JP7181685B2 - electronic equipment housing - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device housing containing heat-generating electronic components and having a vent opening for communication between the inside and outside of the housing.

BACKGROUND ART Patent documents 1 and 2 disclose electronic device housings that house heat-generating electronic components and have vents that allow communication between the inside and outside of the housing.
13 and 14 schematically show the invention disclosed in Patent Document 1. FIG. As shown in FIG. 13, due to the positional relationship between the heat-generating component 1 and the exhaust port 2, high temperature air is exhausted from a portion (A portion) of the exhaust port 2, and the remaining portion (B portion) is not so hot. Air was being vented. Therefore, part of the exhaust port is locally heated.

As shown in FIG. 14, in the present invention, by arranging the heat-conducting member 3 in which the slit is formed in front of the exhaust port 2, high-temperature air is first transmitted to the heat-conducting member 3, and the temperature is slightly lowered. It is exhausted from the A part. The exhausted air, which is not so hot, absorbs heat by passing through the remaining portion of the heat conducting member 3 and passes through the B portion exhaust port 2 after the temperature rises slightly. As a result, the air is exhausted from the A portion and the B portion of the exhaust port 2 after the temperature is equalized, so that the exhaust temperature can be equalized and local heating can be prevented. In this example, the diffusion of heat is heat transfer using the heat conducting member 3 as a heat equalizing member, and is not diffusion of air.
In this case, the amount of heat generated in the housing and the amount of heat exhausted from the exhaust port 2 are basically the same, and the heat conducting member 3 allows air to pass through and does not obstruct the flow of air.

Further, in the invention disclosed in Patent Document 2, when an electric fan is provided in the housing, the air tends to be exhausted along the shortest path from the intake port to the exhaust port, resulting in poor cooling efficiency. For this reason, a plate that forces the flow of air is placed in the path from the intake port to the exhaust port, and the flow of air sucked by the electric fan is diffused within the housing, improving the cooling efficiency throughout the housing. .

JP 2009-26894 A Japanese Utility Model Laid-Open No. 5-25795

FIG. 15 shows the conventional problem from another point of view.
The invention shown in FIG. 14 eliminates the local uneven heating of the exhaust port.
The air heated by the heat-generating member 1 passes through the exhaust port 2 by convection and is exhausted, but as shown in FIG. Other parts are less heated. That is, the exhaust port 2 is a locally heated portion and becomes a high-temperature portion, and the surrounding wall surface is a low-temperature portion and surface temperature unevenness occurs. In this example, the amount of heat generated inside the housing and the amount of heat exhausted through the exhaust port 2 are basically the same.

SUMMARY OF THE INVENTION The present invention provides an electronic device housing in which the temperature deviation of the side wall where the exhaust port is formed is reduced.

The present invention is an electronic device housing that houses electronic components and has a first vent that communicates the inside and outside of the housing, wherein the shortest path that linearly connects the first vent and the electronic components is The plate material is arranged so as not to be blocked and diffuses the convection flowing from the vicinity of the electronic component to the first ventilation port , and has a diffusion plate having a hole larger than that of the first ventilation port .
In the above configuration, the electronic component generally generates heat when a current flows through it. For cooling with air, a method of forcibly generating an air flow using a fan and a method of using air convection can be adopted. When air convection is used, air pressure difference due to temperature difference causes convection, so the air heated by the electronic component tries to move in the shortest distance toward the air vent located above. Then, the heated and high-temperature air is exhausted after heating only the slit of the ventilation port and the relatively nearby portion. However, since a diffusion plate is placed between the ventilation port and the electronic components, the convection from the vicinity of the electronic components toward the ventilation port is diffused by the presence of this diffusion plate, and the air that does not reach the exhaust port in the shortest distance is diffused. produce flow. The air flow that does not reach the exhaust port directly becomes the air flow along the top plate above the electronic components, and heats the top plate when moving along the top plate.

In other words, the air heated by the electronic components does not go only to the air vent, but part of it moves along the other top plate. The phenomenon in which the air paths are divided in this way also results in the amount of heat being divided, so that the amount of heat that heats the vent holes is reduced, and the amount of heat that heats the top plate other than the vent holes is increased. Also, the temperature deviation of the side wall where the vent is formed is reduced.

The electronic device housing of the present invention disperses the amount of heat of the heated air, which has been concentrated in the air vents, and heats the wall material around the air vents. By dissipating heat through other wall materials, it is possible to alleviate the symptoms of locally heating only the vent.

1 is a schematic perspective view of an electronic device housing according to one embodiment of the present invention; FIG. It is a schematic sectional drawing which shows the internal condition of the horizontal installation state of the same electronic device housing|casing. It is a schematic sectional drawing which shows the internal condition of the vertical installation state of the same electronic device housing|casing. FIG. 4 is a cross-sectional view showing convection in an electronic device housing that does not have a diffusion plate and is placed horizontally. FIG. 10 is a schematic cross-sectional view schematically showing the propagation of heat amount in a horizontally placed state of the electronic device housing; FIG. 11 is a cross-sectional view showing convection in a laterally placed state of an electronic device housing according to a modification; FIG. 4 is a cross-sectional view schematically showing the propagation of heat in the electronic device housing in a laterally placed state; FIG. 11 is a cross-sectional view showing convection in a laterally placed state of an electronic device housing according to a modification; It is a schematic sectional drawing which shows the cross-sectional shape concerning the modification of a diffusion plate. It is a schematic sectional drawing which shows the cross-sectional shape concerning the modification of a diffusion plate. It is a schematic sectional drawing which shows the cross-sectional shape concerning the modification of a diffusion plate. FIG. 11 is a cross-sectional view showing convection in a laterally placed state of an electronic device housing according to a modification; It is a schematic sectional view which shows typically the subject of the conventional electronic equipment housing|casing. FIG. 10 is a schematic cross-sectional view schematically showing a state in which a conventional electronic device housing has solved the problem; It is a schematic sectional view which shows typically the subject which the conventional electronic device housing|casing left.

Hereinafter, embodiments of the present invention will be described based on the drawings.
FIG. 1 is a schematic perspective view of an electronic device housing according to one embodiment of the present invention, FIG. 2 is a schematic cross-sectional view showing the internal state of the electronic device housing in a laterally placed state, and FIG. , and a schematic cross-sectional view showing the internal state of the same electronic device housing in a vertically placed state.
In the figure, a housing 10, which is an electronic equipment housing, is formed in the shape of a hollow, roughly rectangular thin box, with large longitudinal and lateral directions on the front and rear sides, and side walls (10c to 10f) connecting the front face 10a and the rear face 10b. ) is thin. Each sidewall is referred to as a top surface 10c, a bottom surface 10d, a left surface 10e and a right surface 10f. In addition, when it is placed horizontally as will be described later, the side surfaces 10a to 10f may be simply referred to. The thin box shape is merely an example, and each side or surface may be curved. The front face 10a is formed with a first ventilation port 11a, which is a through hole arranged in an annular shape. The first vent 11a communicates the inside and outside of the housing 10, and functionally functions as a vent.

The upper surface 10c and the bottom surface 10d are formed with a second vent 11b, which is a slit-shaped through hole. Although not shown in the drawing, legs are formed on the bottom surface 10d so that the second vent 11b of the bottom surface 10d is not blocked even when the bottom surface 10d is arranged on the lower side. The second vent 11b also communicates the inside and outside of the housing 10, and functionally functions as a vent. The first ventilation port 11a and the second ventilation port 11b are collectively referred to simply as the ventilation port 11 (11a, 11b).
A hole for wall hanging (not shown) is provided on the rear surface 10b. An installation method in which the housing 10 is hung on a wall is also possible by using this wall-mounting hole.

Here, the housing 10 has an installation pattern in at least two directions.
FIG. 2 shows an installation pattern in which the front surface 10a faces upward and the rear surface 10b faces downward, which is called horizontal installation in this embodiment. FIG. 3 shows an installation pattern in which the top surface 10c faces upward and the bottom surface 10d faces downward, which is called vertical installation in this embodiment. In other words, the electronic device housing can be installed such that the first vent 11a serves as the top surface, or that one of the second vents 11b serves as the top surface.
Cooling in the case of vertical installation is performed as follows. When the internal electronic component 12 generates heat, the air entering through the vent 11b on the side of the bottom surface 10d exits through the vent 11b on the side of the top surface 10c. At this time, ventilation using the so-called chimney effect can be performed. When performing ventilation using this effect, efficient ventilation can be achieved when the height difference between the intake port and the exhaust port is large compared to when the height difference between the intake port and the exhaust port is small. As will be described later, the diffuser plate 20 has a shape that protrudes toward the electronic component side, but the above-described chimney effect is not disturbed by the protruding portion. Conversely, the protruding portion of the diffuser plate 20 allows the rising air to be drawn toward the electronic component 12 (see the arrow in FIG. 3), thereby improving the heat dissipation effect of the electronic component 12 .

An electronic component 12 and an electronic substrate 13 on which the electronic component 12 is arranged are accommodated in the housing 10 . The electronic component 12 includes various elements, and includes heat-generating members. There are various elements that can be heat generating members, and various high-density ICs such as CPUs often require countermeasures against heat generation. The electronic component 12 includes elements that require such countermeasures against heat generation. The electronic component 12 is arranged on the electronic substrate 13 at a position near the center of the first vent hole 11a, which is generally annular. Therefore, the heat-generating member generates a flow of air that rises to the surroundings by generating heat, and generates a flow of air that rises within a predetermined range centered on the heat-generating member. In this sense, it can be said that the position where the rising air flow is generated is in the vicinity of the electronic component 12 .

In the case of the first air vent 11a, the electronic substrate 13 is arranged to block the space between the front face 10a and the back face 10b, and the air flow substantially penetrates from the bottom face 10d to the first air vent 11a on the top face 10c. Such a flow cannot occur. On the other hand, in the case of the second vent 11b, although there is an obstacle such as the electronic component 12 between the top surface 10c and the bottom surface 10d, a plate-shaped object such as the electronic substrate 13 blocks the air flow. It's not supposed to. Therefore, in the case of vertical installation, the air flow by convection from the bottom to the top relatively easily flows. When the electronic component 12 is placed vertically, when the electronic component 12 generates heat, the surrounding air is warmed and the specific gravity becomes lighter, so that the electronic component 12 rises. As the air around the electronic component 12 rises, the air below is pulled up and the air above is naturally pushed up. Absorbing heat makes it easier to rise. As a result, air is sucked through the second vent 11b of the bottom surface 10d and exhausted through the second vent 11b of the top surface 10c. In this embodiment, this phenomenon is called convection. Intake and exhaust are not necessarily one-way air flows, so they are generally referred to as vents.
Note that the shapes of the first vent 11a and the second vent 11b are not particularly limited. Also, in this example, the electronic device housing has a plurality of side surfaces, and the first vent 11a and the second vent 11b are formed on surfaces that are adjacent to each other and are not surfaces that face each other. It is

A diffuser plate 20 is accommodated in the housing 10 adjacent to the annularly arranged first vent 11a. The diffuser plate 20 is formed of a plate material in a substantially ring shape. Details of the diffusion plate 20 will be described later.

FIG. 4 is a cross-sectional view showing convection in a state in which an electronic device housing without a diffusion plate 20 is placed horizontally, and the housing 10 in FIG. . In the following also, for the sake of convenience of explanation, schematic examples and specific examples are shown.
As shown in FIG. 4, when the electronic component 12 is energized, the electronic component 12 generates heat to warm the surrounding air, particularly the upper air. Since the electronic component 12 is arranged approximately in the center of the annular first vent 11a, the heated air will rise toward the inner wall surface of the annular first vent 11a. However, since it is blocked by the wall, it rises and moves so as to spread to the periphery with reference to the horizontal direction. Then, part of the warmed air passes through the first vent 11a, passes through the wall surface of the front face 10a, and is exhausted to the outside. Since the wall surface of the front face 10a has no vents other than the first vents 11a, all the warmed air passes through the first vents 11a.

While the air warmed by the electronic component 12 is exhausted through the first air vent 11a, outside air is sucked in from the side surfaces 10c and 10d so as to suppress the pressure change inside the housing 10. FIG. In this case, the slit-like second air vents 11b formed on the side surfaces 10c and 10d function only as air intakes, and the sucked air moves toward the first air vents 11a. In this case, since the inner wall of the front face 10a has no obstacles other than the first vents 11a, the air sucked from the second vents 11b flows toward the first vents 11a. flow. The first vent 11a on the front face 10a functions only as an exhaust port. That is, the waste heat of the electronic component 12 is discharged from the first ventilation port 11a through the peripheral air. Only the wall material portion adjacent to the air vent 11a of is locally heated. The air flow along the wall surface of the front face 10a is exhausted to the outside from the first vent 11a when it reaches the position of the first vent 11a although the heated air in the vicinity of the center spreads to the peripheral edge. The wall surface outside the first vent 11a is not heated. On the other hand, on the wall surface outside the first ventilation port 11a, the unheated air sucked from the second ventilation port 11b flows and is exhausted to the outside from the first ventilation port 11a. Even the flow does not heat the wall surface outside the first vent 11a in the front face 10a.
In FIG. 4, arrows indicate the air flow described above.

FIG. 5 is a schematic cross-sectional view schematically showing the propagation of the amount of heat when the electronic device housing is placed horizontally. FIG. 6 is a cross-sectional view showing convection in a specific example of the electronic device housing in this case.
Inside the housing 10, a ring-shaped diffuser plate 20 made of a plate material having an inner diameter slightly larger than that of the annular first vent 11a is arranged at a position inside the first vent 11a. there is The diffuser plate 20 is ring-shaped, and has a convex wall portion 20a protruding from the edge on the inner peripheral side toward the electronic component 12 in a cylindrical shape.
In this way, the diffuser plate 20 is a plate material, and the protruding height toward the electronic component 12 is different between the side near the first vent 11a and the side near the second vent 11b. .

When the air warmed by the electronic component 12 moves upward by convection, the convection spreads to the peripheral edge in front of the first vent 11a due to the resistance of the fluid that occurs when passing through the first vent 11a. try to In particular, since the diffuser plate 20 has a cylindrical convex wall portion 20a in the central portion, the convection path is separated by the convex wall portion 20a, and the convection that spreads in front of the convex wall portion 20a is dissipated. When it hits the diffuser plate 20 , it tries to spread in the peripheral direction along the diffuser plate 20 due to the pressure from the convection that is about to rise further. Without the diffuser plate 20 shown in FIG. 4, an inward air flow toward the first vent 11a was generated outside the first vent 11a. In the case where the diffuser plate 20 shown is provided, conversely, an air flow that spreads from the first vent 11a and moves outward is generated.

When this air flow reaches the outer peripheral edge of the ring-shaped diffuser plate 20, the air flow moves upward due to being warmed, and reaches the wall surface outside the first vent 11a on the wall surface of the front face 10a. will come into contact. The flow of air in contact with the wall surface of the front surface 10a transfers heat to the wall surface of the front surface 10a to warm it. That is, heat is radiated from the surface of the wall surface.
In this way, without the diffuser plate 20, only the periphery of the first vent 11a is warmed and locally heated. The convection is diffused, the air flow is guided to the outside of the first ventilation port 11a, and as a result, the heat is transferred to the entire wall surface located outside the first ventilation port 11a, so that the surface temperature rises. become. By increasing the number of portions that transmit waste heat in this way, the amount of heat emitted from the first vent 11a can be reduced, and localized heating can be reduced.

Note that in FIG. 5, a large amount of heat indicated by three arrows is emitted from the electronic component 12, but a smaller amount of heat indicated by four arrows is emitted from the first ventilation port 11a, and the amount of heat indicated by the four arrows is smaller than the first ventilation port 11a. It shows how the heat of two small arrows is also discharged from the wall of . It can be said that this represents the dispersion of waste heat.

FIG. 6 is a cross-sectional view showing convection in a horizontal placement state of an electronic device housing in a specific example. 5, which is schematically shown as a schematic cross-sectional view, the air heated by the electronic component 12 is diffused outside the diffusion plate 21 on the front side of the diffusion plate 21 with the electronic component 12 as a reference, and diffuses. After that, it rises and flows outward along the wall surface of the front face 10a. When flowing along the wall surface of the front face 10a, the heat is transferred to the wall surface, and the heat is exhausted by heat radiation from the surface of the housing.

FIG. 7 is a cross-sectional view schematically showing the propagation of the amount of heat when the electronic device housing is placed horizontally.
In the embodiment shown in FIGS. 6 and 7, when warmed air is diffused outward by the diffuser plate 21, the flow of air flows out of the housing through a portion of the second vent 11b. As shown in FIG. 6, when the diffuser plate 21 itself blocks the path from the outside of the first vent 11a to the first vent 11a, the air is more likely to be exhausted from the second vent 11b. However, even if the diffusion plate 21 itself does not block the same path, there is also a path through which the air is exhausted from the second vent 11b as shown in FIG.

Of course, air is exhausted from the upper opening of the second vent 11b, and air is sucked from the other lower openings. When the air is exhausted from the second vent 11b, heat is also discharged by thermal radiation from the housing wall surfaces of the top surface 10c and the bottom surface 10d where the second vent 11b is formed. Therefore, in the case shown in FIG. 5, the amount of heat generated by the electronic component 12 is substantially equal to the amount of heat discharged from the front surface 10a, but in the case shown in FIG. It can be said that the amount of heat exhausted from 10a is small, and the difference is exhausted from the top surface 10c and the bottom surface 10d.

Thus, the vent includes the first vent 11a and the second vent 11b, the diffusion plate 21 is positioned closer to the first vent 11a than the second vent 11b, The convection from the vicinity of the electronic component 12 toward the first vent 11a is diffused and guided to the second vent 11b.

The positions of the diffuser plates 20 and 21 can be changed as appropriate for convenience in design. It can be said that the diffusion plates 20 and 21 are generally arranged between the first vent 11 a and the electronic component 12 in the above-described embodiment. However, the diffuser plates 20 and 21 are not arranged so as to block the shortest path that linearly connects the first vent 11 a and the electronic component 12 . It can be guided to the outside without blocking the shortest path. That is, the diffusion plates 20 and 21 are arranged at positions that do not block the straight path connecting the electronic component 12 and the first vent 11a.

Next, FIG. 8 is a cross-sectional view showing convection in the electronic device housing according to the modification when the housing is placed horizontally.
In this embodiment, the diffusion plate 22 is arranged at a position that blocks the shortest path that linearly connects the first vent 11 a and the electronic component 12 . If it is arranged in an unobstructed position, theoretically, an air flow that moves linearly from the electronic component 12 to the first vent 11a is always generated, and the air flow contains a relatively large amount of heat, The amount of heat is directly transferred to the first vent 11a. On the other hand, if it is arranged in the blocking position, the flow of air moving linearly from the electronic component 12 to the first vent 11a is blocked, and more air flow moves along the inner wall surface of the front face 10a. By facilitating the flow and releasing the amount of heat through the wall material, there is a strong tendency to alleviate the temperature imbalance of the wall material of the front face 10a.

It is possible to appropriately determine whether to use the shielding arrangement or the non-shielding arrangement by actually forming both and measuring the temperature distribution.

Focusing on the function of diffusing the flow of air, it is preferable to form the convex wall portions 20a and 21a instead of simply forming the plates like the diffusion plates 20 and 21. FIG.
9 to 11 are schematic cross-sectional views showing cross-sectional shapes according to modifications of the diffusion plate from the same viewpoint.
The cross-sectional shape of the diffuser plate 23 shown in FIG. 9 is such that it protrudes linearly from the side of the first vent 11a to the side of the electronic component 12, spreads outward, and extends toward the first vent 11a. It gradually recedes toward the side, and recedes linearly a short distance toward the first vent 11a at the outer peripheral end.

The cross-sectional shape of the diffuser plate 24 shown in FIG. 10 has substantially the same protruding shape when viewed from the electronic component 12 side, but the cross-sectional shape is not hollowed out.
The cross-sectional shape of diffusion plate 25 shown in FIG. 11 has a ring-shaped disk portion 25a that is substantially parallel to electronic component 12, and the inner diameter is further narrowed toward the electronic component 12 on the inner peripheral side. An inner peripheral conical wall surface portion 25b is formed obliquely to protrude, and an outer peripheral conical wall surface portion 25c is provided on the outer peripheral side of the disk portion 25a, which is widened and receded obliquely away from the electronic component 12. It has become.
All the shapes have in common that they form slopes that gradually recede from the electronic component 12 from the inside to the outside, and the flow of air that is warmed by the electronic component 12 and rises is directed to the first vent 11a. It makes it easier to form an air flow that spreads outward from the

FIG. 12 is a cross-sectional view showing convection in a laterally placed electronic device housing according to a modification.
When the wall surface of the front face 10a where the first vent 11a is formed is used for heat radiation from the surface, it can be said that it is preferable to efficiently propagate heat along the wall surface as much as possible. In this example, a thermally conductive member 30 having high thermal conductivity such as copper foil or aluminum foil is attached to a portion inside the first vent 11a on the back side of the wall surface of the front face 10a. Of course, the thermal conductivity of the thermally conductive member 30 is higher than that of the walls on which the vents 11a and 11b are formed. Waste heat quickly propagates through the wall surface to which the heat-conducting member 30 is attached, and heat radiation from the housing 10 is more efficient than when the heat-conducting member 30 is not provided. The heat conducting member 30 may be attached not only to the wall surface of the front face 10a, but also to the wall surfaces of the top face 10c and the bottom face 10d.

In this manner, the heat-conducting member having higher thermal conductivity than the wall surface on which the vent is formed is arranged adjacent to the vent.

In addition, it cannot be overemphasized that this invention is not what is restricted to the said Example. It goes without saying for those skilled in the art that
- Although the first vent 11a and the diffuser plate 20 are annular in shape, they do not have to be annular, and may be polygonal or linear. A continuous shape or chain shape may be used, and a net-like filter that makes it difficult for foreign substances other than air to enter may be arranged.
In addition,
・Applying the mutually replaceable members and configurations disclosed in the above examples by appropriately changing the combination ・Although not disclosed in the above examples, it is a known technology and the above examples Appropriately replace the members, configurations, etc. that are mutually replaceable with the members, configurations, etc. disclosed in the above, and apply them by changing the combination ・Although not disclosed in the above examples, known techniques It is an embodiment of the present invention that a person skilled in the art can appropriately replace the members and configurations that can be assumed as a substitute for the members and configurations disclosed in the above embodiments based on the above, and change the combination and apply it. It is disclosed as

REFERENCE SIGNS LIST 1 heat-generating component 2 exhaust port 3 heat-conducting member 10 housing 10a front 10b rear 10c top 10d bottom 10e left side 10f right side 11 vent , 11a... first vent, 11b... second vent, 12... electronic component, 13... electronic substrate, 20 to 25... diffusion plate, 20a... convex wall, 21a... convex wall, 25a... Disc portion 25b... inner peripheral conical wall surface part, 25c... outer peripheral conical wall surface part, 30... heat conducting member.

Claims (10)

An electronic device housing containing electronic components and having a first vent for communicating the inside and outside of the housing,
arranged so as not to block the shortest path that linearly connects the first vent and the electronic component,
1. An electronic device housing , comprising: a plate material for diffusing convection flowing from the vicinity of said electronic component toward said first vent, said diffuser plate having a hole larger than said first vent . Furthermore, a second ventilation port is provided, and the diffusion plate is arranged at a position closer to the first ventilation port than the second ventilation port to prevent convection from the vicinity of the electronic component toward the first ventilation port. 2. The electronic device housing according to claim 1, wherein the electronic device housing diffuses and guides at least a portion thereof to the second vent. 3. The electronic device housing according to claim 2, wherein the electronic device housing has a plurality of sides, and the first vent and the second vent are formed on different sides. . 4. The electronic device housing according to claim 3, wherein the electronic device housing can be installed with the first vent as the top surface, or installed with the second vent as the top surface. equipment housing. The diffusion plate is a plate material, and the side near the first ventilation port and the side near the second ventilation port project at different heights toward the electronic component. The electronic device housing according to any one of claims 2 to 4. Claims 1 to 5, characterized in that a heat-conducting member having a higher thermal conductivity than a wall surface on which said first vent is formed is disposed adjacent to said first vent. The electronic device housing according to any one of . In the electronic device housing, the second ventilation port is formed on the bottom surface in a state where the second ventilation port is installed as the top surface, and the second ventilation port is also formed on the bottom surface to form an air flow that flows from the bottom surface to the top surface. The electronic device housing according to claim 4, characterized by: 8. The electronic device housing according to claim 7, wherein the second air vent is formed on the top surface and the bottom surface of the electronic device housing, and the flow of air from the bottom surface to the top surface generates a chimney effect. equipment housing. 9. The electronic device housing according to claim 7, wherein the diffusion plate has an effect of directing the flow of air, which flows from the bottom surface to the top surface of the electronic device housing, toward the electronic component. . The diffusion plate is ring-shaped and has an inner diameter larger than that of the first vent. The electronic device housing according to any one of claims 1 to 9.

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