JP6680521B2 - Electronic equipment - Google Patents

Description

  The present invention relates to an electronic device in which a wiring board and a coaxial connector are connected to each other via a brazing material.

In recent years, the speed of electric signals used in optical communication modules such as optical transceivers has been increased from 40 Gbps (gigabit per second) to 100 Gbps. Optical transceiver
Multiplexer having a function of bundling a plurality of low-speed electric signals transferred from an external module and switching to one or a plurality of high-speed signals, and a function of amplifying the current value of the electric signals transferred from this multiplexer It is composed of a plurality of electronic devices such as a driver. A coaxial connector that is directly connected to a terminal or the like of the electronic device is used for electrical connection between the plurality of electronic devices.

  The coaxial connector is composed of an insulating main body, an inner conductor provided inside the main body, and an outer conductor provided on the surface of the main body. Conventionally, a metal package has been used for an electronic device such as a driver, but due to demands for cost reduction or miniaturization, use of a surface mounting type wiring board is being considered. Along with this, surface mounting type coaxial connector mounted electronic devices in which a coaxial connector is electrically connected directly to a high-speed transmission line (electrode) on a wiring board by a brazing material have been studied.

  In the coaxial connector-equipped electronic device, the inner conductor of the coaxial connector and the signal electrode formed at the end of the high-speed transmission path on the main surface of the wiring board are connected to each other. Further, the outer conductor of the coaxial connector and the ground electrodes arranged apart from the signal electrode on both sides of the signal electrode on the main surface of the wiring board are connected to each other.

JP 2009-218359 JP JP 2007-311505

  In the conventional coaxial connector-equipped electronic device, only the signal electrode and the ground electrode, which have a relatively small area formed on the main surface of the miniaturized wiring board, are connected to the coaxial connector via the brazing material. There is a problem that cracks are easily generated in the brazing material due to the stress. That is, there is a problem to improve the connection strength between the coaxial connector and the electrodes of the surface mounting type wiring board.

  As a measure against such a problem, for example, as described in Patent Document 1, a connection conductor pattern formed by cutting out a via hole (penetrating conductor) from an end portion to a side surface of a main surface of a wiring board, It is conceivable to connect the outer conductor of the coaxial connector via a brazing material.

  However, in the case of an electronic device having a via hole as described above, a crack may occur at the end of the via hole in the wiring board due to the stress generated when the via hole is formed.

Further, for example, as described in Patent Document 2, the end portion of the internal conductor layer (ground electrode or the like) is exposed on the side surface of the wiring board, and the outer conductor of the coaxial connector is connected to this end portion through a brazing material. It is possible to connect. However, even in this case, the joint area between the brazing material and the internal conductor layer (ground electrode, etc.) increases only by the thickness of the internal conductor layer exposed on the side surface of the wiring board. The connection strength with the board may be insufficient.

An electronic device according to an aspect of the present invention includes an insulating substrate including a plurality of insulating layers stacked on each other, a signal disposed on a main surface of the insulating substrate, and having an end portion located on an outer peripheral portion of the main surface. An electrode, a ground electrode having, on the main surface of the insulating substrate, ends on both sides of the signal electrode arranged apart from the signal electrode, and the insulating substrate formed between layers of the plurality of insulating layers A wiring board having a plurality of ground conductors each of which includes an end portion located outside the side surface of the main body, each end portion forming a side surface ground electrode, a main body, and an internal portion provided inside the main body. A conductor and an outer conductor provided on the outer surface of the main body, wherein the inner conductor is electrically connected to the signal electrode, and the outer conductor is electrically connected to the ground electrode. Coaxial connector and Connecting a first brazing material that connects the inner conductor of the the end of the electrode coaxial connector, and said outer conductor of said coaxial connector and an end portion and multiple side ground electrode of the ground electrode A second brazing material, and the ground conductor and the insulating layer are alternately positioned in the thickness direction from both sides of the signal electrode to the side opposite to the main surface of the insulating substrate in the thickness direction. The plurality of side surface ground electrodes each have an extending portion that protrudes outward on the upper end side of the side surface of the insulating layer and extends along the side surface of the insulating layer. The extension portions are separated from each other .

With the electronic device according to one aspect of the present invention, the surface area of the side surface ground electrode, that is, the area to which the second brazing material is connected is large due to the above configuration , and the connection between the second brazing material and the side surface grounding electrode (ground electrode) is The strength is relatively high. As a result, the strength of the connection between the ground electrode of the wiring board and the outer conductor of the coaxial connector via the second brazing material is improved as compared with the conventional electronic device. Further, cracks and the like caused by the via holes are also effectively suppressed. Therefore, it is possible to provide an electronic device in which the connection strength between the wiring board and the coaxial connector is improved.

FIG. 3A is an enlarged perspective view of an essential part showing an electronic device according to a first embodiment of the present invention, and FIG. 3B is an essential part enlarged view showing a wiring board included in the electronic device of the first embodiment of the present invention. It is a perspective view. (A) is a perspective view which shows the coaxial connector contained in the electronic device of the 1st Embodiment of this invention, (b) is a side view of (a). It is the side view which looked at the electronic device shown in Drawing 1 (a) from the coaxial connector side. 1A is an enlarged cross-sectional view of an essential part of the wiring board shown in FIG. 1B, and FIG. 1B is an enlarged cross-sectional view of an essential part of the electronic device shown in FIG. 1A. 1A is an enlarged plan view of an essential part of the wiring board shown in FIG. 1B, and FIG. 1B is a side view of FIG. 4A is an enlarged cross-sectional view of an essential part showing a modified example of FIG. 4A, and FIG. 4B is an enlarged cross-sectional view of an essential part showing a modified example of FIG. 4B. (A) is an enlarged sectional view of an essential part showing a wiring board included in an electronic device according to a second embodiment of the present invention, and (b) is an essential part enlarged view showing an electronic device of the second embodiment of the present invention. FIG. 7A is an enlarged plan view of an essential part of the wiring board shown in FIG. 7A, and FIG. 7B is a side view of FIG. 7A is an enlarged cross-sectional view of an essential part showing a modified example of FIG. 7A, and FIG. 7B is an enlarged cross-sectional view of an essential part showing a modified example of FIG. 7B.

  An electronic device according to an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, in the accompanying drawings, hatching may be applied even in drawings other than the cross-sectional view in order to facilitate identification and the like.

(First embodiment)
FIG. 1A is an enlarged perspective view of an essential part showing an electronic device of a first embodiment of the present invention, and FIG. 1B shows a wiring board included in the electronic device of the first embodiment of the present invention. It is a principal part expansion perspective view shown. 2A is a perspective view showing a coaxial connector included in the electronic device according to the first embodiment of the present invention, and FIG. 2B is a side view of FIG. 2A. FIG. 3 is a side view of the electronic device shown in FIG. 1A as viewed from the coaxial connector side. 4A is an enlarged cross-sectional view of a main part of the wiring board shown in FIG. 1B, and FIG. 4B is an enlarged cross-sectional view of a main part of the electronic device shown in FIG. 5A is an enlarged plan view of a main part of the wiring board shown in FIG. 1B, and FIG. 5B is a side view of FIG. 5A. As shown in FIGS. 1 to 5, the coaxial connector 10 is connected to a wiring board 11 to basically configure an electronic device 12. The side surfaces shown in the above side views are surfaces viewed from a direction perpendicular to the main surface of the wiring board 11. Part of the side surface of the wiring board 11 and part of the side surface of the coaxial connector 10 face each other.

  The wiring board 11 is formed between the insulating substrate 1 including the plurality of insulating layers 1a stacked on each other, the signal electrode 2 and the ground electrode 3 arranged on the main surface of the insulating substrate 1, and the plurality of insulating layers 1a. And a plurality of ground conductors 4 that are connected. The signal electrode 2 has an end located on the outer periphery of the main surface of the insulating substrate 1. The ground electrode 3 has end portions arranged on both sides of the signal electrode 2 on the main surface of the insulating substrate 1 and apart from the signal electrode 2. In addition, the ground conductor 4 includes end portions (the end portions have no reference numeral) located outside the side surface of the insulating substrate 1, and these end portions form a plurality of side surface ground electrodes 7.

  The plurality of ground conductors 4 and the ground electrode 3 are electrically connected to each other through, for example, a through conductor (so-called via conductor) (not shown) for grounding formed inside the insulating substrate 1. By this electrical connection, the area of the conductor layer at the ground potential is increased, and the ground potential is effectively stable.

  The coaxial connector 10 has a body 13 made of an electrically insulating material, an inner conductor 5 provided inside the body 13, and an outer conductor 6 provided on the outer surface of the body 13. The inner conductor 5 is electrically connected to the signal electrode 2, and the outer conductor 6 is electrically connected to the ground electrode 3. The inner conductor 5 has its end exposed for electrical connection with another conductor (described later).

  Further, the electronic device 12 includes the first brazing material 9a that electrically connects the end portion of the signal electrode 2 and the inner conductor 5 of the coaxial connector 10, the plurality of side ground electrodes 7 and the outer conductor of the coaxial connector 10. 6 and a second brazing material 9b electrically connected to each other. Since the first brazing material 9a covers the entire surface of the signal electrode 2, the signal electrode 2 cannot be seen from the outside.

  Such an electronic device 12 is manufactured, for example, as follows. That is, first, the wiring board 11 and the coaxial connector 10 having the above configurations are separately manufactured. Next, the end portion of the signal electrode 2 of the wiring board 11 and the internal conductor 5 (exposed end portion) of the coaxial connector 10 are aligned with each other with the first brazing material 9a interposed therebetween. Further, the ground electrode 3 and the side surface ground electrode 7 and the predetermined portion of the outer conductor 6 of the coaxial connector 10 are aligned with each other with the second brazing material 9b interposed therebetween. After that, these are heated in an electric furnace or the like while being held in a predetermined positional relationship by a jig or the like. As a result, the wiring board 11 and the coaxial connector 10 are electrically and mechanically connected to each other through the first brazing material 9a and the second brazing material 9b, and the electronic device 12 is manufactured.

  In the electronic device 12, for example, a coaxial cable (not shown) whose one end is electrically connected to an external electric circuit (not shown) is connected at the other end to the coaxial connector 10, and the coaxial cable and the coaxial connector 10 are connected. The wiring board 11 and the external electric circuit are used by being electrically connected to each other via the. The wiring board 11 may be further mounted with an electronic component (not shown) such as an IC or LSI, or may be electrically connected to another external electric circuit such as a multiplexer. In this case, signals are transmitted and received between the external electric circuit and the electronic components and the like.

  The inner conductor 5 and the outer conductor 6 of the coaxial connector 10 correspond to the coaxial type transmission line of the coaxial cable, and the inner conductor 5 corresponds to a conductive line for signal transmission in the coaxial type transmission line. The conductor 6 corresponds to a conductive path for grounding.

  The electronic device 10 of the embodiment has the above-described configuration, and has the plurality of side surface grounding electrodes 7 protruding outward from the side surface of the insulating substrate 1, so that the second brazing material 9 and the side surface grounding are provided. Since the bonding area with the electrode 7 is large, the bonding strength is relatively large. By joining the side surface ground electrode 7 and the second brazing material 9, the joining between the second brazing material 9 and the ground electrode 3 is effectively reinforced. As a result, the strength of the joint between the ground electrode 3 of the wiring board 11 and the outer conductor 6 of the coaxial connector 10 via the second brazing material 9 can be determined by the brazing material and the ground electrode in the conventional electronic device (not shown). It is possible to improve the strength of bonding.

  Further, due to the improvement in the joint strength, the joint between the signal electrode 2 of the wiring board 11 and the internal conductor 5 of the connector 10 via the first brazing material 9a is reinforced. That is, the overall joint strength between the wiring board 11 and the coaxial connector 10 is effectively reinforced.

  In such an electronic device 12, for example, the stress generated when another member such as a coaxial cable (not shown) is connected to the coaxial connector 10 is reduced by the second solder having a larger adhesive area with the side ground electrode 7. It can be relaxed with the material 9. Therefore, it is possible to provide the electronic device 12 in which the connection strength between the wiring board 11 and the coaxial connector 10 is improved.

  In the following description, members constituting the electronic device 12 such as the wiring board 11 and the coaxial connector 10 will be described by giving specific examples thereof.

  The insulating substrate 1 functions as a base body for arranging conductors such as the signal electrode 2, the ground electrode 3, and the ground conductor 4 in a predetermined positional relationship while being electrically insulated from each other as necessary. In the case of this example, the conductor of ground potential such as the ground electrode 3 and the ground conductor 4 and the signal electrode 2 are electrically insulated from each other.

  The insulating substrate 1 has, for example, a polygonal plate shape such as a quadrangular shape in a top view, and the surface such as the upper surface and the inside are spaces for arranging the conductors. The insulating substrate 1 may be, for example, one whose corners are formed into a flat shape (so-called chamfered) as shown in FIG. The chamfer is not limited to a flat surface, but may be a curved surface such as an arc.

  The insulating substrate 1 includes a plurality of insulating layers 1a laminated on each other. The plurality of insulating layers 1a are formed of a ceramic material such as a glass ceramic sintered body, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body. . The insulating substrate 1 may be made of a resin material such as epoxy resin or polyimide resin. Note that, in FIGS. 1, 3, and 5, only the portion where the insulating layer 1a is present is shown and the individual insulating layers 1a are not shown for the sake of clarity.

In such an insulating substrate 1, if each insulating layer is made of a glass ceramic sintered body, for example, glass powder and ceramic powder as raw materials such as silicon oxide and aluminum oxide are first formed into a sheet shape together with an organic solvent and a binder. A plurality of ceramic green sheets are formed by molding. Next, a laminated body produced by laminating these ceramic green sheets is fired at a temperature of about 900 to 1000 ° C. Through the above steps, the insulating substrate 1 made of a glass ceramic sintered body can be manufactured.

  On the main surface (the upper surface in the example of FIG. 1 etc.) of the insulating substrate 1, the signal electrode 2 and the ground electrode 3 each having an end located on the outer peripheral portion of this main surface are arranged. The signal electrode 2 and the ground electrode 3 are connected to the corresponding ones of the inner conductor 5 and the outer electrode 6 as the coaxial type transmission line of the coaxial connector 10 as described above.

  The signal electrodes 2 are, for example, strip-shaped (elongated rectangular shape), and one is arranged on the main surface of the insulating substrate 1. The signal electrode 2 is a portion electrically connected to the internal conductor 5 which is a signal transmission path of the coaxial connector 10, and functions as a conductive path for signal transmission in the wiring board 11.

The ground electrode 3 is, for example, strip-shaped (elongated rectangular shape), the main surface of the insulating substrate 1, and has an end that is spaced apart on either side of the signal electrode 2 from the signal electrode 2. That is, the two ground electrodes 3 are arranged with the signal electrode 2 interposed therebetween to form a coplanar type transmission line. The signal electrode 2 and the ground electrode 3 each having a rectangular shape are arranged in parallel with each other, and the electrical insulation between the signal electrode 2 and the ground electrode 3 is secured.

  A plurality of insulating layers is formed between the plurality of insulating layers 1a and includes end portions located outside the side surface of the insulating substrate 1, and these end portions form a plurality of side surface ground electrodes 7. The ground conductor 4 is electrically connected to the ground electrode 3 by the via conductor or the like as described above. The plurality of ground conductors 3 are provided to stabilize the ground potential on the wiring board 11. The plurality of ground conductors 3 are also provided to adjust the characteristic impedance of the signal electrode 2.

  Further, the side surface ground electrode 7 which is the end of the ground conductor 4 has a side surface of the insulating substrate 1 in order to increase the bonding area between the second brazing material 9 and the ground conductor 4 (side surface ground electrode 7) as described above. Project more outward than. The side surface ground electrode 7 is a portion of the ground conductor 4 that is formed so that its end portion protrudes from the interlayer of the insulating layer 1a to the outside.

  The conductor portion (the conductor portion is not denoted by reference numeral) of the wiring board 11 such as the signal electrode 2, the ground electrode 3, the ground conductor 4 including the side surface ground electrode 7, and the via conductor is, for example, copper, silver, palladium, gold, platinum, tungsten, It is formed of a metal material such as molybdenum, nickel or cobalt. Further, the conductor portion may be formed of an alloy material containing one or more of these metal materials as a main component, and a glass component may be contained in order to control the shrinkage behavior. These metal materials can be arranged on a predetermined portion of the insulating substrate 1 by a method such as a metallizing method, a plating method or a vapor deposition method.

  If the conductor portion is made of copper deposited on the insulating substrate 1 by a metallizing method, for example, it can be formed as follows. First, a metal paste prepared by kneading copper and glass powder together with an organic solvent, a binder and the like is prepared. Next, this metal paste is applied to the surface of the ceramic green sheet to be the insulating substrate 1 in a predetermined pattern by a method such as screen printing. After that, the above conductor portions can be formed on the insulating substrate 1 by co-firing them.

The via conductor in the conductor portion is formed by, for example, previously forming a through hole in a ceramic green sheet to be the insulating layer 1a of the insulating substrate 1 by a method such as mechanical drilling or laser processing. It can be formed by filling the inside with a metal paste and firing.

  The side surface ground electrode 7 may be arranged such that the end portion of the ground conductor 4 is more than the side surface of the insulating substrate 1 due to the difference in shrinkage behavior between the green sheet that becomes the insulating layer 1a by firing and the metal paste that becomes the ground conductor 4 by firing. It can be formed by projecting outward. That is, by setting the shrinking completion temperature of the ground conductor 4 (metal paste) to be lower than the shrinking completion temperature of the insulating substrate 1 during firing, the insulating substrate 1 shrinks even after the ground conductor 4 has completed shrinking. Therefore, it is possible to adopt a structure in which the ground conductor 4 projects outward from the side surface of the insulating substrate 1. The protruding end portion of the ground conductor 4 corresponding to the contraction difference becomes the side surface electrode 7.

  The protruding length of the side surface ground electrode 7 from the side surface of the insulating substrate 1 may be, for example, about the thickness of the ground conductor 4 or longer. As a result, the area of bonding of the second brazing material 9b to the side surface ground electrode 7 (ground conductor 4) is effectively increased as compared with the case where the end surface of the ground conductor 4 is simply exposed to the side surface of the insulating substrate 1. be able to. That is, it is possible to effectively increase the strength of the joint between the wiring board 11 and the coaxial connector 10 via the second brazing material 9b.

  In the coaxial connector 10, for example, the inner conductor 5 as described above is provided inside a cylindrical main body 13, and the outer conductor 6 as described above is provided on the outer surface of the main body 13. The main body 5 is formed of an electrically insulating material such as a resin material. The main body 13 is a portion for holding the positional relationship between the inner conductor 5 and the outer conductor 6 in a predetermined positional relationship with the internal conductor 5 and the external conductor 6 electrically insulated from each other.

  The inner conductor 5 is a columnar member made of a metal material such as copper. The end portion of the inner conductor 5 is exposed outside from the side surface of the coaxial connector 10 as described above. The exposed portion is electrically and mechanically connected to the signal electrode 2 by the first brazing material 9a.

  The outer conductor 6 is a member made of a metal material such as copper and having a shape and dimensions such as to cover the main body 13 having a cylindrical shape in the lengthwise direction. For example, a penetrating portion (no reference numeral) corresponding to the main body 13 is provided. It is a block-shaped member having.

  At the end portion of the outer conductor 6 on the side surface side of the coaxial connector 10, there is provided a convex portion (outside the reference numeral as the convex portion) protruding outward from the side surface. This convex portion is electrically and mechanically connected to the ground electrode 3 of the wiring board 11 via the second brazing material 9b.

  In addition, the outer conductor 6, including this convex portion, is joined to the ground electrode 3 and the side surface ground electrode 7 via the second brazing material 9b as described above. In this case, a fillet can be formed on the second brazing filler metal 9b from the lower surface side of the convex portion to the side surface ground electrode 7. It is also possible to distribute the stress along this fillet. Therefore, the external conductor 6 having such a convex portion is advantageous for improving the connection strength between the wiring board 11 and the coaxial connector 10.

  The coaxial connector 10 can be manufactured, for example, by a method of combining (fitting) the main body 13, the inner conductor 5, and the outer conductor 6, which are separately prepared and have a predetermined shape and dimensions, with each other in a predetermined positional relationship.

  The first brazing material 9a that electrically connects the end of the signal electrode 2 and the inner conductor 5 of the coaxial connector 10 is made of an alloy material such as Sn, Ag, Au, or Cu as a main component.

  The second brazing material 9b electrically connecting the plurality of side surface ground electrodes 7 and the outer conductor 6 of the coaxial connector 10 is made of the same material as the first brazing material 9a.

  The signal electrode 2 and the ground electrode 3 of the wiring board 11 and the inner conductor 5 and the outer conductor 6 of the coaxial connector 10 are aligned so as to correspond to each other through the first brazing material 9a or the second brazing material 9b. Thereafter, by heating them in an electric furnace or oven and then cooling and solidifying them, an electronic device 12 in which the wiring board 11 and the coaxial connector 10 are electrically and mechanically connected to each other can be manufactured.

  FIG. 6A is an enlarged cross-sectional view of an essential part showing a modified example of FIG. 4A, and FIG. 6B is an enlarged cross-sectional view of an essential part showing a modified example of FIG. 4B. In these modifications, the plurality of side surface ground electrodes 7 project outward on the upper end side of the side surface of the insulating layer 1a and extend along the side surface of the insulating layer 1a. That is, the plurality of side surface ground electrodes 7 have a portion thicker than the thickness of the ground conductor 4 (main body portion located between layers), that is, a portion relatively thick.

  In this modification, the plurality of side surface ground electrodes 7 have an extension portion (extension portion is not denoted by reference numeral) extending along the side surface of the insulating layer 1a (that is, the side surface of the insulating substrate 1). . Since the surface area of the side surface ground electrode 7 is increased by the amount of the extension portion, the surface area of the side surface ground electrode 7 can be increased and the bonding area of the second brazing material 9b can be increased.

  Further, in the configuration in which the side surface ground electrode 7 has the extending portion, the extending portion is buried in the insulating substrate 1. It may be considered that the side surface of the insulating substrate 1 (insulating layer 1a) is curved inward at a position corresponding to the extending portion, and a part of the side surface ground electrode 7 is arranged so as to fill the curved portion. it can.

  When the extending portion of the side surface ground electrode 7 is buried in the insulating substrate 1 as described above, the mutual bonding area between the side surface ground electrode 7 and the insulating substrate 1 becomes larger. Therefore, the bonding strength between the side surface ground electrode 7 and the insulating substrate 1 is improved.

  In order to manufacture the wiring board 11 including the side ground electrode 7 having the above-described shape, for example, the following may be performed. That is, when the laminated body including the green sheet that is fired to become the insulating layer 1a and the metal paste that is fired to become the ground conductor 4 is cut, the end portion of the ground conductor 4 is cut. Due to the shearing stress at the time of this cutting, the metal paste can be spread along the side surface of the insulating layer 1a. That is, the extended portion can be provided in the side surface ground electrode 7 formed of this metal paste. At the same time, a part of the side surface ground electrode 7 (metal paste) can be embedded in the insulating layer 1a (ceramic green sheet) by this shear stress.

  The plurality of side surface ground electrodes 7 each have an extending portion, and these extending portions extend in the same direction on the side surface of the insulating substrate 1. As a result, the distance between the extending portion of one side surface ground electrode 7 and the other side surface ground electrodes 7 (including the extending portion) located above and below it is kept relatively short and constant. It will be easier. Therefore, it is possible to effectively reduce the possibility that the bonding strength between the second brazing material 9b and the plurality of side surface ground electrodes 7 varies.

  For extending the extension portions of the plurality of side surface ground electrodes 7 in the same direction on the side surface of the insulating substrate 1, for example, as described above, shear stress is applied in one direction to the end portion of the metal paste to be the ground conductor 4. It suffices to apply such stress.

  The length of the extension in the direction along the side surface of the insulating substrate 1 may be set to, for example, about 1/3 to 2/3 of the thickness of the insulating layer 1a. It should be noted that the extending direction of each of the plurality of side surface ground electrodes 7 should be prevented from approaching the signal electrode 2 in order to ensure electrical insulation from the signal electrode 2.

(Second embodiment)
FIG. 7A is an enlarged cross-sectional view of an essential part showing the wiring board 11 included in the electronic device 12 of the second embodiment of the present invention, and FIG. 7B is an electronic diagram of the second embodiment of the present invention. FIG. 4 is an enlarged cross-sectional view of a main part showing the device 12. 7, the same parts as those in FIGS. 1 to 5 are designated by the same reference numerals.

  8A is an enlarged plan view of a main part of the wiring board shown in FIG. 7A, and FIG. 8B is a side view of FIG. 8A.

  The electronic device 12 and the wiring board 11 included in the electronic device 12 according to the second embodiment include a plurality of side surface ground electrodes 7 that are vertically adjacent to each other in at least a part of the plurality of side surface ground electrodes 7. It further has a side surface covering electrode 8 which integrally covers the side surface of the insulating substrate 1. Further, the side surface covering electrode 8 is interposed between the side surface ground electrode 7 and the second brazing material 9b. The electronic device 12 and the wiring board 11 in the second embodiment are the same as the electronic device 12 and the wiring board 11 in the first embodiment except that the side surface covering electrode 8 is provided. A description of these similar points will be omitted.

  In the electronic device of the second embodiment, the side surface covering electrode 8 is formed between the end of the insulating substrate 1 and the coaxial connector 10 so as to surround the signal electrode 2 (end). Therefore, between the side surface of the insulating substrate 1 and the side surface of the coaxial connector 10, a space portion (gap) in which the second brazing material 9b is not interposed between the vertically adjacent side surface ground electrodes 7 is unlikely to occur. As a result, the electrical characteristics (high frequency characteristics) of the electronic device 12 can be improved.

  If the above-mentioned gap occurs, resonance may occur between the side surface of the insulating substrate 1 and the side surface of the coaxial connector 10, and transmission loss due to this resonance may occur. That is, in the electronic device 12 of the second embodiment, the possibility of transmission loss due to such resonance is reduced, which is also advantageous in improving electrical characteristics.

  9A is an enlarged cross-sectional view of an essential part showing a modified example of FIG. 7A, and FIG. 9B is an enlarged cross-sectional view of an essential part showing a modified example of FIG. 7B. In FIG. 9, the same parts as those in FIGS. 7 and 8 are designated by the same reference numerals.

  In the example shown in FIG. 9, in the electronic device 12 of the second embodiment as shown in FIGS. 7 and 8, for example, an extension portion similar to the modification of the electronic device 12 of the first embodiment described above is provided. It is an example.

  That is, in the electronic device 12 including the side surface covering electrode 8, the side surface ground electrode 7 has an extending portion (a relatively thick portion) extending along the side surface of the insulating substrate 1. Further, the extended portion has a portion buried in the side surface of the insulating substrate 1. Moreover, the plurality of extending portions extend in the same direction as each other. The entire side surface ground electrode 7 including the extended portion is covered with the side surface covering electrode 8.

  Also in this case, it is possible to obtain the effect of increasing the joint area between the second brazing material 9b and the side surface ground electrode 7 due to the side surface ground electrode 7 having the extending portion. Further, it is possible to obtain the effect of improving the bonding strength between the two by filling the extending portion with the insulating substrate 1. Further, it is possible to obtain the effect of reducing the variation in the bonding strength between the second brazing material 9b and the plurality of side surface ground electrodes 7. Further, since the joint area between the side surface covering electrode 8 and the side surface ground electrode 7 is increased by the extension of the side surface ground electrode 7, the strength of the joint between the side surface covering electrode 8 and the side surface ground electrode 7 is further improved. You can also let it.

  Further, since the side surface covering electrode 8 is formed, the possibility that resonance may occur between the side surface ground electrodes 7 vertically adjacent to each other between the side surface of the insulating substrate 1 and the side surface of the coaxial connector 10 is reduced. , Electrical characteristics can be improved.

  The electronic device of the present invention is not limited to the examples of the above embodiments, and various modifications can be made within the scope of the gist of the present invention. For example, a conductor layer such as the signal electrode 2 and the ground electrode 3 may be coated with a plating layer (not shown) such as a nickel plating layer and a gold plating layer on the exposed surface thereof. Further, such a plating layer may be applied to each of the wiring board 11 and the coaxial connector 10 before the electronic device 12 is manufactured.

  Further, at least one surface portion of the wiring board 11 and the coaxial connector 10 may be provided with a portion (not shown) such as a mark for fitting each other or a fitting portion of unevenness.

1 ... Insulating substrate 1a ... Insulating layer 2 ... Signal electrode 3 ... Ground electrode 4 ... Ground conductor 5 ... Inner conductor 6 ... Outer conductor 7 ... Side ground electrode 8 ... ..Side cover electrodes 9a..First brazing material 9b..Second brazing material
10 ... Coaxial connector
11 ... wiring board
12 ... Electronic device
13 ... Main body

Claims (4)

An insulating substrate including a plurality of insulating layers stacked on each other, a signal electrode disposed on the main surface of the insulating substrate, the signal electrode having an end located on the outer periphery of the main surface, the main surface of the insulating substrate, A ground electrode having ends arranged on both sides of the signal electrode and spaced apart from the signal electrode; and an end formed between layers of the plurality of insulating layers and located outside a side surface of the insulating substrate. A wiring board having a plurality of ground conductors each of which includes a side surface ground electrode,
A main body, an internal conductor provided inside the main body, and an external conductor provided on an outer surface of the main body, wherein the internal conductor is electrically connected to the signal electrode, and the external conductor is provided. A coaxial connector electrically connected to the ground electrode,
A first brazing material that connects the inner conductor of the coaxial connector and an end portion of the signal electrode, the end portion and multiple side ground electrode of the ground electrode and the outer conductor of the coaxial connector And a second brazing material connecting
From both sides of the signal electrode to the opposite side of the main surface of the insulating substrate in the thickness direction, the ground conductor and the insulating layer are alternately located in the thickness direction ,
The plurality of side surface ground electrodes each have an extending portion that protrudes outward on the upper end side of the side surface of the insulating layer and that extends along the side surface of the insulating layer. An electronic device characterized by being separated from each other . At least a part of the plurality of side surface ground electrodes further includes a side surface covering electrode that integrally covers a plurality of side surface ground electrodes vertically adjacent to each other and a side surface of the insulating substrate,
The electronic device according to claim 1, wherein the side surface covering electrode is interposed between the side surface grounding electrode and the second brazing material. The electronic device according to claim 1 or 2 , wherein the extending portion has a portion having a thickness larger than that of the ground conductor connected to the extending portion. Electronic device according to any one of claims 1 to 3, wherein the extending portion extends in the same direction in the side surface of the insulating substrate.

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