JP6349496B2 - Semiconductor die pickup apparatus and pickup method - Google Patents

Description

  The present invention relates to a structure of a pickup device for a semiconductor die used in a bonding apparatus and a pickup method.

  The semiconductor die is manufactured by cutting a wafer having a size of 6 inches or 8 inches into a predetermined size. At the time of cutting, a dicing sheet is attached to the back surface so that the cut semiconductor dies do not fall apart, and the wafer is cut from the front surface side with a dicing saw or the like. At this time, the dicing sheet affixed to the back surface is slightly cut, but is not cut and holds each semiconductor die. Each cut semiconductor die is picked up from the dicing sheet one by one and sent to the next step such as die bonding.

  As a method of picking up the semiconductor die from the dicing sheet, the dicing sheet is adsorbed on the surface of the disk-shaped adsorbing piece, and the semiconductor die is adsorbed to the collet, and the semiconductor die is pushed up by a push-up block arranged at the center of the adsorbing piece. A method of picking up a semiconductor die from a dicing sheet by raising the collet and raising the collet has been proposed (see, for example, FIGS. 9 to 23 of Patent Document 1). When peeling the semiconductor die from the dicing sheet, it is effective to first peel the peripheral part of the semiconductor die and then peel the central part of the semiconductor die, which is described in Patent Document 1. In the prior art, the push-up block is divided into a push-up block that pushes up the peripheral part of the semiconductor die, a push-up in the center of the semiconductor die, and a push-up in the middle, and first the three blocks are raised to a predetermined height. The middle and middle blocks are raised higher than the surrounding blocks, and finally the middle block is raised higher than the middle blocks.

  Also, with the dicing sheet adsorbed on the surface of the disk-shaped ejector cap and the semiconductor die adsorbed on the collet, the collet and the peripheral, intermediate, and central push-up blocks are set at a predetermined height higher than the ejector cap surface. Then, the collet is kept at the same height, and the dicing sheet is peeled off from the semiconductor die by lowering the push-up block to the position below the ejector cap surface in the order of the surrounding push-up block and the intermediate push-up block. There has also been proposed a method (see, for example, Patent Document 2).

  When the dicing sheet is peeled from the semiconductor die by the method described in Patent Documents 1 and 2, it is described in FIGS. 40, 42 and 44 of Patent Document 1, FIGS. 4A to 4D and FIGS. 5A to 5D of Patent Document 2. Thus, before the semiconductor die is peeled off, the semiconductor die may be bent and deformed together with the dicing sheet while being adhered to the dicing sheet. If the dicing sheet peeling operation is continued in a state where the semiconductor die is bent, the semiconductor die may be damaged. Therefore, as shown in FIG. 31 of Patent Document 1, the suction air from the collet The curvature of the semiconductor die is detected by the change in the flow rate, and if the intake air flow rate is detected as described in FIG. 43 of Patent Document 1, it is determined that the semiconductor die is deformed and the push-up block is moved. There has been proposed a method in which the push-up block is lifted again after being lowered.

  Also, when picking up the semiconductor die, with the semiconductor die picked up by the collet adsorbed, the tip of the lid that closes the suction opening is advanced from the contact surface, and the lid is slid while pushing up the dicing sheet and the semiconductor die. After opening the gap between the suction opening and the tip of the lid, the rear end, which is the end on the side where the lid opens, is advanced from the adhesion surface so that the surface of the lid is substantially parallel to the adhesion surface. Proposing a method that slides the lid while pushing up the dicing sheet and the semiconductor die on the surface to open the suction openings one after another, and then draws the dicing sheets into the opened suction openings and picks up the dicing sheets sequentially from the picked up semiconductor die. (For example, see Patent Document 3).

Japanese Patent No. 4945339 US Patent No. 8092645 Japanese Patent No. 4397429

  By the way, in recent years, semiconductor dies have become very thin, for example, about 20 μm. On the other hand, since the thickness of the dicing sheet is about 100 μm, the thickness of the dicing sheet is four times the thickness of the semiconductor die. When such a thin semiconductor die is peeled off from the dicing sheet, the deformation of the semiconductor die following the deformation of the dicing sheet is more likely to occur. In the prior art described in Patent Literatures 1-3, dicing is performed. When picking up the semiconductor die from the sheet, there is a problem that the semiconductor die is often damaged.

  Therefore, an object of the present invention is to effectively pick up a semiconductor die while suppressing the occurrence of damage to the semiconductor die.

A semiconductor die pick-up device according to the present invention is a semiconductor die pick-up device for picking up a semiconductor die attached to the surface of a dicing sheet, and includes a stage including an adsorption surface for adsorbing the back surface of the dicing sheet, and an adsorption of the stage A suction opening provided on the surface, a lid that slides along the suction surface to open and close the suction opening, and an opening that switches the pressure of the suction opening between a first pressure close to vacuum and a second pressure close to atmospheric pressure A pressure switching mechanism, and when picking up a semiconductor die, the pressure of the suction opening is switched from the second pressure to the first pressure, and then the lid is switched each time the pressure of the suction opening is switched from the first pressure to the second pressure. Is slid in the opening direction by a predetermined distance.

In the semiconductor die pick-up apparatus of the present invention, when picking up a semiconductor die, the suction pressure of the suction surface is kept in a vacuum, each switching the pressure of the suction opening to the second pressure from the first pressure, the lid predetermined It is also preferable to slide in the opening direction by a distance.

In the semiconductor die pick-up device of the present invention, the lid is provided on the stage so that the surface thereof can be advanced from the suction surface, and when picking up the semiconductor die, the lid is slightly slid to slightly open the suction opening. In addition, after the surface of the lid is advanced to a predetermined height higher than the suction surface, the suction pressure of the suction surface is evacuated, and after a predetermined time has elapsed, the pressure of the suction opening is switched from the second pressure to the first pressure, thereby peeling the dicing sheet overlying the BiHiraku the Aspirate opening from a semiconductor die, it is also preferable.

  In the semiconductor die pick-up device of the present invention, the opening pressure switching mechanism switches the suction opening pressure a plurality of times between the first pressure and the second pressure before the lid is first slid in the opening direction by a predetermined distance. This is also preferable.

  In the semiconductor die pick-up device of the present invention, the lid is provided on the stage so that the surface thereof can be advanced from the adsorption surface, and when picking up the semiconductor die, the lid surface is raised to a predetermined height higher than the adsorption surface. It is also preferable to slide the lid in the advanced state.

  In the semiconductor die pick-up device of the present invention, it is provided with a peeling detection means for detecting whether or not a part of the semiconductor die located immediately above the suction opening opened by sliding the lid is peeled off from the surface of the dicing sheet. When it is detected by the means that a part of the semiconductor die is not peeled off the dicing sheet, the pressure of the suction opening is changed after the pressure of the suction opening is switched from the first pressure to the second pressure without sliding the lid. Is preferably switched from the second pressure to the first pressure again.

  The semiconductor die pick-up device of the present invention includes a collet that adsorbs the semiconductor die, a suction mechanism that is connected to the collet and sucks air from the surface of the collet, and a flow rate sensor that detects a suction air flow rate of the suction mechanism. The peeling detection means determines that peeling has occurred when the number of times the differential signal obtained by differentiating the suction air flow signal detected by the flow sensor exceeds a predetermined threshold range has become an even number, and peeling has occurred when it has become an odd number. It is also preferable to judge that it is not.

In the semiconductor die pick-up device of the present invention, provided near the end surface of the suction opening with which the tip of the lid comes into contact when the suction opening is closed, when the suction opening is slightly opened by micro-sliding the lid, Equipped with a sheet displacement detection sensor that detects the displacement in the contact and separation direction with respect to the suction surface of the dicing sheet positioned above the suction opening , and after the suction pressure of the suction surface is evacuated, the suction opening pressure is adjusted after a predetermined time has elapsed. If the sheet displacement detected by the sheet displacement detection sensor is equal to or less than a predetermined threshold when the second pressure is switched to the first pressure, the suction pressure on the suction surface is released to the atmosphere and the suction opening pressure is changed from the first pressure. after switching to a second pressure, again after the vacuum suction pressure of the suction surface, the pressure of the suction opening after a predetermined time is switched from the second pressure to the first pressure, on the Aspirate opening that BiHiraku Located in Thereby peeling the dicing sheet from the semiconductor die that is suitable as a. In addition, the sheet displacement detection sensor is suitable for using light having a wavelength in the range of light transmittance of 0% to 30% for the dicing sheet as a light source, and using a short wavelength LED of 0 nm to 300 nm as a light source. It is also preferable to use a reflective optical fiber.

The semiconductor die pick-up method of the present invention is a semiconductor die pick-up method for picking up a semiconductor die attached to the surface of a dicing sheet, the stage including an adsorption surface for adsorbing the back surface of the dicing sheet, and the stage adsorption A suction opening provided on the surface, a lid provided on the stage so that its surface can be advanced from the suction surface, a lid that slides along the suction surface to open and close the suction opening, and the pressure of the suction opening is close to vacuum An opening pressure switching mechanism for switching between a first pressure and a second pressure close to atmospheric pressure; and a step of preparing a semiconductor die pick-up device, and one end of the semiconductor die picked up by a closed lid tip Position where the stage is moved in the direction along the suction surface so that the position in the width direction of the lid and the position in the width direction of the semiconductor die match And Align step, the lid is minutely sliding the BiHiraku suction opening, after advancing the surface of the lid to a higher predetermined height from the suction surface, the suction pressure of the suction surface and a vacuum, after a predetermined time has elapsed the pressure of the suction opening is switched from the second pressure to the first pressure, holding a first stripping step of stripping the dicing sheet from the semiconductor die to be positioned over the Aspirate opening that BiHiraku, the suction pressure of the suction surface in a vacuum Then, after switching the pressure of the suction opening from the second pressure to the first pressure, every time the pressure of the suction opening is switched from the first pressure to the second pressure, the surface of the lid is advanced to a predetermined height higher than the suction surface. A second peeling step in which the lid is slid in the opening direction by a predetermined distance and a part of the semiconductor die located immediately above the suction opening opened by the sliding is peeled off from the surface of the dicing sheet. Features.

In method of picking up a semiconductor die of the present invention, the opening pressure switching mechanism, first before sliding the lid only opening direction a predetermined distance, several times the pressure of the suction opening between the first pressure and the second pressure It is also suitable as switching.

In the semiconductor die pick-up method of the present invention, the semiconductor die pick-up device is provided in the vicinity of the end surface of the suction opening with which the tip of the lid contacts when the suction opening is closed. vacuum upon opening, comprising a sheet displacement sensor for detecting the displacement of the contact and separation direction relative to the suction surface of the dicing sheet overlying the Aspirate opening that BiHiraku, first release step, the adsorption pressure in the adsorption surface If the sheet displacement detected by the sheet displacement detection sensor exceeds a predetermined threshold when the suction opening pressure is switched from the second pressure to the first pressure after a predetermined time has elapsed, It determines that the dicing sheet overlying the pull opening is peeled off from the semiconductor die, when the sheet displacement detected by the sheet displacement detecting sensor is equal to or less than the predetermined threshold, the BiHiraku A first release determination step of determining a dicing sheet is not peeled off from the semiconductor die to be positioned over the Aspirate opening, the dicing sheet is a semiconductor die which is positioned above the Aspirate opening was BiHiraku in first release determining step If it is determined not to be peeled off from the suction pressure of the suction surface after switching to the second pressure the pressure of the suction opening from the first pressure as well as the air opening, again to a vacuum suction pressure of the suction surface after, including the pressure of the suction opening after a predetermined time is switched from the second pressure to the first pressure, a first retry step for peeling the dicing sheet from the semiconductor die to be positioned over the Aspirate opening that BiHiraku, the This is also preferable. In addition, the sheet displacement detection sensor is suitable for using light having a wavelength in the range of light transmittance of 0% to 30% for the dicing sheet as a light source, and using a short wavelength LED of 0 nm to 300 nm as a light source. It is also preferable to use a reflective optical fiber.

  In the semiconductor die pick-up method of the present invention, the semiconductor die pick-up device includes a collet that adsorbs the semiconductor die, a suction mechanism that is connected to the collet and sucks air from the surface of the collet, and detects a suction air flow rate of the suction mechanism The second peeling step includes sliding the lid when the number of times that the differential signal obtained by differentiating the suction air flow signal detected by the flow sensor exceeds a predetermined threshold range is an even number. It is judged that a part of the semiconductor die located immediately above the opened suction opening has been peeled off from the surface of the dicing sheet, and when it becomes an odd number, the lid of the semiconductor die located just above the opened suction opening is slid. A part of the semiconductor die is diced by the second peeling judgment step for judging that a part of the dicing sheet is not peeled off from the surface of the dicing sheet and the second peeling judgment step. If it is determined that the sheet does not peel off from the surface of the sheet, the pressure of the suction opening is changed from the second pressure to the second pressure after the suction opening is switched from the first pressure to the second pressure without sliding the lid. Including a second retry step of switching to one pressure and peeling a part of the semiconductor die from the surface of the dicing sheet.

  The present invention has an effect of effectively picking up a semiconductor die while suppressing the occurrence of damage to the semiconductor die.

It is explanatory drawing which shows the system | strain structure of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is a perspective view which shows the stage of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is a top view which shows the stage of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is detail drawing of the stage of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is detail drawing of the lid | cover of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is sectional drawing of the stage and lid | cover of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows the wafer affixed on the dicing sheet. It is explanatory drawing which shows the semiconductor die affixed on the dicing sheet. It is explanatory drawing which shows the structure of a wafer holder. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is explanatory drawing which shows operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is a graph which shows the time change of the collet height at the time of operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention, opening width, the suction pressure of a stage, the pressure of a suction opening, and the air leak amount of a collet. It is explanatory drawing which shows operation | movement of the peeling determination process of the pick-up apparatus of the semiconductor die in embodiment of this invention. It is a graph which shows the time change of the collet height in the case of other operation | movement of the pick-up apparatus of the semiconductor die in embodiment of this invention, opening width, the adsorption pressure of a stage, the pressure of a suction opening, and the air leak amount of a collet. .

  Hereinafter, a semiconductor die pick-up apparatus according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, a semiconductor die pick-up device 500 of this embodiment holds a dicing sheet 12 having a semiconductor die 15 attached to a surface 12a and moves in a horizontal direction, and a wafer holder 10 The stage 20 including the suction surface 22 that is disposed on the lower surface of the dicing sheet 12 and sucks the back surface 12b of the dicing sheet 12, and the suction opening 40 provided on the suction surface 22 of the stage 20 as shown in FIG. 1, the slider driving mechanism 300 that slides the slider 332 to which the lid 23 is rotatably mounted as shown in FIG. 1, the collet 18 that picks up the semiconductor die 15, and the pressure of the suction opening 40 of the stage 20. An opening pressure switching mechanism 80 for switching, and an adsorption pressure switching machine for switching the adsorption pressure of the adsorption surface 22 of the stage 20 90, a suction mechanism 100 for sucking air from the surface 18a of the collet 18, a vacuum device 140, a wafer holder horizontal drive unit 110 for driving the wafer holder 10 in the horizontal direction, and a stage for driving the stage 20 in the vertical direction. A vertical drive unit 120, a collet drive unit 130 that drives the collet 18 in the vertical and horizontal directions, and a control unit 150 that performs drive control of the semiconductor die pickup device 500 are provided.

  As shown in FIG. 1, the slider drive mechanism 300 provided inside the stage 20 is driven in the forward / backward direction with respect to the suction surface 22 by a drive unit 25 attached to the base unit 24 of the stage 20. A piston 370 that is slidably attached to the casing 21 of the link 326 and the stage 20 and that moves forward and backward with respect to the suction surface 22, is provided inside the casing 21, and engages with a flange 371 of the piston 370 to engage with the piston 370. A stopper 321a for restricting the movement in the advancing / retreating direction with respect to the suction surface 22, a spring 373 for connecting the first link 326 and the piston 370 in a direction for moving back and forth with respect to the suction surface 22, and the piston 370 are attached to the suction surface 22. A guide rail 331 extending in a direction in which the groove 22a extends, and a slider 3 slidably attached to the guide rail 331 2 and is attached to the piston 370 rotatably by a pin 328, connects the slider 332 and the first link 326, and when the piston 370 contacts the stopper 321a, the first link 326 moves in the advancing / retreating direction with respect to the suction surface 22 And a second link 329 that converts the movement of the slider 332 into a movement in the direction along the guide rail 331. A cylindrical pin 330 extending in the width direction of the groove 22a is attached to the slider 332. As shown in FIG. 5, the pin 330 is provided on an arm 23f that overhangs from the tip 23a of the lid 23 toward the end surface 22e. In addition, an inverted U-shaped notch is rotatably engaged. In addition, the second link 329 has a pin 327 provided at one end entering the engagement groove 326a of the first link 326, and the engagement groove 329a provided at the other end sandwiches the pin 330a of the slider 332, so that the slider 332 and The first link 326 is connected. A motor 381 for operating the slider drive mechanism 300 is attached inside the drive unit 25, and a cam that contacts a roller 326 c provided at the tip of the shaft 326 b of the first link 326 on the rotating shaft of the motor 381. 383 is attached. When the motor 381 rotates in the direction of arrow a shown in FIG. 1, the slider driving mechanism 300 moves up the first link 326 shown by arrow b in FIG. 1 and rotates the second link 329 shown by arrow d in FIG. Thus, the slider 332 is slid rightward along the suction surface 22.

An opening pressure switching mechanism 80 that switches the pressure of the suction opening 40 (see FIG. 2) of the stage 20 or the pressure inside the housing 21 communicating with the suction opening 40 includes a three-way valve 81 and a three-way valve 81 as shown in FIG. And a drive unit 82 that performs the opening / closing drive. The three-way valve 81 has three ports, the first port is connected to the casing 21 communicating with the suction opening 40 of the stage 20 by a pipe 83, and the second port is connected to the vacuum device 140 by a pipe 84, The three ports are connected to a pipe 85 that is open to the atmosphere. The drive unit 82 connects the first port and the second port to block the third port, and sets the pressure of the suction opening 40 to the first pressure P ₁ close to vacuum, or connects the first port and the third port. By blocking the second port and setting the pressure of the suction opening 40 to the second pressure P ₂ close to atmospheric pressure, the pressure of the suction opening 40 is changed between the first pressure P ₁ and the second pressure P _2. Switch.

The adsorption pressure switching mechanism 90 that switches the adsorption pressure of the adsorption surface 22 of the stage 20 includes a three-way valve 91 having three ports, and a drive unit 92 that opens and closes the three-way valve 91, as in the opening pressure switching mechanism 80. The first port is connected to the suction hole 27 communicating with the suction groove 26 of the stage 20 by a pipe 93, the second port is connected to a vacuum device 140 and a pipe 94, and the third port is connected to a pipe 95 opened to the atmosphere. ing. The drive unit 92 communicates the first port and the second port to block the third port, and the suction groove 26 or the suction surface 22 is set to a third pressure P ₃ close to vacuum, or the first port and the second port are connected to each other. The pressure of the suction groove 26 or the suction surface 22 is changed by connecting the three ports to block the second port and setting the pressure of the suction groove 26 or the suction surface 22 to the fourth pressure P ₄ close to the atmospheric pressure. a third pressure P ₃ switching between a fourth pressure P _4.

  Similar to the opening pressure switching mechanism 80, the suction mechanism 100 that sucks air from the surface 18a of the collet 18 includes a three-way valve 101 having three ports, and a drive unit 102 that opens and closes the three-way valve 101. Air is sucked from the surface 18a through the suction hole 19 and the surface 18a of the collet 18 is evacuated. A flow rate sensor 106 for detecting the flow rate of air sucked from the surface 18 a of the collet 18 to the vacuum device 140 is attached to the pipe 103 connecting the suction hole 19 of the collet 18 and the three-way valve 101.

  The wafer holder horizontal direction driving unit 110, the stage vertical direction driving unit 120, and the collet driving unit 130, for example, drive the wafer holder 10, the stage 20, and the collet 18 in the horizontal direction or the vertical direction by a motor and gear provided therein. To do. Further, as shown in FIG. 1, there is a displacement in the contact / separation direction with respect to the suction surface 22 of the dicing sheet 12 in the vicinity of the end surface 22 e of the suction opening 40 with which the tip 23 a of the lid 23 abuts when the suction opening 40 is closed. A sheet displacement detection sensor 107 to be detected is attached. Irradiation light emitted from the light source of the sheet displacement detection sensor 107 does not affect the quality of the dicing sheet, the die attach film existing between the dicing sheet and the die, and the adhesive layer of the die attach film. Light having a high rate, for example, light having a short wavelength of 0 nm to 300 nm, in which the light transmittance of the dicing sheet is 0% to 30% is preferable, more preferably light having a wavelength of 100 nm to 300 nm is preferable, and most preferably having a light transmittance of 200 nm to 300 nm. What uses the reflection type optical fiber which uses LED or blue LED as a light source is good. Moreover, although the thing using a reflection type optical fiber was illustrated in this embodiment, as long as the light with a high reflectance with respect to a dicing sheet can be output, another type of sensor can be used.

  The control unit 150 includes a CPU 151 that performs arithmetic processing, a storage unit 152, and a device / sensor interface 153, and the CPU 151, the storage unit 152, and the device / sensor interface 153 are computers connected by a data bus 154. is there. In the storage unit 152, a control program 155, control data 156, an alignment program 157, a first peeling program 158, and a second peeling program 159 are stored.

  Opening pressure switching mechanism 80, adsorption pressure switching mechanism 90, driving units 82, 92, 102 of three-way valves 81, 91, 101 of suction mechanism 100, motor 381 of slider driving mechanism 300, wafer holder horizontal driving unit 110 The stage vertical direction drive unit 120, the collet drive unit 130, and the vacuum device 140 are connected to the device / sensor interface 153 and driven by commands from the control unit 150. The flow sensor 106 and the seat displacement detection sensor 107 are connected to the device / sensor interface 153, and the detection signal is captured by the control unit 150 and processed. In FIG. 1, the alternate long and short dash lines indicate the device / sensor interface 153 of the control unit 150, the opening pressure switching mechanism 80, the adsorption pressure switching mechanism 90, the driving units 82 of the three-way valves 81, 91, 101 of the suction mechanism 100, 92, 102 and a signal for connecting the motor 381 of the slider drive mechanism 300, the wafer holder horizontal direction drive unit 110, the stage vertical direction drive unit 120, the collet drive unit 130, the vacuum device 140, the flow rate sensor 106, and the sheet displacement detection sensor 107. A line is shown.

  Next, details of the stage 20 and the lid 23 will be described with reference to FIGS. 2 to 6. As shown in FIG. 2, the stage 20 has a cylindrical casing 21 having a suction surface 22 that sucks the dicing sheet 12 on the upper surface thereof, and a base body portion 24 provided on the opposite side of the suction surface 22 of the casing 21. And a drive unit 25 that is attached to the base unit 24 and drives a slider drive mechanism 300 attached to the inside of the housing 21. The base portion 24 of the stage 20 is attached to a stage fixing portion (not shown). The suction surface 22 includes a groove 22a that is recessed from the suction surface 22 toward the inside of the stage 20, and a convex portion 22b that is provided on the outer peripheral side of the stage 20 of the groove 22a and protrudes from the bottom surface of the groove 22a. . The side surface 22f of the groove 22a is the same surface as the guide surfaces 22g on both sides of the convex portion 22b, and extends linearly from the inner peripheral side to the outer peripheral side of the stage. The convex portion 22b is a step having a flat surface between the guide surfaces 22g, and the height thereof is smaller than the depth of the groove 22a. The bottom surface of the groove 22a and the surface of the convex portion 22b are connected by an inclined surface 22c extending from the bottom surface of the groove 22a toward the surface of the convex portion 22b. Two holes 41 communicating with the inside of the stage 20 are provided on the bottom surface of the groove 22a, and ribs 22d are provided on the center of the hole 41 and on the stage outer surface side of the hole 41.

  A lid 23 is attached to the groove 22a and slides along the direction from the groove 22a to the convex portion 22b with a width substantially equal to the width between the groove 22a and the guide surface 22g. In the lid 23, the side facing the end surface 22 e of the groove 22 a along the sliding direction is the front end 23 a, and the end on the side where the lid 23 opens is the rear end 23 c. The lid 23 has a flat plate shape, and includes a flat portion 23h on which the semiconductor die 15 is placed via the dicing sheet 12, and an inclined surface 23g inclined downward from the suction surface following the flat portion 23h. Since the length of the lid 23 in the sliding direction is shorter than the length of the groove 22a in the sliding direction, and the thickness of the flat portion 23h of the lid 23 is the same as the depth of the groove 22a, the tip 23a of the lid 23 is the end face of the groove 22a. When the lid 23 is fitted in the groove 22a so as to contact with 22e, the flat portion 23h on the surface of the lid 23 is flush with the suction surface 22. The side surface 23b of the lid 23 and the side surface 22f of the groove 22a constitute a slide surface. Further, at both corners of the groove 22a on the side where the tip 23a of the lid 23 is in contact, it protrudes from the side surface 22f of the groove 22a in the width direction of the groove 22a, and extends vertically from the suction surface 22 toward the inner surface of the stage 20. A vertical groove 364 for sucking the dicing sheet 12 is provided.

  Since it is configured as described above, the suction surface 22 is formed with a U-shaped suction opening 40 surrounded by the side surface 22f, the end surface 22e, and the guide surface 22g of the groove 22a. The suction opening 40 communicates with the inside of the housing 21. As shown in FIG. 2, three substantially U-shaped suction grooves 26 are provided so as to surround the U-shaped suction opening 40 in triplicate. Two to three suction holes 27 are formed in each side of the suction groove 26. The suction hole 27 is connected to the suction pressure switching mechanism 90 by a pipe 93 as shown in FIG.

  As shown in FIGS. 3 and 4, when the tip 23 a of the lid 23 is pressed against the end surface 22 e of the groove 22 a on the inner peripheral side of the stage 20, the suction opening 40 is closed, and the inner peripheral side of the stage 20. When the lid 23 slides along the side surface 22f and the guide surface 22g of the groove 22a from the outer periphery to the outer peripheral side, and the tip 23a of the lid 23 moves away from the end surface 22e of the groove 22a, the suction opening 40 opens. Therefore, the end face 22e is an end face of the suction opening 40 with which the tip 23a of the lid 23 abuts when the suction opening 40 is closed.

  As shown in FIGS. 4 (a) and 4 (b), when the lid 23 is closed, the tip 23a of the lid 23 contacts the end surface 22e. Therefore, when the lid 23 is closed, the lid 23 and the groove 22a A vertical groove 364 having a fan-shaped cylindrical surface of approximately 180 degrees communicates the suction surface 22 and the inside of the housing 21 at both corners.

  As shown in FIG. 5, the front end 23 a side of the lid 23 is flat, the flat portion 23 h on which the semiconductor die 15 is placed via the dicing sheet 12 has a substantially constant thickness, and the back surface on the rear end 23 c side of the lid 23. Is provided with a curved surface 23d that rounds the angle between the back surface and the surface on the rear end 23c side, and an inclined surface 23g that is inclined from the front surface side toward the back surface side as it goes from the flat portion 23h toward the rear end 23c. It has been. The inclined surface 23g is provided in a region where the semiconductor die 15 is not placed on top, and the length of the flat portion 23h is longer than the length of the semiconductor die 15. The back side of the lid 23 is a flat surface. Further, chamfers 23 e are provided on both side surfaces 23 b of the lid 23. On the back surface of the lid 23 on the side of the tip 23a, two arms 23f projecting in the direction of the tip 23a are provided. Each arm 23f is attached so as to penetrate each hole 41 provided in the stage 20 shown in FIG. The arm 23f has a U-shaped engagement groove. As shown in FIG. 1, the arm 23f is rotatably attached to the slider 332 by engaging the engagement groove with a pin 330 of the slider 332.

  As shown in FIG. 6, when the suction opening 40 is closed by the lid 23 so that the tip 23 a of the lid 23 is in contact with the end surface 22 e of the groove 22 a, the surface of the flat portion 23 h of the lid 23 is the same surface as the suction surface 22. It becomes. When the tip 23a of the lid 23 contacts the end surface 22e of the groove 22a and closes the suction opening 40, a small V-shaped groove is formed between the suction surface 22 and the lid 23. Further, the width of the groove 22a, that is, the width of the suction opening 40, the width of the lid 23, and the width of the semiconductor die 15 are substantially the same, and each side surface 22f of the groove 22a and each side surface 23b of the lid 23 are in contact with each other so as to slide. Yes.

  The operation of the semiconductor die pickup apparatus 500 configured as described above will be described with reference to FIGS. Here, before describing the pick-up operation of the semiconductor die 15, a process of setting the dicing sheet 12 on which the semiconductor die 15 is attached to the wafer holder 10 will be described.

  As shown in FIG. 7, an adhesive dicing sheet 12 is attached to the back surface of the wafer 11, and the dicing sheet 12 is attached to a metal ring 13. The wafer 11 is handled in such a state that it is attached to the metal ring 13 via the dicing sheet 12 in this way. Then, as shown in FIG. 8, the wafer 11 is cut by a dicing saw or the like from the surface side in the cutting process to become each semiconductor die 15. A notch gap 14 formed during dicing is formed between the semiconductor dies 15. The depth of the cut gap 14 extends from the semiconductor die 15 to a part of the dicing sheet 12, but the dicing sheet 12 is not cut, and each semiconductor die 15 is held by the dicing sheet 12.

  As described above, the semiconductor die 15 to which the dicing sheet 12 and the ring 13 are attached is attached to the wafer holder 10 as shown in FIG. The wafer holder 10 includes an annular expand ring 16 having a flange portion and a ring presser 17 for fixing the ring 13 on the flange of the expand ring 16. The ring retainer 17 is driven in a direction to advance and retract toward the flange of the expand ring 16 by a ring retainer drive unit (not shown). The inner diameter of the expand ring 16 is larger than the diameter of the wafer on which the semiconductor die 15 is disposed, the expand ring 16 has a predetermined thickness, and the flange is outside the expand ring 16 and is separated from the dicing sheet 12. It is attached so as to protrude outward on the end face side in the direction. The outer periphery of the expanding ring 16 on the dicing sheet 12 side has a curved surface configuration so that the dicing sheet 12 can be smoothly stretched when the dicing sheet 12 is attached to the expanding ring 16. As shown in FIG. 9B, the dicing sheet 12 to which the semiconductor die 15 is attached is in a substantially flat state before being set on the expanding ring 16.

  As shown in FIG. 1, when the dicing sheet 12 is set on the expanding ring 16, the dicing sheet 12 is stretched along the curved surface at the top of the expanding ring by a level difference between the upper surface of the expanding ring 16 and the flange surface. The dicing sheet 12 fixed to the surface is subjected to a pulling force from the center of the dicing sheet 12 to the periphery. Moreover, since the dicing sheet 12 is extended by this tensile force, the gap 14 between the semiconductor dies 15 attached on the dicing sheet 12 is widened.

  Next, the pickup operation of the semiconductor die 15 will be described. The control unit 150 first executes the alignment program 157 shown in FIG. As shown in FIGS. 10A and 10B, the control unit 150 starts alignment of the lid 23 and the semiconductor die 15 with the lid 23 closed. Since the lid 23 is in a position to close the suction opening 40, the tip 23a of the lid 23 is in contact with the end surface 22e of the groove 22a, and the lower surface on the rear end 23c side of the lid 23 is placed on the surface of the groove 22a. And supported by the groove 22a. Further, the flat portion 23h on the surface of the lid 23 and the suction surface 22 are substantially the same surface. The controller 150 moves the wafer holder 10 horizontally above the standby position of the stage 20 by the wafer holder horizontal direction drive unit 110 shown in FIG. Then, when the wafer holder 10 moves to a predetermined position above the standby position of the stage 20, the control unit 150 temporarily stops the movement of the wafer holder 10 in the horizontal direction, and the stage vertical driving unit 120 shown in FIG. The stage 20 is raised until the suction surface 22 of the stage 20 and the flat portion 23 h of the surface of the lid 23 are in close contact with the lower surface of the dicing sheet 12. When the suction surface 22 of the stage 20 and the flat portion 23 h on the surface of the lid 23 are in close contact with the lower surface of the dicing sheet 12, the control unit 150 stops raising the stage 20. Then, the controller 150 again aligns the one end 15a of the semiconductor die 15 to be picked up with the tip 23a of the lid 23 in the closed state by the wafer holder horizontal direction driving unit 110, and the position in the width direction of the lid 23 and the semiconductor die 15 are aligned. Are adjusted so that the side surface of the semiconductor die 15 matches the side surface 23 b of the lid 23. Since the width of the lid 23 is substantially the same as that of the semiconductor die 15 to be picked up, the position of each side surface of the semiconductor die 15 and each side surface 23b of the lid 23 when one side surface 23b is aligned with the side surface of the semiconductor die 15. Can be combined. At this time, the dicing sheet 12 receives a pulling force by the expanding ring 16 of the wafer holder 10.

  FIG. 10B is a plan view of the suction surface 22 of the stage 20 and the surface of the lid 23. The dicing sheet 12 and the semiconductor die 15 placed thereon are indicated by a one-dot chain line so that the positional relationship can be understood. In FIG. 10B, the lid 23 is shown slightly larger than the semiconductor die 15 in order to distinguish between the semiconductor die 15 and the lid 23 having substantially the same width. The same applies to FIGS. 12B and 22B. As shown in FIG. 10B, when the positions of the lid 23 and the semiconductor die 15 are aligned, the semiconductor die 15 is positioned on the flat portion 23 h of the lid 23.

  When the stage 20 has advanced to the lower surface of the dicing sheet 12, close contact, and alignment of the semiconductor die 15, the control unit 150 lowers the collet 18 onto the semiconductor die 15 by the collet driving unit 130 shown in FIG. 1. The surface 18 a of the collet 18 is landed on the semiconductor die 15. When the collet 18 lands on the semiconductor die 15, the control unit 150 switches the three-way valve 101 in a direction in which the suction hole 19 of the collet 18 and the vacuum device 140 are communicated by the driving unit 102 of the suction mechanism 100. As a result, the air in the suction hole 19 is sucked into the vacuum device 140 as indicated by an arrow 301 shown in FIG. 11, and the suction hole 19 is evacuated. At this time, the height of the surface 18 a of the collet 18 is an initial height obtained by adding the thickness of the dicing sheet 12 and the thickness of the semiconductor die 15 to the height of the suction surface 22. Further, in the state where the execution of the alignment program 157 is finished, the pressure of the suction opening 40, the suction groove 26 or the suction surface 22 is atmospheric pressure (end of the alignment program 157).

Next, the control unit 150 executes the first peeling program 158 shown in FIG. First, at time t ₀ shown in FIG. 23, the control unit 150 causes the slider drive mechanism 300 to advance the flat portion 23 h of the surface of the lid 23 from the suction surface 22 by a predetermined height H ₁ and moves the lid 23 to the stage 20. A command to finely open the suction opening 40 by sliding it slightly toward the outer peripheral side is output. As shown in FIG. 12A, when the motor 381 of the drive unit 25 of the slider drive mechanism 300 is rotated by a command from the control unit 150, the cam 383 attached to the shaft of the motor 381 is rotated. The cam 383 has an elliptical shape, and the cam surface is in contact with the roller 326c attached to the tip of the shaft 326b of the first link 326. When the cam 383 rotates in the direction of arrow a in FIG. 12, the cam surface of the cam 383 attracts the roller 326c. Push up toward the face 22. By this operation, the shaft 326b rises as indicated by the arrow b in FIG. 12A, and the entire first link 326 rises toward the suction surface 22. When the entire first link 326 is lifted, the piston 370 connected to the suction surface 22 by the spring 373 is pushed up by the first link 326, and the entire piston 370 is moved as shown by an arrow c in FIG. It rises toward the suction surface 22. When the entire piston 370 rises toward the suction surface 22, the guide rail 331 attached to the suction surface 22 side also rises toward the suction surface 22 together with the piston 370. When the guide rail 331 rises, the slider 332 attached so as to slide along the upper surface of the guide rail 331 also rises toward the suction surface 22. The tip 23a of the lid 23 that is rotatably engaged with the slider 332 via the arm 23f advances from the suction surface 22 upward as the slider 332 rises.

  As shown by the arrow 201 in FIG. 13, when the tip 23 a of the lid 23 advances upward from the suction surface 22, the tip 23 a of the lid 23 pushes up the dicing sheet 12 and one end 15 a of the semiconductor die 15. Then, since the tip 23 a receives a downward force from the dicing sheet 12, the lid 23 rotates clockwise about the pin 330. The lower surface on the rear end 23c side of the lid 23 is supported by the bottom surface of the groove 22a, and the flat portion 23h of the surface of the lid 23 that pushes up the dicing sheet 12 faces downward from the front end 23a side to the rear end 23c side. Tilt. The control unit 150 causes the collet driving unit 130 to raise the collet 18 in accordance with the upward movement from the suction surface 22 of the lid 23 as indicated by an arrow 302 shown in FIG. The semiconductor die 15 attached to the dicing sheet 12 is also inclined with respect to the suction surface 22 because the inclination is in accordance with the inclination of the flat portion 23 h on the surface of 23. For this reason, the one end 15a side of the semiconductor die 15 rises while being adsorbed by the collet 18, but the other end 15b side of the semiconductor die 15 is stuck to the dicing sheet 12 and is separated from the surface 18a of the collet 18. Yes. In this state, the semiconductor die 15 is slightly bent and deformed between the one end 15a side and the other end 15b side. Further, since the other end 15b side of the semiconductor die 15 is away from the surface 18a of the collet 18, air is sucked from the gap between the other end 15b of the semiconductor die 15 and the surface 18a as shown by an arrow 303 in FIG. 19 flows into.

  As shown in FIG. 12A, when the cam 383 of the slider drive mechanism 300 is further rotated by a command from the control unit 150 and the first link 326 is pushed up toward the suction surface 22, it moves toward the suction surface 22. The spring 373 between the impossible piston 370 and the first link 326 starts to be compressed by the motor 381 and the cam 383 in the direction of moving back and forth with respect to the suction surface 22. When the spring 373 is compressed, the piston 370 does not advance with respect to the suction surface 22, and only the first link 326 advances with respect to the suction surface 22. For this reason, the pin 328 of the piston 370 does not rise with respect to the suction surface 22, and only the pin 327 of the second link 329 entering the engagement groove 326 a of the first link 326 rises in the direction of the suction surface 22. Then, the second link 329 starts to rotate around the pin 328. By this rotation operation, the engaging groove 329a at the other end of the second link 329 moves toward the outer periphery of the stage 20, and the slider 332 and the pin of the slider 332 to which the pin 330a in the engaging groove 329a is fixed. The lid 23 that is rotatably engaged with the 330 via the arm 23 f starts to slide toward the outer peripheral side of the stage 20.

As shown in FIG. 14, when the lid 23 starts to slide toward the outer peripheral side of the stage 20, a curved surface 23d provided at the rear end 23c of the back surface of the lid 23 connects the convex portion 22b and the bottom surface of the groove 22a. It contacts the inclined surface 22c. When the lid 23 is further slid, the curved surface 23d of the lid 23 rises along the inclined surface 22c as indicated by an arrow 203 in FIG. As a result, the surface on the rear end 23 c side of the flat portion 23 h of the lid 23 starts to advance from the suction surface 22. When the lid 23 further slides, the curved surface 23d of the lid 23 exceeds the inclined surface 22c, and the back surface of the lid 23 contacts the surface of the convex portion 22b. Protruding height from the bottom surface of the groove 22a of the protrusion 22b from the substantially equal and advancing the height H ₁ from the suction surface 22 of the lid 23 surface, the rear surface of the cover 23 is in contact with the surfaces of the projections 22b, The flat portion 23 h on the surface of the lid 23 is substantially parallel to the suction surface 22. Since the lower surface of the lid 23 is supported by the surface of the convex portion 22b shown in FIG. 14, the lower surface of the lid 23 is separated from the bottom surface of the groove 22a. After this, the lid 23 slides in a state where the flat portion 23 h on the surface of the lid 23 is substantially parallel to the suction surface 22.

When the flat portion 23h on the surface of the lid 23 is substantially parallel to the suction surface 22, the surface of the flat portion 23h is also substantially parallel to the surface 18a of the collet 18, so that when the flat portion 23h of the lid 23 is inclined, the collet The other end 15 b side of the semiconductor die 15, which is away from the portion 18, is adsorbed again on the surface 18 a of the collet 18. As shown in FIG. 14, when the entire flat portion 23 h on which the semiconductor die 15 is placed advances by a height H ₁ from the suction surface 22 so that the lid 23 is substantially parallel to the suction surface 22, the tip 23 a of the lid 23 It is empty gap width D ₁ between the end surface 22e. The gap is very small opening 42, the width D ₁ is the opening width D ₁ of the minute opening 42. Further, as shown in FIG. 14, the height of the surface 18 a of the collet 18 is a height Hc obtained by adding the thickness of the dicing sheet 12 and the thickness of the semiconductor die 15 to the advance height H ₁ of the flat portion 23 h of the lid 23. It has become.

Next, the control unit 150 outputs a command to set the adsorption pressure to a third pressure P ₃ close to vacuum at time t ₁ in FIG. With this command, the drive unit 92 of the adsorption pressure switching mechanism 90 shown in FIG. 1 switches the three-way valve 91 in a direction in which the adsorption hole 27 and the vacuum device 140 are communicated. Then, as shown by the arrow 202 in FIG. 14, the air suction grooves 26 are sucked into the vacuum device 140 through the suction holes 27, the suction pressure at time t ₂ as shown in FIG. 23 (d) is close to the vacuum 3 the pressure P _3. And the back surface 12b of the dicing sheet 12 at the periphery of the suction opening 40 is vacuum-sucked to the suction surface 22 as shown in FIG. Since the entire flat portion 23h of the cover 23 is advanced from the height H ₁ by the suction surface 22, the dicing sheet 12 is vacuum adsorbed to the adsorption face 22, as shown in FIG. 14, the dicing sheet 12 A tensile force F _{1 that} is inclined downward is applied. This pulling force F ₁ can be broken down into a pulling force F ₂ that pulls the dicing sheet 12 laterally and a pulling force F ₃ that pulls the dicing sheet 12 downward. The lateral tensile force F ₂ generates a shear stress τ between the semiconductor die 15 and the surface 12 a of the dicing sheet 12. Due to the shear stress τ, a deviation occurs between the region near the one end 15 a of the semiconductor die 15 and the surface 12 a of the dicing sheet 12. This misalignment triggers separation between the dicing sheet 12 and the region near the one end 15 a of the semiconductor die 15. Control unit 150, as shown in FIG. 23 (c), after which a third pressure P ₃ close the suction pressure to the vacuum time t _2, the holding suction pressure to the third pressure P ₃ near vacuum.

Controller 150, FIG. 23 (d), the time t first close the pressure of the suction opening 40 from ₂ to time t ₃ after a predetermined time has elapsed from the second pressure P ₂ close to the atmospheric pressure to a vacuum A command to switch to pressure P ₁ is output. In response to this command, the driving unit 82 of the opening pressure switching mechanism 80 switches the three-way valve 81 in a direction in which the suction opening 40 or the inside of the housing 21 and the vacuum device 140 are communicated. Then, as shown by the arrow 204 in FIG. 15, the suction opening 40, the air of the minute opening 42 is sucked into the vacuum apparatus 140, as shown in FIG. 23 (d), at time t ₄ of the suction opening 40 The pressure becomes the first pressure P ₁ close to vacuum. As a result, as indicated by an arrow 205 in FIG. 15, the dicing sheet 12 immediately above the minute opening 42 is pulled downward. As shown by the dotted line in FIG. 23 (d), the driving unit 82 of the opening pressure switching mechanism 80 is configured such that the second pressure P ₂ close to atmospheric pressure and the first pressure P close to vacuum during the period between times t3 and t6. It is also possible to output a command for switching the pressure of the suction opening several times with ₁ . Thereby, peeling of the surface 12a of the dicing sheet 12 and the semiconductor die 15 can be further ensured. In addition, the region near the one end 15 a of the semiconductor die 15 located immediately above the minute opening 42 is pulled by the dicing sheet 12 and is bent and deformed downward as indicated by an arrow 206. As a result, the region near the one end 15 a of the semiconductor die 15 is separated from the surface 18 a of the collet 18. When the adsorption pressure becomes the third pressure P ₃ close to vacuum at time t ₂ , the displacement of the semiconductor die 15 occurs between the region near the one end 15 a of the semiconductor die 15 and the surface 12 a of the dicing sheet 12. Since a trigger for peeling from the surface 12a of the dicing sheet 12 is formed in a region near the one end 15a, the region near the one end 15a of the semiconductor die 15 is diced while being bent and deformed as shown by an arrow 206 in FIG. Peeling has started from the surface 12 a of the sheet 12.

As shown in FIG. 15, when the region near the one end 15 a of the semiconductor die 15 is separated from the surface 18 a of the collet 18, as shown by an arrow 207 in FIG. 15, the suction hole 19 of the collet 18 is in a vacuum. Air comes in. The flow rate of air that flows in (the amount of air leak) is detected by the flow rate sensor 106. As shown in FIG. 23 (d), as the pressure in the suction opening 40 toward the time t ₃ to time t ₄ is lowered from the second pressure P ₂ closer to the atmospheric pressure in the first pressure P ₁ near vacuum Since the region near the one end 15a of the semiconductor die 15 is pulled downward together with the dicing sheet 12 to bend and deform, the air flowing into the suction hole 19 of the collet 18 as shown in FIG. The amount of leak increases from time t ₃ to time t ₄ .

Control unit 150, as shown in FIG. 23 (d), while maintaining the suction pressure to the third pressure P ₃ near vacuum, between time t ₄ of time t _5, the suction opening 40 or the micro stage 20 The opening 42 is maintained at a first pressure P ₁ close to vacuum. During this time, as indicated by an arrow 208 in FIG. 16, the region near the one end 15 a of the semiconductor die 15 returns to the surface 18 a of the collet 18 due to the vacuum of the suction hole 19 of the collet 18 and the elasticity of the semiconductor die 15. As the region near the end 15a of the semiconductor die 15 toward the surface 18a of the collet 18, as shown at time t ₅ from time t ₄ in FIG. 23 (e), the air leakage which come to flow into the suction hole 19 of the collet 18 the amount is reduced, the time t _5, as shown in FIG. 16, when the semiconductor die 15 is vacuum adsorbed to the surface 18a of the collet 18, the air leakage amount is zero. At this time, the region near the one end 15a of the semiconductor die 15 is peeled off from the surface 12a of the dicing sheet 12 located immediately above the minute opening 42 (initial peeling). When the region near the one end 15a of the semiconductor die 15 is initially peeled from the surface 12a of the dicing sheet 12, as shown in FIGS. 15 and 16, the dicing sheet 12 positioned immediately above the minute opening 42 is directed downward. It is displaced to. The control unit 150 detects the downward displacement of the dicing sheet 12 (displacement in the contact / separation direction with respect to the suction surface 22) by the sheet displacement detection sensor 107, and if the detected displacement exceeds a predetermined threshold value, the semiconductor It is determined that the region near the one end 15a of the die 15 is initially peeled from the surface 12a of the dicing sheet 12 located immediately above the minute opening 42. When the detected displacement is equal to or smaller than the predetermined threshold value, it is determined that the region near the one end 15a of the semiconductor die 15 is not initially peeled from the surface 12a of the dicing sheet 12 positioned immediately above the minute opening 42. (First peeling determination step). When the controller 150 determines that the region near the one end 15a of the semiconductor die 15 is initially peeled, the control unit 150 proceeds to the next peeling step. In addition, when the control unit 150 determines that the region near the one end 15a of the semiconductor die 15 is not initially peeled, the control unit 150 performs the first retry process.

In the first retry process, the control unit 150 switches the three-way valves 81 and 91 of the opening pressure switching mechanism 80 and the adsorption pressure switching mechanism 90 so that the atmosphere communicates with the suction opening 40 or the minute opening 42 and the adsorption groove 26. Then, after the pressure and suction pressure of the suction opening 40 are set to the second pressure P ₂ and the fourth pressure P ₄ that are close to the atmospheric pressure, the three-way valves 81 and 91 of the opening pressure switching mechanism 80 and the suction pressure switching mechanism 90 again. Are switched so that the vacuum device 140 and the suction opening 40 or the minute opening 42 and the suction groove 26 communicate with each other, and the pressure of the suction opening 40 and the suction pressure are respectively close to the atmospheric pressure, the second pressure P ₂ and the fourth pressure P _4. Is switched to the first pressure P ₁ and the third pressure P ₃ which are close to vacuum, and it is determined whether or not the displacement detected by the sheet displacement detection sensor 107 exceeds a predetermined threshold. If the detected displacement exceeds the predetermined displacement, the first retry process is terminated and the process proceeds to the next peeling process (end of the first peeling program).

Next, the control unit 150 executes the second peeling program 159 shown in FIG. Control unit 150, as shown in FIG. 23 (c), FIG. 23 (d), while maintaining the suction pressure to the third pressure P ₃ closer to the vacuum, the first pressure close to the pressure of the suction opening 40 to the vacuum After holding at P ₁ for a predetermined time, at time t ₅ , a command for switching the pressure of the suction opening 40 from the first pressure P ₁ close to vacuum to the second pressure P ₂ close to atmospheric pressure is output. By this command, the drive unit 82 of the opening pressure switching mechanism 80 switches the three-way valve 81 so that the piping 85 and the suction opening 40 open to the atmosphere communicate with each other. Thus, as shown by an arrow 210 shown in FIG. 17, the air comes to flow into the suction opening 40, as shown in FIG. 23 (d), toward the time t ₅ to time t _6, the suction opening 40 The pressure increases from the first pressure P ₁ close to vacuum to the second pressure P ₂ close to atmospheric pressure. When the pressure of the suction opening 40 rises to the second pressure P ₂ close to the atmospheric pressure, the dicing sheet 12 positioned immediately above the minute opening 42 that has been pulled downward by vacuum is shown by an arrow 209 in FIG. Return upward.

As shown in FIG. 23D, when the pressure of the suction opening 40 becomes the second pressure P ₂ close to the atmospheric pressure at time t ₆ as shown in FIG. Is output to increase the opening width of the suction opening 40 from the opening width D ₁ of the minute opening 42 to the opening width D ₂ . By this command, the motor 381 of the slider drive mechanism 300 shown in FIG. 1 rotates in the direction of the arrow a shown in FIG. 1, and the ascending operation of the first link 326 shown by the arrow b in FIG. 1 and the arrow d in FIG. As the second link 329 rotates, the slider 332 slides to the right along the suction surface 22, and the lid 23 has a flat portion 23 h on the surface of the lid 23 substantially the same as the suction surface 22 as indicated by an arrow 211 in FIG. 17. Slide in a parallel state. Then, when the opening width becomes D _2, the control unit 150 stops the motor 381 to stop the sliding of the lid 23. As shown in FIG. 17, the suction opening 40 is opened by this operation, and an opening opening 43 having an opening width D ₂ is formed between the tip 23 a and the end surface 22 e of the lid 23.

As shown in FIG. 23D, the control unit 150 outputs a command to switch the pressure of the suction opening 40 from the second pressure P ₂ close to atmospheric pressure to the first pressure P ₁ close to vacuum at time t ₇ . By this command, the drive unit 82 of the opening pressure switching mechanism 80 switches the three-way valve 81 so that the suction opening 40 and the vacuum device 140 communicate with each other. Thus, as shown by arrow 212 in FIG. 18, the air in the suction opening 40 or the opening open portion 43 is attracted to the vacuum device 140, the time t _8, as shown in FIG. 23 (d), the suction opening 40 or the pressure of the opening 43 becomes the first pressure P ₁ close to vacuum. When the pressure of the suction opening 40 or the opening opening 43 is reduced from the second pressure close to the atmospheric pressure to the first pressure P ₁ close to vacuum, the dicing sheet 12 positioned immediately above the opening opening 43 becomes an arrow 213 in FIG. As shown in FIG. As a result, as shown by an arrow 214 in FIG. 18, a region near one end 15a of the semiconductor die 15 is bent and deformed downward, away from the surface 18a of the collet 18, and air is colleted as shown by an arrow 215 in FIG. It flows into the 18 suction holes 19. The amount of air leak flowing into the suction hole 19 is detected by the flow sensor 106 shown in FIG. As shown in FIG. 23 (e), the air leak amount increases from time t ₇ to time t _{8 when} the pressure of the suction opening 40 or the opening part 43 decreases.

At time t ₈ , the controller 150 issues a command to increase the pressure of the suction opening 40 from the first pressure P ₁ close to vacuum to the second pressure P ₂ close to atmospheric pressure, as shown in FIG. Output. In response to this command, the drive unit 82 of the opening pressure switching mechanism 80 switches the three-way valve 81 so that the suction opening 40 and the piping 85 opened to the atmosphere are communicated. Accordingly, as shown by an arrow 216 in FIG. 19, air flows into the suction opening 40 or the opening opening 43, and as shown in FIG. 23 (d), the pressure of the suction opening 40 or the pressure of the opening opening 43 is The pressure rises to a second pressure P ₂ close to atmospheric pressure. As a result, as indicated by an arrow 217 in FIG. 19, the dicing sheet 12 immediately above the opening 43 is displaced upward. In addition, the region located immediately above the opening 43 and the vicinity of the one end 15a of the semiconductor die 15 is moved upward on the surface 18a of the collet 18 as indicated by an arrow 218 shown in FIG. Come back. When the semiconductor die 15 approaches the surface 18a of the collet 18 begins to decrease air leakage quantity flowing into the suction hole 19 of the collet 18 as between times t ₉ from the time t ₈ in FIG. 23 (e), air leakage amount at time t ₉ in FIG. 23 (e) is zero. At this time, a region near the one end 15 a of the semiconductor die 15 is vacuum-sucked on the surface 18 a of the collet 18, and a region near the one end 15 a of the semiconductor die 15 located immediately above the opening 43 is peeled off from the surface 12 a of the dicing sheet 12. (End of the first second peeling step).

Control unit 150 at time t ₉ executes the second time in the second separation step. As shown in FIG. 23B, a command for sliding the lid 23 to increase the opening width of the suction opening 40 from the opening width D ₂ to the opening width D ₃ is output. By this command, the slider driving mechanism 300 shown in FIG. 1 is driven, and the lid 23 slides in a state where the flat portion 23h on the surface of the lid 23 is substantially parallel to the suction surface 22 as shown by an arrow 219 in FIG. To do. When the opening width reaches D ₃ , the controller 150 stops the motor 381 and stops the sliding of the lid 23. As shown in FIG. 17, the suction opening 40 is further opened by this operation, and an opening opening 44 having an opening width D ₃ is formed between the tip 23a and the end surface 22e of the lid 23.

The control unit 150 outputs an instruction for switching the pressure of the suction opening 40 from the second pressure P ₂ closer to the atmospheric pressure at time t ₁₀ to the first pressure P ₁ near vacuum as shown in FIG. 23 (d) . With this command, the drive unit 82 of the opening pressure switching mechanism 80 switches the three-way valve 81 so that the suction opening 40 and the vacuum device 140 are in communication. Thus, as shown in broken line arrow 220 in FIG. 17, the air suction opening 40 or the opening open portion 44 is attracted to the vacuum device 140, the pressure or the pressure of the opening opening portion 44 of the suction opening 40, the time t ₁₁ The first pressure P ₁ is close to vacuum. Then, the dicing sheet 12 is drawn into the opening portion 44 as indicated by a broken line arrow 221 shown in FIG. At this time, the semiconductor die 15 is easily peeled off from the dicing sheet 12 because about half of the entire area is peeled off from the dicing sheet 12. For this reason, even if the dicing sheet 12 moves downward, the dicing sheet 12 is not displaced downward together with the dicing sheet 12 but remains vacuum-adsorbed to the collet 18, and one of the semiconductor dies 15 positioned immediately above the opening opening 44. The part is peeled off from the surface 12 a of the dicing sheet 12. Therefore, air does not flow into the suction hole 19 of the collet 18, FIG. 20 (e), between time t ₁₀ of t ₁₁ is the air leakage amount is zero.

At time t ₁₁ , the controller 150 issues a command to increase the pressure of the suction opening 40 from the first pressure P ₁ close to vacuum to the second pressure P ₂ close to atmospheric pressure, as shown in FIG. Output. In response to this command, the drive unit 82 of the opening pressure switching mechanism 80 switches the three-way valve 81 so that the suction opening 40 and the piping 85 opened to the atmosphere are communicated. As a result, as shown by an arrow 222 in FIG. 20, air flows into the suction opening 40 or the opening 44, and the pressure of the suction opening 40 or the pressure of the opening 44 as shown in FIG. The pressure rises to a second pressure P ₂ close to atmospheric pressure. As a result, as indicated by an arrow 223 in FIG. 20, the dicing sheet 12 immediately above the opening portion 44 is displaced upward. Then, when the pressure at the suction opening 40 or the pressure at the opening 44 becomes the second pressure P ₂ close to the atmospheric pressure at time t ₁₂ , the second second peeling step is finished.

Hereinafter, similarly, the control unit 150 executes the third time in the second peeling process at the time t ₁₂ shown in FIG. 23, the opening width D of the suction opening 40 by sliding the lid 23 as indicated by an arrow 224 in FIG. 21 ₄ after an opening opening portion 45 of the (width of the tip 23a and the end face 22e of the cover 23), close to the atmospheric pressure of the opening opening portion 45 as indicated by the arrow 225 in FIG. 21 at time t ₁₃ shown in FIG. 23 By switching from the second pressure P ₂ to the first pressure P ₁ close to vacuum, a part of the semiconductor die 15 located immediately above the opening 45 is peeled off from the surface 12a of the dicing sheet 12 as indicated by an arrow 226 in FIG. 23, the pressure of the opening opening 45 is switched from the first pressure P ₁ close to vacuum to the second pressure P ₂ close to atmospheric pressure at t ₁₄ shown in FIG. 23, and the pressure of the suction opening 40 or opening opening at time t _15. When the pressure of 45 reaches the second pressure P ₂ close to atmospheric pressure, The second exfoliation process is completed. Similarly the control unit 150 performs a fourth-time second peeling process between times t ₁₈ from the time t ₁₅ shown in FIG. 23, located directly above the opening opening portion open the lid 23 to the opening width D ₅ A part of the semiconductor die 15 is peeled off from the surface 12 a of the dicing sheet 12.

When the lid 23 is slid to the opening width D ₅ , the semiconductor die 15 is almost peeled off from the dicing sheet 12, so the controller 150 removes the lid 23 at time t _{18 as} shown in FIG. By sliding, the opening width is widened from D ₅ to D ₇ , and as shown in FIG. 22, the collet 18 is raised to pick up the semiconductor die 15. After picking up the semiconductor die 15, the control unit 150, the lid 23 returns to the initial position at time t _20, the pressure of the suction opening 40, and ends the pickup operation is returned to the adsorption pressure to atmospheric pressure.

Pickup device 500 of the semiconductor die of the embodiment described above, the semiconductor die 15 when picking up, each time switching the pressure of the suction opening 40 from the first pressure P ₁ closer to the vacuum in the second pressure P ₂ closer to the atmospheric pressure In addition, the second peeling process in which the lid 23 is slid to open the suction opening 40 stepwise is repeated, and the dicing sheet 12 is peeled stepwise from the semiconductor die 15, thereby suppressing damage to the semiconductor die during pick-up. There is an effect that can be done.

The controller 150 determines whether or not the region of the semiconductor die 15 located immediately above the opening opening 43 is peeled from the surface 12a of the dicing sheet 12 in the second peeling step described above. When the determination step is executed and it is determined in the second peeling determination step that the region of the semiconductor die 15 located immediately above the opening 43 is not peeled from the surface 12a of the dicing sheet 12, the second step Perform a retry process. Hereinafter, the second peeling determination step and the second retry step will be described. Note that FIG. 25 showing the pickup operation referred to in the following description is different from FIG. 23 only in the period from time t ₈ to time t ₁₁ showing the operation of the second retry process, and from time t ₀ to time t _8. the operation until the same as in FIG. 23, the operation of the time t ₂₃ from the time t _11, is similar to the operation of the t ₂₀ from the time t ₈ in FIG. 23.

As described earlier with reference to FIG. 18, as shown in FIG. 23 (e), the first pressure pressure of the suction opening 40 at time t ₇ is closer to the vacuum from the second pressure P ₂ closer to the atmospheric pressure When it starts to decrease toward P ₁ , the semiconductor die 15 is bent and deformed to leave the surface 18 a of the collet 18, and air flows into the suction hole 19. Therefore, the air leak detected by the flow sensor 106 shown in FIG. The amount will increase. Then, as shown in FIG. 23 (d), when the pressure in the suction opening 40 at time t ₈ from the first pressure P ₁ near vacuum begins to rise to a second pressure P ₂ close to atmospheric pressure, shown in FIG. 1 air leakage amount detected by the flow rate sensor 106 starts lowering, as shown in FIG. 19, the semiconductor die 15 to the time t ₉ is adsorbed on the surface 18a of the collet 18, the air leakage amount becomes zero, the opening opening portion The semiconductor die 15 in the region located immediately above 43 is peeled off from the surface 12 a of the dicing sheet 12. On the other hand, when the semiconductor die 15 is not peeled off from the surface 12a of the dicing sheet 12, the pressure of the suction opening 40 is changed from the first pressure P ₁ close to vacuum to the second atmospheric pressure as shown in FIG. Even if the pressure is increased to P ₂ , the semiconductor die 15 remains attached to the dicing sheet 12 and is not vacuum-adsorbed on the surface of the collet 18, so that the air leak amount does not become zero even at time t ₉ .

  As described above, when the semiconductor die 15 is peeled off from the dicing sheet 12, the air leak amount increases from zero and then decreases to zero as shown in FIG. When the sheet 12 is not peeled off well, as shown in FIG. 24C, the air leak amount does not decrease to zero while maintaining a certain flow rate after increasing from zero. Since the air leakage amount is an analog amount, in order to accurately detect the separation, in the second separation determination step, the air leakage amount signal shown in FIGS. 24 (a) and 24 (c) is differentiated to obtain FIG. b) An air leak amount differential value as shown in FIG. 24 (d) is calculated.

As shown in FIG. 24B, when the semiconductor die 15 is peeled off successfully, the air leak amount rises from zero and then falls to zero. Therefore, the differential value of the air leak amount is once a positive value. After becoming, it becomes a negative value. On the other hand, as shown in FIG. 24D, if the semiconductor die 15 is not peeled off well, the air leak amount rises from zero and becomes the same value, so the differential value of the air leak amount is once After becoming a positive value, it becomes near zero. Therefore, when the threshold range of the differential value of the air leak amount is set between + S and -S as shown in FIGS. 24B and 24D, the semiconductor as shown in FIG. When the die 15 is peeled off successfully, the differential value of the air leak amount exceeds the threshold range twice (two times in total, once in the plus direction and once in the minus direction). On the other hand, when the semiconductor die 15 is not peeled off well, as shown in FIG. 24D, the differential value of the air leak amount exceeds the threshold value only once on the plus side. Therefore, in the second peeling determination step, if the number of times that the differential value of the air leak amount between time t ₇ and time t ₉ in FIG. Assume that the die 15 is peeled off and proceed to the next peeling step. If the number of times the differential value of the air leak amount exceeds a predetermined threshold range is 1 (odd number), the semiconductor die 15 is peeled off. If not, the process proceeds to a second retry process described below.

In the second retry process, the control unit 150, as shown in FIG. 25 (b), large without sliding the lid 23, as shown in FIG. 25 (d), at time t ₁₀ the pressure of the suction opening 40 The pressure is lowered from the second pressure P ₂ close to atmospheric pressure to the first pressure P ₁ close to vacuum. Then, FIG. 25 (d), the pressure of the suction opening 40 to the time t ₁₁ is increased from the first pressure P ₁ closer to the vacuum in the second pressure P ₂ close to atmospheric pressure (second retry process). The second retry process, the air leakage amount during the time t ₁₂ from the time t ₁₁ in FIG. 25 (e) is zero decreases, the differential value of the air leakage amount is once a predetermined threshold range when the Exceeds (exceeds negative threshold range). As a result, the number of times that the differential value of the air leak amount between time t ₇ and time t ₁₂ shown in FIG. It is determined that the semiconductor die 15 in the region located immediately above the opening 43 has been peeled off from the surface 12a of the dicing sheet 12, and the second retry process is terminated and the number of times is set to 0 before the next second peeling process. (Keep the counter clear).

Further, when the differential value of the air leak amount reaches −S ₁ in the region where the differential value of the air leak amount in FIG. 24B is negative (time t in FIG. 24A and FIG. 24B). _{In 1} ), as shown in FIG. 24 (a), the actual collet air leak amount deviates from the maximum leak amount and starts to decrease. Therefore, after time t ₁ in FIGS. 24A and 24B, it can be predicted that the semiconductor die 15 will be erect (the semiconductor die 15 will be directed to the surface 18a of the collet 18). S ₁ can also be said to be a turning point where the peeling is toward convergence. Therefore, when the differential value of the air leak amount reaches the threshold value −S ₁ , the next peeling process may be started, and the peeling time can be shortened and the damage to the semiconductor die 15 can be reduced.

  In addition, when performing the second peeling step a plurality of times, the control unit 150 counts the number of times that the differential value of the air leak amount exceeds a predetermined threshold range, and when the count number becomes an even number, The process may proceed to the second peeling process, and may proceed to the second retry process when the count number becomes an odd number. For example, when a predetermined portion of the semiconductor die 15 can be peeled off in the first second peeling step, the differential value count is 2 (even), and the process proceeds to the second second peeling step. If the predetermined portion of the semiconductor die 15 is not peeled off in the second second peeling step, and the number of times the differential value of the air leak amount exceeds the predetermined threshold range is 1, the accumulated count is 3 ( Therefore, the process proceeds to the second retry process without proceeding to the second peeling process for the third time. When the predetermined portion of the semiconductor die 15 can be peeled off in the second retry process, the number of times that the differential value of the air leak amount exceeds the predetermined threshold range is counted once, so the integrated count number is 4 ( Therefore, the process proceeds to the second peeling step for the third time. In this way, by determining whether or not to proceed to the next second peeling step depending on whether the integrated count becomes an even number or an odd number, in what number of second peeling steps the semiconductor die has not been peeled off. Can be determined only by the number of counts.

  As described above, the semiconductor die pick-up device 500 of the present embodiment proceeds to the next peeling step after confirming whether or not the semiconductor die 15 has been peeled off from the dicing sheet 12, so that the semiconductor die 15 is subjected to the peeling operation during the peeling operation. Damage to the die 15 can be suppressed.

  10 wafer holder, 11 wafer, 12 dicing sheet, 12a surface, 12b back surface, 13 ring, 14 gap, 15 semiconductor die, 15a one end, 15b other end, 16 expanding ring, 18 collet, 18a surface, 19 suction hole, 20 stage , 21 Housing, 22 Suction surface, 22a Groove, 22b Convex, 22c Inclined surface, 22d Rib, 22e End surface, 22f Side surface, 22g Guide surface, 23 Lid, 23a Front end, 23b Side surface, 23c Rear end, 23d Curved surface, 23e Chamfer, 23f arm, 23g inclined surface, 23h flat part, 24 base part, 25 drive part, 26 suction groove, 27 suction hole, 40 suction opening, 41 hole, 42 minute opening, 43-45 opening opening part, 80 opening pressure Switching mechanism, 81, 91, 101 Three-way valve, 82, 92, 1 2 Driving unit, 83-85, 93-95, 103-105 Piping, 90 Adsorption pressure switching mechanism, 100 Suction mechanism, 106 Flow rate sensor, 107 Sheet displacement detection sensor, 110 Wafer holder horizontal direction driving unit, 120 Stage vertical driving , 130 collet drive unit, 140 vacuum device, 150 control unit, 151 CPU, 152 storage unit, 153 device / sensor interface, 154 data bus, 155 control program, 156 control data, 157 alignment program, 158 first peeling program 159 Second peeling program, 300 slider drive mechanism, 321a stopper, 326 first link, 326a, 329a engagement groove, 326b shaft, 326c roller, 327, 328, 330, 330a pin, 329 second Click, 331 guide rail, 332 slider, 364 flutes, 370 piston, 371 flanges, 381 motor, 383 cam, 500 pickup device.

Claims (16)

A semiconductor die pick-up device for picking up a semiconductor die attached to the surface of a dicing sheet,
A stage including an adsorption surface for adsorbing the back surface of the dicing sheet;
A suction opening provided in the suction surface of the stage;
A lid that slides along the suction surface to open and close the suction opening;
An opening pressure switching mechanism for switching the pressure of the suction opening between a first pressure close to vacuum and a second pressure close to atmospheric pressure,
Each time the semiconductor die is picked up, the pressure of the suction opening is changed from the second pressure to the first pressure, and then the pressure of the suction opening is changed from the first pressure to the second pressure. Slide in the opening direction by a predetermined distance,
A semiconductor die pick-up device. A semiconductor die pick-up device according to claim 1,
When picking up the semiconductor die, the suction pressure of the suction surface was kept in a vacuum, the pressure before Symbol suction opening for each switching from the first pressure to the second pressure, open the lid by a predetermined distance Sliding in the direction,
A semiconductor die pick-up device. A pickup device for a semiconductor die according to claim 1 or 2,
The lid is provided on the stage so that its surface can be advanced from the suction surface,
When picking up the semiconductor die, the lid is slightly slid to slightly open the suction opening, and after the surface of the lid is advanced to a predetermined height higher than the suction surface, the suction pressure of the vacuum, by switching the pressure of said suction opening after a predetermined time from the second pressure to the first pressure, the dicing sheet overlying said Aspirate opening and BiHiraku from said semiconductor die Peeling off,
A semiconductor die pick-up device. A pickup device for a semiconductor die according to any one of claims 1 to 3,
The opening pressure switching mechanism switches the pressure of the suction opening a plurality of times between the first pressure and the second pressure before first sliding the lid in the opening direction by a predetermined distance;
A semiconductor die pick-up device. Claim 1 or a semiconductor die pick-up apparatus according to 2,
The lid is provided on the stage so that its surface can be advanced from the suction surface,
When picking up the semiconductor die, sliding the lid in a state where the surface of the lid is advanced to a predetermined height higher than the suction surface;
A semiconductor die pick-up device. A semiconductor die pick-up device according to any one of claims 1 to 5,
A peeling detecting means for detecting whether a part of the semiconductor die located immediately above the suction opening opened by sliding the lid is peeled off from the surface of the dicing sheet;
When the peeling detecting means detects that the part of the semiconductor die is not peeled from the dicing sheet, the pressure of the suction opening is changed from the first pressure to the first pressure without sliding the lid. Switching the pressure of the suction opening from the second pressure to the first pressure again after switching to two pressures;
A semiconductor die pick-up device. A semiconductor die pick-up device according to claim 6,
A collet that adsorbs a semiconductor die;
A suction mechanism connected to the collet and sucking air from the surface of the collet;
A flow rate sensor for detecting a suction air flow rate of the suction mechanism,
The peeling detection means determines that peeling has occurred when the number of times that the differential signal obtained by differentiating the suction air flow signal detected by the flow sensor exceeds a predetermined threshold range has become an even number, Judging that it has not peeled,
A semiconductor die pick-up device. A semiconductor die pick-up device according to any one of claims 1 to 5,
When the leading end of the lid when closing the suction opening is provided in the vicinity of the end face of the suction opening abuts was BiHiraku the suction opening of the lid by small slide, the Aspirate opening and BiHiraku A sheet displacement detection sensor for detecting a displacement in a contact / separation direction of the dicing sheet positioned on the suction surface;
The sheet displacement detected by the sheet displacement detection sensor is predetermined when the suction opening pressure is switched from the second pressure to the first pressure after a predetermined time has elapsed after the suction pressure of the suction surface is evacuated. If the following threshold, after the adsorption pressure in the adsorption surface is switched to the second pressure the pressure of the suction opening from the first pressure as well as the atmosphere open again, and the suction pressure of the suction surface and a vacuum after the pressure of the suction opening is switched from the second pressure to the first pressure, thereby stripping the dicing sheet overlying said Aspirate opening and BiHiraku from the semiconductor die after a predetermined period of time,
A semiconductor die pick-up device. A semiconductor die pick-up device according to claim 8,
The sheet displacement detection sensor uses light having a wavelength in the range of 0% to 30% as a light source, with respect to the dicing sheet.
A semiconductor die pick-up device. A semiconductor die pick-up device according to claim 9,
The sheet displacement detection sensor uses a reflective optical fiber whose light source is an LED having a short wavelength of 0 nm to 300 nm,
A semiconductor die pick-up device. A method for picking up a semiconductor die for picking up a semiconductor die attached to the surface of a dicing sheet,
A stage including an adsorption surface for adsorbing the back surface of the dicing sheet; an adsorption opening provided on the adsorption surface of the stage; and the adsorption surface provided on the stage so that the surface can be advanced from the adsorption surface. A semiconductor that includes a lid that slides along a surface to open and close the suction opening, and an opening pressure switching mechanism that switches a pressure of the suction opening between a first pressure close to vacuum and a second pressure close to atmospheric pressure. Preparing a die pick-up device;
The stage is moved in the direction along the suction surface so that the end of the closed lid coincides with one end of the semiconductor die to be picked up and the width direction position of the lid coincides with the width direction position of the semiconductor die. An alignment step of
The lid is slightly slid to slightly open the suction opening, and after the surface of the lid is advanced to a predetermined height higher than the suction surface, the suction pressure of the suction surface is set to a vacuum, and a predetermined time the pressure of the suction opening is switched to the first pressure from said second pressure after the elapse of a first peeling step of peeling off the dicing sheet overlying said Aspirate opening and BiHiraku from the semiconductor die,
Each time the suction pressure of the suction surface is switched from the first pressure to the second pressure after the suction pressure of the suction surface is maintained in vacuum and the pressure of the suction opening is switched from the second pressure to the first pressure. Further, the semiconductor is positioned immediately above the suction opening opened by the slide by sliding the lid in the opening direction by a predetermined distance in a state where the surface of the lid is advanced to a predetermined height higher than the suction surface. A second peeling step of peeling a part of the die from the surface of the dicing sheet;
A method for picking up a semiconductor die, comprising: A method for picking up a semiconductor die according to claim 11,
The opening pressure switching mechanism switches the pressure of the suction opening a plurality of times between the first pressure and the second pressure before first sliding the lid in the opening direction by a predetermined distance;
A method for picking up a semiconductor die. A method for picking up a semiconductor die according to claim 11,
The semiconductor die pick-up device is provided in the vicinity of the end face of the suction opening that contacts the tip of the lid when the suction opening is closed, and when the suction opening is slightly opened by microsliding the lid , a seat displacement detection sensor for detecting the displacement of contact and separation direction relative to the suction surface of the dicing sheet overlying said Aspirate opening and BiHiraku,
The first peeling step includes
The sheet displacement detected by the sheet displacement detection sensor is predetermined when the suction opening pressure is switched from the second pressure to the first pressure after a predetermined time has elapsed after the suction pressure of the suction surface is evacuated. when exceeding the threshold value, it determines that the dicing sheet is peeled off from the semiconductor die to be positioned on the Aspirate opening that BiHiraku, the sheet displacement detected by the sheet displacement sensor is less than a predetermined threshold value in the case of a first release determination step of determining a dicing sheet is not peeled off from the semiconductor die to be positioned on the Aspirate opening and BiHiraku,
The suction when the dicing sheet overlying said Aspirate opening and BiHiraku by the first peeling determination process is determined not to be peeled off from the semiconductor die, as well as the suction pressure of the suction surface open to the atmosphere After the opening pressure is switched from the first pressure to the second pressure, the suction pressure of the suction surface is again evacuated, and after a predetermined time has elapsed, the suction opening pressure is changed from the second pressure to the second pressure. switching the first pressure, that includes a first retry step for peeling the dicing sheet from the semiconductor die to be positioned on the Aspirate opening that BiHiraku, and
A method for picking up a semiconductor die. A method for picking up a semiconductor die according to claim 11 or 13,
The semiconductor die pick-up device includes: a collet that adsorbs a semiconductor die; a suction mechanism that is connected to the collet and sucks air from the surface of the collet; and a flow rate sensor that detects a suction air flow rate of the suction mechanism. Prepared,
The second peeling step includes
When the number of times that the differential signal obtained by differentiating the suction air flow signal detected by the flow sensor exceeds a predetermined threshold range is an even number, the semiconductor located immediately above the suction opening opened by sliding the lid It is determined that a part of the die has peeled from the surface of the dicing sheet, and when it becomes an odd number, a part of the semiconductor die located immediately above the suction opening opened by sliding the lid is replaced with the dicing A second peeling determination step for determining that the sheet does not peel from the surface;
In the second peeling determination step, when it is determined that the part of the semiconductor die is not peeled from the surface of the dicing sheet, the pressure of the suction opening is set to the first without sliding the lid. After the pressure is switched to the second pressure, the pressure of the suction opening is switched again from the second pressure to the first pressure, and the part of the semiconductor die is peeled off from the surface of the dicing sheet. Including two retry steps,
A method for picking up a semiconductor die. A method of picking up a semiconductor die according to claim 13,
The sheet displacement detection sensor uses light having a wavelength in the range of 0% to 30% as a light source, with respect to the dicing sheet.
A method for picking up a semiconductor die. A method for picking up a semiconductor die according to claim 15,
The sheet displacement detection sensor uses a reflective optical fiber whose light source is an LED having a short wavelength of 0 nm to 300 nm,
A method for picking up a semiconductor die.

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