JP6503758B2 - Multilayer capacitor - Google Patents

Description

  The present invention relates to a multilayer capacitor.

  A pair of main surfaces facing each other in the first direction, and extending in the first direction so as to connect the pair of main surfaces, have a rectangular parallelepiped shape, and extend in the second direction orthogonal to the first direction. A pair of opposing first side surfaces and a pair of second sides extending in the first direction so as to connect the pair of main surfaces and facing each other in a third direction orthogonal to the first and second directions A plurality of first and second internal electrodes and a plurality of first inner electrodes and a plurality of second inner electrodes alternately arranged in the body so as to face each other in the first direction. There is known a multilayer capacitor comprising a first terminal electrode connected to a first internal electrode and a second terminal electrode arranged on the element and connected to a plurality of second internal electrodes (for example, Patent Document 1).

Japanese Patent Application Laid-Open No. 09-148175

  In recent years, miniaturization and thinning of electronic devices such as information terminal devices have progressed. Along with this, the miniaturization is progressing also in the substrate mounted on the electronic device and the electronic component mounted on the substrate, and the high density mounting is also progressing. In order to achieve further miniaturization, electronic component built-in substrates in which electronic components are embedded in the substrate have also been developed. In the electronic component built-in substrate, the electronic component is embedded and mounted inside the substrate. The wiring formed on the substrate and the embedded electronic component need to be electrically connected reliably. However, in the multilayer capacitor described in Patent Document 1, the embedding in the substrate (embedding in the substrate) and the electrical connection with the wiring formed on the substrate are not considered.

  An object of the present invention is to provide a multilayer capacitor capable of suppressing the occurrence of surface leak while securing the connectivity with a wiring formed on a substrate.

  The multilayer capacitor in accordance with the present invention has a rectangular parallelepiped shape, and extends in the first direction so as to connect the pair of main surfaces facing each other in the first direction and the first direction. And extending in the first direction so as to connect the pair of main surfaces with each other in the third direction orthogonal to the first and second directions. An element body having a pair of opposed second side surfaces, and a plurality of first and second inner electrodes alternately arranged in the element body so as to be opposed to each other in the first direction; A first terminal electrode disposed in the element body and connected to the plurality of first internal electrodes, and a second terminal electrode disposed in the element body and connected to the plurality of second internal electrodes; The length of the first direction is smaller than the length of the second direction of the element and the length of the third direction of the element, and The terminal electrode has a first electrode portion disposed on the main surface, and the second terminal electrode is disposed on the main surface and spaced apart from the first electrode portion in the second direction on the main surface And the second direction length of the central portion in the third direction in the first electrode portion and the second electrode portion has the second electrode portion in the third direction in the first electrode portion and the second electrode portion. The length in the second direction of the end of the first electrode portion and the second electrode portion is smaller than the length in the second direction of the end, and the length in the second direction of the end of the first electrode portion is The second direction length of the central portion of the first electrode portion and the second electrode portion is larger than the distance in the second direction, and the second direction length of the central portion of the first electrode portion is Less than the spacing in the direction.

  In the multilayer capacitor in accordance with the present invention, the length in the first direction of the element body is smaller than the length in the second direction of the element body and the length in the third direction of the element body. As a result, the height of the multilayer capacitor can be reduced, and a multilayer capacitor suitable for incorporation in a substrate can be realized. The first terminal electrode has a first electrode portion disposed on the main surface of the element body, and the second terminal electrode has a second electrode portion disposed on the main surface of the element body. Therefore, the multilayer capacitor according to the present invention can be electrically connected to the wiring formed on the substrate on the main surface side of the element body, and can be easily incorporated into the substrate.

  The length in the second direction of the end of the first electrode portion in the third direction is larger than the distance in the second direction between the end of the first electrode portion and the end of the second electrode portion. The length in the second direction of the end of the second electrode portion in the third direction is also greater than the distance in the second direction between the end of the first electrode portion and the end of the second electrode portion. As a result, the electrode area is secured in the area on the end side of the first electrode portion and the second electrode portion. As a result, the connectivity between the wiring formed on the substrate and the first and second terminal electrodes can be secured.

  The length in the second direction of the central portion in the third direction in the first electrode portion and the length in the second direction of the central portion in the third direction of the second electrode portion are the center portion and the second portion of the first electrode portion The distance in the second direction from the central portion of the two electrode portions is smaller. That is, the distance between the central portion of the first electrode portion and the central portion of the second electrode portion in the second direction is the distance between the end of the first electrode portion and the end of the second electrode portion in the second direction Greater than. Thus, the distance between the central portion of the first electrode portion and the central portion of the second electrode portion in the second direction is the distance between the end portion of the first electrode portion and the end portion of the second electrode portion in the second direction. The occurrence of surface leakage can be suppressed as compared with the configuration having the interval or less.

  The length in the first direction of the element body may be smaller than the distance between the first terminal electrode and the second terminal electrode in the second direction. In this case, it is possible to secure the connectivity between the wiring formed on the substrate and the first and second terminal electrodes while realizing a further reduction in height of the multilayer capacitor.

  The length in the third direction of the element body is greater than the length in the second direction of the element body, and the plurality of first inner electrodes are exposed on one of the first side surfaces and have a third length in the third direction. The plurality of second internal electrodes are exposed to the other first side surface while the length in the second direction is greater than the length in the second direction and the length in the third direction is greater than the length in the second direction; And the second terminal electrode is disposed on the other first side surface and has a plurality of second interiors. It may further have an electrode portion connected to the electrode. In this case, the current path in the multilayer capacitor becomes short, and ESL (equivalent series inductance) can be reduced.

  The first terminal electrode and the second terminal electrode are formed of a sintered conductor layer formed on the element body and containing Cu or Ni, and formed on the baked conductor layer and containing Ni or Sn. It may have a plating layer and a second plating layer formed on the first plating layer and containing Cu or Au. In this case, since the first internal electrode is connected to the baked conductor layer of the first terminal electrode, the first internal electrode and the first terminal electrode come into contact with each other with certainty. Since the second inner electrode is connected to the baked conductor layer of the second terminal electrode, the second inner electrode and the second terminal electrode come into contact with each other with certainty. Since the second plating layer contains Cu or Au, the connectivity between the wiring formed on the substrate and the first and second terminal electrodes can be further secured. The first plated layer suppresses damage to the baked conductor layer in the step of forming the second plated layer. This can suppress degradation of the insulation resistance of the multilayer capacitor.

  The second plating layer may be a Cu plating layer, and a protrusion made of Cu may be formed on the surface of the Cu plating layer. The multilayer capacitor is incorporated in the substrate by being filled with a resin after being disposed in the substrate accommodation portion. When the projections are formed on the second plating layer, the projections form irregularities on the surface of the second plating layer. In the configuration in which the projections are formed in the second plating layer, the surface area of the second plating layer is large as compared with the configuration in which the projections are not formed, and meshing with the resin is good due to the above-mentioned unevenness. Therefore, when the multilayer capacitor is incorporated in the substrate, the adhesion between the second plating layer and the resin can be improved.

  The element body has an inner layer portion in which the plurality of first inner electrodes and the plurality of second inner electrodes are positioned, and a pair of outer layer portions positioned so as to sandwich the inner layer portion in the first direction. The thickness in the first direction of the pair of outer layer portions may be smaller than the thickness in the first direction of the first electrode portion and the thickness in the first direction of the second electrode portion. In this case, a further reduction in height of the multilayer capacitor can be realized.

  After the multilayer capacitor is built in the substrate, a via hole reaching the first terminal electrode and the second terminal electrode is formed in the substrate by laser processing. At this time, the laser is irradiated to the first terminal electrode and the second terminal electrode, and there is a possibility that the first terminal electrode and the second terminal electrode may be damaged. Since the thickness in the first direction of the first electrode portion and the thickness in the first direction of the second electrode portion are larger than the thickness in the first direction of each outer layer portion, the influence of damage by laser irradiation can be suppressed low.

  The first electrode portion and the second electrode portion respectively have edges facing each other in the second direction, and each edge of the first and second electrode portions is more than the distance between both ends in the second direction. It may be curved as viewed from the first direction so as to increase the distance between the central portions in the second direction. In this case, since the edges of the first and second electrode portions have a smooth shape, it is difficult for the first and second electrode portions to have a place where the electric field is concentrated. Therefore, the occurrence of a short circuit between the first terminal electrode and the second terminal electrode can be suppressed.

  According to the present invention, it is possible to provide a multilayer capacitor capable of suppressing the occurrence of surface leak while securing the connectivity with the wiring formed on the substrate.

FIG. 1 is a perspective view showing a multilayer capacitor in accordance with an embodiment of the present invention. It is a top view which shows the multilayer capacitor which concerns on this embodiment. It is a top view which shows the multilayer capacitor which concerns on this embodiment. It is a figure for demonstrating the cross-sectional structure along the IV-IV line in FIG. It is a figure for demonstrating the cross-sectional structure along the VV line | wire in FIG. It is a figure for demonstrating the cross-sectional structure along the VI-VI line in FIG. It is a top view which shows a 1st and 2nd internal electrode. It is a perspective view which shows a 3rd electrode layer. It is a figure for demonstrating the mounting structure of the multilayer capacitor which concerns on this embodiment. It is a figure for demonstrating the mounting structure of the multilayer capacitor which concerns on this embodiment. It is a figure for demonstrating the mounting structure of the multilayer capacitor which concerns on this embodiment. It is a perspective view which shows the multilayer capacitor which concerns on the modification of this embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer capacitor which concerns on the modification of this embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer capacitor which concerns on the modification of this embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer capacitor which concerns on the modification of this embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same function will be denoted by the same reference symbols, without redundant description.

  The configuration of the multilayer capacitor C1 according to the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing the multilayer capacitor in accordance with the present embodiment. 2 and 3 are plan views showing the multilayer capacitor in accordance with the present embodiment. FIG. 4 is a diagram for explaining a cross-sectional configuration along the line IV-IV in FIG. FIG. 5 is a diagram for explaining a cross-sectional configuration along the line V-V in FIG. FIG. 6 is a diagram for explaining a cross-sectional configuration along the line VI-VI in FIG.

  The multilayer capacitor C1 includes, as shown in FIGS. 1 to 6, an element body 2 having a rectangular parallelepiped shape, and a first terminal electrode 5 and a second terminal electrode 7 disposed on the outer surface of the element body 2, Is equipped. The first terminal electrode 5 and the second terminal electrode 7 are separated. The rectangular parallelepiped shape includes the shape of a rectangular parallelepiped whose corners and ridges are chamfered, and the shape of a rectangular parallelepiped whose corners and ridges are rounded.

  Element body 2 has, as its outer surface, a pair of substantially rectangular main surfaces 2a and 2b facing each other, a pair of first side surfaces 2c and 2d facing each other, and a pair of facing main surfaces And second side surfaces 2e and 2f. The direction in which the pair of main surfaces 2a and 2b are opposite is the first direction D1, the direction in which the pair of first side surfaces 2c and 2d is opposite is the second direction D2, and the pair of second side surfaces 2e and 2d The direction in which 2f is facing is the third direction D3. In the present embodiment, the first direction D1 is the height direction of the element body 2. The second direction D2 is the width direction of the element body 2 and is orthogonal to the first direction D1. The third direction D3 is the longitudinal direction of the element body 2, and is orthogonal to the first direction D1 and the second direction D2.

  The length of the first direction D1 of the element body 2 is smaller than the length of the third direction D3 of the element body 2 and the length of the second direction D2 of the element body 2. The length of the third direction D3 of the element body 2 is larger than the length of the second direction D2 of the element body 2. The length of the third direction D3 of the element body 2 is set to, for example, 0.4 to 1.6 mm. The length of the second direction D2 of the element body 2 is set to, for example, 0.2 to 0.8 mm. The length of the first direction D1 of the element body 2 is set to, for example, 0.1 to 0.35 mm. The multilayer capacitor C1 is an ultra-low profile multilayer capacitor. The length of the third direction D3 of the element body 2 may be equal to the length of the second direction D2 of the element body 2.

  In addition to being equal, “equivalent” may be equal to a value including a difference or a manufacturing error in a preset range. For example, if a plurality of values are included within ± 5% of the average value of the plurality of values, the plurality of values are defined as being equivalent.

  The pair of first side surfaces 2c and 2d extends in the first direction D1 so as to connect the pair of main surfaces 2a and 2b. The pair of first side surfaces 2c and 2d also extend in the third direction D3 (the long side direction of the pair of main surfaces 2a and 2b). The pair of second side surfaces 2e and 2f extend in the first direction D1 so as to connect the pair of main surfaces 2a and 2b. The pair of second side surfaces 2e and 2f also extend in the second direction D2 (the short side direction of the pair of main surfaces 2a and 2b).

The element body 2 is configured by laminating a plurality of dielectric layers in a direction (first direction D1) in which the pair of main surfaces 2a and 2b are opposed to each other. In the element body 2, the stacking direction of the plurality of dielectric layers (hereinafter simply referred to as "stacking direction") coincides with the first direction D1. Each dielectric layer is made of, for example, a sintered body of a ceramic green sheet containing a dielectric material (a dielectric ceramic such as BaTiO ₃ , Ba (Ti, Zr) O ₃ , or (Ba, Ca) TiO ₃ ). Configured In the actual element body 2, each dielectric layer is integrated to such an extent that the boundary between each dielectric layer can not be seen.

  The multilayer capacitor C1 includes a plurality of first inner electrodes 11 and a plurality of second inner electrodes 13 as shown in FIGS. The first and second inner electrodes 11 and 13 are made of a conductive material (for example, Ni or Cu or the like) that is usually used as an inner electrode of a stacked electric device. The first and second inner electrodes 11 and 13 are configured as sintered bodies of a conductive paste containing the above-described conductive material.

  The first inner electrode 11 and the second inner electrode 13 are disposed at different positions (layers) in the first direction D1. That is, the first inner electrodes 11 and the second inner electrodes 13 are alternately arranged in the element body 2 so as to face each other with a gap in the first direction D1. The first internal electrode 11 and the second internal electrode 13 have different polarities.

  Each first internal electrode 11 includes a main electrode portion 11a and a connection portion 11b, as shown in FIG. 7A. The connection portion 11 b extends from one side of the main electrode portion 11 a and is exposed to the first side surface 2 c. The first internal electrode 11 is exposed to the first side surface 2c, and not exposed to the pair of main surfaces 2a and 2b, the first side surface 2d, and the pair of second side surfaces 2e and 2f. The main electrode portion 11a and the connection portion 11b are integrally formed.

  The main electrode portion 11a has a rectangular shape in which the third direction D3 is a long side direction and the second direction D2 is a short side direction. That is, in the main electrode portion 11a of each first inner electrode 11, the length in the third direction D3 is larger than the length in the second direction D2. The connection portion 11 b extends from the end portion on the first side surface 2 c side of the main electrode portion 11 a to the first side surface 2 c. The length of the third direction D3 of the connection portion 11b is smaller than the length of the third direction D3 of the main electrode portion 11a. The length in the second direction D2 of the connection portion 11b is also smaller than the length in the second direction D2 of the main electrode portion 11a. The connection portion 11 b is connected to the first terminal electrode 5 at an end exposed to the first side surface 2 c. The length of the third direction D3 of the connection portion 11b may be equal to the length of the third direction D3 of the main electrode portion 11a.

  Each second internal electrode 13 includes a main electrode portion 13a and a connection portion 13b, as shown in (b) of FIG. The main electrode portion 13a is opposed to the main electrode portion 11a via a part (dielectric layer) of the element body 2 in the first direction D1. The connection portion 13 b extends from one side of the main electrode portion 13 a and is exposed to the first side surface 2 d. The second inner electrode 13 is exposed to the first side surface 2d, and not exposed to the pair of main surfaces 2a and 2b, the first side surface 2c, and the pair of second side surfaces 2e and 2f. The main electrode portion 13a and the connection portion 13b are integrally formed.

  The main electrode portion 13a has a rectangular shape in which the third direction D3 is a long side direction and the second direction D2 is a short side direction. That is, in the main electrode portion 13a of each second internal electrode 13, the length in the third direction D3 is larger than the length in the second direction D2. The connection portion 13 b extends from the end portion on the first side surface 2 d side of the main electrode portion 13 a to the first side surface 2 d. The length of the third direction D3 of the connection portion 13b is smaller than the length of the third direction D3 of the main electrode portion 13a. The length in the second direction D2 of the connection portion 13b is also smaller than the length in the second direction D2 of the main electrode portion 13a. The connection portion 13 b is connected to the second terminal electrode 7 at an end exposed to the first side surface 2 c. The length of the third direction D3 of the connection portion 13b may be equal to the length of the third direction D3 of the main electrode portion 13a.

  The element body 2 has an inner layer portion 3A and a pair of outer layer portions 3B and 3C, as shown in FIGS. The plurality of first inner electrodes 11 and the plurality of second inner electrodes 13 are located in the inner layer portion 3A. The pair of outer layer portions 3B and 3C are positioned to sandwich the inner layer portion 3A in the first direction D1. The first inner electrode 11 and the second inner electrode 13 are not located in the pair of outer layer portions 3B and 3C.

  The thickness in the first direction D1 of the outer layer portion 3B is defined by the distance between the main surface 2a and the internal electrode closest to the main surface 2a (in the present embodiment, the first internal electrode 11) in the first direction D1. Be done. The thickness in the first direction D1 of the outer layer portion 3C is defined by the distance between the main surface 2b and the internal electrode closest to the main surface 2b (in the present embodiment, the second internal electrode 13) in the first direction D1. Be done. The thickness in the first direction D1 of the inner layer portion 3A is defined by the distance in the first direction D1 between the internal electrode closest to the major surface 2a and the internal electrode closest to the major surface 2b. The thickness in the first direction D1 of each outer layer portion 3B, 3C is smaller than the thickness in the first direction D1 of the inner layer portion 3A.

  The first terminal electrode 5 is located at an end of the element body 2 on the first side surface 2 c side as viewed in the second direction D2. The first terminal electrode 5 includes an electrode portion 5a disposed on the main surface 2a, an electrode portion 5b disposed on the main surface 2b, an electrode portion 5c disposed on the first side surface 2c, and a pair of second portions It has the electrode part 5d arrange | positioned at side 2e, 2f. That is, the first terminal electrode 5 is formed on the five surfaces 2a, 2b, 2c, 2e and 2f. The electrode portions 5a to 5d adjacent to each other are connected at the ridge line portion of the element body 2 and electrically connected to each other.

  The second terminal electrode 7 is located at the end on the first side face 2 d side of the element body 2 as viewed in the second direction D2. The second terminal electrode 7 includes an electrode portion 7a disposed on the main surface 2a, an electrode portion 7b disposed on the main surface 2b, an electrode portion 7c disposed on the first side surface 2d, and a pair of second portions It has the electrode part 7d arrange | positioned at side 2e, 2f. That is, the second terminal electrode 7 is formed on the five surfaces 2a, 2b, 2d, 2e and 2f. The electrode portions 7 a to 7 d adjacent to each other are connected at the ridge line portion of the element body 2 and electrically connected to each other.

  The electrode portion 5c is disposed so as to cover the entire exposed portion of the first side surface 2c of each connection portion 11b, and the connection portion 11b is directly connected to the first terminal electrode 5. That is, the connection part 11b connects the main electrode part 11a and the electrode part 5c. Thereby, each first internal electrode 11 is electrically connected to the first terminal electrode 5. The electrode portion 7c is disposed so as to cover the entire exposed portion of the first side surface 2d of each connection portion 13b, and the connection portion 13b is directly connected to the second terminal electrode 7. That is, the connection portion 13 b connects the main electrode portion 13 a and the electrode portion 7 c. Thereby, each second internal electrode 13 is electrically connected to the second terminal electrode 7.

  The electrode portion 5a and the electrode portion 7a arranged on the main surface 2a are separated in the second direction D2 on the main surface 2a. The electrode portion 5a has an edge 6A facing the electrode portion 7a when viewed in the first direction D1. The electrode portion 7a has an edge 8A facing the electrode portion 5a when viewed in the first direction D1. That is, the edge 6A and the edge 8A face each other in the second direction D2.

  The electrode portion 5b and the electrode portion 7b arranged on the main surface 2b are separated in the second direction D2 on the main surface 2b. The electrode portion 5b has an edge 6B facing the electrode portion 7b when viewed in the first direction D1. The electrode portion 7b has an edge 8B facing the electrode portion 5b when viewed in the first direction D1. That is, the edge 6B and the edge 8B face each other in the second direction D2.

As shown in FIGS. 2 and 3, in each of the electrode portions 5a and 5b, the lengths L ₅₁ and L ₅₂ of the second direction D2 at each end in the third direction D3 are central in the third direction D3. It is larger than the length L ₅₃ of the second direction D2 of the part. In the present embodiment, the edges 6A and 6B are curved as viewed from the first direction D1 such that the lengths L ₅₁ and L ₅₂ are larger than the length L ₅₃ . In the present embodiment, the length L ₅₁ and the length L ₅₂ are equal. The length L ₅₁ and the length L ₅₂ may be different.

In the present embodiment, the electrode portion 5a and the electrode portion 5b have the same shape when viewed from the first direction D1. That is, the length _{L 51} of the electrode portion 5a is equivalent to the length _{L 51} of the electrode portion 5b, of the electrode portions 5a length _{L 52} is equivalent to the length _{L 52} of the electrode portion 5b, of the electrode portions 5a the length _{L 53} is equivalent to the length _{L 53} of the electrode portion 5b. The length _{L 51} of the electrode portion 5a may be different from the length _{L 51} of the electrode portion 5b. The length _{L 52} of the electrode portion 5a may be different from the length _{L 52} of the electrode portion 5b. The length _{L 53} of the electrode portion 5a may be different from the length _{L 53} of the electrode portion 5b.

As shown in FIGS. 2 and 3, in each of the electrode portions 7a and 7b, the lengths L ₇₁ and L ₇₂ of the second direction D2 at each end in the third direction D3 are central in the third direction D3. It is larger than the length L ₇₃ of the second direction D2 of the part. In the present embodiment, edges 8A, 8B, like larger than the length _{L 71, L 72} is the length _{L 73,} when viewed from the first direction D1, are curved. In the present embodiment, the length _L71 and the length _L72 are equal. The length L ₇₁ and the length L ₇₂ may be different.

In the present embodiment, the electrode portion 7a and the electrode portion 7b have the same shape when viewed from the first direction D1. That is, the length _{L 71} of the electrode portion 7a is equal to the length _{L 71} of the electrode portion 7b, the length _{L 72} of the electrode portion 7a is equal to the length _{L 72} of the electrode portion 7b, the electrode portions 7a the length _{L 73} is equivalent to the length _{L 73} of the electrode portion 7b. The length _{L 71} of the electrode portion 7a may be different from the length _{L 71} of the electrode portion 7b. The length _{L 72} of the electrode portion 7a may be different from the length _{L 72} of the electrode portion 7b. The length _{L 73} of the electrode portion 7a may be different from the length _{L 73} of the electrode portion 7b.

  One end of each of the electrode portions 5a and 5b and one end of each of the electrode portions 7a and 7b are located on the second side surface 2e as viewed from the first direction D1. The other ends of the electrode portions 5a and 5b and the other ends of the electrode portions 7a and 7b are located on the second side surface 2f as viewed from the first direction D1.

Electrode portion 5a, one end portion and the electrode portion 7a and 5b, the interval _{G 11} in the second direction D2 and one end of 7b, the electrode portion 5a, a central portion of 5b and the electrode portions 7a, 7b central smaller than the spacing G ₁₃ in the second direction D2 of the section. Electrode portion 5a, the other end portion and the electrode portion 7a of 5b, spacing _{G 12} in the second direction D2 and the other end of 7b is smaller than the spacing _{G 13.} That is, the edge 6A and the edge 8A, so that the interval _{G 13} is greater than the distance _{G 11, G 12,} when viewed from the first direction D1, are curved. The edges 6B and the edge 8B, so that the interval _{G 13} is greater than the distance _{G 11, G 12,} when viewed from the first direction D1, are curved.

Spacing G ₁₁ and one end of one end portion and the electrode portion 7a of the electrode portions 5a may be equal to the interval G ₁₁ and one end of one end portion and the electrode portion 7b of the electrode portions 5b Also, they may be different. Spacing G ₁₂ between one end of the one end portion and the electrode portion 7a of the electrode portions 5a may be equal to the interval G ₁₂ and one end of one end portion and the electrode portion 7b of the electrode portions 5b Also, they may be different. Spacing G ₁₃ and one end of one end portion and the electrode portion 7a of the electrode portions 5a may be equal to the interval G ₁₃ and one end of one end portion and the electrode portion 7b of the electrode portions 5b Also, they may be different.

The relationship between the lengths L ₅₁ , L ₅₂ , L ₅₃ , L ₇₁ , L ₇₂ and L ₇₃ and the intervals G ₁₁ , G ₁₂ and G ₁₃ is as follows. The lengths L ₅₁ and L ₇₁ are larger than the interval G ₁₁ . The lengths L ₅₂ and L ₇₂ are larger than the interval G ₁₂ . The lengths L ₅₃ and L ₇₃ are smaller than the interval G ₁₃ .

The electrode portion 5d and the electrode portion 7d disposed on the second side surface 2e are separated in the second direction D2 on the second side surface 2e. In the present embodiment, the length of the second direction D2 of the electrode portion 5d is equivalent to the length L _51, the length of the second direction D2 of the electrode portion 7d is equivalent to the length L _71. Interval in the second direction D2 of the second side surface electrode portion 5d which is disposed 2e and the electrode portion 7d is equivalent to the interval G _11.

The electrode portion 5d and the electrode portion 7d disposed on the second side surface 2f are separated in the second direction D2 on the second side surface 2f. In the present embodiment, the length of the second direction D2 of the electrode portion 5d is equivalent to the length L _52, the length of the second direction D2 of the electrode portion 7d is equivalent to the length L _72. Interval in the second direction D2 of the second side surface electrode portion 5d which is disposed 2f and the electrode portion 7d is equivalent to the interval G _12.

  The first and second terminal electrodes 5 and 7 respectively have a first electrode layer 21, a second electrode layer 23, and a third electrode layer 25. That is, the electrode portions 5a, 5b, 5c, 5d and the electrode portions 7a, 7b, 7c, 7d respectively include the first electrode layer 21, the second electrode layer 23, and the third electrode layer 25. The third electrode layer 25 constitutes the outermost layer of the first and second terminal electrodes 5 and 7.

  The first electrode layer 21 is formed by applying a conductive paste to the surface of the element body 2 and baking it. That is, the first electrode layer 21 is a baked conductor layer. In the present embodiment, the first electrode layer 21 is a baked conductor layer made of Cu. The first electrode layer 21 may be a baked conductor layer made of Ni. Thus, the first electrode layer 21 contains Cu or Ni. What mixed the glass component, the organic binder, and the organic solvent with the powder which consists of Cu or Ni is used for the conductive paste. The thickness of the first electrode layer 21 is, for example, at most 20 μm.

  The second electrode layer 23 is formed on the first electrode layer 21 by plating. In the present embodiment, the second electrode layer 23 is a Ni plating layer formed by Ni plating on the first electrode layer 21. The second electrode layer 23 may be a Sn plating layer. Thus, the second electrode layer 23 contains Ni or Sn. The thickness of the second electrode layer 23 is, for example, 1 to 5 μm.

  The third electrode layer 25 is formed on the second electrode layer 23 by plating. In the present embodiment, the third electrode layer 25 is a Cu plating layer formed by Cu plating on the second electrode layer 23. The second electrode layer 23 may be an Au plating layer. Thus, the third electrode layer 25 contains Cu or Au. The thickness of the third electrode layer 25 is, for example, 1 to 15 μm.

  As also shown in FIG. 8, a plurality of protrusions 25 a are formed on the surface of the third electrode layer 25 which is a Cu plating layer. Each protrusion 25a is made of Cu. The diameter of each protrusion 25a is 10 to 30 μm, and the height of each protrusion 25a is 1 to 10 μm.

  The thickness of each of the electrode portions 5a, 5b, 7a, 7b is the sum of the thicknesses of the first electrode layer 21, the second electrode layer 23, and the third electrode layer 25 constituting the electrode portions 5a, 5b, 7a, 7b. Specified by value. The thickness of each electrode portion 5a, 5b, 7a, 7b is, for example, 5 to 40 μm. In the present embodiment, the thickness in the first direction D1 of each outer layer portion 3B, 3C is larger than the thickness in the first direction D1 of each electrode portion 5a, 5b, 7a, 7b.

  As described above, in the present embodiment, the length in the first direction D1 of the element body 2 is smaller than the length in the second direction D2 of the element body 2 and the length in the third direction D3 of the element body 2. As a result, the height of the multilayer capacitor C1 can be reduced, and a multilayer capacitor suitable for being incorporated in a substrate can be realized. The first terminal electrode 5 has electrode portions 5a and 5b disposed on the main surfaces 2a and 2b, and the second terminal electrode 7 has electrode portions 7a and 7b disposed on the main surfaces 2a and 2b. There is. Therefore, the multilayer capacitor C1 is electrically connected to the wiring formed on the substrate on the main surface 2a side of the element body 2, the main surface 2b side of the element body 2, or both main surface 2a, 2b sides of the element body 2. It becomes connectable and easy to incorporate in a substrate.

The lengths L ₅₁ and L ₇₁ are larger than the interval G ₁₁ , and the lengths L ₅₂ and L ₇₂ are larger than the interval G ₁₂ . As a result, the electrode area is secured in the regions on both end sides of the electrode portion 5a and the electrode portion 7a. As a result, the connectivity between the wiring formed on the substrate and the first and second terminal electrodes 5 and 7 can be secured. In this case, it is preferable that the regions on both ends of the electrode portion 5a and the electrode portion 7a be connected to the wiring formed on the substrate.

  In the present embodiment, the electrode area is secured in the region on both ends of the electrode portion 5 b and the electrode portion 7 b. Therefore, even when the regions on both ends of the electrode portion 5 b and the electrode portion 7 b are connected to the wiring formed on the substrate, the connection between the wiring formed on the substrate and the first and second terminal electrodes 5 and 7 It is possible to secure the sex.

The lengths L ₅₃ and L ₇₃ are smaller than the interval G ₁₃ . That is, the interval _{G 13} is greater than the spacing _{G 12.} Thus, as compared with the configuration interval G ₁₃ is distance G ₁₂ or less, the interval in the second direction between the first terminal electrode 5 and the second terminal electrode 7 is increased. Therefore, it is difficult for a leak current to flow on the element 2 (particularly on the main surfaces 2a and 2b) between the first terminal electrode 5 and the second terminal electrode 7, and generation of surface leakage can be suppressed.

  In the present embodiment, the length in the third direction D3 of the element body 2 is larger than the length in the second direction D2 of the element body 2, and each first internal electrode 11 has a second length in the third direction D3. The length of the third direction D3 of each of the second inner electrodes 13 is larger than the length of the second direction D2, which is larger than the length of the direction D2. That is, the length of the second direction D2 of the element body 2 is smaller than the length of the third direction D3 of the element body 2, and in each of the first and second inner electrodes 11 and 13, the length of the second direction D2 is Less than the length of the three-way D3. Therefore, the current path in the multilayer capacitor C1 is shortened, and the ESL can be reduced.

  In the present embodiment, the first and second terminal electrodes 5 and 7 respectively include the first electrode layer 21, the second electrode layer 23, and the third electrode layer 25. Since the first and second inner electrodes 11 and 13 are connected to the first electrode layer 21 which is a baked conductor layer, the first and second inner electrodes 11 and 13 reliably contact the first electrode layer 21. . Since the third electrode layer 25 contains Cu or Au, the connectivity between the wiring formed on the substrate and the first and second terminal electrodes 5 and 7 can be further secured. The second electrode layer 23 suppresses the damage of the first electrode layer 21 in the process of forming the third electrode layer 25. Thus, the insulation resistance of the multilayer capacitor C1 can be suppressed from deteriorating.

  The third electrode layer 25 is a Cu plating layer, and a protrusion 25 a made of Cu is formed on the surface of the third electrode layer 25. The multilayer capacitor C <b> 1 is incorporated in the substrate by being filled with a resin after being disposed in the container of the substrate, as described later. When the projections 25 a are formed on the third electrode layer 25, the projections 25 a form irregularities on the surface of the third electrode layer 25. In the configuration in which the protrusion 25 a is formed in the third electrode layer 25, the surface area of the third electrode layer 25 is larger than in the configuration in which the protrusion 25 a is not formed, and the engagement with the resin Good. Therefore, when the multilayer capacitor C1 is incorporated in the substrate, the adhesion between the third electrode layer 25 and the resin can be improved.

In this embodiment, the edge 6A and the edge 8A, so that the interval _{G 13} than the spacing _{G 11, G 12} increases, as viewed from the first direction D1, with curved, the edge 6B and the edge 8B , like spacing _{G 13} is greater than the distance _{G 11, G 12,} when viewed from the first direction D1, are curved. Since each of the edges 6A, 6B, 8A, 8B has a smooth shape, it is difficult for the electrode portions 5a, 5b, 7a, 7b to have a place where the electric field is concentrated. Therefore, the occurrence of a short between the first terminal electrode 5 and the second terminal electrode 7 can be suppressed.

  The multilayer capacitor C1 is embedded in and mounted on the substrate 31 as shown in FIGS. That is, the multilayer capacitor C1 is incorporated in the substrate 31. 9 to 11 are views for explaining the mounting structure of the multilayer capacitor in accordance with the present embodiment.

  The substrate 31 is configured by laminating a plurality of insulating layers 33. The insulating layer 33 is made of an insulating material such as ceramic or resin and integrated with one another by adhesion or the like.

  The multilayer capacitor C1 is disposed in the housing portion 31a formed on the substrate 31, and is fixed to the substrate 31 by the resin 34 filled in the housing portion 31a. Thereby, the multilayer capacitor C1 is embedded in the substrate 31. The multilayer capacitor C1 is electrically connected to the electrodes 35 and 37 disposed on the surface of the substrate 31 through the via conductors 45 and 47. That is, the first terminal electrode 5 (electrode portion 5a) is electrically connected to the electrode 35 through the via conductor 45, and the second terminal electrode 7 (electrode portion 7a) is electrically connected to the electrode 37 through the via conductor 47 It is done.

  The via conductors 45 and 47 are formed by growing a conductive metal (for example, Cu or Au or the like) in the via holes formed in the substrate 31 by electroless plating or the like. The via holes are formed by laser processing so as to reach the electrode portions 5a and 7a of the first and second terminal electrodes 5 and 7 of the multilayer capacitor C1 from the surface side of the substrate 31.

  As described above, the first and second terminal electrodes 5 and 7 have electrode areas secured in the regions on both ends of the electrode portions 5a and 7a. Therefore, the first and second terminal electrodes 5 and 7 (electrode portions 5a and 7a) and the via conductors 45 and 47 can be reliably connected.

  In the multilayer capacitor C1, the electrode portions 5a and 7a have a third electrode layer 25 as a plating layer. Therefore, via conductors 45 and 47 formed in the via holes can be reliably connected to electrode portions 5a and 7a. In particular, when via conductors 45 and 47 are formed by plating, via conductors 45 and 47 and electrode portions 5a and 7a are more reliably connected.

  Next, with reference to FIGS. 12 to 15, the configuration of the multilayer capacitor C2 in accordance with the modification of the present embodiment will be described. FIG. 12 is a perspective view showing the multilayer capacitor in accordance with the present modification. 13 to 15 are views for explaining the cross-sectional configuration of the multilayer capacitor in accordance with the present modification.

  The multilayer capacitor C2 also includes an element body 2, a first terminal electrode 5 and a second terminal electrode 7, a plurality of first inner electrodes 11, and a plurality of second inner electrodes 13.

The multilayer capacitor C2 has a length in the first direction D1 of the element body 2, that is, a length in the height direction of the element body 2 smaller than that of the multilayer capacitor C1. In this modification, the length of the first direction D1 of the element body 2 is smaller than the distance between the first terminal electrode 5 and the second terminal electrode 7 in the second direction D2. Specifically, the length of the first direction D1 of the element body 2 is smaller than the intervals G ₁₁ and G ₁₂ . Thereby, in the present modification, it is possible to secure the connectivity between the wiring formed on the substrate and the first and second terminal electrodes 5 and 7 while realizing a further reduction in height of the multilayer capacitor C2.

Each outer layer 3B, the thickness of the first direction D1 of the 3C, each electrode portions 5a, 5b, 7a, smaller than the thickness _{T E} of the first direction D1 of 7b. Also in this modification, further reduction in height of the multilayer capacitor C2 can be realized in this modification.

As described above, after the multilayer capacitor C2 is incorporated in the substrate, the via holes reaching the first terminal electrode 5 and the second terminal electrode 7 are formed in the substrate by laser processing. At this time, the first terminal electrode 5 and the second terminal electrode 7 may be irradiated with the laser, and the first terminal electrode 5 and the second terminal electrode 7 may be damaged. However, the electrode portions 5a, 5b, 7a, since the thickness _{T E} of the first direction D1 and 7b is greater than the thickness of the first direction D1 of the outer layer 3B, 3C, suppressing the influence of the damage caused by the irradiation of the laser be able to.

  As mentioned above, although embodiment of this invention was described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  The first and second terminal electrodes 5 and 7 do not need to have the electrode portions 5a and 7a and the electrode portions 5b and 7b. If the first and second terminal electrodes 5 and 7 have at least one of the electrode parts 5a and 7a and the electrode parts 5b and 7b as electrode parts connected to the wiring formed on the substrate Good.

  Although the multilayer capacitor C1 is embedded in the substrate 31 and mounted in FIGS. 8 and 9, the multilayer capacitor C2 may be embedded in the substrate 31 and mounted.

2 element body 2a 2b main surface 2c 2d first side surface 2e 2f second side surface 3A inner layer portion 3B 3C outer layer portion 5 first terminal electrode 5a to 5d ... electrode part, 6A, 6B ... edge, 7 ... second terminal electrode, 7a to 7d ... electrode part, 8A, 8B ... edge, 11 ... first internal electrode, 13 ... second internal electrode, 21 ... first electrode layer , 23: second electrode layer, 25: third electrode layer, 25a: protrusion, C1, C2: multilayer capacitor, D1: first direction, D2: second direction, D3: third direction, L ₅₁ , L ₅₂ , L ₅₃ , L ₇₁ , L ₇₂ , L ₇₃ ... length in the second direction of the electrode portion, G ₁₁ , G ₁₂ , G ₁₃ ... distance in the second direction of the electrode portion.

Claims (6)

A second member extending in the first direction so as to connect the pair of main surfaces having a rectangular parallelepiped shape and facing each other in the first direction and the pair of main surfaces and being orthogonal to the first direction Extending in the first direction so as to connect the pair of first side surfaces facing each other in the direction and the pair of main surfaces, and facing each other in a third direction orthogonal to the first and second directions An element body having a pair of second side surfaces,
A plurality of first and second inner electrodes alternately arranged in the body so as to face each other in the first direction;
A first terminal electrode disposed in the element body and connected to the plurality of first internal electrodes;
A second terminal electrode disposed in the element body and connected to the plurality of second inner electrodes;
The length in the first direction of the element body is smaller than the length in the second direction of the element body and the length in the third direction of the element body,
The first terminal electrode has a first electrode portion disposed on the main surface,
The second terminal electrode has a second electrode portion disposed on the main surface and spaced apart from the first electrode portion in the second direction on the main surface,
The length in the second direction of the central portion in the third direction in the first electrode portion and the second electrode portion is the end in the third direction in the first electrode portion and the second electrode portion. Less than the length of the second direction of the
The length in the second direction of the ends of the first electrode portion and the second electrode portion corresponds to the second direction of the end of the first electrode portion and the end of the second electrode portion Greater than the interval at
The length in the second direction of the central portion of the first electrode portion and the second electrode portion corresponds to the second direction of the central portion of the first electrode portion and the central portion of the second electrode portion rather smaller than the interval at the,
The first electrode portion and the second electrode portion have edges facing each other in the second direction,
Each of the edges of the first and second electrode portions is such that the spacing of the central portion in the second direction is greater than the spacing of the ends in the second direction. Seeing from a curved , laminated capacitor.   The multilayer capacitor according to claim 1, wherein the length in the first direction of the element body is smaller than a distance between the first terminal electrode and the second terminal electrode in the second direction. The length in the third direction of the element body is larger than the length in the second direction of the element body,
The plurality of first internal electrodes are exposed on one of the first side surfaces and the length in the third direction is larger than the length in the second direction,
The plurality of second inner electrodes are exposed to the other first side surface and the length in the third direction is larger than the length in the second direction,
The first terminal electrode further includes an electrode portion disposed on the one first side surface and connected to the plurality of first inner electrodes,
The multilayer capacitor according to claim 1, wherein the second terminal electrode further includes an electrode portion disposed on the other first side surface and connected to the plurality of second inner electrodes. .   The first terminal electrode and the second terminal electrode are formed on the element body and include a baked conductor layer including Cu or Ni, and are formed on the baked conductor layer and include Ni or Sn. The first plating layer according to any one of claims 1 to 3, and a second plating layer formed on the first plating layer and containing Cu or Au. Multilayer capacitor as described. The second plating layer is a Cu plating layer, and
The multilayer capacitor according to claim 4, wherein a protrusion made of Cu is formed on the surface of the Cu plating layer. The element body includes an inner layer portion in which the plurality of first inner electrodes and the plurality of second inner electrodes are positioned, and a pair of outer layer portions positioned to sandwich the inner layer portion in the first direction. And have, and
The thickness in the first direction of the pair of outer layer portions is smaller than the thickness in the first direction of the first electrode portion and the thickness in the first direction of the second electrode portion. The multilayer capacitor according to any one of the items.

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