JP6529866B2 - Capacitive sensor, touch panel and electronic device - Google Patents

Description

  The present invention relates to a capacitive sensor, a touch panel and an electronic device, and more particularly to a capacitive sensor, a touch panel and an electronic device capable of expanding a detection area.

  Patent Document 1 discloses a touch panel in which a sensor substrate and a cover substrate are bonded to each other via a fixing layer. The cover substrate described in Patent Document 1 is provided with a light shielding layer and a conductive layer. The conductive layer is provided in contact with the surface of the light shielding layer and has a width wider than the width of the signal wiring. The conductive layer is made of a metal material, and is made of, for example, a low resistance material such as a conductive paste or silver paste. Furthermore, the conductive layer is provided in an area outside the area facing the signal wiring, and extends along the periphery of the sensor electrode and the signal wiring. Therefore, the conductive layer described in Patent Document 1 functions as a guard ring for ESD (Electro Static Discharge) measures.

  Here, generally, the periphery of the sensor electrode and the signal wiring is an area where a fixed layer used when bonding the touch panel to a housing or the like of the device is provided. In the touch panel described in Patent Document 1, a conductive layer functioning as a guard ring for ESD protection is provided in a region where the fixed layer is provided. Therefore, the touch panel described in Patent Document 1 does not have to newly provide a space for the conductive layer in the in-plane layout of the touch panel, and as a result, it is possible to take ESD measures without widening the frame.

JP, 2013-161397, A

  However, in the touch panel described in Patent Document 1, the conductive layer is provided in an area around the sensor electrode and the signal wiring (an area provided with the fixed layer), and is provided in contact with the surface of the light shielding layer. That is, the conductive layer is provided in the decoration area (non-detection area) formed on the periphery of the detection area of the touch panel. Therefore, while the touch panel described in Patent Document 1 can take ESD measures without widening the frame, it is difficult to narrow the frame to widen the detection area of the touch panel and to take ESD measures.

  The present invention is intended to solve the above-described conventional problems, and has an object to provide a capacitance type sensor, a touch panel, and an electronic device capable of taking an ESD countermeasure and expanding a detection region.

  In one aspect of the capacitive sensor according to the present invention, a light-transmissive substrate, a light-transmissive transparent electrode provided on a detection region on the substrate, and a region outside the detection region A wiring portion electrically connected to the transparent electrode, a panel provided on the transparent electrode and the wiring portion having light transmitting property, and a shield wiring provided on the side surface of the panel And.

  According to the capacitance type sensor according to one aspect of the present invention, since the shield wire having conductivity is provided on the side surface of the panel, even when ESD occurs, the wire portion is prevented from being melted and broken, and the ESD is suppressed. Measures can be taken. In addition, since the shield wiring is not provided substantially in parallel with the wiring portion, and provided on the side of the panel, there is no need to provide a space for providing the shield wiring substantially in parallel with the wiring portion. , The detection area can be expanded. As described above, according to the capacitance type sensor according to one aspect of the present invention, it is possible to take ESD measures and widen the detection region.

  The capacitance type sensor according to the present invention further comprises a decorative layer provided on the surface of the panel facing the wiring portion in the outer region and having a light shielding property, and the wiring portion is made of a material having a metal. It may be formed. According to this, even when a low resistance metal is used for the wiring portion, the shield wiring can suppress melting of the wiring portion, and can take ESD measures. Further, it is not necessary to provide a space for providing the shield wiring substantially in parallel with the wiring portion, and the decoration area formed by the decoration layer can be narrowed, so that the detection area can be expanded.

  In the capacitance type sensor of the present invention, the wiring portion may be formed of a transparent conductive material, and the shield wiring may be formed of a black-based material. According to this, even when the decoration area is not provided, it is possible not only to take ESD measures but also to arrange the transparent electrode to the vicinity of the side surface of the panel. Therefore, the detection area can be expanded. Further, since the shield wiring is formed of a black based material, it absorbs a part of light emitted from, for example, the display panel etc., and reduces the possibility of light leakage generated by reflection in the shield wiring from the operation surface It can be done. Therefore, the image from the display panel can be clearly displayed.

  The capacitive sensor according to the present invention further includes a flexible printed circuit board electrically connected to the wiring portion, and the shield wiring is electrically connected to a portion of the flexible printed circuit board set to a ground potential. It may be connected. According to this, since the shield wiring is electrically connected to the portion of the flexible printed board set to the ground potential, the touch panel, the electronic device, etc. may be, for example, even during transportation of the capacitive sensor. Products can be protected from ESD.

  The touch panel according to the present invention, in one aspect, includes a display panel and a touch sensor provided on the display panel, and the touch sensor is any one of the above-described capacitance sensors. I assume. According to this, it is possible to provide a touch panel in which an ESD countermeasure is taken and the detection area is expanded by the electrostatic capacitance type sensor provided on the side surface of the panel and having the conductive shield wiring.

  An electronic device according to the present invention includes the above touch sensor. According to this, it is possible to provide an electronic device in which the ESD countermeasure is taken and the detection area is expanded by the capacitance type sensor provided on the side surface of the panel and having the conductive shield wiring.

  In the electronic device of the present invention, the electronic apparatus may further include a housing for fixing the above-described touch sensor, and the housing may have a protrusion in contact with the shield wiring and electrically connected to the shield wiring. . According to this, since the projection of the housing is electrically connected to the shield wiring, for example, the volume of the wiring connected to the portion set to the ground potential can be increased. Therefore, the shield effect can be enhanced as compared with the case where the projection is not electrically connected to the shield wiring.

  According to the present invention, it is possible to provide a capacitive sensor, a touch panel, and an electronic device capable of taking ESD measures and expanding the detection area.

It is a schematic plan view showing the capacitance type sensor concerning this embodiment. It is the typical enlarged view to which area | region A1 represented to FIG. 1 was expanded. FIG. 3 is a schematic cross-sectional view of the cross section A-A shown in FIG. It is a schematic cross section showing the electrostatic capacitance type sensor concerning this embodiment. It is a schematic cross section showing the electrostatic capacitance type sensor which concerns on other embodiment. It is a schematic cross section showing the state where the electric capacity type sensor concerning this embodiment was installed in the case of an apparatus. It is a schematic diagram which shows the application example of the electrostatic capacitance type sensor which concerns on this embodiment. It is a schematic diagram which shows the application example of the electrostatic capacitance type sensor which concerns on this embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals and the detailed description will be appropriately omitted.
FIG. 1 is a schematic plan view showing a capacitance type sensor according to the present embodiment.
FIG. 2 is a schematic enlarged view of the area A1 shown in FIG.
FIG. 3 is a schematic cross-sectional view of the cross section A-A shown in FIG.
FIG. 4 is a schematic cross-sectional view showing the capacitance type sensor according to the present embodiment.
FIG. 4A is a schematic cross-sectional view of the cross section B-B shown in FIG. FIG.4 (b) is typical sectional drawing in cut surface CC shown to FIG.

  In the present specification, “transparent” and “translucent” refer to a state in which the visible light transmittance is 50% or more (preferably 80% or more). Furthermore, it is preferable that the haze value is 6% or less. In the present specification, the terms "light shielding" and "light shielding property" refer to a state in which the visible light transmittance is less than 50% (preferably less than 20%).

  As shown in FIGS. 1 to 3, the capacitance type sensor 1 according to this embodiment includes a substrate 2, a first electrode 8, a second electrode 12, a wiring portion 6, and a panel 3. , And shield wiring 18.

  The first electrode 8 is provided in a detection area 11 (an area where an operation can be performed by an operating body such as a finger), and has a plurality of first transparent electrodes 4. As shown in FIG. 3, the plurality of first transparent electrodes 4 are formed on the surface 2 a of the base 2. The respective first transparent electrodes 4 are connected in the Y1-Y2 direction (first direction) via the elongated connecting portions 7. Then, the first electrodes 8 having the plurality of first transparent electrodes 4 connected in the Y1-Y2 direction are arranged at intervals in the X1-X2 direction.

  The first transparent electrode 4 and the connecting portion 7 are formed of a transparent conductive material such as ITO (Indium Tin Oxide) by sputtering, vapor deposition, or the like. As the transparent conductive material, in addition to ITO, metal nanowires represented by silver nanowires, thin metals formed in a mesh shape, or conductive polymers may be mentioned. The same is true for the transparent conductive material described later. The substrate 2 is translucent, and is formed of a film-like transparent substrate such as polyethylene terephthalate (PET) or a glass substrate.

  The second electrode 12 is provided in the detection area 11 and has a plurality of second transparent electrodes 5. As shown in FIG. 3, the plurality of second transparent electrodes 5 are formed on the surface 2 a of the base 2. Thus, the second transparent electrode 5 is formed on the same surface (the surface 2 a of the base 2) as the first transparent electrode 4. As shown in FIGS. 2 and 3, the respective second transparent electrodes 5 are connected in the X1-X2 direction (the second direction) via the elongated bridge wiring 10. The second electrodes 12 having the plurality of second transparent electrodes 5 connected in the X1-X2 direction are arranged at intervals in the Y1-Y2 direction. The X1-X2 direction intersects with the Y1-Y2 direction. For example, the X1-X2 direction is perpendicular to the Y1-Y2 direction.

  The second transparent electrode 5 is formed of a transparent conductive material such as ITO by sputtering or vapor deposition. The bridge wiring 10 is formed of a transparent conductive material such as ITO. Alternatively, the bridge wiring 10 may have a first layer containing a transparent conductive material such as ITO, and a second layer made of a metal that is lower in resistance than the first layer and is transparent. When the bridge wiring 10 has a stacked structure of a first layer and a second layer, the second layer is preferably formed of any selected from the group consisting of Au, an Au alloy, CuNi and Ni. It is. Among these, it is more preferable to select Au. When the second layer is formed of Au, the bridge wiring 10 can obtain excellent environmental resistance (moisture resistance, heat resistance).

  In FIG. 1, the first transparent electrode 4, the second transparent electrode 5, and the wiring portion 6 formed on the surface 2 a of the base material 2 included in the capacitance type sensor 1 are illustrated. However, in practice, as shown in FIG. 3, the panel 3 is provided on the surface 2 a side of the base material 2. The panel 3 has translucency. For example, on the back surface 3b (the surface facing the wiring portion 6: the surface on the opposite side to the operation surface 3a of the panel 3) of the region (the region outside the detection region 11) where the wiring portion 6 is provided, The decorative layer 9 is present. Therefore, when the decoration layer 9 exists, the wiring part 6 can not be seen from the surface side (the operation surface 3a side) of the panel 3. That is, the decorative layer 9 has a light shielding property. In addition, since a transparent electrode is transparent and can not be visually recognized, it has shown the external shape of a transparent electrode in FIG. Further, in the present embodiment, the decorative layer 9 may not necessarily be provided except for the region where the external connection portion 27 is provided.

  As shown in FIGS. 2 and 3, an insulating layer 20 is formed on the surface of the connecting portion 7 connecting the first transparent electrodes 4. As shown in FIG. 3, the insulating layer 20 fills the space between the connecting portion 7 and the second transparent electrode 5 and slightly runs on the surface of the second transparent electrode 5. As the insulating layer 20, for example, novolac resin (resist) is used.

  As shown in FIGS. 2 and 3, the bridge wiring 10 is formed from the surface 20 a of the insulating layer 20 to the surfaces of the second transparent electrodes 5 located on both sides of the insulating layer 20 in the X1-X2 direction. The bridge wiring 10 electrically connects the second transparent electrodes 5.

  As shown in FIGS. 2 and 3, the insulating layer 20 is provided on the surface of the connecting portion 7 connecting the first transparent electrodes 4, and the second transparent electrodes 5 are provided on the surface of the insulating layer 20. A bridge wiring 10 to be connected is provided. As described above, the insulating layer 20 is interposed between the connection portion 7 and the bridge wiring 10, and the first transparent electrode 4 and the second transparent electrode 5 are electrically insulated. In the present embodiment, the first transparent electrode 4 and the second transparent electrode 5 can be formed on the same surface (the surface 2 a of the base 2), and the thinning of the capacitive sensor 1 can be realized.

  The connecting portion 7, the insulating layer 20, and the bridge wiring 10 are all located in the detection region 11 and have translucency similar to the first transparent electrode 4 and the second transparent electrode 5.

  In the capacitance type sensor 1 shown in FIG. 1, the periphery (outside) of the detection area 11 is a frame-like decoration area (non-detection area) 25. While the detection area 11 has translucency, the decoration area 25 does not have translucency. That is, the decoration area 25 has a light shielding property. Therefore, in the capacitance type sensor 1 shown in FIG. 1, the wiring portion 6 and the external connection portion 27 provided in the decoration area 25 should be viewed from the surface (surface of the panel 3) of the capacitance type sensor 1. I can not do it. Further, as shown in FIG. 3, a decorative layer 9 is formed on the back surface 3 b of the panel 3 in the decorative area 25. As described above, the decorative layer 9 may not necessarily be provided except for the region where the external connection portion 27 is provided.

  As shown in FIG. 1, a plurality of wiring portions 6 drawn from the respective first electrodes 8 and the respective second electrodes 12 are formed in the decoration area 25. Each of the first electrode 8 and the second electrode 12 is electrically connected to the wiring portion 6 via the connection wiring 16. As shown in FIG. 1, the tip of each wiring portion 6 is formed as an external connection portion 27 electrically connected to the flexible printed circuit board 29. As shown in FIG. 4B, the external connection portion 27 is electrically connected to the flexible printed circuit board 29, for example, via the conductive paste.

  Each wiring portion 6 is formed of a material having a metal such as Cu, Cu alloy, CuNi alloy, Ni, Ag, Au or the like. The connection wiring 16 is formed of a transparent conductive material such as ITO and extends from the detection area 11 to the decoration area 25. The wiring portion 6 is stacked on the connection wiring 16 in the decoration area 25 and is electrically connected to the connection wiring 16. In the case where the decorative layer 9 is not provided in the area excluding the area where the external connection section 27 is provided, each wiring section 6 is formed of a transparent conductive material such as ITO by sputtering or evaporation. Ru.

  As shown in FIG. 3, the panel 3 is bonded to the substrate 2 via an optical clear adhesive layer (OCA; Optical Clear Adhesive) 30 provided between the substrate 2 and the panel 3. The material of the panel 3 is not particularly limited. As a material of the panel 3, a glass substrate or a plastic substrate is preferably applied. The optically transparent adhesive layer (OCA) 30 is an acrylic adhesive, a double-sided adhesive tape, or the like.

  As shown in FIGS. 1 to 3, a shield wiring 18 is provided on the side surface of the panel 3. Specifically, as shown in FIG. 1, the shield wiring 18 is provided on the other side surfaces 3c, 3d, 3e excluding the side surface 3f in the region where the external connection portion 27 is provided. The shield wiring 18 has conductivity and is formed of a material having a metal such as Cu, Cu alloy, CuNi alloy, Ni, Ag, Au or the like. The shield wiring 18 is formed of an ink containing a metal material, for example, by screen printing. Alternatively, the shield wiring 18 may be formed of a material having a metal by sputtering, evaporation, or the like. Alternatively, the shield wiring 18 may be formed, for example, by screen printing using an ink containing a carbon-based conductive material.

  As shown in FIGS. 1 and 4A, the shield wiring 18 extends from the side surfaces 3c and 3e of the panel 3 to the back surface 3b of the panel 3 toward the flexible printed circuit board 29 on both sides of the external connection portion 27. ing. The connection between the shield wiring 18 provided on the side surfaces 3c and 3e of the panel 3 and the shield wiring 18 provided on the back surface 3b of the panel 3 is formed of ink containing a metal material, for example, by screen printing. Ru. Alternatively, the connection between the shield wiring 18 provided on the side surfaces 3 c and 3 e of the panel 3 and the shield wiring 18 provided on the back surface 3 b of the panel 3 may be formed by sputtering or vapor deposition.

  As shown in FIG. 4A, the shield wiring 18 is electrically connected to, for example, a portion of the flexible printed board 29 set to the ground potential as a reference potential, for example, via the conductive paste 28.

  In the capacitance type sensor 1 shown in FIG. 1, as shown in FIG. 3, when the finger F is brought into contact with the operation surface 3a of the panel 3, between the finger F and the first transparent electrode 4 near the finger F, A capacitance occurs between the finger F and the second transparent electrode 5 close to the finger F. The capacitance type sensor 1 can calculate the contact position of the finger F based on the change in capacitance at this time. The capacitive sensor 1 detects the X coordinate of the position of the finger F based on the change in capacitance between the finger F and the first electrode 8, and detects the X coordinate between the finger F and the second electrode 12. The Y coordinate of the position of the finger F is detected based on the change in capacitance (self-capacitance detection type).

  Alternatively, the capacitive sensor 1 may be of mutual capacitance detection type. That is, the capacitance type sensor 1 applies a drive voltage to one row of either one of the first electrode 8 and the second electrode 12, and either the first electrode 8 or the second electrode 12. A change in capacitance between the other electrode and the finger F may be detected. Thereby, the capacitance type sensor 1 detects the Y coordinate of the position of the finger F by the other electrode, and detects the X coordinate of the position of the finger F by one electrode.

Here, when an electrostatic discharge (ESD) occurs outside the capacitive sensor 1 and a voltage is applied to the capacitive sensor 1, the current flows from the side surfaces 3 c, 3 d, and so on of the panel 3. It flows into the shield wiring 18 provided in 3e (surface of the outermost periphery of the electrostatic capacitance type sensor 1). The shield wiring 18 is electrically connected to, for example, a portion of the flexible printed board 29 set to the ground potential as a reference potential, so that the flow of current to the wiring portion 6 can be suppressed. That is, when a voltage is applied to the capacitive sensor 1 by the ESD generated outside the capacitive sensor 1, the current can be suppressed from flowing to the shield wiring 18 and to the wiring portion 6. . Therefore, it is possible to suppress large current from instantaneously flowing into the wiring portion 6 and generating local heat generation and melting of the wiring portion 6.
This is not limited to ESD, and is the same as when noise is generated outside the capacitive sensor 1.

  According to the present embodiment, since the shield wiring 18 is provided on the side surfaces 3c, 3d and 3e of the panel 3, even when ESD occurs, the wiring portion 6 is prevented from melting and disconnection and ESD countermeasure is taken. it can. Further, the shield wiring 18 is not provided substantially in parallel with the wiring portion 6, and is provided on the side surfaces 3 c, 3 d, 3 e of the panel 3. Therefore, it is not necessary to provide a space for providing the shield wiring 18 substantially in parallel with the wiring portion 6, and the decoration area 25 can be narrowed. Thereby, the detection area 11 can be expanded.

  Further, since the shield wiring 18 is electrically connected to, for example, a portion of the flexible printed circuit board 29 set to the ground potential as the reference potential, for example, the touch panel is And products such as electronic devices can be protected from ESD.

  Furthermore, even if the decoration area 25 is not provided in the area other than the area where the external connection portion 27 is provided, by using a metal of low resistance as the material of the shield wiring 18, not only can ESD measures can be taken. The first electrode 8 and the second electrode 12 can be disposed up to the vicinity of the side surfaces 3c, 3d, 3e of the panel 3. Thereby, the detection area 11 can be expanded.

FIG. 5 is a schematic cross-sectional view showing a capacitance type sensor according to another embodiment.
In addition, FIG. 5 is corresponded to the typical sectional drawing in cut surface AA represented to FIG. Moreover, in the electrostatic capacity type sensor shown in FIG. 5, the 1st transparent electrode 4, the 2nd transparent electrode 5, and the wiring part 6 are abbreviate | omitted for convenience of explanation.

  The capacitance type sensor 1 a shown in FIG. 5 is provided on the display panel 210. For example, a liquid crystal display panel is used as the display panel 210. The decorative layer 9 is not provided in the capacitance type sensor 1a according to the present embodiment except for the region where the external connection portion 27 is provided. In other words, in the capacitance type sensor 1a according to the present embodiment, the decoration area 25 is not provided except the area where the external connection portion 27 is provided.

  Shield wires 18 are provided on the side surfaces 3c, 3d, 3e of the panel 3 (see FIG. 1). The shield wiring 18 of the capacitance type sensor 1a is formed by screen printing with an ink of a black-based material such as carbon, for example, and can shield light.

  As indicated by an arrow A11 shown in FIG. 5, part of the light emitted from the display panel 210 passes through the capacitive sensor 1a and is emitted to the outside of the capacitive sensor 1a. Further, as indicated by an arrow A12 shown in FIG. 5, another part of the light emitted from the display panel 210 proceeds to the side surface 3 c of the panel 3. The other part of the light emitted from the display panel 210 travels not only to the side surface 3c but also to the other side surfaces 3d and 3e (see FIG. 1).

  Here, since the shield wiring 18 of the capacitive sensor 1 a is formed of, for example, a black-based material such as carbon, light which travels in the direction of the arrow A 12 is easily absorbed by the side surface 3 c of the panel 3. For this reason, it is hard to produce reflected light like arrow A13. That is, by forming the shield wiring 18 with a black-based material, the possibility of the occurrence of light leakage like the arrow A13 shown in FIG. 5 from the operation surface 3a of the panel 3 can be reduced. Therefore, the image from the display panel 210 can be displayed clearly.

FIG. 6 is a schematic cross-sectional view showing a state in which the capacitance type sensor according to the present embodiment is installed in the housing of the electronic device.
6 corresponds to a schematic cross-sectional view of the cross section A-A shown in FIG. Moreover, in the electrostatic capacitance type sensor shown in FIG. 6, the 1st transparent electrode 4, the 2nd transparent electrode 5, and the wiring part 6 are abbreviate | omitted for convenience of explanation.

  The capacitance type sensor 1a shown in FIG. 6 is provided on the display panel 210, similarly to the capacitance type sensor 1a described above with reference to FIG. For example, a liquid crystal display panel is used as the display panel 210. Further, in the capacitance type sensor 1a, the decorative layer 9 and the decorative region 25 are not provided except the region where the external connection portion 27 is provided. The shield wiring 18 provided on the side surfaces 3c, 3d, 3e of the panel 3 is formed by screen printing with an ink of a black material such as carbon, for example.

  The capacitance type sensor 1 a and the display panel 210 are fixed to a housing 310 of the electronic device by a fixing member 330 such as a double-sided adhesive tape, for example. The housing 310 has a protrusion 340. The protrusion 340 is provided on the inner side surface 311 of the housing 310 and is in contact with the shield wiring 18. The protrusion 340 is formed of a material having a metal such as Cu, Cu alloy, CuNi alloy, Ni, Ag, Au or the like. Therefore, the protrusion 340 is electrically connected to the shield wiring 18.

  For example, an electronic component 230 such as a substrate or a battery is provided between the display panel 210 and the housing 310.

  According to the present embodiment, since the protrusion 340 provided on the inner side surface 311 of the housing 310 is electrically connected to the shield wiring 18, for example, the wiring connected to the portion set to the ground potential Volume can be increased. Therefore, the shield effect can be enhanced as compared with the case where the protrusion 340 is not electrically connected to the shield wiring 18.

Next, an application example of the capacitance type sensor 1 according to the present embodiment will be described.
FIG. 7A to FIG. 8B are schematic views showing application examples of the capacitance type sensor according to the present embodiment.
FIG. 7A shows an example in which the capacitance type sensor 1 is applied to the touch panel 200. The touch panel 200 includes a display panel 210 and a capacitive sensor 1 provided on the display panel 210. For example, a liquid crystal display panel is used as the display panel 210. A display panel 210 formed of a liquid crystal display panel has a drive substrate 211 and an opposite substrate 212 which are disposed to face each other, and a liquid crystal layer 213 is provided between the drive substrate 211 and the opposite substrate 212. The touch sensor 220 is provided on the front side of the counter substrate 212.

  An example of the electronic device 300 provided with the touch panel 200 is shown in FIG. The electronic device 300 is, for example, a television. The electronic device 300 includes a housing 310 and a display unit 320. A touch panel 200 is provided on the surface of the display unit 320. Note that the electronic device 300 is not limited to a television, and may be another device such as a smartphone, a mobile phone, or a tablet terminal.

  An example (notebook computer) of the computer 400 provided with the touch panel 200 is shown in FIG. 8A. The computer 400 includes a display 410, a keyboard 420, an input pad 430, and the like. As shown in FIG. 8B, the computer 400 includes a central processing unit 401, a main storage unit 402, a sub storage unit 403, an input unit 404, an output unit 405, and an interface 406. The keyboard 420 and the input pad 430 are an example of the input unit 404. The display 410 is an example of the output unit 405. Touch panel 200 is included in display 410. The touch panel 200 is an example in which both the input unit 404 and the output unit 405 are used.

  By applying the capacitance type sensor 1 of this embodiment to these devices, it is possible to provide the touch panel 200, the electronic device 300 and the computer 400 in which the ESD countermeasure is taken and the detection area 11 is expanded.

  Although the embodiment and the application examples thereof have been described above, the present invention is not limited to these examples. For example, those skilled in the art may appropriately add, delete, or change design elements of the above-described embodiments or their application examples, or may appropriately combine the features of the embodiments. As long as it comprises the gist, it is included within the scope of the present invention.

1, 1a Capacitive sensor 2 base 2a front surface 3 panel 3a operation surface 3b back surface 3c, 3d, 3e, 3f side surface 4 first transparent electrode 5 second transparent electrode 6 wiring portion 7 connection portion 8 first Electrode 9 Decorative layer 10 Bridge wiring 11 Detection area 12 Second electrode 16 Connection wiring 18 Shield wiring 20 Insulating layer 20a Surface 25 Decorative area 27 External connection 28 Conductive paste 29 Flexible printed circuit board 30 Optical transparent adhesive layer 200 Touch panel 210 Display panel 211 Drive substrate 212 Counter substrate 213 Liquid crystal layer 220 Touch sensor 230 Electronic component 310 Electronic device 310 Housing 311 Side surface 320 Display part 330 Fixing member 340 Protrusion part 400 Computer 401 Central processing part 402 Main storage part 403 Secondary storage part 404 Input Part 405 Output part 406 Interface 410 Display 420 Keyboard 430 input pad

Claims (6)

A translucent substrate,
A translucent transparent electrode provided in a detection area on the substrate;
A wiring portion provided in an area outside the detection area and electrically connected to the transparent electrode;
A translucent panel provided on the transparent electrode and the wiring portion;
Conductive shield wiring provided on the side surface of the panel;
A flexible printed circuit board electrically connected to the wiring portion;
Equipped with
The shield wiring is
Separate from the transparent electrode and the wiring portion,
Formed on the side of the panel outside the wiring section,
Is set to the ground potential ,
The shield wiring is electrically connected to a portion of the flexible printed circuit set at a ground potential,
The shield wiring extends from a side surface of the panel onto a decorative layer formed on the back surface of the panel and is connected to a portion set to a ground potential of the flexible printed circuit board. Capacitance sensor. It further comprises a decorative layer provided on the surface of the panel facing the wiring portion in the outer region, and having a light shielding property,
The said wiring part was formed of the material which has a metal, The electrostatic capacitance type sensor of Claim 1 characterized by the above-mentioned. The wiring portion is formed of a transparent conductive material,
The capacitance type sensor according to claim 1, wherein the shield wiring is formed of a black-based material. Display panel,
A touch sensor provided on the display panel;
Equipped with
The touch panel according to any one of claims 1 to 3 , wherein the touch sensor is a capacitive sensor. An electronic device comprising the touch sensor according to claim 4 . It further comprises a housing for fixing the touch sensor,
The electronic device according to claim 5 , wherein the housing has a protrusion in contact with the shield wiring and electrically connected to the shield wiring.