JP6447416B2 - Image forming apparatus - Google Patents

Description

  The present invention relates to an image forming apparatus that forms an image on recording paper, and more particularly to a technique for cooling elements on a power supply substrate of an image forming apparatus.

  This type of image forming apparatus includes a high voltage power supply substrate that outputs a high voltage used for charging a photoconductor (image carrier), a low voltage power supply substrate that outputs a low voltage for operating a motor and various circuits, A plurality of types of substrates such as a control substrate are provided. Further, when an element having a large calorific value is provided on these substrates, it is necessary to cool the element.

  For example, in Patent Document 1, a duct is provided on the side wall of the shield case, a plurality of small ventilation holes are formed in the side wall, and air is blown into the inside of the duct by a fan. The printed circuit board disposed inside the shield case is cooled.

  Moreover, in patent document 2, an electrical equipment board | substrate is accommodated in a shield case, an air duct is connected to a shield case, air is flowed inside a shield case from a fan through an air duct, and the electrical equipment board | substrate is cooled.

JP 11-186767 A JP 2002-182545 A

  By the way, since units and parts are arranged with high density inside the image forming apparatus, it is desired to save space for the air duct. However, in Patent Document 1, since the duct is provided on the side wall of the shield case, it is necessary to provide a space dedicated to the duct. Moreover, in patent document 2, since it was the structure which guides air to an inner side of a shield case through an air duct from a fan, it was necessary to provide the space only for a duct. For this reason, it cannot be said that space saving has been sufficiently achieved.

  The present invention has been made in view of the above circumstances. An air flow path is configured by using two power supply boards, and elements on the two power supply boards are formed by air drawn into the air flow paths. It is an object of the present invention to enable further space saving of a cooling mechanism necessary for cooling elements on a power supply board by enabling cooling.

An image forming apparatus according to an aspect of the present invention includes two power supply boards arranged to face each other with mounting surfaces on which elements are mounted facing each other, and an air flow formed by being surrounded by the power supply boards. A fan that is disposed in the path and that circulates air through the air flow path to cool the element on each mounting surface; a specific element disposed on at least one of the mounting surfaces of each power supply board; and Air that is formed in the wall of the apparatus housing on the side of the opening of the air flow path and is drawn into the air flow path from the outside to the inside of the image forming apparatus by the air flow formed by the fan. A first air passage port to be passed through, a second air passage port through which the air that passes through the air flow path and is discharged from the power supply substrate passes outside the image forming apparatus, and each of the power supply substrates. Formed on at least one of the mounting surfaces; And a heat radiating plate for guiding the flow of air drawn into the air flow path by, as the heat radiating plate, includes at least a first heat radiating plate and the second heat sink, said first heat sink, Including a plate-like first heat radiating plate and an inverted L-shaped first heat radiating plate , out of both sides of the specific element on the mounting surface of the power supply board on which the specific element is disposed among the power supply boards . is the erected inverted L-shaped first radiating plate to the position of one side end, the plate-shaped first radiating plate is erected on the other side side position of the both sides, the inverted L- The first heat dissipating plate has a base end that is an end on the mounting surface side of the power supply board on which the specific element is disposed, and a front end on the opposite side of the end. The end portion is erected and extends in the same first direction as the air blowing direction from the fan to the specific element, and the tip portion is connected to the base end portion and the base end portion. It has been set to inverted L-shape bent in the specific element side the first direction as the fold between the edge portion, the fan and the first heat sink, the mounting surface of the respective power supply board The air is applied to the specific element disposed on at least one of the two and the air flow is divided to both sides of the specific element, and the second heat radiating plate includes the specific element of the power supply boards. wherein the position closer to the fan than the a one side-side inverted L-shaped first radiating plate of both sides, the mounting surface of the power supply board of the specific element in the mounting surface of the power supply board towards the A base end portion which is an end portion on the side extends in a longitudinal direction which is a direction different from the air blowing direction from the fan to the specific element, and the second heat radiating plate further includes the base end portion Between the base end and the tip of the tip on the opposite side A portion of the distal end portion, which is a portion positioned on the distal end side with respect to the portion notched in the longitudinal direction of the base end portion, is a standing direction with respect to the mounting surface of the power supply board of the second heat radiating plate. The upside-down direction is a fold line, and the first L-shaped first heat radiating plate is bent in the first direction, and a part of the first L-shaped first L-shaped side of the specific element. It is located at a position farther from the specific element than the heat radiating plate, and air is guided in the first direction by the part on the side opposite to the specific element side of the base end portion of the inverted L-shaped first heat radiating plate. In addition, air is guided in a direction different from the first direction by the base end portion .

  According to the present invention, an air flow path is configured using two power supply boards, and the elements on the two power supply boards can be cooled by the air drawn into the air flow paths. The space required for the cooling mechanism necessary for cooling the upper element can be further reduced.

1 is a front sectional view showing the structure of an image forming apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing the image forming apparatus as seen from the back side. FIG. 3 is a perspective view showing the internal structure of the image forming apparatus with the rear panel of the image forming apparatus removed. FIG. 2 is a perspective view showing a part of the internal structure of the image forming apparatus in an enlarged and broken view. FIG. 2 is a perspective view showing a state where a high-voltage power supply board inside the image forming apparatus is removed. FIG. 3 is a perspective view showing a state where a terminal base inside the image forming apparatus is further removed to expose a low-voltage power supply substrate. It is a perspective view which shows a high voltage power supply board seeing from the back side. It is a perspective view which shows a high voltage power supply board seeing from the mounting surface side. It is a perspective view which shows a low voltage power supply board seeing from the mounting surface side.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a front sectional view showing the structure of an image forming apparatus according to an embodiment of the present invention. The image forming apparatus 1 according to the present embodiment is a multifunction machine having a plurality of functions such as a copy function, a printer function, a scanner function, and a facsimile function. The image forming apparatus 1 includes an apparatus main body 2 provided with an image reading unit (ISU; Image scanner unit) 5, an operation unit 47, an image forming unit 120, a fixing device 13, a paper feeding unit 14, and the like.

  The operation unit 47 is operated by a user and accepts execution instructions such as an image forming operation and an image reading operation.

  When performing an image reading operation, the image reading device 5 optically reads an image of a document and generates image data. Image data generated by the image reading device 5 is stored in a built-in HDD or a computer connected to a network.

  When performing an image forming operation, the image data generated by the image reading operation described above, image data received from a user terminal device such as a computer or smartphone connected to a network, or image data stored in a built-in HDD Based on this, the image forming unit 120 forms a toner image on the recording paper P as a recording medium supplied from the paper supply unit 14.

  The image forming unit 120 includes a magenta image forming unit 12M, a cyan image forming unit 12C, a yellow image forming unit 12Y, and a black image forming unit 12Bk. Each of the image forming units 12M, 12C, 12Y, and 12Bk exposes the surface of the photosensitive drum 122, the charging device that uniformly charges the surface of the photosensitive drum 122, and the surface of the photosensitive drum 122 to the surface. An exposure device (LSU) 123 that forms an electrostatic latent image, a developing device 124 that develops the electrostatic latent image on the surface of the photosensitive drum 122 into a toner image using toner, and a primary transfer roller 126 And each.

  When performing color printing, in each of the image forming units 12M, 12C, 12Y, and 12Bk, the surface of the photosensitive drum 122 is uniformly charged and then exposed, and the surface corresponds to an image of a color component of color. An electrostatic latent image is formed, the electrostatic latent image on the surface of the photosensitive drum 122 is developed by the developing device 124, a toner image of the color component is formed on the photosensitive drum 122, and the toner image is primarily transferred. The roller 126 performs primary transfer onto the intermediate transfer belt 125 stretched around the driving roller 125A and the driven roller 125B.

  The intermediate transfer belt 125 has an image bearing surface on which the toner image is transferred on the outer circumferential surface thereof, and is driven by the driving roller 125 </ b> A while being in contact with the circumferential surface of the photosensitive drum 122. The intermediate transfer belt 125 runs endlessly between the driving roller 125A and the driven roller 125B while being synchronized with each photosensitive drum 122.

  The toner images of the respective color components transferred onto the intermediate transfer belt 125 are superimposed on the intermediate transfer belt 125 with the transfer timing adjusted to become a color toner image. The secondary transfer roller 210 records the color toner image formed on the surface of the intermediate transfer belt 125 from the paper supply unit 14 through the conveyance path 190 at the nip portion N between the secondary transfer roller 210 and the intermediate transfer belt 125. Secondary transfer is performed on the paper P.

  Thereafter, the recording paper P is heated and pressurized by the fixing device 13, the toner image on the recording paper P is fixed by thermocompression bonding, and the recording paper P is discharged to the discharge tray 151 through the discharge roller pair 159.

  The paper supply unit 14 accommodates a plurality of recording papers P, and rotates the pickup roller 145 to convey and supply the recording papers P to the conveyance path 190.

  FIG. 2 is a perspective view showing the image forming apparatus 1 as seen from the back side. FIG. 3 is a perspective view showing the internal structure of the image forming apparatus 1 with the rear panel of the image forming apparatus 1 removed. Further, FIG. 4 is an enlarged perspective view of a part of the internal structure of the image forming apparatus 1.

  As shown in FIGS. 1 and 2, an image reading device 5 is provided above the apparatus main body 2 of the image forming apparatus 1, and an upper surface of the apparatus main body 2 is a discharge tray 151. In addition, an image forming unit 120, a fixing device 13, a paper feeding unit 14, and the like are provided inside the apparatus main body 2.

  When the three back panels 51 provided on the back side of the apparatus main body 2 are removed, the high-voltage power supply board 52 and the control board 53 arranged inside the apparatus main body 2 are exposed. A low-voltage power supply substrate 54 is provided on the back side of the high-voltage power supply substrate 52 (the front side of the image forming apparatus 1), and the high-voltage power supply substrate 52 and the low-voltage power supply substrate 54 are arranged to face each other with an appropriate interval. A cooling fan 63 is provided between the high-voltage power supply substrate 52 and the low-voltage power supply substrate 54. Further, a terminal base 55 is provided on one end of the high voltage power supply substrate 52 so as to overlap.

  The high voltage power supply board 52 is screwed to a stay 64 fixed to the bottom wall 56 of the apparatus main body 2, the frame 65 of the apparatus main body 2, and the like, and the high voltage power supply board 52 is electrically connected to the terminal base 55. The terminal base 55 is screwed to the frames 65 and 68 (FIG. 6) of the apparatus main body 2, and the fan 63 is screwed to the terminal base 55. Further, the low-voltage power supply board 54 is screwed to a sheet metal 58 or the like on the back side of the low-voltage power supply board 54.

  The high voltage power supply substrate 52 generates a high voltage to be applied to the primary transfer roller 126, the secondary transfer roller 210, and the like, and outputs this high voltage to the image forming unit 120 through the terminal base 55. The low voltage power supply board 54 generates and outputs a low voltage for operating the motor and various circuits. The high-voltage power supply board 52 and the low-voltage power supply board 54 include a rear panel 51, a bottom wall 56 and a side wall 57 of the apparatus main body 2, a wall portion (not shown) disposed on the back side of each of the power supply boards 52 and 54, and It is surrounded and shielded by a wall portion (not shown) arranged on the upper side of each power supply board 52, 54, so that noise generated in each power supply board 52, 54 is not leaked to the outside. .

  The control board 53 is for controlling the entire image forming apparatus 1, and includes a back panel 51, a side wall 59 of the apparatus main body 2, and shield plates (not shown) arranged on the side and back side of the board 53. ) And the like are shielded so that external noise is blocked from entering.

  A cooling fan 61 is provided below the control board 53. The fan 61 sucks outside air through a louver 62 formed on the lower left side back panel 51, and blows the air to an electromagnetic clutch or a motor arranged around the back side of the fan 61. Cooling. Then, the air is guided to the upper control board 53 to cool a plurality of elements mounted on the mounting surface of the control board 53, and further, a louver (second air passage) formed on the upper rear panel 51. Mouth) 67 is exhausted to the outside.

  Incidentally, the high-voltage power supply substrate 52 and the low-voltage power supply substrate 54 are provided with a plurality of elements that generate a large amount of heat, and these elements need to be efficiently cooled. However, in order to reduce the size of the image forming apparatus 1, the units and components are arranged at high density inside the image forming apparatus 1, and therefore a mechanism for cooling the power supply boards 52 and 54 is also included. It is desirable to save space.

  Therefore, in this embodiment, further space saving is achieved by configuring the duct D (air flow path) using the high-voltage power supply substrate 52 and the low-voltage power supply substrate 54.

  Next, the configuration of the duct D will be described in detail. FIG. 5 is a perspective view showing a state in which the high-voltage power supply substrate 52 inside the image forming apparatus 1 is removed, and FIG. 6 is a perspective view showing a state in which the terminal base 55 is further removed and the low-voltage power supply substrate 54 is exposed. FIG. FIG. 7 is a perspective view showing the high-voltage power supply substrate 52 as seen from the back surface side, and FIG. 8 is a perspective view showing the high-voltage power supply substrate 52 as seen from the mounting surface side. Further, FIG. 9 is a perspective view showing the low-voltage power supply board 54 as viewed from the mounting surface side.

  As shown in FIGS. 5 and 6, when the high-voltage power supply substrate 52 is removed, the terminal base 55 is exposed, and when the terminal base 55 is further removed, the cooling fan 63 screwed to the terminal base 55 is also removed. Thus, the entire low-voltage power supply board 54 is exposed.

  As shown in FIG. 7, no element is mounted on the back surface of the high-voltage power supply substrate 52. On the other hand, a plurality of elements are mounted on the mounting surface of the high-voltage power supply substrate 52 as shown in FIG. Yes. A plurality of sub-substrates 71 are erected vertically on the mounting surface of the high-voltage power supply substrate 52 with respect to the high-voltage power supply substrate 52. These sub-boards 71 are provided to supplement the capacity of the mounting surface of the high-voltage power supply board 52. Further, on the mounting surface of the high-voltage power supply substrate 52, a plurality of heat radiation plates 72, 73, 74 are erected vertically with respect to the high-voltage power supply substrate 52. The heat radiating plates 72, 73, 74 guide the flow of air drawn into the duct D by the fan 63. These radiator plates 72, 73, 74 are equipped with switching elements that generate a large amount of heat.

  Each of the sub-boards 71 has a flat plate shape, and the longitudinal direction thereof is in the horizontal direction in FIG. Each heat radiating plate 72 has a flat plate shape, and the longitudinal direction thereof is in the horizontal direction in FIG. Each of the other heat sinks 73 is bent in a U shape, and the longitudinal direction thereof is in the horizontal direction in FIG. Each of the other heat radiating plates 74 is bent in a U shape, and the longitudinal direction thereof is in the vertical direction in FIG.

  Further, as shown in FIG. 9, a plurality of elements are mounted on the mounting surface of the low-voltage power supply board 54, and a large electrolytic capacitor 81 is disposed at the approximate center of the mounting surface. A plurality of heat sinks 82, 83, 84, 85 are erected vertically on the mounting surface of the low voltage power supply board 54 with respect to the low voltage power supply board 54. Is equipped with a switching element that generates a large amount of heat.

  Each heat radiating plate 82 has a flat plate shape, and the longitudinal direction thereof is in the horizontal direction. Each of the other heat radiating plates 83 has a flat plate shape, and the longitudinal direction thereof is in the vertical direction. Another heat radiating plate 84 has an L-shaped cross-sectional shape, and its longitudinal direction is in the horizontal direction. Furthermore, the other heat sink 85 is formed by bending a part 85a thereof in the horizontal direction.

  Here, the high-voltage power supply substrate 52 and the low-voltage power supply substrate 54 are arranged to face each other, and the mounting surface of the high-voltage power supply substrate 52 on which a plurality of elements are mounted and the mounting surface of the low-voltage power supply substrate 54 on which a plurality of elements are mounted are It is made to face each other. A region surrounded by the high-voltage power supply substrate 52 and the low-voltage power supply substrate 54 forms an air flow path through which air flows, that is, the duct D. The high voltage power supply board 52 has a larger area than the low voltage power supply board 54, and only the duct portion 52 a of the high voltage power supply board 52 faces the low voltage power supply board 54. In other words, of the mounting surface of the high-voltage power supply substrate 52, the duct portion 52 a facing the low-voltage power supply substrate 54 forms the duct D with the low-voltage power supply substrate 54.

  Further, as described above, the fan 63 is screwed to the terminal base 55 and is disposed between the high voltage power supply board 52 and the low voltage power supply board 54. In FIGS. 8 and 9, the directions of viewing the respective mounting surfaces are opposite to each other. Therefore, the fans 63 are shown at different left and right positions, and air is blown out from the fans 63. The direction is also reverse as shown by the arrows. In the present embodiment, the blowing direction of the air from the fan 63 is substantially horizontal and facing the inside of the image forming apparatus 1.

  Thus, in the configuration in which the mounting surface of the high-voltage power supply substrate 52 and the mounting surface of the low-voltage power supply substrate 54 face each other, the distance between the element on the mounting surface of the high-voltage power supply substrate 52 and the element on the mounting surface of the low-voltage power supply substrate 54 is set. It is necessary to keep the insulation distance longer than the respective elements. In this embodiment, the interval between the mounting surfaces is set as narrow as possible on the premise that the insulation distance is kept at least. That is, while the elements on the high-voltage power supply board 52 side and the elements on the low-voltage power supply board 54 side are appropriately separated, the distance between the power supply boards 52 and 54 is narrowed.

  In addition, each sub-board 71 on the mounting surface of the high-voltage power supply substrate 52 is disposed in the duct portion 52a of the high-voltage power supply substrate 52 and extends in the horizontal direction, and each heat sink on the mounting surface of the low-voltage power supply substrate 54. 82 extends in the horizontal direction. The sub boards 71 and the heat radiating plates 82 are located above the fans 63 and restrict the air flow upward from the sub boards 71 and the heat radiating plates 82.

  Further, as shown in FIG. 4, a bottom wall 56 of the apparatus main body 2 is provided below the high-voltage power supply board 52 and the low-voltage power supply board 54. An opening space formed therebetween is covered with the bottom wall 56. The bottom wall 56 prevents air leakage below the bottom wall 56.

  That is, the high-voltage power supply board 52 and the low-voltage power supply board 54 are arranged to face each other, and the interval between the power supply boards 52 and 54 is set narrow. Each heat sink 82 restricts the air flow upward, and the bottom wall 56 of the apparatus main body 2 prevents the air leakage downward.

  That is, the sub-boards 71, the heat sinks 82, and the bottom wall 56 of the apparatus main body 2 are formed so as to cover the opening space formed between the peripheral edges of the high-voltage power supply board 52 and the low-voltage power supply board 54 that are arranged to face each other. A plurality of members are provided. The duct portion 52a of the high-voltage power supply board 52, the low-voltage power supply board 54, the sub-boards 71, the heat sinks 82, and the bottom wall 56 of the apparatus main body 2 have a cylindrical shape that guides the air blown from the fan 63 in the horizontal direction. An air flow path, that is, the duct D is configured.

  In such a configuration, the fan 63 sucks air outside the image forming apparatus 1 through a louver (first air passage port) 66 formed on the side wall 57 of the apparatus main body 2, and this air is taken into the inside of the duct D. To guide. The louver 66 is formed on a side wall 57 that is lateral to the opening of the duct D as an air flow path. The louver 66 allows the air drawn into the duct D to pass from the outside to the inside of the image forming apparatus 1 by the flow of air formed by the fan 63. The air generally flows in the horizontal direction through the duct D formed between the duct portion 52a of the high-voltage power supply board 52 and the low-voltage power supply board 54, and a plurality of elements on the mounting surface of the duct portion 52a of the high-voltage power supply board 52 are arranged. And it sprays on the several element on the mounting surface of the low voltage power supply board 54, and these elements are cooled. Then, the air that has passed through the duct D formed by each of the power supply boards 52 and 54 merges with the air blown from the other fan 61 and is guided to the upper control board 53, A plurality of elements on the mounting surface are cooled and exhausted to the outside through a louver 67 formed on the back panel 51. That is, the louver 67 allows the air discharged from the power supply boards 52 and 54 to pass outside the image forming apparatus 1 through a duct D as an air flow path to be described later.

  Specifically, in the duct D, since the interval between the power supply boards 52 and 54 is set narrow, the capacity of the duct D is suppressed, and the air blown from the fan 63 flows at high speed. Then, as shown in FIG. 9, this air is blown to a large electrolytic capacitor 81 (an example of an element to which air is applied) on the low voltage power supply board 54 side, and flows above and below the electrolytic capacitor 81. It is divided into two air streams A and B.

  The upper air flow A is rectified into a horizontal flow by the sub-boards 71 on the high-voltage power supply board 52 side and the heat sinks 82 on the low-voltage power supply board 54 side, and flows quickly. Each element located above the electrolytic capacitor 81 is cooled by restricting the air flow upward from the respective heat sinks 82. Further, even if a part of the air circulates above each sub-board 71 and each heat sink 82, the air circulated above is mounted on other parts except the duct part 52 a of the high-voltage power supply board 52. Each element is sprayed to cool these elements.

  Further, the lower air flow B is rectified into a horizontal flow by the heat radiation plates 72 and 73 on the high voltage power supply substrate 52 side and the heat radiation plate 84 on the low voltage power supply substrate 54 side, and flows more quickly, than the electrolytic capacitor 81. Each element located on the lower side is cooled.

  Further, the air blown from the fan 63 passes through the upper space of the part 85a bent in the horizontal direction of the heat dissipation plate 85 on the low-voltage power supply board 54 side, and becomes an air flow C flowing along the part 85a. The air flow C is directly blown to the element that generates a large amount of heat on the low-voltage power supply board 54 side, and the element is effectively cooled.

  Furthermore, after each air flow A, B, C passes between each sub board 71, each heat sink 72, 73, 82, 84, 85, etc., each heat sink 74 and low voltage power supply on the high voltage power supply board 52 side. It strikes against each heat sink 83 on the substrate 54 side and diffuses over a wide range to cool peripheral elements and components. Then, the air passing through the duct D merges with the air blown from the other fan 61, is guided upward, and is exhausted to the outside through the louver 67 formed in the back panel 51.

  As described above, in this embodiment, the duct D is configured by using the duct portion 52a and the low-voltage power supply board 54 of the high-voltage power supply board 52. Therefore, further space saving can be realized.

  One fan 63 is disposed between the high-voltage power supply board 52 and the low-voltage power supply board 54, and each element on the mounting surface of the high-voltage power supply board 52 and each element on the mounting surface of the low-voltage power supply board 54 by the fan 63. Therefore, the number of fans can be suppressed to a minimum, which can also save space, and further reduce the number of components and power consumption.

  Moreover, since the longitudinal direction of each sub board | substrate 71 and each heat sink 72,73,82,84 etc. is made parallel to the flow direction (horizontal direction) of an air flow, an air flow is obstructed by these sub boards and a heat sink. Thus, each element on the mounting surface of the high-voltage power supply substrate 52 and each element on the mounting surface of the low-voltage power supply substrate 54 can be efficiently cooled.

  In the above-described embodiment, the image forming apparatus according to the present invention is described using a color multifunction peripheral, but this is only an example, and a monochrome printer, a color printer, or another electronic device, for example, Other image forming apparatuses such as a copying machine and a facsimile machine may be used.

  Moreover, the structure demonstrated using FIG. 1 thru | or FIG. 9 is only one Embodiment of this invention, and is not the meaning which limits this invention to the said structure.

DESCRIPTION OF SYMBOLS 1 Image forming apparatus 2 Apparatus main body 52 High voltage power supply board 53 Control board 54 Low voltage power supply board 61, 63 Fan 71 Sub board | substrate 72-74 Heat sink 81 Electrolytic capacitor 82-85 Heat sink

Claims (2)

Two power supply boards that are arranged opposite each other with the mounting surfaces on which the elements are mounted facing each other;
A fan that is disposed in an air flow path formed by being surrounded by each of the power supply substrates, and that circulates air through the air flow path to cool the elements on the mounting surfaces;
A specific element disposed on at least one of the mounting surfaces of each power supply board;
Air that is formed in the wall portion of the apparatus housing on the side of the opening of the air flow path and is drawn into the air flow path by the air flow formed by the fan is supplied from the outside to the inside of the image forming apparatus. A first air passage port to be passed through;
A second air passage port through which the air that passes through the air flow path and is discharged from the power supply substrate passes outside the image forming apparatus;
A heat sink that is formed on at least one of the mounting surfaces of each power supply board and guides the flow of air drawn into the air flow path by the fan, and
The heat sink includes at least a first heat sink and a second heat sink,
The first heat radiating plate includes a plate-shaped first heat radiating plate and an inverted L-shaped first heat radiating plate, and the specification on the mounting surface of the power supply board on which the specific element is disposed among the power supply boards. The inverted L-shaped first heat radiating plate is erected at a position on one side of both sides of the element, and the plate-shaped first radiating plate is erected at a position on the other side of the both sides. Established,
The inverted L-shaped first heat radiating plate has a base end portion that is an end portion on the mounting surface side of the power supply board on which the specific element is disposed, and a tip end portion on the side opposite to the end portion. The base end portion is erected in the same first direction as the air blowing direction from the fan to the specific element, and the tip end portion is located between the base end portion and the tip end portion. The first direction is a reverse L-shape that is bent toward the specific element with a crease as the crease,
The fan and the first heat radiating plate apply the air to the specific element disposed on at least one of the mounting surfaces of the power supply boards, and divide the air flow on both sides of the specific element.
The second heat radiating plate is on one side of the both sides of the specific element on the mounting surface of the power supply board on which the specific element is disposed among the power supply boards, and the inverted L-shaped. A longitudinal direction in which a base end portion, which is an end portion on the mounting surface side of the power supply board , is closer to the fan than the first heat radiating plate is a direction different from the air blowing direction from the fan to the specific element Standing up and extending
Furthermore, the second heat radiating plate has a portion between the base end portion and the tip end portion of the tip end portion on the side opposite to the base end portion, which is notched in the longitudinal direction of the base end portion. Is a portion located on the front end side, and a part of the front end portion is the inverted L-shaped first heat radiating plate with the erected direction being a standing direction with respect to the mounting surface of the power supply substrate of the second heat radiating plate. And a part thereof is located farther from the specific element than the inverted L-shaped first heat radiating plate on one side of the specific element. In part, air is guided in the first direction on the side opposite to the specific element side of the base end portion of the inverted L-shaped first heat radiating plate, and the base end portion differs from the first direction. An image forming apparatus that guides air in a direction . The two power supply boards, one is a high-voltage power supply board and the other is a low-voltage power supply board, and are arranged to face each other in a posture parallel to the vertical direction,
The high-voltage power supply substrate is formed to have a larger area than the low-voltage power supply substrate,
The low-voltage power supply board is disposed opposite to the lower side of the mounting surface of the high-voltage power supply board,
The mounting surface of the high-voltage power supply substrate has a portion facing the low-voltage power supply substrate and a portion not facing the low-voltage power supply substrate,
Of the mounting surface of the high-voltage power supply board, a sub-board is erected along the upper peripheral edge of the portion facing the low-voltage power supply board,
The specific element is disposed on the mounting surface of the low-voltage power supply board,
The plate-like first heat radiating plate is erected on the upper side of the both sides of the specific element on the mounting surface of the low-voltage power supply board, and on the lower side of the both sides. , The inverted L-shaped first heat sink is erected,
The plate-like first heat radiating plate located on the upper side of the specific element is erected on the upper peripheral edge of the mounting surface of the low-voltage power supply board so that the longitudinal direction faces the first direction,
A portion of the high-voltage power supply substrate facing the low-voltage power supply board, the low-voltage power supply board, the sub-board, the plate-shaped first heat radiating plate, the inverted L-shaped first heat radiating plate, and the second heat radiating plate. The image forming apparatus according to claim 1, wherein the air flow path is formed.