JP7190649B2 - Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board - Google Patents

Description

TECHNICAL FIELD The present invention relates to a resin composition, a prepreg, a resin-coated film, a resin-coated metal foil, a metal-clad laminate, and a wiring board.

With the increase in the amount of information processed in various electronic devices, mounting techniques such as higher integration of semiconductor devices to be mounted, higher wiring density, and multilayering are progressing. Moreover, wiring boards used in various electronic devices are required to be high-frequency compatible wiring boards, such as millimeter-wave radar boards for in-vehicle applications. Wiring boards used in various electronic devices are required to reduce loss during signal transmission in order to increase the signal transmission speed, and high-frequency compatible wiring boards are particularly required to do so. In order to satisfy this demand, substrate materials for forming substrates of wiring boards used in various electronic devices are required to have a low dielectric constant and a low dielectric loss tangent.

On the other hand, molding materials such as base materials are required to have not only excellent low dielectric properties but also excellent heat resistance and the like. For this reason, it is conceivable to increase the heat resistance by using a resin that can be polymerized together with a curing agent or the like, for example, a resin having a vinyl group or the like, as the resin contained in the substrate material.

Examples of such a base material include the resin composition described in Patent Document 1, and the like. Patent Document 1 describes a curable resin composition containing a vinyl compound having a polyphenylene ether skeleton in the molecule and a bismaleimide compound having a predetermined structure.

JP 2009-161725 A

According to Patent Document 1, it provides a cured product with a low dielectric constant, a low dielectric loss tangent, excellent heat resistance, mechanical properties, chemical resistance, and flame retardancy, and has excellent curability even in the presence of oxygen, and cures at a low temperature. It is disclosed that a curable resin composition that can be obtained can be obtained. A substrate of a wiring board obtained using a resin composition having low dielectric properties such as dielectric constant and dielectric loss tangent as described in Patent Document 1 has low dielectric properties, and a wiring board comprising this base material can reduce loss during signal transmission. On the other hand, it is required to further increase the signal transmission speed in the wiring board, and to further increase the heat resistance from the viewpoint of product stability and the like. The heat resistance is not limited to heat resistance such as oven heat resistance of the base material of the wiring board obtained using the resin composition. Also includes heat resistance such that the dielectric properties of the base material of the wiring board do not easily change. Therefore, the material used as the base material is required to have lower dielectric properties and higher heat resistance.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin composition from which a cured product having low dielectric properties and high heat resistance can be obtained. Another object of the present invention is to provide a prepreg, a resin-coated film, a resin-coated metal foil, a metal-clad laminate, and a wiring board obtained using the resin composition.

As a result of various studies, the inventors of the present invention have found that the above object can be achieved by the present invention described below.

A resin composition according to one aspect of the present invention comprises a polymer having a structural unit represented by the following formula (1) in its molecule, and a monofunctional maleimide compound having one maleimide group in its molecule. A resin composition characterized by:

In formula (1), Z represents an arylene group, R ₁ to R ₃ each independently represent a hydrogen atom or an alkyl group, R ₄ to R ₆ each independently represent a hydrogen atom or carbon It represents an alkyl group of numbers 1-6.

Moreover, in the resin composition, it is preferable that the structural unit represented by the formula (1) includes a structural unit represented by the following formula (2).

In formula (2), R ₄ to R ₆ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R ₇ represents an arylene group having 6 to 12 carbon atoms.

Moreover, in the resin composition, it is preferable that the structural unit represented by the formula (2) includes a structural unit represented by the following formula (3).

In formula (3), R ₄ to R ₆ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

Moreover, in the resin composition, it is preferable that the polymer further includes a polymer having a structural unit represented by the following formula (4) in the molecule.

In formula (4), R ₈ to R ₁₀ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R ₁₁ represents an aryl group.

Further, in the resin composition, the aryl group in the structural unit represented by formula (4) preferably contains an aryl group having an alkyl group having 1 to 6 carbon atoms.

Moreover, in the resin composition, the weight average molecular weight of the polymer is preferably 1,500 to 40,000.

Further, in the resin composition, the equivalent weight of the vinyl group contained in the structural unit represented by the formula (1) in which R ₁ to R ₃ are hydrogen atoms of the polymer is 250 to 1200. preferable.

Moreover, in the resin composition, the monofunctional maleimide compound preferably contains a compound represented by the following formula (5) or a compound represented by the following formula (6).

Further, in the resin composition, the content ratio of the polymer to the monofunctional maleimide compound is preferably 50:50 to 90:10 in mass ratio.

A prepreg according to another aspect of the present invention includes the resin composition or a semi-cured material of the resin composition, and a fibrous base material.

A resin-coated film according to another aspect of the present invention includes a resin layer containing the resin composition or a semi-cured product of the resin composition, and a support film.

A resin-coated metal foil according to another aspect of the present invention includes a resin layer containing the resin composition or a semi-cured material of the resin composition, and a metal foil.

A metal-clad laminate according to another aspect of the present invention includes an insulating layer containing a cured product of the resin composition or a cured product of the prepreg, and a metal foil.

A wiring board according to another aspect of the present invention includes an insulating layer containing a cured product of the resin composition or a cured product of the prepreg, and wiring.

ADVANTAGE OF THE INVENTION According to this invention, a resin composition from which a hardened|cured material with low dielectric properties and high heat resistance is obtained can be provided. Moreover, according to the present invention, it is possible to provide a prepreg, a resin-coated film, a resin-coated metal foil, a metal-clad laminate, and a wiring board obtained using the resin composition.

FIG. 1 is a schematic cross-sectional view showing an example of a prepreg according to an embodiment of the invention. FIG. 2 is a schematic cross-sectional view showing an example of a metal-clad laminate according to an embodiment of the invention. FIG. 3 is a schematic cross-sectional view showing an example of a wiring board according to an embodiment of the invention. FIG. 4 is a schematic cross-sectional view showing an example of a resin-coated metal foil according to an embodiment of the invention. FIG. 5 is a schematic cross-sectional view showing an example of a resin-coated film according to an embodiment of the invention.

Embodiments according to the present invention will be described below, but the present invention is not limited to these.

[Resin composition]
A resin composition according to an embodiment of the present invention comprises a polymer having a structural unit represented by the following formula (1) in the molecule and a monofunctional maleimide compound having one maleimide group in the molecule. A resin composition characterized by:

In formula (1), Z represents an arylene group. R ₁ to R ₃ are each independent. That is, R ₁ to R ₃ may each be the same group or different groups. Also, R ₁ to R ₃ represent a hydrogen atom or an alkyl group. R ₄ to R ₆ are each independent. That is, R ₄ to R ₆ may each be the same group or different groups. R ₄ to R ₆ each represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

The present inventors conducted various studies to provide a resin composition that is superior in heat resistance and low dielectric properties to conventional resin compositions such as the resin composition described in Patent Document 1. Specifically, the present inventors focused on the polymer, that is, a polymer having a structural unit represented by the following formula (1) in the molecule, and the cured product obtained by curing this is , excellent in heat resistance and low dielectric properties. Furthermore, the inventors have found that when the polymer is cured using a maleimide compound, the glass transition temperature of the resulting cured product increases, and the heat resistance can be improved. On the other hand, according to the studies of the present inventors, there are cases where the dielectric loss tangent is increased and excellent low dielectric properties cannot be maintained depending on the maleimide compound used. Therefore, as a result of further detailed investigation, it was found that when the above-mentioned monofunctional maleimide compound having one maleimide group in the molecule is used as the maleimide compound, the obtained cured product glass can be obtained while maintaining excellent low dielectric properties. It has been found that the transition temperature can be increased and the heat resistance can be improved. Specifically, when a wiring board is obtained using a resin composition, the base material of the obtained wiring board has high oven heat resistance, moisture absorption solder heat resistance, etc., and even when the wiring board is heated, Furthermore, the inventors have found that the base material of the wiring board has high heat resistance such that the dielectric properties of the base material are not easily changed.

As described above, the resin composition is a resin composition that provides a cured product having low dielectric properties and high heat resistance.

(Polymer)
The polymer is not particularly limited as long as it has a structural unit represented by formula (1) in the molecule. Further, the polymer may have a structural unit other than the structural unit represented by the formula (1) as long as it is a polymer having the structural unit represented by the formula (1) in the molecule. good. Further, the polymer may contain a repeating unit in which the structural unit represented by the formula (1) is repeatedly bonded, or a repeating unit in which the structural unit represented by the formula (1) is repeatedly bonded and the formula It may be a polymer in which repeating units in which structural units other than the structural units represented by (1) are repeatedly bonded are randomly bonded. That is, when it has a structural unit other than the structural unit represented by the formula (1), it may be a block copolymer or a random copolymer.

The arylene group in formula (1) is not particularly limited. The arylene group includes, for example, a monocyclic aromatic group such as a phenylene group, and a polycyclic aromatic group in which the aromatic is not monocyclic but polycyclic aromatic such as a naphthalene ring. The arylene group also includes derivatives in which a hydrogen atom bonded to an aromatic ring is substituted with a functional group such as an alkenyl group, an alkynyl group, a formyl group, an alkylcarbonyl group, an alkenylcarbonyl group, or an alkynylcarbonyl group. .

The alkyl groups represented by R ₁ to R ₃ in formula (1) are not particularly limited, and for example, alkyl groups having 1 to 18 carbon atoms are preferable, and alkyl groups having 1 to 10 carbon atoms are more preferable. Specific examples include methyl group, ethyl group, propyl group, hexyl group, and decyl group.

The alkyl groups having 1 to 6 carbon atoms represented by R ₄ to R ₆ in formula (1) are not particularly limited, and specific examples include methyl group, ethyl group, propyl group, hexyl group, and the like. is mentioned.

The polymer is an aromatic polymer having a structural unit derived from a bifunctional aromatic compound in which two carbon-carbon unsaturated double bonds are bonded to an aromatic ring as the structural unit represented by the formula (1). It preferably includes coalescence. The structural unit derived from the bifunctional aromatic compound is a structural unit obtained by polymerizing the bifunctional aromatic compound. The aromatic polymer is also referred to herein as a divinyl aromatic polymer.

The bifunctional aromatic compound is not particularly limited as long as it is a bifunctional aromatic compound in which two carbon-carbon unsaturated double bonds are bonded to an aromatic ring. Examples of the bifunctional aromatic compound include m-divinylbenzene, p-divinylbenzene, 1,2-diisopropenylbenzene, 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene, 1, 3-divinylnaphthalene, 1,8-divinylnaphthalene, 1,4-divinylnaphthalene, 1,5-divinylnaphthalene, 2,3-divinylnaphthalene, 2,7-divinylnaphthalene, 2,6-divinylnaphthalene, 4,4 '-divinylbiphenyl, 4,3'-divinylbiphenyl, 4,2'-divinylbiphenyl, 3,2'-divinylbiphenyl, 3,3'-divinylbiphenyl, 2,2'-divinylbiphenyl, 2,4-divinyl biphenyl, 1,2-divinyl-3,4-dimethylbenzene, 1,3-divinyl-4,5,8-tributylnaphthalene, and 2,2'-divinyl-4-ethyl-4'-propylbiphenyl, and the like. be done. These may be used alone or in combination of two or more. Among these, the bifunctional aromatic compound is preferably divinylbenzene such as m-divinylbenzene and p-divinylbenzene, and more preferably p-divinylbenzene.

The aromatic polymer may have other structural units in addition to the structural units derived from the bifunctional aromatic compound. Other structural units include, for example, a structural unit derived from a monofunctional aromatic compound in which one carbon-carbon unsaturated double bond is attached to an aromatic ring, and a carbon-carbon unsaturated double bond attached to an aromatic ring. Structural units derived from trifunctional aromatic compounds, structural units derived from indenes, structural units derived from acenaphthylenes, and the like. The structural unit derived from the monofunctional aromatic compound is a structural unit obtained by polymerizing the monofunctional aromatic compound. The structural unit derived from the trifunctional aromatic compound is a structural unit obtained by polymerizing the trifunctional aromatic compound. Structural units derived from indenes are structural units obtained by polymerizing indenes. Further, the structural unit derived from acenaphthylenes is a structural unit obtained by polymerizing acenaphthylenes.

The monofunctional aromatic compound may have one carbon-carbon unsaturated double bond bonded to the aromatic ring, and the aromatic ring is bonded with a group other than the carbon-carbon unsaturated double bond. may be As the monofunctional aromatic compound, for example, one carbon-carbon unsaturated double bond is bonded to an aromatic ring, and a monofunctional aromatic compound other than the carbon-carbon unsaturated double bond is not bonded. compounds, and monofunctional aromatic compounds in which one carbon-carbon unsaturated double bond is bonded to an aromatic ring and an alkyl group such as an ethyl group is further bonded to the aromatic ring.

Examples of monofunctional aromatic compounds having one carbon-carbon unsaturated double bond bonded to an aromatic ring and having no groups other than this carbon-carbon unsaturated double bond include styrene, 2-vinyl biphenyl, 3-vinylbiphenyl, 4-vinylbiphenyl, 1-vinylnaphthalene, 2-vinylnaphthalene, α-alkyl-substituted styrene, and the like. Examples of α-alkyl-substituted styrene include α-methylstyrene, α-ethylstyrene, α-propylstyrene, α-n-butylstyrene, α-isobutylstyrene, α-t-butylstyrene, α-n- pentylstyrene, α-2-methylbutylstyrene, α-3-methylbutyl-2-styrene, α-t-butylstyrene, α-t-butylstyrene, α-n-pentylstyrene, α-2-methylbutylstyrene, α-3-methylbutylstyrene, α-t-pentylstyrene, α-n-hexylstyrene, α-2-methylpentylstyrene, α-3-methylpentylstyrene, α-1-methylpentylstyrene, α-2, 2-dimethylbutylstyrene, α-2,3-dimethylbutylstyrene, α-2,4-dimethylbutylstyrene, α-3,3-dimethylbutylstyrene, α-3,4-dimethylbutylstyrene, α-4, 4-dimethylbutylstyrene, α-2-ethylbutylstyrene, α-1-ethylbutylstyrene, α-cyclohexylstyrene, α-cyclohexylstyrene and the like. These may be used alone or in combination of two or more.

Examples of monofunctional aromatic compounds having one carbon-carbon unsaturated double bond bonded to an aromatic ring and an alkyl group bonded to the aromatic ring include, for example, nuclear alkyl-substituted aromatic compounds and alkoxy-substituted styrenes. mentioned.

Examples of the nuclear alkyl-substituted aromatic compound include an ethylvinyl aromatic compound in which the alkyl group bonded to the aromatic ring is an ethyl group, a nuclear alkyl-substituted styrene in which an alkyl group is bonded to styrene as the aromatic ring, and The ethylvinyl aromatic compound and the nuclear alkyl-substituted aromatic compounds other than the nuclear alkyl-substituted styrene (other nuclear alkyl-substituted aromatic compounds) are included.

Examples of the ethylvinyl aromatic compounds include o-ethylvinylbenzene, m-ethylvinylbenzene, p-ethylvinylbenzene, 2-vinyl-2'-ethylbiphenyl, 2-vinyl-3'-ethylbiphenyl, 2- Vinyl-4'-ethylbiphenyl, 3-vinyl-2'-ethylbiphenyl, 3-vinyl-3'-ethylbiphenyl, 3-vinyl-4'-ethylbiphenyl, 4-vinyl-2'-ethylbiphenyl, 4- Vinyl-3'-ethylbiphenyl, 4-vinyl-4'-ethylbiphenyl, 1-vinyl-2-ethylnaphthalene, 1-vinyl-3-ethylnaphthalene, 1-vinyl-4-ethylnaphthalene, 1-vinyl-5 -ethylnaphthalene, 1-vinyl-6-ethylnaphthalene, 1-vinyl-7-ethylnaphthalene, 1-vinyl-8-ethylnaphthalene, 2-vinyl-1-ethylnaphthalene, 2-vinyl-3-ethylnaphthalene, 2 -vinyl-4-ethylnaphthalene, 2-vinyl-5-ethylnaphthalene, 2-vinyl-6-ethylnaphthalene, 2-vinyl-7-ethylnaphthalene, and 2-vinyl-8-ethylnaphthalene.

Examples of the nuclear alkyl-substituted styrene include m-methylstyrene, p-methylstyrene, m-propylstyrene, p-propylstyrene, mn-butylstyrene, pn-butylstyrene and mt-butylstyrene. , pt-butylstyrene, mn-hexylstyrene, pn-hexylstyrene, m-cyclohexylstyrene, and p-cyclohexylstyrene.

Examples of other nuclear alkyl-substituted aromatic compounds include 2-vinyl-2'-propylbiphenyl, 2-vinyl-3'-propylbiphenyl, 2-vinyl-4'-propylbiphenyl, and 3-vinyl-2'. -propylbiphenyl, 3-vinyl-3'-propylbiphenyl, 3-vinyl-4'-propylbiphenyl, 4-vinyl-2'-propylbiphenyl, 4-vinyl-3'-propylbiphenyl, 4-vinyl-4' -propylbiphenyl, 1-vinyl-2-propylnaphthalene, 1-vinyl-3-propylnaphthalene, 1-vinyl-4-propylnaphthalene, 1-vinyl-5-propylnaphthalene, 1-vinyl-6-propylnaphthalene, 1 -vinyl-7-propylnaphthalene, 1-vinyl-8-propylnaphthalene, 2-vinyl-1-propylnaphthalene, 2-vinyl-3-propylnaphthalene, 2-vinyl-4-propylnaphthalene, 2-vinyl-5- propylnaphthalene, 2-vinyl-6-propylnaphthalene, 2-vinyl-7-propylnaphthalene, 2-vinyl-8-propylnaphthalene and the like.

Examples of the alkoxy-substituted styrene include o-ethoxystyrene, m-ethoxystyrene, p-ethoxystyrene, o-propoxystyrene, m-propoxystyrene, p-propoxystyrene, on-butoxystyrene, mn- butoxystyrene, pn-butoxystyrene, o-isobutoxystyrene, m-isobutoxystyrene, p-isobutoxystyrene, ot-butoxystyrene, mt-butoxystyrene, pt-butoxystyrene, o -n-pentoxystyrene, mn-pentoxystyrene, pn-pentoxystyrene, α-methyl-o-butoxystyrene, α-methyl-m-butoxystyrene, α-methyl-p-butoxystyrene, ot-pentoxystyrene, mt-pentoxystyrene, pt-pentoxystyrene, on-hexoxystyrene, mn-hexoxystyrene, pn-hexoxystyrene, α- Methyl-o-pentoxystyrene, α-methyl-m-pentoxystyrene, α-methyl-p-pentoxystyrene, o-cyclohexoxystyrene, m-cyclohexoxystyrene, p-cyclohexoxystyrene, o-phenoxystyrene , m-phenoxystyrene, and p-phenoxystyrene.

As the monofunctional aromatic compound, the compounds exemplified above may be used alone, or two or more thereof may be used in combination. Among the compounds exemplified above, styrene and p-ethylvinylbenzene are preferable as the monofunctional aromatic compound.

Examples of trifunctional aromatic compounds in which three carbon-carbon unsaturated double bonds are bonded to an aromatic ring include 1,2,4-trivinylbenzene, 1,3,5-trivinylbenzene, 1,2 ,4-triisopropenylbenzene, 1,3,5-triisopropenylbenzene, 1,3,5-trivinylnaphthalene, and 3,5,4′-trivinylbiphenyl. As the trifunctional aromatic compound, the compounds exemplified above may be used alone, or two or more thereof may be used in combination.

Examples of the indenes include indene, alkyl-substituted indene, and alkoxyindene. Examples of the alkyl-substituted indene include methylindene, ethylindene, propylindene, butylindene, t-butylindene, sec-butylindene, n-pentylindene, 2-methyl-butylindene, 3-methyl-butylindene, n-hexylindene, 2-methyl-pentylindene, 3-methyl-pentylindene, 4-methyl-pentylindene and the like. Examples of the alkoxyindene include methoxyindene, ethoxyindene, ptoxyindene, butoxyindene, t-butoxyindene, sec-butoxyindene, n-pentoxyindene, 2-methyl-butoxyindene, 3-methyl-butoxyindene, alkoxyindene such as n-hexytocyindene, 2-methyl-pentoxyindene, 3-methyl-pentoxyindene, 4-methyl-pentoxyindene; As the indenes, the compounds exemplified above may be used alone, or two or more of them may be used in combination.

Examples of the acenaphthylenes include acenaphthylene, alkylacenaphthylenes, halogenated acenaphthylenes, and phenylacenaphthylenes. Examples of the alkylacenaphthylenes include 1-methylacenaphthylene, 3-methylacenaphthylene, 4-methylacenaphthylene, 5-methylacenaphthylene, 1-ethylacenaphthylene, and 3-ethylacenaphthylene. phthalene, 4-ethylacenaphthylene, 5-ethylacenaphthylene and the like. Examples of the halogenated acenaphthylenes include 1-chloroacenaphthylene, 3-chloroacenaphthylene, 4-chloroacenaphthylene, 5-chloroacenaphthylene, 1-bromoacenaphthylene, and 3-bromoacenaphthylene. rene, 4-bromoacenaphthylene, 5-bromoacenaphthylene and the like. Examples of the phenylacenaphthylenes include 1-phenylacenaphthylene, 3-phenylacenaphthylene, 4-phenylacenaphthylene, 5-phenylacenaphthylene and the like. As the acenaphthylenes, the compounds exemplified above may be used alone, or two or more thereof may be used in combination.

When the aromatic polymer not only has a structural unit derived from the bifunctional aromatic compound but also has other structural units, the structural unit derived from the bifunctional aromatic compound and the monofunctional aromatic It is a copolymer with other structural units such as structural units derived from compounds. This copolymer may be a block copolymer or a random copolymer.

As described above, the polymer is not particularly limited as long as it is a polymer having a structural unit represented by the formula (1) in its molecule. The structural unit represented by the formula (1) preferably contains a structural unit represented by the following formula (2). That is, the polymer is preferably a polymer having a structural unit represented by the following formula (2) in its molecule.

In formula (2), R ₄ to R ₆ are the same as R ₄ to R ₆ in formula (1). Specifically, R ₄ to R ₆ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. R ₇ represents an arylene group having 6 to 12 carbon atoms.

The arylene group having 6 to 12 carbon atoms in formula (2) is not particularly limited. The arylene group includes, for example, a monocyclic aromatic group such as a phenylene group, and a bicyclic aromatic group in which the aromatic is not a monocyclic but a bicyclic aromatic such as a naphthalene ring. The arylene group also includes derivatives in which a hydrogen atom bonded to an aromatic ring is substituted with a functional group such as an alkenyl group, an alkynyl group, a formyl group, an alkylcarbonyl group, an alkenylcarbonyl group, or an alkynylcarbonyl group. .

The structural unit represented by the formula (2) preferably includes a structural unit represented by the following formula (3). That is, in the structural unit represented by formula (2) above, R ₇ is preferably a phenylene group. Further, among the phenylene groups, the p-phenylene group is more preferable.

In formula (3), R ₄ to R ₆ are the same as R ₄ to R ₆ in formula (1). Specifically, R ₄ to R ₆ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

The polymer preferably contains a polymer further having a structural unit represented by the following formula (4) in the molecule. That is, the polymer contains a structural unit derived from a monofunctional aromatic compound in which one carbon-carbon unsaturated double bond is bonded to an aromatic ring as a structural unit represented by the following formula (4). is preferred. Therefore, the polymer is preferably a polymer having in its molecule a structural unit represented by the formula (1) and a structural unit represented by the following formula (4). That is, if the polymer is a polymer having a structural unit represented by the formula (1) and a structural unit represented by the following formula (4) in the molecule, it is represented by the formula (1). and a structural unit other than the structural unit represented by the following formula (4) (structural units other than (1) and (4)). Further, the polymer may contain structural units other than the above (1) and (4), and a repeating unit in which the structural unit represented by the above formula (1) is repeatedly bonded and represented by the following formula (4) A repeating unit that is repeatedly bonded and a repeating unit that is repeatedly bonded to structural units other than the above (1) and (4) may be a randomly bonded polymer or a block copolymer. Alternatively, it may be a random copolymer.

In formula (4), R ₈ to R ₁₀ are each independent. That is, R ₈ to R ₁₀ may each be the same group or different groups. R ₈ to R ₁₀ each represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. R ₁₁ represents an aryl group.

The alkyl group having 1 to 6 carbon atoms represented by R ₈ to R ₁₀ in the formula (4) is not particularly limited, and the alkyl group having 1 to 6 carbon atoms represented by R ₄ to R ₆ in the formula (1) may be the same as the alkyl group of Specific examples of the alkyl group having 1 to 6 carbon atoms represented by R ₈ to R ₁₀ in the formula (4) include methyl group, ethyl group, propyl group and hexyl group.

The aryl group in the formula (4) is not particularly limited, and may be an unsubstituted aryl group or an aryl group in which a hydrogen atom bonded to an aromatic ring is substituted with an alkyl group or the like. good. Further, the unsubstituted aryl group may be a group obtained by removing one hydrogen atom from an aromatic hydrocarbon having one aromatic ring, or an aromatic hydrocarbon having two or more independent aromatic rings. It may be a group obtained by removing one hydrogen atom from a hydrocarbon (eg, biphenyl, etc.). The aryl group in the formula (4) is, for example, an unsubstituted aryl group having 6 to 12 carbon atoms, and a hydrogen atom of the aryl group having 6 to 12 carbon atoms is substituted with an alkyl group having 1 to 6 carbon atoms. An arylene group having 6 to 18 carbon atoms and the like can be mentioned. Examples of the unsubstituted aryl group having 6 to 12 carbon atoms include phenyl group, naphthyl group and biphenylyl group. More specifically, the aryl group in formula (4), ie, R ₁₁ , includes the aryl groups listed in Tables 1 and 2 below.

The weight average molecular weight of the polymer is preferably 1,500 to 40,000, more preferably 1,500 to 35,000. If the weight-average molecular weight is too low, the heat resistance tends to deteriorate. On the other hand, if the weight average molecular weight is too high, there is a tendency for moldability and the like to deteriorate. Therefore, when the weight average molecular weight of the resin composition is within the above range, the heat resistance and moldability are excellent. Here, the weight-average molecular weight may be one measured by general molecular weight measurement, and specifically includes a value measured using gel permeation chromatography (GPC).

In the polymer, when the total amount of structural units in the polymer is 100 mol%, the molar content of the structural unit represented by the formula (1) is within the range of the above polymerization average molecular weight. Specifically, it is preferably 2 to 95 mol %, more preferably 8 to 81 mol %. Further, the molar content of the structural unit represented by the formula (2) and the molar content of the structural unit represented by the formula (3) are the molar contents of the structural unit represented by the formula (1). Specifically, it is preferably 2 to 95 mol%, more preferably 8 to 81 mol%. Further, when the polymer is a polymer having a structural unit represented by the formula (1) and a structural unit represented by the following formula (4) in the molecule, the polymer represented by the formula (1) The molar content of the structural unit is preferably 2 to 95 mol%, more preferably 8 to 81 mol%, and the molar content of the structural unit represented by the formula (4) is 5 to It is preferably 98 mol %, more preferably 19 to 92 mol %.

In the polymer, the average number of structural units represented by the formula (1) is preferably a number within the range of the polymerization average molecular weight, specifically, preferably 1 to 160. , 3 to 140. The average number of structural units represented by formula (2) and the average number of structural units represented by formula (3) are the same as the average number of structural units represented by formula (1). Specifically, it is preferably from 1 to 160, more preferably from 3 to 140. Further, when the polymer is a polymer having a structural unit represented by the formula (1) and a structural unit represented by the following formula (4) in the molecule, the polymer represented by the formula (1) The average number of structural units is preferably 1 to 160, more preferably 3 to 140, and the average number of structural units represented by the formula (4) is preferably 2 to 350. , 4 to 300.

Specific examples of the polymer include a structural unit represented by the following formula (8) in the molecule, and a structural unit represented by the following formula (7) and a structural unit represented by the following formula (9). Polymers further containing at least one of This polymer may be a block copolymer or a random copolymer.

A polymer containing a structural unit represented by the formula (8) in the molecule and further containing at least one of a structural unit represented by the formula (7) and a structural unit represented by the formula (9) Then, the molar contents of the structural unit represented by the formula (7), the structural unit represented by the formula (8), and the structural unit represented by the formula (9) are each 0 to 92 mol. %, 8 to 54 mol %, and 0 to 89 mol %. The average number of structural units represented by formula (7) is preferably 0 to 350, and the average number of structural units represented by formula (8) is preferably 1 to 160. Preferably, the average number of structural units represented by the formula (9) is 0-270. As the polymer, for example, commercially available products such as ODV-XET (X03), ODV-XET (X04), and ODV-XET (X05) manufactured by Nippon Steel Chemical & Materials Co., Ltd. are used.

The equivalent weight of the vinyl group contained in the structural unit of the polymer represented by the formula (1) in which R ₁ to R ₃ are hydrogen atoms is preferably from 250 to 1,200, and preferably from 300 to 1,100. is more preferred. If the equivalent weight is too small, the number of vinyl groups will be too large, and the reactivity will be too high. may occur. When a resin composition having an excessively small equivalent weight is used, molding defects such as voids occur during multi-layer molding due to insufficient fluidity, etc., and it is difficult to obtain a highly reliable wiring board. may occur. On the other hand, if the equivalent weight is too large, the vinyl groups are too small, and the heat resistance of the cured product tends to be insufficient. Therefore, when the equivalent weight is within the above range, excellent heat resistance and moldability can be obtained. The equivalent weight of the vinyl group contained in the structural unit represented by the formula (1) and having R ₁ to R ₃ each being a hydrogen atom is the so-called vinyl equivalent weight.

(Monofunctional maleimide compound)
The monofunctional maleimide compound is not particularly limited as long as it is a monofunctional maleimide compound having one maleimide group in the molecule. Preferred specific examples of the monofunctional maleimide compound include compounds represented by the following formula (5) and compounds represented by the following formula (6). These may be used independently and may be used in combination of 2 types.

(Content)
The content ratio of the polymer to the monofunctional maleimide compound is preferably 50:50 to 90:10, more preferably 60:40 to 80:20, in mass ratio. That is, the content of the polymer is preferably 50 to 90 parts by mass, more preferably 60 to 80 parts by mass, with respect to 100 parts by mass of the total mass of the polymer and the monofunctional maleimide compound. more preferred. The content of the monofunctional maleimide compound is preferably 10 to 50 parts by mass, more preferably 20 to 40 parts by mass, with respect to 100 parts by mass of the total mass of the polymer and the monofunctional maleimide compound. is more preferable. If the content of the polymer is too low, that is, if the content of the monofunctional maleimide is too high, the low dielectric loss tangent tends to be insufficient. On the other hand, if the content of the polymer is too high, that is, if the content of the monofunctional maleimide is too low, the heat resistance tends to be insufficient. Therefore, if the respective contents of the polymer and the monofunctional maleimide compound are within the above ranges, the obtained resin composition can suitably obtain a cured product having low dielectric properties and high heat resistance. be able to.

(other ingredients)
The resin composition according to the present embodiment may optionally contain components (other components) other than the polymer and the monofunctional maleimide compound within a range that does not impair the effects of the present invention. Other components contained in the resin composition according to the present embodiment include, for example, a curing agent other than the monofunctional maleimide compound, a silane coupling agent, a flame retardant, an initiator, an antifoaming agent, an antioxidant, Additives such as heat stabilizers, antistatic agents, UV absorbers, dyes and pigments, lubricants, and inorganic fillers may also be included. In addition to the polymer, the resin composition may contain resins such as polyphenylene ether, epoxy resin, unsaturated polyester resin, and thermosetting polyimide resin.

The curing agent is particularly limited as long as it is a curing agent (crosslinking type crosslinking agent) that can react with the polymer to crosslink the polymer and the curing agent and cure the resin composition. not. Examples of the cross-linking curing agent include compounds having two or more unsaturated double bonds in the molecule, alkenyl isocyanurate compounds, styrene, styrene derivatives, allyl compounds having at least one allyl group in the molecule, molecules Examples include polyfunctional maleimide compounds having at least two maleimide groups therein, modified maleimide compounds, and acenaphthylene compounds having an acenaphthylene structure in the molecule. Further, the compound having two or more unsaturated double bonds in the molecule includes a polyfunctional methacrylate compound having two or more methacryloyl groups in the molecule, a polyfunctional acrylate compound having two or more acryloyl groups in the molecule, and polyfunctional vinyl compounds having two or more vinyl groups in the molecule. Examples of the polyfunctional vinyl compound include divinylbenzene and polybutadiene. The alkenyl isocyanurate compound may be any compound having an isocyanurate structure and an alkenyl group in the molecule, and examples thereof include triallyl isocyanurate (TAIC) and other triallyl isocyanurate compounds. Bromostyrene etc. are mentioned as said styrene derivative. Examples of the modified maleimide compound include a modified maleimide compound in which a portion of the molecule is amine-modified, a modified maleimide compound in which a portion of the molecule is modified with silicone, and a modified maleimide compound in which a portion of the molecule is amine-modified and silicone-modified. and modified maleimide compounds. Among these, the alkenyl isocyanurate compound, the polyfunctional acrylate compound, the polyfunctional methacrylate compound, and the polyfunctional vinyl compound are preferable because they can further increase the heat resistance of the cured product of the resin composition. This is believed to be due to the fact that the use of these cross-linking curing agents facilitates the formation of cross-links in the resin composition through the curing reaction. In addition, as the cross-linking curing agent, the exemplified cross-linking curing agents may be used alone, or two or more thereof may be used in combination. In addition, as the cross-linking curing agent, not only the above-exemplified cross-linking curing agents such as compounds having two or more unsaturated double bonds in the molecule, but also compounds having one unsaturated double bond in the molecule. Individual compounds may be used in combination. Examples of the compound having one unsaturated double bond in the molecule include monovinyl compounds having one vinyl group in the molecule.

Examples of the polyfunctional methacrylate compound include compounds having a polyphenylene ether structure and two or more methacryloyl groups in the molecule, and tricyclodecanedimethanol dimethacrylate. Examples of the compound having a polyphenylene ether structure and two or more methacryloyl groups in the molecule include methacryl-modified polyphenylene ether compounds obtained by modifying terminal hydroxyl groups of polyphenylene ether with methacryl groups.

The resin composition according to this embodiment may contain a silane coupling agent as described above. The silane coupling agent may be contained in the resin composition, or may be contained as a silane coupling agent surface-treated in advance in the inorganic filler contained in the resin composition. Among these, the silane coupling agent is preferably contained as a silane coupling agent surface-treated in advance on the inorganic filler. Furthermore, it is more preferable to incorporate a silane coupling agent into the resin composition. Moreover, in the case of prepreg, the prepreg may contain a silane coupling agent that is previously surface-treated on the fibrous base material.

Examples of the silane coupling agent include silane coupling agents having at least one functional group selected from the group consisting of a vinyl group, a styryl group, a methacryloyl group, an acryloyl group, and a phenylamino group. That is, this silane coupling agent has at least one of a vinyl group, a styryl group, a methacryloyl group, an acryloyl group, and a phenylamino group as a reactive functional group. Examples thereof include compounds having a hydrolyzable group.

Examples of the silane coupling agent having a vinyl group include vinyltriethoxysilane and vinyltrimethoxysilane. Examples of the silane coupling agent having a styryl group include p-styryltrimethoxysilane and p-styryltriethoxysilane. Examples of the silane coupling agent having a methacryloyl group include 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropylmethyl diethoxysilane, 3-methacryloxypropylethyldiethoxysilane, and the like. Examples of the silane coupling agent having an acryloyl group include 3-acryloxypropyltrimethoxysilane and 3-acryloxypropyltriethoxysilane. Examples of the silane coupling agent having a phenylamino group include N-phenyl-3-aminopropyltrimethoxysilane and N-phenyl-3-aminopropyltriethoxysilane.

The resin composition according to this embodiment may contain a flame retardant as described above. By containing a flame retardant, the flame retardancy of the cured product of the resin composition can be enhanced. The flame retardant is not particularly limited. Specifically, in the field of using halogen-based flame retardants such as brominated flame retardants, for example, ethylene dipentabromobenzene, ethylenebistetrabromoimide, decabromodiphenyl oxide, and tetradecabromo, which have a melting point of 300° C. or higher Diphenoxybenzene is preferred. By using a halogen-based flame retardant, desorption of halogen at high temperatures can be suppressed, and it is thought that a decrease in heat resistance can be suppressed. Further, in fields where halogen-free is required, phosphate ester-based flame retardants, phosphazene-based flame retardants, bisdiphenylphosphine oxide-based flame retardants, and phosphinate-based flame retardants can be used. Specific examples of the phosphate flame retardant include condensed phosphate of dixylenyl phosphate. A specific example of the phosphazene-based flame retardant is phenoxyphosphazene. Specific examples of bisdiphenylphosphine oxide flame retardants include xylylenebisdiphenylphosphine oxide. Specific examples of phosphinate-based flame retardants include metal phosphinates of aluminum dialkylphosphinates. As the flame retardant, each of the exemplified flame retardants may be used alone, or two or more thereof may be used in combination.

The resin composition according to the present embodiment may contain an initiator (reaction initiator) as described above. Even if the resin composition consists of the polymer and the monofunctional maleimide, the curing reaction can proceed. However, depending on the process conditions, it may be difficult to increase the temperature until curing proceeds, so a reaction initiator may be added. The reaction initiator is not particularly limited as long as it can accelerate the curing reaction between the polymer and the monofunctional maleimide compound. Specifically, for example, α,α'-di(t-butylperoxy)diisopropylbenzene, 2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexyne, benzoyl peroxide, 3,3′,5,5′-tetramethyl-1,4-diphenoquinone, chloranil, 2,4,6-tri-t-butylphenoxyl, t-butylperoxyisopropyl monocarbonate, azobisisobutyronitrile, etc. oxidizing agents. Moreover, carboxylic acid metal salt etc. can be used together as needed. By doing so, the curing reaction can be further accelerated. Among these, α,α'-di(t-butylperoxy)diisopropylbenzene is preferably used. Since α,α'-di(t-butylperoxy)diisopropylbenzene has a relatively high reaction initiation temperature, it is possible to suppress the acceleration of the curing reaction at a time when curing is not necessary, such as when the prepreg is dried. , the deterioration of the storage stability of the resin composition can be suppressed. Furthermore, since α,α'-di(t-butylperoxy)diisopropylbenzene has low volatility, it does not volatilize during drying or storage of the prepreg and has good stability. Moreover, the reaction initiator may be used alone or in combination of two or more.

As described above, the resin composition according to the present embodiment may contain a filler such as an inorganic filler. The filler is not particularly limited and includes those added to improve the heat resistance and flame retardancy of the cured product of the resin composition. Moreover, heat resistance, flame retardancy, etc. can be further improved by containing a filler. Specific examples of fillers include silica such as spherical silica, metal oxides such as alumina, titanium oxide and mica, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, talc, aluminum borate, and sulfuric acid. barium, calcium carbonate, and the like. Among these fillers, silica, mica, and talc are preferable, and spherical silica is more preferable. Moreover, a filler may be used individually by 1 type, and may be used in combination of 2 or more types. The filler may be used as it is, or may be surface-treated with the silane coupling agent. When a filler is contained, its content (filler content) is preferably 30 to 270% by mass, more preferably 50 to 250% by mass, relative to the resin composition.

(Production method)
A method for producing the resin composition is not particularly limited, and examples thereof include a method of mixing the polymer and the monofunctional maleimide compound so that the content is predetermined. Specifically, when obtaining a varnish-like composition containing an organic solvent, the method described later and the like can be used.

Moreover, by using the resin composition according to the present embodiment, a prepreg, a metal-clad laminate, a wiring board, a resin-coated metal foil, and a resin-coated film can be obtained as follows.

[Prepreg]
FIG. 1 is a schematic cross-sectional view showing an example of a prepreg 1 according to an embodiment of the invention.

A prepreg 1 according to the present embodiment includes the resin composition or a semi-cured material 2 of the resin composition, and a fibrous base material 3, as shown in FIG. The prepreg 1 comprises the resin composition or a semi-cured material 2 of the resin composition, and a fibrous base material 3 present in the resin composition or the semi-cured material 2 of the resin composition.

In the present embodiment, the semi-cured product is a state in which the resin composition is partially cured to the extent that it can be further cured. That is, the semi-cured product is a semi-cured resin composition (B-staged). For example, when the resin composition is heated, the viscosity first gradually decreases, then curing starts, and then curing starts and the viscosity gradually increases. In such a case, semi-curing includes the state between when the viscosity starts to rise and before it is completely cured.

In addition, the prepreg obtained using the resin composition according to the present embodiment may include a semi-cured product of the resin composition as described above, or may include the uncured resin composition. It may comprise the composition itself. That is, it may be a prepreg comprising a semi-cured product of the resin composition (the resin composition in the B stage) and a fibrous base material, or the resin composition before curing (the resin composition in the A stage). and a fibrous base material. Further, the resin composition or the semi-cured product of the resin composition may be obtained by drying or heat-drying the resin composition.

When producing a prepreg, the resin composition 2 is often prepared in the form of a varnish and used to impregnate the fibrous base material 3, which is the base material for forming the prepreg. That is, the resin composition 2 is usually a resin varnish prepared in the form of a varnish. Such a varnish-like resin composition (resin varnish) is prepared, for example, as follows.

First, each component that can be dissolved in an organic solvent is put into the organic solvent and dissolved. At this time, it may be heated, if necessary. After that, a component that is insoluble in an organic solvent, which is used as necessary, is added, and dispersed by using a ball mill, a bead mill, a planetary mixer, a roll mill, or the like, until a predetermined dispersed state is obtained, thereby forming a varnish-like resin. A composition is prepared. The organic solvent used here is not particularly limited as long as it dissolves the polymer, the monofunctional maleimide compound and the like and does not inhibit the curing reaction. Specific examples include toluene and methyl ethyl ketone (MEK).

A method for manufacturing the prepreg is not particularly limited as long as the prepreg can be manufactured. Specifically, when producing a prepreg, the resin composition used in the present embodiment described above is often prepared in the form of a varnish and used as a resin varnish, as described above.

Specific examples of the fibrous base material include glass cloth, aramid cloth, polyester cloth, glass nonwoven fabric, aramid nonwoven fabric, polyester nonwoven fabric, pulp paper, and linter paper. When glass cloth is used, a laminate having excellent mechanical strength can be obtained, and flattened glass cloth is particularly preferable. As a specific example of the flattening process, there is a method in which glass cloth is continuously pressed with press rolls at an appropriate pressure to flatten the yarn. In addition, the thickness of the generally used fibrous base material is, for example, 0.01 mm or more and 0.3 mm or less.

A method for manufacturing the prepreg is not particularly limited as long as the prepreg can be manufactured. Specifically, when producing a prepreg, the resin composition according to the present embodiment described above is often prepared in the form of a varnish and used as a resin varnish, as described above.

As a method of manufacturing the prepreg 1, for example, a method of impregnating the fibrous base material 3 with the resin composition 2, for example, the resin composition 2 prepared in the form of varnish, and then drying the impregnated resin composition 2 can be mentioned. The resin composition 2 is impregnated into the fibrous base material 3 by dipping, coating, or the like. It is also possible to repeat impregnation several times as needed. In this case, it is also possible to adjust the desired composition and impregnation amount by repeating the impregnation using a plurality of resin compositions having different compositions and concentrations.

The fibrous base material 3 impregnated with the resin composition (resin varnish) 2 is heated under desired heating conditions, for example, at 80° C. or higher and 180° C. or lower for 1 minute or longer and 10 minutes or shorter. By heating, the prepreg 1 is obtained before curing (A stage) or in a semi-cured state (B stage). The heating can volatilize the organic solvent from the resin varnish and reduce or remove the organic solvent.

The resin composition according to the present embodiment is a resin composition from which a cured product having low dielectric properties and high heat resistance can be suitably obtained. Therefore, a prepreg comprising this resin composition or a semi-cured product of this resin composition is a prepreg from which a cured product with low dielectric properties and high heat resistance can be suitably obtained. This prepreg is a prepreg from which a wiring board having an insulating layer with low dielectric properties and high heat resistance can be manufactured.

[Metal clad laminate]
FIG. 2 is a schematic cross-sectional view showing an example of the metal-clad laminate 11 according to the embodiment of the invention.

As shown in FIG. 2, the metal-clad laminate 11 is composed of an insulating layer 12 containing a cured product of the prepreg 1 shown in FIG. That is, the metal-clad laminate 11 has an insulating layer 12 containing a cured resin composition and a metal foil 13 provided on the insulating layer 12 . Moreover, the insulating layer 12 may be made of a cured product of the resin composition, or may be made of a cured product of the prepreg. Moreover, the thickness of the metal foil 13 is not particularly limited, and varies depending on the performance required for the finally obtained wiring board. The thickness of the metal foil 13 can be appropriately set according to the desired purpose, and is preferably 0.2 to 70 μm, for example. Examples of the metal foil 13 include copper foil and aluminum foil. When the metal foil is thin, a carrier-attached copper foil having a peeling layer and a carrier for improving handling properties can be used. good too.

A method for manufacturing the metal-clad laminate 11 is not particularly limited as long as the metal-clad laminate 11 can be manufactured. Specifically, a method of producing a metal-clad laminate 11 using the prepreg 1 can be mentioned. As this method, one or more prepregs 1 are stacked, and metal foils 13 such as copper foils are stacked on both sides or one side of the prepregs 1, and the metal foils 13 and the prepregs 1 are heat-pressed and laminated to integrate. A method of manufacturing a laminate 11 with metal foil on both sides or with metal foil on one side, etc., can be mentioned. That is, the metal-clad laminate 11 is obtained by laminating the metal foil 13 on the prepreg 1 and molding it under heat and pressure. Moreover, the heating and pressurizing conditions can be appropriately set according to the thickness of the metal-clad laminate 11 to be manufactured, the type of composition of the prepreg 1, and the like. For example, the temperature can be 170-210° C., the pressure can be 3.5-4 MPa, and the time can be 60-150 minutes. Moreover, the metal-clad laminate may be produced without using a prepreg. For example, there is a method of applying a varnish-like resin composition onto a metal foil, forming a layer containing the resin composition on the metal foil, and heating and pressurizing the layer.

The resin composition according to the present embodiment is a resin composition from which a cured product having low dielectric properties and high heat resistance can be suitably obtained. Therefore, a metal-clad laminate having an insulating layer containing a cured product of this resin composition is a metal-clad laminate having an insulating layer with low dielectric properties and high heat resistance. This metal-clad laminate is a metal-clad laminate from which a wiring board having an insulating layer with low dielectric properties and high heat resistance can be manufactured.

[Wiring board]
FIG. 3 is a schematic cross-sectional view showing an example of the wiring board 21 according to the embodiment of the invention.

As shown in FIG. 3, a wiring board 21 according to the present embodiment is laminated with an insulating layer 12 that is used by curing the prepreg 1 shown in FIG. and a wiring 14 formed as follows. That is, the wiring board 21 has an insulating layer 12 containing a cured product of a resin composition and wirings 14 provided on the insulating layer 12 . Moreover, the insulating layer 12 may be made of a cured product of the resin composition, or may be made of a cured product of the prepreg.

A method for manufacturing the wiring board 21 is not particularly limited as long as the wiring board 21 can be manufactured. Specifically, a method of manufacturing a wiring board 21 using the prepreg 1, and the like can be mentioned. As this method, for example, wiring is provided as a circuit on the surface of the insulating layer 12 by etching the metal foil 13 on the surface of the metal-clad laminate 11 produced as described above to form wiring. and a method for fabricating the wiring board 21 . That is, wiring board 21 is obtained by partially removing metal foil 13 from the surface of metal-clad laminate 11 to form a circuit. In addition to the above methods, other methods for forming a circuit include, for example, forming a circuit by a semi-additive process (SAP: Semi Additive Process) or a modified semi-additive process (MSAP: Modified Semi Additive Process). Wiring board 21 has insulating layer 12 which has a high glass transition temperature, a low water absorption rate, and sufficiently suppresses increases in dielectric constant and dielectric loss tangent due to water absorption even after water absorption.

Such a wiring board is a wiring board having an insulating layer with low dielectric properties and high heat resistance.

[Metal foil with resin]
FIG. 4 is a schematic cross-sectional view showing an example of the resin-coated metal foil 31 according to this embodiment.

A resin-coated metal foil 31 according to the present embodiment includes a resin layer 32 containing the resin composition or a semi-cured material of the resin composition, and a metal foil 13, as shown in FIG. This resin-coated metal foil 31 has a metal foil 13 on the surface of the resin layer 32 . That is, the resin-coated metal foil 31 includes the resin layer 32 and the metal foil 13 laminated together with the resin layer 32 . Moreover, the resin-coated metal foil 31 may have another layer between the resin layer 32 and the metal foil 13 .

The resin layer 32 may contain a semi-cured material of the resin composition as described above, or may contain the uncured resin composition. . That is, the resin-coated metal foil 31 may include a resin layer containing a semi-cured product of the resin composition (the B-stage resin composition) and a metal foil, or may include the resin before curing. It may be a resin-coated metal foil comprising a resin layer containing the composition (the resin composition in the A stage) and a metal foil. The resin layer may contain the resin composition or a semi-cured material of the resin composition, and may or may not contain a fibrous base material. Further, the resin composition or the semi-cured product of the resin composition may be obtained by drying or heat-drying the resin composition. As the fibrous base material, the same fibrous base material as that of the prepreg can be used.

As the metal foil, any metal foil used for metal-clad laminates can be used without limitation. Examples of metal foil include copper foil and aluminum foil.

The resin-coated metal foil 31 and the resin-coated film 41 may be provided with a cover fill or the like, if necessary. By providing the cover film, it is possible to prevent foreign matter from entering. Examples of the cover film include, but are not limited to, polyolefin films, polyester films, polymethylpentene films, and films formed by providing these films with a release agent layer.

A method for manufacturing the resin-coated metal foil 31 is not particularly limited as long as the resin-coated metal foil 31 can be manufactured. Examples of the method for producing the resin-coated metal foil 31 include a method in which the varnish-like resin composition (resin varnish) is applied onto the metal foil 13 and heated. The varnish-like resin composition is applied onto the metal foil 13 by using, for example, a bar coater. The applied resin composition is heated, for example, under conditions of 80° C. to 180° C. and 1 minute to 10 minutes. The heated resin composition is formed on the metal foil 13 as an uncured resin layer 32 . The heating can volatilize the organic solvent from the resin varnish and reduce or remove the organic solvent.

The resin composition according to the present embodiment is a resin composition from which a cured product having low dielectric properties and high heat resistance can be suitably obtained. Therefore, the resin-coated metal foil provided with a resin layer containing this resin composition or a semi-cured product of this resin composition has low dielectric properties and a resin-coated metal foil from which a cured product with high heat resistance can be suitably obtained. is. This resin-coated metal foil can be used when manufacturing a wiring board having an insulating layer with low dielectric properties and high heat resistance. For example, a multilayer wiring board can be manufactured by laminating on a wiring board. A wiring board obtained using such a resin-coated metal foil is a wiring board having an insulating layer with low dielectric properties and high heat resistance.

[Film with resin]
FIG. 5 is a schematic cross-sectional view showing an example of the resin-coated film 41 according to this embodiment.

A resin-coated film 41 according to this embodiment includes a resin layer 42 containing the resin composition or a semi-cured material of the resin composition, and a support film 43, as shown in FIG. The resin-coated film 41 includes the resin layer 42 and a support film 43 laminated together with the resin layer 42 . Further, the resin-coated film 41 may have another layer between the resin layer 42 and the support film 43 .

The resin layer 42 may contain a semi-cured material of the resin composition as described above, or may contain an uncured resin composition. . That is, the resin-coated film 41 may include a resin layer containing a semi-cured product of the resin composition (the B-stage resin composition) and a support film. It may be a resin-coated film comprising a resin layer containing a substance (the resin composition in the A stage) and a support film. The resin layer may contain the resin composition or a semi-cured material of the resin composition, and may or may not contain a fibrous base material. Further, the resin composition or the semi-cured product of the resin composition may be obtained by drying or heat-drying the resin composition. As the fibrous base material, the same fibrous base material as that of the prepreg can be used.

Moreover, as the support film 43, the support film used for the film with resin can be used without limitation. Examples of the support film include electrically insulating films such as polyester film, polyethylene terephthalate (PET) film, polyimide film, polyparabanic acid film, polyetheretherketone film, polyphenylene sulfide film, polyamide film, polycarbonate film, and polyarylate film. A film etc. are mentioned.

The resin-coated film 41 may be provided with a cover film or the like, if necessary. By providing the cover film, it is possible to prevent foreign matter from entering. Examples of the cover film include, but are not limited to, polyolefin film, polyester film, and polymethylpentene film.

The support film and cover film may be subjected to surface treatment such as matte treatment, corona treatment, release treatment, and roughening treatment, if necessary.

A method for manufacturing the resin-coated film 41 is not particularly limited as long as the resin-coated film 41 can be manufactured. Examples of the method for manufacturing the resin-coated film 41 include a method for manufacturing by applying the varnish-like resin composition (resin varnish) on the support film 43 and heating. The varnish-like resin composition is applied onto the support film 43 by using, for example, a bar coater. The applied resin composition is heated, for example, under conditions of 80° C. to 180° C. and 1 minute to 10 minutes. The heated resin composition is formed on the support film 43 as an uncured resin layer 42 . The heating can volatilize the organic solvent from the resin varnish and reduce or remove the organic solvent.

The resin composition according to the present embodiment is a resin composition from which a cured product having low dielectric properties and high heat resistance can be suitably obtained. Therefore, a resin-coated film provided with a resin layer containing this resin composition or a semi-cured product of this resin composition is a resin-coated film from which a cured product having low dielectric properties and high heat resistance can be suitably obtained. . This resin-coated film can be used when manufacturing a wiring board having an insulating layer with low dielectric properties and high heat resistance. For example, a multilayer wiring board can be manufactured by laminating on a wiring board and then peeling off the supporting film, or by laminating on the wiring board after peeling off the supporting film. As a wiring board obtained by using such a film with resin, a wiring board having an insulating layer with low dielectric properties and high heat resistance is obtained.

Although this specification discloses various aspects of the technology as described above, the main technologies thereof are summarized below.

A resin composition according to one aspect of the present invention comprises a polymer having a structural unit represented by the following formula (1) in its molecule, and a monofunctional maleimide compound having one maleimide group in its molecule. A resin composition characterized by:

In formula (1), Z represents an arylene group, R ₁ to R ₃ each independently represent a hydrogen atom or an alkyl group, R ₄ to R ₆ each independently represent a hydrogen atom or carbon It represents an alkyl group of numbers 1-6.

According to such a configuration, it is possible to provide a resin composition that gives a cured product having low dielectric properties and high heat resistance. In addition, when a wiring board is obtained using the resin composition, the base material of the obtained wiring board has high heat resistance such as oven heat resistance and moisture absorption solder heat resistance, and the wiring board can be heated by heating. Also, the substrate of the wiring board has a high heat resistance such that the dielectric properties of the base material do not easily change. These things are considered to be due to the following.

First, the cured product obtained by curing the polymer is considered to be excellent in heat resistance and low dielectric properties. Furthermore, it is thought that when the polymer is cured using the monofunctional maleimide compound, the reactivity is high and the residual vinyl groups are reduced. For this reason, it is considered that the glass transition temperature of the obtained cured product can be further increased while maintaining excellent low dielectric properties, and the heat resistance can be further increased. In addition, since the residual vinyl groups are reduced, not only the cured product itself has high heat resistance, but also heat resistance such that the dielectric properties of the cured product hardly change due to heating is considered to be exhibited. From these facts, it is considered that this resin composition has low dielectric properties and gives a cured product with high heat resistance. When a wiring board is produced using this resin composition, the dielectric properties are low, and the base material of the wiring board has high heat resistance such as oven heat resistance and moisture absorption solder heat resistance, and the wiring board is heated. It is considered that this also makes it possible to obtain a wiring board having high heat resistance in which the dielectric properties of the base material of the wiring board do not easily change.

Moreover, in the resin composition, it is preferable that the structural unit represented by the formula (1) includes a structural unit represented by the following formula (2).

In formula (2), R ₄ to R ₆ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R ₇ represents an arylene group having 6 to 12 carbon atoms.

According to such a configuration, it is possible to obtain a resin composition from which a cured product having lower dielectric properties and higher heat resistance can be obtained.

Moreover, in the resin composition, it is preferable that the structural unit represented by the formula (2) includes a structural unit represented by the following formula (3).

In formula (3), R ₄ to R ₆ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

According to such a configuration, it is possible to obtain a resin composition from which a cured product having lower dielectric properties and higher heat resistance can be obtained.

Moreover, in the resin composition, it is preferable that the polymer further includes a polymer having a structural unit represented by the following formula (4) in the molecule.

In formula (4), R ₈ to R ₁₀ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R ₁₁ represents an aryl group.

According to such a configuration, it is possible to obtain a resin composition from which a cured product having lower dielectric properties and higher heat resistance can be obtained.

Further, in the resin composition, the aryl group in the structural unit represented by formula (4) preferably contains an aryl group having an alkyl group having 1 to 6 carbon atoms.

According to such a configuration, it is possible to obtain a resin composition from which a cured product having lower dielectric properties and higher heat resistance can be obtained.

Moreover, in the resin composition, the weight average molecular weight of the polymer is preferably 1,500 to 40,000.

According to such a constitution, a cured product having low dielectric properties and high heat resistance can be obtained, and a resin composition having excellent moldability can be obtained.

Further, in the resin composition, the equivalent weight of the vinyl group contained in the structural unit represented by the formula (1) in which R ₁ to R ₃ are hydrogen atoms of the polymer is 250 to 1200. preferable.

According to such a constitution, a cured product having low dielectric properties and high heat resistance can be obtained, and a resin composition having excellent moldability can be obtained.

Moreover, in the resin composition, the monofunctional maleimide compound preferably contains a compound represented by the following formula (5) or a compound represented by the following formula (6).

According to such a configuration, it is possible to obtain a resin composition from which a cured product having lower dielectric properties and higher heat resistance can be obtained.

Further, in the resin composition, the content ratio of the polymer to the monofunctional maleimide compound is preferably 50:50 to 90:10 in mass ratio.

According to such a configuration, it is possible to obtain a resin composition from which a cured product having lower dielectric properties and higher heat resistance can be obtained.

A prepreg according to another aspect of the present invention includes the resin composition or a semi-cured material of the resin composition, and a fibrous base material.

With such a configuration, it is possible to provide a prepreg from which a cured product having low dielectric properties and high heat resistance can be suitably obtained.

A resin-coated film according to another aspect of the present invention includes a resin layer containing the resin composition or a semi-cured product of the resin composition, and a support film.

According to such a configuration, it is possible to provide a resin-coated film from which a cured product having low dielectric properties and high heat resistance can be suitably obtained.

A resin-coated metal foil according to another aspect of the present invention includes a resin layer containing the resin composition or a semi-cured material of the resin composition, and a metal foil.

According to such a configuration, it is possible to provide a resin-coated metal foil from which a cured product having low dielectric properties and high heat resistance can be suitably obtained.

A metal-clad laminate according to another aspect of the present invention includes an insulating layer containing a cured product of the resin composition or a cured product of the prepreg, and a metal foil.

According to such a configuration, it is possible to provide a metal-clad laminate having an insulating layer with low dielectric properties and high heat resistance.

A wiring board according to another aspect of the present invention includes an insulating layer containing a cured product of the resin composition or a cured product of the prepreg, and wiring.

According to such a configuration, it is possible to provide a wiring board having an insulating layer with low dielectric properties and high heat resistance.

The present invention will be described in more detail with reference to examples below, but the scope of the present invention is not limited to these.

[Examples 1 to 6 and Comparative Examples 1 to 9]
In this example, each component used in preparing the resin composition will be described.

Polymer 1: ODV-XET (X03) manufactured by Nippon Steel Chemical & Materials Co., Ltd. (Polymer having a structural unit represented by the above formula (1) in the molecule: carbon-carbon unsaturated double bond is aromatic An aromatic polymer having a structural unit derived from a bifunctional aromatic compound bonded to two rings, a compound having a structural unit represented by the above formulas (7) to (9), weight average molecular weight Mw: 26300 , the equivalent weight of the vinyl group contained in the structural unit represented by the above formula (1) in which R ₁ to R ₃ are hydrogen atoms (vinyl equivalent): 510)
Polymer 2: ODV-XET (X04) manufactured by Nippon Steel Chemical & Materials Co., Ltd. (Polymer having a structural unit represented by the above formula (1) in the molecule: carbon-carbon unsaturated double bond is aromatic An aromatic polymer having a structural unit derived from a bifunctional aromatic compound bonded to two rings, a compound having a structural unit represented by the above formulas (7) to (9), weight average molecular weight Mw: 31100 , the equivalent weight of the vinyl group contained in the structural unit represented by the above formula (1) in which R ₁ to R ₃ are hydrogen atoms (vinyl equivalent): 380)
Polymer 3: ODV-XET (X05) manufactured by Nippon Steel Chemical & Materials Co., Ltd. (Polymer having a structural unit represented by the above formula (1) in the molecule: carbon-carbon unsaturated double bond is aromatic An aromatic polymer having a structural unit derived from a bifunctional aromatic compound bonded to two rings, a compound having a structural unit represented by the above formulas (7) to (9), weight average molecular weight Mw: 39500 , the equivalent weight of the vinyl group contained in the structural unit represented by the above formula (1) in which R ₁ to R ₃ are hydrogen atoms (vinyl equivalent): 320)
The equivalent weight (vinyl equivalent weight) of the vinyl group contained in the structural unit represented by the above formula (1) in which R ₁ to R ₃ are hydrogen atoms in Polymers 1 to 3 is determined by iodine value measurement by the Wiiss method. Calculated. Specifically, first, the compound to be measured was dissolved in chloroform to a concentration of 0.3 g/35 mL to 0.3 g/25 mL. An excess amount of iodine chloride was added to the double bonds present in this solution. By doing so, the double bond reacts with iodine chloride, and after the reaction has sufficiently progressed, by adding a 20% by mass aqueous solution of potassium iodide to the solution after the reaction, The residual iodine content was extracted into the aqueous phase in the form of I ₃ ^- . The aqueous phase from which I ₃ ⁻ was extracted was titrated with an aqueous sodium thiosulfate solution (0.1 mol/L sodium thiosulfate standard solution) to calculate the iodine value. The following formula was used to calculate the iodine value.

Iodine value = [(B-A) × F × 1.269] / mass of compound (g)
In the above formula, B represents the titer (cc) of the 0.1 mol/L sodium thiosulfate standard solution required for the blank test, and A represents the 0.1 mol/L sodium thiosulfate standard required for neutralization. Titration volume (cc) of solution is indicated, F indicates titer of sodium thiosulfate.

Butadiene-styrene oligomer: Ricon 100 from Clay Valley
Monofunctional maleimide 1: Imirex C manufactured by Nippon Shokubai Co., Ltd. (compound represented by the above formula (5))
Monofunctional maleimide 2: Imirex P manufactured by Nippon Shokubai Co., Ltd. (compound represented by the above formula (6))
Bifunctional maleimide: 3,3-dimethyl-5,5′-diethyl-4,4′-diphenylmethanebismaleimide (BMI-5100 manufactured by Daiwa Kasei Kogyo Co., Ltd.)
DVB: divinylbenzene (DVB810 manufactured by Nippon Steel Chemical & Materials Co., Ltd.)
TAIC: triallyl isocyanurate (TAIC manufactured by Nippon Kasei Co., Ltd.)
TMPT: trimethylolpropane trimethacrylate (TMPT manufactured by Shin-Nakamura Chemical Co., Ltd.)
Polybutadiene: B-1000 manufactured by Nippon Soda Co., Ltd.
Filler (silica): Vinylsilane-treated spherical silica (SC2300-SVJ manufactured by Admatechs Co., Ltd.)
(Preparation method)
First, each component other than the filler was added to and mixed with methyl ethyl ketone (MEK) in the composition (parts by mass) shown in Table 3 so that the solid content concentration was 55% by mass. The mixture was stirred for 60 minutes. After that, a filler was added to the obtained liquid, and the filler was dispersed by a bead mill. By doing so, a varnish-like resin composition (varnish) was obtained.

Next, a fibrous base material (glass cloth: L2116, #2116 type, L glass manufactured by Asahi Kasei Corporation) is impregnated with the obtained varnish, and then dried by heating at 110 ° C. for about 3 to 8 minutes to prepare a prepreg. was made. At that time, the content (resin content) of the components constituting the resin by the curing reaction, such as the resin compound (polymer, etc.) and the cross-linking curing agent (monofunctional maleimide compound, etc.), with respect to the prepreg is about 55% by mass. adjusted to be

Then, six sheets of each of the obtained prepregs were stacked, heated to a temperature of 200° C. at a temperature increase rate of 3.5° C./min, and heated and pressed at 200° C. for 120 minutes at a pressure of 3 MPa to form an evaluation substrate (prepreg). (cured product) was obtained.

The varnish, prepreg, and substrate for evaluation prepared as described above were evaluated by the methods shown below.

[Glass transition temperature (Tg)]
The Tg of the prepreg was measured using a viscoelastic spectrometer "DMS6100" manufactured by Seiko Instruments Inc. At this time, dynamic viscoelasticity measurement (DMA) was performed with a bending module at a frequency of 10 Hz, and the temperature at which tan δ when the temperature was raised from room temperature to 320 ° C. at a temperature increase rate of 5 ° C./min was defined as Tg. did.

[Oven heat resistance 1]
According to the standard of JIS C 6481, the evaluation substrate was left in a constant temperature bath set at a predetermined temperature for a predetermined time, and then taken out. Then, the removed metal-clad laminate was visually observed. The time at which abnormalities such as blisters began to be observed in the metal-clad laminate taken out at various times was measured. If no abnormality such as blistering was found in the metal-clad laminate taken out after 60 minutes, it was evaluated as ">60".

[Oven heat resistance 2]
According to the standard of JIS C 6481, the evaluation board was left in a constant temperature bath set at a predetermined temperature for 1 hour, and then taken out. Then, the removed metal-clad laminate was visually observed. If no abnormality such as blistering was observed even when the temperature was 300°C, it was evaluated as "⊚". When the temperature was 300°C, occurrence of abnormalities such as blisters was observed, but when the temperature was 280°C, when no abnormalities such as blisters were observed, the evaluation was given as "Good". Moreover, when the temperature was 280° C., if an abnormality such as blistering was observed, it was evaluated as “×”.

[Moisture absorption solder heat resistance]
When preparing the evaluation board, by stacking 6 prepregs, a copper foil-clad laminate (metal foil-clad laminate) having a thickness of about 0.8 mm with copper foil adhered to both sides was obtained. rice field. Wiring was formed by forming a grid-like pattern so that the copper foil on both sides of the copper foil-clad laminate had a residual copper rate of 50%. The prepreg was laminated one by one on both sides of the substrate on which the wiring was formed, and the laminate was heated and pressurized under the same conditions as in the production of the copper foil-clad laminate. The double-sided copper foils of the laminate thus formed were removed by etching. The laminate for evaluation thus obtained was held for 6 hours under conditions of a temperature of 121° C. and a relative humidity of 100%. After that, this laminate for evaluation was immersed in a solder bath at 288° C. for 10 seconds. Then, the immersed laminate was visually observed for the occurrence of measling, blistering, and the like. If the occurrence of measling, blistering, etc. was not confirmed, it was evaluated as "A". In addition, the same evaluation was performed using a solder bath at 260°C instead of the solder bath at 288°C. In the case of 288°C, the occurrence of measling, blistering, etc. was confirmed, but in the case of 260°C, if the occurrence of measling, blistering, etc. was not confirmed, it was evaluated as "good". Even at 260° C., if occurrence of measling, blistering, etc. was confirmed, it was evaluated as “×”.

[Dielectric loss tangent before heat treatment]
The dielectric loss tangent of the evaluation substrate at 10 GHz was measured by the cavity resonator perturbation method. Specifically, a network analyzer (N5230A manufactured by Keysight Technologies, Inc.) was used to measure the dielectric loss tangent of the evaluation substrate at 10 GHz.

[Dielectric loss tangent after heat treatment]
The evaluation substrate used in the measurement of the dielectric loss tangent before the heat treatment is held (heated) for 120 hours under conditions of 130 ° C., and the dielectric loss tangent of the heat-treated evaluation substrate (dielectric loss tangent after heat treatment) is , was measured by the same method as the measurement of the dielectric loss tangent before the heat treatment.

[Change in dielectric loss tangent (after heat treatment - before heat treatment)]
The difference between the dielectric loss tangent before heat treatment and the dielectric loss tangent after heat treatment (=dielectric loss tangent after heat treatment−dielectric loss tangent before heat treatment) was calculated.

[Change rate of dielectric loss tangent ([after heat treatment - before heat treatment]/before heat treatment)]
The change rate of the dielectric loss tangent after the heat treatment from the dielectric loss tangent before the heat treatment (=[dielectric loss tangent after the heat treatment−dielectric loss tangent before the heat treatment]/dielectric loss tangent before the heat treatment×100) was calculated.

Table 3 shows the results of each of the above evaluations.

As can be seen from Table 3, when a polymer having a structural unit represented by formula (1) in the molecule and a monofunctional maleimide compound having one maleimide group in the molecule are included (Examples 1 to 6 ) had a high glass transition temperature, a high oven heat resistance, and a low dielectric loss tangent. From this, it can be seen that these resin compositions have low dielectric properties and give cured products with high heat resistance. In addition, the dielectric loss tangent after heating the evaluation substrate was low, and the amount of change in the dielectric loss tangent due to the heat treatment was also small. From this, it can be seen that signal transmission can be maintained even after the environment becomes hot and humid. Furthermore, the dielectric loss tangent after heating the evaluation substrate was low, and the change rate of the dielectric loss tangent due to the heat treatment was also low. Moreover, the evaluation board obtained using this resin composition not only had high oven heat resistance, but also high moisture absorption solder heat resistance, which is heat resistance after moisture absorption, as described above. From this, it can be seen that a wiring board with high environmental stability can be obtained, which can maintain the performance of the wiring board even after being exposed to an environment such as high temperature and high humidity.

On the other hand, when the monofunctional maleimide compound is not contained (Comparative Examples 1 to 8), compared with Examples 1 to 6, at least the glass transition temperature is low, the oven heat resistance is low, Dielectric loss tangent was high. Also, the dielectric loss tangent after heating the evaluation substrate was low. As a result, the amount of change in the dielectric loss tangent due to the heat treatment was large, and the rate of change in the dielectric loss tangent due to the heat treatment was also high. Among these, when the bifunctional maleimide compound was included instead of the monofunctional maleimide compound (Comparative Example 4), the glass transition temperature was not sufficiently high and the dielectric loss tangent was low. Further, in the case of not containing anything that acts as a curing agent (Comparative Examples 1 to 3) or in the case of containing a curing agent other than a maleimide compound (Comparative Examples 5 to 8), compared with Examples 1 to 6, , the glass transition temperature and oven heat resistance were low. In particular, when trimethylolpropane trimethacrylate (TMPT) was included (Comparative Example 7), not only the glass transition temperature and oven heat resistance were lower than those of Examples 1 to 6, but also the dielectric loss tangent was high. In addition, when polybutadiene was contained (Comparative Example 8), the oven heat resistance was lower than that of Examples 1 to 6 and even that of the other comparative examples.

In addition, when the aromatic polymer was not contained but the butadiene-styrene oligomer was contained (Comparative Example 9), the glass transition temperature was lower and the oven heat resistance was lower as compared with Examples 1 to 6.

Reference Signs List 1 prepreg 2 resin composition or semi-cured resin composition 3 fibrous base material 11 metal-clad laminate 12 insulating layer 13 metal foil 14 wiring 21 wiring board 31 metal foil with resin 32, 42 resin layer 41 film with resin 43 support film

Claims (14)

a polymer having a structural unit represented by the following formula (1) in the molecule;
A resin composition comprising a maleimide compound having one maleimide group in the molecule.

(In Formula (1), Z represents an arylene group, R ₁ to R ₃ each independently represent a hydrogen atom or an alkyl group, R ₄ to R ₆ each independently represent a hydrogen atom or Indicates an alkyl group having 1 to 6 carbon atoms.) The resin composition according to claim 1, wherein the structural unit represented by formula (1) includes a structural unit represented by formula (2) below.

(In Formula (2), R ₄ to R ₆ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R ₇ represents an arylene group having 6 to 12 carbon atoms.) 3. The resin composition according to claim 2, wherein the structural unit represented by the formula (2) contains a structural unit represented by the following formula (3).

(In Formula (3), R ₄ to R ₆ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.) The resin composition according to any one of claims 1 to 3, wherein the polymer further contains a polymer having a structural unit represented by the following formula (4) in the molecule.

(In Formula (4), R ₈ to R ₁₀ each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R ₁₁ represents an aryl group.) 5. The resin composition according to claim 4, wherein the aryl group in the structural unit represented by formula (4) contains an aryl group having an alkyl group having 1 to 6 carbon atoms. The resin composition according to any one of claims 1 to 5, wherein the polymer has a weight average molecular weight of 1,500 to 40,000. 7. The equivalent weight of the vinyl group contained in the structural unit of the polymer represented by the formula (1) in which R ₁ to R ₃ are hydrogen atoms is 250 to 1200. The resin composition according to . The resin composition according to any one of claims 1 to 7, wherein the maleimide compound comprises a compound represented by the following formula (5) or a compound represented by the following formula (6).

9. The resin composition according to any one of claims 1 to 8, wherein the content ratio of the polymer and the maleimide compound is 50:50 to 90:10 in mass ratio. A prepreg comprising the resin composition according to any one of claims 1 to 9 or a semi-cured product of the resin composition, and a fibrous base material. A resin-coated film comprising a resin layer containing the resin composition according to any one of claims 1 to 9 or a semi-cured product of the resin composition, and a support film. A resin-coated metal foil comprising a resin layer containing the resin composition according to any one of claims 1 to 9 or a semi-cured product of the resin composition, and a metal foil. A metal-clad laminate comprising an insulating layer containing the cured product of the resin composition according to any one of claims 1 to 9 or the cured product of the prepreg according to claim 10, and a metal foil. A wiring board comprising an insulating layer containing the cured product of the resin composition according to any one of claims 1 to 9 or the cured product of the prepreg according to claim 10, and wiring.

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