JP5930599B2 - Electronic component mounting method and mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting method that presses a cover component that covers an electronic component mounted on a substrate and attaches the cover component to the substrate, and a mounting device that uses the method.

  Conventionally, some electronic components mounted on an electronic component mounting apparatus are easily affected by electromagnetic waves or heat. Recently, in order to prevent such effects, a shield cover is assembled on a substrate with a mobile phone, a personal computer, or the like. There are an increasing number of things that are attached or mounted on the chassis. Such cover parts such as a shield cover are attached to a portion where paste-like solder is printed like an electronic part, and are not fixed to the substrate by being heated in a reflow furnace, but provided on the cover part. In order to engage with the substrate using an engaging claw or the like, the operator manually presses and fits the electronic component after the electronic component to be covered is mounted. In such a manual operation, there is a possibility that the assembly may vary or the cycle time for completing the mounting of the substrate may be reduced because it is performed separately from the automated line.

  In patent document 1, when fixing the leg part of an electronic component to the insertion hole provided in the board | substrate, after inserting a leg part into an insertion hole, an electronic component is pressed, and a leg part is aimed. It is described that it is inserted to the position.

  Moreover, in patent document 2, it hold | maintains with an electronic component provided with the clamp nail | claw for grabbing a large-sized electronic component, and the holding | pressing plate which presses an electronic component, and it hold | maintains in an engagement hole of a board | substrate. The engagement pin is positioned, the center of the electronic component is pressed by the holder, the engagement pin is pushed into the engagement hole of the board, and the holder is further moved to a portion corresponding to another engagement pin of the board. Then, press that part of the electronic component with the holder. This describes that a large electronic component is securely held on a substrate.

Japanese Patent Laid-Open No. 2001-165852 JP 2010-027661 A

  However, in the above-mentioned Patent Document 1, there are two types of suction nozzles for sucking electronic components and dedicated pressing heads for pressing the electronic components, and the dedicated pressing heads are also provided in the suction nozzle station where the suction nozzles are placed, Only when it is necessary, the suction nozzle is replaced with the press-only head, and the pressing operation of the electronic component is performed. For this reason, the electronic component sucked by the suction nozzle and positioned at a predetermined position on the substrate is displaced from the original position positioned by the vibration of the machine or the like during the head replacement work before the pressing work. There was a problem that. In particular, a lightweight component such as a cover component has a problem that it is likely to be displaced due to vibration of the machine.

  Moreover, in patent document 2, since the clamp nail | claw is used as a holder in order to grasp a large-sized electronic component, the holder which can be used is regulated by the dimension of the large-sized electronic component to hold | maintain, etc. There was a risk that the number of types would increase. There is a problem in that extra equipment costs arise when a cover part that can be sucked by a suction nozzle is used by preparing a dedicated clamp claw.

  The present invention has been made in view of the conventional problems, and after the cover component is positioned and placed on the substrate, the cover component is prevented from being displaced before being pressed and fixed, and various types of electronic components are mounted. In addition, the present invention is to provide an electronic component mounting method and a mounting apparatus that are highly versatile and can reduce the types of holders (suction nozzles) to be prepared.

In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that a substrate transfer device that transfers and positions a substrate on which an electronic component is mounted, and a position where the transferred substrate is positioned. A camera for recognizing a mark to be recognized and an electronic component collected by the component supply device are positioned and mounted at the mounting position of the substrate, and a cover component that covers the mounted electronic component is sampled to cover the electronic component An electronic component mounting apparatus including a component transfer device that is positioned and mounted at a position, wherein a vertical movement member having a pressing portion that presses the cover component positioned at the predetermined position is moved up and down on the component transfer device. provided to be driven in the direction, provided with a rectangular frame-shaped frame member to the predetermined position of the substrate is provided with engaging means for engaging said frame member to said cover component, said positioning A substrate transport positioning step for positioning the substrate is conveyed by said storage means for previously storing the data of the position coordinates of the frame member with the data of the position coordinates of the substrate relative to the substrate provided, wherein the substrate transfer apparatus is, conveyed The position coordinates of the substrate thus positioned are read by the mark recognition camera, and the read position coordinates of the substrate are compared with the data of the position coordinates of the substrate stored in advance in the storage means. and conveyed the positional deviation of the substrate positioned in recognizing the substrate positional deviation recognition step, by said mark recognition camera, the frame member the position coordinates of the frame member relative to the position of the substrate positioned is the transport and position coordinate reading step of reading the corner portion facing on the diagonal of the frame portion read by said position coordinate reading step Of contrast and data of position coordinates of the frame member position coordinates with respect to the substrate which is previously stored in the storage means, the predetermined position where the cover part with respect to the positioning position of the substrate is positioned A positional deviation recognition step for recognizing a positional deviation, and for each cover component placed on the frame member by the positional deviation recognized in the positional deviation recognition step with respect to the substrate positioned in the substrate conveyance positioning step. It said predetermined position located corrected by recognizing the corners of the frame member, and the cover component positioning placing step of positioning placed was collected by adsorbing the cover part by the component transfer device, in the component transfer device Immediately after positioning and mounting the cover part at the predetermined position, the vertical movement member is driven and the cover part is pressed by the pressing part, And a pressing and assembling step of engaging the engaging means of the cover part with the frame member provided on the substrate.

According to a second aspect of the present invention, in the first aspect , the pressing portion is provided with a negative pressure channel that is intermittently communicated with a negative pressure source and opened on a lower surface thereof. In the state where the negative pressure source communicates with the negative pressure flow path of the pressing portion, the cover component is sucked and positioned and placed at the predetermined position, and in the pressing assembly process, the negative pressure flow path of the pressing portion is placed on the negative pressure flow path. The cover part positioned at the predetermined position is pressed by the pressing portion with the pressure source cut off.

The structural feature of the invention according to claim 3 is that, in claim 2 , the component transfer device is provided with two shaft-like vertical movement members, and at least one of the vertical movement members includes the pressing portion. And at least one of the vertically moving members is provided with the negative pressure flow path communicating with the negative pressure source.

The structural feature of the invention according to claim 4 is that in any one of claims 1 to 3, the frame member provided on the substrate is erected on the substrate so as to surround the electronic component to be covered. The engaging recess is a frame member provided on the outer periphery, and the engaging means is a plurality of engaging claws provided with engaging projections that engage with the engaged recess.

The structural features of the invention according to claim 5 are: a substrate transfer device for transferring and positioning a substrate on which an electronic component is mounted, a mark recognition camera for recognizing a positioned position of the transferred substrate, and a component A component transfer device that positions and mounts an electronic component collected by the supply device at a mounting position of the substrate, collects a cover component that covers the mounted electronic component, and positions the electronic component at a predetermined position that covers the electronic component; The electronic component mounting apparatus includes: a vertical movement member provided in the component transfer apparatus so as to be movable up and down and having a pressing portion that presses the cover component positioned at the predetermined position; and the predetermined of the substrate a rectangular frame-like frame member provided at a position, and engagement means for engaging the frame member provided in the cover part, before the data of the position coordinates of the substrate to be the positioning Said storage means for previously storing the data of the position coordinates of the frame member relative to the substrate, and the substrate conveying and positioning means for positioning the substrate was transported by the substrate transport apparatus, the position coordinates of the substrate positioned are conveyed The positional deviation of the substrate that has been transported and positioned is recognized in comparison with the position coordinates of the substrate read by the mark recognition camera and the data of the positional coordinates of the substrate stored in advance in the storage means. Position coordinates of the frame member relative to the position of the substrate that has been transported and positioned by a corner portion that is diagonally opposed to the frame member, by the substrate position deviation recognition means that performs the positioning, and the mark recognition camera a reading unit, previously stored in the position coordinate and said storage means of said frame member which is read by the position coordinate reading means And comparing the data of the position coordinates of the frame member with respect to the substrate, and the predetermined position positional deviation recognizing means for recognizing a positional shift of the cover part with respect to the positioning position of the substrate is positioned, said substrate The corner of the frame member is recognized and position-corrected for each cover component placed on the frame member due to the positional deviation recognized by the positional deviation recognition unit with respect to the substrate positioned by the conveyance positioning unit. Cover component positioning and placing means for picking up and positioning the cover component by suction with the component transfer device at a predetermined position, and immediately after the cover component is positioned and placed at the predetermined position by the component transfer device The pressing assembly means for engaging the cover component with the substrate by driving the vertical movement member and pressing the cover component with the pressing portion. And is equipped with.

According to the first aspect of the present invention, the cover component positioned and placed at a predetermined position of the substrate by the component transfer device is pressed by the pressing portion of the vertical movement member immediately after being positioned, so that the vibration of the machine after positioning is achieved. The cover component can be pressed and assembled to the substrate without causing a positional shift of the cover component with respect to the substrate. Cover parts are collected by suction and are not restricted by the dimensions of the cover parts, unlike conventional clamp claws, so it is not necessary to prepare various types of holding parts (for example, nozzles) in the parts transfer device. It is possible to save the space of the station for storing the parts.
Further, the position coordinates on the substrate of the frame member are read by the corner portions facing diagonally opposite to the frame member by the position coordinate reading process, and the cover component is used for the mark recognition from the position coordinates of the frame member read by the position deviation recognition process. The camera recognizes a positional deviation with respect to the position of the substrate positioned by the camera, and recognizes a corner of the frame member for each cover part by the recognized positional deviation and corrects the position of the cover part by the recognized positional deviation. Position and mount. Accordingly, even when a predetermined position where the cover component is to be attached on the substrate is deviated from a preset position coordinate, the cover component can be reliably assembled to the substrate by correcting the positional deviation.

According to the second aspect of the present invention, the cover part is sampled by the vertical movement member provided with the pressing part by adsorbing the cover part by communicating the negative pressure channel opened at the lower end of the pressing part with the negative pressure source. The suction cover part is separated from the pressing part and placed at a predetermined position by shutting off the negative pressure flow path from the negative pressure source, and the cover part is immediately pressed by the pressing part and assembled to the substrate. Can do.

According to the invention of claim 3 , since the pressing portion is provided in at least one of the two vertical movement members provided in the component transfer device, the cover component positioned at a predetermined position by the component transfer device is provided. The cover component can be pressed immediately without the need to replace the vertical movement member mounted on the component transfer device. Since at least one of the vertical movement members is provided with a negative pressure flow path communicating with a negative pressure source, it is possible to collect and mount electronic components without the need to replace the vertical movement member mounted on the component transfer device. Can work.

According to the fourth aspect of the present invention, the plurality of engaging claws provided in the cover component are provided in the engaged recess provided in the outer periphery of the frame member standing so as to surround the electronic component covered by the substrate. Since the provided engaging projections are simply engaged, the cover component positioned and placed in the cover component positioning and placing step is securely placed in the press assembly step immediately after being placed. Can be assembled to.

According to the fifth aspect of the present invention, the cover component positioned and placed at a predetermined position by the positioning and placing means is positioned and placed by pressing the cover component by the pressing and assembling means immediately after the positioning and placing. The cover component can be securely assembled to the substrate without causing a positional shift of the cover component due to vibration of a subsequent machine or the like. Cover parts are collected by suction and are not restricted by the dimensions of the cover parts, unlike conventional clamp claws, so it is not necessary to prepare various types of holding parts (for example, nozzles) in the parts transfer device. It is possible to save the space of the station for storing the parts.
Further, the position coordinates on the substrate of the frame member are read by the position coordinates reading means by the corners opposed to the diagonal of the frame member , and the cover component is used for the mark recognition from the position coordinates of the frame member read by the position deviation recognition means. The camera recognizes the positional deviation with respect to the position of the substrate positioned by the camera, and the cover component positioning mounting means recognizes the corner of the frame member for each cover component based on the recognized positional deviation, and corrects the position to correct the cover component. Position and mount. Accordingly, even when a predetermined position where the cover component is to be attached on the substrate is deviated from a preset position coordinate, the cover component can be reliably assembled to the substrate by correcting the positional deviation.

The top view which shows the outline of the electronic component mounting apparatus which concerns on this embodiment. The figure which shows the outline | summary of a component transfer apparatus and a vertical motion member. The perspective view of a cover component. The flowchart which shows the procedure which attaches a cover component to a board | substrate. The figure which shows the positional relationship of the board | substrate with which the frame member was assembled | attached, the component transfer apparatus, and the camera for mark recognition. The figure showing the process of reading the reference mark of a board | substrate. The figure showing the process of reading the position coordinate of the corner of a frame member. The figure showing the process of positioning a cover component above a frame member. The figure showing the process of mounting a cover component. The figure showing the process of positioning a press part above cover parts. The figure showing the process of pressing the center part of a cover component with a press part. The figure showing the process of positioning a press part above one edge part of a cover component. The figure showing the process of pressing one edge part of a cover component with a press part. The figure showing the process of positioning a press part above the other edge part of a cover component. The figure showing the process of pressing the other edge part of a cover component with a press part. The figure showing the other example of a vertical movement member. The figure showing the other example of an up-and-down moving member.

A first embodiment of an electronic component mounting apparatus that performs an electronic component mounting method according to the present invention will be described below with reference to the drawings.
As shown in FIG. 1, the electronic component mounting apparatus 2 includes a substrate transfer device 4 that loads a substrate 3 into a loading position and positions the substrate 3 at a predetermined position, a component supply device 5, and a base 6 in a horizontal direction. A component transfer device 12 and a mark recognition camera 14 having a mounting head 10 provided on a movable table 8 supported so as to be movable in a certain X direction and Y direction, and a component recognition camera 16 fixed to the base 6. And a control device 18 for controlling the mounting by the component transfer device 12.

  The substrate transfer device 4 is a so-called double conveyor type, and each conveyor is provided in parallel along a guide rail 20 extending in the X direction and is provided in parallel with a conveyor belt (in parallel) for carrying the substrate 3 to a positioned position. (Not shown), a support frame (not shown) for supporting each of the loaded substrates 3, and a lifting device (not shown) for raising the supported substrates 3 to a mounting position (predetermined position). And a clamping device (not shown) for clamping the substrate 3 at each position (mounting position).

The component supply device 5 is configured by arranging a plurality of cassette-type feeders 21 in parallel on the side portion (front side in FIG. 1) of the substrate transfer device 4. Each of the cassette type feeders 21 includes a case part detachably attached to the slot (not shown), a supply reel provided at the rear part of the case part, and a component take-out part provided at the tip of the case part. An elongated tape (not shown) in which electronic components 40 (see FIG. 5) are encased at a predetermined pitch is wound and held on the supply reel, and this tape is pulled out at a predetermined pitch by a sprocket (not shown). The encapsulated state is released and the components are sequentially fed into the component take-out section. A code (identification code) is affixed to the cassette-type feeder 21, and correspondence data between the code and the ID, part number, number of enclosures, part weight, etc. of the electronic part 40 is a host that manages the entire line in the control device 18. It is recorded in advance in mounting program data transmitted from a computer (not shown).
A component tray 17 is disposed on the side of the substrate transfer device 4 (upper side in FIG. 1), and a large electronic component and a cover component 19 are accommodated in the component tray 17.

  An X-direction moving beam 22 is provided above the substrate transport device 4, and the X-direction moving beam 22 extends in the Y direction and extends in the X direction along the substrate transport device 4 ( It is provided so as to be movable along (not shown). As shown in FIG. 1, the moving table 8 is provided on the X direction moving beam 22 so as to be movable on a Y direction rail (not shown) provided on the side surface of the X direction moving beam 22 via a slider (not shown). It has been. The moving table 8 holds a component transfer device 12 having a mounting head 10 and a mark recognition camera 14 so as to be movable together with the moving table 8. The X-direction moving beam 22 is driven by a servo motor via a ball screw mechanism (not shown), and the moving table 8 is driven by a servo motor (not shown) via a Y-direction moving ball screw mechanism (not shown). . The drive of these servo motors is controlled by the control device 18.

  The optical axis of the mark recognition camera 14 is parallel to the Z direction perpendicular to the X direction and the Y direction. As shown in FIGS. 5 to 7, the mark recognition camera 14 has a rectangular field of view SA.

  A captured image captured by the mark recognition camera 14 is input to an unillustrated image recognition apparatus including an unillustrated A / D converter. The image recognition apparatus captures the captured image and reads information from the reference mark m (see FIG. 6). Then, the positional deviation of the reference mark m is calculated by a calculation device (not shown) provided in the control device 18. Next, when the mark recognition camera 14 is moved, the position deviation is corrected and moved.

  The component transfer device 12 includes the moving table 8, a mounting head lifting device (not shown) supported by the moving table 8 so as to be movable up and down in the Z direction perpendicular to the X direction and the Y direction, and the mounting head lifting device. The mounting head 10 is supported. As shown in FIGS. 2 and 5, the mounting head 10 is provided with a pair of nozzle holders 24, 26, and each nozzle holder 24, 26 is supported by a bearing (not shown) so as to be rotatable in the axial direction. . The nozzle holders 24 and 26 are supported by a guide member (not shown) so as to be movable up and down. The nozzle holders 24 and 26 are vertically driven by a nozzle holder lifting device (not shown) driven by a servo motor (not shown). The nozzle holders 24 and 26 are rotationally driven around their central axes by a rotation driving mechanism (not shown) and a servo motor (not shown) that drives the rotation driving mechanism.

  In each of the nozzle holders 24 and 26, axial suction nozzles 28 and 30 are removably fitted. As shown in FIG. 2, one of the suction nozzles 28 and 30 is formed with a rectangular pressing portion 32 at the lower end. A negative pressure passage 36 communicating with a negative pressure supply pump 34 that is a negative pressure source is opened at the lower end of the pressing portion 32. An electromagnetic valve 38 is provided between the negative pressure flow path 36 and the negative pressure supply pump 34, and the negative pressure air from the negative pressure supply pump 34 to the negative pressure flow path 36 can be communicated and blocked by the electromagnetic valve 38. . The operation of the electromagnetic valve 38 is controlled by the control device 18. The tip of the suction nozzle 28 and the opening of the negative pressure flow path 36 of the suction nozzle 30 are adapted to suck and hold the electronic component 40 and the like by supplying negative pressure air. The nozzle holders 24 and 26 and the suction nozzles 28 and 30 constitute a vertically moving member.

  A component recognition camera 16 is provided between the substrate transfer device 4 and the component supply device 5, and the electronic component 40 sucked by the suction nozzles 28 and 30 is imaged by the component recognition camera 16 to produce the product. It is determined whether the electronic component is of a type suitable for the type of substrate to be printed, whether the suction state is good, and whether there is a defective portion of the component itself.

  The electronic component mounting apparatus 2 is provided with an input device 42 such as a keyboard for inputting board data, component data, and the like. The input device 42 is provided with a display device 44, and on the screen of the display device 44, substrate data, component data, calculation data, an image captured by the mark recognition camera 14 and the like can be displayed.

  The cover part 19 used in the present embodiment is made of a metal such as a copper alloy or an aluminum alloy, and has a rectangular plate shape, as shown in FIG. The cover main body 48 is bent at an acute angle slightly more than 90 degrees, and corresponds to a tapered surface 54 of the frame member 52 described later. These engagement claws 46 correspond to engagement means. The engaging claws 46 located at the ends of the aligned engaging claws 46 are formed with convex engaging convex portions 50 having circular bases.

  As shown in FIGS. 5 and 8, a frame member 52 as an engaged means is assembled on the upper surface of the substrate 6. The frame member 52 is made of a metal such as a copper alloy and is formed in a rectangular frame shape having a certain height, and a tapered surface 54 that is inclined outward is formed around the periphery, and a cover is formed at a corner portion. A concave engaging concave portion 56 having a circular outer edge corresponding to the engaging convex portion 50 of the component 19 is formed. The frame member 52 is bonded to the substrate 3 by, for example, solder.

A procedure for covering the electronic component 40 mounted on the substrate 3 with the cover component 19 using the electronic component mounting apparatus 2 configured as described above will be described below based on the flowchart of FIG.
First, the control device 18 transports the board 3 on which the solder is printed in the screen printing process, which is a previous process, to the electronic component mounting device 2, and although not shown, the electronic component 40 covered by the cover component 19 A frame member 52 for assembling the cover component 19 to the substrate 3 is mounted on the conveyed substrate 3 (step 101, hereinafter abbreviated as “S101”).

  And the control apparatus 18 conveys the board | substrate 3 with which the said electronic component 40 and the frame member 52 were mounted | worn to an unillustrated reflow furnace, and heats / cools in a reflow furnace, and the electronic component 40 grade | etc., The board | substrate 3, and Is melted and then solidified (S102). Thereby, the electronic component 40 and the frame member 52 are assembled and fixed to the substrate 3.

  Hereinafter, the process will be described in detail. The control device 18 carries the substrate 3 on which the covered component (electronic component) 40 and the frame member 52 are assembled into the electronic component mounting device 2, and the substrate transfer device 4 Transport to a predetermined transport position (S103).

  The substrate 3 transported to the predetermined transport position is raised from the predetermined transport position to the mounting position by a lifting device (not shown), positioned, and clamped by a clamping device (not shown) (substrate transport positioning step S104).

  Next, as shown in FIG. 6, the control device 18 positions the mark recognition camera 14 at a pair of reference marks m provided at the corners on the diagonal line of the positioned substrate 3, and the position coordinates of the reference mark m. Is read (S105). Thereby, in comparison with the position coordinate data of the substrate 3 stored in the storage device of the control device 18 in advance, the horizontal displacement (X direction, Y direction) of the position where the substrate 3 is positioned by the substrate transfer device 4. Direction and direction of rotation).

  Next, as shown in FIG. 7, the control device 18 positions the center of the mark recognition camera 14 at the corners 52 a and 52 b that are opposite to each other on the diagonal of the frame member 52. The position coordinates of the positioned corner portions 52a and 52b are read (position coordinate reading step), and the position coordinates of the substrate 3 are compared with the position coordinate data stored in the storage device in advance. A misregistration is recognized (misregistration recognition step S106).

  Next, as shown in FIG. 8, the control device 18 collects the cover component 19 from the component tray 17 by the suction nozzle 30 having the pressing portion 32, and positions and mounts the cover component 19 on the position coordinate corrected for the position of the frame member 52. (Cover part positioning placement step S107). At this time, the control device 18 communicates the negative pressure flow path 36 with the negative pressure supply pump 34 by the electromagnetic valve 38, and holds the cover component 19 by suction at the opening at the lower end of the pressing portion 32. Then, as shown in FIG. 9, the suction nozzle 30 is lowered and the negative pressure flow path 36 is shut off by the electromagnetic valve 38 at the positioning position, the vacuum break is performed, and the cover part 19 is detached from the suction nozzle 30 to cover the cover part. 19 is placed on the frame member 52. The front end portion of the engaging claw 46 of the cover part 19 comes into contact with the upper end side edge portion of the frame member 52, and the upper end side edge portion of the frame member 52 is sandwiched by the opposing engaging claw 46.

  Next, as shown in FIG. 10, the control device 18 raises the suction nozzle 30 above the cover component 19, and then lowers the suction nozzle 30 as shown in FIG. Is pressed (press assembly step S108). By this pressing, a part of the end of the engaging claw 46 at the center of the cover part 19 reaches the tapered surface 54 beyond the upper edge of the frame member 52 and is tapered by the elastic force of the engaging claw 46. The engaging claw 46 slides downward along the short direction 54 and engages with the tapered surface 54 sandwiched therebetween.

  Next, as shown in FIG. 12, the control device 18 raises the suction nozzle 30, moves it to one end of the cover part 19, positions it, and lowers the suction nozzle 30 as shown in FIG. 13. Thus, one end portion of the cover part 19 is pressed by the pressing portion 32. By this pressing, the engaging claws 46 facing the cover component 19 are engaged with the tapered surface 54 of the frame member 52 sandwiched in the same manner as described above, and the engaging convex portions 50 provided on the engaging claws 46 are engaged. Engages with the engaging recess 56 of the frame member 52.

  Next, as shown in FIG. 14, the control device 18 raises the suction nozzle 30, moves it to the other end of the cover part 19, positions it, and lowers the suction nozzle 30 as shown in FIG. 15. Thus, the other end portion of the cover part 19 is pressed by the pressing portion 32. By this pressing operation, the engaging claw 46 of the cover part 19 is engaged with the tapered surface 54 of the frame member 52 in the same manner as described above, and the engaging convex portion 50 provided on the engaging claw 46 is changed to the frame member 52. The engaging recess 56 is engaged. And the assembly | attachment to the board | substrate 3 of the cover component 19 is complete | finished.

  Next, the control device 18 unclamps the substrate 3 to which the cover component 19 is assembled, and lowers the substrate 3 from the mounting position to the transport position by the lifting device, and delivers it to the substrate transport device 4 (S109).

  Next, the control apparatus 18 drives the board | substrate conveyance apparatus 4, and pays out the board | substrate 3 with which the cover component 19 was assembled | attached to the following process (S110).

  According to the method of assembling the cover component using the electronic component mounting apparatus 2 configured as described above, the cover component 19 positioned at a predetermined position on the substrate 3 by the component transfer device 12 is sucked immediately after being positioned. By pressing with the pressing portion 32 of the nozzle 30, the cover component 19 can be pressed and assembled to the substrate 3 without causing a positional shift of the cover component 19 with respect to the substrate 3 due to vibration of the machine after positioning. The cover component 19 is collected by suction, and since it is not necessary to prepare various types of nozzles in the component transfer device 12 without being restricted by the size of the cover component 19 as in the case of a conventional clamp claw, the nozzles are stored. Space saving of the nozzle station can be achieved.

  Further, the position coordinate of the frame member 52 on the substrate 3 is read, and the position deviation of the cover component 19 relative to the position of the substrate 3 positioned by the mark recognition camera 14 is recognized from the read position coordinate of the frame member 52, The cover component 19 is positioned and placed at a predetermined position by correcting the position based on the recognized displacement. As a result, even when the predetermined position on the substrate 3 where the cover component 19 is to be attached is deviated from the preset position coordinates, the cover component 19 can be reliably assembled to the substrate 3 by correcting the positional deviation.

  Further, the negative pressure flow path 36 opened at the lower end of the pressing portion 32 is communicated with the negative pressure supply pump 34 to suck the cover component 19, whereby the cover component 19 is sampled by the suction nozzle 30 provided with the pressing portion 32. The suctioned cover component 19 is separated from the pressing portion 32 and placed at a predetermined position by shutting off the negative pressure flow path 36 from the negative pressure supply pump 34, and immediately presses the cover component 19 with the pressing portion 32. And can be assembled to the substrate 3.

  In addition, since one of the two nozzles 28 and 30 provided in the component transfer device 12 is provided with the pressing portion 32, the cover component 19 positioned at a predetermined position by the component transfer device 12 is transferred to the component transfer device 12. The cover component 19 can be pressed immediately without the need to replace the nozzles 28 and 30 mounted on the mounting device 12. Further, since each of the nozzles 28 and 30 is provided with a negative pressure flow path 36 communicating with the negative pressure supply pump 34, the nozzles 28 and 30 mounted on the component transfer device 12 need not be replaced. Parts can be collected and installed.

  In addition, a plurality of engaging claws 46 provided in the cover component 19 are provided in an engaged recess 56 provided in an outer periphery of a frame member 52 erected so as to surround the electronic component 40 covered by the substrate 3. Since the engaging projection 50 is configured to be engaged, the cover component 19 positioned and placed in the cover component positioning and placing step is surely placed in the pressing and assembling step immediately after being placed. It can be assembled to the substrate 3.

  In the above embodiment, the pressing portion 32 is provided on one suction nozzle 30 of the two suction nozzles provided as the vertically moving members. However, the present invention is not limited to this, for example, as shown in FIG. You may provide the 1st press part 64 and the 2nd press part 66 from which the magnitude | size differs in the lower end part of both the suction nozzles 60 and 62, respectively. Further, the pressing portion is not necessarily limited to the one integrated with the suction nozzle, and may be, for example, a pressing member 72 that is sucked and fixed to one tip of the suction nozzles 68 and 70 as shown in FIG.

  Also, the number of vertically moving members is not limited to two, and may be one or three or more, for example.

  Further, although the frame member 52 fixed to the substrate 3 is used as the engaged means and the engaging claw 46 is engaged with the frame member 52 as the engaging means, the present invention is not limited thereto. The engagement hole provided in the board | substrate may be sufficient and the engagement means may be the engagement protrusion engaged with the said engagement hole.

  Thus, the specific configuration described in the above-described embodiment is merely an example of the present invention, and the present invention is not limited to such a specific configuration. Various embodiments can be adopted without departing from the scope.

DESCRIPTION OF SYMBOLS 2 ... Electronic component mounting apparatus, 3 ... Board | substrate, 4 ... Board | substrate conveyance apparatus, 5 ... Component supply apparatus, 12 ... Component transfer apparatus, 14 ... Mark recognition camera, 19 ... Cover component, 24, 26 ... Vertical movement member ( Nozzle holder), 28, 30 ... Vertical movement member (adsorption nozzle), 32 ... Pressing part, 34 ... Negative pressure source, 36 ... Negative pressure flow path, 40 ... Electronic component, 46 ... Engaging means (engaging claw), 50 ... engaging protrusion, 52 ... engaged means (frame member), 56 ... engaged recess, 60 ... vertical movement member (adsorption nozzle), 62 ... vertical movement member (adsorption nozzle), 64 ... pressing part (first) 1 pressing part), 66 ... pressing part (second pressing part), 68 ... vertical movement member (adsorption nozzle), 70 ... vertical movement member (adsorption member), 72 ... pressing part (pressing member).

Claims (5)

A board transfer device for transferring and positioning a board on which an electronic component is mounted;
A mark recognition camera for recognizing a positioned position of the conveyed substrate;
The electronic component collected by the component supply device is positioned and mounted at the mounting position of the substrate, and the cover component that covers the mounted electronic component is sampled and positioned and placed at a predetermined position that covers the electronic component. In an electronic component mounting device comprising a mounting device,
A vertically moving member having a pressing portion for pressing the cover component positioned at the predetermined position is provided on the component transfer device so as to be driven in the vertical direction;
Provided with a rectangular frame-shaped frame member to the predetermined position of the substrate is provided with engaging means for engaging said frame member to said cover component,
A storage means for storing in advance the position coordinate data of the substrate to be positioned and the position coordinate data of the frame member relative to the substrate;
A substrate transfer positioning step of transferring and positioning the substrate by the substrate transfer device;
The position coordinates of the substrate that has been conveyed and positioned are read by the mark recognition camera, and the read position coordinates of the substrate are compared with the data of the position coordinates of the substrate stored in advance in the storage means. A substrate misalignment recognition step for recognizing a misalignment of the substrate that has been transported and positioned;
A position coordinate reading step of reading the position coordinates of the frame member with respect to the position of the substrate that has been transported and positioned by the mark recognition camera, by means of corner portions facing diagonally of the frame member ;
The position of the positioned substrate is determined by comparing the position coordinates of the frame member read in the position coordinate reading step with the position coordinate data of the frame member with respect to the substrate stored in advance in the storage means. A misregistration recognition step for recognizing a misregistration of the predetermined position where the cover part is positioned with respect to
Position correction by recognizing the corner of the frame member for each cover component placed on the frame member by the positional deviation recognized in the positional deviation recognition step with respect to the substrate positioned in the substrate conveyance positioning step. in the predetermined position, and the cover component positioning placing step of positioning placed was collected by adsorbing the cover part by the component transfer device,
Immediately after positioning and mounting the cover component at the predetermined position by the component transfer device, the frame provided on the substrate is driven by driving the vertical movement member and pressing the cover component with the pressing portion. A pressing and assembling step for engaging the engaging means of the cover part with a member ;
An electronic component mounting method comprising the steps of: In claim 1 , the pressing portion is provided with a negative pressure flow path that is intermittently communicated with a negative pressure source and opened on a lower surface,
In the cover part positioning and placing step, the cover part is sucked and placed and placed at the predetermined position in a state where the negative pressure source is communicated with the negative pressure flow path of the pressing part,
In the pressing and assembling step, an electronic component mounting method comprising pressing the cover component positioned at the predetermined position by the pressing portion in a state where the negative pressure source is blocked in the negative pressure flow path of the pressing portion. 3. The component transfer device according to claim 2 , wherein the component transfer device is provided with two shaft-like vertical movement members, of which at least one of the vertical movement members is provided with the pressing portion, and at least one of the vertical movement members is provided with The electronic component mounting method, wherein the negative pressure flow path communicating with the negative pressure source is provided. 4. The frame member according to claim 1, wherein the frame member provided on the substrate is a frame member that is erected on the substrate so as to surround an electronic component to be covered, and an engaged recess is provided on an outer periphery. ,
The electronic component mounting method according to claim 1, wherein the engaging means is a plurality of engaging claws provided with engaging convex portions that engage with the engaged concave portions. A board transfer device for transferring and positioning a board on which an electronic component is mounted;
A mark recognition camera for recognizing a positioned position of the conveyed substrate;
A component transfer device that positions and mounts an electronic component collected by a component supply device at a mounting position of a substrate, and collects a cover component that covers the mounted electronic component and positions the electronic component at a predetermined position that covers the electronic component. In an electronic component mounting apparatus comprising:
A vertically moving member provided on the component transfer device so as to be vertically movable, and having a pressing portion that presses the cover component positioned at the predetermined position;
A rectangular frame-shaped frame member provided at the predetermined position of the substrate;
Engagement means provided on the cover component and engaged with the frame member ;
Storage means for preliminarily storing the position coordinate data of the substrate to be positioned and the position coordinate data of the frame member with respect to the substrate;
Substrate transport positioning means for transporting and positioning a substrate by the substrate transport device;
The substrate position coordinates conveyed and positioned are read by the mark recognition camera, and the read position coordinates of the substrate are compared with the position coordinate data stored in advance in the storage means. A substrate misalignment recognition means for recognizing a misalignment of the substrate that has been conveyed and positioned;
Position coordinate reading means for reading the position coordinates of the frame member with respect to the position of the substrate that has been transported and positioned by the mark recognition camera, by means of corner portions facing diagonally of the frame member ;
The position of the substrate positioned by comparing the position coordinates of the frame member read by the position coordinate reading means with the data of the position coordinates of the frame member with respect to the substrate stored in advance in the storage means Misregistration recognizing means for recognizing misregistration of the predetermined position where the cover part is positioned with respect to
Position correction by recognizing the corner of the frame member for each cover component placed on the frame member by the positional shift recognized by the positional shift recognition unit with respect to the substrate positioned by the substrate transfer positioning unit. Cover component positioning and mounting means for collecting and positioning and mounting the cover component by suction with the component transfer device at the predetermined position;
Immediately after positioning and mounting the cover component at the predetermined position by the component transfer device, the cover component is engaged with the substrate by driving the vertical movement member and pressing the cover component with the pressing portion. Pressing assembly means to be combined,
An electronic component mounting apparatus comprising:

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