JP6991300B2 - Electronic components - Google Patents

Description

The present invention relates to an electronic component comprising a sensor element having an outside air contact surface including an outside air contact area to be exposed to the outside air. Examples of the sensor element having a surface for contact with the outside air include a barometric pressure sensor element, a humidity sensor element, and the like.

FIG. 57 is a cross-sectional view showing an electronic component (hereinafter, referred to as “barometric pressure detection device”) provided with a conventional barometric pressure sensor element.
The conventional barometric pressure detection device 601 includes a barometric pressure sensor element 602, a support substrate 603 that supports the barometric pressure sensor element 602, and a lid 604 that covers the barometric pressure sensor element 602. The lid 604 is made of, for example, metal. The lid 604 is formed with a ventilation hole 604a that penetrates the lid 604 in the thickness direction.

The barometric pressure sensor element 602 includes a glass pedestal 611 fixed to the support substrate 603, a silicon substrate 612 provided on the glass pedestal 611, and a diaphragm 613 supported by the silicon substrate 612. The silicon substrate 612 is formed with a cavity 614 penetrating in the thickness direction. A silicon substrate 612 is bonded to the pedestal 611. The pedestal 611 partitions the bottom surface of the cavity 614. The diaphragm 613 partitions the top surface portion of the cavity 614. The diaphragm 613 includes a movable portion 613A that partitions the top surface portion of the cavity 614, and a fixed portion 613B around the movable portion 613A. The fixing portion 613B of the diaphragm 613 is bonded onto the silicon substrate 612. A strain gauge resistance (not shown) is formed on the movable portion 613A.

The movable portion 613A of the diaphragm 613 is distorted according to the difference between the pressure inside the cavity (reference pressure) and the outside air pressure. The outside air pressure is detected by detecting this strain amount as the change amount of the electric resistance value of the strain gauge resistance. Therefore, the surface of the movable portion 613A of the surface of the diaphragm 613 opposite to the cavity 614 is the outside air contact region Sa that needs to be exposed to the outside air. The surface of the barometric pressure sensor element 2 on the diaphragm side is an outside air contact surface S including an outside air contact region Sa to be exposed to the outside air. The outside air contact region Sa of the barometric pressure sensor element 602 needs to be exposed to the outside air, but since it is fragile, it is necessary to protect it from touching by a finger or the like. Therefore, the outside air contact region Sa of the barometric pressure sensor element 602 is covered with the lid 604.

International Publication No. 2011/010571

In the above-mentioned conventional example, a lid for covering the outside air contact region of the barometric pressure sensor element is required. Therefore, there is a problem that the height of the barometric pressure sensor device increases and the cost increases.
An object of the present invention is to provide an electronic component that does not require a lid that covers an outside air contact region of a sensor element.

One embodiment of the present invention includes a sensor element having an outside air contact surface including an outside air contact region to be exposed to the outside air, an integrated circuit element that processes an output signal of the sensor element, the sensor element, and the integrated circuit. The support substrate includes a support substrate for supporting the element, and the support substrate is formed with a recess that is recessed from the one surface of the support substrate and whose entire side surface is surrounded by a side wall made of the support substrate. Into the first concave portion having a rectangular shape in a plan view and one side in the first concave portion extending outward from the first concave portion in a plan view from one of the four sides of the first concave portion. The sensor element is composed of a second recess that communicates with the corresponding side portion and is shallower than the first recess, and the surface for contacting the outside air of the sensor element faces the bottom surface of the first recess, and the outside air. The integrated circuit element is joined to the bottom surface of the first recess in a state where a gap through which outside air flows is formed between the contact region and the bottom surface of the first recess, and one surface of the integrated circuit element is the second surface. It is joined to the bottom surface of the second recess while facing the bottom surface of the recess, and passes from the bottom surface of the first recess through the side portion that communicates the first recess and the second recess. 2. The element / circuit connection wiring has an element / circuit connection wiring extending to the bottom surface of the recess, and the element / circuit connection wiring provides an electronic component connecting the sensor element and the integrated circuit.

In this configuration, the outside air contact surface (outside air contact area) of the sensor element is protected by a support substrate for supporting the sensor element, so it is necessary to separately provide a lid for protecting the outside air contact area of the sensor element. do not have. In this way, even when the sensor element is bonded to one surface of the support substrate while facing one surface of the support substrate, outside air flows between the outside air contact region of the sensor element and one surface of the support substrate. Since the gap is formed, the outside air contact region of the sensor element can be exposed to the outside air.

In one embodiment of the invention, the integrated circuit element has the one surface, the other surface opposite to the one surface, and the side surface connecting the one surface to the other surface. The entire side surface of the integrated circuit element is surrounded by a side wall of the recess, and the integrated circuit is supported only by the bottom surface of the recess.
In one embodiment of the present invention, the plurality of first electrodes formed on the surface side for contact with the outside air of the sensor element and the plurality of first pads formed on the bottom surface of the first recess are further included. The first electrode of the above is joined to the plurality of first pads.

In one embodiment of the present invention, the plurality of second electrodes formed on the one surface side of the integrated circuit element and the plurality of second pads formed on the bottom surface of the second recess are further included. The second electrode of the above is joined to the plurality of second pads.
In one embodiment of the invention, a plurality of external terminals formed in a region surrounding the recess on the one surface of the support substrate and connected to any of the plurality of second pads are further included.

In one embodiment of the invention, the plurality of second pads are attached to the second pad connected to any of the plurality of first pads via the element / circuit connection wiring and to the one surface of the support substrate. It includes a second pad connected to any of the plurality of external terminals via the formed pad / terminal connection wiring.

FIG. 1 is a schematic plan view of the first barometric pressure detection device. FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. FIG. 3 is a schematic cross-sectional view taken along line III-III of FIG. FIG. 4 is a schematic cross-sectional view showing a manufacturing process of the atmospheric pressure detection device of FIG. FIG. 5 is a schematic cross-sectional view showing the next step of FIG. FIG. 6 is a schematic cross-sectional view showing the next step of FIG. FIG. 7 is a schematic cross-sectional view showing the next step of FIG. FIG. 8 is a schematic cross-sectional view showing the next step of FIG. 7. FIG. 9 is a schematic cross-sectional view showing the next step of FIG. FIG. 10 is a schematic cross-sectional view showing the next step of FIG. FIG. 11 is a schematic cross-sectional view showing the next step of FIG. FIG. 12 is a schematic cross-sectional view showing the next step of FIG. FIG. 13 is a schematic cross-sectional view showing the next step of FIG. FIG. 14 is a schematic cross-sectional view showing the next step of FIG. FIG. 15 is a schematic cross-sectional view showing the next step of FIG. FIG. 16 is a schematic cross-sectional view showing the next step of FIG. FIG. 17 is a schematic cross-sectional view showing the next step of FIG. FIG. 18 is a schematic cross-sectional view showing a mounting state of the atmospheric pressure detection device shown in FIG. FIG. 19 is a schematic cross-sectional view showing a modified example of the first atmospheric pressure detection device. FIG. 20 is a view of the outside air contact surface of the atmospheric pressure sensor element used in the atmospheric pressure detection device of FIG. 19 as viewed from the −Z direction side. FIG. 21 is a partially enlarged cross-sectional view of the barometric pressure sensor element used in the barometric pressure detection device of FIG. FIG. 22 shows a modified example of the waterproof / dustproof wall, and is a view of the outside air contact surface of the barometric pressure sensor element as viewed from the −Z direction side. FIG. 23 shows another modification of the waterproof / dustproof wall, and is a view of the surface of the barometric pressure sensor element for contact with the outside air as viewed from the −Z direction side. FIG. 24 shows still another modification of the waterproof / dustproof wall, and is a view of the outside air contact surface of the barometric pressure sensor element as viewed from the −Z direction side. FIG. 25 is a schematic cross-sectional view showing an example in which a waterproof / dustproof wall is formed in a high frequency portion of a support substrate. FIG. 26 is a schematic plan view showing a waterproof / dustproof wall formed in a high frequency portion of a support substrate. FIG. 27 shows a modified example of the waterproof / dustproof wall formed in the high frequency portion of the support substrate, and is a view of the high frequency portion of the support substrate viewed from the + Z direction side. FIG. 28 shows another modified example of the waterproof / dustproof wall formed in the high frequency portion of the support substrate, and is a view of the high frequency portion of the support substrate viewed from the + Z direction side. FIG. 29 shows still another modification of the waterproof / dustproof wall formed in the high frequency portion of the support substrate, and is a view of the high frequency portion of the support substrate viewed from the + Z direction side. FIG. 30 is a schematic plan view of the second barometric pressure detection device. FIG. 31 is a schematic cross-sectional view taken along the line XXXI-XXXI of FIG. FIG. 32 is a schematic cross-sectional view showing the mounting state of the atmospheric pressure detection device shown in FIG. FIG. 33 is a schematic cross-sectional view showing a modified example of the second barometric pressure detection device. FIG. 34 is a view of the outside air contact surface of the atmospheric pressure sensor element used in the atmospheric pressure detection device of FIG. 33 as viewed from the −Z direction side. FIG. 35 is a partially enlarged cross-sectional view of the barometric pressure sensor element used in the barometric pressure detection device of FIG. 33. FIG. 36 shows a modified example of the waterproof / dustproof wall, and is a view of the outside air contact surface of the barometric pressure sensor element as viewed from the −Z direction side. FIG. 37 shows another modified example of the waterproof / dustproof wall, and is a view of the surface of the barometric pressure sensor element for contact with the outside air as viewed from the −Z direction side. FIG. 38 shows still another modification of the waterproof / dustproof wall, and is a view of the surface of the barometric pressure sensor element for contact with the outside air as viewed from the −Z direction side. FIG. 39 is a schematic cross-sectional view showing an example in which a waterproof / dustproof wall is formed in a high region portion of a support substrate, and shows a cut surface corresponding to FIG. 32. FIG. 40 is a schematic plan view showing a waterproof / dustproof wall formed in a high frequency portion of a support substrate. FIG. 41 shows a modified example of the waterproof / dustproof wall formed in the high frequency portion of the support substrate, and is a view of the high frequency portion of the support substrate viewed from the + Z direction side. FIG. 42 shows another modified example of the waterproof / dustproof wall formed in the high frequency portion of the support substrate, and is a view of the high frequency portion of the support substrate viewed from the + Z direction side. FIG. 43 shows still another modification of the waterproof / dustproof wall formed in the high frequency portion of the support substrate, and is a view of the high frequency portion of the support substrate viewed from the + Z direction side. FIG. 44 is a schematic plan view of the third barometric pressure detector. FIG. 45 is a schematic cross-sectional view taken along line XLV-XLV of FIG. FIG. 46 is a schematic cross-sectional view showing a mounting state of the atmospheric pressure detection device shown in FIG. 44. FIG. 47 is a schematic cross-sectional view showing a modified example of the third barometric pressure detection device. FIG. 48 is a view of the outside air contact surface of the atmospheric pressure sensor element used in the atmospheric pressure detection device of FIG. 47 as viewed from the −Z direction side. FIG. 49 is a schematic plan view of the fourth barometric pressure detection device. FIG. 50 is a schematic cross-sectional view taken along the line L-L of FIG. 49. FIG. 51 is a schematic cross-sectional view showing a mounting state of the atmospheric pressure detection device shown in FIG. 49. FIG. 52 is a schematic plan view of the fifth barometric pressure detection device. FIG. 53 is a schematic cross-sectional view taken along the line LIII-LIII of FIG. 52. FIG. 54 is a schematic cross-sectional view showing the mounting state of the atmospheric pressure detection device shown in FIG. 52. FIG. 55 is a schematic plan view of the sixth barometric pressure detection device. FIG. 56 is a schematic cross-sectional view taken along the LVI-LVI line of FIG. 55. FIG. 57 is a schematic cross-sectional view showing a conventional example.

Hereinafter, embodiments in the case where the electronic component according to the present invention is applied to the atmospheric pressure detection device will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic plan view of the first barometric pressure detection device. In FIG. 1, for convenience of explanation, the barometric pressure sensor element and the integrated circuit element are shown by imaginary lines. FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. FIG. 3 is a schematic cross-sectional view taken along line III-III of FIG.

The first pressure detection device 1 includes a pressure sensor element 2, an integrated circuit element 3 that performs pressure detection processing based on the output of the pressure sensor element 2, and a support substrate 4 that supports the pressure sensor element 2 and the integrated circuit element 3. And include. For convenience of explanation, the + X direction, the −X direction, the + Y direction and the −Y direction shown in FIG. 1 and the + Z direction and the −Z direction shown in FIGS. 2 and 3 may be used below. The + X direction and the −X direction are two directions along one side of the support substrate 4 having a rectangular shape in a plan view, and when these are collectively referred to, they are simply referred to as “X direction”. The + Y direction and the −Y direction are two directions along the other side orthogonal to the one side of the support substrate 4, and when these are collectively referred to, they are simply referred to as “Y direction”. The + Z direction and the −Z direction are two directions along the thickness direction of the support substrate 4, and when these are collectively referred to, they are simply referred to as “Z direction”. When the support substrate 4 is placed on a horizontal plane, the X and Y directions are two horizontal directions (first horizontal direction and second horizontal direction) along two horizontal straight lines (X-axis and Y-axis) that are orthogonal to each other. The direction is the vertical direction (height direction) along the vertical straight line (Z axis).

The support substrate 4 is composed of a base material 5 having a rectangular shape in a plan view (viewing in the Z direction) and an insulating layer 6 formed on the + Z side surface of the base material 5. The base material 5 is made of, for example, Si. The insulating layer 6 is made of, for example, SiO ₂ . The support substrate 4 is formed in a rectangular shape in a plan view, and has a pair of main surfaces 4a and 4b and four side surfaces connecting these main surfaces 4a and 4b. A recess 10 recessed toward the other main surface 4b is formed in the central portion of one main surface (main surface on the + Z direction side) 4a of the support substrate 4. The other main surface 4b of the support substrate 4 is a flat surface. In this embodiment, the recess 10 has a rectangular shape having four sides parallel to the four sides of the support substrate 4 in a plan view.

The recess 10 is composed of a first recess 11 having a rectangular shape in a plan view and a second recess 12 communicating with one side surface of the first recess 11 on the + Y direction side in a plan view and having a shallower depth than the first recess 11. .. The second recess 12 is arranged on the + Y direction side with respect to the first recess 11. In the plan view, the widths of the recesses 11 and 12 in the X direction are the same, and both are positionally aligned with respect to the X direction.
On one main surface 4a of the support substrate 4, the first recess 11 and the second recess 12 provide a low frequency portion 13 which is the bottom surface of the first recess 11 and a mid region portion 14 which is the bottom surface of the second recess 12. , A high frequency portion 15 which is a peripheral region of the recess 10 is formed. The low frequency portion 13 has a rectangular shape having four sides parallel to the four sides of the support substrate 4 in a plan view. Similarly, the mid region portion 14 has a rectangular shape having four sides parallel to the four sides of the support substrate 4 in a plan view. The high frequency portion 15 is a rectangular annular shape surrounding the recess 10 in a plan view.

A connecting portion 16 for connecting the three sides of the low frequency portion 13 excluding the + Y direction side and the high frequency portion 15 is formed. A connecting portion 17 for connecting them is formed between the + Y direction side of the low frequency portion 13 and the −Y direction side of the mid region portion 14. A connecting portion 18 for connecting them is formed between the three sides of the mid region portion 14 excluding the side on the −Y direction side and the high region portion 15.

The connecting portions 16 and 17 are formed on an inclined surface so that the cross-sectional area of the first recess 11 gradually increases from the low region portion 13 to the mid region portion 14 and the high region portion 15. The connecting portion 18 is formed on an inclined surface so that the cross-sectional area of the second recess 12 gradually increases from the middle region portion 14 to the high region portion 15. The high region portion 15 is arranged so as to be separated from each other in the X direction with the recess 10 interposed therebetween, and includes a rectangular first region 15A and a second region 15B having a long plan view in the Y direction.

A wiring film 20 is formed on the main surface 4a of the support substrate 4. The wiring film 20 has a laminated structure of the barrier seed layer 20A and the plating layer 20B. The barrier seed layer 20A is a base layer for forming the plating layer 20B, and is formed on the insulating layer 6. The barrier seed layer 20A is composed of, for example, a Ti layer as a barrier layer formed on the insulating layer 6 and a Cu layer as a seed layer laminated on the Ti layer. The barrier seed layer 20A is formed by, for example, a sputtering method. The plating layer 20B is made of, for example, Cu, and is formed by electroplating using the barrier seed layer 20A.

The wiring film 20 includes a plurality of first pads 21 formed on the peripheral edge of the low frequency portion 13, a plurality of second pads 22 formed on the peripheral edge of the mid region portion 14, and a first of the high frequency portions 15. It includes a plurality of third pads 23 formed in the region 15A and the second region 15B, and a plurality of connecting portions 24 connecting the pads.
The plurality of first pads 21 are rectangular in a plan view, and for example, four are formed on the peripheral portion of the low frequency portion 13. These first pads 21 are provided for mechanically and electrically fixing the barometric pressure sensor element 2 to the low frequency portion 13.

The plurality of second pads 22 are rectangular in a plan view, and for example, twelve are formed on the peripheral edge of the mid region portion 14. These second pads 22 are provided to mechanically and electrically fix the integrated circuit element 3 to the mid-range portion 14.
Five of the plurality of third pads 23 are formed in the first region 15A and the second region 15B. In this embodiment, of the ten third pads 23, the third pad 23 formed at the + Y direction end of the first region 15A is electrically connected to both the barometric pressure sensor element 2 and the integrated circuit element 3. It is a dummy pad that is not connected. Bumps 25 are formed on each third pad 23. The external terminal 26 is formed by the third pad 23 and the bump 25 formed on the third pad 23. The external terminal 26 is used for surface-mounting the atmospheric pressure detection device 1 on a circuit board (not shown).

The connection portion 24 includes a plurality of first connection portions 24A connecting the first pad 21 and the second pad 22, a plurality of second connection portions 24B connecting the second pad 22 and the third pad 23, and a second. It includes a third connection portion 24C for connecting the 1 pad 21 and the external terminal 26 (third pad 23).
The barometric pressure sensor element 2 has a rectangular parallelepiped shape and is housed in the first recess 11. The barometric pressure sensor element 2 includes a pedestal 31 having a rectangular shape in a plan view, a substrate 32 formed on the surface of the pedestal 31 on the −Z direction side, and a diaphragm 33 supported by the substrate 32. The pedestal 31 is made of, for example, glass. The substrate 32 is formed with a rectangular cavity 34 in a plan view that penetrates in the thickness direction (Z direction). The substrate 32 has a rectangular annular shape in a plan view, and is made of, for example, a Si substrate. An insulating layer 35 is formed on the surface of the substrate 32 on the −Z direction side.

The surface of the substrate 32 on the + Z direction side is joined to the pedestal 31. The pedestal 31 partitions the bottom surface of the cavity 34. The diaphragm 33 is supported on the surface of the substrate 32 on the −Z direction side via an insulating layer 35. The diaphragm 33 partitions the top surface portion of the cavity 34. The diaphragm 33 includes a movable portion 33A having a rectangular shape in a plan view for partitioning the top surface portion of the cavity 34, and a fixed portion 33B having an annular shape in a plan view around the movable portion 33A. The fixing portion 33B of the diaphragm 33 is bonded to the insulating layer 35 on the silicon substrate 32. A strain gauge resistance (not shown) is formed on the movable portion 33A of the diaphragm 33. The fixed portion 33B of the diaphragm 33 is provided with a plurality of pad electrodes (not shown) connected to strain gauge resistors.

The movable portion 33A of the diaphragm 33 is distorted according to the difference between the pressure inside the cavity (reference pressure) and the outside air pressure. The outside air pressure is detected by detecting this strain amount as the change amount of the electric resistance value of the strain gauge resistance. Therefore, the surface of the movable portion 33A of the surface of the diaphragm 33 opposite to the cavity 34 (the surface on the −Z direction side) is the outside air contact region Sa that needs to be exposed to the outside air. The surface of the barometric pressure sensor element 2 on the diaphragm 33 side is an outside air contact surface S including an outside air contact region Sa to be exposed to the outside air.

The barometric pressure sensor element 2 is joined to the low frequency portion 13 in a face-down state in which the outside air contact surface S faces the low frequency portion (bottom surface of the first recess 11) 13. Specifically, a plurality of pad electrodes provided on the outside air contact surface S of the barometric pressure sensor element 2 are mechanically and electrically connected to the first pad 21 formed in the low frequency portion 13 via the solder layer 41. It is joined to. Between the outside air contact surface S (outside air contact region Sa) of the barometric pressure sensor element 2 and the low frequency portion 13, there is a gap corresponding to the thickness of the first pad 21 plus the thickness of the solder layer 41. It is formed. That is, there is a gap of at least the thickness of the first pad 21 between the outside air contact region Sa of the barometric pressure sensor element 2 and the low frequency portion 13.

In this embodiment, the integrated circuit element 3 is configured as a so-called ASIC (Application Specific Integrated Circuit) element. The integrated circuit element 3 has a rectangular parallelepiped shape flat in the Z direction, and most of the integrated circuit element 3 is housed in the second recess 12. A plurality of pad electrodes (not shown) are provided on one surface of the integrated circuit element 3 (the surface on the −Z direction side, hereinafter referred to as “mounting surface”). The integrated circuit element 3 is joined to the mid region portion 14 with its mounting surface facing the mid region portion 14. Specifically, a plurality of pad electrodes (not shown) provided on the mounting surface of the integrated circuit element 3 are mechanically and electrically connected to the second pad 22 formed in the mid region portion 14 via the solder layer 42. Are joined together. Most of the integrated circuit element 3 is housed in the second recess 12, and the end portion on the −Y direction side thereof is housed in the first recess 11. That is, the end portion of the integrated circuit element 3 on the −Y direction side protrudes from the second recess 12 into the first recess 11.

The integrated circuit element 3 can be used for processing a signal or the like according to the amount of change in the electric resistance value of the strain gauge resistance in the pressure sensor element 2. The signal processing result of the integrated circuit element 3 can be output to the outside via the second connection portion 24B and the external terminal 26.
4 to 12 are cross-sectional views for explaining an example of the manufacturing process of the atmospheric pressure detection device 1, and show the cut surface corresponding to FIG.

First, as shown in FIG. 4, a wafer-shaped Si substrate 71 having a pair of main surfaces 71a and 71b facing opposite sides in the Z direction is prepared. Next, for example, a masking oxide film 72 is formed on the main surface 71a of the Si substrate 71 by a thermal oxidation method.
Next, as shown in FIG. 5, the portion of the masking oxide film 72 corresponding to the region where the first recess 11 should be formed is removed by photolithography and etching.

Next, as shown in FIG. 6, the Si substrate 71 is etched using a hard mask made of a mask oxide film 72. As the etching, for example, potassium hydroxide (wet etching (anisotropic etching) using an etchant containing KOH) is used, whereby the first recess 11 is formed.
Next, as shown in FIG. 7, the portion of the masking oxide film 72 corresponding to the region where the second recess 12 should be formed is removed by photolithography and etching.

Next, as shown in FIG. 8, the Si substrate 71 is etched using a hard mask made of a mask oxide film 72. As a result, the second recess 12 connected to the first recess 11 is formed.
Next, as shown in FIG. 9, the mask oxide film 72 is removed by etching. After that, an insulating layer 73 made of SiO ₂ is formed on the entire surface of the main surface 71a including the inner surfaces of the recesses 11 and 12 of the Si substrate 71 by, for example, a thermal oxidation method.

Next, as shown in FIG. 10, for example, by a sputtering method, the barrier seed layer 74, which is the material layer of the barrier seed layer 20A of the wiring film 20, is formed so as to cover the entire area of the insulating layer 73. Specifically, first, a barrier layer made of Ti is formed on the insulating layer 73 by a sputtering method. After that, a seed layer made of Cu is formed on the Ti barrier layer by the sputtering method.

Next, as shown in FIG. 11, the photoresist film 75 is formed so as to cover the surface of the barrier seed layer 74.
Next, as shown in FIG. 12, the portion of the photoresist film 75 corresponding to the region where the wiring film 20 should be formed is removed by photolithography and etching. As a result, the portion of the barrier seed layer 74 corresponding to the region where the wiring film 20 should be formed is exposed from the portion from which the photoresist film 75 has been removed.

Next, as shown in FIG. 13, the plating layer 20B is formed on the exposed portion of the barrier seed layer 74. The plating layer 20B is formed, for example, by electrolytic plating using the seed layer of the barrier seed layer 74. The pattern of the plating layer 20B thus formed matches the pattern of the final wiring film 20.
Next, as shown in FIG. 14, the photoresist film 75 is removed. As a result, the portion of the barrier seed layer 74 on which the plating layer 20B is not laminated is exposed. After that, as shown in FIG. 15, the portion of the barrier seed layer 74 exposed from the plating layer 20B is removed by, for example, wet etching. As a result, the barrier seed layer 74 becomes the barrier seed layer 20A that matches the pattern of the final wiring film 20. As a result, the wiring film 20 composed of the barrier seed layer 20A and the plating layer 20B is obtained.

Next, as shown in FIG. 16, the barometric pressure sensor element 2 is joined to the low frequency portion 13, and the integrated circuit element 3 is joined to the mid region portion 14. Solder balls (not shown) to be the solder layer 41 are formed on the plurality of electrode pads formed on the outside air contact surface S of the barometric pressure sensor element 2. After the flux is applied to these solder balls, the solder balls of the barometric pressure sensor element 2 are placed on the first pad 21 formed on the low frequency portion 13.

Similarly, solder balls (not shown) to be the solder layer 42 are formed on the plurality of electrode pads formed on the mounting surface of the integrated circuit element 3. After the flux is applied to these solder balls, the solder balls of the integrated circuit element 3 are placed on the second pad 22 formed on the mid region portion 14. Then, the solder balls are melted and then cured by the reflow furnace, so that the plurality of electrode pads of the pressure sensor element 2 are joined to the first pad 21 via the solder layer 41, and the plurality of integrated circuit elements 3 are present. The electrode pad of No. 1 is joined to the second pad 22 via the solder layer 42. After that, a bump 25 made of a metal such as Ni, Pd, or AU is formed on the third pad 23 by, for example, electroless plating. As a result, a plurality of external terminals 26 including the third pad 23 and the bump 25 are formed in the high frequency portion 15 of the support substrate 4.

Next, as shown in FIG. 17, the dicer 76 cuts the Si substrate 71 along the dicing line set on the main surface 71a of the Si substrate 71. As a result, the wafer-shaped Si substrate 71 is individualized into individual barometric pressure detection devices. As a result, the Si substrate 71 becomes the base material 5, the insulating layer 73 becomes the insulating layer 6, and the supporting substrate 4 is composed of the base material 5 and the insulating layer 6. As a result, the atmospheric pressure detection device 1 shown in FIGS. 1 to 3 is obtained.

FIG. 18 is a schematic cross-sectional view showing a mounting state of the first atmospheric pressure detection device shown in FIG. 1, and shows a cut surface corresponding to FIG. 2.
A plurality of lands 83 are formed on the surface 82 of the wiring board (mounting board) 81. The atmospheric pressure detection device 1 is surface-mounted with the bump 25 facing the surface 82 of the wiring board (mounting board) 81. Cream solder 84 is applied on the plurality of lands 83. When the atmospheric pressure detection device 1 is surface-mounted on the wiring board 81, the third pad 23 of the atmospheric pressure detection device 1 is joined to the land 83 via the cream solder 84 and the bump 25.

In the state where the barometric pressure detection device 1 is mounted on the wiring board 81, the thickness of the third pad 23 is set between the surface of the high frequency portion 15 of the support board 4 of the barometric pressure detection device 1 and the wiring board 81. , There is a gap corresponding to the thickness of the bump 25, the cream solder 84, and the land 83. As described above, there is a gap of at least the thickness of the first pad 21 between the outside air contact surface S of the barometric pressure sensor element 2 and the low frequency portion 13 of the support substrate 4. Therefore, the outside air passes through the gap and the recess 10 between the wiring board 81 and the barometric pressure detection device 1 to the outside air contact surface S (outside air contact region Sa) of the barometric pressure sensor element 2 and the low frequency portion 13 of the support board 4. It is possible to flow into the gap between them. Therefore, since the outer surface (outside air contact region Sa) of the movable portion 33A of the diaphragm 33 of the atmospheric pressure detection device 1 is exposed to the outside air, the atmospheric pressure detection using the atmospheric pressure sensor element 2 becomes possible.

In the first barometric pressure detection device 1 described above, the barometric pressure sensor element 2 is joined to the low frequency portion 13 of the support substrate 4 in a face-down state in which the surface S for contact with the outside air faces the low frequency portion 13. .. As a result, the outside air contact surface S (outside air contact region Sa) of the barometric pressure sensor element 2 is protected by the support substrate 4 for supporting the barometric pressure sensor element 2, so that the outside air contact surface S (outside air) of the barometric pressure sensor element 2 is protected. It is not necessary to separately provide a lid for protecting the contact area Sa). In this way, even when the barometric pressure sensor element 2 is joined to the support substrate 4 in a face-down state, at least a first pad is located between the outside air contact region Sa of the barometric pressure sensor element 2 and the low frequency portion 13 of the support substrate 4. Since a gap corresponding to the thickness of 21 is formed, the outside air contact region Sa of the barometric pressure sensor element 2 can be exposed to the outside air through the recess 10. Therefore, there is no problem in detecting the atmospheric pressure.

FIG. 19 is a schematic cross-sectional view showing a modified example of the first atmospheric pressure detection device, and shows a cut surface corresponding to FIG. 2. In FIG. 19, the parts corresponding to the respective parts of FIG. 2 described above are designated by the same reference numerals as those in FIG.
The barometric pressure detection device 1 of FIG. 19 is different from the first barometric pressure detection device 1 shown in FIGS. 1 to 3 only in the barometric pressure sensor element 2. FIG. 20 is a view of the outside air contact surface S of the atmospheric pressure sensor element 2 used in the atmospheric pressure detection device 1 of FIG. 19 as viewed from the −Z direction side. In FIG. 20, since the solder layer 41 is omitted, the electrode pad appears on the surface S for contact with the outside air.

Four electrode pads 50 are formed on the outside air contact surface S of the barometric pressure sensor element 2. In the −Z direction view, the four electrode pads 50 are arranged at the four corners of the outside air contact surface S of the barometric pressure sensor element 2. On the outer surface (the surface on the −Z direction side) of the fixed portion 33B of the diaphragm 33, a waterproof / dustproof wall 51 having at least one divided portion so as to substantially surround the movable portion 33A (outside air contact region Sa) of the diaphragm 33 is provided. It is formed. In this example, the waterproof / dustproof wall 51 is an endd rectangular ring in which a divided portion (cut portion) 52 is formed only at one location in the −Z direction. Further, in this example, the waterproof / dustproof wall 51 is formed so as to pass through the inside of the four electrode pads 50 in the −Z direction view.

The waterproof / dustproof wall 51 projects in the −Z direction from the outer surface of the diaphragm 33. The protruding length (length in the Z direction) of the waterproof / dustproof wall 51 is such that when the barometric pressure sensor element 2 is joined to the low frequency portion 13 of the support substrate 4, the protruding end of the waterproof / dustproof wall 52 is the low frequency portion. It is preferably formed in a length that allows pressure contact or contact with the surface of 13. Specifically, as shown in FIG. 21, a solder ball serving as a solder layer 41 on the electrode pad 50 of the barometric pressure sensor element 2 in a state before the barometric pressure sensor element 2 is joined to the low frequency portion 13 of the support substrate 4. When the 41A is formed, the length H from the outer surface of the diaphragm 33 to the protruding end of the waterproof / dustproof wall 51 is from the length B from the outer surface of the diaphragm 33 to the protruding end of the solder ball 41A. Is also formed small. The aspect ratio R (H / W) defined by the ratio of the height H of the waterproof / dustproof wall 52 to the width W of the waterproof / dustproof wall 51 is formed to be 1 or less (R ≦ 1). Is preferable.

The waterproof / dustproof wall 51 is made of a resin such as polyimide, ceramics such as SiO ₂ , and a metal such as Cu. The waterproof / dustproof wall 51 made of polyimide is formed, for example, as follows. First, the polyimide imparted with photosensitivity by the CVD method is applied to the fixed portion 33B of the diaphragm 33. Next, after the polyimide is exposed in a region pattern other than the region where the waterproof / dustproof wall 51 should be formed, the polyimide is exposed to light. Finally, the polyimide is heat treated. As a result, the waterproof / dustproof wall 51 made of polyimide is formed.

The waterproof / dustproof wall 51 made of SiO ₂ can be formed, for example, by forming a SiO ₂ film on the fixing portion 33B of the diaphragm 33 by a CVD method and then patterning the SiO ₂ film. The waterproof / dustproof wall 51 made of Cu can be formed, for example, by forming a Cu film on the fixing portion 33B of the diaphragm 33 by a sputtering method and then patterning the SiO ₂ film.

In the atmospheric pressure detection device 1 of FIG. 19, as in the first atmospheric pressure detection device 1 of FIG. 1, it is not necessary to separately provide a lid for protecting the outside air contact surface S of the atmospheric pressure sensor element 2. Further, in the atmospheric pressure detection device 1 of FIG. 19, a waterproof / dustproof wall having a rectangular annular shape with an end in a plan view so as to substantially surround the movable portion 33A (outside air contact region Sa) on the surface of the fixed portion 33B of the diaphragm 33 on the −Z direction side. Since the 52 is formed, it is possible to suppress the intrusion of moisture and dust into the gap between the movable portion 33A (outside air contact region Sa) of the diaphragm 33 and the low frequency portion 13 of the support substrate 4.

As shown in FIG. 22, the waterproof / dustproof wall 51 includes a first waterproof / dustproof wall 51A formed on the fixed portion 33B so as to substantially surround the movable portion 33A of the diaphragm 33 in the −Z direction. It may be composed of a second waterproof / dustproof wall 51B formed on the fixing portion 33B so as to substantially surround the first waterproof / dustproof wall 51A. In this example, the first and second waterproof / dustproof walls 51A and 51B are ended rectangular rings in which the dividing portions 52A and 52B are formed only at one place in the −Z direction view.

In this embodiment, the divided portion 52A of the first waterproof / dustproof wall 51A is formed at the center of the length of the portion along one side of the diaphragm 33, and the divided portion of the second waterproof / dustproof wall 51B is formed. It is formed in the central portion of the length of the portion of the diaphragm 33 along the other side facing the other side. As described above, the divided portion 52A of the first waterproof / dustproof wall 51A and the divided portion 52B of the second waterproof / dustproof wall 51B are the first or second waterproof / dustproof dustproof portion 52B in the -Z direction. It is preferable that the walls 51A and 51B are formed at positions that are offset from each other in the direction along the wall 51A and 51B. In other words, when the second waterproof / dustproof wall 51B is viewed from the first waterproof / dustproof wall 51A side, the divided portion 52A of the first waterproof / dustproof wall 51A is the second waterproof / dustproof dustproof wall 51A. It is preferable that the wall 51B is formed at a position facing the undivided portion (the portion other than the divided portion 52B). Further, when the first waterproof / dustproof wall 51A is viewed from the second waterproof / dustproof wall 51B side, the divided portion 52B of the second waterproof / dustproof wall 51B is a non-divided portion of the first waterproof / dustproof wall 51A. It is preferably formed at a position facing the portion (a portion other than the divided portion 52A). This is because such a configuration can more effectively suppress the intrusion of moisture and dust into the outside air contact region Sa of the atmospheric pressure sensor element 2.

As shown in FIG. 23, the waterproof / dustproof wall 51 is a rectangle having a longitudinal direction along an annular virtual line surrounding the movable portion 33A (outside air contact region Sa) at the fixed portion 33B of the diaphragm 33 in the −Z direction view. The structure may be such that the portions 53 and the divided portions 54 are alternately formed.
Further, as shown in FIG. 24, the waterproof / dustproof wall 51 is the first fixed portion 33B formed so as to substantially surround the movable portion 33A (outside air contact region Sa) of the diaphragm 33 in the −Z direction view. It may be composed of a waterproof / dustproof wall 51C and a second waterproof / dustproof wall 51D formed on the fixing portion 33B so as to substantially surround the first waterproof / dustproof wall 51C. In the first waterproof / dustproof wall 51C, the rectangular portion 53C having a longitudinal direction along the first annular virtual line surrounding the movable portion 33A (outside air contact region Sa) and the divided portion 54C alternate in the −Z direction. It is a structure that is formed in. The second waterproof / dustproof wall 51D alternates between a rectangular portion 53D having a longitudinal direction along a second annular virtual line surrounding the first waterproof / dustproof wall 51C and a dividing portion 54D in the −Z direction. It is a structure that is formed in.

As shown in FIG. 24, each of the divided portions 54C of the first waterproof / dustproof wall 51C and each of the divided portions 54D of the second waterproof / dustproof wall 51D are formed into a first or second annular virtual line. It is preferable that they are formed at positions that are offset from each other in the direction along the line. In other words, when the second waterproof / dustproof wall 51D is viewed from the first waterproof / dustproof wall 51C side, each divided portion 54C of the first waterproof / dustproof wall 51C is the second waterproof / dustproof. It is preferable that the dust wall 51D is formed at a position facing any of the rectangular portions 53D. Further, when the first waterproof / dustproof wall 51C is viewed from the second waterproof / dustproof wall 51D side, each of the divided portions 54D of the second waterproof / dustproof wall 51D is the first waterproof / dustproof dustproof wall 51D. It is preferably formed at a position facing any of the rectangular portions 53C of the wall 51C. This is because such a configuration can more effectively suppress the intrusion of moisture and dust into the outside air contact region Sa of the atmospheric pressure sensor element 2.

Instead of or in addition to forming the waterproof / dustproof wall 51 on the surface for contact with the outside air of the barometric pressure sensor element 2, the waterproof / dustproof wall 55 may be formed on the high frequency portion 15 of the support substrate 4.
FIG. 25 is a schematic cross-sectional view showing an example in which a waterproof / dustproof wall is formed in a high region portion of a support substrate, and shows a cut surface corresponding to FIG. FIG. 26 is a schematic plan view showing a waterproof / dustproof wall formed in a high frequency portion of a support substrate. In the example of FIG. 25, the waterproof / dustproof wall is not formed on the outside air contact surface S of the barometric pressure sensor element 2, but the above-mentioned waterproof / dustproof wall 51 is formed on the outside air contact surface S of the barometric pressure sensor element 2. It may be formed.

A waterproof / dustproof wall 55 is formed in the high frequency portion 15 of the support substrate 4 so as to substantially surround the recess 10 at least at one portion. In this example, the waterproof / dustproof wall 55 is an endd rectangular ring having a divided portion 56 formed only at one position in the Z direction. Further, in this example, the waterproof / dustproof wall 55 is formed so as to pass through the outside of the ten third pads 23 in the Z direction view.

The waterproof / dustproof wall 55 projects in the + Z direction from the high frequency portion 15. The protruding length (length in the Z direction) of the waterproof / dustproof wall 55 is such that when the first atmospheric pressure detection device 1 is mounted on the wiring board 81, the protruding end of the waterproof / dustproof wall 55 is the surface of the wiring board 81. It is preferably formed so as to be in pressure contact with or in contact with 82. The waterproof / dustproof wall 55 is made of a resin such as polyimide, ceramics such as SiO ₂ , and a metal such as Cu. By forming the waterproof / dustproof wall 55 in the high frequency portion 15 of the support substrate 4 in this way, it is possible to suppress the intrusion of moisture and dust into the recess 10, so that the movable portion 33A (outside air contact region) of the diaphragm 33 can be suppressed. It is possible to suppress the intrusion of moisture and dust into the gap between Sa) and the low frequency portion 13 of the support substrate 4.

As shown in FIG. 27, the waterproof / dustproof wall 55 includes a first waterproof / dustproof wall 55A formed in the high frequency portion 15 so as to substantially surround the recess 10 and a first waterproof / dustproof wall 55 in the Z direction. It may be composed of a second waterproof / dustproof wall 55B formed in the high frequency portion 15 so as to substantially surround the dustproof / dustproof wall 55A. In this example, the first and second waterproof / dustproof walls 55A and 55B are ended rectangular rings in which the divided portions 56A and 56B are formed only at one place in the Z direction view.

In this embodiment, the divided portion 56A of the first waterproof / dustproof wall 55A is formed in the central portion of the length of the portion along one side of the main surface 4a of the support substrate 4, and the second waterproof / dustproof wall 55B is formed. The divided portion 56B is formed at the center of the length of the portion of the main surface 4a of the support substrate 4 along the other side facing the other side. As described above, the divided portion 56A of the first waterproof / dustproof wall 55A and the divided portion 56B of the second waterproof / dustproof wall 55B are the first or second waterproof / dustproof wall 55A in the Z direction. , 55B is preferably formed at positions offset from each other with respect to the direction. In other words, when the second waterproof / dustproof wall 55B is viewed from the first waterproof / dustproof wall 55A side, the divided portion 56A of the first waterproof / dustproof wall 55A is the second waterproof / dustproof dustproof wall 55A. It is preferable that the wall 55B is formed at a position facing the undivided portion (the portion other than the divided portion 56B). Further, when the first waterproof / dustproof wall 55A is viewed from the second waterproof / dustproof wall 55B side, the divided portion 56B of the second waterproof / dustproof wall 55B is the first waterproof / dustproof wall. It is preferable that the 55A is formed at a position facing the undivided portion (the portion other than the divided portion 56A).

As shown in FIG. 28, in the waterproof / dustproof wall 55, in the Z direction view, the rectangular portion 57 having a longitudinal direction along the annular virtual line surrounding the movable portion 33A and the divided portion 58 alternate in the high region portion 15. It may be configured to be formed in.
Further, as shown in FIG. 29, the waterproof / dustproof wall 55 includes a first waterproof / dustproof wall 55C formed in the high frequency portion 15 so as to substantially surround the recess 10 in the Z direction view, and a first. It may be composed of a second waterproof / dustproof wall 55D formed in the high frequency portion 15 so as to substantially surround the waterproof / dustproof wall 55C. The first waterproof / dustproof wall 55C is configured such that a rectangular portion 57C having a longitudinal direction along a first annular virtual line surrounding the recess 10 and a dividing portion 58C are alternately formed in the Z direction. be. In the second waterproof / dustproof wall 55D, the rectangular portion 57D having a longitudinal direction along the second annular virtual line surrounding the first waterproof / dustproof wall 55C and the divided portion 58D alternate in the Z direction. It is a structure that is formed.

As shown in FIG. 29, each of the divided portions 58C of the first waterproof / dustproof wall 55C and each of the divided portions 58D of the second waterproof / dustproof wall 55D are along the first or second annular virtual line. It is preferable that they are formed at positions that are offset from each other in terms of direction. In other words, when the second waterproof / dustproof wall 55D is viewed from the first waterproof / dustproof wall 55C side, each divided portion 58C of the first waterproof / dustproof wall 55C is the second waterproof / dustproof. It is preferable that the dust wall 55D is formed at a position facing any of the rectangular portions 57D. Further, when the first waterproof / dustproof wall 55C is viewed from the second waterproof / dustproof wall 55D side, each divided portion 58D of the second waterproof / dustproof wall 55D is the first waterproof / dustproof dust. It is preferably formed at a position facing any rectangular portion 57C of the wall 55C.

FIG. 30 is a schematic plan view of the second barometric pressure detection device. FIG. 31 is a schematic cross-sectional view taken along the line XXXI-XXXI of FIG.
The second barometric pressure detection device 101 includes a barometric pressure sensor element 102 and a support substrate 104 that supports the barometric pressure sensor element 102. For convenience of explanation, the + X direction, the −X direction, the + Y direction and the −Y direction shown in FIG. 30 and the + Z direction and the −Z direction shown in FIG. 31 may be used below.

The support substrate 104 is composed of a multilayer wiring board having a wiring layer inside. The support substrate 104 is formed in a rectangular shape in a plan view (Z direction view), and has a pair of main surfaces 104a and 104b and four side surfaces connecting these main surfaces 104a and 104b. At the center of one main surface (main surface on the + Z direction side) 104a of the support substrate 104, a concave portion 110 having a rectangular shape in a plan view is formed, which is recessed toward the other main surface 104b. The other main surface 104b of the support substrate 104 is a flat surface.

On one main surface 102a of the support substrate 104, a low-pass portion 113 which is the bottom surface of the recess 110 and a high-pass portion 115 which is an annular shape in a plan view around the recess 110 are formed by the recess 110. The low frequency portion 113 has a rectangular shape having four sides parallel to the four sides of the support substrate 104 in a plan view. A connecting portion 116 for connecting the four sides of the low frequency portion 113 and the high frequency portion 115 is formed. The connecting portion 116 is substantially perpendicular to the low frequency portion 113. The high region portion 115 is arranged so as to be separated from each other in the X direction with the recess 110 interposed therebetween, and includes a rectangular first region 115A and a second region 115B having a long plan view in the Y direction.

A plurality of first pads 121 are formed in the low frequency range 113. The plurality of first pads 121 are rectangular in a plan view, and for example, four are formed in the low frequency portion 113. These first pads 121 are provided for mechanically and electrically fixing the barometric pressure sensor element 102 to the low frequency portion 113.
A plurality of second pads 123 are formed in the first region 115A and the second region 115B of the high region portion 115. Two of the plurality of second pads 123 are formed in the first region 115A and the second region 115B. Bumps 125 are formed on each second pad 123. The external terminal 126 is formed by the second pad 123 and the bump 125 formed on the second pad 123. The external terminal 126 is used for surface mounting the barometric pressure detection device 101 on a circuit board (not shown). The first pad 121 and the second pad 123 are connected to each other via the wiring 127 formed in the support substrate 104.

The barometric pressure sensor element 102 has a rectangular parallelepiped shape whose planar shape is closer to a square than that of the barometric pressure sensor element 2 of the first barometric pressure detection device 1. The structure of the barometric pressure sensor element 102 is the same as that of the barometric pressure sensor element 2 of the first barometric pressure detection device 1. That is, the barometric pressure sensor element 102 includes a pedestal 31, a substrate 32 formed on the surface of the pedestal 31 on the −Z direction side, and a diaphragm 33 supported by the substrate 32. The pedestal 31 is made of, for example, glass. The substrate 32 is formed with a rectangular cavity 34 in a plan view that penetrates in the thickness direction. The substrate 32 has a rectangular annular shape in a plan view, and is made of, for example, a Si substrate. An insulating layer 35 is formed on the surface of the substrate 32 on the −Z direction side.

The surface of the substrate 32 on the + Z direction side is joined to the pedestal 31. The pedestal 31 partitions the bottom surface of the cavity 34. The diaphragm 33 is supported on the surface of the substrate 32 via an insulating layer 35. The diaphragm 33 partitions the top surface portion of the cavity 34. The diaphragm 33 includes a movable portion 33A having a rectangular shape in a plan view for partitioning the top surface portion of the cavity 34, and a fixed portion 33B having an annular shape in a plan view around the movable portion 33A. The fixing portion 33B of the diaphragm 33 is bonded to the insulating layer 35 on the silicon substrate 32. A strain gauge resistance (not shown) is formed on the movable portion 33A of the diaphragm 33. The fixed portion 33B of the diaphragm 33 is provided with a plurality of pad electrodes (not shown) connected to strain gauge resistors.

The movable portion 33A of the diaphragm 33 is distorted according to the difference between the pressure inside the cavity (reference pressure) and the outside air pressure. The outside air pressure is detected by detecting this strain amount as the change amount of the electric resistance value of the strain gauge resistance. Therefore, the surface of the movable portion 33A of the surface of the diaphragm 33 opposite to the cavity 34 (the surface on the −Z direction side) is the outside air contact region Sa that needs to be exposed to the outside air. The surface of the barometric pressure sensor element 2 on the diaphragm side is an outside air contact surface S including an outside air contact region Sa to be exposed to the outside air.

The barometric pressure sensor element 102 is joined to the low frequency portion 113 in a face-down state in which the outside air contact surface S faces the low frequency portion (bottom surface of the recess 110) 113. Specifically, a plurality of pad electrodes provided on the outside air contact surface S of the barometric pressure sensor element 102 are mechanically and electrically connected to the first pad 121 formed in the low frequency portion 113 via the solder layer 141. It is joined to. As a result, each pad electrode of the barometric pressure sensor element 102 is connected to the second pad 123 (external terminal 126) via the wiring 127 formed in the first pad 121 and the support substrate 104. Between the outside air contact surface S (outside air contact region Sa) of the barometric pressure sensor element 102 and the low frequency portion 113, there is a gap corresponding to the thickness of the first pad 121 plus the thickness of the solder layer 141. It is formed. That is, there is a gap of at least the thickness of the first pad 121 between the outside air contact region Sa of the barometric pressure sensor element 102 and the low frequency portion 13.

FIG. 32 is a schematic cross-sectional view showing a mounting state of the second barometric pressure detection device shown in FIG. 30, and shows a cut surface corresponding to FIG. 31.
A plurality of lands 83 are formed on the surface 82 of the wiring board (mounting board) 81. The atmospheric pressure detection device 101 is surface-mounted with the bump 125 facing the surface 82 of the wiring board (mounting board) 81. Cream solder 84 is applied on the plurality of lands 83. When the barometric pressure detection device 101 is surface-mounted on the wiring board 81, the second pad 123 of the barometric pressure detection device 101 is joined to the land 83 via the cream solder 84 and the bump 125.

In the state where the barometric pressure detection device 101 is mounted on the wiring board 81, a second pad is located between the surface (+ Z side surface) of the high frequency portion 115 of the support board 104 of the barometric pressure detection device 101 and the wiring board 81. There is a gap corresponding to the thickness of the bump 125, the cream solder 84, and the land 83 added to the thickness of 123. As described above, there is a gap of at least the thickness of the first pad 121 between the outside air contact surface S of the barometric pressure sensor element 102 and the low frequency portion 113 of the support substrate 104. Therefore, the outside air flows into the gap between the wiring board 81 and the barometric pressure detection device 101 and the gap between the outside air contact surface S of the barometric pressure sensor element 102 and the low frequency portion 113 of the support board 104 through the recess 110. It is possible. Therefore, since the outer surface (outside air contact region Sa) of the movable portion 33A of the diaphragm 33 of the atmospheric pressure detection device 101 is exposed to the outside air, the atmospheric pressure detection using the atmospheric pressure sensor element 102 becomes possible.

In the second atmospheric pressure detection device 101, the atmospheric pressure sensor element 102 is joined to the low frequency portion 113 of the support substrate 104 in a face-down state in which the surface S for contact with the outside air faces the low frequency portion 113. As a result, the outside air contact surface S (outside air contact region Sa) of the barometric pressure sensor element 102 is protected by the support substrate 104 for supporting the barometric pressure sensor element 102, so that the outside air contact surface S (outside air) of the barometric pressure sensor element 102. It is not necessary to separately provide a lid for protecting the contact area Sa). In this way, even when the barometric pressure sensor element 102 is joined to the support substrate 104 in the face-down state, at least the first pad is located between the outside air contact region Sa of the barometric pressure sensor element 102 and the low frequency portion 113 of the support substrate 104. Since a gap corresponding to the thickness of 121 is formed, the outside air contact region Sa of the barometric pressure sensor element 102 can be exposed to the outside air through the recess 110. Therefore, there is no problem in detecting the atmospheric pressure.

FIG. 33 is a schematic cross-sectional view showing a modified example of the second barometric pressure detection device, and shows a cut surface corresponding to FIG. 31. In FIG. 33, the portions corresponding to the respective parts of FIG. 31 are designated by the same reference numerals as those in FIG. 31.
The barometric pressure detection device 101 of FIG. 33 differs only in the barometric pressure sensor element 102 from the second barometric pressure detection device 101 shown in FIGS. 30 and 31. FIG. 34 is a view of the outside air contact surface S of the atmospheric pressure sensor element 102 used in the atmospheric pressure detection device 101 of FIG. 33 as viewed from the −Z direction side. In FIG. 34, since the solder layer 141 is omitted, the electrode pad appears on the surface S for contact with the outside air.

Four electrode pads 150 are formed on the outside air contact surface S of the barometric pressure sensor element 102. In the −Z direction view, the four electrode pads 150 are arranged at the four corners of the outside air contact surface S of the barometric pressure sensor element 102. On the surface of the fixing portion 33B of the diaphragm 33 on the −Z direction side, a waterproof / dustproof wall 151 having at least one divided portion so as to substantially surround the movable portion 33A (outside air contact region Sa) of the diaphragm 33 is formed. .. In this example, the waterproof / dustproof wall 151 is an endd rectangular ring in which a divided portion (cut portion) 152 is formed only at one location in the −Z direction. Further, in this example, the waterproof / dustproof wall 151 is formed so as to pass through the outside of the four electrode pads 150 in the −Z direction view.

The waterproof / dustproof wall 151 projects in the −Z direction from the outer surface of the diaphragm 33. The protruding length (length in the Z direction) of the waterproof / dustproof wall 151 is such that when the barometric pressure sensor element 102 is joined to the low frequency portion 113 of the support substrate 104, the protruding end of the waterproof / dustproof wall 151 is the low frequency portion. It is preferably formed so as to be in pressure contact with or in contact with the surface of 113. Specifically, as shown in FIG. 35, in a state before the barometric pressure sensor element 102 is joined to the low frequency portion 113 of the support substrate 104, a solder ball serving as a solder layer 141 on the electrode pad 150 of the barometric pressure sensor element 102. When 141A is formed, the length H from the outer surface of the diaphragm 33 to the protruding end of the waterproof / dustproof wall 151 is from the length B from the outer surface of the diaphragm 33 to the protruding end of the solder ball 141A. Is also formed small. The aspect ratio R (H / W) defined by the ratio of the height H of the waterproof / dustproof wall 151 to the width W of the waterproof / dustproof wall 151 is formed to be 1 or less (R ≦ 1). Is preferable. The waterproof / dustproof wall 151 is made of a resin such as polyimide, ceramics such as SiO ₂ , and a metal such as Cu.

Similarly to the second atmospheric pressure detection device 101 of FIG. 30, the atmospheric pressure detection device 101 of FIG. 33 does not need to be separately provided with a lid for protecting the outside air contact surface S of the atmospheric pressure sensor element 102. Further, in the atmospheric pressure detection device 101 of FIG. 33, a waterproof / dustproof wall having a rectangular annular shape with an end in a plan view so as to substantially surround the movable portion 33A (outside air contact region Sa) on the surface of the fixed portion 33B of the diaphragm 33 on the −Z direction side. Since 151 is formed, it is possible to suppress the intrusion of moisture and dust into the gap between the movable portion 33A (outside air contact region Sa) of the diaphragm 33 and the low frequency portion 113 of the support substrate 104.

As shown in FIG. 36, the waterproof / dustproof wall 151 is a first waterproof / dustproof wall formed on the fixed portion 33B so as to substantially surround the movable portion 33A (outside air contact region Sa) of the diaphragm 33 in the −Z direction view. It may be composed of a dustproof / dustproof wall 151A and a second waterproof / dustproof wall 151B formed on the fixing portion 33B so as to substantially surround the first waterproof / dustproof wall 151A. In this example, the first and second waterproof / dustproof walls 151A and 151B are ended rectangular rings in which the divided portions 152A and 152B are formed only at one place in the −Z direction view.

In this embodiment, the divided portion 152A of the first waterproof / dustproof wall 151A is formed in the central portion of the length of the portion along one side of the diaphragm 33, and the divided portion 152B of the second waterproof / dustproof wall 151B is formed. , Is formed in the central portion of the length of the portion of the diaphragm 33 along the other side facing the other side. As described above, the divided portion 152A of the first waterproof / dustproof wall 151A and the divided portion 152B of the second waterproof / dustproof wall 151B are the first or second waterproof / dustproof dustproof portion 152B in the -Z direction. It is preferable that the walls are formed at positions offset from each other with respect to the direction along the walls 151A and 151B. In other words, when the second waterproof / dustproof wall 151B is viewed from the first waterproof / dustproof wall 151A side, the divided portion 152A of the first waterproof / dustproof wall 151A is the second waterproof / dustproof dust. It is preferable that the wall 151B is formed at a position facing the undivided portion (the portion other than the divided portion 152B). Further, when the first waterproof / dustproof wall 151A is viewed from the second waterproof / dustproof wall 151B side, the divided portion 152B of the second waterproof / dustproof wall 151B is a non-divided portion of the first waterproof / dustproof wall 151A. It is preferably formed at a position facing the portion (a portion other than the divided portion 152A).

As shown in FIG. 37, the waterproof / dustproof wall 151 has a rectangular portion 153 and a dividing portion 154 having a longitudinal direction along an annular virtual line surrounding the movable portion 33A on the fixed portion 33B of the diaphragm 33 in the −Z direction view. And may be formed alternately.
Further, as shown in FIG. 38, the waterproof / dustproof wall 151 is the first fixed portion 33B formed so as to substantially surround the movable portion 33A (outside air contact region Sa) of the diaphragm 33 in the −Z direction view. It may be composed of a waterproof / dustproof wall 151C and a second waterproof / dustproof wall 151D formed on the fixing portion 33B so as to substantially surround the first waterproof / dustproof wall 151C. In the first waterproof / dustproof wall 151C, rectangular portions 153C having a longitudinal direction along the first annular virtual line surrounding the movable portion 33A and division portions 154C are alternately formed in the −Z direction. It is a composition. In the second waterproof / dustproof wall 151D, the rectangular portion 153D having a longitudinal direction along the second annular virtual line surrounding the first waterproof / dustproof wall 151C and the divided portion 154D alternate in the −Z direction. It is a structure that is formed in.

As shown in FIG. 38, the divided portions 154C of the first waterproof / dustproof wall 151C and the divided portions 154D of the second waterproof / dustproof wall 151D are formed on the first or second annular virtual line. It is preferable that they are formed at positions that are offset from each other in the direction along the line. In other words, when the second waterproof / dustproof wall 151D is viewed from the first waterproof / dustproof wall 151C side, each divided portion 154C of the first waterproof / dustproof wall 151C is the second waterproof / dustproof wall. It is preferable that the dust wall 151D is formed at a position facing any of the rectangular portions 153D. Further, when the first waterproof / dustproof wall 151C is viewed from the second waterproof / dustproof wall 151D side, each divided portion 154D of the second waterproof / dustproof wall 151D is the first waterproof / dustproof dust. It is preferably formed at a position facing any rectangular portion 153C of the wall 151C.

Instead of or in addition to forming the waterproof / dustproof wall 151 on the surface for contact with the outside air of the barometric pressure sensor element 102, the waterproof / dustproof wall 155 may be formed on the high frequency portion 115 of the support substrate 104.
FIG. 39 is a schematic cross-sectional view showing an example in which a waterproof / dustproof wall is formed in a high region portion of a support substrate, and shows a cut surface corresponding to FIG. 32. FIG. 40 is a schematic plan view showing a waterproof / dustproof wall formed in a high frequency portion of a support substrate. In the example of FIG. 39, the waterproof / dustproof wall is not formed on the outside air contact surface S of the barometric pressure sensor element 102, but the above-mentioned waterproof / dustproof wall 151 is formed on the outside air contact surface S of the barometric pressure sensor element 102. It may be formed.

A waterproof / dustproof wall 155 having at least one divided portion so as to substantially surround the recess 110 is formed in the high frequency portion 115 of the support substrate 104. In this example, the waterproof / dustproof wall 155 is an endd rectangular ring having a divided portion 156 formed only at one position in the Z direction. Further, in this example, the waterproof / dustproof wall 155 is formed so as to pass through the inside of the four second pads 123 in the Z direction view.

The waterproof / dustproof wall 155 projects in the + Z direction from the high frequency portion 115. The protruding length (length in the Z direction) of the waterproof / dustproof wall 155 is such that when the second barometric pressure detection device 101 is mounted on the wiring board 81, the protruding end of the waterproof / dustproof wall 155 is the surface of the wiring board 81. It is preferably formed so as to be in pressure contact with or in contact with 82. The waterproof / dustproof wall 155 is made of a resin such as polyimide, ceramics such as SiO ₂ , and a metal such as Cu. By forming the waterproof / dustproof wall 155 on the high frequency portion 115 of the support substrate 104 in this way, it is possible to suppress the intrusion of moisture and dust into the recess 110, so that the movable portion 33A (outside air contact region) of the diaphragm 33 can be suppressed. It is possible to suppress the intrusion of moisture and dust into the gap between Sa) and the low frequency portion 113 of the support substrate 104.

As shown in FIG. 41, the waterproof / dustproof wall 155 includes a first waterproof / dustproof wall 155A formed in the high frequency portion 115 so as to substantially surround the recess 110 in the Z direction view, and a first waterproof / dustproof wall 155A. It may be composed of a second waterproof / dustproof wall 155B formed in the high frequency portion 115 so as to substantially surround the dustproof / dustproof wall 155A. In this example, the first and second waterproof / dustproof walls 155A and 155B are ended rectangular rings in which the divided portions 156A and 156B are formed only at one place in the Z direction view.

In this embodiment, the divided portion 156A of the first waterproof / dustproof wall 155A is formed in the central portion of the length of the portion along one side of the main surface 104a of the support substrate 104, and the second waterproof / dustproof wall 155B is formed. The divided portion 156B is formed at the center of the length of the portion of the main surface 104a of the support substrate 104 along the other side facing the other side. As described above, the divided portion 156A of the first waterproof / dustproof wall 155A and the divided portion 156B of the second waterproof / dustproof wall 155B are the first or second waterproof / dustproof wall 155A in the Z direction. , 155B, preferably formed at positions deviated from each other with respect to the direction. In other words, when the second waterproof / dustproof wall 155B is viewed from the first waterproof / dustproof wall 155A side, the divided portion 156A of the first waterproof / dustproof wall 155A is the second waterproof / dustproof wall. It is preferable that the 155B is formed at a position facing the non-divided portion (a portion other than the divided portion 156B). Further, when the first waterproof / dustproof wall 155A is viewed from the second waterproof / dustproof wall 155B side, the divided portion 156B of the second waterproof / dustproof wall 155B is the first waterproof / dustproof wall. It is preferable that the 155A is formed at a position facing the undivided portion (the portion other than the divided portion 156A).

As shown in FIG. 42, in the waterproof / dustproof wall 155, in the Z direction view, the rectangular portion 157 having the longitudinal direction along the annular virtual line surrounding the movable portion 33A and the divided portion 158 alternate with each other in the high frequency portion 115. It may be configured to be formed in.
Further, as shown in FIG. 43, the waterproof / dustproof wall 155 is the first waterproof / dustproof wall 155C formed in the high frequency portion 15 so as to substantially surround the recess 110 in the Z direction view, and the first. It may be composed of a second waterproof / dustproof wall 155D formed in the high frequency portion 115 so as to substantially surround the waterproof / dustproof wall 155A. The first waterproof / dustproof wall 155C has a configuration in which rectangular portions 157C having a longitudinal direction along a first annular virtual line surrounding the recess 110 and division portions 158C are alternately formed in the Z direction. be. In the second waterproof / dustproof wall 155D, the rectangular portion 157D having a longitudinal direction along the second annular virtual line surrounding the first waterproof / dustproof wall 155C and the divided portion 158D alternate in the Z direction. It is a structure that is formed.

As shown in FIG. 43, each of the divided portions 158C of the first waterproof / dustproof wall 155C and each of the divided portions 158D of the second waterproof / dustproof wall 155D are along the first or second annular virtual line. It is preferable that they are formed at positions that are offset from each other in terms of direction. In other words, when the second waterproof / dustproof wall 155D is viewed from the first waterproof / dustproof wall 155C side, each divided portion 158C of the first waterproof / dustproof wall 155C is the second waterproof / dustproof wall. It is preferable that the dust wall is formed at a position facing any of the rectangular portions 157D of the dust wall 155D. Further, when the first waterproof / dustproof wall 155C is viewed from the second waterproof / dustproof wall 155D side, each divided portion 158D of the second waterproof / dustproof wall 155D is the first waterproof / dustproof dust. It is preferably formed at a position facing any rectangular portion 157C of the wall 155C.

FIG. 44 is a schematic plan view of the third barometric pressure detector. FIG. 45 is a schematic cross-sectional view taken along the XLV-XLV of FIG. In FIGS. 44 and 45, the parts corresponding to the respective parts shown in FIGS. 30 and 31 are designated by the same reference numerals.
The third barometric pressure detection device 201 includes a barometric pressure sensor element 102 and a support substrate 104 that supports the barometric pressure sensor element 102. For convenience of explanation, the + X direction, the −X direction, the + Y direction and the −Y direction shown in FIG. 44, and the + Z direction and the −Z direction shown in FIG. 45 may be used below.

In the third barometric pressure detection device 201, the formation position of the second pad 123 for surface-mounting the barometric pressure detection device 201 on the wiring board 81 and the wiring path connecting the first pad 121 and the second pad 123 are set. , It is different from the above-mentioned second barometric pressure detection device 101. Other than that, it is the same as the second barometric pressure detection device 101.
In the third barometric pressure detection device 201, the second pad 123 is formed not on the main surface 104a on the + Z direction side of the support substrate 104 but on the main surface 104b on the −Z direction side. Specifically, the second pad 123 is provided in each of the region of the main surface 104b of the support substrate 104 facing the first region 115A of the high frequency portion 115 and the region facing the second region 115B of the high frequency portion 115. It is formed two by two. Bumps 125 are formed on each second pad 123. The external terminal 126 is formed by the second pad 123 and the bump 125 formed on the second pad 123. The first pad 121 and the second pad 123 are connected to each other via the wiring 127 formed in the support substrate 104.

FIG. 46 is a schematic cross-sectional view showing a mounting state of the third barometric pressure detection device shown in FIG. 44, and shows a cut surface corresponding to FIG. 45.
A plurality of lands 83 are formed on the surface 82 of the wiring board (mounting board) 81. The atmospheric pressure detection device 101 is surface-mounted with the bump 125 facing the surface 82 of the wiring board (mounting board) 81. In the third atmospheric pressure detection device 201, since the bump 125 is formed on the main surface 104b side of the support substrate 104, the atmospheric pressure detection device 201 is in a state where the main surface 104b of the support substrate 104 faces the surface of the wiring board 81. Is mounted on the wiring board 81. Cream solder 84 is applied on the plurality of lands 83. When the barometric pressure detection device 201 is surface-mounted on the wiring board 81, the second pad 123 of the barometric pressure detection device 201 is joined to the land 83 via the cream solder 84 and the bump 125.

In the state where the air pressure detection device 201 is mounted on the wiring board 81, the opening of the recess 110 is open to the outside air. There is a gap of at least the thickness of the first pad 121 between the outside air contact surface S of the barometric pressure sensor element 102 and the low frequency portion 113 of the support substrate 104. Therefore, the outside air can flow into the gap between the outside air contact surface S of the barometric pressure sensor element 102 and the low frequency portion 113 of the support substrate 104 through the opening of the recess 110. Therefore, since the outer surface (outside air contact region Sa) of the movable portion 33A of the diaphragm 33 of the atmospheric pressure sensor element 102 is exposed to the outside air, the atmospheric pressure can be detected using the atmospheric pressure sensor element 102.

In the third barometric pressure detection device 201, the barometric pressure sensor element 102 is joined to the low frequency portion 113 of the support substrate 104 in a face-down state in which the surface S for contact with the outside air faces the low frequency portion 113. As a result, the outside air contact surface S (outside air contact region Sa) of the barometric pressure sensor element 102 is protected by the support substrate 104 for supporting the barometric pressure sensor element 102, so that the outside air contact surface S (outside air) of the barometric pressure sensor element 102. It is not necessary to separately provide a lid for protecting the contact area Sa). In this way, even when the barometric pressure sensor element 102 is joined to the support substrate 104 in the face-down state, at least the first pad is located between the outside air contact region Sa of the barometric pressure sensor element 102 and the low frequency portion 113 of the support substrate 104. Since a gap corresponding to the thickness of 121 is formed, the outside air contact region Sa of the barometric pressure sensor element 102 can be exposed to the outside air through the recess 110. Therefore, there is no problem in detecting the atmospheric pressure.

FIG. 47 is a schematic cross-sectional view showing a modified example of the third barometric pressure detection device, and shows a cut surface corresponding to FIG. 45. In FIG. 47, the portions corresponding to the respective parts of FIG. 45 are designated by the same reference numerals as those in FIG. 45.
The barometric pressure detection device 201 of FIG. 47 differs only in the barometric pressure sensor element 102 from the third barometric pressure detection device 201 shown in FIGS. 44 and 45. FIG. 48 is a view of the outside air contact surface S of the atmospheric pressure sensor element 102 used in the atmospheric pressure detection device 201 of FIG. 47 as viewed from the −Z direction side. In FIG. 48, since the solder layer 141 is omitted, the electrode pad appears on the surface S for contact with the outside air.

Four electrode pads 150 are formed on the outside air contact surface S of the barometric pressure sensor element 102. In the −Z direction view, the four electrode pads 150 are arranged at the four corners of the outside air contact surface S of the barometric pressure sensor element 102. On the surface of the fixed portion 33B of the diaphragm 33 on the −Z direction side, a waterproof / dustproof wall 151 is formed in which at least one portion is divided so as to substantially surround the movable portion 33A (outside air contact region Sa) of the diaphragm. The waterproof / dustproof wall 151 is the same as the waterproof / dustproof wall 151 described with reference to FIGS. 33 to 35. In this example, the waterproof / dustproof wall 151 is an endd rectangular ring in which a divided portion (cut portion) 152 is formed only at one location in the −Z direction. Further, in this example, the waterproof / dustproof wall 151 is formed so as to pass through the outside of the four electrode pads 150 in the −Z direction view.

The waterproof / dustproof wall 151 projects in the −Z direction from the outer surface of the diaphragm 33. The protruding length (length in the Z direction) of the waterproof / dustproof wall 151 is such that when the barometric pressure sensor element 102 is joined to the low frequency portion 113 of the support substrate 104, the protruding end of the waterproof / dustproof wall 151 is the low frequency portion. It is preferably formed so as to be in pressure contact with or in contact with the surface of 113. The waterproof / dustproof wall 151 is made of a resin such as polyimide, ceramics such as SiO ₂ , and a metal such as Cu. The waterproof / dustproof wall 151 may have the configuration shown in FIG. 36, FIG. 37, or FIG. 38 described above.

In the atmospheric pressure detection device 201 of FIG. 47, as in the third atmospheric pressure detection device 201 of FIG. 44, it is not necessary to separately provide a lid for protecting the outside air contact surface S of the atmospheric pressure sensor element 102. Further, in the atmospheric pressure detection device 201 of FIG. 47, a waterproof / dustproof wall having a rectangular annular shape with an end in a plan view so as to substantially surround the movable portion 33A (outside air contact region Sa) on the surface of the fixed portion 33B of the diaphragm 33 on the −Z direction side. Since 151 is formed, it is possible to suppress the intrusion of moisture and dust into the gap between the movable portion 33A of the diaphragm 33 and the low frequency portion 113 of the support substrate 104.

FIG. 49 is a schematic plan view of the fourth barometric pressure detection device. FIG. 50 is a schematic cross-sectional view taken along the LL of FIG. 49.
The fourth pressure detection device 301 includes a pressure sensor element 102, an integrated circuit element 103 that performs pressure detection processing based on the output of the pressure sensor element 102, and a support substrate 204 that supports the pressure sensor element 102 and the integrated circuit element. including. For convenience of explanation, the + X direction, the −X direction, the + Y direction and the −Y direction shown in FIG. 49, and the + Z direction and the −Z direction shown in FIG. 50 may be used below.

The support board 204 is composed of a multilayer wiring board having a wiring layer inside. The support substrate 204 is formed in a rectangular shape in a plan view, and has a pair of main surfaces 204a and 204b and four side surfaces connecting these main surfaces 2044a and 204b. At the center of one main surface (main surface on the + Z direction side) 204a of the support substrate 204, a concave portion 210 having a rectangular shape in a plan view is formed, which is recessed toward the other main surface 204b. The other main surface 204b of the support substrate 204 is a flat surface.

The recess 210 is composed of a rectangular third recess 211 recessed from the main surface 204a of the support substrate 204 and a fourth recess 212 further recessed from the bottom surface of the third recess 211. When viewed from the Z direction, the contours of the third recess 211 and the fourth recess 212 are rectangles similar to each other, and the contour of the fourth recess 212 is smaller than the contour of the third recess 211. When viewed from the Z direction, the bottom surface of the third recess 211 is a rectangular ring surrounding the fourth recess 212, and the bottom surface of the fourth recess 212 is a rectangular shape surrounded by the bottom surface of the third recess 211.

On one main surface 204a of the support substrate 204, the third recess 211 and the fourth recess 212 form a rectangular low-frequency portion 213 in a plan view, which is the bottom surface of the fourth recess 212, and the bottom surface of the third recess 211. A mid-range portion 214 having a rectangular annular shape in a plan view and a high-frequency portion 215 having a rectangular ring shape in a plan view around the recess 210 are formed.
A connecting portion 217 for connecting them is formed between the four sides of the low frequency portion 213 and the four sides of the inner peripheral edge side of the mid region portion 214. A connecting portion 218 for connecting them is formed between the four sides on the outer peripheral edge side of the mid-range portion 214 and the four sides on the inner peripheral edge side of the high-pass portion 215. The connection portion 217 is substantially perpendicular to the low frequency portion 213. The connection portion 218 is substantially perpendicular to the mid region portion 214. The high region portion 215 is arranged so as to be separated from each other in the X direction with the recess 210 interposed therebetween, and includes a rectangular first region 215A and a second region 215B having a long plan view in the Y direction.

A plurality of first pads 221 are formed on the peripheral portion of the low frequency portion 213. The plurality of first pads 221 are rectangular in a plan view, and for example, four are formed in the low frequency portion 213. These first pads 221 are provided to mechanically and electrically fix the barometric pressure sensor element 102 to the low frequency portion 213.
A plurality of second pads 222 are formed in the mid region portion 214. The plurality of second pads 222 are rectangular in plan view, and for example, twelve are formed in the mid-range portion 214. These second pads 222 are provided to mechanically and electrically fix the integrated circuit element 103 to the mid-range portion 214.

A plurality of third pads 223 are formed in the first region 215A and the second region 215B of the high frequency portion 215. A plurality of third pads 223 are formed in each of the first region 215A and the second region 215B. Bump 225 is formed on each third pad 223. The external terminal 226 is formed by the third pad 223 and the bump 225 formed on the third pad 223. The external terminal 226 is used for surface mounting the barometric pressure detection device 301 on a circuit board (not shown). The predetermined first pad 221 and the second pad 222 are connected to each other via the wiring 227 formed in the support substrate 204. Further, the predetermined second pad 222 and the third pad 223 (external terminal 226) are connected to each other via the wiring 228 formed in the support substrate 204.

Since the barometric pressure sensor element 102 is the same as the barometric pressure sensor element 102 of the second barometric pressure detection device 101, the description thereof will be omitted. The barometric pressure sensor element 102 has a rectangular parallelepiped shape and is housed in the fourth recess 212. The barometric pressure sensor element 102 is joined to the low frequency portion 213 in a face-down state in which the outside air contact surface S faces the low frequency portion 213 (bottom surface of the fourth recess 212). Specifically, a plurality of pad electrodes provided on the outside air contact surface S of the barometric pressure sensor element 102 are mechanically and electrically connected to the first pad 221 formed in the low frequency portion 213 via the solder layer 241. It is joined to. As a result, each pad electrode of the barometric pressure sensor element 102 is connected to a predetermined second pad 222 via the first pad 221 and the wiring 227 formed in the support substrate 204. Between the outside air contact surface S (outside air contact region Sa) of the barometric pressure sensor element 102 and the low frequency portion 213, there is a gap corresponding to the thickness of the first pad 221 plus the thickness of the solder layer 241. It is formed. That is, there is a gap of at least the thickness of the first pad 221 between the outside air contact region Sa of the barometric pressure sensor element 102 and the low frequency portion 213.

In this embodiment, the integrated circuit element 103 is configured as a so-called ASIC (Application Specific Integrated Circuit) element. The integrated circuit element 103 has a rectangular parallelepiped shape flat in the Z direction, and is housed in the third recess 211. A plurality of pad electrodes (not shown) are provided on the peripheral edge of one surface of the integrated circuit element 103 (the surface on the −Z direction side, hereinafter referred to as “mounting surface”). The integrated circuit element 103 is joined to the mid-range portion 214 in a state where the peripheral edge portion of the mounting surface thereof faces the mid-range portion 214. Specifically, a plurality of pad electrodes provided on the mounting surface of the integrated circuit element 103 are mechanically and electrically bonded to the second pad 222 formed in the mid-range portion 214 via the solder layer 242. ing. As a result, each pad electrode of the integrated circuit element 103 is connected to a predetermined third pad 223 via the second pad 222 and the wiring 228 formed in the support substrate 204.

The integrated circuit element 103 can be used for processing a signal or the like according to the amount of change in the electric resistance value of the strain gauge resistance in the pressure sensor element 102. The signal processing result of the integrated circuit element 103 can be output to the outside via the wiring 228 and the external terminal 226.
FIG. 51 is a schematic cross-sectional view showing a mounting state of the fourth barometric pressure detection device shown in FIG. 49, and shows a cut surface corresponding to FIG. 50.

A plurality of lands 83 are formed on the surface 82 of the wiring board (mounting board) 81. The atmospheric pressure detection device 301 is surface-mounted with the bump 225 facing the surface 82 of the wiring board (mounting board) 81. Cream solder 84 is applied on the plurality of lands 83. When the barometric pressure detection device 301 is surface-mounted on the wiring board 81, the third pad 223 of the barometric pressure detection device 301 is joined to the land 83 via the cream solder 84 and the bump 225.

In the state where the barometric pressure detection device 301 is mounted on the wiring board 81, a third pad is located between the surface (+ Z side surface) of the high frequency portion 215 of the support board 204 of the barometric pressure detection device 301 and the wiring board 81. In the thickness of 223, there is a gap corresponding to the thickness of the bump 225, the cream solder 84, and the land 83. As described above, there is a gap of at least the thickness of the first pad 221 between the outside air contact surface S of the barometric pressure sensor element 102 and the low frequency portion 213 of the support substrate 204. Therefore, the outside air passes through the gap between the wiring board 81 and the barometric pressure detection device 301 and the recess 210, and passes through the outside air contact surface S (outside air contact region Sa) of the barometric pressure sensor element 102 and the low frequency portion 213 of the support board 204. It is possible to flow into the gap between and. Therefore, since the outer surface (outside air contact region Sa) of the movable membrane portion 34A of the diaphragm 33 of the atmospheric pressure sensor element 102 is exposed to the outside air, the atmospheric pressure can be detected using the atmospheric pressure sensor element 102.

In the fourth barometric pressure detection device 301 described above, the barometric pressure sensor element 102 is joined to the low frequency portion 213 of the support substrate 204 in a face-down state in which the surface S for contact with the outside air faces the low frequency portion 213. .. As a result, the outside air contact surface S (outside air contact region Sa) of the barometric pressure sensor element 102 is protected by the support substrate 204 for supporting the barometric pressure sensor element 102, so that the outside air contact surface S (outside air) of the barometric pressure sensor element 102. It is not necessary to separately provide a lid for protecting the contact area Sa). In this way, even when the barometric pressure sensor element 102 is joined to the support substrate 204 in the face-down state, at least the first pad is located between the outside air contact region Sa of the barometric pressure sensor element 102 and the low frequency portion 213 of the support substrate 204. Since a gap corresponding to the thickness of 221 is formed, the outside air contact region Sa of the barometric pressure sensor element 102 can be exposed to the outside air through the recess 210. Therefore, there is no problem in detecting the atmospheric pressure.

Also in the fourth barometric pressure detection device 301, the waterproof / dustproof wall similar to the waterproof / dustproof wall 151 described with reference to FIGS. 33 to 35 is formed on the outer surface of the fixed portion 33B of the diaphragm 33 of the barometric pressure sensor element 102. May be formed. Further, the waterproof / dustproof wall formed on the outer surface of the fixing portion 33B may have a configuration as shown in FIG. 36, FIG. 37 or FIG. 38 described above.
Further, also in the fourth atmospheric pressure detection device 301, a waterproof / dustproof wall similar to the waterproof / dustproof wall 155 described with reference to FIGS. 39 and 40 is formed on the high frequency portion 215 of the support substrate 204. May be good. Further, the waterproof / dustproof wall formed in the high frequency portion 215 may have a configuration as shown in FIG. 41, FIG. 42 or FIG. 43 described above.

FIG. 52 is a schematic plan view of the fifth barometric pressure detection device. FIG. 53 is a schematic cross-sectional view taken along the line LIII-LIII of FIG. 52. In FIGS. 52 and 53, the parts corresponding to the respective parts shown in FIGS. 49 and 50 are designated by the same reference numerals.
The fifth pressure detection device 401 includes a pressure sensor element 102, an integrated circuit element 103 that performs pressure detection processing based on the output of the pressure sensor element 102, and a support substrate 204 that supports the pressure sensor element 102 and the integrated circuit element 103. And include. For convenience of explanation, the + X direction, the −X direction, the + Y direction and the −Y direction shown in FIG. 49, and the + Z direction and the −Z direction shown in FIG. 50 may be used below.

In the fifth barometric pressure detection device 401, the formation position of the third pad 223 for surface-mounting the barometric pressure detection device 201 on the wiring board 81 and the wiring path connecting the second pad 222 and the third pad 223 are set. , It is different from the above-mentioned fourth barometric pressure detection device 301. Other than that, it is the same as the fourth barometric pressure detection device 301.
In the fifth barometric pressure detection device 401, the third pad 223 is formed not on the main surface 204a on the + Z direction side of the support substrate 204 but on the main surface 204b on the −Z direction side. Specifically, the third pad 223 is provided in each of the region of the main surface 204b of the support substrate 204 facing the first region 215A of the high frequency portion 215 and the region facing the second region 215B of the high frequency portion 215. Five are formed at a time. Bump 225 is formed on each third pad 223. The external terminal 226 is formed by the third pad 223 and the bump 225 formed on the third pad 223. The second pad 222 and the third pad 223 are connected to each other via the wiring 228 formed in the support substrate 204.

FIG. 54 is a schematic cross-sectional view showing a mounting state of the fifth barometric pressure detection device shown in FIG. 53, and shows a cut surface corresponding to FIG. 53.
A plurality of lands 83 are formed on the surface 82 of the wiring board (mounting board) 81. The atmospheric pressure detection device 401 is surface-mounted with the bump 225 facing the surface 82 of the wiring board (mounting board) 81. In the fifth atmospheric pressure detection device 401, since the bump 225 is formed on the main surface 204b side of the support substrate 204, the atmospheric pressure detection device 401 is in a state where the main surface 204b of the support substrate 204 faces the surface of the wiring board 81. Is mounted on the wiring board 81. Cream solder 84 is applied on the plurality of lands 83. When the barometric pressure detection device 401 is surface-mounted on the wiring board 81, the third pad 223 of the barometric pressure detection device 401 is joined to the land 83 via the cream solder 84 and the bump 225.

In the state where the air pressure detection device 401 is mounted on the wiring board 81, the opening of the recess 210 (the opening of the third recess 211) is open to the outside air. There is a gap of at least the thickness of the first pad 221 between the outside air contact surface S of the barometric pressure sensor element 402 and the low frequency portion 213 of the support substrate 204. Therefore, the outside air can flow into the gap between the outside air contact surface S of the barometric pressure sensor element 102 and the low frequency portion 213 of the support substrate 204 through the opening of the recess 210. Therefore, since the outer surface (outside air contact region Sa) of the movable portion 33A of the diaphragm 33 of the atmospheric pressure sensor element 102 is exposed to the outside air, the atmospheric pressure can be detected using the atmospheric pressure sensor element 102.

In the fifth barometric pressure detection device 401, the barometric pressure sensor element 102 is joined to the low frequency portion 213 of the support substrate 204 in a face-down state in which the surface for contact with the outside air faces the low frequency portion 213. As a result, the outside air contact surface S (outside air contact region Sa) of the barometric pressure sensor element 102 is protected by the support substrate 204 for supporting the barometric pressure sensor element 102, so that the outside air contact surface S (outside air) of the barometric pressure sensor element 102. It is not necessary to separately provide a lid for protecting the contact area Sa). In this way, even when the barometric pressure sensor element 102 is joined to the support substrate 204 in the face-down state, at least the first pad is located between the outside air contact region Sa of the barometric pressure sensor element 102 and the low frequency portion 213 of the support substrate 204. Since a gap corresponding to the thickness of 221 is formed, the outside air contact region Sa of the barometric pressure sensor element 102 can be exposed to the outside air through the recess 210. Therefore, there is no problem in detecting the atmospheric pressure.

Also in the fifth barometric pressure detection device 401, the waterproof / dustproof wall similar to the waterproof / dustproof wall 151 described with reference to FIGS. 33 to 35 is formed on the outer surface of the fixed portion 33B of the diaphragm 33 of the barometric pressure sensor element 102. May be formed. Further, the waterproof / dustproof wall formed on the outer surface of the fixing portion 33B may have a configuration as shown in FIG. 36, FIG. 37 or FIG. 38 described above.
FIG. 55 is a schematic plan view of the sixth barometric pressure detection device. FIG. 56 is a schematic cross-sectional view taken along the LVI-LVI of FIG. In FIGS. 55 and 56, the parts corresponding to the respective parts shown in FIGS. 52 and 53 are designated by the same reference numerals.

The sixth pressure detection device 501 includes a pressure sensor element 102, an integrated circuit element 103 that performs pressure detection processing based on the output of the pressure sensor element 102, and a support substrate 204 that supports the pressure sensor element 102 and the integrated circuit element 103. including. For convenience of explanation, the + X direction, the −X direction, the + Y direction and the −Y direction shown in FIG. 55 and the + Z direction and the −Z direction shown in FIG. 56 may be used below.

The configuration of the sixth barometric pressure detection device 501 is almost the same as that of the fifth barometric pressure detection device 401, but the posture of the barometric pressure sensor element 102 supported by the support substrate 204 is different from that of the fifth barometric pressure detection device 401. There is. That is, in the sixth barometric pressure detection device 501, the barometric pressure sensor element 102 is supported in a face-up state in which the surface opposite to the outside air contact surface S (the surface on the pedestal 31 side) faces the low frequency portion 213. It is joined to the low frequency portion 213 of the substrate 204. In the low frequency portion 213, a plurality of first pads 221 are formed in the outer region of the region to which the barometric pressure sensor element 102 is joined. The pad electrode formed on the outside air contact surface S of the barometric pressure sensor element 102 is connected to the first pad 221 via the bonding wire 219. The first pad 221 is connected to the second pad 222 by a wiring 227 formed in the support substrate 204. The second pad 222 is connected to the third pad 223 by a wiring 228 formed in the support substrate 204.

In the sixth barometric pressure detection device 501, the barometric pressure sensor element 102 is joined to the low frequency portion 213 of the support substrate 204 in a face-up state in which the surface opposite to the outside air contact surface S faces the low frequency portion 213. Has been done. However, since the outside air contact surface S of the barometric pressure sensor element 102 is covered by the integrated circuit element 103, it is not necessary to separately provide a lid for protecting the outside air contact surface S of the barometric pressure sensor element 102.

The above has described the case where the present invention is applied to a barometric pressure detection device including a barometric pressure sensor element, but the present invention is an electronic component including a sensor element having a surface for outside air contact including an outside air contact region to be exposed to the outside air. If so, it can be applied to electronic components other than the barometric pressure detector. Such electronic components include, for example, a humidity detection device including a humidity sensor element.
In addition, various design changes can be made within the scope of the matters described in the claims.

The following features can be further extracted from this specification.
1. 1. The sensor element includes a sensor element having an outside air contact surface including an outside air contact region to be exposed to the outside air and a support substrate for supporting the sensor element, and the sensor element has an outside air contact surface of the support substrate. An electron bonded to the one surface of the support substrate while facing the surface and having a gap through which outside air flows is formed between the outside air contact region and the one surface of the support substrate. parts.

In this configuration, the outside air contact surface (outside air contact area) of the sensor element is protected by a support substrate for supporting the sensor element, so it is necessary to separately provide a lid for protecting the outside air contact area of the sensor element. do not have. In this way, even when the sensor element is bonded to one surface of the support substrate while facing one surface of the support substrate, outside air flows between the outside air contact region of the sensor element and one surface of the support substrate. Since the gap is formed, the outside air contact region of the sensor element can be exposed to the outside air.

2. 2. A plurality of electrodes formed on the outside air contact surface side of the sensor element and a plurality of pads formed on the one surface of the support substrate are further included, and the plurality of electrodes are joined to the plurality of pads. Yes, 1. Electronic components described in.
3. 3. The support substrate is formed with a recess formed from the one surface of the support substrate and accommodating the sensor element. The sensor element has a surface for contact with outside air facing the bottom surface of the recess. 1. It is joined to the bottom surface of the recess in a state where a gap through which outside air flows is formed between the outside air contact region and the bottom surface of the recess. Electronic components described in.

4. A plurality of electrodes formed on the surface side for contact with the outside air of the sensor element and a plurality of pads formed on the bottom surface of the recess are further included, and the plurality of electrodes are joined to the plurality of pads. 3. 3. Electronic components described in.
5. 4. Further including a plurality of external terminals formed in a region surrounding the recess on the one surface of the support substrate and connected to any of the plurality of pads. Electronic components described in.

6. 4. The plurality of external terminals are connected to any of the plurality of pads via wiring formed on the one surface of the support substrate. Electronic components described in.
7. 4. The plurality of external terminals are connected to any of the plurality of pads via wiring formed in the support substrate. Electronic components described in.
8. 3. Further including a plurality of external terminals formed on the other surface of the support substrate opposite to the one surface and connected to any of the plurality of pads. Electronic components described in.

9. 8. The plurality of external terminals are connected to any of the plurality of pads via wiring formed in the support substrate. Electronic components described in.
10. An integrated circuit element supported by the support substrate is further included, and the support substrate is provided with a first recess recessed from the one surface of the support substrate and a recess from the one surface of the support substrate to form the first recess. A second recess that communicates with the side surface and is shallower than the first recess is formed, and the surface of the sensor element for contact with outside air faces the bottom surface of the first recess, and the outside air. The integrated circuit element is joined to the bottom surface of the first recess in a state where a gap through which outside air flows is formed between the contact region and the bottom surface of the first recess, and one surface of the integrated circuit element is the second surface. 1. It is joined to the bottom surface of the second recess while facing the bottom surface of the recess. Electronic components described in.

11. A plurality of first electrodes formed on the surface side for contact with the outside air of the sensor element and a plurality of first pads formed on the bottom surface of the first recess are further included, and the plurality of first electrodes are the plurality. It is joined to the first pad of 10. Electronic components described in.
12. A plurality of second electrodes formed on the one surface side of the integrated circuit element, and a plurality of second pads formed on the bottom surface of the second recess and connected to any one of the plurality of first pads are further added. 11. The plurality of second electrodes are joined to the plurality of second pads. Electronic components described in.

13. 12. Further including a plurality of external terminals formed in a region surrounding the first recess and the second recess on the one surface of the support substrate and connected to any of the plurality of second pads. Electronic components described in.
14. The plurality of second pads are connected to any one of the plurality of first pads via a first wiring formed on the one surface of the support substrate, and the plurality of external terminals are connected to the support substrate. 13. It is connected to any of the plurality of second pads via a second wiring formed on one of the surfaces. Electronic components described in.

15. An integrated circuit element supported by the support substrate is further included, and the support substrate has a third recess recessed from the one surface of the support substrate and a fourth recess further recessed from the bottom surface of the third recess. The sensor element is formed so that the surface for contacting the outside air faces the bottom surface of the fourth recess, and a gap through which outside air flows is formed between the outside air contact region and the bottom surface of the fourth recess. In this state, the integrated circuit element is joined to the bottom surface of the fourth recess, one surface of which faces the bottom surface of the third recess, and the one surface and the bottom surface of the third recess. 1. It is joined to the bottom surface of the third recess in a state where a gap through which outside air flows is formed between the two. Electronic components described in.

16. A plurality of first electrodes formed on the surface side for contact with the outside air of the sensor element and a plurality of first pads formed on the bottom surface of the fourth recess are further included, and the plurality of first electrodes are the plurality. It is joined to the first pad of 15. Electronic components described in.
17. A plurality of second electrodes formed on the one surface side of the integrated circuit element, and a plurality of second pads formed on the bottom surface of the third recess and connected to any one of the plurality of first pads are further added. 16. The plurality of second electrodes are joined to the plurality of second pads. Electronic components described in.

18. 17. Further including a plurality of external terminals formed in a region surrounding the third recess on the one surface of the support substrate and connected to any of the plurality of second pads. Electronic components described in.
19. The plurality of second pads are connected to any one of the plurality of first pads via a first wiring formed in the support substrate, and the plurality of external terminals are formed in the support substrate. It is connected to any of the plurality of second pads via the second wiring. Electronic components described in.

1,101,201,301,401,501 Pressure detector 2,102 Pressure sensor element 3,103 Integrated circuit element 4,104,204 Support substrate 4a, 104a, 204a Main surface 4b, 104b, 204b Main surface 5 Base material 6 Insulation layer 10,110,210 Recess 11 1st recess 12 2nd recess 211 3rd recess 212 4th recess 13,113,213 Low frequency 14,214 Midrange 15,115,215 High frequency 15A, 115A , 215A 1st area 15B, 115B, 215B 2nd area 16,116 Connection part 17,217 Connection part 18,218 Connection part 20 Wiring film 21,121,221 1st pad 22,123,222 2nd pad 23,223 3rd pad 24 connection part 24A 1st connection part 24B 2nd connection part 24C 3rd connection part 25, 125, 225 bumps 26, 126, 226 external terminals 127, 227 wiring 228 wiring 31 pedestal 32 board 33 diaphragm 33A movable part 33B Fixed part 34 Cavity 35 Insulation layer 41, 141,241 Solder layer 41A, 141A Solder ball 42,242 Solder layer 50,150 Electrode pad 51,151 Waterproof / dustproof wall 52, 52A, 52B, 152, 152A, 152B Dividing part 53, 53C, 53D, 153, 153C, 153D Rectangular part 54, 54C, 54D, 154, 154C, 154D Dividing part 51A, 51C, 151A, 151C First waterproof / dustproof wall 51B, 51D, 151B, 151D Second Waterproof / Dustproof Wall 55,155 Waterproof / Dustproof Wall 56,56A, 56B, 156,156A, 156B Divided part 57,57C, 57D, 157,157C, 157D Rectangular part 58,58C, 58D, 158,158C, 158D Dividing part 55A, 55C, 155A, 155C First waterproof / dustproof wall 55B, 55D, 155B, 155D Second waterproof / dustproof wall

Claims (6)

A sensor element with an outside air contact surface that includes an outside air contact area that should be exposed to the outside air,
An integrated circuit element that processes the output signal of the sensor element and
Including the sensor element and a support substrate for supporting the integrated circuit element.
The support substrate is formed with a recess from one surface of the support substrate and a recess whose entire side surface is surrounded by a side wall made of the support substrate.
The recess extends from one side of the four sides of the first recess in a plan view to the outside of the first recess and the one in the first recess in a plan view. It consists of a second recess that communicates with the side corresponding to the side and is shallower than the first recess.
The sensor element has a surface for contacting outside air facing the bottom surface of the first recess, and a gap through which outside air flows is formed between the outside air contact region and the bottom surface of the first recess. It is joined to the bottom surface of the first recess,
The integrated circuit element is joined to the bottom surface of the second recess with one surface facing the bottom surface of the second recess.
It has an element / circuit connection wiring extending from the bottom surface of the first recess to the bottom surface of the second recess through the side portion communicating the first recess and the second recess.
The element / circuit connection wiring is an electronic component that connects the sensor element and the integrated circuit element . The integrated circuit element has the one surface, the other surface opposite to the one surface, and the side surface connecting the one surface and the other surface.
The entire side surface of the integrated circuit element is surrounded by the side wall of the recess.
The electronic component according to claim 1, wherein the integrated circuit element is supported only by the bottom surface of the recess. A plurality of first electrodes formed on the surface side of the sensor element for contact with the outside air, and
Further including a plurality of first pads formed on the bottom surface of the first recess,
The electronic component according to claim 1 or 2, wherein the plurality of first electrodes are bonded to the plurality of first pads. A plurality of second electrodes formed on the one surface side of the integrated circuit element, and
Further including a plurality of second pads formed on the bottom surface of the second recess,
The electronic component according to claim 3, wherein the plurality of second electrodes are joined to the plurality of second pads. The electronic component according to claim 4, further comprising a plurality of external terminals formed in a region surrounding the recess on the one surface of the support substrate and connected to any of the plurality of second pads. The plurality of second pads are a second pad connected to any one of the plurality of first pads via the element / circuit connection wiring, and a pad / terminal connection wiring formed on the one surface of the support substrate. 5. The electronic component of claim 5, comprising a second pad connected to any of the plurality of external terminals via.

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