JP6608236B2 - Marking device - Google Patents

Description

  The present invention relates to a marking device.

  The marking apparatus is an apparatus that prints (marks) a predetermined shape such as a character, a symbol, a figure, or a wiring pattern on a workpiece such as a semiconductor device, a liquid crystal display substrate, or an electronic component.

  As a specific marking device, a laser marking device for converging a laser beam with a predetermined dot diameter and irradiating the surface of the work piece in a two-dimensional direction to mark characters or figures on the surface of the work piece Has been proposed (for example, Patent Document 1).

  In addition, as a configuration of the laser marking device, a configuration in which one pulse laser beam irradiated from one laser unit is distributed to a plurality of optical paths for processing (for example, Patent Document 2) is also known.

  Furthermore, as a configuration of the laser marking device, a configuration in which the laser dot diameter is adjusted according to the distance from the convergent lens to the processing surface when laser printing is performed on a three-dimensional processing surface has been proposed (for example, Patent Document 3).

  On the other hand, the techniques disclosed in Patent Documents 1 to 3 have a problem that it is difficult to achieve both machining accuracy and shortening of work time.

  Specifically, in the techniques as shown in Patent Documents 1 and 3, as the dot diameter of the laser used for marking increases, the working time is shortened, but fine pattern drawing cannot be performed, resulting in poor processing accuracy. There was a problem. On the other hand, the smaller the dot diameter used for marking, the finer pattern drawing can be made, so that the processing accuracy is improved, but the processing time is long, so that it is difficult to shorten the working time.

  In addition, as shown in Patent Document 2, the technique of distributing and marking a plurality of laser beams from a single laser light source to a plurality of optical paths reduces the working time compared to the case of marking using only one optical path. However, there is a problem that the machining accuracy cannot be improved, and there is a problem that there is no change in the point that the machining accuracy and the shortening of the working time are in a trade-off relationship.

  In view of this, there has been proposed an apparatus that combines a plurality of laser units that perform drawing with different dot diameters and performs high-speed and fine marking (Patent Document 4).

JP 2005-66611 A JP-A-2005-74479 JP 2009-285693 A JP, 2015-160235, A

  The apparatus described in Patent Document 4 is useful in that it can simultaneously improve machining accuracy and shorten work time.

  On the other hand, in the apparatus described in Patent Document 4, if the drawing position accuracy of the plurality of laser units is not always constant, drawing leakage (gap) may occur in the patterns drawn by the respective laser units. Therefore, there has been a problem that complicated accuracy calibration work is required between the laser units.

  Furthermore, in the apparatus described in Patent Document 4, a plurality of laser units are required. However, when it is necessary to use only a laser unit having a smaller dot diameter because the pattern to be drawn is small, the dot diameter is large. Since the other laser unit is not used, the configuration becomes useless. For this reason, there is a problem that the apparatus configuration is complicated and expensive for the pattern to be drawn.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a marking device that can realize drawing at high speed and finely with a simple configuration.

In order to solve the above-described problem, one aspect of the present invention provides a marking apparatus that draws a predetermined drawing pattern in a marking area set on a workpiece. The first dot diameter and the first dot diameter are larger than the first dot diameter. A marking part for marking the workpiece with a second dot diameter having a small dot diameter, a variable part for changing the dot diameter of the marking part, and a pattern constituting a part of the drawing pattern, a pattern constituting a part of the first drawing pattern and the drawing pattern is drawn with one dot diameter, registers the second drawing pattern to be drawn in the second dot diameter, a partial drawing pattern registration unit, wherein An overlap amount setting unit for setting an overlap amount between the first drawing pattern and the second drawing pattern; and the first drawing with respect to an edge of the drawing pattern An offset amount setting unit configured to set an offset amount of an edge of the turn, and the first drawing pattern and the second drawing pattern are drawn on each other so as to overlap each other with respect to the workpiece. In the marking device, a drawing pattern is formed, and the second drawing pattern includes a contour pattern that fills an edge of the first drawing pattern .

  ADVANTAGE OF THE INVENTION According to this invention, the marking apparatus which can implement | achieve drawing at high speed and finely by simple structure can be provided.

It is a perspective view showing a schematic structure of marking device 1 concerning one embodiment of the present invention. 1 is a block diagram of a marking device 1 according to an embodiment of the present invention, in which a thick line indicates a connection by a dedicated line, a waveform line indicates a connection by communication, a thin line indicates a connection by an I / O (input / output) port, and a dotted line Means an analog line connection. It is sectional drawing of the film 100 which concerns on one Embodiment of this invention. It is a top view which shows the marking area 203 on the film 100 which concerns on one Embodiment of this invention. 3 is a perspective view showing a schematic configuration of a laser processing unit 3 and an actuator 71. FIG. 4 is a plan view showing an example of an overall drawing pattern 113 formed on a film 100. FIG. FIG. 7 is a plan view showing an example of an overall drawing pattern 113 formed on the film 100, and is an enlarged view of the vicinity of the wiring pattern 70 of FIG. FIG. 8 is a plan view illustrating an example of a first drawing pattern 115, corresponding to FIG. FIG. 8 is a plan view showing an example of a second drawing pattern 117, corresponding to FIG. It is a top view which shows the example of the whole drawing pattern 113, Comprising: The part drawn by the oblique line is the 1st drawing pattern 115, the part drawn by the dotted line is the 2nd drawing pattern 117, and the part drawn by the shading is the 1st An overlapping region 118 of the drawing pattern 115 and the second drawing pattern 117 is shown. FIG. 11 is an enlarged view of region A in FIG. 10, and also shows a first dot diameter 303 and a second dot diameter 304. FIG. 5 is a diagram showing a drawing pattern assuming that the entire region 310 is drawn as the first drawing pattern 115 and the dot diameter is drawn only as the first dot diameter 303; It is a figure which shows the example which formed the 2nd drawing pattern 117 with the pattern containing several rows. It is a flowchart which shows the procedure of marking using the marking apparatus. It is a detailed flowchart of S2 of FIG. It is a side view of the circumference | surroundings of the process table 21 of the marking apparatus 1 which concerns on one Embodiment of this invention, Comprising: It is a figure corresponding to each flow of FIG. It is a side view of the circumference | surroundings of the process table 21 of the marking apparatus 1 which concerns on one Embodiment of this invention, Comprising: It is a figure corresponding to each flow of FIG.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments suitable for the invention will be described in detail with reference to the drawings.

  First, the configuration of the marking device 1 according to the present embodiment will be described with reference to FIGS. 1 and 2.

  Here, as the marking apparatus 1, a laser marking apparatus that performs marking using a laser on the surface of a film 100 as a workpiece is illustrated.

  Specifically, the marking device 1 shown in FIG. 1 includes a laser processing unit 3 as a marking unit. Further, the apparatus PC7 shown in FIG. 2 operates together with a PLC (Programmable Logic Controller) 37 as a control apparatus that controls the marking.

  The laser processing unit 3 can perform marking on the film 100 with the first dot diameter 303 and the second dot diameter 304 that is smaller than the first dot diameter 303 (see FIG. 5).

  Among these, the apparatus PC 7 includes a control unit 6 and a storage unit 7a, and the storage unit 7a stores a storage area 12 that stores an overall drawing pattern 113 (see FIG. 6) that is information on the overall pattern shape to be marked, and a laser. The first partial storage area 14 that stores the first drawing pattern 115 (see FIG. 8) drawn by the processing unit 3 with the first dot diameter 303 and the second that the laser processing unit 3 draws with the second dot diameter 304. It has a second partial storage area 16 for storing the drawing pattern 117 (see FIG. 9). Thus, the first drawing pattern 115 and the second drawing pattern 117 generated from the entire drawing pattern 113 are registered in the storage unit 7a. For this reason, the apparatus PC 7 operates as a partial drawing pattern registration unit for registering the first drawing pattern 115 and the second drawing pattern 117.

  Furthermore, the apparatus PC 7 also operates as a contour column number setting unit that sets the number of columns of the contour pattern 120 (see FIG. 9) in the second drawing pattern 117.

  The apparatus PC 7 also operates as an overlap amount setting unit for setting the overlap amounts Vx and Vy (see FIG. 11) of the first drawing pattern 115 and the second drawing pattern 117, and the edge of the overall drawing pattern 113. It also operates as an offset amount setting unit that sets offset amounts Gx and Gy (see FIG. 11) of the edge of the first drawing pattern 115 with respect to 313.

  Thus, in this embodiment, since the apparatus PC7 performs the process of registering the entire drawing pattern 113 and generating the first drawing pattern 115 and the second drawing pattern 117 from the entire drawing pattern 113, the apparatus PC7 registers the entire drawing pattern. And a function as a partial drawing pattern generation unit.

  With reference to FIGS. 1-5, the structure of the marking apparatus 1 is demonstrated in detail.

  As shown in FIGS. 1 and 2, the marking device 1 includes an unwinder 11 that unwinds the film 100 and a winder 13 that winds the film 100 unwound from the unwinder 11.

  Here, as shown in FIG. 3, the film 100 is obtained by forming a metal layer 103 on a base material 101 such as a polymer film, and selectively irradiating laser on the metal layer 103 from the laser processing unit 3. Thus, the irradiated portion is removed to form a predetermined wiring pattern 70 (see FIG. 6).

  On the other hand, in the marking device 1, a processing table as a relative moving unit that holds and holds the marking area 203 (see FIG. 4) of the film 100 between the unwinder 11 and the winder 13 and below the film 100. 21 is provided. The processing table 21 is driven by the drive unit 23 in directions parallel to the transport direction of the film 100, + x and −x in FIG. 1, and + z and −z that are parallel to the normal direction of the surface of the film 100. It is possible to move in the direction.

  On the other hand, the processing table 21 has a movable distance in the + x and −x directions limited to the distance H in FIG. 1, and holding tables 25 for temporarily adsorbing and holding the film 100 at both ends of the movement limit. Is provided. The holding table 25 can be moved in the directions of + z and -z in FIG. 1 by an actuator (not shown).

  The processing table 21 adsorbs the film 100 at the time of marking, and moves along the film 100 when the film 100 is conveyed, thereby preventing the positional deviation of the film 100.

  When the processing table 21 reaches the movement limit due to the conveyance of the film 100, the film 100 is temporarily sucked by the holding table 25, and the processing table 21 is separated from the film 100 to the upstream side (unwinder 11 side). Return the processing table 21 to.

  In the marking device 1, the laser processing unit 3 may be fixed, or an XYθ stage or a UVW stage for position correction is provided so that the laser processing unit 3 can move in the horizontal (XY) direction with respect to the film 100. It may be configured to be relatively movable in the rotation (θ) direction with the Z direction as the rotation axis.

  Furthermore, the marking device 1 has a laser power meter 33 and a converter 35 for measuring the output of the laser.

  The device PC7 is a computer that drives and controls each component of the marking device 1. The device PC7 is provided with a monitor 8 and a keyboard 10 for operating the device PC7 as input / output devices. These input / output devices may be tablet-type input / output devices.

  In addition, the apparatus PC 7 controls the processing table 21, the unwinder 11, and the winder 13 to perform marking while moving the laser processing unit 3 relative to the film 100. It also has a function as a movement marking control unit that commands the device 11 and the winder 13 (via the PLC 37).

  Further, in the present embodiment, the devices PC7 and PLC 37 operate as a control device that controls marking. More specifically, the apparatus PC7 determines the laser processing conditions of the laser processing unit 3 (laser output, laser oscillation frequency, galvano scanning speed, transport speed of the processing table 21, transport distance of the processing table 21, conditions of the laser power meter 33, In addition to mainly setting the layout of the laser processing and processing instruction control related to the laser processing unit 3, it also plays a role of transmitting information (processing completion trigger) indicating that the processing is completed to the PLC 37.

  The PLC 37 controls the operation of the processing table 21, the operation of the holding table 25, the vacuum suction and the suction release control of the processing table 21 and the holding table 25, the operations of a dust collector, a laser chiller, a table nip, etc. (not shown). In addition to controlling the operation of the components other than the laser processing unit 3 such as control and control of the opening / closing operation of the mechanical shutter of the laser, the role of transmitting information (trigger) indicating that the operation control is completed to the apparatus PC7 Bear.

  The apparatus PC 7, the laser processing unit 3, the unwinder 11, the winder 13, the processing table 21, the holding table 25, and the laser power meter 33 (converter 35) are connected via a PLC (Programmable Logic Controller) 37. .

  Furthermore, the marking device 1 has an actuator 71 as a variable unit that changes the dot diameter of the laser irradiated from the laser processing unit 3.

  In addition, the area | region which marks at a time in the film 100 becomes the marking area 203 as shown, for example in FIG.

  In FIG. 1, the number of the laser processing units 3 is one, but two or more laser processing units 3 are arranged in a parallel direction (+ y, −y direction) with respect to the transport direction of the film 100 for marking. You may go.

  Here, with reference to FIG. 5, the outline of a structure and operation | movement of the laser processing part 3 and the actuator 71 is demonstrated.

  As shown in FIG. 5, the laser processing unit 3 is provided on a light source 51 for irradiating a laser such as a YAG (Yttrium Aluminum Garnet) laser, and on the optical path of the laser irradiated from the light source 51, and adjusts the dot diameter of the laser. Beam expander 53, corner mirrors 55 and 57 for changing the direction of the laser beam that has passed through beam expander 53, a Z scanner 59 that adjusts the focal point in the Z-axis direction of the laser incident from corner mirror 57, and objective lens 61 And an XY galvano scanner 63 that adjusts the X-axis and Y-axis direction coordinates of the light transmitted through the objective lens 61, and a laser processing unit PC39 that controls the operation of these components.

  The beam expander 53 includes a plurality of lenses 53a and 53b. An actuator 71 that moves the lens 53b relative to the lens 53a in the optical path direction (directions -y and + y in FIG. 5) is provided. It is provided on the lens 53b.

  The actuator 71 adjusts the distance L between the lens 53a and the lens 53b by moving the lens 53b relative to the lens 53a in the optical path direction. As a result, the dot diameter of the laser emitted from the light source 51 is set to either the first dot diameter 303 or the second dot diameter 304.

  At the time of marking, the laser processing unit 3 adjusts the laser beam irradiated with a predetermined output from the light source 51 to a predetermined dot diameter by the beam expander 53, and the Z scanner 59, the objective lens 61, and the XY galvano scanner 63. The position coordinates to be irradiated and the focal point at the position are adjusted, and a desired position on the film 100 is irradiated with the first dot diameter 303.

  The actuator 71 may be provided not on the lens 53b but on the lens 53a.

In the laser processing unit 3, an fθ lens can be used instead of the Z scanner 59 and the objective lens 61. In this case, the fθ lens is disposed between the XY galvano scanner 63 and the film 100 to adjust the focus in the Z-axis direction.
The above is the outline of the configuration and operation of the laser processing unit 3 and the actuator 71.

  Next, a marking procedure using the marking device 1 will be described with reference to FIGS.

  First, an example of the overall drawing pattern 113 formed on the film 100 in the following description will be described with reference to FIGS.

  As shown in FIG. 6, 16 wiring patterns 70 are provided in the entire drawing pattern 113 in the rectangular marking area 203.

  In the present embodiment, the first drawing pattern 115 and the second drawing pattern 117 constituting a part of the whole drawing pattern 113 are generated from the whole drawing pattern 113. Therefore, a method for generating the first drawing pattern 115 and the second drawing pattern 117 from the overall drawing pattern 113 will be described in detail with reference to FIGS.

  First, consider a case where there is an overall drawing pattern 113 as shown in FIG. 7 and the diameter of the first dot diameter 303 is D. In this case, the regions 305, 306, 307, and 309 that are smaller (narrower) than D cannot be drawn when the laser dot diameter is the first dot diameter 303. Therefore, the second drawing is performed with the second dot diameter 304. The drawing pattern 117 is set.

  Next, since the first dot diameter 303 is larger than the second dot diameter 304 in drawing, the laser dot diameter is larger, and a large area can be drawn at a higher speed, so that the first dot diameter 303 can be drawn. It is originally desirable that the region (region 310) is set as the first drawing pattern 115.

  On the other hand, in the present embodiment, the second drawing pattern 117 is set as a pattern having the contour pattern 120 that fills the edge 116 of the first drawing pattern 115. In other words, the edge portion 116 of the first drawing pattern 115 has a shape offset inward with respect to the edge portion 313 of the overall drawing pattern 113. On the other hand, the outer edge 114 (including the contour pattern 120) of the second drawing pattern 117 coincides with the edge 313 of the overall drawing pattern 113.

  When the first drawing pattern 115 and the second drawing pattern 117 are generated from the entire drawing pattern 113 of FIG. 7 according to the above criteria, the first drawing pattern 115 becomes the pattern shown in FIG. 8, and the second drawing pattern 117 is shown in FIG. It becomes the pattern shown.

  Further, when the first drawing pattern 115 and the second drawing pattern 117 are overlapped, an overlapping region 118 is generated as shown in FIGS. That is, the first drawing pattern 115 and the second drawing pattern 117 are drawn so as to overlap each other, whereby the entire drawing pattern 113 is formed on the film 100.

  As shown in FIG. 11, the overlap amount in the X direction in the first drawing pattern 115 and the second drawing pattern 117 is referred to as Vx, and the overlap amount in the Y direction is referred to as Vy. Further, the offset amount in the X direction from the edge portion of the first drawing pattern 115 with respect to the edge portion 313 of the overall drawing pattern 113 is referred to as Gx, and the offset amount in the Y direction is referred to as Gy.

  Here, the edge of the first drawing pattern 115 is set as the contour pattern 120 of the second drawing pattern 117 for the following two reasons.

  First, the laser processing unit 3 performs marking based on the first drawing pattern 115 and the second drawing pattern 117, but the dot shape of the laser has a circular planar shape. Therefore, as shown in FIG. 12, if the entire region 310 larger than D is marked by the laser processing unit 3 as the first drawing pattern 115, the space between the edge of the first drawing pattern 115 and the pattern actually drawn is between Produces a certain gap 315.

  Such a gap 315 is generated even when drawing is performed in the area 310 with the second dot diameter 304 as the dot diameter, but the first dot diameter 303 is larger than the second dot diameter 304 because the dot diameter is larger. When the first dot diameter 303 is used for drawing, the gap 315 becomes larger.

  Therefore, by setting the second drawing pattern 117 as a pattern including the contour pattern 120 that fills the edge of the first drawing pattern 115, the gap 315 is formed as compared with the case where the entire region 310 is the first drawing pattern 115. Thus, the accuracy of the entire drawing pattern 113 can be improved. This is the first reason.

  Next, in the marking device 1, the position of the actually drawn pattern is shifted from the first drawing pattern 115 and the second drawing pattern 117 due to the alignment accuracy of the laser processing unit 3, changes with time during marking, and the like. There is a case.

  In this case, the shift amount of the first drawing pattern 115 is larger than that of the second drawing pattern 117. This is because the first dot diameter 303 has a larger dot diameter than the second dot diameter 304. Therefore, the deviation of the first drawing pattern 115 is particularly problematic.

  Therefore, by setting the edge of the first drawing pattern 115 as the second drawing pattern 117, even if the region to be drawn with the first drawing pattern 115 actually shifts, Drawing is performed in the area of the second drawing pattern 117.

  More precisely, as shown in FIG. 11, when the offset amounts Gx and Gy from the outer periphery of the first drawing pattern 115 with respect to the edge 313 of the entire drawing pattern 113 are equal to or less than the overlapping amounts Vx and Vy, the first drawing pattern If the amount of deviation 115 is equal to or less than Gx and Gy, the amount of deviation is drawn in the area of the second drawing pattern 117 or the area of the overlapping area 118.

  On the other hand, when the offset amounts Gx and Gy are larger than the overlay amounts Vx and Vy, if the shift amount of the first drawing pattern 115 is equal to or less than Vx and Vy, the amount of the shift is the amount of the second drawing pattern 117. Drawing is performed in the region or the region of the overlapping region 118.

Therefore, the amount of deviation can be absorbed in the range of the offset amounts Gx, Gy or the overlay amounts Vx, Vy, and the actually drawn pattern itself is the same as the entire drawing pattern 113 regardless of whether or not there is a deviation. Can be shaped. This is the second reason.
The above is the method for generating the first drawing pattern 115 and the second drawing pattern 117 from the entire drawing pattern 113.

  In this way, the dot diameter of the laser processing unit 3 is made variable and a plurality of different dot diameters are used, a portion that needs to be processed in a large area is drawn at a high speed with a larger dot diameter, and a portion that requires fine processing is formed as a dot. By accurately drawing with a smaller diameter, the marking device 1 can realize drawing with high speed and fineness with a simple configuration.

  In particular, since the marking device 1 performs marking with different dot diameters by one laser processing unit 3, the apparatus configuration is simple compared to the case where marking is performed by providing a plurality of laser processing units for different dot diameters. Complicated accuracy calibration work between processing parts is also unnecessary.

Further, in the marking device 1, by setting the edge of the first drawing pattern 115 as the contour pattern 120 of the second drawing pattern 117, the region to be drawn with the first drawing pattern 115 is actually misaligned. However, the amount of deviation is drawn in the area of the second drawing pattern 117.
Therefore, the marking device 1 can further improve the processing accuracy.

  In FIG. 11, the width of the pattern that fills the edge of the first drawing pattern 115 in the second drawing pattern 117 (in FIG. 11, the width in the X direction is denoted by Sx and the width in the Y direction is denoted by Sy) is the second width. This is the same as the diameter of the dot diameter 304. That is, the second drawing pattern 117 is formed by a single line of dots.

  On the other hand, the second drawing pattern 117 is not necessarily formed by a single line of dots, and may be formed by a plurality of lines as shown in FIG.

By using a plurality of rows in this manner, the overlay amounts Vx and Vy and the offset amounts Gx and Gy can be increased as compared with the case of one row.
Therefore, the allowable deviation amount of the first drawing pattern 115 (and the second drawing pattern 117) can be further increased.

However, as the number of columns and the overlapping amounts Vx and Vy increase, the area of the second drawing pattern 117 increases and the time required for drawing increases.
For this reason, it is desirable that the overlapping amounts Vx, Vy and the number of columns are selected in an appropriate range by comparing the expected deviation amount with the working time.

  For example, if the positional deviations of the first drawing pattern 115 and the second drawing pattern 117 that are assumed to be the marking positions due to changes over time during marking are α and β, respectively, the overlapping amounts Vx and Vy need to be α + β at least. Become. Furthermore, when the first drawing pattern 115 and the second drawing pattern 117 are displaced by the maximum amount in the opposite directions, a gap (see the gap 315 in FIG. 12) derived from the dot diameter being a circle may occur. Therefore, if the amount that can fill this gap is γ, the actual overlay amounts Vx and Vy are α + β + γ.

Further, as described above, the number of columns of the second drawing pattern 117 increases or decreases depending on the size of the overlay amounts Vx and Vy and the size of the offset amounts Gx and Gy. That is, it is desirable to increase the number of columns as the overlapping amounts Vx, Vy and offset amounts Gx, Gy increase, and it is desirable to decrease the number of columns as the overlapping amounts Vx, Vy and offset amounts Gx, Gy decrease.
The above is the description of the example of the overall drawing pattern 113 formed on the film 100.

  Next, the marking procedure will be described with reference to FIG. In the following description, it is assumed that the first dot diameter 303 is 0.1 mm in diameter and the second dot diameter 304 is 0.05 mm in diameter. That is, it is assumed that the diameter of the second dot diameter 304 is ½ of the diameter of the first dot diameter 303.

  First, the apparatus PC7 (the control unit 6) of the marking apparatus 1 determines whether or not the entire drawing pattern 113 and the first drawing pattern 115 and the second drawing pattern 117 corresponding to the entire drawing pattern 113 are registered in the storage unit 7a. (S1 in FIG. 14), if registered, marking (pattern drawing) is performed according to the registered pattern (S2 in FIG. 14).

  When the first drawing pattern 115 and the second drawing pattern 117 are not registered, the control unit 6 of the apparatus PC 7 generates the first drawing pattern 115 and the second drawing pattern 117 (partial drawing pattern) according to the following procedure. register. Here, the apparatus PC 7 is used as a partial drawing pattern generation unit that generates a partial drawing pattern. However, instead of using the apparatus PC 7, another computer may be used to generate the partial drawing pattern.

  First, the control unit 6 of the apparatus PC 7 reads pattern shape data such as CAD data corresponding to the entire drawing pattern 113 (S3 in FIG. 14).

  Next, the control unit 6 of the apparatus PC7 superimposes Vx and Vy of the first drawing pattern 115 and the second drawing pattern 117, and offset amounts Gx, Gy of the first drawing pattern 115 with respect to the edge 313 of the entire drawing pattern 113. And the number of columns of the second drawing pattern 117 is set (S4 in FIG. 14). Specifically, the operator inputs the overlay amounts Vx, Vy, the offset amounts Gx, Gy, and the number of columns of the second drawing pattern 117, or reads these data from another PC or storage medium.

  Next, the control unit 6 of the apparatus PC 7 converts the read CAD data into Gerber data (S5 in FIG. 14).

  Next, the control unit 6 of the apparatus PC 7 generates and registers the first drawing pattern 115 and the second drawing pattern 117 from the entire drawing pattern 113 (S6 in FIG. 14). A specific generation method is as described with reference to FIGS. 6 to 13 and will be briefly described below.

  That is, the divided drawing pattern generation unit sets the shape of the entire drawing pattern 113, the overlapping amounts Vx and Vy of the first drawing pattern 115 and the second drawing pattern 117 set in S4, and the first to the edge 313 of the entire drawing pattern 113. The second drawing pattern 117 is generated based on the offset amounts Gx and Gy of the one drawing pattern 115 and the number of columns of the second drawing pattern 117.

  Next, the control unit 6 of the apparatus PC7 sets the drawing energy (laser output and oscillation frequency) of the light source 51 when drawing the first drawing pattern 115, and uses the set drawing energy as the first part of the storage unit 7a. Registration is made in the storage area 14 or the like (S7 in FIG. 14). Here, it is assumed that the laser output of the light source 51 in the case of drawing with the first dot diameter 303 is set to 1000 mW and the frequency is set to 10 kHz.

  Next, the control unit 6 of the apparatus PC7 calculates the drawing energy (laser output and oscillation frequency) of the light source 51 when drawing the second drawing pattern 117 (S8 in FIG. 14). Here, the calculation is performed so that the drawing energy per unit area when drawing the second drawing pattern 117 is substantially equal to the drawing energy per unit area when drawing the first drawing pattern 115. This is because, since the first drawing pattern 115 and the second drawing pattern 117 have different dot diameters, the light source 51 simply draws the first drawing pattern 115 and the second drawing pattern 117 with the same laser output and oscillation frequency. This is because the drawing energy per unit area is different during drawing, and drawing unevenness (difference in processing depth, etc.) occurs between the first drawing pattern 115 and the second drawing pattern 117.

  In this example, since the diameter of the second dot diameter 304 is ½ of the diameter of the first dot diameter 303, the area of the second dot diameter 304 is ¼ of the area of the first dot diameter 303. Become. Therefore, the laser output of the light source 51 when drawing with the second dot diameter 304 is set to 250 mW, which is ¼ of the laser output when drawing with the first dot diameter 303.

  In addition, when the processing speed is equal, the amount of movement in the X and Y directions for each laser irradiation when drawing with the second dot diameter 304 is ½ of the first dot diameter 303, so the oscillation frequency is The frequency is set to 20 kHz, which is twice the oscillation frequency when drawing with the first dot diameter 303.

  Next, the control unit 6 of the apparatus PC7 registers the drawing energy calculated in S8 in the second partial storage area 16 and the like of the storage unit 7a (S9 in FIG. 14).

  Next, the drawing method of the entire drawing pattern 113 (S2 in FIG. 14) will be described in more detail with reference to FIGS.

  First, the marking device 1 (PLC 37 of the device PC7) drives the unwinder 11 and the winder 13 with a motor or the like (not shown), and the marking area 203 of the film 100 is arranged at a position where the laser processing unit 3 can draw. Then, the film 100 is conveyed in the + x direction (S11 in FIG. 15, FIG. 16A). At this time, the processing table 21 moves under the control of the PLC 37 while adsorbing and holding the lower surface of the marking area 203. When the movement of the machining table 21 is completed, the PLC 37 transmits information (movement completion trigger) indicating that the movement is completed and position information of the machining table 21 to the apparatus PC7.

  Next, the apparatus PC7 that has received the movement completion trigger and the position information of the processing table 21 instructs the laser processing unit 3 (the laser processing unit PC39) to first set the laser dot diameter to the first dot diameter 303. (S12 in FIG. 15). At this time, the apparatus PC 7 instructs the laser processing unit 3 to set the drawing energy (laser output and frequency) to a value corresponding to the first dot diameter 303.

  Next, the apparatus PC7 instructs processing of the first drawing pattern 115 by the laser processing unit 3 (laser processing unit PC39). Upon receiving the instruction, the laser processing unit 3 performs patterning by irradiating the marking area 203 with a laser based on the first drawing pattern 115 (S13 in FIG. 15, FIG. 16B).

  Next, the apparatus PC7 instructs the laser processing unit 3 (the laser processing unit PC39) to set the laser dot diameter to the second dot diameter 304 (S14 in FIG. 15, FIG. 16B). At this time, the apparatus PC 7 instructs the laser processing unit 3 to set the drawing energy (laser output and frequency) to a value corresponding to the second dot diameter 304.

  Next, the apparatus PC7 instructs the laser processing unit 3 (the laser processing unit PC39) to process the second drawing pattern 117. Upon receiving the instruction, the laser processing unit 3 performs patterning by irradiating the marking area 203 with a laser based on the second drawing pattern 117 (S15 in FIG. 15).

  When the machining is completed, the apparatus PC 7 transmits information (machining completion trigger) indicating that the machining is completed to the PLC 37.

  Next, upon receiving the processing completion trigger, the PLC 37 of the marking device 1 determines whether or not the position of the processing table 21 is at the movement limit on the downstream side (winder 13 side) (S16 in FIG. 15) downstream side. If it is not within the movement limit, the process returns to S11.

  When the position of the processing table 21 is at the downstream movement limit, the marking device 1 needs to return the processing table 21 to the upstream side (unwinder 11 side), and therefore the processing table 21 is moved according to the following procedure.

  First, the PLC 37 of the marking device 1 moves the holding table 25 in the + z direction by using an actuator or the like (not shown) and sucks and holds the film 100 (S17 in FIG. 15, FIG. 16C).

  Next, the PLC 37 of the marking device 1 releases the adsorption of the film 100 by the processing table 21, and moves the processing table 21 in the -z direction using the driving unit 23 to separate it from the film 100 (S18 in FIG. 15, FIG. 15). 17 (a)).

  Next, the PLC 37 of the marking device 1 uses the drive unit 23 to move the processing table 21 in the -x direction and moves it upstream (S19 in FIG. 15, FIG. 17B).

  Next, the PLC 37 of the marking device 1 uses the drive unit 23 to move the processing table 21 in the direction of + z to contact with the film 100 again to attract the film 100 (S20 in FIG. 15, FIG. 17C). .

  Next, the PLC 37 of the marking device 1 releases the suction of the holding table 25 to the film 100, moves the holding table 25 in the direction of -z, and pulls it away from the film 100 (S21 in FIG. 15, FIG. 17 (d)). .

  Thereafter, S11 to S21 are repeated until the entire marking area 203 is processed.

In this manner, the processing table 21 always holds the marking area 203 by suction from below, so that the positional deviation of the film 100 during marking can be minimized.
The above is the marking procedure using the marking device 1.

As described above, according to this embodiment, the marking apparatus 1 performs laser processing for marking the film 100 with the first dot diameter 303 and the second dot diameter 304 that is smaller than the first dot diameter 303. Part 3, an actuator 71 that changes the dot diameter of the laser processing unit 3, and a pattern that forms part of the overall drawing pattern 113, and a first drawing pattern 115 that draws with the first dot diameter 303 and the overall drawing pattern 113 includes a device PC7 as a partial drawing pattern registration unit that registers a second drawing pattern 117 to be drawn with the second dot diameter 304.
Therefore, the marking apparatus 1 can realize drawing with high speed and fineness with a simple configuration.

  As mentioned above, although this invention was demonstrated based on embodiment, this invention is not limited to above-described embodiment.

  For example, in the above-described embodiment, the marking device 1 is exemplified by a device that performs marking using a laser. However, the present invention is not limited to this, and any device that can mark a workpiece is used. For example, an apparatus for marking using a coating apparatus such as an inkjet or a dispenser may be used.

  In the above-described embodiment, the laser processing unit 3 performs drawing with two dot diameters of the first dot diameter 303 and the second dot diameter 304, but the dot diameter may be three or more. In this case, the number of partial drawing patterns is not limited to two, ie, the first drawing pattern 115 and the second drawing pattern 117, but is three or more.

  In the present embodiment, the first drawing pattern 115 is first drawn and then the second drawing pattern 117 is drawn for the entire drawing pattern 113. However, the drawing order may be reversed. In other words, the first drawing pattern 115 may be drawn after the second drawing pattern 117 is drawn first.

  Similarly, in this embodiment, the drawing energy of the light source 51 when drawing the first drawing pattern 115 is set first, and then the drawing energy of the light source 51 when drawing the second drawing pattern 117 is set. This order may be reversed.

  Further, in the above-described embodiment, the first drawing pattern 115 and the second drawing pattern 117 are patterns obtained by dividing the entire drawing pattern 113, but the first drawing pattern 115 and the second drawing pattern 117 are not necessarily divided patterns. For example, as shown in FIG. 10, one pattern may be generated by overwriting the entire drawing pattern 113 with the areas of the first drawing pattern 115 and the second drawing pattern 117.

  In addition, the marking object (workpiece) to which the present invention can be applied is not limited to a long sheet such as the film 100, but a rectangular substrate such as a glass plate or a printed board, or a circular substrate such as a semiconductor wafer or a glass wafer. Etc. can be exemplified.

1: Marking device 3: Laser processing unit 6: Control unit 7: Device PC
7a: Storage unit 8: Monitor 10: Keyboard 11: Unwinder 12: Storage area 13: Winder 14: First partial storage area 16: Second partial storage area 21: Processing table 23: Drive unit 25: Holding table 33: Laser power meter 35: Converter 37: PLC
39: Laser processing unit PC
51: Light source 53: Beam expander 53a: Lens 53b: Lens 55: Corner mirror 57: Corner mirror 59: Z scanner 61: Objective lens 63: XY galvano scanner 70: Wiring pattern 71: Actuator 100: Film 101: Substrate 103 : Metal layer 113: entire drawing pattern 114: edge 115: first drawing pattern 116: edge 117: second drawing pattern 118: overlapping region 120: contour pattern 203: marking area 303: first dot diameter 304: Second dot diameter 305: region 306: region 307: region 309: region 310: region 313: edge 315: gap A: region

Claims (6)

In a marking device that draws a predetermined drawing pattern in a marking area set on a workpiece,
A marking portion that marks the workpiece with a first dot diameter and a second dot diameter that is smaller than the first dot diameter;
A variable portion for changing the dot diameter of the marking portion;
A pattern constituting a part of the drawing pattern, a first drawing pattern drawn with the first dot diameter, and a pattern constituting a part of the drawing pattern, wherein the first drawing pattern is drawn with the second dot diameter. A partial drawing pattern registration unit for registering two drawing patterns;
An overlap amount setting unit for setting an overlap amount between the first drawing pattern and the second drawing pattern;
An offset amount setting unit that sets an offset amount of an edge of the first drawing pattern with respect to an edge of the drawing pattern;
The first drawing pattern and the second drawing pattern are formed so as to overlap each other, whereby the predetermined drawing pattern is formed on the workpiece,
The second drawing pattern includes a contour pattern that fills an edge of the first drawing pattern.
Marking device. The marking device according to claim 1 , wherein the contour pattern of the second drawing pattern is configured by a plurality of columns. A contour column number setting unit for setting the number of columns of the contour pattern in the second drawing pattern;
The marking device according to claim 2 , wherein the second drawing pattern having the number of contour patterns set by the contour column number setting unit is registered in the partial drawing pattern registration unit. A relative movement part for relatively moving the workpiece and the marking part;
A moving marking control unit that performs a marking command while controlling the relative moving unit to move the marking unit relative to the workpiece;
The marking device according to any one of claims 1 to 3 . An overall drawing pattern registration unit for registering the entire drawing pattern to be marked on the workpiece as an overall drawing pattern;
The marking device according to any one of claims 1 to 4 , further comprising a partial drawing pattern generation unit that generates the first drawing pattern and the second drawing pattern from the entire drawing pattern. The marking part is
A light source for marking the workpiece with a laser;
A plurality of lenses provided on an optical path of a laser irradiated from the light source, and a beam expander that adjusts a dot diameter of the laser by a distance between the plurality of lenses,
The variable part is:
Provided on at least one of the plurality of lenses, and moving at least one of the plurality of lenses relative to the other to set the dot diameter of the laser to either the first dot diameter or the second dot diameter The marking apparatus as described in any one of Claims 1-5 which has an actuator to perform.

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