JP5588796B2 - Tape sticking method and tape sticking apparatus - Google Patents

Description

  The present invention relates to a tape adhering method and a tape adhering apparatus for adhering a support tape to the back surface of a workpiece (workpiece) such as a semiconductor wafer.

  In the semiconductor device manufacturing process, division lines are arranged in a lattice pattern on the workpiece surface, and devices such as IC and LSI are formed in each of a plurality of regions partitioned by the division lines. Then, each region in which these devices are formed is diced along a predetermined division line, whereby individual chips are manufactured.

  The work is supplied to the dicing apparatus in a state of being supported via a support tape at the center of the opening of the annular frame so that the divided chips after dicing are not scattered. However, when air bubbles are generated between the work and the support tape, the work and the support tape are not in close contact with each other in the air bubble portion, which sometimes causes a problem that chips are scattered during processing.

  Then, in order to prevent generation | occurrence | production of the bubble between a workpiece | work and a support tape, the tape sticking method which presses a support tape against a workpiece | work with a roller and sticks to a workpiece | work is proposed (for example, refer patent document 1).

JP 63-166243 A

  However, for example, when a three-dimensional structure such as MEMS (Micro Electro Mechanical Systems) is formed on the workpiece surface, the structure may be damaged if pressure is applied. The method cannot be adopted.

  The present invention has been made in view of the above points, and provides a tape adhering method and a tape adhering apparatus that can remove bubbles existing between a work and a support tape without applying pressure to the work surface. The purpose is to provide.

The tape adhering method of the present invention is a tape adhering method in which a supporting tape is adhered to the back surface of the plate-like work before the plate-like work having a three-dimensional structure formed on the surface is divided into chips. The back surface of the plate-like workpiece is opposed to the sticking surface of the support tape having the activated diffusion flow mechanism, and the plate-like workpiece is placed on the support tape so that at least the back surface of the plate-like workpiece is the support tape. A step of forming an adhesion region annularly surrounding air bubbles existing between the support tape and the plate-like workpiece, and a non-adhesion surface side of the support tape. A step of removing bubbles present between the support tape and the plate workpiece surrounded by the sticking region by sucking the support tape from the entire surface on which the plate workpiece is placed; Including and with That.

  According to this tape adhering method, by sucking the support tape from the non-adhesive surface side of the support tape, air bubbles existing between the support tape and the plate-like work can be removed. It is possible to remove air bubbles existing between the workpiece and the support tape without applying pressure.

The tape adhering device of the present invention is a tape adhering device for adhering a supporting tape to the back surface of the plate-shaped workpiece before processing the plate-shaped workpiece having a three-dimensional structure formed on the surface into chips. A suction table that performs suction through a suction path provided in the center of the suction surface, and a timer that sets a suction time in the suction table, and the back surface of the plate-like workpiece is attached to the suction table. Adsorbing the support tape having an activated diffusion flow mechanism in which an annular adhesion region surrounding air bubbles existing between the support tape and the plate-like workpiece is formed by being adhered to the attachment surface It is placed at the center of the surface, and the sticking tape is sucked from the entire surface on which the plate-like workpiece is placed on the non-sticking side of the support tape for the sticking time set in the timer. Surrounded by landing area It has been characterized by the removal of air bubbles present between the plate-shaped workpiece and the support tape.

  According to this tape sticking apparatus, air bubbles existing between the support tape and the plate-like workpiece are removed by sucking the support tape from the non-stick surface side of the support tape during the suction time set in the timer. Therefore, it is possible to remove bubbles existing between the workpiece and the support tape without applying pressure to the workpiece surface. In addition, since the support tape is sucked during the suction time set in the timer, even if the size of the plate-like work or the material of the support tape is different, the air bubbles that exist reliably between the work and the support tape Can be removed.

  ADVANTAGE OF THE INVENTION According to this invention, the tape sticking method which can remove the bubble which exists between a workpiece | work and a support tape, without applying a pressure to the workpiece | work surface can be provided.

It is principal part sectional drawing of the tape sticking apparatus with which the tape sticking method which concerns on one embodiment of this invention is applied. It is the cross-sectional schematic diagram which expanded the area | region B shown in FIG. It is a perspective view which shows the external appearance of the tape sticking apparatus which concerns on the said embodiment.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
The tape sticking method according to the present invention sticks a support tape having an activated diffusion flow mechanism to the back surface of a plate-like work, and in particular, does not generate bubbles between the work and the support tape. Thus, a support tape is stuck on the back surface of the workpiece. Hereinafter, the structure of the tape sticking apparatus to which the tape sticking method according to the present invention is applied will be described.

  FIG. 1 is a cross-sectional view of a main part of a tape sticking apparatus to which a tape sticking method according to an embodiment of the present invention is applied. In addition, in FIG. 1, the structure of the suction table 1 periphery with which the tape sticking apparatus which concerns on this Embodiment is provided is shown. FIG. 1A shows a case where a workpiece corresponding to the entire suction surface 2 to be described later is an object to be pasted. In FIG. 1B, a workpiece corresponding to a part of the suction surface 2 is pasted. The case where it is made to wear is shown.

  As shown to Fig.1 (a), the adsorption | suction table 1 has a flat cylindrical shape, for example, and the adsorption | suction surface 2 is provided in the upper surface center. The adsorption surface 2 is made of, for example, a porous ceramic. A suction path 3 is formed inside the suction table 1. The suction path 3 is provided so as to extend in the vertical direction at the center of the suction table 1. The upper end of the suction path 3 is connected to the center of the lower surface of the suction surface 2. On the other hand, the lower end of the suction path 3 is connected to a decompression means (not shown). In the suction table 1, by operating this pressure reducing means, the air in the suction surface 2 is sucked in the direction of the arrow A in the suction path 3, and the support tape and work placed on the suction surface 2 can be sucked. It is configured.

  In the tape adhering apparatus 10 according to the present embodiment, the support tape 5 to which the workpiece 4 is adhered is adhered to the lower surface of an annular frame (hereinafter referred to as “annular frame”) 6 in a top view. . The annular frame is made of, for example, a metal plate and is gripped when the workpiece 4 is conveyed. The support tape 5 has an adhesive surface (adhesion surface) on the upper surface shown in FIG. 1 and is adhered to the lower surface of the annular frame 6 at the peripheral edge. The work 4 is disposed on the adhesive surface (sticking surface) of the support tape 5 disposed inside the annular frame 6. In addition, the support tape 5 has a non-adhesive surface (non-adhesion surface) on the lower surface shown in FIG.

  As described above, the support tape 5 has an activated diffusion flow mechanism. Here, the activated diffusion flow mechanism refers to a mechanism in which gas molecules permeate through a film substantially free of pores. In the activated diffusion flow mechanism, gas molecules first agglomerate on the film surface, then (1) dissolve inside the film, (2) diffuse inside the film, and (3) desorb from the opposite surface of the film. Transmits through the film.

  Although it does not specifically limit as the workpiece | work 4 stuck on such a support tape 5, For example, the silicon | silicone (Si) wafer etc. with which MEMS was formed on the surface are mentioned. Moreover, the workpiece | work etc. which cannot touch the surface because the image sensor is formed are mentioned.

  When the support tape 5 on which the work 4 is placed is placed on the suction surface 2, the support tape 5 is sucked and the work 4 is sucked through the support tape 5. As shown in FIG. 1A, when the workpiece 4 corresponding to the entire suction surface 2 is placed on the support tape 5, the entire air in the suction surface 2 is sucked, and the workpiece 4 and this It is possible to adsorb the entire support tape 5 that is disposed oppositely. Further, in FIG. 1B, when the work 4 corresponding to a part of the suction surface 2 is placed on the support tape 5, the work 4 is placed at the center of the suction surface 2, so that the suction is performed. A portion of the air corresponding to the workpiece 4 in the surface 2 is sucked, and the workpiece 4 and a part of the support tape 5 disposed to face the workpiece 4 can be adsorbed.

  In the tape adhering device according to the present embodiment, air bubbles existing between the support tape 5 and the work 4 can be removed in the process of adsorbing the work 4 and the support tape 5 in this way. As a result, it is possible to attach the work 4 in a state of being in close contact with the support tape 5. Hereinafter, the tape sticking method using the tape sticking apparatus according to the present embodiment will be described. FIG. 2 is a schematic cross-sectional view in which the region B shown in FIG. 1 is enlarged. 2A shows a state before the suction process by the suction table 1, and FIG. 2B shows a state after the suction process. The area B includes a part of the work 4, the support tape 5, and the suction surface 2 in FIG. 1.

  First, the process of sticking the workpiece 4 to the support tape 5 will be described with reference to FIG. The back surface of the workpiece 4 is placed facing the adhesive surface (sticking surface) 5a of the support tape 5. At this time, the support tape 5 and the work 4 are placed so as to be concentric. The entire support tape 5 is bent into a fine wave shape. Therefore, the contact state between the plate-like workpiece 4 and the support tape 5 is divided into a sticking region 7 that is in contact and stuck, and a non-sticking region 8 (bubble 8) that is not in contact. The boundary between the sticking region 7 and the bubbles 8 is formed in an annular shape on the adhesive surface 5 a of the support tape 5. Therefore, the bubble 8 is a circular region surrounded by the sticking region 7, that is, inside the annular boundary line.

  The support tape 5 is placed on the suction table 1 such that the non-adhesive surface (non-adhesion surface) 5 b faces the suction surface 2. When the support tape 5 is placed on the suction table 1, the work 4 and the support tape 5 that are attached in advance may be placed on the suction table 1, or the support tape 5 is placed on the suction table 1. After placing, the workpiece 4 may be placed on the support tape 5.

  Then, the process of removing the bubble 8 which exists between the workpiece | work 4 and the support tape 5 is demonstrated. First, the support tape 5 is sucked from the entire surface on which the work 4 is placed on the non-adhesive surface 5 b side of the support tape 5. Then, the air bubbles existing between the suction surface 2 and the support tape 5 are immediately sucked, and the non-adhesive surface 5 b side of the support tape 5 comes into close contact with the suction surface 2. On the other hand, the bubbles 8 existing between the workpiece 4 and the support tape 5 are removed by an activated diffusion flow mechanism in which gas molecules existing in the bubbles 8 pass through the support tape 5. That is, it is removed by continuing to suck the support tape 5 from the non-adhesive surface 5b side until the three steps of (1) dissolution, (2) diffusion, and (3) desorption of the activated diffusion flow mechanism are completed. .

  Here, the permeation amount of gas molecules from the adhesive surface 5a side to the non-adhesive surface 5b side of the support tape 5 is proportional to, for example, the strength of the negative pressure of suction, the area of the support tape 5 and the elapsed time of suction, It is inversely proportional to the thickness of the support tape 5. For this reason, the suction with respect to the workpiece 4 and the support tape 5 in the suction table 1 is determined in consideration of these factors.

  As an example, in the case where the base of the support tape 5 is polyvinyl chloride and the adhesive material is acrylic, the negative pressure is changed from -70 [kPa] to -90 [kPa], and suction is continued for 30 minutes to 1 hour. The bubbles 8 can be completely removed.

  In another example, when the base of the support tape 5 is a polyolefin base and the adhesive material is an acrylic base, if the negative pressure is changed from -70 [kPa] to -90 [kPa] and the suction is continued for 3 hours, bubbles are generated. 8 can be removed.

  When performing bubble removal, it includes a step of measuring a processing time (suction time) at which a desired bubble removal effect is obtained in advance, and setting the processing time in a timer to measure the time until bubble removal. If it is, bubbles can be removed efficiently, which is preferable.

  When the support tape 5 is continuously sucked from the non-adhesive surface 5b side and the three steps of (1) dissolution, (2) diffusion, and (3) desorption of the activated diffusion flow mechanism are completed, the removal of the bubbles 8 is completed. Thereby, as shown in FIG. 2B, the pressure-sensitive adhesive surface 5 a side of the support tape 5 is in close contact with the back surface of the workpiece 4.

  As described above, according to the tape adhering method according to the present embodiment, the air bubbles 8 existing between the support tape 5 and the work 4 are obtained by sucking the support tape 5 from the non-adhesive surface 5 b side of the support tape 5. Can be removed. Thereby, the air bubbles 8 existing between the workpiece 4 and the support tape 5 can be removed without applying pressure to the surface of the workpiece 4 using a roller, as in the prior art. It becomes possible to stick 4 in the state which stuck.

  FIG. 3 is a perspective view showing an appearance of the tape sticking apparatus 10 according to the present embodiment. As shown in FIG. 3, the tape sticking device 10 includes a base 11 on which the suction table 1 is disposed. In the tape sticking apparatus 10 shown in FIG. 3, a case where three suction tables 1 are provided on the base 11 is shown. However, the number of suction tables 1 is not limited to three and can be any number. These suction tables 1 are connected to a single or a plurality of decompression means arranged in the base 11 and configured to be capable of sucking the support tape 5 and the like from the suction surface 2.

  An operation display panel 12 is provided on the front surface of the base 11. The operation display board 12 receives an instruction from the operator to the tape sticking device 10. The operation display panel 12 includes a display unit 12a that displays an instruction input from the operator and the current operation status of the suction table 1. The display unit 12a displays, for example, the presence or absence of suction in each suction table 1, the elapsed time since the start of suction, and the like. In addition, it is preferable as an embodiment to display a selection screen on which parameters such as the strength of the negative pressure of suction and the area and thickness of the support tape 5 can be selected on the display unit 12a. In this case, the operator can appropriately attach the workpiece 4 to the support tape 5 by selecting a desired parameter from the selection screen.

  Further, the operation display panel 12 includes a timer that can set a processing time (suction time) in each suction table 1. In this timer, for example, the suction time in the suction table 1 is set individually by the operator based on the size of the work 4 and the material of the support tape 5. The suction time in the suction table 1 may be set individually according to the parameter selection content on the selection screen described above.

  As described above, the time until the removal of the bubbles 8, that is, the time until the three steps of the activated diffusion flow mechanism are completed differs depending on the size of the workpiece 4, the material of the support tape 5, and the like. By measuring the processing time for obtaining the desired bubble removal effect in advance and setting the processing time for each suction table 1 in the timer via the operation display panel 12, the workpiece 4 having different sticking conditions or It is possible to efficiently perform the sticking operation on the support tape 5 as well.

  Thus, according to the tape sticking device 10 according to the present embodiment, the support tape 5 and the support tape 5 are sucked from the non-adhesive surface 5b side of the support tape 5 during the suction time set by the timer. Since the bubbles 8 existing between the workpiece 4 can be removed, the bubbles 8 existing between the workpiece 4 and the support tape 5 can be removed without applying pressure to the surface of the workpiece 4.

  Thereby, due to the presence of the bubbles 8 between the workpiece 4 and the support tape 5, the workpiece 4 and the support tape 5 are not sufficiently adhered to each other at the bubble 8 portion, and the chip is obtained by dividing the workpiece 4 during processing. Can be solved, and the problem that the chip cannot be divided at the time of expansion because the bubble 8 part is larger than the chip.

  The tape adhering device 10 according to the present embodiment sucks and holds the workpiece 4 on the suction table 1 as, for example, a cutting device, a grinding device, or an expanding device (hereinafter referred to as a grinding device or the like). However, this technique is clearly different from the technique of sucking and holding the workpiece 4 with a chuck table for processing. In the tape adhering device 10 according to the present embodiment, since the gas in the bubbles is transmitted by the activated diffusion flow mechanism and the bubbles are removed, the negative adhesion is stronger than that required for suction holding in a grinding device or the like. Pressure and a long processing time (suction continuation time) are required. That is, it is difficult to complete the three steps of the activated diffusion flow mechanism with a negative pressure and a processing time sufficient to suck and hold the workpiece 4 for processing by a chuck table in a grinding apparatus or the like.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the tape adhering device 10 shown in the above embodiment, the suction operation in the suction table 1 is stopped as the suction time input (or selected) through the operation display panel 12 elapses. . However, it is preferable as an embodiment to further include a function for stopping the suction operation in the suction table 1. For example, it is conceivable that a function for detecting the completion of desorption in the activated diffusion flow mechanism is provided, and the suction operation in the suction table 1 is stopped according to the detection result. As a function of detecting the completion of desorption in the activated diffusion flow mechanism, for example, a function of detecting the weight of the workpiece 4 or the like on the adsorption table 1 indicating that the gas in the bubbles 8 has been transmitted by the activated diffusion flow mechanism. In addition, a function of measuring the flatness of the work 4 indicating that the gas in the bubbles 8 is transmitted by the activated diffusion flow mechanism and the support tape 5 is in close contact with the work 4 is exemplified.

  Since air bubbles existing between the workpiece and the supporting tape can be removed without applying pressure to the workpiece surface, the supporting tape can be attached to the back surface of the workpiece on which a structure such as MEMS is formed. It is possible and useful for applications such as dicing of workpieces.

DESCRIPTION OF SYMBOLS 1 Suction table 2 Suction surface 3 Suction route 4 Workpiece 5 Support tape 5a Adhesive surface (adhesion surface)
5b Non-adhesive surface (non-stick surface)
6 Annular frame 7 Adhering area 8 Air bubbles 10 Tape adhering device 11 Base 12 Operation display panel 12a Display unit

Claims (2)

A tape adhering method for adhering a supporting tape to the back surface of the plate-like work before processing to divide the plate-like work having a three-dimensional structure formed on the surface into chips ,
The back surface of the plate-like workpiece is opposed to the sticking surface of the support tape having an activated diffusion flow mechanism, and the plate-like workpiece is placed on the support tape so that at least the back surface of the plate-like workpiece is the support tape. A step of forming a sticking region in a ring shape, which is attached to the sticking surface and surrounds air bubbles existing between the support tape and the plate-like workpiece ;
By sucking the support tape from the entire surface on which the plate-like work is placed among the non-stick surface side of the support tape, the support tape and the plate-like work are surrounded by the sticking region. Removing air bubbles present between them,
The tape sticking method characterized by including. A tape sticking device for sticking a support tape to the back surface of the plate-like work before processing to divide the plate-like work having a three-dimensional structure formed on the surface into chips ,
A suction table that performs suction through a suction path provided at the center of the suction surface;
A timer for setting a suction time in the suction table;
With
An annular sticking region surrounding air bubbles existing between the support tape and the plate work was formed on the suction table by sticking the back surface of the plate work to the sticking surface. The support tape having an activated diffusion flow mechanism is placed at the center of the suction surface, and the support tape is placed on the timer from the entire surface on which the plate-like workpiece is placed on the non-stick surface side of the support tape. A tape adhering device that removes air bubbles that are surrounded by the adhering region and exist between the support tape and the plate-like workpiece by sucking in a suction time set to 1.

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