JP6569802B2 - 基板貼り合わせ装置および基板貼り合わせ方法 - Google Patents
基板貼り合わせ装置および基板貼り合わせ方法 Download PDFInfo
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- JP6569802B2 JP6569802B2 JP2018507853A JP2018507853A JP6569802B2 JP 6569802 B2 JP6569802 B2 JP 6569802B2 JP 2018507853 A JP2018507853 A JP 2018507853A JP 2018507853 A JP2018507853 A JP 2018507853A JP 6569802 B2 JP6569802 B2 JP 6569802B2
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Description
特許文献1 特開2013−258377号公報
また、本実施例において「貼り合わせ」とは、本実施例に記載の方法で積層された二つの基板に設けられた端子が互いに接続され、これにより、二つの基板間に電気的な導通が確保された場合もしくは二つの基板の接合強度が所定の強度以上となる場合には、それらの状態を指す。また、本実施例に記載の方法で積層された二つの基板をその後にアニール等の処理を行うことにより、二つの基板が最終的に電気的に接続される場合もしくは二つの基板の接合強度が所定の強度以上となる場合は、「貼り合わせ」は、アニール等の処理前に二つの基板が一時的に結合している状態、すなわち仮接合されている状態を指す。
また、本実施例では、基板211、213間に閾値以上の位置ずれが生じる前に、接触領域の拡大を開始させる例を示したが、これに代えて、基板211、213の少なくとも一方に閾値以上の変形が生じる前に接触領域の拡大を開始してもよい。この場合、一方の基板のみが変形する場合は、基板211、213の一部同士が接触する前の状態もしくは基板211、213が位置合わせされた状態を基準として、その一方の基板に生じる変形量の大きさが、基板211、213の接続部間に適切な電気的接続や接合強度が得られないずれを発生する大きさにならないように、閾値が設定される。一方、基板211、213の両方が変形する場合は、変形量の差が、基板211、213の接続部間に適切な電気的接続や接合強度が得られないずれを発生する大きさにならないように、閾値が設定される。
Claims (21)
- 第1の基板における表面の一部と第2の基板における表面の一部とを、前記第1の基板および前記第2の基板の間に温度差を設けて相対位置を補正した状態で接触させて前記一部に接触領域を形成した後に、前記接触領域を拡大させて、前記第1の基板および前記第2の基板を貼り合わせる基板貼り合わせ装置であって、
前記第1の基板および前記第2の基板の間の位置ずれが閾値を超える前に前記接触領域の拡大を開始させ、
前記閾値は、前記第1の基板および前記第2の基板を貼り合わせた後に前記第1の基板および前記第2の基板の間に電気的な導通が可能となるずれ量である基板貼り合わせ装置。 - 前記位置ずれは、前記第1の基板および前記第2の基板の少なくとも一方の歪みにより生じるずれを含む、請求項1に記載の基板貼り合せ装置。
- 前記第1の基板および前記第2の基板のそれぞれの前記表面のまだ接触していない非接触領域の温度差が前記位置ずれの閾値に対応する所定の範囲外になる前に、前記接触領域の拡大を開始する請求項1または2に記載の基板貼り合わせ装置。
- 前記一部に形成された前記接触領域において、前記第1の基板および前記第2の基板の面方向の相対位置が固定される結合力で前記第1の基板および前記第2の基板が互いに結合された後、前記接触領域の拡大を開始する請求項1から3のいずれか一項に記載の基板貼り合わせ装置。
- 前記結合力で結合された前記接触領域が前記一部に形成されたか否かを判断する判断部を備え、前記判断部による判断結果に基づいて、前記接触領域の拡大が開始される請求項4に記載の基板貼り合わせ装置。
- 前記第1の基板を保持する保持部を備え、
前記保持部による前記第1の基板の保持を解除することにより前記接触領域が拡大され、
前記保持部は、前記第1の基板および前記第2の基板の間に閾値以上の位置ずれが生じる前に、前記第1の基板の保持を解除する請求項1から5のいずれか一項に記載の基板貼り合わせ装置。 - 前記閾値は、前記第1の基板および前記第2の基板にそれぞれ設けられた接続部同士が少なくとも一部で接触するときの前記第1の基板および前記第2の基板の間の位置ずれ量に対応する値である請求項6に記載の基板貼り合わせ装置。
- 前記位置ずれは、前記第1の基板および前記第2の基板の少なくとも一方の温調により前記第1の基板および前記第2の基板の相対位置が補正された状態に対するずれである請求項1から7のいずれか一項に記載の基板貼り合わせ装置。
- 前記補正の補正量を算出する算出部を備え、
前記算出部は、前記接触領域が拡大する過程で前記第1の基板および前記第2の基板の少なくとも一方に生じる歪みによる位置ずれに基づいて、前記補正量を算出する請求項8に記載の基板貼り合わせ装置。 - 前記第1の基板および前記第2の基板の少なくとも一方と外部との熱の交流を制御する温度調節部をさらに備える請求項1から9のいずれか一項に記載の基板貼り合わせ装置。
- 第1の基板における表面の一部と第2の基板における表面の一部とを、前記第1の基板および前記第2の基板の間に温度差を設けて相対位置を補正した状態で接触させて前記一部に接触領域を形成した後に、前記接触領域を拡大させて、前記第1の基板および前記第2の基板を貼り合わせる基板貼り合わせ方法であって、
前記第1の基板および前記第2の基板の間の位置ずれが閾値を超える前に前記接触領域の拡大を開始させる段階を含み、
前記閾値は、前記第1の基板および前記第2の基板を貼り合わせた後に前記第1の基板および前記第2の基板の間に電気的な導通が可能となるずれ量である基板貼り合わせ方法。 - 前記位置ずれは、前記第1の基板および前記第2の基板の少なくとも一方の歪みにより生じるずれを含む、請求項11に記載の基板貼り合わせ方法。
- 前記第1の基板および前記第2の基板のそれぞれの前記表面のまだ接触していない非接触領域の温度差が前記位置ずれの閾値に対応する所定の範囲外になる前に、前記接触領域の拡大を開始する請求項11または12に記載の基板貼り合わせ方法。
- 前記一部に形成された前記接触領域において、前記第1の基板および前記第2の基板の面方向の相対位置が固定される結合力で前記第1の基板および前記第2の基板が互いに結合された後、前記接触領域の拡大を開始する開始段階を有する請求項11から13のいずれか一項に記載の基板貼り合わせ方法。
- 前記結合力で結合された前記接触領域が前記一部に形成されたか否かを判断する判断段階を含み、前記開始段階は、前記判断段階での判断結果に基づいて、前記接触領域の拡大を開始する請求項14に記載の基板貼り合わせ方法。
- 前記第1の基板を保持部に保持する保持段階を含み、
前記開始段階は、前記第1の基板および前記第2の基板の間に閾値以上の位置ずれが生じる前に、前記保持部による前記第1の基板の保持を解除する請求項14または15に記載の基板貼り合わせ方法。 - 前記保持段階では、前記第1の基板および前記第2の基板の歪み量の差による位置ずれを補正する場合に、補正量が小さい方の基板を前記保持部に保持する請求項16に記載の基板貼り合わせ方法。
- 前記閾値は、前記第1の基板および前記第2の基板にそれぞれ設けられた接続部同士が少なくとも一部で接触するときの前記第1の基板および前記第2の基板の間の位置ずれ量に対応する値である請求項16に記載の基板貼り合わせ方法。
- 前記位置ずれは、前記第1の基板および前記第2の基板の少なくとも一方の温調により前記第1の基板および前記第2の基板の相対位置が補正された状態に対するずれである請求項11から18のいずれか一項に記載の基板貼り合わせ方法。
- 前記補正の補正量を算出する算出段階を備え、
前記算出段階は、前記接触領域が拡大する過程で前記第1の基板および前記第2の基板の少なくとも一方に生じる歪みによる位置ずれに基づいて、前記補正量を算出する請求項19に記載の基板貼り合わせ方法。 - 前記第1の基板および前記第2の基板の少なくとも一方と外部との熱の交流を制御する段階をさらに備える請求項11から20のいずれか一項に記載の基板貼り合わせ方法。
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