the longitudinal direction of the mounting board 50. The mounting board 50 may include one or more wires in addition to the pair of first wires 51 and the pair of second wires 52.

[First Light-Emitting Device 11, Second Light-Emitting Device 12]
3A is a schematic perspective view of the light emitting device (the first light emitting device 11 and the second light emitting device 12) viewed from the upper side, and FIG. 3B is a schematic perspective view of the light emitting device viewed from the lower side, and FIG. 3D is a schematic top view of the light emitting device, FIG. 3D is a schematic bottom view of the light emitting device, and FIG. 3E is a schematic end view taken along line 3E-3E in FIG. 3C. The first light emitting device 11 and the second light emitting device 12 function as a light source of the light source device 500. The first light emitting device 11 and the second light emitting device 12 can be light emitting devices having the same structure. The first light emitting device 11 is arranged on the pair of first wirings 51 of the mounting substrate 50, and the second light emitting device 12 is arranged on the pair of second wirings 52 of the mounting substrate 50. The light source device 500 may include another light emitting device other than the first light emitting device 11 and the second light emitting device 12. In the first embodiment, the first light emitting device 11 and the second light emitting device 12 are top emission type (top view type) light emitting devices that emit light from the upper surface.

Each light emitting device may be a substantially rectangular parallelepiped light emitting device having a pair of long side surfaces and a pair of short side surfaces. For example, the light emitting devices are arranged such that the long side faces of the light emitting devices are parallel to the longitudinal direction of the mounting substrate 50, and the short side faces of the light emitting devices face each other. Thereby, the light source device 500 can be made thin.

The first light emitting device 11 and the second light emitting device 12 include the light emitting element 1 and the light reflecting member 30 that covers the side surface of the light emitting element 1 and efficiently reflects the light from the light emitting element 1. The light emitting device 1 includes a semiconductor laminated structure 1b including a light emitting layer and a device electrode 1c connected to the semiconductor laminated structure 1b. The light emitting device 1 may further include a transparent substrate 1a. The light reflecting member 30 may directly contact the side surface of the light emitting element 1, or may indirectly cover the side surface of the light emitting element 1 via another member. In FIG. 3A and FIG. 3B, the light reflecting member 30 is located on the upper surface, the lower surface, and each outer surface of the first light emitting device 11 and the second light emitting device 12. The light reflecting member 30 is formed of, for example, a resin material having an epoxy resin or a silicone resin as a base material.

The first light emitting device 11 includes a first upper surface 11a serving as a light emitting surface, a first lower surface 11b located on the opposite side of the first upper surface 11a and having a pair of first electrodes 15 disposed thereon, the first upper surface 11a and the first upper surface 11a. It has a first side surface 11c connected to the lower surface 11b. The second light emitting device 12 includes a second upper surface 12a serving as a light emitting surface, a second lower surface 12b located on the opposite side of the second upper surface 12a and provided with a pair of second electrodes 16, a second upper surface 12a and a second upper surface 12a. The second side surface 12c is connected to the lower surface 12b.

The first light emitting device 11 and the second light emitting device 12 are arranged adjacent to each other on the upper surface 50a of the mounting substrate 50 with the first side surface 11c and the second side surface 12c facing each other. In the light source device 500 shown in FIG. 1A, the short sides of the first light emitting device 11 and the second light emitting device 12 are arranged so as to face each other. The shortest distance between the first side surface 11c and the second side surface 12c is 300 μm or less, and preferably 100 μm or less. Accordingly, for example, when the light source device 500 is used as the light source of the edge type liquid crystal display device, it is possible to prevent the dark portion between the first light emitting device 11 and the second light emitting device 12. Further, by reducing the separation distance between the first side surface 11c and the second side surface 12c, the first adhesive member 7 described later is arranged so as to easily contact both the first light emitting device 11 and the second light emitting device 12. be able to.

The first electrode 15 and the second electrode 16 are members for electrically connecting the light emitting device to the wiring of the mounting substrate 50. The first electrode 15 and the second electrode 16 are formed in contact with the element electrode 1c of the light emitting element 1, as shown in FIGS. 3D and 3E. The plane area of the first electrode 15 and the second electrode 16 is preferably formed larger than the plane area of the device electrode 1c. As a result, the bonding area between the conductive member such as the first conductive member 5 and the light emitting device is increased, so that the bonding strength between the conductive member and the light emitting device is improved. Further, the heat generated by the light emitting element 1 can be efficiently radiated to the outside. The first electrode 15 and the second electrode 16 can be formed by ALD, CVD, sputtering, plating, conductive paste, vapor deposition, or the like. In addition, the first electrode 15 and the second electrode 16 preferably include a high melting point metal such as Ru, Mo, or Ta. Thereby, the heat resistance of the 1st electrode 15 and the 2nd electrode 16 can be improved effectively. In addition, by forming the first electrode 15 and the second electrode 16 from a plurality of metal layers and providing these high melting point metals inside the outermost surface layers of the first electrode 15 and the second electrode 16, It is possible to reduce the diffusion of Sn contained in the element into the light emitting device. The first electrode 15 and the second electrode 16 can have a laminated structure of Ni/Ru/Au, Ti/Pt/Au, or the like, for example. The thickness of the metal layer containing a high melting point metal such as Ru is preferably about 10Å to 1000Å.

As shown in FIG. 3E, the first light emitting device 11 and the second light emitting device 12 may include a light transmissive member 25 and a light guide member 35 in addition to the light emitting element 1 and the light reflecting member 30.

The translucent member 25 is provided on the light emitting element 1. By disposing the translucent member 25 on the light emitting element 1, the light emitting element 1 can be protected from external stress. The side surface of the translucent member 25 is covered with the light reflecting member 30. As a result, the contrast between the light emitting region and the non-light emitting region is increased, and a light emitting device having a good parting property can be obtained. In FIG. 3E, the light reflecting member 30 is provided around the light transmitting member 25, and the upper surface of the light transmitting member 25 and the upper surface of the light reflecting member 30 are substantially flush with each other.

The translucent member 25 can have a phosphor layer 25a and/or a transparent layer 25b. The translucent member 25 preferably has a phosphor layer 25a containing a phosphor. As a result, the light emitted by the light emitting element 1 and the light emitted by the phosphor can be mixed to output a desired mixed color light. The phosphor may be uniformly dispersed in the phosphor layer 25a, or the phosphor may be unevenly distributed closer to the light emitting element 1 side than the upper surface of the phosphor layer 25a. By unevenly distributing the phosphor closer to the light emitting element 1 than the upper surface of the phosphor layer 25a, deterioration of the phosphor, which is weak against moisture, due to water can be easily suppressed. Examples of phosphors weak against water include manganese-activated fluoride-based phosphors. The manganese-activated fluoride-based phosphor is a preferable phosphor from the viewpoint of color reproducibility because it can emit light with a relatively narrow spectral line width. The phosphor may be one kind of phosphor or plural kinds of phosphors.

The phosphor layer 25a can have a plurality of phosphor layers. For example, the phosphor layer 25a can include a phosphor layer containing a manganese-activated fluoride-based phosphor and a phosphor layer containing a β-sialon-based phosphor. The phosphor layer 25a may be a single layer, and the single-layer phosphor layer 25a may contain a manganese-activated fluoride-based phosphor and a β-sialon-based phosphor.

In the light emitting device, the light guide member 35 can be arranged between the light emitting element 1 and the translucent member 25. The light guide member 35 covers the side surface of the light emitting element 1, and guides the light emitted from the side surface of the light emitting element 1 toward the upper surface of the light emitting device. By disposing the light guide member 35 on the side surface of the light emitting element 1, it is possible to prevent a part of the light reaching the side surface of the light emitting element 1 from being reflected by the side surface and being attenuated in the light emitting element 1. The light guide member 35 can cover the upper surface and the side surface of the light emitting element 1. Thereby, the adhesion strength between the light emitting element 1 and the light guide member 35 can be improved. The light guide member 35 is, for example, a member including a resin material as a base material. As the resin material, a translucent resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin can be preferably used. The light guide member 35 preferably has a high light transmittance. Therefore, it is preferable that the light guide member 35 does not include a substance that reflects, absorbs, or scatters light. As the light guide member 35, a member having higher transmittance of light from the light emitting element 1 than the light reflecting member 30 is selected.

The light guide member 35 has, for example, a difference in thermal expansion coefficient between the light guide member 35 and the light emitting element 1 (this is referred to as “first difference in thermal expansion coefficient ΔT30”), and the light reflection member 30 and the light emitting element 1. It is preferable to select the material of the light guide member 35 so that ΔT40<ΔT30 when compared with the difference in thermal expansion coefficient (this is referred to as “second difference in thermal expansion coefficient ΔT40”). This can prevent the light guide member 35 from peeling off from the light emitting element 1.

Next, returning to FIGS. 1A and 1B, the first conductive member 5, the second conductive member 6, the first adhesive member 7, and the second adhesive member 8 will be described.
The first light emitting device 11 is arranged such that the pair of first electrodes 15 located on the first lower surface 11b face the pair of first wirings 51 of the mounting substrate 50. A pair of first conductive members 5 are arranged between the pair of first electrodes 15 and the pair of first wirings 51, and the pair of first electrodes 15 and the pair of first wirings 51 connect the first conductive member 5 to each other. Electrically connected via. The first conductive member 5 is, for example, solder.

The second light emitting device 12 is arranged such that the pair of second electrodes 16 located on the second lower surface 12b face the pair of second wirings 52 of the mounting substrate 50. A pair of second conductive members 6 are disposed between the pair of second electrodes 16 and the pair of second wirings 52, and the pair of second electrodes 16 and the pair of second wirings 52 form the second conductive member 6. Electrically connected via. The second conductive member 6 is, for example, solder.

The first light emitting device 11 and the second light emitting device 12 are further fixed on the mounting substrate 50 by using the first adhesive member 7 and the second adhesive member 8. By using the first adhesive member 7 and the second adhesive member 8 in addition to the conductive member such as solder, the fixing strength between the light emitting device and the mounting substrate can be improved. The first conductive member 5 and the second conductive member 6 are conductive members, and the first adhesive member 7 and the second adhesive member 8 are members made of an insulating resin material. The first adhesive member 7 and the second adhesive member 8 are made of, for example, a resin material containing epoxy as a base material.

The first adhesive member 7 is located between the first side surface 11c of the first light emitting device 11 and the second side surface 12c of the second light emitting device 12, and is in contact with both the first light emitting device 11 and the second light emitting device 12. .. In other words, one adhesive member (first adhesive member 7) is located between the first light emitting device 11 and the second light emitting device 12, and the first adhesive member 7 is the first light emitting device 11 and the second light emitting device 12. Both are fixed to the mounting substrate 50. As a result, the distance between the light emitting devices can be reduced as compared with the case where the adhesive members are arranged at the edges of the light emitting devices. As a result, in a top view, it is possible to effectively suppress the luminance unevenness between the luminance of light emitted above each light emitting device and the luminance of light between the light emitting devices. Further, since the number of steps for disposing the adhesive member can be reduced, the lead time of the manufacturing process can be shortened. Further, the fixing strength between each light emitting device and the mounting substrate can be improved.

The first adhesive member 7 is at least in contact with the first side surface 11c of the first light emitting device 11 and the second side surface 12c of the second light emitting device 12. Preferably, the first adhesive member 7 is the first side surface 11c of the first light emitting device 11, one or two side surfaces adjacent to the first side surface 11c, the second side surface 12c and the second side surface of the second light emitting device 12. It contacts one or two side surfaces adjacent to 12c. Since the first adhesive member 7 is in contact with two or more side surfaces of each light emitting device, the fixing strength between each light emitting device and the mounting substrate can be further improved.

As shown in FIG. 1B, the highest portion of the upper surface 70 of the first adhesive member 7 has the same height as the upper surface of each light emitting device or the height lower than the upper surface of each light emitting device. It is preferable. Thus, for example, when the light source device 500 is arranged in the liquid crystal display device, when the upper surface of each light emitting device and the light incident surface of the light guide plate are arranged close to each other, the light incident surface of the light guide plate and the first It is possible to prevent the adhesive member 7 from unintentionally coming into contact with each other and cracking the first adhesive member 7. For example, the first adhesive member 7 may have a curved surface on the upper surface that curves in a direction from the upper surface to the lower surface. Thereby, the upper surface of the first adhesive member 7 can be easily made lower than the upper surface of each light emitting device. The upper surface of the first adhesive member 7 may be a flat surface or may have a curved surface that curves in a direction from the lower surface to the upper surface.

The first adhesive member 7 can be made of a translucent resin material as a base material. The first adhesive member 7 may include a light-transmitting resin material and a light-reflecting substance or a light-absorbing substance. For example, the first adhesive member 7 can be a white member containing a light-reflecting substance such as titanium oxide. Since the first adhesive member 7 contains the light-reflecting substance, part of the light reflected to the light emitting device side by the light incident surface of the light guide plate or the like can be reflected upward by the first adhesive member 7. Further, the first adhesive member 7 can be a black member including a light absorbing member such as carbon black. Since the first adhesive member 7 includes the light absorbing member, the first adhesive member 7 absorbs part of the light reflected by the light incident surface of the light guide plate toward the light emitting device, and the mother of the first adhesive member 7 is absorbed. It is possible to suppress the deterioration of the resin material that is the material. The first adhesive member 7 does not have to include a light reflecting material or a light absorbing member.

The second adhesive member 8 is arranged between the pair of first wirings 51 and between the pair of second wirings 52 in a top view. The second adhesive member 8 is a member that improves the bonding strength between each light emitting device and the mounting substrate, like the first adhesive member 7. Further, since the second adhesive member 8 is located between the pair of wirings, it is possible to prevent the conductive members arranged on each wiring from contacting each other. The second adhesive member 8 contacts the first lower surface 11b of the first light emitting device 11 and the second lower surface 12b of the second light emitting device 12. Specifically, the second adhesive member 8 arranged between the pair of first wirings 51 is in contact with the first lower surface 11b of the first light emitting device 11 and is arranged between the pair of second wirings 52. The second adhesive member 8 contacts the second lower surface 12b of the second light emitting device 12. Further, the second adhesive member 8 is arranged apart from the first adhesive member 7 as shown in FIG. 1B.

As shown in FIG. 1B, the second adhesive member 8 is preferably in contact with not only the lower surface of each light emitting device but also one or two side surfaces adjacent to the lower surface. The one or two side surfaces adjacent to the lower surface refer to side surfaces located in a direction orthogonal to the direction in which the first light emitting device 11 and the second light emitting device 12 are arranged. The second adhesive member 8 is in contact with those side surfaces, so that the fixing strength between each light emitting device and the mounting substrate 50 can be improved.

Next, the arrangement of the first conductive member 5, the second conductive member 6, the first adhesive member 7 and the second adhesive member 8 and the mounting of each light emitting device will be described with reference to FIGS. 4A to 4D.

First, as shown in FIG. 4A, a mounting board 50 having a pair of first wirings 51 and a pair of second wirings 52 on the upper surface 50a is prepared. In a later step of mounting the light emitting device, the first light emitting device 11 is arranged on the upper surfaces of the pair of first wirings 51, and the second light emitting device 12 is arranged on the upper surfaces of the pair of second wirings 52. .. Copper can be used as the base material for the pair of first wirings 51 and the pair of second wirings 52. Thereby, the cost of the mounting board 50 can be reduced, and the heat generated from each light emitting device can be efficiently radiated. The pair of first wirings 51 and the pair of second wirings 52 can have plating on the surface of the base copper. Thereby, the wettability of the bonding material on the wiring can be improved.

Next, as shown in FIG. 4B, the conductive material 5 a to be the first conductive member 5 is arranged on the first wiring 51, and the conductive material 6 a to be the second conductive member 6 is arranged on the second wiring 52. In FIG. 4B, the regions where the conductive material 5a and the conductive material 6a are formed are hatched. The conductive material 5a and the conductive material 6a are, for example, solder. The conductive material 5a and the conductive material 6a can be formed only on the wiring, for example, by disposing a mask on the mounting substrate 50 and using a printing method or the like.

Next, as shown in FIG. 4C, a resin material (hereinafter, referred to as a resin material 7a) that becomes the first adhesive member 7 after being solidified is disposed between the first wiring 51 and the second wiring 52. Further, a resin material (hereinafter referred to as a resin material 8a) which becomes the second adhesive member 8 after being solidified is arranged between the pair of first wirings 51 and between the pair of second wirings 52. The step of disposing the resin material 7a and the step of disposing the resin material 8a may be the same step or different steps. The step of forming the resin material (the resin material 7a and the resin material 8a) may be before or after the step of forming the conductive material (the conductive material 5a and the conductive material 6a).

The step of disposing the resin material 7a and the resin material 8a can be formed, for example, by applying the resin material 7a and the resin material 8a on the mounting substrate 50 using a dispensing device. The resin material 7a and the resin material 8a are arranged so as not to contact each other. As a result, it is possible to reduce the possibility that the resin material 7a and the resin material 8a are inadvertently brought into contact with each other and one resin material is pulled by the other resin material and the resin material is displaced. The step of arranging the resin material 7a and the resin material 8a is performed, for example, by spraying the resin material by an inkjet method or by printing the resin material by using a mask by a printing method, in addition to the method using the dispensing device. You can do it. When the printing method is used, first, a conductive member mask is arranged on the mounting substrate 50, and a conductive material is printed. Next, the conductive member mask is removed, the resin member mask is placed on the mounting substrate 50, and the resin material is printed. In this case, a recess is provided in the area where the printed conductive material is located on the installation surface of the resin member mask. Accordingly, the resin material can be arranged in a desired region while suppressing contact between the resin member mask and the previously printed conductive material.

The resin material 7a is preferably arranged so as to be separated from the adjacent first wiring 51 and second wiring 52 in a top view. As a result, it is possible to prevent a portion of the resin material 7a from being located on the first wiring 51 and the second wiring 52. As a result, the electrodes located on the lower surface of the light emitting device and the wiring of the mounting substrate are joined together mainly through the conductive material. This strengthens the bonding between the light emitting device and the mounting substrate. In addition, since the insulating resin material is not disposed between the electrodes of the light emitting device and the wiring of the mounting substrate, it is possible to prevent the light emitting device from becoming unlit. The resin material 7a may be partially disposed on the adjacent first wiring 51 and second wiring 52.

The planar shapes of the resin material 7a and the resin material 8a can be various shapes. The planar shapes of the resin material 7a and the resin material 8a can be, for example, elliptical or circular.

Next, as shown in FIG. 4D, the first light emitting device 11 is arranged on the pair of first wirings 51, and the second light emitting device 12 is arranged on the pair of second wirings 52. The pair of first electrodes 15 of the first light emitting device 11 are in contact with the pair of conductive materials 5a on the pair of first wirings 51, and the first lower surface 11b of the first light emitting device 11 is the resin material 8a on the mounting substrate 50. Contact with. The pair of second electrodes 16 of the second light emitting device 12 are in contact with the pair of conductive materials 6a on the pair of second wirings 52, and the second lower surface 12b of the second light emitting device 12 is the resin material 8a on the mounting substrate 50. Contact with.

Next, a heating step of applying heat to the resin material and the conductive material is performed. When the resin material is a material having a thermosetting resin as a base material, the resin material and the conductive material should be selected so that the temperature T1 at which the resin material is completely solidified is lower than the temperature T2 at which the conductive material melts. Is preferred. That is, it is preferable that the conductive material is melted and the light emitting device and the mounting substrate are bonded together while the light emitting device is temporarily fixed by the resin member that has been solidified previously. Accordingly, when the conductive material is melted, it is possible to prevent the light emitting device from being moved or rotated in an unintended direction by being pulled by the conductive material. As a result, the mounting accuracy of the light emitting device on the mounting substrate can be improved. By performing the heating step, the first conductive member 5, the second conductive member 6, the first adhesive member 7, and the second adhesive member 8 are formed.

Hereinafter, each member used in the light source device 500 of the present invention will be described.

(First light emitting device 11, second light emitting device 12)
The first light emitting device 11 and the second light emitting device 12 function as a light source of the light source device 500. The light source device 500 may include one or more other light emitting devices in addition to the first light emitting device 11 and the second light emitting device 12. Each light emitting device includes at least the light emitting element 1, and the light reflecting member 30 that covers the side surface of the light emitting element 1 and efficiently reflects the light from the light emitting element 1.

(Light emitting element 1)
The light emitting element 1 is, for example, an LED chip. Light-emitting element 1, for example, a semiconductor multilayer structure including a light emitting capable nitride semiconductor of ultraviolet to visible range _{(In x Al y Ga 1-} x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) Can have. The emission peak wavelength of the light emitting element 1 is preferably 400 nm or more and 530 nm or less, more preferably 420 nm or more and 490 nm or less, and more preferably 450 nm or more and 475 nm or less in consideration of the emission efficiency of the light emitting device, the excitation spectrum of the wavelength conversion particles, and the color mixing property. More preferable.

The number of light emitting elements may be one or two or more. When there are a plurality of light emitting elements, the plurality of light emitting elements are, for example, a plurality of blue light emitting elements that emit blue light, three light emitting elements that emit blue light, green light and red light respectively, or emit blue light. A combination of a light emitting element that emits light and a light emitting element that emits green light can be used. When the light emitting device is used as a light source of a liquid crystal display device or the like, as a light emitting element, one light emitting element that emits blue light, two light emitting elements that emit blue light, three or more light emitting elements that emit blue light, or It is preferable to use a combination of a light emitting element that emits blue light and a light emitting element that emits green light. For the light emitting element that emits blue light and the light emitting element that emits green light, it is preferable to use a light emitting element having a half-value width of 40 nm or less, and more preferable to use a light emitting element having a half value width of 30 nm or less. Thereby, blue light and green light can easily have sharp peaks. As a result, for example, when the light emitting device is used as a light source of a liquid crystal display device or the like, the liquid crystal display device can achieve high color reproducibility. In addition, the plurality of light-emitting elements can be electrically connected to each other by a series connection, a parallel connection, or a connection method combining series and parallel.

(Light reflection member 30)
From the viewpoint of light extraction efficiency in the upper surface direction of the light emitting device, the light reflecting member 30 preferably has a light reflectance of 70% or more at the light emission peak wavelength of the light emitting element 1, and more preferably 80% or more. It is preferably 90% or more, and more preferably 90% or more. Further, the light reflecting member 30 is preferably white. The light-reflecting member 30 can include a light-reflecting substance in a resin material as a base material. The light reflecting member 30 can be obtained by solidifying a liquid resin material. The light reflecting member 30 can be formed by transfer molding, injection molding, compression molding, potting, or the like.

The light reflecting member 30 may include a resin material as a base material. A thermosetting resin, a thermoplastic resin, or the like can be used as the resin material as the base material. Specifically, modified epoxy resins such as epoxy resin, silicone resin, silicone modified epoxy resin, modified silicone resin such as epoxy modified silicone resin, modified silicone resin, unsaturated polyester resin, saturated polyester resin, polyimide resin, modified polyimide resin. A cured product such as polyphthalamide (PPA), a polycarbonate resin, a polyphenylene sulfide (PPS), a liquid crystal polymer (LCP), an ABS resin, a phenol resin, an acrylic resin, or a PBT resin can be used. In particular, as the resin material of the light reflection member 30, it is preferable to use a thermosetting resin such as an epoxy resin or a silicone resin, which has excellent heat resistance and light resistance.

Epoxy resin can be selected as the resin material for the base material of the light reflecting member 30. The strength of the light emitting device can be improved by selecting an epoxy resin having higher strength than the silicone resin when solidified. In addition, when the resin material which is the base material of the first adhesive member 7 and the second adhesive member 8 is an epoxy resin, the fixing strength of the first adhesive member 7, the second adhesive member 8 and the light reflection member 30 should be improved. You can

The light reflecting member 30 preferably contains a light reflecting substance in the resin material as the base material. As the light-reflecting substance, it is preferable to use a member that hardly absorbs light from the light emitting element and has a large difference in refractive index from the resin material as the base material. Such a light-reflecting substance is, for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, aluminum nitride or the like.

(Translucent member 25)
The translucent member 25 is a member which is provided on the light emitting element 1 and protects the light emitting element 1. The translucent member 25 may be a single layer or a multilayer. When the translucent member 25 has a plurality of layers, the base material of each layer may be the same or different.

As the base material of the translucent member 25, a material having translucency to the light of the light emitting element 1 is used. In the present specification, having translucency means that the light transmittance of the light emitting element 1 at the emission peak wavelength is 60% or more, preferably 70% or more, and more preferably 80% or more. .. As the base material of the translucent member 25, for example, silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, or modified resin thereof can be used. Further, the base material of the translucent member 25 may be glass. In particular, silicone resins and epoxy resins are preferably used because they have excellent heat resistance and light resistance. Examples of the silicone resin include dimethyl silicone resin, phenyl-methyl silicone resin, diphenyl silicone resin and the like. The modified resin in this specification includes a hybrid resin.

The transparent member 25 may contain light diffusing particles. Examples of the light diffusion particles include silicon oxide, aluminum oxide, zirconium oxide, zinc oxide and the like. As the light diffusion particles, one of these may be used alone, or two or more of these may be used in combination. In particular, it is preferable to use silicon oxide having a small linear expansion coefficient as the light diffusion particles. Further, it is preferable to use nanoparticles as the light diffusion particles. This increases the scattering of light emitted by the light emitting element, and reduces the amount of wavelength conversion particles used. The nanoparticles are particles having a particle size of 1 nm or more and 100 nm or less. The particle size in the present specification is mainly defined by D50.

The translucent member 25 may include a phosphor layer 25a containing a phosphor. The phosphor is a member that absorbs at least a part of the primary light emitted from the light emitting element and emits secondary light having a wavelength different from that of the primary light. As the fluorescent substance, one of the fluorescent substances shown below can be used alone, or two or more types can be used in combination.

Examples of the phosphor include yttrium/aluminum/garnet-based phosphor (for example, Y ₃ (Al,Ga) ₅ O ₁₂ :Ce) and lutetium/aluminum/garnet-based phosphor (for example, Lu ₃ (Al,Ga) ₅ O ₁₂ :). Ce), terbium-aluminum-garnet-based phosphor (for example, Tb ₃ (Al, Ga) ₅ O ₁₂ :Ce), silicate-based phosphor (for example, (Ba,Sr) ₂ SiO ₄ :Eu), chlorosilicate-based phosphor. (e.g. _{Ca 8 Mg (SiO 4) 4} Cl 2: Eu), β -sialon-based phosphor (e.g. _{Si 6-z Al z O z} N 8-z: Eu (0 <z <4.2)), SGS -based Phosphor (for example, SrGa ₂ S ₄ :Eu), alkaline earth aluminate-based phosphor (for example, (Ba,Sr,Ca)Mg _x Al ₁₀ O _17-x :Eu,Mn), α-sialon-based phosphor (for example, M _z (Si,Al) ₁₂ (O,N) ₁₆ (where 0<z≦2, M is Li, Mg, Ca, Y, and a lanthanide element other than La and Ce), nitrogen-containing calcium aluminosilicate system phosphors (e.g. _{(Sr, Ca) AlSiN 3:} Eu), manganese activated fluoride phosphor (general formula _{(I) A 2 [M 1} -a Mn a F 6] in the phosphor represented (however, In the general formula (I), A is at least one selected from the group consisting of K, Li, Na, Rb, Cs, and NH ₄ , and M is a group consisting of a Group 4 element and a Group 14 element. And y is 0<a<0.2)). The yttrium-aluminum-garnet-based phosphor emits light by substituting a part of Y with Gd. The peak wavelength can be shifted to the longer wavelength side, and a typical example of the manganese-activated fluoride-based phosphor is a manganese-activated potassium fluorosilicate phosphor (for example, K ₂ SiF ₆ :Mn).
Further, the translucent member 25 may be a sintered body of a phosphor and an inorganic material such as alumina, or a plate crystal of the phosphor.

(Light guide member 35)
The light guide member 35 covers the side surface of the light emitting element 1, and guides the light emitted from the side surface of the light emitting element 1 toward the upper surface of the light emitting device. That is, a part of the light reaching the side surface of the light emitting element 1 is reflected by the side surface and attenuated in the light emitting element 1, but the light guide member 35 guides the light into the light guide member 35 and outside the light emitting element 1. Can be taken out. The resin material exemplified for the light reflecting member 30 can be used for the light guide member 35. In particular, it is preferable to use a thermosetting translucent resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin as the light guide member 35. The light guide member 35 preferably has a high light transmittance. Therefore, it is usually preferable that the light guide member 35 does not substantially contain an additive that reflects, absorbs, or scatters light. The term “substantially free of additives” means that additives are inevitably mixed. The light guide member 35 may contain the same light diffusing particles and/or wavelength converting particles as the above-mentioned light transmissive member 25.

(Mounting board 50)
The mounting substrate 50 includes a plate-shaped base material made of glass epoxy resin, ceramic, polyimide, or the like. Further, the mounting substrate 50 has a land portion and a wiring pattern made of copper, gold, silver, nickel, palladium, tungsten, chromium, titanium, or an alloy thereof on the base material. The land portion and the wiring pattern are formed by using a method such as plating, lamination pressure bonding, attachment, sputtering, vapor deposition, and etching.

(First conductive member 5, second conductive member 6)
For the first conductive member 5 and the second conductive member 6, any material known in the art can be used. Specifically, the first conductive member 5 and the second conductive member 6 are made of tin-bismuth-based solder, tin-copper-based solder, tin-silver-based solder, gold-tin-based solder (specifically, Ag and Cu. An alloy containing Sn as a main component, an alloy containing Cu and Sn as a main component, an alloy containing Bi and Sn as a main component, a eutectic alloy (an alloy containing Au and Sn as a main component, Au) Alloys containing Si as a main component, alloys containing Au and Ge as main components, conductive pastes such as silver, gold and palladium, bumps, anisotropic conductive materials, brazing materials such as low melting point metals, etc. Can be mentioned.

(First adhesive member 7, second adhesive member 8)
For the first adhesive member 7 and the second adhesive member 8, for example, resin materials such as the epoxy resin listed for the translucent member 25 can be used. The first adhesive member 7 and the second adhesive member 8 may be the same material or different materials.

(Embodiment 2)
FIG. 5 is a schematic side view of the light source device 600 according to the second embodiment. The light source device 600 mainly differs from the light source device 500 according to the first embodiment in that a recess is formed in the first side surface 11c of the first light emitting device 11 and the second side surface 12c of the second light emitting device 12. Therefore, the depression formed on the first side surface 11c of the first light emitting device 11 and the second side surface 12c of the second light emitting device 12 will be mainly described. In FIG. 5, the region where the first adhesive member 7 is arranged is hatched for the sake of clarity.

The first light emitting device 11 has a first recess 13a that is open in the first side surface 11c and the first lower surface 11b and that is recessed in a direction opposite to the second side surface 12c. In addition, the second light emitting device 12 has a second recess 13b that is open in the second side surface 12c and the second lower surface 12b and is recessed in the direction opposite to the first side surface 11c. In FIG. 5, the light reflection member 30 is located on the inner surface of the first depression 13a and the inner surface of the second depression 13b. The first adhesive member 7 is arranged in the first depression 13a and the second depression 13b.

6A is a schematic top view of the first light emitting device 11 according to the second embodiment, FIG. 6B is a schematic bottom view of the first light emitting device 11, and FIG. 6C is a schematic side view of the first light emitting device 11. Is. FIG. 6C is a view of the first light emitting device 11 as seen from the direction E shown in FIG. 6A. The length T1 of the opening of the first depression 13a is, for example, 0.2 times or more and 0.8 times or less, and 0.4 times or more and 0.6 times, the maximum thickness T2 of the first light emitting device 11 in the height direction. The following is preferable. This makes it easier for the first adhesive member 7 to stay in the first recess 13a, and for example, it is possible to prevent the first adhesive member 7 from reaching the upper surface of each light emitting device. In the direction from the first side surface 11c to the second side surface 12c, the width W1 of the first recess 13 is, for example, 0.01 times or more and 0.5 times or less of the maximum width W2 of the first light emitting device 11. It is preferably 0.03 times or more and 0.1 times or less. As a result, the adhesion between the first depression 13a and the first adhesive member 7 becomes good. Further, by setting the width W1 of the first recessed portion 13 to the above numerical value, the first light emitting device 11 is easily pulled to the mounting substrate 50 side when the resin material that becomes the first adhesive member 7 solidifies. Become. This makes it easy to make a minute error in the separation distance from the mounting substrate 50 on the entire lower surface of the first light emitting device 11 uniform.

The first light emitting device 11 may have depressions on the other side surfaces 11d and 11e adjacent to the first side surface 11c in addition to the first side surface 11c. As a result, the first adhesive member 7 enters the depressions on the other side surfaces 11d and 11e in addition to the first depression 13a, so that the fixing strength between the first light emitting device 11 and the mounting substrate 50 can be further improved. .. Further, as shown in FIG. 6C, the first light emitting device 11 may have a recess on the side surface 11f located on the opposite side of the first side surface 11c. Accordingly, when the light source device 600 has three or more light emitting devices and another light emitting device is arranged so as to face the side surface 11f of the first light emitting device 11, the first light emitting device 11 and the second light emitting device are arranged. As in the case of the first light emitting device 12, the arrangement of the first adhesive member 7 between the first light emitting device 11 and another light emitting device becomes easy. The first light emitting device 11 may have a recess only on the first side surface 11c among the plurality of side surfaces.

The shape or arrangement of the second recess 13b in the second light emitting device 12 can be variously changed similarly to the first recess 13a in the first light emitting device 11.

Since the first light-emitting device 11 and the second light-emitting device 12 have the first recess 13a and the second recess 13b, the first adhesive member 7 and the first side surface 11c and the second side surface 12c are different from the case where the first adhesive member 7 and the second side surface 12c are flat. The area which can contact is increased, and the fixing strength of the first light emitting device 11, the second light emitting device 12, and the first adhesive member 7 is improved. Further, by disposing the first adhesive member 7 in the first recess 13a and the second recess 13b, the first adhesive member 7 is likely to stay in the first recess 13a and the second recess 13b, for example, the first adhesive It is possible to prevent the member 7 from reaching the upper surface of each light emitting device. Thereby, for example, when the light source device 600 is arranged in the liquid crystal display device, when the upper surface of each light emitting device and the light incident surface of the light guide plate are arranged in close proximity to each other, the light incident surface of the light guide plate and the first It is possible to prevent the adhesive member 7 from unintentionally coming into contact with each other and cracking the first adhesive member 7.

(Embodiment 3)
7A is a schematic top view of the light source device 700 according to the third embodiment, and FIG. 7B is a schematic front view of the light source device 700. The light source device 700 according to the third embodiment mainly differs from the light source device 500 according to the first embodiment in that the first light emitting device 11 and the second light emitting device 12 are side-light emitting devices. Therefore, in the light source device 700 of the third embodiment, the first light emitting device 11 and the second light emitting device 12 will be mainly described.

8A and 8B are schematic perspective views of the first light emitting device 11. The first light emitting device 11 includes a first front surface 21a serving as a light emitting surface, a first lower surface 21b on which a pair of first electrodes 15 are arranged orthogonal to the first front surface 21a, a first front surface 21a and a first lower surface 21b. It has the 1st side 21c to connect. The first light emitting device 11 shown in FIGS. 8A and 8B has a first back surface 21d located on the opposite side of the first front surface 21a. The first light emitting device 11 is a side light emitting type (side view type) light emitting device having the first lower surface 21b as a mounting surface.

In the first light emitting device 11 according to the third embodiment, as shown in FIG. 8B, the first electrode 15 may have a lower surface electrode 15a located on the first lower surface 21b and a back surface electrode 15b located on the first back surface 21d. it can. Since the first electrode 15 includes the lower surface electrode 15a and the rear surface electrode 15b, the heat generated by the light emitting element 1 can be efficiently radiated from the lower surface side and the rear surface side. Further, since the conductive member (first conductive member 5) is in contact with the back electrode 15b in addition to the lower surface electrode 15a, the bonding strength between the conductive member and the light emitting device can be improved.

The second light emitting device 12 can also have the same configuration as the first light emitting device 11. The second light emitting device 12 is connected to the second front surface 22a serving as a light emitting surface, the second lower surface on which the pair of second electrodes 16 are arranged orthogonal to the second front surface 22a, and the second front surface 22a and the second lower surface. It has the 2nd side 22c. In addition, the second light emitting device 12 has a second back surface located on the opposite side of the second front surface 22a.

Further, as shown in FIGS. 7A and 7B, the first light emitting device 11 is arranged such that the first lower surface 21b faces the upper surfaces of the pair of first wirings 51 of the mounting substrate 50. The pair of first electrodes 15 located on the first lower surface 21b are electrically connected to the pair of first wirings 51 via the pair of first conductive members 5. The second light emitting device 12 is arranged such that the second lower surface faces the upper surfaces of the pair of second wirings 52 of the mounting substrate 50. The pair of second electrodes 16 located on the second lower surface are electrically connected to the pair of second wirings 52 via the pair of second conductive members 6.

The first light emitting device 11 and the second light emitting device 12 are further fixed on the mounting substrate 50 by the first adhesive member 7 and the second adhesive member 8. The first adhesive member 7 is in contact with both the first light emitting device 11 and the second light emitting device 12 between the first side surface 21c of the first light emitting device 11 and the second side surface 22c of the second light emitting device 12. Will be placed. Further, the second adhesive member 8 contacts the first lower surface 21b of the first light emitting device 11 or the second lower surface of the second light emitting device 12 between the pair of first wirings 51 or between the pair of second wirings 52. , And is separated from the first adhesive member 7. By fixing the first light emitting device 11 and the second light emitting device 12 using the first adhesive member 7 and the second adhesive member 8, it is possible to improve the fixing strength between each light emitting device and the mounting substrate 50. ..

REFERENCE SIGNS LIST 1 light emitting element 5 first conductive member 6 second conductive member 7 first adhesive member 7a upper surface 8 second adhesive member 11 first light emitting device 11a first upper surface 11b first lower surface 11c first side surface 12 second light emitting device 13a first Recess 13b Second recess 15 First electrode 16 Second electrode 21a First front surface 21b First lower surface 21c First side surface 22a Second front surface 22b Second lower surface 22c Second side surface 25 Translucent member 25a Phosphor layer 25b Transparent layer 30 Light reflection member 35 Light guide member 50 Mounting board 50a Upper surface 51 First wiring 52 Second wiring 70 Upper surface 600 Light source device 700 Light source device 800 Light source device

Claims (10)

A mounting board having a pair of first wirings and a pair of second wirings adjacent to the pair of first wirings on an upper surface;
A first upper surface serving as a light emitting surface, a first lower surface located on the opposite side of the first upper surface and having a pair of first electrodes disposed thereon, and a first side surface connected to the first upper surface and the first lower surface. A first light-emitting device having the first lower surface facing the upper surfaces of the pair of first wirings;
A second upper surface serving as a light emitting surface, a second lower surface located on the opposite side of the second upper surface and having a pair of second electrodes disposed thereon, and a second side surface connected to the second upper surface and the second lower surface. A second light-emitting device having the second lower surface facing the upper surfaces of the pair of second wirings;
A pair of first conductive members that are disposed between the pair of first electrodes and the pair of first wirings and electrically connect the pair of first electrodes and the pair of first wirings;
A pair of second conductive members that are disposed between the pair of second electrodes and the pair of second wirings and electrically connect the pair of second electrodes and the pair of second wirings. ,
The first light emitting device and the second light emitting device are arranged such that the first side surface and the second side surface face each other,
A first adhesive member that is in contact with both the first light emitting device and the second light emitting device is disposed between the first side surface and the second side surface,
Between the pair of first wirings or between the pair of second wirings, contact the first lower surface of the first light emitting device or the second lower surface of the second light emitting device and separate from the first adhesive member. A light source device in which a second adhesive member is disposed. The light source device according to claim 1, wherein the upper surface of the first adhesive member is lower than the first upper surface of the first light emitting device and the second upper surface of the second light emitting device in the height direction. The first light emitting device has a first recessed portion that is open in the first side surface and the first lower surface and is recessed in a direction opposite to the second side surface,
The second light emitting device has a second recessed portion that is open in the second side surface and the second lower surface and is recessed in a direction opposite to the first side surface,
The said 1st adhesive member is in contact with both the inner surface of the said 1st hollow part, and the inner surface of the said 2nd hollow part, and is arrange|positioned in the said 1st hollow part and the said 2nd hollow part. Light source device. In the height direction,
The length of the opening of the first recess is 0.4 times or more and 0.6 times or less of the maximum thickness of the first light emitting device,
The light source device according to claim 3, wherein the length of the opening of the second recess is 0.4 times or more and 0.6 times or less the maximum thickness of the second light emitting device. In the direction from the first side surface to the second side surface,
The width of the first recess is 0.03 times or more and 0.1 times or less the maximum width of the first light emitting device,
The light source device according to claim 3 or 4, wherein a width of the second recessed portion is 0.03 times or more and 0.1 times or less of a maximum width of the second light emitting device. The first adhesive member is located between the first wiring and the second wiring adjacent to the first wiring in a top view,
The light source device according to claim 1, wherein the first adhesive member is separated from the first wiring and the second wiring in a top view. The light source device according to claim 1, wherein the first adhesive member has a curved surface that curves in a direction from the upper surface to the lower surface on the upper surface. The light source device according to claim 1, wherein the first adhesive member is white. The light source device according to claim 1, wherein the first adhesive member is black. A mounting board having a pair of first wirings and a pair of second wirings adjacent to the pair of first wirings on an upper surface;
A first front surface to be a light emitting surface, a first lower surface on which a pair of first electrodes are arranged orthogonal to the first front surface, and a first side surface connected to the first front surface and the first lower surface, A first light emitting device arranged such that the first lower surface faces the upper surfaces of the pair of first wirings;
A second front surface serving as a light emitting surface, a second lower surface on which a pair of second electrodes are arranged orthogonal to the second front surface, and a second side surface connected to the second front surface and the second lower surface, A second light emitting device arranged such that the second lower surface faces the upper surfaces of the pair of second wirings;
A pair of first conductive members that are disposed between the pair of first electrodes and the pair of first wirings and electrically connect the pair of first electrodes and the pair of first wirings;
A pair of second conductive members that are disposed between the pair of second electrodes and the pair of second wirings and electrically connect the pair of second electrodes and the pair of second wirings. ,
The first light emitting device and the second light emitting device are arranged such that the first side surface and the second side surface face each other,
A first adhesive member that is in contact with both the first light emitting device and the second light emitting device is disposed between the first side surface and the second side surface, and is disposed between the pair of first wirings or the pair of first wirings. A light source device in which a second adhesive member that is in contact with the first lower surface of the first light emitting device or the second lower surface of the second light emitting device and is separated from the first adhesive member is disposed between the two wirings.

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