JP6595308B2 - Electronic component mounting substrate, electronic device and electronic module - Google Patents

Electronic component mounting substrate, electronic device and electronic module Download PDF

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JP6595308B2
JP6595308B2 JP2015224032A JP2015224032A JP6595308B2 JP 6595308 B2 JP6595308 B2 JP 6595308B2 JP 2015224032 A JP2015224032 A JP 2015224032A JP 2015224032 A JP2015224032 A JP 2015224032A JP 6595308 B2 JP6595308 B2 JP 6595308B2
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electronic component
recess
insulating substrate
electronic
substrate
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晃一 川崎
陽介 森山
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Kyocera Corp
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Description

本発明は、電子部品搭載用基板、電子装置および電子モジュールに関するものである。   The present invention relates to an electronic component mounting substrate, an electronic device, and an electronic module.

従来、絶縁基板の主面に電子部品および他の電子部品を搭載する配線基板および電子装置が知られている（例えば、特許文献１参照）。   Conventionally, a wiring board and an electronic device in which an electronic component and other electronic components are mounted on a main surface of an insulating substrate are known (see, for example, Patent Document 1).

特開2005−38406号公報JP 2005-38406 A

しかしながら、近年は、電子装置の小型化が求められている。絶縁基板が小さくなり、主面に搭載された電子部品および他の電子部品との間隔が狭くなりつつある。電子装置を作動させた際に、他の電子部品の熱が絶縁基板における電子部品の周囲に伝わり、または電子部品の熱が絶縁基板における他の電子部品の周囲に伝わり、電子部品搭載用基板と電子部品または他の電子部品との接合信頼性が低下したり、絶縁基板における電子部品の周囲が歪みやすくなり、電子部品が傾いてしまい、例えば電子部品が受光素子の場合に正常に受光できなくなることが懸念される。   However, in recent years, downsizing of electronic devices has been demanded. The insulating substrate is becoming smaller, and the distance between the electronic component mounted on the main surface and other electronic components is becoming narrower. When the electronic device is operated, the heat of other electronic components is transferred around the electronic components on the insulating substrate, or the heat of the electronic components is transferred around the other electronic components on the insulating substrate. Bonding reliability with the electronic component or other electronic components is reduced, or the periphery of the electronic component on the insulating substrate is easily distorted, and the electronic component is tilted. For example, when the electronic component is a light receiving element, it cannot receive light normally. There is concern.

本発明の一つの態様によれば、電子部品搭載用基板は、主面に開口し、電子部品を搭載する第１凹部および他の主面に開口し、他の電子部品を搭載する第２凹部を有する絶縁基板を有し、前記第１凹部の底面が前記他の主面側に設けられ、前記第２凹部の底面が前記主面側に設けられており、平面透視において、前記第２凹部よりも大きく、前記第２凹部が収まるように前記主面に配置された配線導体を有している。
According to one aspect of the present invention, the electronic component mounting substrate has an opening in the main surface, the first recess for mounting the electronic component, and the second recess in which the other electronic component is mounted. have a dielectric substrate having the bottom surface of the first recess is found provided on the other main surface, a bottom surface of said second recess is provided on the main surface side, in a plan perspective, said second The wiring conductor is larger than the recess and is disposed on the main surface so that the second recess is accommodated .

本発明の一つの態様によれば、電子装置は、上記構成の電子部品搭載用基板と、前記第１凹部に搭載された電子部品と、前記第２凹部に搭載された他の電子部品とを有する。   According to one aspect of the present invention, an electronic device includes an electronic component mounting board having the above-described configuration, an electronic component mounted in the first recess, and another electronic component mounted in the second recess. Have.

本発明の一つの態様によれば、電子モジュールは、接続パッドを有するモジュール用基板と、前記接続パッドにはんだを介して接続された上記構成の電子装置とを有する。   According to one aspect of the present invention, an electronic module includes a module substrate having a connection pad, and the electronic device configured as described above connected to the connection pad via solder.

本発明の一つの態様による電子部品搭載用基板において、主面に開口し、電子部品を搭載する第１凹部および他の主面に開口し、他の電子部品を搭載する第２凹部を有する絶縁基板を有し、第１凹部の底面が他の主面側に設けられ、第２凹部の底面が主面側に設けられており、平面透視において、第２凹部よりも大きく、第２凹部が収まるように主面に配置された配線導体を有している。上記構成により、絶縁基板における、電子部品を搭載する第１凹部の底面と、他の電子部品を搭載する第２凹部の底面との間の伝熱経路が実質的に長くなり、電子装置を作動させた際に、他の電子部品の熱が絶縁基板における電子部品の周囲に伝わるのを抑制し、または電子部品の熱が絶縁基板における他の電子部品の周囲に伝わるのを抑制し、電子部品搭載用基板と電子部品または他の電子部品との接合信頼性が低下するのを抑制することができる。また、電子装置を作動させた際に、絶縁基板における電子部品の周囲が歪みやすくなり、電子部品が傾くのを抑制し、例えば電子部品が受光素子の場合に良好に受光することができる。 In an electronic component mounting board according to one aspect of the present invention, an insulation having an opening on a main surface, a first recess for mounting an electronic component, and an opening on another main surface and a second recess for mounting another electronic component. have a substrate, the bottom surface of the first recess is al provided the other main surface, a bottom surface of the second recess is provided on the main surface side, in a plan perspective, larger than the second recess, the second recess Has a wiring conductor arranged on the main surface so as to fit . With the above configuration, the heat transfer path between the bottom surface of the first recess for mounting the electronic component and the bottom surface of the second recess for mounting the other electronic component on the insulating substrate is substantially lengthened, and the electronic device is activated. Suppresses the heat of other electronic components from being transmitted to the periphery of the electronic components on the insulating substrate, or suppresses the heat of the electronic components from being transmitted to the periphery of the other electronic components on the insulating substrate. It can suppress that the joint reliability of a mounting board | substrate and an electronic component or another electronic component falls. In addition, when the electronic device is operated, the periphery of the electronic component on the insulating substrate is easily distorted, and the electronic component is prevented from being tilted. For example, when the electronic component is a light receiving element, light can be received well.

本発明の一つの態様による電子装置において、上記構成の電子装置において、上記構成
の電子部品搭載用基板と、第１凹部に搭載された電子部品と、第２凹部に搭載された他の電子部品とを有することによって、長期信頼性に優れた電子装置とすることができる。 In the electronic device according to one aspect of the present invention, in the electronic device having the above configuration, the electronic component mounting substrate having the above configuration, the electronic component mounted in the first recess, and the other electronic component mounted in the second recess. Thus, an electronic device with excellent long-term reliability can be obtained.

本発明の一つの態様による電子モジュールにおいて、接続パッドを有するモジュール用基板と、接続パッドにはんだを介して接続された上記構成の電子装置とを有していることによって、長期信頼性に優れたものとすることができる。   The electronic module according to one aspect of the present invention has excellent long-term reliability by including the module substrate having connection pads and the electronic device having the above-described configuration connected to the connection pads via solder. Can be.

（ａ）は本発明の第１の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 1st Embodiment of this invention, (b) is a bottom view of (a). （ａ）は図１（ａ）に示した電子装置のＡ−Ａ線における縦断面図であり、（ｂ）はＢ−Ｂ線における縦断面図である。(A) is a longitudinal cross-sectional view in the AA line of the electronic device shown to Fig.1 (a), (b) is a longitudinal cross-sectional view in the BB line. 図１における電子装置をモジュール用基板に実装した電子モジュールを示す縦断面図である。It is a longitudinal cross-sectional view which shows the electronic module which mounted the electronic device in FIG. 1 on the board | substrate for modules. （ａ）は本発明の第２の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 2nd Embodiment of this invention, (b) is a bottom view of (a). （ａ）は図４（ａ）に示した電子装置のＡ−Ａ線における断面図であり、（ｂ）はＢ−Ｂ線における断面図である。(A) is sectional drawing in the AA line of the electronic device shown to Fig.4 (a), (b) is sectional drawing in BB line. （ａ）は本発明の第３の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 3rd Embodiment of this invention, (b) is a bottom view of (a). （ａ）は図６（ａ）に示した電子装置のＡ−Ａ線における断面図であり、（ｂ）はＢ−Ｂ線における断面図である。(A) is sectional drawing in the AA line of the electronic device shown to Fig.6 (a), (b) is sectional drawing in a BB line. （ａ）は本発明の第４の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 4th Embodiment of this invention, (b) is a bottom view of (a). （ａ）は図８（ａ）に示した電子装置のＡ−Ａ線における断面図であり、（ｂ）はＢ−Ｂ線における断面図である。(A) is sectional drawing in the AA line of the electronic device shown to Fig.8 (a), (b) is sectional drawing in a BB line.

本発明のいくつかの例示的な実施形態について、添付の図面を参照しつつ説明する。   Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

（第１の実施形態）
本発明の第１の実施形態における電子装置は、図１〜図３に示すように、電子部品搭載用基板１と、電子部品搭載用基板１の第１凹部12および第２凹部13に搭載された電子部品２（第１電子部品21および第２電子部品22）とを含んでいる。電子装置は、図３に示すように、例えば電子モジュールを構成するモジュール用基板５上にはんだ６を用いて接続される。 (First embodiment)
As shown in FIGS. 1 to 3, the electronic device according to the first embodiment of the present invention is mounted on the electronic component mounting substrate 1 and the first recess 12 and the second recess 13 of the electronic component mounting substrate 1. Electronic component 2 (first electronic component 21 and second electronic component 22). As shown in FIG. 3, the electronic device is connected to a module substrate 5 constituting an electronic module, for example, using solder 6.

本実施形態における電子部品搭載用基板１は、主面（下面）に開口し、電子部品（第１電子部品21）を搭載する第１凹部12および他の主面（上面）に開口し、他の電子部品（第２電子部品22）を搭載する第２凹部13を有する絶縁基板11を有している。第１凹部12の底面が他の主面側に設けられており、第２凹部13の底面が主面側に設けられている。電子部品搭載用基板１は、絶縁基板11の主面および内部に設けられた配線導体15を有している。図１〜図３において、電子部品搭載用基板１および電子装置は仮想のｘｙｚ空間におけるｘｙ平面に実装されている。図１〜図３において、上方向とは、仮想のｚ軸の正方向のことをいう。なお、以下の説明における上下の区別は便宜的なものであり、実際に電子部品搭載用基板１等が使用される際の上下を限定するものではない。   The electronic component mounting substrate 1 according to the present embodiment is opened in the main surface (lower surface), and is opened in the first recess 12 and the other main surface (upper surface) for mounting the electronic component (first electronic component 21). And an insulating substrate 11 having a second recess 13 for mounting the electronic component (second electronic component 22). The bottom surface of the first recess 12 is provided on the other main surface side, and the bottom surface of the second recess 13 is provided on the main surface side. The electronic component mounting substrate 1 has a wiring conductor 15 provided on the main surface and inside of the insulating substrate 11. 1 to 3, the electronic component mounting board 1 and the electronic device are mounted on an xy plane in a virtual xyz space. 1-3, the upward direction refers to the positive direction of the virtual z-axis. In addition, the upper and lower distinction in the following description is for convenience, and does not limit the upper and lower when the electronic component mounting board 1 or the like is actually used.

絶縁基板11は、一方主面（図１〜図３では下面）および他方主面（図１〜図３では上面）と、側面とを有している。絶縁基板11は、複数の絶縁層からなり、一方主面に開口し、電子部品（第１電子部品21）を搭載する第１凹部12と、他方主面に開口し、他の電子部品
（第２電子部品22）を搭載する第２凹部13とを有しており、平面視すなわち主面に垂直な方向から見ると矩形の板状の形状を有している。絶縁基板11は電子部品２を支持するための支持体として機能し、第１凹部12の底面の搭載領域上および第２凹部13の底面の搭載領域上に、電子部品２がはんだバンプ、金バンプまたは導電性樹脂（異方性導電樹脂等）等の接続部材３を介して接着されて固定される。 The insulating substrate 11 has one main surface (the lower surface in FIGS. 1 to 3), the other main surface (the upper surface in FIGS. 1 to 3), and a side surface. The insulating substrate 11 is composed of a plurality of insulating layers, and is opened on one main surface, and is provided with a first recess 12 for mounting an electronic component (first electronic component 21), and is opened on the other main surface, and another electronic component (first 2 has a second recess 13 for mounting the electronic component 22), and has a rectangular plate shape when seen from a plan view, that is, from a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is solder bumps and gold bumps on the mounting region on the bottom surface of the first recess 12 and on the mounting region on the bottom surface of the second recess 13. Or it adhere | attaches and fixes through the connection members 3, such as conductive resin (anisotropic conductive resin etc.).

絶縁基板11は、例えば、酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，窒化珪素質焼結体、ムライト質焼結体またはガラスセラミックス焼結体等のセラミックスを用いることができる。絶縁基板11は、例えば酸化アルミニウム質焼結体である場合であれば、酸化アルミニウム（Ａｌ２Ｏ３），酸化珪素（ＳｉＯ２），酸化マグネシウム（ＭｇＯ），酸化カルシウム（ＣａＯ）等の原料粉末に適当な有機バインダーおよび溶剤等を添加混合して泥漿物を作製する。この泥漿物を、従来周知のドクターブレード法またはカレンダーロール法等を採用してシート状に成形することによってセラミックグリーンシートを作製する。次に、このセラミックグリーンシートに適当な打ち抜き加工を施すとともに、セラミックグリーンシートを複数枚積層して生成形体を形成し、この生成形体を高温（約1600℃）で焼成することによって絶縁基板11が製作される。 For the insulating substrate 11, for example, a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a silicon nitride sintered body, a mullite sintered body, or a glass ceramic sintered body is used. it can. If the insulating substrate 11 is an aluminum oxide sintered body, for example, a raw material powder such as aluminum oxide (Al 2 O 3 ), silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO), etc. A suitable organic binder, a solvent, etc. are added and mixed to prepare a slurry. A ceramic green sheet is produced by forming this mud into a sheet using a conventionally known doctor blade method or calendar roll method. Next, an appropriate punching process is performed on the ceramic green sheet, and a plurality of ceramic green sheets are laminated to form a generated shape, and the generated shape is fired at a high temperature (about 1600 ° C.), whereby the insulating substrate 11 is formed. Produced.

第１凹部12は、絶縁基板11の一方主面に設けられている。第１凹部12は、底面に第１電子部品21を搭載するためのものである。第１凹部12の底面には、第１電子部品21と電気的に接続するための配線導体15が導出している。第２凹部13は、絶縁基板11の他方主面に設けられている。第２凹部13は、底面に第２電子部品22を搭載するためのものである。第２凹部13の底面には、第２電子部品22と電気的に接続するための配線導体15が導出している。第１凹部12の底面は、縦断面視において、第２凹部13の底面よりも、絶縁基板11の他方主面側に設けられている。第１凹部12と第２凹部13とは、平面透視において、互いに重ならないように配置されている。第２凹部13の底面は、縦断面視において、第１凹部12の底面よりも、絶縁基板11の一方主面側に設けられている。第２凹部13は、図１に示す例では、絶縁基板11の他方主面に、４つの第２凹部13が設けられており、４つの第２凹部13は、平面透視にて、第１凹部12を取り囲むように配置されている。第２凹部13は、平面透視において、第１凹部12よりも小さく形成されており、第２凹部13には、第１電子部品21よりも小型の第２電子部品22が搭載される。第１凹部12および第２凹部13は、図１〜図３に示す例では、平面視にて、角部が円弧状の矩形状としているが、平面視にて、多角形状、円形状、その他の形状であっても構わない。なお、絶縁基板11が、平面視にて矩形状としていると、小型の電子部品搭載用基板１を形成しやすい。   The first recess 12 is provided on one main surface of the insulating substrate 11. The first recess 12 is for mounting the first electronic component 21 on the bottom surface. A wiring conductor 15 for electrical connection with the first electronic component 21 is led out to the bottom surface of the first recess 12. The second recess 13 is provided on the other main surface of the insulating substrate 11. The second recess 13 is for mounting the second electronic component 22 on the bottom surface. A wiring conductor 15 for electrical connection with the second electronic component 22 is led out to the bottom surface of the second recess 13. The bottom surface of the first recess 12 is provided closer to the other main surface of the insulating substrate 11 than the bottom surface of the second recess 13 in the longitudinal sectional view. The first concave portion 12 and the second concave portion 13 are arranged so as not to overlap each other in plan perspective. The bottom surface of the second recess 13 is provided on the one main surface side of the insulating substrate 11 with respect to the bottom surface of the first recess 12 in the longitudinal sectional view. In the example shown in FIG. 1, the second recesses 13 are provided with four second recesses 13 on the other main surface of the insulating substrate 11, and the four second recesses 13 are first recesses in plan perspective. It is arranged so as to surround 12. The second recess 13 is formed to be smaller than the first recess 12 in a plan view, and a second electronic component 22 smaller than the first electronic component 21 is mounted in the second recess 13. In the example shown in FIGS. 1 to 3, the first concave portion 12 and the second concave portion 13 have a rectangular shape with a corner having an arc shape in a plan view. It may be a shape. If the insulating substrate 11 is rectangular in plan view, a small electronic component mounting substrate 1 can be easily formed.

第１凹部12および第２凹部13は、例えば、絶縁基板11用のセラミックグリーンシートのいくつかにレーザー加工や金型による打ち抜き加工等によって、第１凹部12または第２凹部13となる貫通孔をそれぞれのセラミックグリーンシートに形成し、このセラミックグリーンシートを、貫通孔を形成していない他のセラミックグリーンシートに積層することで形成できる。   For example, the first recess 12 and the second recess 13 have through-holes that become the first recess 12 or the second recess 13 formed on some of the ceramic green sheets for the insulating substrate 11 by laser processing, punching with a mold, or the like. It can be formed by forming each ceramic green sheet and laminating this ceramic green sheet on another ceramic green sheet in which no through hole is formed.

配線導体15は、絶縁基板11の主面および内部に設けられている。配線導体15は、外部電極12とともに、電子部品搭載用基板１に搭載された電子部品２とモジュール用基板５とを電気的に接続するためのものである。配線導体15は、絶縁基板11の表面または内部に設けられた配線導体15と、絶縁基板11を構成する絶縁層を貫通して上下に位置する配線導体15同士を電気的に接続する貫通導体とを含んでいる。   The wiring conductor 15 is provided on the main surface and inside of the insulating substrate 11. The wiring conductor 15 is for electrically connecting the electronic component 2 mounted on the electronic component mounting substrate 1 and the module substrate 5 together with the external electrode 12. The wiring conductor 15 includes a wiring conductor 15 provided on the surface or inside of the insulating substrate 11, and a through conductor that electrically connects the wiring conductors 15 positioned vertically through the insulating layer constituting the insulating substrate 11. Is included.

配線導体15は、例えばタングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ）または銅（Ｃｕ）等を主成分とする金属粉末メタライズである。例えば、絶縁基板11が酸化アルミニウム質焼結体から成る場合であれば、Ｗ，ＭｏまたはＭｎ等の高融点金属粉末に適当な有機バインダーおよび溶媒等を添加混合して得たメタライズペースト
を、絶縁基板11用のセラミックグリーンシートに予めスクリーン印刷法によって所定のパターンに印刷塗布して、絶縁基板11用のセラミックグリーンシートと同時に焼成することによって、絶縁基板11の所定位置に被着形成される。配線導体15は、例えば、絶縁基板11用のセラミックグリーンシートに配線導体15用のメタライズペーストをスクリーン印刷法等の印刷手段によって印刷塗布し、絶縁基板11用のセラミックグリーンシートとともに焼成することによって形成される。また、配線導体15が貫通導体である場合は、例えば、絶縁基板11用のセラミックグリーンシートに金型またはパンチングによる打ち抜き加工またはレーザー加工等の加工方法によって貫通導体用の貫通孔を形成し、この貫通孔に貫通導体用のメタライズペーストを上記印刷手段によって充填しておき、絶縁基板11用のセラミックグリーンシートとともに焼成することによって形成される。メタライズペーストは、上述の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、絶縁基板11との接合強度を高めるために、ガラス粉末、セラミック粉末を含んでいても構わない。 The wiring conductor 15 is a metal powder metallization mainly composed of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like. For example, if the insulating substrate 11 is made of an aluminum oxide sintered body, a metallized paste obtained by adding and mixing a suitable organic binder and solvent to a refractory metal powder such as W, Mo or Mn is insulated. The ceramic green sheet for the substrate 11 is preliminarily printed and applied in a predetermined pattern by a screen printing method, and is fired at the same time as the ceramic green sheet for the insulating substrate 11 to be deposited on a predetermined position of the insulating substrate 11. The wiring conductor 15 is formed by, for example, printing and applying a metallized paste for the wiring conductor 15 on a ceramic green sheet for the insulating substrate 11 by printing means such as a screen printing method, and baking together with the ceramic green sheet for the insulating substrate 11. Is done. Further, when the wiring conductor 15 is a through conductor, for example, a through hole for the through conductor is formed in the ceramic green sheet for the insulating substrate 11 by a die or punching process by punching or a processing method such as laser processing. It is formed by filling the through hole with a metallized paste for through conductor by the above printing means and firing it with the ceramic green sheet for the insulating substrate 11. The metallized paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to the above metal powder and kneading. In order to increase the bonding strength with the insulating substrate 11, glass powder or ceramic powder may be included.

配線導体15の絶縁基板11から露出する表面には、電気めっき法または無電解めっき法によって金属めっき層が被着される。金属めっき層は、ニッケル，銅，金または銀等の耐食性および接続部材３との接続性に優れる金属から成るものであり、例えば厚さ0.5〜５μ
ｍ程度のニッケルめっき層と0.1〜３μｍ程度の金めっき層とが、あるいは厚さ１〜10μ
ｍ程度のニッケルめっき層と0.1〜１μｍ程度の銀めっき層とが、順次被着される。これ
によって、配線導体15が腐食することを効果的に抑制できるとともに、配線導体15と電子部品２との固着および配線導体15とボンディングワイヤ等の接続部材３との接合、ならびに配線導体15とモジュール用基板５に形成された接続用の接続パッド51との接合を強固にできる。 A metal plating layer is applied to the surface of the wiring conductor 15 exposed from the insulating substrate 11 by electroplating or electroless plating. The metal plating layer is made of a metal excellent in corrosion resistance such as nickel, copper, gold or silver and connectivity with the connection member 3, and has a thickness of 0.5 to 5 μm, for example.
m nickel plating layer and 0.1-3 μm gold plating layer, or thickness 1-10 μm
A nickel plating layer of about m and a silver plating layer of about 0.1 to 1 μm are sequentially deposited. As a result, corrosion of the wiring conductor 15 can be effectively suppressed, the wiring conductor 15 and the electronic component 2 are fixed, the wiring conductor 15 is bonded to the connection member 3 such as a bonding wire, and the wiring conductor 15 and the module. The bonding with the connection pad 51 formed on the substrate 5 can be strengthened.

また、金属めっき層は、ニッケルめっき層／金めっき層に限られるものではなく、ニッケルめっき層／金めっき層／銀めっき層、あるいはニッケルめっき層／パラジウムめっき層／金めっき層等を含むその他の金属めっき層であっても構わない。   In addition, the metal plating layer is not limited to the nickel plating layer / gold plating layer, but may include nickel plating layer / gold plating layer / silver plating layer or other nickel plating layer / palladium plating layer / gold plating layer. It may be a metal plating layer.

また、電子部品２が搭載される配線導体15上では、例えば上述のニッケルめっき層と金めっき層の下地層に、例えば、厚さ10〜80μｍ程度の銅めっき層を金属めっき層として被着させておくことにより、電子部品２の熱を銅めっき層を介して電子部品搭載用基板１側に良好に放熱させやすくしてもよい。   Further, on the wiring conductor 15 on which the electronic component 2 is mounted, for example, a copper plating layer having a thickness of, for example, about 10 to 80 μm is deposited as a metal plating layer on the above-described nickel plating layer and gold plating layer. Thus, the heat of the electronic component 2 may be easily radiated to the electronic component mounting substrate 1 side through the copper plating layer.

電子部品搭載用基板１の第１凹部12の底面に第１電子部品21を搭載し、電子部品搭載用基板１の第２凹部13の底面に第２電子部品22を搭載することによって、電子装置を作製できる。電子部品搭載用基板１に搭載される第１電子部品21は、受光素子、撮像素子、発光素子、ＩＣチップまたはＬＳＩチップ等の半導体素子等であり、第２電子部品22は、発光素子、抵抗素子、容量素子、ツェナーダイオード等である。例えば、第１電子部品21として、受光素子が用いられる場合、第２電子部品22として、発光素子が用いられる。第１電子部品21として、例えば、光学素子が用いられる場合、図１および図２に示す例のように、第１凹部12の底面に、絶縁基板11の他方主面と第１凹部12の底面とを貫通する開口部14が設けられる。光学素子は、受光面を開口部14側に向けて第１凹部12に搭載されており、第１凹部12に搭載された光学素子に外部の光が開口部14を介して入射して受光されるようにしている。開口部14は、凹部と同様に、絶縁基板11用のセラミックグリーンシートのいくつかにレーザー加工や金型による打ち抜き加工等によって、開口部14となる貫通孔をセラミックグリーンシートに形成しておくことにより形成できる。例えば電子部品２がフリップチップ型の半導体素子である場合には、半導体素子は、はんだバンプ、金バンプまたは導電性樹脂（異方性導電樹脂等）等の接続部材３を介して、半導体素子の電極と配線導体15とが電気的および機械的に接続されることによって電子部品搭載用基板１に搭載される。また、例えば、電子部品２がワイヤボンディング型の半導体素子である場合には、半
導体素子は、低融点ろう材または導電性樹脂等の接合部材によって、配線導体15上に固定された後、ボンディングワイヤ等の接続部材３を介して半導体素子の電極と配線導体15とが電気的に接続されることによって電子部品搭載用基板１に搭載される。これにより、電子部品２は外部電極12に電気的に接続される。また、電子部品２は必要に応じて、樹脂またはガラス等からなる封止材を用いて、樹脂、ガラス、セラミックスまたは金属等からなる蓋体等により封止される。 By mounting the first electronic component 21 on the bottom surface of the first recess 12 of the electronic component mounting substrate 1 and mounting the second electronic component 22 on the bottom surface of the second recess 13 of the electronic component mounting substrate 1, an electronic device is obtained. Can be produced. The first electronic component 21 mounted on the electronic component mounting substrate 1 is a light receiving element, an imaging element, a light emitting element, a semiconductor element such as an IC chip or an LSI chip, and the second electronic component 22 is a light emitting element, a resistor, or the like. An element, a capacitive element, a Zener diode, or the like. For example, when a light receiving element is used as the first electronic component 21, a light emitting element is used as the second electronic component 22. For example, when an optical element is used as the first electronic component 21, the other main surface of the insulating substrate 11 and the bottom surface of the first recess 12 are formed on the bottom surface of the first recess 12 as in the example shown in FIGS. Are provided. The optical element is mounted in the first recess 12 with the light receiving surface facing the opening 14, and external light enters the optical element mounted in the first recess 12 through the opening 14 and is received. I try to do it. As in the case of the recess, the opening 14 has through-holes to be the opening 14 formed in the ceramic green sheet by laser processing or punching with a mold in some ceramic green sheets for the insulating substrate 11. Can be formed. For example, when the electronic component 2 is a flip-chip type semiconductor element, the semiconductor element is connected to the semiconductor element via a connection member 3 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin or the like). The electrode and the wiring conductor 15 are mounted on the electronic component mounting board 1 by being electrically and mechanically connected. For example, when the electronic component 2 is a wire bonding type semiconductor element, the semiconductor element is fixed on the wiring conductor 15 by a bonding member such as a low melting point brazing material or a conductive resin, and then bonded to the bonding wire. The electrode of the semiconductor element and the wiring conductor 15 are electrically connected via the connecting member 3 such as the electronic component mounting board 1. Thereby, the electronic component 2 is electrically connected to the external electrode 12. Moreover, the electronic component 2 is sealed with a lid made of resin, glass, ceramics, metal, or the like, using a sealing material made of resin, glass, or the like, if necessary.

本実施形態の電子装置の配線導体15が、図３に示すように、図３に示すように、モジュール用基板５の接続パッド51にはんだ６を介して接続されて、電子モジュールとなる。   As shown in FIG. 3, the wiring conductor 15 of the electronic device of this embodiment is connected to the connection pad 51 of the module substrate 5 via the solder 6 as shown in FIG.

また、配線導体15が、図１に示す例のように、平面透視において、第２凹部13よりも大きく、第２凹部13と重なるように絶縁基板11の一方主面に配置されていると、電子装置を作動させた際に、第２凹部13に搭載された第２電子部品22の熱を配線導体15を介して、モジュール用基板５側に伝わりやすくすることができ、第２電子部品22の絶縁基板11における第１凹部12側への伝熱、すなわち、第１電子部品21側への伝熱を抑制することができる。   In addition, when the wiring conductor 15 is arranged on one main surface of the insulating substrate 11 so as to be larger than the second concave portion 13 and overlap the second concave portion 13 in a plan view as shown in the example shown in FIG. When the electronic device is operated, the heat of the second electronic component 22 mounted in the second recess 13 can be easily transmitted to the module substrate 5 side via the wiring conductor 15. Heat transfer to the first recess 12 side in the insulating substrate 11, that is, heat transfer to the first electronic component 21 side can be suppressed.

また、電子装置を作動させた際に発生する第２電子部品22の熱を、モジュール用基板５へ伝わりやすいものとしており、絶縁基板11の下面と第２凹部13の底面との間における絶縁基板11の厚みが小さいため、モジュール用基板５への伝熱をより良好なものとすることができ、熱による絶縁基板11の歪みにより第２凹部13における底面と側壁との間に亀裂が生じることを抑制することができるので、薄型の電子部品搭載用基板１として有効である。   Further, the heat of the second electronic component 22 generated when the electronic device is operated is easily transferred to the module substrate 5, and the insulating substrate between the lower surface of the insulating substrate 11 and the bottom surface of the second recess 13. Since the thickness of 11 is small, heat transfer to the module substrate 5 can be improved, and a crack is generated between the bottom surface and the side wall of the second recess 13 due to distortion of the insulating substrate 11 due to heat. Therefore, it is effective as a thin electronic component mounting substrate 1.

また、第２凹部13の底面と絶縁基板11の一方主面に設けられた配線導体15との間隔が、第１凹部12の底面と第２凹部13の底面との間隔よりも小さいと、第２凹部13に搭載された第２電子部品22の熱を配線導体15を介して、モジュール用基板５に伝わりやすくし、第１凹部12側への伝熱を抑制することができる。第２凹部13の底面と絶縁基板11の一方主面に設けられた配線導体15との間隔は、第１凹部12の底面と第２凹部13の底面との間隔の１／２以下であることがより好ましい。   Further, if the distance between the bottom surface of the second recess 13 and the wiring conductor 15 provided on one main surface of the insulating substrate 11 is smaller than the distance between the bottom surface of the first recess 12 and the bottom surface of the second recess 13, 2 Heat of the second electronic component 22 mounted in the recess 13 can be easily transferred to the module substrate 5 through the wiring conductor 15, and heat transfer to the first recess 12 side can be suppressed. The distance between the bottom surface of the second recess 13 and the wiring conductor 15 provided on one main surface of the insulating substrate 11 is not more than ½ of the distance between the bottom surface of the first recess 12 and the bottom surface of the second recess 13. Is more preferable.

本実施形態の電子部品搭載用基板１は、主面に開口し、電子部品（第１電子部品21）を搭載する第１凹部12および他の主面に開口し、他の電子部品（第２電子部品22）を搭載する第２凹部13を有する絶縁基板11を有しており、第１凹部12の底面が他の主面側に設けられており、第２凹部13の底面が主面側に設けられている。上記構成により、絶縁基板11における、電子部品（第１電子部品21）を搭載する第１凹部12の底面と、他の電子部品（第２電子部品22）を搭載する第２凹部13の底面との間の伝熱経路が実質的に長くなり、電子装置を作動させた際に、他の電子部品の熱が絶縁基板11における電子部品の周囲に伝わるのを抑制し、電子部品搭載用基板１と電子部品との接合信頼性が低下するのを抑制することができる。また、電子装置を作動させた際に、絶縁基板11における電子部品の周囲が歪みやすくなり、電子部品が傾くのを抑制し、例えば電子部品が受光素子の場合に良好に受光することができる。   The electronic component mounting board 1 of the present embodiment is opened in the main surface, opened in the first recess 12 for mounting the electronic component (first electronic component 21) and other main surfaces, and other electronic components (second It has an insulating substrate 11 having a second recess 13 for mounting an electronic component 22), the bottom surface of the first recess 12 is provided on the other main surface side, and the bottom surface of the second recess 13 is the main surface side. Is provided. With the above configuration, the bottom surface of the first recess 12 in which the electronic component (first electronic component 21) is mounted and the bottom surface of the second recess 13 in which another electronic component (second electronic component 22) is mounted in the insulating substrate 11 When the electronic device is operated, the heat of other electronic components is prevented from being transferred to the periphery of the electronic components in the insulating substrate 11, and the electronic component mounting substrate 1 is It is possible to suppress a decrease in the bonding reliability between the electronic component and the electronic component. Further, when the electronic device is operated, the periphery of the electronic component on the insulating substrate 11 is easily distorted, and the electronic component is prevented from being tilted. For example, when the electronic component is a light receiving element, light can be received well.

また、第１電子部品21として、受光素子等の光学素子が用いられる場合、第２電子部品22から第１電子部品21周囲の絶縁基板11への伝熱が抑制され、受光素子等の光学素子にて外部の光を良好に受光することができる。   When an optical element such as a light receiving element is used as the first electronic component 21, heat transfer from the second electronic component 22 to the insulating substrate 11 around the first electronic component 21 is suppressed, and the optical element such as the light receiving element Can receive external light well.

本実施形態の電子装置は、上記構成の電子部品搭載用基板１と、第１凹部12に搭載された電子部品（第１電子部品21）と、第２凹部13に搭載された他の電子部品（第２電子部品22）とを有していることによって、長期信頼性に優れた電子装置とすることができる。   The electronic device according to the present embodiment includes the electronic component mounting substrate 1 having the above-described configuration, an electronic component (first electronic component 21) mounted in the first recess 12, and another electronic component mounted in the second recess 13. By having (second electronic component 22), it is possible to provide an electronic device having excellent long-term reliability.

本実施形態の電子モジュールは、接続パッド51を有するモジュール用基板５と、接続パッド51にはんだ６を介して接続された上記構成の電子装置とを有していることによって、長期信頼性に優れたものとすることができる。   The electronic module of the present embodiment has excellent long-term reliability by including the module substrate 5 having the connection pads 51 and the electronic device having the above-described configuration connected to the connection pads 51 via the solder 6. Can be.

本実施形態における電子部品搭載用基板１は、小型で高出力の電子装置において好適に使用することができ、電子部品搭載用基板１における接続信頼性を高めることができる。例えば、第１電子部品21として、受光素子が用いられ、第２電子部品22として、発光素子が用いられる小型の電子部品搭載用基板１として好適に用いることができる。   The electronic component mounting board 1 in the present embodiment can be suitably used in a small and high-power electronic device, and the connection reliability in the electronic component mounting board 1 can be enhanced. For example, a light receiving element can be used as the first electronic component 21, and the small electronic component mounting substrate 1 in which a light emitting element can be used as the second electronic component 22.

（第２の実施形態）
次に、本発明の第２の実施形態による電子装置について、図４および図５を参照しつつ説明する。 (Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS.

本発明の第２の実施形態における電子装置において、第１凹部12が絶縁基板11の中央部に設けられ、第２凹部13が絶縁基板11の角部に設けられている。   In the electronic device according to the second embodiment of the present invention, the first recess 12 is provided at the center of the insulating substrate 11, and the second recess 13 is provided at the corner of the insulating substrate 11.

本発明の第２の実施形態における電子部品搭載用基板１によれば、第１の実施形態の配線基板１と同様に、絶縁基板11における、電子部品（第１電子部品21）を搭載する第１凹部12の底面と、他の電子部品（第２電子部品22）を搭載する第２凹部22の底面との間の伝熱経路が実質的に長くなり、電子装置を作動させた際に、他の電子部品の熱が絶縁基板11における電子部品の周囲に伝わるのを抑制し、電子部品搭載用基板１と電子部品との接合信頼性が低下するのを抑制することができる。また、電子装置を作動させた際に、絶縁基板11における電子部品の周囲が歪みやすくなり、電子部品が傾くのを抑制し、例えば電子部品が受光素子の場合に良好に受光することができる。   According to the electronic component mounting substrate 1 in the second embodiment of the present invention, the electronic component (first electronic component 21) on the insulating substrate 11 is mounted in the same manner as the wiring substrate 1 in the first embodiment. 1 When the heat transfer path between the bottom surface of the recess 12 and the bottom surface of the second recess 22 on which another electronic component (second electronic component 22) is mounted becomes substantially long, It is possible to suppress the heat of other electronic components from being transmitted to the periphery of the electronic component in the insulating substrate 11, and to suppress the decrease in the bonding reliability between the electronic component mounting substrate 1 and the electronic component. Further, when the electronic device is operated, the periphery of the electronic component on the insulating substrate 11 is easily distorted, and the electronic component is prevented from being tilted. For example, when the electronic component is a light receiving element, light can be received well.

第２の実施形態における電子部品搭載用基板１によれば、絶縁基板11は平面視で矩形状であり、平面透視において、第１凹部12は絶縁基板11の中央部に設けられ、第２凹部13は絶縁基板11の角部に設けられていることから、第１の実施形態の電子部品搭載用基板１と比較して、絶縁基板11の角部を広い領域とすることができ、第２凹部13を絶縁基板11の角部の広い領域に設けることができるので、第１凹部12と第２凹部13との間隔を広くし、第２電子部品22の熱が第１電子部品21側に伝熱するのを抑制することができるとともに、第１凹部12と第２凹部13との間の絶縁基板11の厚みが大きくなり、絶縁基板11に生じる歪みを抑制することができる。   According to the electronic component mounting substrate 1 of the second embodiment, the insulating substrate 11 is rectangular in plan view, and the first recess 12 is provided in the center of the insulating substrate 11 in plan view, and the second recess Since 13 is provided at the corner of the insulating substrate 11, the corner of the insulating substrate 11 can be widened compared to the electronic component mounting substrate 1 of the first embodiment. Since the concave portion 13 can be provided in a wide area of the corner of the insulating substrate 11, the distance between the first concave portion 12 and the second concave portion 13 is widened so that the heat of the second electronic component 22 is directed to the first electronic component 21 side. Heat transfer can be suppressed, and the thickness of the insulating substrate 11 between the first recess 12 and the second recess 13 can be increased, and distortion generated in the insulating substrate 11 can be suppressed.

第１凹部12は平面透視で矩形状であり、各隅部が絶縁基板11の角部に挟まれる位置に設けられていることから、絶縁基板11の角部の領域を良好に広くすることができ、第２凹部13を絶縁基板11の角部の広い領域に設けることができるので、第１凹部12と第２凹部13との間隔を広くし、電子装置を作動させた際に、第２電子部品22の熱が絶縁基板11における第１電子部品21側に伝わるのを抑制し、電子部品搭載用基板１と第１電子部品21との接合信頼性が低下するのを抑制することができる。また絶縁基板11における第１凹部12と第２凹部13との間の厚みが厚いものとなり、絶縁基板11に生じる歪みを抑制し、第１電子部品21が傾くのを抑制することができる。   The first recess 12 has a rectangular shape when seen in a plan view, and each corner is provided at a position sandwiched between the corners of the insulating substrate 11, so that the corner region of the insulating substrate 11 can be favorably widened. In addition, since the second recess 13 can be provided in a wide area of the corner of the insulating substrate 11, the second recess 13 and the second recess 13 are widened so that when the electronic device is operated, the second recess 13 is provided. It is possible to suppress the heat of the electronic component 22 from being transmitted to the first electronic component 21 side in the insulating substrate 11 and to suppress the decrease in the bonding reliability between the electronic component mounting substrate 1 and the first electronic component 21. . Moreover, the thickness between the 1st recessed part 12 and the 2nd recessed part 13 in the insulated substrate 11 becomes a thick thing, the distortion which arises in the insulated substrate 11 can be suppressed, and it can suppress that the 1st electronic component 21 inclines.

第１凹部12は平面透視で矩形状であり、第１凹部12における対角に位置する一組の隅部が、絶縁基板11の対向する一組の辺に対し垂直に交わる仮想直線11ａ上に設けられていることから、絶縁基板11の角部の領域を偏りなく広くすることができ、第２凹部13を絶縁基板11の角部の広い領域に設けることができるので、第１凹部12と第２凹部13との間隔を広くし、電子装置を作動させた際に、第２電子部品22の熱が絶縁基板11における第１電子部品21側に伝わるのを抑制することができ、電子部品搭載用基板１と電子部品との接合信頼
性が低下するのを抑制することができる。また、絶縁基板11における第１凹部12と第２凹部13との間の厚みが厚いものとなり、絶縁基板11に生じる歪みを抑制し、第１電子部品21が傾くのを抑制することができる。 The first recess 12 is rectangular in a plan view, and a pair of corners located diagonally in the first recess 12 is on a virtual straight line 11 a that intersects perpendicularly with a pair of opposing sides of the insulating substrate 11. Therefore, the corner region of the insulating substrate 11 can be widened without unevenness, and the second recess 13 can be provided in a wide region of the corner of the insulating substrate 11. When the distance between the second concave portion 13 is increased and the electronic device is operated, the heat of the second electronic component 22 can be suppressed from being transmitted to the first electronic component 21 side of the insulating substrate 11, and the electronic component can be suppressed. It can suppress that the joint reliability of the mounting substrate 1 and an electronic component falls. Moreover, the thickness between the 1st recessed part 12 and the 2nd recessed part 13 in the insulated substrate 11 becomes thick, can suppress the distortion which arises in the insulated substrate 11, and can suppress that the 1st electronic component 21 inclines.

第２の実施形態の電子部品搭載用基板１は、第１の実施形態と同様に、小型で高出力の電子装置において好適に使用することができ、電子部品搭載用基板１における接続信頼性を高めることができる。例えば、第１電子部品21として、受光素子が用いられ、第２電子部品22として、発光素子が用いられる小型の電子部品搭載用基板１として好適に用いることができる。   Similarly to the first embodiment, the electronic component mounting board 1 of the second embodiment can be suitably used in a small and high-power electronic device, and the connection reliability in the electronic component mounting board 1 can be improved. Can be increased. For example, a light receiving element can be used as the first electronic component 21, and the small electronic component mounting substrate 1 in which a light emitting element can be used as the second electronic component 22.

第２の実施形態の電子部品搭載用基板１は、上述の第１の実施形態の電子部品搭載用基板１と同様の製造方法を用いて製作することができる。   The electronic component mounting board 1 of the second embodiment can be manufactured using the same manufacturing method as the electronic component mounting board 1 of the first embodiment described above.

（第３の実施形態）
次に、本発明の第３の実施形態による電子装置について、図６および図７を参照しつつ説明する。 (Third embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described with reference to FIGS.

本発明の第３の実施形態における電子装置において、第１凹部12が絶縁基板11の中央部に設けられ、第２凹部13が絶縁基板11の角部に設けられており、第２凹部13における第１凹部12側の側面と、第１凹部12における第２凹部13側の側面とが平行である。   In the electronic device according to the third embodiment of the present invention, the first recess 12 is provided at the center of the insulating substrate 11, the second recess 13 is provided at the corner of the insulating substrate 11, and the second recess 13 The side surface on the first recess 12 side and the side surface on the second recess 13 side in the first recess 12 are parallel.

本発明の第３の実施形態における電子部品搭載用基板１によれば、第１の実施形態における電子部品搭載用基板１と同様に、絶縁基板11における、電子部品を搭載する第１凹部の底面と、他の電子部品を搭載する第２凹部の底面との間の伝熱経路が実質的に長くなり、電子装置を作動させた際に、他の電子部品の熱が絶縁基板11における電子部品の周囲に伝わるのを抑制し、電子部品搭載用基板１と電子部品との接合信頼性が低下するのを抑制することができる。また、電子装置を作動させた際に、絶縁基板11における電子部品の周囲が歪みやすくなり、電子部品が傾くのを抑制し、例えば電子部品が受光素子の場合に良好に受光することができる。   According to the electronic component mounting substrate 1 in the third embodiment of the present invention, as in the electronic component mounting substrate 1 in the first embodiment, the bottom surface of the first recess for mounting the electronic component in the insulating substrate 11. And the bottom surface of the second concave portion on which the other electronic component is mounted become substantially long, and when the electronic device is operated, the heat of the other electronic component is transferred to the electronic component on the insulating substrate 11. It is possible to suppress the transmission to the periphery of the electronic component and to suppress the decrease in the bonding reliability between the electronic component mounting substrate 1 and the electronic component. Further, when the electronic device is operated, the periphery of the electronic component on the insulating substrate 11 is easily distorted, and the electronic component is prevented from being tilted. For example, when the electronic component is a light receiving element, light can be received well.

また、第２凹部13における第１凹部12側の側面と、第１凹部12における第２凹部13側の側面とが平行であることにより、第１凹部12の隅部と第２凹部13の隅部とが対向していないので、第１凹部12と第２凹部13との間における絶縁基板11の厚みが局所的に小さくなることがなくなり、第１電子部品21または第２電子部品22の作動による生じる熱により、絶縁基板11における第１凹部12と第２凹部13との間に亀裂等が生じることを抑制することができる。   Further, since the side surface of the second recess 13 on the first recess 12 side and the side surface of the first recess 12 on the second recess 13 side are parallel, the corners of the first recess 12 and the corners of the second recess 13 are formed. The thickness of the insulating substrate 11 between the first concave portion 12 and the second concave portion 13 is not locally reduced, and the operation of the first electronic component 21 or the second electronic component 22 is not performed. It is possible to suppress the occurrence of cracks or the like between the first recess 12 and the second recess 13 in the insulating substrate 11 due to the heat generated by.

第３の実施形態の電子部品搭載用基板１は、第１の実施形態と同様に、小型で高出力の電子装置において好適に使用することができ、電子部品搭載用基板１における接続信頼性を高めることができる。例えば、第１電子部品21として、受光素子が用いられ、第２電子部品22として、発光素子が用いられる小型の電子部品搭載用基板１として好適に用いることができる。   Similarly to the first embodiment, the electronic component mounting board 1 of the third embodiment can be suitably used in a small and high-power electronic device, and the connection reliability in the electronic component mounting board 1 can be improved. Can be increased. For example, a light receiving element can be used as the first electronic component 21, and the small electronic component mounting substrate 1 in which a light emitting element can be used as the second electronic component 22.

第３の実施形態の電子部品搭載用基板１は、上述の第１の実施形態の電子部品搭載用基板１と同様の製造方法を用いて製作することができる。   The electronic component mounting substrate 1 of the third embodiment can be manufactured using the same manufacturing method as the electronic component mounting substrate 1 of the first embodiment described above.

（第４の実施形態）
次に、本発明の第４の実施形態による電子装置について、図８および図９を参照しつつ説明する。 (Fourth embodiment)
Next, an electronic device according to a fourth embodiment of the present invention will be described with reference to FIGS.

本発明の第４の実施形態における電子装置において、上記した第１の実施形態の電子装置と異なる点は、第２凹部13の底面に、絶縁基板11の一方主面（下面）と第２凹部13の底面とを貫通する開口部14が設けられる点、絶縁基板11の他方主面（上面）における第１凹部12の底面と重なる領域に、配線導体15が設けられている点である。   The electronic device according to the fourth embodiment of the present invention differs from the electronic device according to the first embodiment described above in that one main surface (lower surface) of the insulating substrate 11 and the second recess are formed on the bottom surface of the second recess 13. An opening 14 penetrating the bottom surface of 13 is provided, and a wiring conductor 15 is provided in a region overlapping the bottom surface of the first recess 12 on the other main surface (upper surface) of the insulating substrate 11.

本発明の第４の実施形態における電子部品搭載用基板１によれば、第１の実施形態における電子部品搭載用基板１と同様に、絶縁基板11における、電子部品を搭載する第１凹部の底面と、他の電子部品を搭載する第２凹部の底面との間の伝熱経路が実質的に長くなり、電子装置を作動させた際に、電子部品の熱が絶縁基板11における他の電子部品の周囲に伝わるのを抑制し、電子部品搭載用基板１と他の電子部品との接合信頼性が低下するのを抑制することができる。また、電子装置を作動させた際に、絶縁基板11における電子部品の周囲が歪みやすくなり、電子部品が傾くのを抑制し、例えば電子部品が受光素子の場合に良好に受光することができる。   According to the electronic component mounting substrate 1 in the fourth embodiment of the present invention, the bottom surface of the first recess in which the electronic component is mounted in the insulating substrate 11 as in the electronic component mounting substrate 1 in the first embodiment. And the bottom surface of the second concave portion on which the other electronic component is mounted become substantially long, and when the electronic device is operated, the heat of the electronic component is transferred to the other electronic component on the insulating substrate 11. It is possible to suppress the transmission to the periphery of the electronic component, and it is possible to suppress a decrease in the bonding reliability between the electronic component mounting substrate 1 and other electronic components. Further, when the electronic device is operated, the periphery of the electronic component on the insulating substrate 11 is easily distorted, and the electronic component is prevented from being tilted. For example, when the electronic component is a light receiving element, light can be received well.

また、配線導体15が、平面透視において、第１凹部12と重なり、第１凹部12を囲むように絶縁基板11の他方主面に配置されていると、電子装置を作動させた際に、第１凹部12に搭載された第１電子部品21の熱を配線導体15を介して、モジュール用基板５側に伝わりやすくすることができ、第１電子部品21の絶縁基板11における第２凹部13側への伝熱、すなわち、第２電子部品22側への伝熱を抑制することができる。   In addition, when the wiring conductor 15 is disposed on the other main surface of the insulating substrate 11 so as to overlap the first recess 12 and surround the first recess 12 in a plan view, when the electronic device is operated, The heat of the first electronic component 21 mounted in the first recess 12 can be easily transferred to the module substrate 5 side via the wiring conductor 15, and the second recess 13 side of the insulating substrate 11 of the first electronic component 21 can be made. Heat transfer to the side, that is, heat transfer to the second electronic component 22 side can be suppressed.

第４の実施形態の電子部品搭載用基板１は、第１の実施形態と同様に、小型で高出力の電子装置において好適に使用することができ、電子部品搭載用基板１における接続信頼性を高めることができる。例えば、第１電子部品21として、受光素子が用いられ、第２電子部品22として、発光素子が用いられる小型の電子部品搭載用基板１として好適に用いることができる。   Similar to the first embodiment, the electronic component mounting board 1 of the fourth embodiment can be suitably used in a small and high-power electronic device, and the connection reliability in the electronic component mounting board 1 is improved. Can be increased. For example, a light receiving element can be used as the first electronic component 21, and the small electronic component mounting substrate 1 in which a light emitting element can be used as the second electronic component 22.

第４の実施形態の電子部品搭載用基板１は、上述の第１の実施形態の電子部品搭載用基板１と同様の製造方法を用いて製作することができる。   The electronic component mounting substrate 1 of the fourth embodiment can be manufactured using the same manufacturing method as the electronic component mounting substrate 1 of the first embodiment described above.

本発明は、上述の実施の形態の例に限定されるものではなく、種々の変更は可能である。例えば、配線導体15は、絶縁基板11の側面と一方主面との間に切欠きが設けられており、切欠きの内面に配線導体15が延出された、いわゆるキャスタレーション導体を有していてもよい。   The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the wiring conductor 15 includes a so-called castoration conductor in which a notch is provided between the side surface of the insulating substrate 11 and one main surface, and the wiring conductor 15 extends to the inner surface of the notch. May be.

また、第１〜第４の実施形態における電子部品搭載用基板１は、第１凹部12および第２凹部13は、縦断面視において、側壁が垂直形状に形成しているが、第１凹部12または第２凹部13は、縦断面視において、側壁が、底面側よりも開口側が広くなるような階段状の凹部であっても構わない。また、第１凹部12または第２凹部13は、平面透視において、凹部の開口側の大きさが、凹部の底面側の大きさよりも小さい凹部であっても構わない。   Further, in the electronic component mounting substrate 1 in the first to fourth embodiments, the first recess 12 and the second recess 13 have vertical sidewalls in the longitudinal sectional view. Alternatively, the second recess 13 may be a step-like recess whose side wall is wider on the opening side than on the bottom side in a longitudinal sectional view. Further, the first recess 12 or the second recess 13 may be a recess whose size on the opening side of the recess is smaller than the size on the bottom surface side of the recess when seen in a plan view.

また、電子部品搭載用基板１は、多数個取り電子部品搭載用基板の形態で製作されていてもよい。   The electronic component mounting board 1 may be manufactured in the form of a multi-piece electronic component mounting board.

１・・・・電子部品搭載用基板
11・・・・絶縁基板
11ａ・・・仮想直線
12・・・・第１凹部
13・・・・第２凹部
14・・・・開口部
15・・・・配線導体
２・・・・電子部品
21・・・・第１電子部品
22・・・・第２電子部品
３・・・・接続部材
５・・・・モジュール用基板
51・・・・接続パッド
６・・・・はんだ 1 .... Electronic component mounting board
11 ... Insulating substrate
11a ... Virtual straight line
12 ··· First recess
13 ... Second recess
14 ... Opening
15 ... Wiring conductor 2 ... Electronic components
21 ... 1st electronic component
22 ... Second electronic component 3 ... Connection member 5 ... Module substrate
51 ... Connection pads 6 ... Solder

Claims (7)

主面に開口し、電子部品を搭載する第１凹部、および他の主面に開口し、他の電子部品を搭載する第２凹部を有する絶縁基板を有し、
前記第１凹部の底面が前記他の主面側に設けられ、
前記第２凹部の底面が前記主面側に設けられており、
平面透視において、前記第２凹部よりも大きく、前記第２凹部が収まるように前記主面に配置された配線導体を有していることを特徴とする電子部品搭載用基板。 Open to the major surface, a first recess for mounting the electronic components, and opened to the other main surface, it has a dielectric substrate having a second recess for mounting the other electronic components,
The bottom surface of the first recess is found provided on the other main surface,
A bottom surface of the second recess is provided on the main surface side ;
An electronic component mounting board comprising: a wiring conductor disposed on the main surface so as to be larger than the second recess and accommodated in the second recess, as seen in a plan view . 前記絶縁基板は平面視で矩形状であり、
平面透視において、前記第１凹部は前記絶縁基板の中央部に設けられ、前記第２凹部は前記絶縁基板の角部に設けられていることを特徴とする請求項１に記載の電子部品搭載用基板。 The insulating substrate is rectangular in plan view,
2. The electronic component mounting device according to claim 1, wherein the first concave portion is provided in a central portion of the insulating substrate and the second concave portion is provided in a corner portion of the insulating substrate when seen in a plan view. substrate. 前記第１凹部は平面透視で矩形状であり、各隅部が前記絶縁基板の前記角部に挟まれる位置に設けられていることを特徴とする請求項２に記載の電子部品搭載用基板。   3. The electronic component mounting board according to claim 2, wherein the first recess has a rectangular shape in a plan view, and each corner is provided at a position sandwiched between the corners of the insulating substrate. 前記第１凹部は平面透視で矩形状であり、前記第１凹部における対角に位置する一組の隅部が、前記絶縁基板の対向する一組の辺に対し垂直に交わる仮想直線上に設けられていることを特徴とする請求項２に記載の電子部品搭載用基板。   The first recess is rectangular in plan view, and a pair of corners located diagonally in the first recess is provided on an imaginary straight line that intersects perpendicularly with the opposing pair of sides of the insulating substrate. The electronic component mounting board according to claim 2, wherein the electronic component mounting board is provided. 前記第２凹部は平面透視で矩形状であり、
前記第２凹部における前記第１凹部側の側面と、前記第１凹部における前記第２凹部側の側面とが平行であることを特徴とする請求項３または請求項４に記載の電子部品搭載用基板。 The second recess is rectangular in plan view,
5. The electronic component mounting device according to claim 3, wherein a side surface of the second recess portion on the side of the first recess portion and a side surface of the first recess portion on the side of the second recess portion are parallel to each other. substrate. 請求項１乃至請求項５のいずれかに記載の電子部品搭載用基板と、
前記第１凹部に搭載された電子部品と、
前記第２凹部に搭載された他の電子部品とを有することを特徴とする電子装置。 An electronic component mounting substrate according to any one of claims 1 to 5,
An electronic component mounted in the first recess;
An electronic device comprising: another electronic component mounted in the second recess. 接続パッドを有するモジュール用基板と、
前記接続パッドにはんだを介して接続された請求項６に記載の電子装置とを有することを特徴とする電子モジュール。 A module substrate having connection pads;
An electronic module comprising: the electronic device according to claim 6 connected to the connection pad via solder.
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