JP7070528B2 - Image pickup device and image sensor - Google Patents

Description

The present invention relates to an image pickup device and an image pickup apparatus.

An image pickup unit in which a back-illuminated image pickup chip and a signal processing chip are connected via microbumps for each cell in which a plurality of pixels are put together is known.
[Prior Art Document]
[Patent Document]
[Patent Document 1] Japanese Unexamined Patent Publication No. 2006-49361

In the image pickup unit, control of charge accumulation time and control of pixel signal readout are performed for each cell. However, when the number of pixels included in the cell is increased due to the demand for high resolution, the so-called rolling shutter method is used in which the pixels are controlled row by row in the cell, so that the distortion when an image of a moving object is imaged is the cell. There is a problem that it appears in units.

In the first aspect of the present invention, the image pickup device is a plurality of first photoelectric conversion units arranged in the first region and converting light into electric charges, and a second region on the row direction side from the first region. An image sensor having a plurality of second photoelectric conversion units arranged in the above and converting light into electric charges, an order in which charges are transferred in the plurality of first photoelectric conversion units, and the plurality of second photoelectric conversion units. Each unit includes a control unit that controls the order in which charges are transferred and the order in which the charges are transferred.

In the second aspect of the present invention, the image pickup device is a plurality of first photoelectric conversion units arranged in the first region and converting light into electric charges, and a second region on the row direction side from the first region. A plurality of second photoelectric conversion units, which are arranged in the above and convert light into charges, are provided, and the order in which charges are transferred in the plurality of first photoelectric conversion units is different in the plurality of second photoelectric conversion units. The order in which the charges are transferred is different.

The outline of the above invention does not list all the necessary features of the present invention. A subcombination of these feature groups can also be an invention.

It is sectional drawing of the back-illuminated type image sensor which concerns on this embodiment. It is a figure explaining the pixel arrangement and the unit group of an image pickup chip. The equivalent circuit diagram of a pixel is shown. It is a circuit diagram which shows the connection relation of the said pixel in a unit group. It is a block diagram which shows the structure of the image pickup apparatus which concerns on this embodiment. This is an example of a sequence table. It is a block diagram which shows the functional structure of an image pickup device. It is a conceptual diagram which shows the order of control of charge accumulation of a plurality of unit groups. The equivalent circuit of other pixels is shown. It is a block diagram which shows the structure of the image pickup apparatus which has another drive part.

Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention to which the claims are made. Also, not all combinations of features described in the embodiments are essential to the means of solving the invention.

FIG. 1 is a cross-sectional view of a back-illuminated image sensor 100 according to the present embodiment. The image pickup device 100 includes an image pickup chip and 113 that output a pixel signal corresponding to incident light, a signal processing chip 111 that processes the pixel signal, and a memory chip 112 that stores the pixel signal. The image pickup chip 113, the signal processing chip 111, and the memory chip 112 are laminated and electrically connected to each other by a conductive bump 109 such as Cu.

As shown in the figure, the incident light is mainly incident in the Z-axis plus direction indicated by the white arrow. In the present embodiment, in the image pickup chip 113, the surface on the side where the incident light is incident is referred to as a back surface. Further, as shown in the coordinate axes, the right direction of the paper surface orthogonal to the Z axis is defined as the X-axis plus direction, and the Z-axis and the front direction of the paper surface orthogonal to the X-axis are defined as the Y-axis plus direction. In some of the subsequent figures, the coordinate axes are displayed so that the orientation of each figure can be understood with reference to the coordinate axes of FIG.

An example of the image pickup chip 113 is a back-illuminated MOS image sensor. The PD layer is arranged on the back surface side of the wiring layer 108. The PD layer 106 has a plurality of PDs (photodiodes) 104 arranged two-dimensionally, and a transistor 105 provided corresponding to the PD 104. PD104 is an example of a photoelectric conversion element.

A color filter 102 is provided on the incident side of the incident light in the PD layer 106 via the passivation film 103. The color filter 102 has a plurality of types that transmit different wavelength regions from each other, and has a specific arrangement corresponding to each of the PD 104. The arrangement of the color filters 102 will be described later. A set of a color filter 102, a PD 104, and a transistor 105 forms one pixel.

A microlens 101 is provided on the incident side of the incident light in the color filter 102 corresponding to each pixel. The microlens 101 collects incident light toward the corresponding PD 104.

The wiring layer 108 has a wiring 107 that transmits a pixel signal from the PD layer 106 to the signal processing chip 111. The wiring 107 may have multiple layers, and may be provided with passive elements and active elements.

A plurality of bumps 109 are arranged on the surface of the wiring layer 108. The plurality of bumps 109 are aligned with the plurality of bumps 109 provided on the facing surfaces of the signal processing chip 111, and the image pickup chip 113 and the signal processing chip 111 are aligned by being pressurized or the like. The bumps 109 are joined together and electrically connected.

Similarly, a plurality of bumps 109 are arranged on the surfaces of the signal processing chip 111 and the memory chip 112 facing each other. These bumps 109 are aligned with each other, and the signal processing chip 111 and the memory chip 112 are pressurized, so that the aligned bumps 109 are joined to each other and electrically connected.

The bonding between the bumps 109 is not limited to Cu bump bonding by solid phase diffusion, but micro bump bonding by solder melting may be adopted. Further, for example, about one bump 109 may be provided for one output wiring described later. Therefore, the size of the bump 109 may be larger than the pitch of the PD 104. Further, in the peripheral region other than the pixel region in which the pixels are arranged, a bump larger than the bump 109 corresponding to the pixel region may be provided together.

The signal processing chip 111 has TSVs (Through Silicon Vias) 110 that connect circuits provided on the front and back surfaces to each other. The TSV 110 is preferably provided in the peripheral region. Further, the TSV 110 may also be provided in the peripheral area of the image pickup chip 113 and the memory chip 112.

FIG. 2 is a diagram illustrating a pixel arrangement of the image pickup chip 113 and a unit group 131. In particular, the state in which the image pickup chip 113 is observed from the back surface side is shown. More than 20 million pixels are arranged in a matrix in the pixel area. In the example of FIG. 2, 16 pixels of adjacent 4 pixels × 4 pixels form one group. The grid lines in the figure show the concept that adjacent pixels are grouped to form a unit group 131. In other words, a pixel region is formed by arranging a plurality of unit groups 131 two-dimensionally.

As shown in the partially enlarged view of the pixel region, the unit group 131 includes four so-called Bayer arrays including four pixels of green pixels Gb, Gr, blue pixels B, and red pixels R in the vertical and horizontal directions. The green pixels Gb and Gr have a green filter as a color filter 102, and receive light in the green wavelength band among the incident light. Similarly, the blue pixel B has a blue filter as a color filter 102 and receives light in the blue wavelength band, and the red pixel R has a red filter as the color filter 102 and receives light in the red wavelength band. ..

FIG. 3 shows an equivalent circuit diagram of the pixel 150. Each of the plurality of pixels 150 has the PD 104, the transfer transistor 152, the reset transistor 154, the amplification transistor 156, and the selection transistor 158. At least some of these transistors correspond to the transistor 105 in FIG. Further, the pixel 150 includes a reset wiring 300 to which an on signal of the reset transistor 154 is supplied, a transfer wiring 302 to which an on signal of the transfer transistor 152 is supplied, a power supply wiring 304 to receive power from the power supply Vdd, and a selection transistor 158. The selection wiring 306 to which the ON signal of the above is supplied and the output wiring 308 to output the pixel signal are arranged.

The source, gate, and drain of the transfer transistor 152 are connected to one end of the PD 104, the transfer wiring 302, and the gate of the amplification transistor 156, respectively. The drain of the reset transistor 154 is connected to the power supply wiring 304 and the source is connected to the gate of the amplification transistor 156. A so-called floating diffusion FD is formed between the drain of the transfer transistor 152 and the source of the reset transistor 154.

The drain of the amplification transistor 156 is connected to the power supply wiring 304 and the source is connected to the drain of the selection transistor 158. The gate of the selection transistor 158 is connected to the selection wiring 306 and the source is connected to the output wiring 308. The load current source 309 supplies current to the output wiring 308. That is, the output wiring 308 for the selection transistor 158 is formed by the source follower. The load current source 309 may be provided on the image pickup chip 113 side or the signal processing chip 111 side.

Here, the flow from the start of charge accumulation to the pixel output after the end of accumulation will be described. When a reset pulse is applied to the reset transistor 154 through the reset wiring 300 and at the same time a transfer pulse is applied to the transfer transistor 152 through the transfer wiring 302, the potentials of the PD 104 and the floating diffusion FD are reset.

When the application of the transfer pulse is released, the PD 104 accumulates an electric charge corresponding to the incident light received. After that, when the transfer pulse is applied again without the reset pulse being applied, the accumulated charge is transferred to the floating diffusion FD, and the potential of the floating diffusion FD changes from the reset potential to the signal potential after charge accumulation. .. Then, when the selection pulse is applied to the selection transistor 158 through the selection wiring 306, the fluctuation of the signal potential of the floating diffusion FD is transmitted to the output wiring 308 via the amplification transistor 156 and the selection transistor 158. As a result, the pixel signal corresponding to the reset potential and the signal potential is output from the unit pixel to the output wiring 308.

FIG. 4 is a circuit diagram showing the connection relationship of the pixels 150 in the unit group 133. Although the reference numbers of the respective transistors are omitted for the purpose of making the drawings easier to see, each transistor of each pixel in FIG. 4 has the same configuration and function as each transistor arranged at the corresponding position in the pixel 150 of FIG. ..

The unit group 133 of FIG. 4 is formed by 9 pixels of adjacent 3 pixels × 3 pixels. The number of pixels included in the unit group 133 is not limited to this. The two-dimensional position of the unit group 133 is indicated by pixel A or the like, and the order in which the pixel A or the like is controlled is indicated by (1) or the like.

The pixel reset transistors included in the unit group 133 are individually turned on and off for each pixel. In the example shown in FIG. 4, a reset wiring 300 for turning on / off the reset transistor of the pixel A is provided, and a reset wiring 310 for turning on / off the reset transistor of the pixel B is provided separately from the reset wiring 300. Similarly, the reset wiring 320 for turning on and off the reset transistor of the pixel C is provided separately from the reset wirings 300 and 310. Dedicated lines for turning on and off each reset transistor are also arranged for the other pixels D to I.

The transfer transistors of the pixels included in the unit group 133 are also turned on and off individually for each pixel. In the example shown in FIG. 4, the transfer wiring 302 for turning on / off the transfer transistor of pixel A, the transfer wiring 312 for turning on / off the transfer transistor of pixel B, and the transfer wiring 322 for turning on / off the transfer transistor of pixel C are separately provided. .. A dedicated line for selecting each transfer transistor is also arranged for the other pixels D to I.

The pixel selection transistors included in the unit group 133 are also turned on and off individually for each pixel. In the example shown in FIG. 4, the selection wiring 306 for turning on / off the selection transistor of pixel A, the selection wiring 316 for turning on / off the selection transistor of pixel B, and the selection wiring 326 for turning on / off the selection transistor of pixel C are separately provided. .. A dedicated line for selecting each selection transistor is also arranged for the other pixels D to I.

The power supply wiring 304 is commonly connected by pixels A to I included in the unit group 133. Similarly, the output wiring 308 is commonly connected by pixels A to I included in the unit group 133. Further, the power supply wiring 304 is commonly connected among the plurality of unit groups, but the output wiring 308 is provided for each unit group.

By turning on / off the reset transistor and the transfer transistor of the unit group 133 individually, the charge including the charge accumulation start time, the accumulation end time, and the transfer timing is independently for each pixel A to I included in the unit group 133. Accumulation can be controlled. Further, by turning on and off the selection transistors of the unit group 133 individually, the pixel signals of the pixels A to I can be output via the common output wiring 308.

Here, there is a so-called rolling shutter method in which charge accumulation is controlled in a regular order for rows and columns for each pixel A to I included in the unit group 133. In the rolling shutter method, since the pixels are selected for each row and then the columns are specified, the pixel signals are output in the order of "ABCDEFGHI" in the example of FIG. However, in the rolling shutter method, when a moving object is imaged, an image in which the moving object is obliquely distorted is generated for the pixels in the unit group 133.

On the other hand, in the present embodiment, pixel signals are output in an order different from the rolling shutter method, in which at least two pixels adjacent to each other are not continuously selected. In the example shown in FIG. 4, pixel signals are output in the order of "AICGFDHBE". As a result, it is possible to disperse the distortion when the moving object is imaged and make it inconspicuous on the image.

FIG. 5 is a block diagram showing the configuration of the image pickup apparatus 500 according to the present embodiment. The image pickup device 500 includes a photographing lens 520 as a photographing optical system, and the photographing lens 520 guides a subject light flux incident along the optical axis OA to the image pickup element 100. The photographing lens 520 may be an interchangeable lens that can be attached to and detached from the image pickup apparatus 500. The image pickup device 500 mainly includes an image pickup element 100, a system control unit 501, a drive unit 502, a photometric unit 503, a work memory 504, a recording unit 505, and a display unit 506.

The photographing lens 520 is composed of a plurality of optical lens groups, and forms a subject light flux from the scene in the vicinity of the focal plane thereof. In addition, in FIG. 5, it is represented by one virtual lens arranged in the vicinity of the pupil. The drive unit 502 is a control circuit that executes charge accumulation control such as timing control and region control of the image pickup device 100 according to instructions from the system control unit 501. In this sense, it can be said that the drive unit 502 has a function of an image sensor control unit that causes the image sensor 100 to accumulate charges and output a pixel signal. The drive unit 502 is combined with the image pickup device 100 to form an image pickup unit. The control circuit forming the drive unit 502 may be chipped and laminated on the image pickup device 100.

The image sensor 100 passes the pixel signal to the image processing unit 511 of the system control unit 501. The image processing unit 511 performs various image processing using the work memory 504 as a workspace to generate image data. For example, when generating image data in JPEG file format, a compression process is executed after performing a white balance process, a gamma process, or the like. The generated image data is recorded in the recording unit 505, converted into a display signal, and displayed on the display unit 506 for a preset time.

The photometric unit 503 detects the luminance distribution of the scene prior to a series of shooting sequences that generate image data. The photometric unit 503 includes, for example, an AE sensor having about 1 million pixels. The calculation unit 512 of the system control unit 501 receives the output of the photometric unit 503 and calculates the brightness for each area of the scene. The calculation unit 512 determines the shutter speed, the aperture value, and the ISO sensitivity according to the calculated luminance distribution. The pixels used in the AE sensor may be provided in the image sensor 100, and in this case, the photometric unit 503 separate from the image sensor 100 may not be provided.

The drive unit 502 has an order setting unit 514 and an order table 516. When the order setting unit 514 receives an instruction for imaging of the image pickup device 100 from the system control unit 501, the order setting unit 514 sets an order for controlling each pixel A or the like included in the unit group 133 with reference to the order table 516.

FIG. 6 is an example of the sequence table 516. The order table 516 stores information for identifying the position of the pixel in association with the order in which the pixel is controlled. In the example of FIG. 6, the information A to I for identifying the pixel positions is stored in order corresponding to the unit group 133 of FIG.

The order includes an order in which at least two adjacent pixels in a unit group are not selected. For example, in order 1, the order of pixel A, pixel I, and pixel C is included. Pixels A are arranged in the 1st row and 1st column in the unit group 133, pixel I is arranged in the 3rd row and 3rd column, and pixel C is arranged in the 1st row and 3rd column. Therefore, neither pixel B nor pixel D is selected next to pixel A. Further, the order of the pixel A, the pixel I, and the pixel C is at least the order of going back and forth between the rows. Further, it is preferable that the same row or column is not continuously arranged in the order.

In order 1, pixel I is controlled next to pixel A, but any pixel is controlled in any order. As described above, the order of the order table 516 is different from the so-called thinning-out reading, but it may be applied in the case of thinning-out reading. In this case, for example, in the case of thinning out to read out half of the pixels, the first to fifth pixels may be controlled and the pixel signal may be read from them.

FIG. 7 is a block diagram showing a functional configuration of the image pickup device 100. The analog multiplexer 411 sequentially selects pixels A to I of the unit group 133 in the order determined by the order setting unit 514 with reference to the order table 516, and outputs each pixel signal to the output wiring 308. ..

The pixel signal output via the multiplexer 411 is converted to CDS and A / D by a signal processing circuit 412 that performs correlated double sampling (CDS) analog / digital (A / D) conversion via the output wiring 308. Is done. The pixel signal digitized by the A / D conversion is passed to the demultiplexer 413 via the output wiring 330 and stored in the pixel memory 414 corresponding to each pixel. In this case, the pixel memory 414 is associated with the position of the two-dimensional array of pixels.

In the example shown in FIG. 7, according to the order 1 of the order table 516 of FIG. 6, the multiplexer 411 controls the charge accumulation of the pixel A and the like of the unit group 133 and outputs the pixel signal. For example, the multiplexer 411 outputs the pixel signal of the pixel A first and outputs the pixel signal of the pixel I second. The demultiplexer 413 stores the pixel signal of the A / D-converted pixel A in the memory A, and then stores the pixel signal of the A / D-converted pixel I in the memory I.

The multiplexer 411 is formed on the image pickup chip 113. The signal processing circuit 412 is formed on the signal processing chip 111. The demultiplexer 413 and the pixel memory 414 are formed on the memory chip 112.

Output wirings 308 and 330 are provided corresponding to the unit group 133. Since the image pickup element 100 has an image pickup chip 113, a signal processing chip 111, and a memory chip 112 stacked on top of each other, by making these wirings electrical connections between the chips using bumps 109, each chip can be made larger in the plane direction. Wiring can be routed without doing anything.

The arithmetic circuit 415 processes the pixel signal stored in the pixel memory 414 and hands it over to the image processing unit in the subsequent stage. The arithmetic circuit 415 may be provided on the signal processing chip 111 or the memory chip 112. In the figure, connections for one group are shown, but in reality, these exist for each group and operate in parallel. However, the arithmetic circuit 415 does not have to exist for each group, and for example, one arithmetic circuit 415 may sequentially refer to the value of the pixel memory 414 corresponding to each group for processing.

FIG. 8 is a conceptual diagram showing the order of control of charge accumulation of a plurality of unit groups 133 and 135. The order of control of charge accumulation is different between the unit group 133 and the unit group 135 for at least a part of the pixels at the corresponding positions.

In the example shown in FIG. 8, the order of control of the unit group 133 is "AICGFDHBE" according to the order 1 of the order table 516 of FIG. On the other hand, the order of control of the unit group 135 is "IAGCDFBHIE" according to the order 2 of the order table 516. The pixel A of the unit group 133 is controlled first, while the pixel A of the unit group 133 is controlled second.

According to the embodiment shown in FIG. 8, in the plurality of unit groups 133 and 135, the order of control of charge accumulation is different for at least a part of the pixels at the corresponding positions. Therefore, it is possible to disperse the distortion when the moving object is imaged and make it inconspicuous on the image.

FIG. 9 shows an equivalent circuit of another pixel 170. In FIG. 9, the same reference number as that of the pixel 150 in FIG. 3 is assigned and the description thereof will be omitted. A load current source is connected to the output wiring 308 as in the example of FIG. 3, but the illustration is omitted.

The pixel 170 is provided with a row selection transistor 171 and a column selection transistor 172 between the transfer wiring 302 and the gate of the transfer transistor 152. The gate of the row selection transistor 171 is connected to the row selection wiring 391, and the gate of the column selection transistor 172 is connected to the column selection wiring 392. In the row selection wiring 391, for example, the gates of the row selection transistors of a plurality of pixels arranged in the row direction are commonly arranged with the pixel 170 in at least the unit group 133. Similarly, the column selection wiring 392 is commonly arranged with, for example, at least the gates of the pixel 170 in the unit group 133 and the column selection transistors of a plurality of pixels arranged in the column direction.

According to the above configuration, when an on signal is added to the row selection wiring 391 and the column selection wiring 392, the transfer transistor 152 of the pixel 170 specified by the wiring can be turned on. This makes it possible to control the on / off of the transfer transistor on a pixel-by-pixel basis.

Further, the pixel 170 is provided with a row selection transistor 174 and a column selection transistor 175 instead of one selection transistor 158 of the pixel 150. The gate of the row selection transistor 174 is connected to the row selection wiring 394, and the gate of the column selection transistor 175 is connected to the column selection wiring 395. In the row selection wiring 394, for example, the gates of the row selection transistors of a plurality of pixels arranged in the row direction are commonly arranged with the pixel 170 in at least the unit group 133. Similarly, in the column selection wiring 395, for example, the gates of the column selection transistors of a plurality of pixels arranged in the column direction with the pixels 170 in at least the unit group 133 are commonly arranged.

According to the above configuration, when an on signal is added to the row selection wiring 394 and the column selection wiring 395, the pixel signal of the pixel 170 specified by the wiring can be output to the output wiring 308. As a result, the number of wirings can be reduced as compared with the selection wiring 306 having a one-to-one correspondence with the selection transistor 158 such as the pixel 150.

The pixel 170 is provided with a row selection transistor 176 and a column selection transistor 177 in place of the reset transistor 154 of the pixel 150. The gate of the row selection transistor 176 is connected to the row selection wiring 396, and the gate of the column selection transistor 177 is connected to the column selection wiring 397. In the row selection wiring 396, for example, the gates of the row selection transistors of a plurality of pixels arranged in the row direction are commonly arranged with the pixel 170 in at least the unit group 133. Similarly, in the column selection wiring 397, for example, the gate of the column selection transistor of a plurality of pixels arranged in the column direction is commonly arranged with the pixel 170 in at least the unit group 133.

According to the above configuration, when an on signal is added to the row selection wiring 396 and the column selection wiring 397, the pixel 170 specified by the wiring can be reset. This makes it possible to control the reset on a pixel-by-pixel basis.

The row selection wiring 391 and column selection wiring 392 for the transfer transistor 152, the row selection wiring 396 and column selection wiring 397 for resetting, and the row selection wiring 394 and column selection wiring 395 for the output wiring 308 are used in combination. You don't have to. The configuration of the pixel 150 may be used for any of them. If transfer and output are not performed at the same time, the row selection wiring 391 and 394 are used in common for transfer and output, and the column selection wiring 392 and 395 are also used as one for transfer and output. It may be used in common with.

In all of the above embodiments, the power supply wiring 304 is common to the unit group 133. In addition to this, the power supply wiring 304 may be common among the plurality of unit groups 131.

FIG. 10 is a block diagram showing a configuration of an image pickup apparatus 500 having another drive unit 522. The same reference number as that of the image pickup apparatus 500 of FIG. 5 in the image pickup apparatus 500 of FIG. 10 will be assigned and the description thereof will be omitted.

The drive unit 522 has a random number generation unit 518 instead of the order table 516 of the drive unit 502 in FIG. The random number generation unit 518 generates a pseudo-random number according to an instruction from the system control unit 501. The order setting unit 514 sets an order for controlling each pixel A or the like included in the unit group 133 based on the pseudo-random number generated by the random number generation unit 518.

By associating the numerical value indicated by the pseudo-random number with the two-dimensional position of the pixel in advance, the order setting unit 514 controls the pixel indicated by the pseudo-random number generated by the random number generation unit 518. As a result, each pixel is controlled in an order in which at least two adjacent pixels included in each of the unit groups are not continuously selected by using a pseudo-random number.

Alternatively or additionally, the sequence setting unit 514 determines which of the plurality of sequences to use in the sequence table 516 shown in FIG. 6 using the pseudo-random numbers generated by the random number generator 518. You may.

As described above, according to the present embodiment, since the pixel signals are output in the order in which at least two pixels adjacent to each other in the unit group are not continuously selected, the distortion when the moving object is imaged is dispersed and displayed on the image. It can be made inconspicuous.

Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various changes or improvements can be made to the above embodiments. It is clear from the description of the claims that the form with such changes or improvements may be included in the technical scope of the present invention.

The order of execution of each process such as operation, procedure, step, and step in the apparatus, system, program, and method shown in the claims, specification, and drawings is particularly "before" and "prior to". It should be noted that it can be realized in any order unless the output of the previous process is used in the subsequent process. Even if the scope of claims, the specification, and the operation flow in the drawings are explained using "first", "next", etc. for convenience, it means that it is essential to carry out in this order. It's not a thing.

100 Imaging element, 101 Microlens, 102 Color filter, 103 Passion film, 104 PD, 105 Transistor, 106 PD layer, 107 wiring, 108 wiring layer, 109 bump, 110 TSV, 111 signal processing chip, 112 memory chip, 113 imaging Chip, 131 unit group, 133 unit group, 135 unit group, 150 pixels, 152 transfer transistor, 154 reset transistor, 156 amplification transistor, 158 selection transistor, 170 pixels, 171 row selection transistor, 172 column selection transistor, 174 row selection transistor , 175-column selection transistor, 176-row selection transistor, 177-column selection transistor, 300 reset wiring, 302 transfer wiring, 304 power supply wiring, 306 selection wiring, 308 output wiring, 309 load current source, 310 reset wiring, 312 transfer wiring, 316. Selective wiring, 320 reset wiring, 322 transfer wiring, 326 selective wiring, 330 output wiring, 391 row selective wiring, 392 column selective wiring, 394 row selective wiring, 395 column selective wiring, 396 row selective wiring, 397 column selective wiring, 411 Multiplexer, 412 signal processing circuit, 413 demultiplexer, 414 pixel memory, 415 arithmetic circuit, 500 image pickup device, 520 shooting lens, 501 system control unit, 502 drive unit, 503 photometric unit, 504 work memory, 505 recording unit, 506 display. 511 Image processing unit, 512 calculation unit, 514 order setting unit, 516 order table, 518 random number generator unit, 522 drive unit

Claims (30)

An image sensor having a pixel region in which a plurality of photoelectric conversion units that convert light into electric charges are arranged side by side in the row direction and the column direction, respectively .
Among the plurality of photoelectric conversion units, the order in which the charges converted by the plurality of first photoelectric conversion units arranged in the first region of the pixel region are transferred from the plurality of first photoelectric conversion units, respectively. Among the plurality of photoelectric conversion units, the order in which the charges converted by the plurality of second photoelectric conversion units arranged in the second region of the pixel region are transferred from the plurality of second photoelectric conversion units is the order. It is equipped with a control unit that controls the order so that it is in a different order.
The second region is an image pickup apparatus arranged at a position on the row direction side from the first region in the pixel region . An image sensor in which multiple photoelectric conversion units that convert light into electric charges are arranged,
The order in which the charges converted by the plurality of first photoelectric conversion units among the plurality of photoelectric conversion units are transferred from the plurality of first photoelectric conversion units, and the second of the plurality of photoelectric conversion units. A control unit that controls the charges converted by the photoelectric conversion units so that the charges are transferred from the plurality of second photoelectric conversion units in a different order from each other is provided.
The plurality of first photoelectric conversion units are arranged side by side in the row direction.
The control unit controls the imaging so that the charges converted by the two photoelectric conversion units arranged next to each other in the row direction are not transferred in a continuous order among the plurality of first photoelectric conversion units. Device. The image pickup apparatus according to claim 2, wherein the plurality of second photoelectric conversion units are arranged side by side in the row direction. The control unit controls the charges converted by the two photoelectric conversion units arranged next to each other in the row direction so as not to be transferred in a continuous order among the plurality of second photoelectric conversion units. Item 3. The imaging device according to item 3. An image sensor in which multiple photoelectric conversion units that convert light into electric charges are arranged,
The order in which the charges converted by the plurality of first photoelectric conversion units among the plurality of photoelectric conversion units are transferred from the plurality of first photoelectric conversion units, and the second of the plurality of photoelectric conversion units. A control unit that controls the charges converted by the photoelectric conversion units so that the charges are transferred from the plurality of second photoelectric conversion units in a different order from each other is provided.
The plurality of first photoelectric conversion units are arranged side by side in the column direction, respectively.
The control unit controls the imaging so that the charges converted by the two photoelectric conversion units arranged next to each other in the column direction are not transferred in a continuous order among the plurality of first photoelectric conversion units. Device. The image pickup apparatus according to claim 5, wherein the plurality of second photoelectric conversion units are arranged side by side in the column direction. The control unit controls the charges converted by the two photoelectric conversion units arranged next to each other in the column direction so as not to be transferred in a continuous order among the plurality of second photoelectric conversion units. Item 6. The image pickup apparatus according to Item 6. From claim 1, the image pickup element includes a signal processing unit that performs signal processing on a signal based on the charge transferred from the first photoelectric conversion unit and a signal based on the charge transferred from the second photoelectric conversion unit. The imaging device according to any one of claim 7 . The image pickup apparatus according to claim 8 , wherein the signal processing unit includes a circuit for converting an analog signal into a digital signal. The image pickup device according to claim 8 or 9 , wherein the image pickup device includes a first semiconductor chip in which the plurality of photoelectric conversion units are arranged and a second semiconductor chip in which the signal processing unit is arranged. The image pickup apparatus according to claim 10 , wherein the first semiconductor chip is laminated by the second semiconductor chip. The image pickup element performs signal processing on a first signal processing circuit that performs signal processing on a signal based on the charge transferred from the first photoelectric conversion unit and a signal based on the charge transferred from the second photoelectric conversion unit. The image pickup apparatus according to any one of claims 1 to 7, further comprising a second signal processing circuit. The first signal processing circuit has a circuit for converting an analog signal into a digital signal.
The imaging device according to claim 12 , wherein the second signal processing circuit includes a circuit for converting an analog signal into a digital signal. 12. The image pickup element has a first semiconductor chip in which the plurality of photoelectric conversion units are arranged, and a second semiconductor chip in which the first signal processing circuit and the second signal processing circuit are arranged. Alternatively, the imaging device according to claim 13 . The image pickup apparatus according to claim 14 , wherein the first semiconductor chip is laminated by the second semiconductor chip. An image sensor having a pixel region in which a plurality of photoelectric conversion units that convert light into electric charges are arranged side by side in the row direction and the column direction, respectively .
Among the plurality of photoelectric conversion units, the order in which the charges converted by the plurality of first photoelectric conversion units arranged in the first region of the pixel region are transferred from the plurality of first photoelectric conversion units is the order. Of the plurality of photoelectric conversion units, what is the order in which the charges converted by the plurality of second photoelectric conversion units arranged in the second region of the pixel region are transferred from the plurality of second photoelectric conversion units. Different,
The second region is an image pickup device arranged at a position on the row direction side from the first region in the pixel region . An image sensor equipped with a plurality of photoelectric conversion units that convert light into electric charges.
The order in which the charges converted by the plurality of first photoelectric conversion units among the plurality of photoelectric conversion units are transferred from the plurality of first photoelectric conversion units is the order in which the charges are transferred from the plurality of second photoelectric conversion units. The order in which the electric charges converted by the photoelectric conversion units are transferred from the plurality of second photoelectric conversion units is different.
The plurality of first photoelectric conversion units are arranged side by side in the row direction.
Of the plurality of first photoelectric conversion units, the two photoelectric conversion units arranged side by side in the row direction are image pickup devices in which the converted charges are not transferred in a continuous order. The image pickup device according to claim 17 , wherein the plurality of second photoelectric conversion units are arranged side by side in the row direction. The image pickup device according to claim 18 , wherein among the plurality of second photoelectric conversion units, the two photoelectric conversion units arranged next to each other in the row direction do not transfer the converted charges in a continuous order. An image sensor equipped with a plurality of photoelectric conversion units that convert light into electric charges.
The order in which the charges converted by the plurality of first photoelectric conversion units among the plurality of photoelectric conversion units are transferred from the plurality of first photoelectric conversion units is the order in which the charges are transferred from the plurality of second photoelectric conversion units. The order in which the electric charges converted by the photoelectric conversion units are transferred from the plurality of second photoelectric conversion units is different.
The plurality of first photoelectric conversion units are arranged side by side in the column direction, respectively.
Of the plurality of first photoelectric conversion units, the two photoelectric conversion units arranged side by side in the column direction are image pickup devices in which the converted charges are not transferred in a continuous order. The image pickup device according to claim 20 , wherein the plurality of second photoelectric conversion units are arranged side by side in the column direction. The image pickup device according to claim 21 , wherein of the plurality of second photoelectric conversion units, the two photoelectric conversion units arranged next to each other in the column direction do not transfer the converted charges in a continuous order. 6 . The image pickup device according to item 1 . 23. The image pickup device according to claim 23 , wherein the signal processing unit has a circuit for converting an analog signal into a digital signal. The plurality of photoelectric conversion units are arranged on the first semiconductor chip, and the plurality of photoelectric conversion units are arranged on the first semiconductor chip.
The image pickup device according to claim 23 or 24 , wherein the signal processing unit is arranged on the second semiconductor chip. The image pickup device according to claim 25 , wherein the first semiconductor chip is laminated by the second semiconductor chip. A first signal processing circuit that performs signal processing on a signal based on the charge transferred from the first photoelectric conversion unit, and
A second signal processing circuit that performs signal processing on the signal based on the charge transferred from the second photoelectric conversion unit, and
The image pickup device according to any one of claims 16 to 22 . The first signal processing circuit has a circuit for converting an analog signal into a digital signal.
The image pickup element according to claim 27 , wherein the second signal processing circuit includes a circuit for converting an analog signal into a digital signal. The plurality of photoelectric conversion units are arranged on the first semiconductor chip, and the plurality of photoelectric conversion units are arranged on the first semiconductor chip.
The image pickup element according to claim 27 or 28 , wherein the first signal processing circuit and the second signal processing circuit are arranged on a second semiconductor chip. The image pickup device according to claim 29 , wherein the first semiconductor chip is laminated by the second semiconductor chip.

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