JPS61260698A - Breathing construction of electronic equipment - Google Patents
Breathing construction of electronic equipmentInfo
- Publication number
- JPS61260698A JPS61260698A JP10126185A JP10126185A JPS61260698A JP S61260698 A JPS61260698 A JP S61260698A JP 10126185 A JP10126185 A JP 10126185A JP 10126185 A JP10126185 A JP 10126185A JP S61260698 A JPS61260698 A JP S61260698A
- Authority
- JP
- Japan
- Prior art keywords
- casing
- vent
- housing
- ventilation
- breathing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、電子機器に係り、％に印刷回路基板をほぼ水
平に設置し、各部品の放熱を自然対流により筐体外部に
放熱させるのに好適な通気構造に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to electronic equipment, in which a printed circuit board is installed almost horizontally, and the heat from each component is radiated to the outside of the housing by natural convection. This invention relates to a suitable ventilation structure.
従来の通気構造は、実開昭５８−４４８９５号及び実開
昭５８−５３ｊ９５号に記載のように、各部品から放熱
された空気は、筐体の上面の通気。In the conventional ventilation structure, as described in Japanese Utility Model Application No. 58-44895 and Japanese Utility Model Application No. 58-53j95, the air radiated from each component is vented on the upper surface of the housing.
口に直接流れて、外部へ放出されていた。しかし、゛筐
体に収納されている部品の一部が高温であるとＪその上
部の筐体が熱流および該部品の輻射熱によ゛り加熱され
、筐体上面の温度が高温になってしま。It flowed directly into the mouth and was released to the outside. However, if some of the components housed in the casing are at high temperatures, the casing above them will be heated by the heat flow and the radiant heat of the parts, and the temperature of the top surface of the casing will become high. .
う、この点に対する予防については配慮されてい。Well, consideration has been given to preventive measures against this point.
なかりた。There wasn't.
本発明の目的は、筐体上面の表面温度を低く押゛える電
気機器の通気構造を提供することにある。１□〔発明の
概要〕
すなわち、各部品から放熱された熱を、直接上。An object of the present invention is to provide a ventilation structure for electrical equipment that can keep the surface temperature of the upper surface of the casing low. 1□ [Summary of the invention] In other words, the heat radiated from each component is directly transferred to the top.
方の通気口に流すのではなく、通気口の下部に整。Instead of flushing it down the side vent, place it at the bottom of the vent.
流板を設け、熱風を一度整流板に当て、自然攪拌。A flow plate is installed, and hot air is once applied to the rectifier plate to create natural agitation.
させ、熱風の温度を平均化させてから、整流板の：３周
囲から上方に熱風を流し、筐体上面の空気口ま・で導き
、外部に放出させる。また、この整流板に。After the temperature of the hot air is averaged, the hot air is flowed upward from around the current plate, guided to the air opening on the top of the housing, and released to the outside. Also, on this rectifier plate.
より、高温部品からの輻射熱が直接筐体に届くこ。This allows radiant heat from high-temperature parts to directly reach the housing.
とも防ぎ、筐体上面の表面温度が部分的に高くな。This prevents the surface temperature of the top of the case from becoming partially high.
ることを防止することができる。It is possible to prevent this from happening.
以下、本発明の一実施例を第１図及び第２図により説明
する。第１図は外観図、第２図は断面図である。１子回
路を構成する印刷基板１と入力装置２は筐体６に収納さ
れている。筐体３の上面を後方に高くなるよう傾斜させ
、この上面後部に通気口４を設け、また背面上部に通気
口５を設けている。通気口４の数ミリ下には、整流板６
が筐体６の上面にほぼ平行に設けられている、７は印刷
基板１に取付けられた高温になる電子部品である。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is an external view, and FIG. 2 is a sectional view. A printed circuit board 1 and an input device 2 constituting one child circuit are housed in a housing 6. The upper surface of the casing 3 is inclined to be higher rearward, and a ventilation hole 4 is provided at the rear of the upper surface, and a ventilation hole 5 is provided at the upper part of the back surface. A few millimeters below the vent 4 is a rectifier plate 6.
are provided substantially parallel to the upper surface of the housing 6, and 7 is an electronic component that is attached to the printed circuit board 1 and becomes hot.
電子部品７から発せられた熱は、自然対流により上昇す
るが整ｉａ６により四方に拡散され、その後、一部は通
気口４から、一部は通気口５から外部に放出される、
かかる通風構造にすることにより、熱は直接、通気口４
に達することがなく、矢印の如く四方に拡散されて温度
は平均化された後通気口４及び通・気口５から放出され
るので、筐体上面が局部的に・加熱されることはない。The heat emitted from the electronic component 7 rises due to natural convection, but is diffused in all directions by the air conditioner 6, and then part of it is released from the vent 4 and part from the vent 5 to the outside. By doing so, the heat is directed directly to the vent 4.
The temperature is diffused in all directions as shown by the arrow and is averaged before being released from the vents 4 and 5, so the top surface of the casing is not heated locally. .
さらに、整流板６には傾・斜がついているので、熱が後
方に流れ安くなって−いる。、また、この整流板６は、
電子部品７から発せられる輻射熱が直接筐体上面に達す
ることも防いでおり、筐体上面の温度を下げる効果は倍
増する。ひいては、筐体内に高温になる電子部品を収納
できる。Furthermore, since the rectifying plate 6 has an inclination, heat flows backwards more easily. , Also, this rectifier plate 6 is
This also prevents the radiant heat emitted from the electronic component 7 from directly reaching the top surface of the casing, thereby doubling the effect of lowering the temperature of the top surface of the casing. Furthermore, electronic components that become hot can be stored inside the housing.
本発明によれば、高温になる電子部品を配して。 According to the present invention, electronic components that become hot are arranged.
も、部体上面が局所的に高温になることを防止で。It also prevents the top surface of the body from becoming locally hot.
きる。Wear.
第１図は本発明の電子機器を説明する図で第２図のＡ−
Ａ線断面図、第２図は本発明の電子機器。
の外観図である。
１・・・印刷基板、４・・・上面通気口、５・・・背面
通気。
口、６・・・整流板、７・・・電子部品。FIG. 1 is a diagram explaining the electronic device of the present invention, and A-A in FIG.
The A-line sectional view and FIG. 2 show the electronic device of the present invention. FIG. 1...Printed circuit board, 4...Top vent, 5...Back vent. mouth, 6... rectifier plate, 7... electronic component.
Claims (1)
筐体上面の通気口の下方に、該通気口より離れて位置し
た通風整流板を備えたことを特徴とする電子機器の通気
構造。 ２、筐体上面及び通風整流板を後方が高くなるように傾
斜させるとともに筐体の背面上部に通気口を備えた特許
請求の範囲第１項記載の電子機器の通気構造。[Claims] 1. In an electronic device having a heat radiation vent in the housing,
1. A ventilation structure for an electronic device, comprising a ventilation rectifier plate located below a ventilation hole on the upper surface of a housing and located away from the ventilation hole. 2. A ventilation structure for an electronic device according to claim 1, wherein the top surface of the casing and the ventilation rectifying plate are inclined so that the rear side is higher, and a vent is provided at the upper part of the back surface of the casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10126185A JPS61260698A (en) | 1985-05-15 | 1985-05-15 | Breathing construction of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10126185A JPS61260698A (en) | 1985-05-15 | 1985-05-15 | Breathing construction of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61260698A true JPS61260698A (en) | 1986-11-18 |
Family
ID=14295969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10126185A Pending JPS61260698A (en) | 1985-05-15 | 1985-05-15 | Breathing construction of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61260698A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004128305A (en) * | 2002-10-04 | 2004-04-22 | Yamaha Corp | Electronic device |
| JP2019009165A (en) * | 2017-06-21 | 2019-01-17 | Ｎｅｃプラットフォームズ株式会社 | Heat diffusion structure and electronic device including the same |
| JP2019091769A (en) * | 2017-11-13 | 2019-06-13 | 株式会社バッファロー | Electronic equipment enclosure |
| WO2019150742A1 (en) * | 2018-01-31 | 2019-08-08 | Ｎｅｃプラットフォームズ株式会社 | Heat-dissipating water-proof structure |
-
1985
- 1985-05-15 JP JP10126185A patent/JPS61260698A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004128305A (en) * | 2002-10-04 | 2004-04-22 | Yamaha Corp | Electronic device |
| JP2019009165A (en) * | 2017-06-21 | 2019-01-17 | Ｎｅｃプラットフォームズ株式会社 | Heat diffusion structure and electronic device including the same |
| JP2019091769A (en) * | 2017-11-13 | 2019-06-13 | 株式会社バッファロー | Electronic equipment enclosure |
| WO2019150742A1 (en) * | 2018-01-31 | 2019-08-08 | Ｎｅｃプラットフォームズ株式会社 | Heat-dissipating water-proof structure |
| JP2019134082A (en) * | 2018-01-31 | 2019-08-08 | Ｎｅｃプラットフォームズ株式会社 | Heat radiation and water resistant structure |
| US11910553B2 (en) | 2018-01-31 | 2024-02-20 | Nec Platforms, Ltd. | Heat-dissipating waterproof structure |
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