JP6569351B2 - Insulated transformer mounting board and power supply - Google Patents

Insulated transformer mounting board and power supply Download PDF

Info

Publication number
JP6569351B2
JP6569351B2 JP2015143215A JP2015143215A JP6569351B2 JP 6569351 B2 JP6569351 B2 JP 6569351B2 JP 2015143215 A JP2015143215 A JP 2015143215A JP 2015143215 A JP2015143215 A JP 2015143215A JP 6569351 B2 JP6569351 B2 JP 6569351B2
Authority
JP
Japan
Prior art keywords
insulating
substrate
wire
transformer
bobbin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015143215A
Other languages
Japanese (ja)
Other versions
JP2017028023A (en
Inventor
健一 関谷
健一 関谷
浩久 松元
浩久 松元
森福 邱
森福 邱
▲しん▼嵩 郭
▲しん▼嵩 郭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2015143215A priority Critical patent/JP6569351B2/en
Priority to CN201610553145.3A priority patent/CN106356180A/en
Publication of JP2017028023A publication Critical patent/JP2017028023A/en
Application granted granted Critical
Publication of JP6569351B2 publication Critical patent/JP6569351B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/027Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2823Wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/32Insulating of coils, windings, or parts thereof
    • H01F27/324Insulation between coil and core, between different winding sections, around the coil; Other insulation structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Insulating Of Coils (AREA)
  • Coils Or Transformers For Communication (AREA)

Description

本発明は、基板の部品実装面に絶縁トランスが実装された絶縁トランス実装基板、および絶縁トランス実装基板を備えて構成された電源装置に関するものである。   The present invention relates to an insulating transformer mounting board in which an insulating transformer is mounted on a component mounting surface of the board, and a power supply device including the insulating transformer mounting board.

例えば、下記の特許文献には、基板に実装されて電源回路を構成する小形トランス(以下、単に「トランス」ともいう)の発明が開示されている。このトランスは、筒状巻線部の両端部(上端部および下端部)にそれぞれ鍔が設けられたボビンを用い、このボビンの筒状巻線部に線材を巻回することで一次コイルおよび二次コイルがそれぞれ形成されている。また、ボビンにおける下端部側の鍔には、一次コイルおよび二次コイルの両線材を実装基板の配線パターンに接続するための端子ピンがそれぞれ植設されている。さらに、このトランスでは、一次コイルおよび二次コイルが形成されたボビンを挟み込むようにしてE形フエライトコア(磁性コア)が装着されて両コイルの周囲に磁路が形成されている。   For example, the following patent document discloses an invention of a small transformer (hereinafter also simply referred to as “transformer”) that is mounted on a substrate and constitutes a power supply circuit. This transformer uses a bobbin provided with hooks at both ends (upper end and lower end) of the cylindrical winding part, and a wire is wound around the cylindrical winding part of the bobbin so that the primary coil and the secondary coil are wound. Each of the next coils is formed. In addition, terminal pins for connecting both the wire materials of the primary coil and the secondary coil to the wiring pattern of the mounting board are respectively planted on the lower end of the bobbin. Further, in this transformer, an E-shaped ferrite core (magnetic core) is mounted so as to sandwich a bobbin in which a primary coil and a secondary coil are formed, and a magnetic path is formed around both coils.

この場合、この種のトランスでは、一次コイルおよび二次コイルを十分に絶縁する必要があるため、高絶縁性被覆が施された線材が使用されて両コイルが形成されている。しかしながら、高絶縁性被覆が施された線材を使用したとしても、その線材において接続ピンに接続するために被覆を除去した部位(線材における接続ピン側の端部)や、線材を接続した接続ピンについては絶縁性が保たれない。したがって、このトランスでは、筒状巻線部における筒長方向の中央部寄りの部位(鍔から離れている部位)だけに線材を巻回して一次コイルおよび二次コイルを形成することにより、筒状巻線部における筒長方向の両端部寄りの部位(鍔に近い部位:端子ピンに近い部位)にコイルが存在しないバリア空間が設けられている。   In this case, in this type of transformer, since it is necessary to sufficiently insulate the primary coil and the secondary coil, both coils are formed using a wire with a high insulation coating. However, even if a wire with a high insulation coating is used, the portion of the wire that has been removed to connect to the connection pin (the end of the wire on the connection pin side) or the connection pin to which the wire is connected The insulation is not maintained. Therefore, in this transformer, the primary coil and the secondary coil are formed by winding the wire only on the portion near the center portion in the tube length direction (the portion away from the flange) in the tube winding portion, thereby forming the tube A barrier space in which no coil exists is provided in a portion of the winding portion near both ends in the tube length direction (a portion close to the flange: a portion close to the terminal pin).

これにより、このトランスでは、下側の鍔に植設されて一次コイルが接続された接続ピンと二次コイル(筒状巻線部に巻回されている二次コイル用の線材)との間の絶縁性、および下側の鍔に植設されて二次コイルが接続された接続ピンと一次コイル(筒状巻線部に巻回されている一次コイル用の線材)との間の絶縁性が確保されている。   Thereby, in this transformer, between the connection pin and the secondary coil (wire material for the secondary coil wound around the cylindrical winding part), which is implanted in the lower cage and connected to the primary coil. Insulation and insulation between the primary coil (wire material for the primary coil wound around the cylindrical winding) and the connection pin that is planted in the lower cage and connected to the secondary coil are secured. Has been.

特開平7−240324号公報(第3−4頁、第1−6図)JP-A-7-240324 (page 3-4, FIG. 1-6)

ところが、上記の特許文献に開示されているトランスには、以下のような問題点が存在する。すなわち、従来のトランスでは、筒状巻線部における筒長方向の両端部寄りの部位にバリア空間を設けることにより、筒状巻線部に巻回されたコイル(線材)と鍔に植設された端子ピンとの間の絶縁性を確保する構成が採用されている。この場合、高絶縁性被覆が施された線材は、被覆の厚みの分だけ直径が大きくなるため、コイルの形成に必要な巻数が多いときには、大きなボビンが必要となる。このため、一次コイルおよび二次コイルの双方を高絶縁性被覆が施された線材で構成したときは、トランスの小型化が困難となる。   However, the transformer disclosed in the above patent document has the following problems. That is, in a conventional transformer, a barrier space is provided in a portion near both ends of the cylindrical winding portion in the cylindrical length direction, so that the coil (wire) wound around the cylindrical winding portion and the rod are implanted. A configuration that ensures insulation between the terminal pins is employed. In this case, since the diameter of the wire with high insulation coating increases by the thickness of the coating, a large bobbin is required when the number of turns necessary for forming the coil is large. For this reason, when both a primary coil and a secondary coil are comprised with the wire with which high insulation coating was given, size reduction of a transformer becomes difficult.

そこで、出願人は、一次コイルおよび二次コイルのいずれか一方を絶縁性が十分に高い被覆が施された線材で構成し、他方のコイルについては、簡易的な被覆を施した線材で構成したトランスを試作した。具体的には、上記の特許文献に開示されているトランスのボビンおよび磁性コアと同様のボビンおよび磁性コアを使用しつつ、一例として、巻数が少ない二次コイルを高絶縁性被覆が施された線材で構成し、巻数が多い一次コイルについては、簡易的な被覆が施された線材で構成した。このような構成を採用することにより、両コイル間の絶縁性が損なわれたり、ボビンの大型化を招いたりすることなく、十分な巻数に亘って筒状巻線部の周囲に線材を巻回できることが確認された。   Therefore, the applicant configured either one of the primary coil and the secondary coil with a wire with a coating having a sufficiently high insulation, and the other coil with a wire with a simple coating. Prototype transformer. Specifically, while using the same bobbin and magnetic core as the transformer bobbin and magnetic core disclosed in the above patent document, as an example, a secondary coil with a small number of turns is provided with a highly insulating coating. About the primary coil comprised with a wire and many windings, it comprised with the wire with which simple coating | cover was given. By adopting such a configuration, the wire can be wound around the cylindrical winding portion over a sufficient number of turns without impairing the insulation between the coils or causing an increase in the size of the bobbin. It was confirmed that it was possible.

一方で、出願人が試作したトランスでは、簡易的な被覆が施された線材で構成した一次コイル(一次巻線)の近傍に磁性コアが存在する状態となるため、二次コイル(二次巻線)用の線材が接続された接続ピンと磁性コア(ひいては一次巻線)との間の絶縁性を確保するのが好ましい。この場合、上記の特許文献に開示されているボビンでは、下側の鍔に植設された接続ピンと磁性コアとの間に下方に向かって突出する壁状部(上記特許文献の図9における平行突片部13e)が形成されており、この壁状部の存在により、接続ピンと磁性コアとの沿面距離がある程度長くなっている。   On the other hand, in the transformer prototyped by the applicant, the magnetic core exists in the vicinity of the primary coil (primary winding) composed of a wire with a simple coating, so the secondary coil (secondary winding) It is preferable to ensure the insulation between the connection pin to which the wire rod is connected and the magnetic core (and thus the primary winding). In this case, in the bobbin disclosed in the above-mentioned patent document, a wall-like portion protruding downward between the connection pin and the magnetic core planted in the lower ridge (parallel in FIG. 9 of the above-mentioned patent document). A protruding piece 13e) is formed, and the presence of this wall-like portion increases the creeping distance between the connection pin and the magnetic core to some extent.

このような構成のボビンにおいて、接続ピンと磁性コアとの間の絶縁性を一層向上させるには、磁性コアに絶縁被覆を施したり、上記の壁状部の高さ(鍔部から壁状部の下端部までの距離)を延長したりする必要がある。しかしながら、例えば、磁性コアに絶縁被覆を施す場合には、その作業が煩雑であるだけでなく、材料コストに起因してトランスの製造コストが高騰するおそれがある。また、壁状部の高さ(鍔部から壁状部の下端部までの高さ)を延長した場合には、トランスの実装高(基板における部品実装面からトランスの上端部までの距離)が高くなるため、簡易的な被覆を施した線材を採用してトランスの大型化を回避しようとしているにも拘わらず、そのトランスを実装した実装基板が大型化するおそれがある。   In the bobbin having such a configuration, in order to further improve the insulation between the connection pin and the magnetic core, the magnetic core is provided with an insulating coating or the height of the wall-shaped portion (from the flange portion to the wall-shaped portion). It is necessary to extend the distance) to the lower end. However, for example, when an insulating coating is applied to the magnetic core, the work is not only complicated, but the manufacturing cost of the transformer may increase due to the material cost. When the height of the wall-like part (height from the collar part to the lower end of the wall-like part) is extended, the mounting height of the transformer (distance from the component mounting surface on the board to the upper end of the transformer) is Therefore, the mounting board on which the transformer is mounted may be increased in size even though a wire with a simple coating is used to avoid increasing the size of the transformer.

本発明は、かかる問題点に鑑みてなされたものであり、製造コストの高騰や大型化を招くことなく、絶縁トランスにおける各部の絶縁性が十分に確保された絶縁トランス実装基板および電源装置を提供することを主目的とする。   The present invention has been made in view of such problems, and provides an insulating transformer mounting substrate and a power supply device in which insulation of each part of the insulating transformer is sufficiently ensured without causing an increase in manufacturing cost or an increase in size. The main purpose is to do.

上記目的を達成すべく、本発明に係る絶縁トランス実装基板は、第1の絶縁線がボビンに巻回されて一次巻線が形成され、かつ第2の絶縁線が当該ボビンに巻回されて二次巻線が形成されると共に磁性コアが当該ボビンに装着された絶縁トランスが基板の部品実装面に実装されている絶縁トランス実装基板であって、前記ボビンは、前記基板に実装された実装状態において当該基板の前記部品実装面に当接可能な当接部と、前記第1の絶縁線における両端部がそれぞれ接続されることで前記実装状態において前記一次巻線を前記基板に接続する第1の接続端子群と、前記第2の絶縁線における両端部がそれぞれ接続されることで前記実装状態において前記二次巻線を前記基板に接続する第2の接続端子群とを備えると共に、前記第1の接続端子群および前記第2の接続端子群のうちの少なくとも一方の接続端子群における突出部位のなかで前記磁性コアとの離間距離が最も短い第1の基準点と当該磁性コアにおいて当該第1の基準点との離間距離が最も短い第2の基準点との間に当該第1の基準点および当該第2の基準点間の沿面距離を延長する壁状絶縁部が設けられて構成され、前記基板は、前記第1の接続端子群および前記第2の接続端子群をそれぞれ挿通可能な端子挿通孔と、前記壁状絶縁部を挿入可能なスリットとが設けられ、前記絶縁トランスは、前記第1の接続端子群および前記第2の接続端子群が前記基板の前記端子挿通孔に挿通させられ、前記ボビンの前記当接部が前記基板の前記部品実装面に当接させられ、かつ前記ボビンの前記壁状絶縁部における少なくとも一部が前記基板の前記スリットに挿入されると共に、前記磁性コアが前記基板の厚みの範囲内に位置せずに当該基板の厚み方向で前記部品実装面と対向するように当該基板に実装されている。 In order to achieve the above object, the insulated transformer mounting board according to the present invention has a first insulating wire wound around a bobbin to form a primary winding, and a second insulating wire wound around the bobbin. An insulating transformer mounting substrate in which a secondary winding is formed and an insulating transformer having a magnetic core mounted on the bobbin is mounted on a component mounting surface of the substrate, wherein the bobbin is mounted on the substrate A first portion connecting the primary winding to the substrate in the mounted state by connecting a contact portion that can contact the component mounting surface of the substrate in the state and both ends of the first insulating wire, respectively. 1 connection terminal group and a second connection terminal group for connecting the secondary winding to the substrate in the mounted state by connecting both ends of the second insulation wire, respectively, First connection end A first reference point having the shortest separation distance from the magnetic core among the projecting portions of at least one of the group and the second connection terminal group, and the first reference point in the magnetic core A wall-like insulating portion extending the creeping distance between the first reference point and the second reference point is provided between the first reference point and the second reference point having the shortest separation distance from the second reference point, A terminal insertion hole through which each of the first connection terminal group and the second connection terminal group can be inserted, and a slit into which the wall-like insulating portion can be inserted. The connection terminal group and the second connection terminal group are inserted into the terminal insertion hole of the substrate, the contact portion of the bobbin is contacted with the component mounting surface of the substrate, and the bobbin At least in the wall insulation With part is inserted into the slit of the substrate, wherein the magnetic core is mounted on the substrate so as to face the component mounting surface in the thickness direction of the substrate without a position within the thickness of the substrate Yes.

また、本発明に係る絶縁トランス実装基板は、前記絶縁トランスが、前記第1の絶縁線および前記第2の絶縁線のいずれか一方の絶縁線が他方の絶縁線よりも高い絶縁性を有する被覆が施された線材で構成され、前記ボビンは、前記一方の絶縁線が前記第1の絶縁線のときには前記第1の接続端子群だけを前記一方の接続端子群として前記壁状絶縁部が設けられ、前記一方の絶縁線が前記第2の絶縁線のときには前記第2の接続端子群だけを前記一方の接続端子群として前記壁状絶縁部が設けられているIn the insulating transformer mounting substrate according to the present invention, the insulating transformer has a coating in which one of the first insulating wire and the second insulating wire has higher insulation than the other insulating wire. The bobbin is provided with the wall-like insulating portion with only the first connecting terminal group as the one connecting terminal group when the one insulating wire is the first insulating wire. When the one insulating wire is the second insulating wire, the wall-like insulating portion is provided with only the second connecting terminal group as the one connecting terminal group .

また、本発明に係る電源装置は、上記の絶縁トランス実装基板がケーシング内に収容されている。   Further, in the power supply device according to the present invention, the insulating transformer mounting substrate is accommodated in a casing.

本発明に係る絶縁トランス実装基板では、第1の接続端子群および第2の接続端子群のうちの少なくとも一方の接続端子群における突出部位のなかで磁性コアとの離間距離が最も短い第1の基準点と磁性コアにおいて第1の基準点との離間距離が最も短い第2の基準点との間に第1の基準点および第2の基準点間の沿面距離を延長する壁状絶縁部が絶縁トランスのボビンに設けられると共に、第1の接続端子群および第2の接続端子群が基板の端子挿通孔に挿通させられ、ボビンの当接部が基板の部品実装面に当接させられ、かつボビンの壁状絶縁部が基板のスリットに挿入されると共に、磁性コアが基板の部品実装面と対向するように絶縁トランスが基板に実装されている。また、本発明に係る電源装置では、絶縁トランス実装基板がケーシング内に収容されて構成されている。   In the insulated transformer mounting substrate according to the present invention, the first separation terminal is the shortest distance from the magnetic core among the protruding portions of at least one of the first connection terminal group and the second connection terminal group. A wall-like insulating portion extending a creeping distance between the first reference point and the second reference point between the reference point and the second reference point having the shortest distance from the first reference point in the magnetic core; Provided on the bobbin of the insulation transformer, the first connection terminal group and the second connection terminal group are inserted into the terminal insertion hole of the board, the contact part of the bobbin is brought into contact with the component mounting surface of the board, An insulating transformer is mounted on the substrate such that the wall-like insulating portion of the bobbin is inserted into the slit of the substrate and the magnetic core faces the component mounting surface of the substrate. In the power supply device according to the present invention, the insulating transformer mounting substrate is housed in the casing.

したがって、本発明に係る絶縁トランス実装基板および電源装置によれば、磁性コアを挿入可能な大きな孔を基板に設けることなく、スリットに挿入した壁状絶縁部の高さの分だけ、基板の部品実装面から絶縁トランスの上端部までの高さを低くすることができる。これにより、基板の強度が低下する事態を招くことなく、絶縁トランス実装基板および電源装置を十分に小型化することができる。また、接続端子群と磁性コアとの絶縁性を確保することを目的として磁性コアに絶縁被覆を施す必要がないため、絶縁トランス実装基板および電源装置の製造コストを十分に低減することができる。   Therefore, according to the insulated transformer mounting substrate and the power supply device according to the present invention, the board components are provided by the height of the wall-shaped insulating portion inserted into the slit without providing a large hole into which the magnetic core can be inserted. The height from the mounting surface to the upper end of the insulating transformer can be reduced. Thereby, the insulation transformer mounting substrate and the power supply device can be sufficiently downsized without causing a situation where the strength of the substrate is lowered. Moreover, since it is not necessary to apply an insulating coating to the magnetic core for the purpose of ensuring the insulation between the connection terminal group and the magnetic core, the manufacturing cost of the insulating transformer mounting substrate and the power supply device can be sufficiently reduced.

また、本発明に係る絶縁トランス実装基板、およびその絶縁トランス実装基板を備えた電源装置によれば、第1の接続端子群および第2の接続端子群のうちの、他方の絶縁線よりも高い絶縁性を有する被覆が施された線材で構成された絶縁線が接続されている一方だけを一方の接続端子群として壁状絶縁部をボビンに設けたことにより、壁状絶縁部を挿入するために基板に設けるスリットの数が1つで済むため、十分に強度が高い基板を備えた絶縁トランス実装基板および電源装置を提供することができる。   Moreover, according to the insulated transformer mounting board | substrate which concerns on this invention, and the power supply device provided with the insulated transformer mounting board, it is higher than the other insulated wire among the 1st connection terminal group and the 2nd connection terminal group. In order to insert the wall-shaped insulating portion by providing the wall-shaped insulating portion on the bobbin with only one of the connecting wires connected to the insulating wire made of the wire coated with insulating properties as one connection terminal group Since only one slit is provided on the substrate, it is possible to provide an insulating transformer mounting substrate and a power supply device including a substrate having a sufficiently high strength.

電源装置100における実装基板1の断面図である。3 is a cross-sectional view of the mounting substrate 1 in the power supply apparatus 100. FIG. 基板2の平面図である。2 is a plan view of a substrate 2. FIG. トランス3におけるボビン20の外観斜視図である。3 is an external perspective view of a bobbin 20 in a transformer 3. FIG. トランス3におけるボビン20の底面図である。4 is a bottom view of a bobbin 20 in a transformer 3. FIG. 電源装置100における実装基板1の壁状絶縁部35近傍の拡大断面図である。FIG. 3 is an enlarged cross-sectional view of the vicinity of a wall-like insulating portion 35 of the mounting substrate 1 in the power supply device 100.

以下、絶縁トランス実装基板および電源装置の実施の形態について、添付図面を参照して説明する。   Hereinafter, embodiments of an insulating transformer mounting substrate and a power supply device will be described with reference to the accompanying drawings.

図1に示す電源装置100は、「電源装置」の一例であるAC/DCコンバータであって、図示しない絶縁ケース内に実装基板1が収容されて構成されている。また、実装基板1は、「絶縁トランス実装基板」の一例であって、基板2にトランス3が実装されて構成されている。なお、実際の実装基板1は、トランス3以外の各種の各種電子部品が基板2に実装されて構成されているが、「絶縁トランス実装基板」の構成についての理解を容易とするために、トランス3以外の電子部品についての図示および説明を省略する。   A power supply device 100 shown in FIG. 1 is an AC / DC converter that is an example of a “power supply device”, and includes a mounting substrate 1 housed in an insulating case (not shown). The mounting board 1 is an example of an “insulating transformer mounting board”, and is configured by mounting a transformer 3 on a board 2. Note that the actual mounting substrate 1 is configured by mounting various electronic components other than the transformer 3 on the substrate 2, but in order to facilitate understanding of the configuration of the “insulating transformer mounting substrate”, the transformer Illustration and description of electronic components other than 3 are omitted.

基板2は、「基板」の一例であって、その部品実装面Faにトランス3などを実装可能に構成されている。この基板2は、図2に示すように、全体として矩形状に形成されると共に、後述するようにトランス3に配設された接続端子41a,41a・・,41b,41b・・を挿通可能な端子挿通孔11a,11a・・,11b,11b・・、および「スリット」の一例であるスリット12が形成されている。   The board 2 is an example of a “board”, and is configured such that the transformer 3 and the like can be mounted on the component mounting surface Fa. As shown in FIG. 2, the substrate 2 is formed in a rectangular shape as a whole, and can pass through connection terminals 41a, 41a,..., 41b, 41b,. The terminal insertion holes 11a, 11a,.., 11b, 11b,... And a slit 12 that is an example of a “slit” are formed.

トランス3は、「絶縁トランス」の一例であって、図1に示すように、ボビン20、一次巻線(例えば、主一次巻線と補助一次巻線)21a,21b、二次巻線22および磁性コア23を備えて構成されている。ボビン20は、「ボビン」の一例であって、図1,3に示すように、筒部31およびフランジ部32a,32bからなる「巻枠」と、端子保持部33a,33b、当接部34,34および壁状絶縁部35とが絶縁性樹脂材料を成形材料とする成形処理によって一体的に形成されると共に、成形処理に際して接続端子41a,41bがインサートされて端子保持部33a,33bと一体化されている。   The transformer 3 is an example of an “insulating transformer”, and as shown in FIG. 1, a bobbin 20, primary windings (for example, main primary winding and auxiliary primary winding) 21a, 21b, secondary winding 22 and A magnetic core 23 is provided. The bobbin 20 is an example of a “bobbin”. As shown in FIGS. 1 and 3, a “winding frame” including a cylindrical portion 31 and flange portions 32 a and 32 b, terminal holding portions 33 a and 33 b, and abutting portions 34. , 34 and the wall-like insulating part 35 are integrally formed by a molding process using an insulating resin material as a molding material, and the connection terminals 41a and 41b are inserted during the molding process to be integrated with the terminal holding parts 33a and 33b. It has become.

この場合、筒部31は、一例として、上側コア部材(E字コア)23aおよび下側コア部材(E字コア)23b(図1参照)の芯部(センターポール部)を挿通孔31hに挿通させることができるように角筒状に形成されている。また、本例のボビン20では、フランジ部32bの一端部寄りに端子保持部33aが一体的に形成されると共にフランジ部32bの他端部寄りに端子保持部33bが一体的に形成され、端子保持部33aと一体化された接続端子41a,41a・・(「第1の接続端子群」の一例)、および端子保持部33bと一体化された接続端子41b,41b・・(「第2の接続端子群」の一例)が十分に離間させられている。   In this case, as an example, the cylindrical portion 31 is inserted through the insertion hole 31h through the core portion (center pole portion) of the upper core member (E-shaped core) 23a and the lower core member (E-shaped core) 23b (see FIG. 1). It is formed in a rectangular tube shape so that it can be made. Further, in the bobbin 20 of this example, the terminal holding portion 33a is integrally formed near one end portion of the flange portion 32b, and the terminal holding portion 33b is integrally formed near the other end portion of the flange portion 32b. Connection terminals 41a, 41a,... Integrated with the holding portion 33a (an example of “first connection terminal group”), and connection terminals 41b, 41b, integrated with the terminal holding portion 33b (“the second connection terminal group”). An example of “connecting terminal group” is sufficiently separated.

また、図1,3,4に示すように、本例のボビン20では、端子保持部33a,33bの底面に、基板2の部品実装面Faに当接させられる当接部34がそれぞれ形成されている。なお、図4では、当接部34の形状についての理解を容易とするために、当接部34の底面(基板2の部品実装面Faに当接させられる面)を網線で塗り潰して図示している。   As shown in FIGS. 1, 3 and 4, in the bobbin 20 of this example, the contact portions 34 which are brought into contact with the component mounting surface Fa of the substrate 2 are formed on the bottom surfaces of the terminal holding portions 33 a and 33 b, respectively. ing. In FIG. 4, in order to facilitate understanding of the shape of the contact portion 34, the bottom surface of the contact portion 34 (surface that is in contact with the component mounting surface Fa of the substrate 2) is filled with a mesh line. Show.

さらに、本例のボビン20では、一例として、接続端子41aが一体化されている端子保持部33bの底面には「基板のスリットに挿入される壁状絶縁部」が設けられることなく、接続端子41bが一体化されている端子保持部33bの底面だけに「基板のスリットに挿入される壁状絶縁部」の一例である壁状絶縁部35が設けられている(接続端子41b,41b・・を「一方の接続端子群」とした構成の一例)。   Further, in the bobbin 20 of this example, as an example, the bottom surface of the terminal holding portion 33b in which the connection terminal 41a is integrated is not provided with a “wall-like insulating portion that is inserted into the slit of the substrate”. Only the bottom surface of the terminal holding portion 33b in which the terminal 41b is integrated is provided with a wall-like insulating portion 35 which is an example of “a wall-like insulating portion inserted into the slit of the substrate” (connection terminals 41b, 41b,... Is an example of a configuration in which “one connection terminal group” is used.

この場合、図5に示すように、本例のボビン20では、一例として、壁状絶縁部35の高さH35(当接部34の下端面から壁状絶縁部35の下端部までの長さ)が、基板2の厚みTと同程度となるように壁状絶縁部35が形成されている(後述するように壁状絶縁部35を基板2のスリット12内に挿入したときに壁状絶縁部35の下端部が基板2の裏面Fbと面一となる構成)。   In this case, as shown in FIG. 5, in the bobbin 20 of this example, as an example, the height H35 of the wall-like insulating portion 35 (the length from the lower end surface of the abutting portion 34 to the lower end portion of the wall-like insulating portion 35). However, the wall-shaped insulating portion 35 is formed so as to be approximately equal to the thickness T of the substrate 2 (the wall-shaped insulating portion 35 is inserted when the wall-shaped insulating portion 35 is inserted into the slit 12 of the substrate 2 as will be described later). The configuration in which the lower end portion of the portion 35 is flush with the back surface Fb of the substrate 2).

なお、壁状絶縁部35の高さについては、厚みTよりも低く規定したり(壁状絶縁部35をスリット12内に挿入したときに壁状絶縁部35の下端部が基板2の厚みTの範囲内に位置する状態となる構成)、厚みTよりも高く規定したり(壁状絶縁部35をスリット12内に挿入したときに壁状絶縁部35の下端部が基板2の裏面Fbから突出した状態となる構成)することができる。この場合、壁状絶縁部35の高さを高くするほど、磁性コア23と接続端子41aとの間の沿面距離を長くすることができるため、トランス3に求められる絶縁性に応じて壁状絶縁部35の高さを任意に規定すればよい。   Note that the height of the wall-like insulating portion 35 is defined to be lower than the thickness T (the lower end portion of the wall-like insulating portion 35 is the thickness T of the substrate 2 when the wall-like insulating portion 35 is inserted into the slit 12). In which the lower end portion of the wall-like insulating portion 35 extends from the back surface Fb of the substrate 2 when the wall-like insulating portion 35 is inserted into the slit 12. Projecting state). In this case, since the creepage distance between the magnetic core 23 and the connection terminal 41a can be increased as the height of the wall-shaped insulating portion 35 is increased, wall-shaped insulation is provided according to the insulation required for the transformer 3. What is necessary is just to prescribe | regulate the height of the part 35 arbitrarily.

また、図1に示すように、本例のトランス3では、一例として、ボビン20における筒部31の周囲に絶縁線が巻回されて「一次巻線」の一例である一次巻線21aが形成され、その周囲に他の絶縁線が巻回されて「二次巻線」の一例である二次巻線22が形成されると共に、その周囲に他の絶縁線が巻回されて「一次巻線」の他の一例である一次巻線21bが形成されている。この場合、一次巻線21a,21bを構成する絶縁線としては、「第1の絶縁線」の一例であるエナメル被覆線が使用されている。また、二次巻線22を構成する絶縁線としては、「第2の絶縁線」の一例である三層絶縁線(「他方の絶縁線よりも高い絶縁性を有する被覆が施された線材」の一例)が使用されている。   As shown in FIG. 1, in the transformer 3 of this example, as an example, an insulating wire is wound around the cylindrical portion 31 of the bobbin 20 to form a primary winding 21 a that is an example of a “primary winding”. Then, another insulation wire is wound around the periphery to form a secondary winding 22 which is an example of a “secondary winding”, and another insulation wire is wound around the periphery to form a “primary winding”. A primary winding 21b, which is another example of the “line”, is formed. In this case, an enamel-coated wire which is an example of a “first insulating wire” is used as the insulating wire constituting the primary windings 21a and 21b. Further, as an insulating wire constituting the secondary winding 22, a three-layer insulating wire which is an example of a “second insulating wire” (“wire material with a coating having higher insulation than the other insulating wire”) Example) is used.

また、本例のトランス3では、簡易な絶縁被覆が施された絶縁線(エナメル被覆線)で構成されている一次巻線21a,21bが接続端子41aに接続されると共に、絶縁性が高い三層絶縁被覆が施された絶縁線(三層絶縁線)で構成されている二次巻線22が接続端子41bに接続されている(二次巻線22を構成する絶縁線が「一方の絶縁線」で、接続端子41b,41b・・が「一方の接続端子群」である構成の一例)。   Further, in the transformer 3 of the present example, primary windings 21a and 21b each made of an insulating wire (enamel-coated wire) provided with a simple insulating coating are connected to the connection terminal 41a, and a high insulating property is achieved. A secondary winding 22 composed of an insulation wire (three-layer insulation wire) coated with a layer insulation coating is connected to the connection terminal 41b (the insulation wire constituting the secondary winding 22 is "one insulation An example of a configuration in which the connection terminals 41b, 41b,... Are “one connection terminal group”.

この場合、本例のトランス3では、図1,5に示すように、接続端子41aにおいて端子保持部33aから突出している「突出部位(長さLbの範囲内の部位)」のうちの端子保持部33a寄りの長さLaの範囲内に一次巻線21a,21b用のエナメル被覆線の端部を接続すると共に、接続端子41bにおいて端子保持部33bから突出している「突出部位(長さLbの範囲内の部位)」のうちの端子保持部33b寄りの長さLaの範囲内に二次巻線22用の三層絶縁線の端部を接続する構成が採用されている。   In this case, in the transformer 3 of this example, as shown in FIGS. 1 and 5, the terminal holding of the “projecting part (part within the range of the length Lb)” protruding from the terminal holding part 33 a in the connection terminal 41 a. The end portion of the enameled wire for the primary windings 21a and 21b is connected within the range of the length La close to the portion 33a, and the projecting portion (length Lb of the length Lb) protrudes from the terminal holding portion 33b in the connection terminal 41b. The configuration is adopted in which the end of the three-layer insulating wire for the secondary winding 22 is connected within the range of the length La near the terminal holding portion 33b.

したがって、本例のトランス3では、接続端子41a,41bに接続した各絶縁線の端部が基板2の部品実装面Faに接することがないように、両端子保持部33a,33bの底部に高さH34(図5参照)の当接部34,34を設けることで、接続端子41a,41bにおける上記の長さLaの範囲内が基板2の部品実装面Fa側に位置した状態が維持される構成が採用されている。   Therefore, in the transformer 3 of this example, the end portions of the respective insulation wires connected to the connection terminals 41a and 41b do not touch the component mounting surface Fa of the board 2 so that the bottom portions of both terminal holding portions 33a and 33b are high. By providing the abutting portions 34 and 34 of length H34 (see FIG. 5), the state where the range of the length La of the connection terminals 41a and 41b is located on the component mounting surface Fa side of the substrate 2 is maintained. Configuration is adopted.

この実装基板1の製造に際しては、まず、トランス3と製作する。具体的には、予め成形したボビン20における筒部31の周囲にエナメル被覆線を巻回することで一次巻線21aを形成する。この際には、巻回したエナメル被覆線の両端部を端子保持部33aによって保持されている一対の接続端子41a,41aにそれぞれ接続する。なお、トランス3の製作に際しては、必要に応じて任意の部位に絶縁テープを配設するが、トランス3の製作方法についての理解を容易とするために、絶縁テープに関する図示および説明を省略する。   In manufacturing the mounting substrate 1, first, the transformer 3 is manufactured. Specifically, the primary winding 21a is formed by winding an enamel-coated wire around the cylindrical portion 31 of the previously formed bobbin 20. At this time, both ends of the wound enamel-coated wire are connected to the pair of connection terminals 41a and 41a held by the terminal holding part 33a, respectively. In manufacturing the transformer 3, an insulating tape is disposed at an arbitrary position as necessary. However, in order to facilitate understanding of the manufacturing method of the transformer 3, illustration and description regarding the insulating tape are omitted.

次いで、一次巻線21aの周囲に三層絶縁線を巻回することで二次巻線22を形成する。この際には、巻回した三層絶縁線の両端部を端子保持部33bによって保持されている一対の接続端子41b,41bにそれぞれ接続する。続いて、二次巻線22の周囲にエナメル被覆線を巻回することで一次巻線21bを形成する。この際には、巻回したエナメル被覆線の両端部を端子保持部33bによって保持されている他の一対の接続端子41a,41aにそれぞれ接続する。   Next, the secondary winding 22 is formed by winding a three-layer insulation wire around the primary winding 21a. At this time, both ends of the wound three-layer insulation wire are connected to the pair of connection terminals 41b and 41b held by the terminal holding part 33b, respectively. Subsequently, the primary winding 21 b is formed by winding an enamel-coated wire around the secondary winding 22. At this time, both ends of the wound enamel-coated wire are connected to the other pair of connection terminals 41a and 41a held by the terminal holding portion 33b.

この場合、エナメル被覆線は、絶縁被覆が薄厚のため、その直径が三層絶縁線と比較して非常に小さくなっている。したがって、二次巻線22よりも巻数が多い一次巻線21a,21bをエナメル被覆線によって形成したトランス3では、ボビン20の大型化を招くことなく、必要十分な巻数の絶縁線を巻回して一次巻線21a,21bを形成することが可能となっている。この後、一次巻線21a、二次巻線22および一次巻線21bの形成が完了したボビン20を挟み込むようにして上側コア部材23aおよび下側コア部材23bを装着する。これにより、磁性コア23が形成されてトランス3が完成する。   In this case, the enamel-coated wire has a very small diameter compared to the three-layer insulated wire because the insulation coating is thin. Therefore, in the transformer 3 in which the primary windings 21a and 21b having a larger number of turns than the secondary winding 22 are formed by the enameled coated wire, an insulating wire having a necessary and sufficient number of turns is wound without increasing the size of the bobbin 20. Primary windings 21a and 21b can be formed. Thereafter, the upper core member 23a and the lower core member 23b are mounted so as to sandwich the bobbin 20 in which the primary winding 21a, the secondary winding 22 and the primary winding 21b have been formed. Thereby, the magnetic core 23 is formed and the transformer 3 is completed.

続いて、トランス3を基板2に実装する。具体的には、図1に示すように、各接続端子41a,41a・・を端子挿通孔11a,11a・・に挿通させ、各接続端子41b,41b・・を端子挿通孔11b,11b・・に挿通させ、かつ両当接部34,34を部品実装面Faに当接させると共に壁状絶縁部35をスリット12に挿入するようにして基板2にトランス3を載置する。この後、トランス3以外の他の電子部品が部品実装面Faに載置された状態で、基板2の裏面Fbにおいてトランス3の各接続端子41a,41a・・,41b,41b・・や電子部品の接続端子を配線パターンにそれぞれ半田付けすることにより、トランス3の実装が完了して実装基板1が完成する。   Subsequently, the transformer 3 is mounted on the substrate 2. Specifically, as shown in FIG. 1, the connection terminals 41a, 41a,... Are inserted into the terminal insertion holes 11a, 11a, and the connection terminals 41b, 41b,. The transformer 3 is placed on the substrate 2 so that both the abutting portions 34 and 34 abut against the component mounting surface Fa and the wall-like insulating portion 35 is inserted into the slit 12. Thereafter, in a state where other electronic components other than the transformer 3 are placed on the component mounting surface Fa, the respective connection terminals 41a, 41a,..., 41b, 41b,. Each of the connection terminals is soldered to the wiring pattern, whereby the mounting of the transformer 3 is completed and the mounting substrate 1 is completed.

この実装基板1に実装されているトランス3では、図5に示すように、「少なくとも一方の接続端子群」としての接続端子41b,41b・・において端子保持部33bから突出している「突出部位(長さLbの範囲内の部位)」のなかで磁性コア23(本例では、下側コア部材23b)との離間距離が最も短い基準点P1(「第1の基準点」の一例)と、磁性コア23(下側コア部材23b)において接続端子41bにおける「突出部位」との離間距離が最も短い基準点P2(「第2の基準点」の一例)との間に、基準点P1,P2間の沿面距離を延長するようにして当接部34および壁状絶縁部35が設けられている。   In the transformer 3 mounted on the mounting substrate 1, as shown in FIG. 5, the “protruding portion (projecting portion) protruding from the terminal holding portion 33 b at the connecting terminals 41 b, 41 b... As“ at least one connecting terminal group ”. A reference point P1 (an example of a “first reference point”) having the shortest separation distance from the magnetic core 23 (in this example, the lower core member 23b) among the “parts within the range of the length Lb”; Reference points P1 and P2 between the magnetic core 23 (lower core member 23b) and the reference point P2 (an example of the “second reference point”) that is the shortest distance from the “projection part” of the connection terminal 41b. A contact portion 34 and a wall-like insulating portion 35 are provided so as to extend the creepage distance therebetween.

なお、本例の実装基板1におけるトランス3では、磁性コア23(下側コア部材23b)の下端面が端子保持部33a,33bの下端面と同程度の高さとなるようにボビン20が形成されているため、壁状絶縁部35だけでなく、当接部34も基準点P1,P2間の沿面距離を延長する「壁状絶縁部」として機能している。しかしながら、前述したように、当接部34は、接続端子41a,41bにおける長さLaの範囲内に接続した絶縁線が基板2の部品実装面Faに接した状態となるのを阻止することを主目的として形成されたものであり、例えば、磁性コア23(下側コア部材23b)の下端面が当接部34の下端面と同程度の高さに位置するように設計変更したときには、壁状絶縁部35だけが「壁状絶縁部」として機能することとなる。   In the transformer 3 in the mounting substrate 1 of this example, the bobbin 20 is formed so that the lower end surface of the magnetic core 23 (lower core member 23b) is substantially the same height as the lower end surfaces of the terminal holding portions 33a and 33b. Therefore, not only the wall-shaped insulating portion 35 but also the abutting portion 34 functions as a “wall-shaped insulating portion” that extends the creeping distance between the reference points P1 and P2. However, as described above, the abutting portion 34 prevents the insulating wire connected within the range of the length La of the connection terminals 41a and 41b from being in contact with the component mounting surface Fa of the substrate 2. For example, when the design is changed so that the lower end surface of the magnetic core 23 (lower core member 23b) is positioned at the same height as the lower end surface of the contact portion 34, the wall Only the insulative part 35 functions as a “wall-like insulating part”.

また、「当接部」については、接続端子41a,41bに接続した絶縁線が部品実装面Faに接した状態となることを阻止できる限り、本例のボビン20における当接部34の形成位置とは異なる位置に形成することができる。したがって基準点P1,P2の間に「当接部」が存在しない構成を採用したときには、ボビン20における当接部34の高さH34と、壁状絶縁部35の高さH35とを合わせた高さの「壁状絶縁部」を基準点P1,P2の間に設けることで、本例のトランス3と同様の後述する絶縁性を確保することが可能となる。   As for the “contact portion”, the position where the contact portion 34 is formed on the bobbin 20 of this example as long as it is possible to prevent the insulated wires connected to the connection terminals 41a and 41b from being in contact with the component mounting surface Fa. It can be formed at a different position. Therefore, when a configuration in which no “contact portion” exists between the reference points P1 and P2, the height H34 of the contact portion 34 in the bobbin 20 and the height H35 of the wall-shaped insulating portion 35 are combined. By providing the “wall-like insulating portion” between the reference points P1 and P2, it is possible to ensure the insulating property, which will be described later, similar to the transformer 3 of this example.

この場合、本例の実装基板1におけるトランス3では、ボビン20の大型化を招くことなく、必要な巻数の絶縁線を巻回するために、簡易的な絶縁被覆を施したエナメル被覆線で一次巻線21a,21bが形成されている。したがって、一次巻線21a,21bの近傍に磁性コア23が配置されているトランス3では、安全規格上、通電時における磁性コア23の電位を一次巻線21a,21bの電位と同程度と見なして必要な絶縁対策を施す必要がある。このため、本例のトランス3では、一次巻線21a,21bと二次巻線22との間の絶縁性、一次巻線21a,21bと接続端子41bとの間の絶縁性、および二次巻線22と接続端子41aとの間の絶縁性だけでなく、磁性コア23と二次巻線22との間の絶縁性、および磁性コア23と接続端子41bとの間の絶縁性を確保する必要がある。   In this case, in the transformer 3 in the mounting substrate 1 of this example, in order to wind an insulation wire having a necessary number of turns without causing an increase in the size of the bobbin 20, the enamel-coated wire with a simple insulation coating is primary. Windings 21a and 21b are formed. Therefore, in the transformer 3 in which the magnetic core 23 is disposed in the vicinity of the primary windings 21a and 21b, the potential of the magnetic core 23 when energized is considered to be approximately the same as the potential of the primary windings 21a and 21b for safety standards. Necessary insulation measures must be taken. For this reason, in the transformer 3 of this example, the insulation between the primary windings 21a and 21b and the secondary winding 22, the insulation between the primary windings 21a and 21b and the connection terminal 41b, and the secondary winding It is necessary to ensure not only the insulation between the wire 22 and the connection terminal 41a, but also the insulation between the magnetic core 23 and the secondary winding 22, and the insulation between the magnetic core 23 and the connection terminal 41b. There is.

この場合、一次巻線21a,21bと二次巻線22との間については、絶縁性が高い三層絶縁線で二次巻線22を形成したことで絶縁性が確保されている。また、一次巻線21a,21bと接続端子41bとの間については、端子保持部33bを十分に高くして筒部31の周囲に巻回されているエナメル線から接続端子41bを十分に離間させたことで絶縁性が確保されている。さらに、二次巻線22と接続端子41aとの間については、三層絶縁線で二次巻線22を形成したことに加え、端子保持部33aを十分に高くして筒部31の周囲に巻回されている三層絶縁線から接続端子41aを十分に離間させたことで絶縁性が確保されている。また、磁性コア23と二次巻線22との間については、三層絶縁線で二次巻線22を形成したことで絶縁性が確保されている。   In this case, insulation between the primary windings 21a, 21b and the secondary winding 22 is ensured by forming the secondary winding 22 with a three-layer insulation wire having high insulation. Further, between the primary windings 21a and 21b and the connection terminal 41b, the terminal holding portion 33b is sufficiently high so that the connection terminal 41b is sufficiently separated from the enamel wire wound around the cylindrical portion 31. As a result, insulation is ensured. Furthermore, between the secondary winding 22 and the connection terminal 41a, in addition to forming the secondary winding 22 with a three-layer insulated wire, the terminal holding portion 33a is sufficiently raised to surround the cylindrical portion 31. The insulation is ensured by sufficiently separating the connection terminal 41a from the wound three-layer insulation wire. In addition, insulation between the magnetic core 23 and the secondary winding 22 is ensured by forming the secondary winding 22 with a three-layer insulating wire.

さらに、磁性コア23と接続端子41bとの間については、上記の基準点P1,P2の間に当接部34および壁状絶縁部35を設けて基準点P1,P2間の沿面距離を十分に延長したことで絶縁性が確保されている。具体的には、端子保持部33bに当接部34および壁状絶縁部35が存在しないボビン(図示せず)では、基準点P1,P2間の沿面距離が図5に示す距離Lであるのに対し、当接部34および壁状絶縁部35が設けられている本例のボビン20では、基準点P1,P2間の沿面距離が図5に示す高さH34と高さH35との合計長の2倍の距離に距離Lを合算した非常に長い距離となっている。この基準点P1,P2間の沿面距離は、端子保持部33bに壁状絶縁部35が存在しないボビン(図示せず)における沿面距離(図5に示す高さH34の2倍の距離に距離Lを合算した距離)よりも十分に長くなっている。   Furthermore, between the magnetic core 23 and the connection terminal 41b, a contact portion 34 and a wall-like insulating portion 35 are provided between the reference points P1 and P2 to sufficiently increase the creepage distance between the reference points P1 and P2. Insulation is secured by extending. Specifically, in a bobbin (not shown) in which the contact holding part 34 and the wall-like insulating part 35 are not present in the terminal holding part 33b, the creeping distance between the reference points P1 and P2 is the distance L shown in FIG. On the other hand, in the bobbin 20 of the present example provided with the contact portion 34 and the wall-like insulating portion 35, the creeping distance between the reference points P1 and P2 is the total length of the height H34 and the height H35 shown in FIG. It is a very long distance obtained by adding the distance L to twice the distance. The creepage distance between the reference points P1 and P2 is the distance L to the creepage distance (twice the height H34 shown in FIG. 5) on the bobbin (not shown) where the wall-like insulating portion 35 does not exist in the terminal holding portion 33b. It is sufficiently longer than the total distance).

この場合、磁性コア23と接続端子41bとの間の絶縁性を確保するために当接部34の高さH34と壁状絶縁部35の高さH35とを合計した「壁状絶縁部」が必要とされるトランス3を、基板2におけるスリット12に対応する要素が設けられていない「基板」に実装する際には、壁状絶縁部35の下端部が「部品実装面」に接した状態とする必要が生じることから、その「基板」の「部品実装面」からトランス3の上端部のまでの高さ(トランス3)の実装高が高くなる。これに対して、壁状絶縁部35をスリット12に挿入した状態で基板2にトランス3を実装した本例の実装基板1では、磁性コア23と接続端子41bとの間の絶縁性を損なうことなく、スリット12に挿入した壁状絶縁部35の高さH35の分だけ、基板2の部品実装面Faからトランス3の上端部までの高さ(トランス3の実装高)が低くなっている。   In this case, in order to ensure insulation between the magnetic core 23 and the connection terminal 41b, a “wall-like insulating portion” is obtained by summing the height H34 of the abutting portion 34 and the height H35 of the wall-like insulating portion 35. When the required transformer 3 is mounted on a “board” in which an element corresponding to the slit 12 in the board 2 is not provided, the lower end portion of the wall-shaped insulating portion 35 is in contact with the “component mounting surface”. Therefore, the mounting height from the “component mounting surface” of the “board” to the upper end of the transformer 3 (transformer 3) becomes high. On the other hand, in the mounting substrate 1 of this example in which the transformer 3 is mounted on the substrate 2 with the wall-shaped insulating portion 35 inserted in the slit 12, the insulation between the magnetic core 23 and the connection terminal 41b is impaired. Instead, the height (mounting height of the transformer 3) from the component mounting surface Fa of the substrate 2 to the upper end portion of the transformer 3 is lowered by the height H35 of the wall-like insulating portion 35 inserted into the slit 12.

一方、「基板」の「部品実装面」からトランス3の上端部までの高さをさらに低くするために、壁状絶縁部35だけでなく、当接部34,34の一部も「基板」の厚みの範囲内に位置させる構成を採用しようとしたときには、両当接部34,34を挿入可能な2本のスリットを「基板」に設ける必要が生じる。また、「基板」の「部品実装面」からトランス3の上端部までの高さをさらに低くするために、接続端子41a,41bの位置や形状を適宜変更して磁性コア23の一部を「基板」の厚みの範囲内に位置させる構成を採用しようとしたときには、磁性コア23などを挿入可能な大きな孔を「基板」に設ける必要が生じる。   On the other hand, in order to further reduce the height from the “component mounting surface” of the “board” to the upper end portion of the transformer 3, not only the wall-shaped insulating portion 35 but also a part of the contact portions 34, 34 are “board”. When it is going to employ | adopt the structure located in the range of thickness of this, it will be necessary to provide two slits which can insert both contact parts 34 and 34 in a "board | substrate." Further, in order to further reduce the height from the “component mounting surface” of the “board” to the upper end portion of the transformer 3, the positions and shapes of the connection terminals 41 a and 41 b are appropriately changed so that a part of the magnetic core 23 is “ When it is intended to adopt a configuration that is positioned within the thickness range of the “substrate”, it is necessary to provide a large hole in the “substrate” into which the magnetic core 23 or the like can be inserted.

このため、「基板」の「部品実装面」からトランス3の上端部までの高さをさらに低くしようとしたときには、トランス3における壁状絶縁部35を挿入するために1本のスリット12だけを形成した本例の実装基板1における基板2と比較して、トランス3を実装する「基板」の強度が低下するおそれがある。これに対して、本例の実装基板1における基板2では、トランス3の磁性コア23が部品実装面Faと対向した状態となっており、磁性コア23等を挿入する大きな孔が形成された「基板」とは異なり、十分な強度が確保されている。   For this reason, when trying to further reduce the height from the “component mounting surface” of the “board” to the upper end of the transformer 3, only one slit 12 is provided to insert the wall-like insulating part 35 in the transformer 3. There is a possibility that the strength of the “board” on which the transformer 3 is mounted is lowered as compared with the board 2 in the formed mounting board 1 of this example. On the other hand, in the board 2 in the mounting board 1 of the present example, the magnetic core 23 of the transformer 3 is in a state of facing the component mounting surface Fa, and a large hole for inserting the magnetic core 23 and the like is formed. Unlike the “substrate”, sufficient strength is secured.

この後、図示しない樹脂ケース内に実装基板1を収容することにより、AC/DCコンバータが完成する(図示せず)。   Thereafter, the mounting substrate 1 is accommodated in a resin case (not shown) to complete the AC / DC converter (not shown).

このように、この実装基板1では、接続端子41a,41a・・および接続端子41b,41b・・のうちの少なくとも一方の接続端子群(本例では、接続端子41b,41b・・)における「突出部位」のなかで磁性コア23との離間距離が最も短い基準点P1と磁性コア23において基準点P1との離間距離が最も短い基準点P2との間に基準点P1,P2間の沿面距離を延長する壁状絶縁部35をトランス3のボビン20に設けると共に、接続端子41a,41bを基板2の端子挿通孔11a,11bに挿通させ、ボビン20の当接部34,34を基板2の部品実装面Faに当接させ、かつボビン20の壁状絶縁部35を基板2のスリット12に挿入すると共に磁性コア23が基板2の部品実装面Faと対向するようにトランス3を基板2に実装している。また、この電源装置100では、実装基板1をケーシング内に収容して構成している。   As described above, in the mounting substrate 1, the “protrusion” in the connection terminal group (in this example, the connection terminals 41 b, 41 b...) Of the connection terminals 41 a, 41 a. The creepage distance between the reference points P1 and P2 is between the reference point P1 having the shortest separation distance from the magnetic core 23 and the reference point P2 having the shortest separation distance from the reference point P1 in the magnetic core 23. The extending wall-like insulating portion 35 is provided on the bobbin 20 of the transformer 3, the connection terminals 41 a and 41 b are inserted into the terminal insertion holes 11 a and 11 b of the substrate 2, and the contact portions 34 and 34 of the bobbin 20 are components of the substrate 2. Based on the transformer 3, the wall-like insulating portion 35 of the bobbin 20 is inserted into the slit 12 of the substrate 2 and the magnetic core 23 faces the component mounting surface Fa of the substrate 2. It has been implemented in 2. In the power supply device 100, the mounting substrate 1 is housed in a casing.

したがって、この実装基板1および電源装置100によれば、磁性コア23を挿入可能な大きな孔を「基板」に設けることなく、スリット12に挿入した壁状絶縁部35の高さH35の分だけ、基板2の部品実装面Faからトランス3の上端部までの高さを低くすることができる。これにより、基板2の強度が低下する事態を招くことなく、実装基板1および電源装置100を十分に小型化することができる。また、接続端子41bと磁性コア23との絶縁性を確保することを目的として磁性コア23に絶縁被覆を施す必要がないため、実装基板1および電源装置100の製造コストを十分に低減することができる。   Therefore, according to the mounting substrate 1 and the power supply device 100, without providing a large hole in the “substrate” into which the magnetic core 23 can be inserted, only the height H35 of the wall-shaped insulating portion 35 inserted into the slit 12 is obtained. The height from the component mounting surface Fa of the substrate 2 to the upper end of the transformer 3 can be reduced. Thereby, the mounting substrate 1 and the power supply device 100 can be sufficiently downsized without causing a situation where the strength of the substrate 2 is reduced. In addition, since it is not necessary to apply an insulating coating to the magnetic core 23 for the purpose of ensuring the insulation between the connection terminal 41b and the magnetic core 23, the manufacturing costs of the mounting substrate 1 and the power supply device 100 can be sufficiently reduced. it can.

また、この実装基板1および電源装置100によれば、接続端子41aおよび接続端子41bのうちの、他方の絶縁線よりも高い絶縁性を有する被覆が施された線材で構成された絶縁線(本例では、三層絶縁線)が接続されている一方(本例では、接続端子41b)だけを「一方の接続端子群」として壁状絶縁部35をボビン20に設けたことにより、「壁状絶縁部」を挿入するために「基板」に設ける「スリット」の数が1つ(本例では、スリット12だけ)で済むため、十分に強度が高い基板2を備えた実装基板1および電源装置100を提供することができる。   In addition, according to the mounting substrate 1 and the power supply device 100, the insulating wire (the book) made of a wire having a coating having higher insulation than the other insulating wire of the connecting terminal 41a and the connecting terminal 41b. In the example, the wall-like insulating portion 35 is provided on the bobbin 20 with only one (in this example, the connection terminal 41b) to which the three-layer insulation wire is connected as the "one connection terminal group", thereby providing a "wall-like Since the number of “slits” provided in the “substrate” for inserting the “insulating portion” is only one (in this example, only the slit 12), the mounting substrate 1 and the power supply device including the substrate 2 having sufficiently high strength are provided. 100 can be provided.

なお、「絶縁トランス実装基板」および「電源装置」の構成は、上記の実装基板1および電源装置100の構成の例に限定されない。例えば、端子保持部33bだけに「壁状絶縁部」としての壁状絶縁部35を設けた構成を例に挙げて説明したが、端子保持部33aにも壁状絶縁部35と同様の「壁状絶縁部」を設けることができる。このような構成の「ボビン」を採用したときには、スリット12に加え、端子保持部33aに形成した壁状絶縁部35を挿入可能な「スリット」を設ければ良い。   Note that the configurations of the “insulating transformer mounting substrate” and the “power supply device” are not limited to the configuration examples of the mounting substrate 1 and the power supply device 100 described above. For example, the configuration in which the wall-shaped insulating portion 35 as the “wall-shaped insulating portion” is provided only in the terminal holding portion 33b has been described as an example, but the terminal holding portion 33a has the same “wall” as the wall-shaped insulating portion 35. ”-Like insulating portion” can be provided. When the “bobbin” having such a configuration is adopted, in addition to the slit 12, a “slit” into which the wall-like insulating portion 35 formed in the terminal holding portion 33a can be inserted may be provided.

また、インサート成形によって接続端子41a,41bが端子保持部33a,33bに保持された状態となっているボビン20を例に挙げて説明したが、「ボビン」の構成はこの例に限定されず、端子保持部33a,33bに相当する部位に予め形成された端子挿入孔に接続端子41a,41bを圧入することで保持させる構成を採用することもできる。さらに、E字コアで構成された上側コア部材23aおよび下側コア部材23bによって磁性コア23を構成した例について説明したが、「磁性コア」の構成はこれに限定されず、E字コア、I字コア、T字コアおよびC字コアなどを適宜組み合わせて磁性コア23と同様の「磁路」を形成する構成を採用することができる。   In addition, the bobbin 20 in which the connection terminals 41a and 41b are held in the terminal holding portions 33a and 33b by insert molding has been described as an example. However, the configuration of the “bobbin” is not limited to this example. It is also possible to adopt a configuration in which the connection terminals 41a and 41b are held by being press-fitted into terminal insertion holes formed in advance in portions corresponding to the terminal holding portions 33a and 33b. Furthermore, although the example which comprised the magnetic core 23 by the upper core member 23a comprised by the E-shaped core and the lower core member 23b was demonstrated, the structure of a "magnetic core" is not limited to this, An E-shaped core, I A configuration in which a “magnetic path” similar to that of the magnetic core 23 is formed by appropriately combining a character core, a T-shaped core, a C-shaped core, and the like can be employed.

また、「電源装置」の一例である電源装置100(AC/DCコンバータ)を例に挙げて説明したが、DC/DCコンバータやDC/ACコンバータなどの各種の「電源装置」において上記の実装基板1と同様の構成を採用することができる。   Further, the power supply device 100 (AC / DC converter) which is an example of the “power supply device” has been described as an example. However, in the various “power supply devices” such as a DC / DC converter and a DC / AC converter, the mounting board described above is used. 1 can be adopted.

100 電源装置
1 実装基板
2 基板
3 トランス
11a,11b 端子挿通孔
12 スリット
20 ボビン
21a,21b 一次巻線
22 二次巻線
23 磁性コア
23a 上側コア部材
23b 下側コア部材
31 筒部
31h 挿通孔
32a,32b フランジ部
33a,33b 端子保持部
34 当接部
35 壁状絶縁部
41a,41b 接続端子
Fa 部品実装面
Fb 裏面
H34,H35 高さ
L 距離
La,Lb 長さ
P1,P2 基準点
T 厚み
DESCRIPTION OF SYMBOLS 100 Power supply device 1 Mounting board 2 Board | substrate 3 Transformer 11a, 11b Terminal insertion hole 12 Slit 20 Bobbin 21a, 21b Primary winding 22 Secondary winding 23 Magnetic core 23a Upper core member 23b Lower core member 31 Cylindrical part 31h Insertion hole 32a , 32b Flange portion 33a, 33b Terminal holding portion 34 Abutting portion 35 Wall-like insulating portion 41a, 41b Connection terminal Fa Component mounting surface Fb Back surface H34, H35 Height L Distance La, Lb Length P1, P2 Reference point T Thickness

Claims (3)

第1の絶縁線がボビンに巻回されて一次巻線が形成され、かつ第2の絶縁線が当該ボビンに巻回されて二次巻線が形成されると共に磁性コアが当該ボビンに装着された絶縁トランスが基板の部品実装面に実装されている絶縁トランス実装基板であって、
前記ボビンは、前記基板に実装された実装状態において当該基板の前記部品実装面に当接可能な当接部と、前記第1の絶縁線における両端部がそれぞれ接続されることで前記実装状態において前記一次巻線を前記基板に接続する第1の接続端子群と、前記第2の絶縁線における両端部がそれぞれ接続されることで前記実装状態において前記二次巻線を前記基板に接続する第2の接続端子群とを備えると共に、前記第1の接続端子群および前記第2の接続端子群のうちの少なくとも一方の接続端子群における突出部位のなかで前記磁性コアとの離間距離が最も短い第1の基準点と当該磁性コアにおいて当該第1の基準点との離間距離が最も短い第2の基準点との間に当該第1の基準点および当該第2の基準点間の沿面距離を延長する壁状絶縁部が設けられて構成され、
前記基板は、前記第1の接続端子群および前記第2の接続端子群をそれぞれ挿通可能な端子挿通孔と、前記壁状絶縁部を挿入可能なスリットとが設けられ、
前記絶縁トランスは、前記第1の接続端子群および前記第2の接続端子群が前記基板の前記端子挿通孔に挿通させられ、前記ボビンの前記当接部が前記基板の前記部品実装面に当接させられ、かつ前記ボビンの前記壁状絶縁部における少なくとも一部が前記基板の前記スリットに挿入されると共に、前記磁性コアが前記基板の厚みの範囲内に位置せずに当該基板の厚み方向で前記部品実装面と対向するように当該基板に実装されている絶縁トランス実装基板。
A first insulated wire is wound around a bobbin to form a primary winding, and a second insulated wire is wound around the bobbin to form a secondary winding, and a magnetic core is attached to the bobbin. An insulated transformer mounting board in which the insulated transformer is mounted on the component mounting surface of the board,
In the mounted state, the bobbin is connected to a contact portion that can contact the component mounting surface of the substrate in a mounted state mounted on the substrate and both end portions of the first insulating wire. A first connection terminal group for connecting the primary winding to the substrate and both ends of the second insulating wire are connected to each other to connect the secondary winding to the substrate in the mounted state. 2 connection terminal groups, and the separation distance from the magnetic core is the shortest among the protruding portions of at least one of the first connection terminal groups and the second connection terminal groups. The creepage distance between the first reference point and the second reference point is between the first reference point and the second reference point having the shortest separation distance from the first reference point in the magnetic core. Extending wall insulation Is configured provided,
The substrate is provided with a terminal insertion hole through which the first connection terminal group and the second connection terminal group can be inserted, and a slit into which the wall-like insulating portion can be inserted,
In the insulating transformer, the first connection terminal group and the second connection terminal group are inserted into the terminal insertion hole of the board, and the abutting portion of the bobbin contacts the component mounting surface of the board. And at least a portion of the wall-like insulating portion of the bobbin is inserted into the slit of the substrate, and the magnetic core is not positioned within the thickness range of the substrate, and the thickness direction of the substrate the component mounting surface and in which an insulating transformer mounting board is implemented on the substrate so as to face in.
前記絶縁トランスは、前記第1の絶縁線および前記第2の絶縁線のいずれか一方の絶縁線が他方の絶縁線よりも高い絶縁性を有する被覆が施された線材で構成され、
前記ボビンは、前記一方の絶縁線が前記第1の絶縁線のときには前記第1の接続端子群だけを前記一方の接続端子群として前記壁状絶縁部が設けられ、前記一方の絶縁線が前記第2の絶縁線のときには前記第2の接続端子群だけを前記一方の接続端子群として前記壁状絶縁部が設けられている請求項1記載の絶縁トランス実装基板。
The insulating transformer is composed of a wire material provided with a coating in which either one of the first insulating wire and the second insulating wire has a higher insulating property than the other insulating wire,
The bobbin is provided with the wall-shaped insulating portion with only the first connecting terminal group as the one connecting terminal group when the one insulating wire is the first insulating wire, and the one insulating wire is 2. The insulated transformer mounting substrate according to claim 1, wherein when the second insulating wire is used, the wall-like insulating portion is provided with only the second connecting terminal group as the one connecting terminal group.
請求項1または2記載の絶縁トランス実装基板がケーシング内に収容されている電源装置。   A power supply apparatus in which the insulating transformer mounting board according to claim 1 is accommodated in a casing.
JP2015143215A 2015-07-17 2015-07-17 Insulated transformer mounting board and power supply Active JP6569351B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015143215A JP6569351B2 (en) 2015-07-17 2015-07-17 Insulated transformer mounting board and power supply
CN201610553145.3A CN106356180A (en) 2015-07-17 2016-07-14 Insulating transformer mounting board and power supply apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015143215A JP6569351B2 (en) 2015-07-17 2015-07-17 Insulated transformer mounting board and power supply

Publications (2)

Publication Number Publication Date
JP2017028023A JP2017028023A (en) 2017-02-02
JP6569351B2 true JP6569351B2 (en) 2019-09-04

Family

ID=57843249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015143215A Active JP6569351B2 (en) 2015-07-17 2015-07-17 Insulated transformer mounting board and power supply

Country Status (2)

Country Link
JP (1) JP6569351B2 (en)
CN (1) CN106356180A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6984346B2 (en) * 2017-11-24 2021-12-17 Tdk株式会社 Electronic devices and manufacturing methods for electronic devices
JP7302236B2 (en) * 2019-03-29 2023-07-04 Tdk株式会社 Trance

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729290Y2 (en) * 1979-01-17 1982-06-26
JPH09121080A (en) * 1995-10-26 1997-05-06 Tec Corp Fixing structure for circuit board assembling member
JP2001143942A (en) * 1999-11-18 2001-05-25 Cosel Co Ltd Layer winding transformer and bobbin for transformer
JP4022529B2 (en) * 2004-05-31 2007-12-19 兼教 角田 Trance
JP2008147358A (en) * 2006-12-08 2008-06-26 Fdk Corp Insulating transformer
JP5500352B2 (en) * 2010-02-19 2014-05-21 日立金属株式会社 Trance
JP5603640B2 (en) * 2010-04-23 2014-10-08 パナソニック株式会社 Power supply
US20120038448A1 (en) * 2010-08-11 2012-02-16 Samsung Electro-Mechanics Co., Ltd. Transformer and display device using the same
CN102568782B (en) * 2010-12-20 2015-05-13 三星电机株式会社 Transformer and flat panel display device including the same
JP2013215053A (en) * 2012-04-03 2013-10-17 Mitsubishi Electric Corp Power supply device and power module
CN202905417U (en) * 2012-11-21 2013-04-24 深圳市奥海科技有限公司 Transformer framework
CN104170026B (en) * 2012-11-30 2017-05-24 古河电气工业株式会社 Insulated wire and electrical/electronic device
JP3184261U (en) * 2013-04-08 2013-06-20 スミダコーポレーション株式会社 Magnetic element
KR20150050025A (en) * 2013-10-31 2015-05-08 삼성전기주식회사 Coil component

Also Published As

Publication number Publication date
CN106356180A (en) 2017-01-25
JP2017028023A (en) 2017-02-02

Similar Documents

Publication Publication Date Title
JP2008112753A (en) Lateral low-profile coil part, and soldering method of its winding terminal
JP2005142459A (en) Surface mounted inductor
JP6637834B2 (en) Electromagnetic inductor and method of manufacturing electromagnetic inductor
JP6569351B2 (en) Insulated transformer mounting board and power supply
US10951100B2 (en) Winding method for electric motor stator, electric motor stator, and fan electric motor
KR101610339B1 (en) Coil component and manufacturing method there of
JP3184261U (en) Magnetic element
JP2006032589A (en) Transformer
KR20160042560A (en) Coil component and manufacturing method thereof
JP6413639B2 (en) Magnetic element
KR102143868B1 (en) Flat type transformer
US20220189687A1 (en) Leakage transformer
KR101656013B1 (en) Coil component
JP5059050B2 (en) Winding frame and winding parts
JP6156042B2 (en) Transformer device and method of manufacturing transformer device
JP5088638B2 (en) Coil component, transformer, and method of manufacturing coil component
JP2017130604A (en) Surface-mount inductor
JP4831775B2 (en) Winding parts
JP2007103974A (en) Transformer
JP2007174787A (en) Stator of rotating electric machine
JP2013168476A (en) Common mode choke coil
JP2011049433A (en) Transformer
JP2001076942A (en) Transformer
JP2016207811A (en) Surface-mounting transformer
US11538623B2 (en) Coil component, electronic component, and electronic apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180306

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180911

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181105

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190423

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190621

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190709

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190722

R150 Certificate of patent or registration of utility model

Ref document number: 6569351

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150