JP5545492B2 - Electrical junction box - Google Patents

Description

  The present invention relates to an electrical junction box.

  Conventionally, as an electrical junction box comprising a case and a relay module formed by surrounding a switching element housed in the case and connected to a bus bar with a molded portion made of synthetic resin, the one described in Patent Document 1 It has been known.

JP 2003-218554 A

  In the electrical junction box according to the above configuration, since the relay module is not housed in close contact with the case, a gap may be formed between the relay module and the case. An air layer is formed in the gap. Since this air layer has a relatively low thermal conductivity, there is a concern that the heat generated in the switching element during energization will be trapped in the gaps and the inside of the electrical junction box will become locally hot. The Then, we are anxious about the malfunction occurring in the electronic component accommodated in the electrical junction box.

  This invention is completed based on the above situations, Comprising: It aims at providing the electrical junction box by which the inside was suppressed from becoming high temperature locally.

  The present invention surrounds a case having an opening opening upward, a cover for closing the opening of the case, and a switching element housed in the case and connected to a bus bar with a mold portion made of a synthetic resin. An electrical connection box comprising a relay module, and a mounting table on which the relay module is mounted is formed in the vicinity of one side wall of the case. Has a case-side inclined surface that is inclined downward as it approaches the one side wall, and a screw hole into which a screw is screwed is formed in the case-side inclined surface in the vertical direction. Has a mounting portion attached to the mounting table, and a lower surface of the mounting portion has a module-side inclined surface aligned with the case-side inclined surface. An insertion portion through which the screw is inserted at a position corresponding to the screw hole in a state where the attachment portion is placed on the placement table is formed through the attachment portion. The mold part is brought into close contact with the one side wall when the screw inserted into the insertion part is screwed into the screw hole in a state where the attachment part is mounted on the one side wall.

  According to the present invention, when the screw is screwed into the screw hole, the relay module is pressed against one side wall of the case. As a result, the mold part of the relay module is firmly attached to the side wall of the case. It is like that. Thereby, the heat generated in the switching element when energized is transmitted from the switching element to the mold part, and then reliably transmitted to the case. Thereby, it can suppress that the inside of an electrical-connection box becomes high temperature locally.

As embodiments of the present invention, the following embodiments are preferable.
In the case, it is preferable that a control board including a control unit for controlling on / off of the switching element is accommodated in a posture perpendicular to the relay module.

  According to the above aspect, the control board is arranged perpendicular to the relay module. As a result, since the area covered with the relay module is not formed on the surface of the control circuit, the wiring density of the control board can be improved as compared with the case where the relay module is arranged on the control board. As a result, the electrical junction box can be reduced in size.

  The relay module has a board connection terminal protruding from the mold part toward the control board and connected to the control board, and the board connection terminal has a bent stress relaxation part. Preferably it is formed.

  When the screw is screwed into the screw hole and the relay module is brought into close contact with the one side wall, the relay module may move in a direction approaching the one side wall. Then, there is a concern that force is applied to the control board via the board connection terminal protruding from the relay module. Therefore, in this aspect, a stress relaxation portion is formed on the substrate connection terminal. As a result, even when the relay module moves in a direction approaching the one side wall, the force applied to the control board by the stress relaxation portion is reduced, so that the force is suppressed from being applied to the control board. Thereby, damage to the control board and the like are suppressed.

  Preferably, the bus bar is arranged in a posture parallel to the one side wall in the mold part, and the switching element is connected to a surface of the bus bar on the side of the one side wall.

  According to said aspect, the heat which generate | occur | produced with the switching element at the time of electricity supply is transmitted to a mold part, and is more rapidly transmitted from this mold part to one side wall of a case. Thereby, it can further suppress that the inside of an electric junction box becomes high temperature locally.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that the inside of an electrical junction box becomes high temperature locally.

1 is an exploded perspective view showing an electrical junction box according to the present invention. Side view showing electrical junction box Bottom view showing electrical junction box Top view showing electrical junction box Top view showing the case The perspective view which shows a 1st relay module Rear view showing the first relay module Front view showing the first relay module Front view showing a connection structure between a bus bar and a switching element in the first relay module XX sectional view in FIG. XI-XI sectional view taken on the line in FIG. XII-XII line sectional view in FIG. The perspective view which shows a 2nd relay module Rear view showing the second relay module Front view showing the second relay module The front view which shows the connection structure of the bus-bar and switching element in a 2nd relay module XVII-XVII line sectional view in FIG. XVIII-XVIII line sectional view in FIG.

<Embodiment>
An embodiment in which the present invention is applied to an electric junction box 10 for a vehicle will be described with reference to FIGS. The electrical junction box 10 according to the present embodiment is disposed between a power source (not shown) and electrical components such as a lamp and a motor, and performs energization and disconnection of the electrical components. The electrical junction box 10 includes a case 12 having an opening 11 that opens upward, a cover 13 that is attached to the case 12 and closes the opening 11, a first relay module 14 that is accommodated in the case 12, and a first relay module 14. 2 relay module 15. In the following description, the upper side in FIG. 1 is the upper side, and the lower side is the lower side.

(Case 12 and cover 13)
The case 12 is made of a synthetic resin and has a substantially rectangular shape when viewed from above. As shown in FIG. 3, a connector housing 16 that opens downward is formed on the lower side of the case 12. A mating connector (not shown) is fitted into the connector housing 16. The mating connector is electrically connected to a power source, electrical components, etc. via a wire 26 harness (not shown).

  As shown in FIG. 1, a lock protrusion 17 that protrudes outward is formed on the side surface of the case 12. In a state where the opening 11 of the case 12 is closed by the cover 13, a lock receiving portion 18 that elastically engages with the lock protrusion 17 is provided on the side wall of the cover 13 at a position corresponding to the lock protrusion 17. Is formed. The cover 13 is assembled to the case 12 integrally by elastically engaging the lock protrusion 17 and the lock receiving portion 18.

  As shown in FIG. 5, a first housing part 19 in which the first relay module 14 is housed and a second housing part 20 in which the second relay module 15 is housed are recessed downward in the case 12. Is formed. A terminal insertion hole 21 for communicating the first housing part 19 and the second housing part 20 with the connector housing 16 is formed in the bottom walls of the first housing part 19 and the second housing part 20. The 1st accommodating part 19 and the 2nd accommodating part 20 are each formed in the position of the vicinity of the different side walls 40 and 140 of the case 12 along each side wall 40 and 140. As shown in FIG. The first accommodating portion 19 is formed in the vicinity of one side wall 40 that forms the long side of the case 12. Further, the second accommodating portion 20 is formed in the vicinity of the other side wall 140 that forms the long side of the case 12.

  The shape of the first accommodating portion 19 viewed from above is formed following the shape of the first relay module 14 viewed from above. Similarly, the shape of the second housing portion 20 viewed from above is formed following the shape of the second relay module 15 viewed from above.

(First relay module 14)
As shown in FIG. 6, in the first relay module 14 accommodated in the first accommodating portion 19, the switching element 23 connected to the bus bar 22 is surrounded by a molded portion 24 made of synthetic resin. The first relay module 14 has an elongated flat plate shape as a whole.

  The switching element 23 is a semiconductor relay. Further, as shown in FIG. 9, the bus bar 22 is electrically connected to a power source and connected to an input pad (not shown) formed on the bottom surface of the switching element 23, and the switching element 23. The output bus bar 22B is connected to the output pad 25 via the wire 26, and the control bus bar 22C is connected to the control pad 27 of the switching element 23 via the wire 26. The output pad 25 or the control pad 27 and each bus bar 22 are connected by wire bonding.

  The input bus bar 22A is formed to be elongated in the left-right direction in FIG. An input terminal 28 is formed on the input bus bar 22A so as to extend downward from approximately the center in the left-right direction in FIG. The input terminal 28 is inserted into the terminal insertion hole 21 and arranged in the connector housing 16. The input bus bar 22A has a board connection terminal 29 extending upward at the left end in FIG. The board connection terminal 29 is connected to a control board 30 described later.

  At a position below the input bus bar 22A, a plurality of output bus bars 22B are arranged side by side in the left-right direction in FIG. An output terminal 31 extending downward is formed on the output bus bar 22B. The output terminal 31 is inserted into the terminal insertion hole 21 and arranged in the connector housing 16. Further, among the output bus bars 22B, the output bus bars 22B located at the left and right ends in FIG. 9 are formed with board connection terminals 29 extending upward.

  A plurality of control bus bars 22C are arranged in the left-right direction in FIG. 9 at a position above the input bus bar 22A. A board connection terminal 29 extending upward is formed on the control bus bar 22C.

  The board connection part protrudes upward from the upper edge of the mold part 24. The board connection terminal 29 is bent twice at right angles and bent in a crank shape. This bent portion is the stress relaxation portion 32. Further, the output terminal 31 and the input terminal 28 protrude downward from the lower edge of the mold portion 24.

  As shown in FIG. 11, the mold portion 24 of the first relay module 14 is formed with a mounting portion 33 that protrudes to the side opposite to the side wall 40 of the case 12 while being accommodated in the first accommodating portion 19. Yes. The mounting portion 33 is placed on a mounting table 34 formed in the first housing portion 19 in a state where the first relay module 14 in the first housing portion 19 is housed. . As shown in FIG. 7, three mounting tables 34 are formed in the first housing portion 19. Correspondingly, three attachment portions 33 are formed in the first relay module 14. On the other hand, as shown in FIG. 8, the surface of the mold part 24 of the first relay module 14 opposite to the surface on which the attachment part 33 is formed is a flat surface.

  As shown in FIG. 11, a case-side inclined surface 35 is formed on the upper surface of the mounting table 34 so as to be inclined downward as it approaches the side wall 40 of the case 12. A screw hole 37 into which the screw 36 is screwed is formed in the case-side inclined surface 35 in the vertical direction.

  An insertion portion 38 through which the screw 36 is inserted is formed in the attachment portion 33 of the first relay module 14 so as to penetrate the attachment portion 33. In the present embodiment, the insertion portion 38 is formed by cutting out the protruding end portion of the attachment portion 33. Thereby, the insertion part 38 has comprised the U shape seeing from upper direction.

  A module-side inclined surface 39 that is aligned with the case-side inclined surface 35 is formed on the lower surface of the attachment portion 33. The module-side inclined surface 39 is inclined downward as it approaches the side wall 40 of the case 12. The upper surface of the attachment portion 33 is formed substantially horizontally, and the head portion of the screw 36 comes into contact with the upper portion.

  In a state where the mounting portion 33 is placed on the mounting table 34, the screw 36 inserted through the insertion portion 38 is screwed into the screw hole 37, so that the mold portion 24 of the first relay module 14 becomes the side wall of the case 12. The first relay module 14 is attached to the case 12 in a state of being in close contact with the inner surface of 40.

  As shown in FIG. 12, the bus bar 22 arranged inside the mold part 24 is arranged in parallel with the side wall 40 of the case 12. Of the plate surfaces of the bus bar 22, the switching element 23 is connected to the plate surface on the side wall 40 side of the case 12 to which the mold part 24 is in close contact.

(Second relay module 15)
On the other hand, as shown in FIG. 13, in the second relay module 15 accommodated in the second accommodating portion 20, the switching element 123 connected to the bus bar 122 is surrounded by a molded portion 124 made of synthetic resin. The second relay module 15 has a flat plate shape as a whole. The second relay module 15 is smaller than the first relay module 14.

  As shown in FIG. 16, the bus bar 122 of the second relay module 15 is electrically connected to the power source and connected to an input pad (not shown) formed on the bottom surface of the switching element 123. The output bus bar 122B is connected to the output pad 125 of the switching element 123 via the wire 126, and the control bus bar 122C is connected to the control pad 127 of the switching element 123 via the wire 126.

  The input bus bar 122A is formed extending in the left-right direction in FIG. The input bus bar 122A is formed with an input terminal 128 extending downward at the left end in FIG. The input terminal 128 is inserted into the terminal insertion hole 21 and arranged in the connector housing 16. Further, the input bus bar 122A is formed with a board connection terminal 129 extending upward at the left end in FIG.

  At a position below the input bus bar 122A, a plurality of output bus bars 122B are arranged side by side in the left-right direction in FIG. An output terminal 131 extending downward is formed on the output bus bar 122B. The output terminal 131 is inserted into the terminal insertion hole 21 and arranged in the connector housing 16.

  Further, a plurality of control bus bars 122C are arranged in the left-right direction in FIG. 16 at a position above the input bus bar 122A. A board connection terminal 129 extending upward is formed on the control bus bar 122C.

  The board connection terminal 129 protrudes upward from the upper edge of the mold part 124. The board connection terminal 129 is bent at a right angle twice and bent in a crank shape. This bent portion is the stress relaxation portion 132. In addition, an output terminal 131 and an input terminal 128 protrude downward from the lower edge of the mold portion 124.

  As shown in FIG. 12, the mold part 124 of the second relay module 15 is provided with an attachment part 133 that protrudes to the opposite side of the side wall 140 of the case 12 while being accommodated in the second accommodation part 20. Yes. The mounting portion 133 is placed on a mounting table 134 formed in the second housing portion 20 in a state where the second relay module 15 is housed in the second housing portion 20. . As shown in FIG. 14, one mounting table 134 is formed in the second storage unit 20. Correspondingly, one attachment portion 133 is formed in the second relay module 15. On the other hand, as shown in FIG. 15, the surface of the mold portion 124 of the second relay module 15 opposite to the surface on which the mounting portion 133 is formed is a flat surface.

  As shown in FIG. 12, a case-side inclined surface 135 that is inclined downward as it approaches the side wall 140 of the case 12 is formed on the upper surface of the mounting table 134. A screw hole 137 into which the screw 136 is screwed is formed in the case-side inclined surface 135 in the vertical direction.

  An insertion part 138 through which the screw 136 is inserted is formed in the attachment part 133 of the second relay module 15 so as to penetrate the attachment part 133. In the present embodiment, the insertion portion 138 is formed by cutting out the protruding end portion of the attachment portion 133. Thereby, the insertion part 138 has comprised the U shape seeing from upper direction.

  A module-side inclined surface 139 that is aligned with the case-side inclined surface 135 is formed on the lower surface of the attachment portion 133. The module-side inclined surface 139 is inclined downward as it approaches the side wall 140 of the case 12. The upper surface of the attachment portion 133 is formed substantially horizontally, and the head of the screw 136 is in contact with the upper portion.

  In a state where the mounting portion 133 is mounted on the mounting table 134, the screw 136 inserted through the insertion portion 138 is screwed into the screw hole 137, so that the mold portion 124 of the second relay module 15 becomes the side wall of the case 12. The second relay module 15 is attached to the case 12 while being in close contact with the inner surface of 140.

  The bus bar 122 disposed inside the mold part 124 is disposed in parallel with the side wall 140 of the case 12. Of the plate surfaces of the bus bar 22, the switching element 123 is connected to the plate surface on the side wall 140 side of the case 12 to which the mold part 124 is in close contact.

(Control board 30)
As shown in FIG. 12, in the case 12, the switching element 23 disposed on the first relay module 14 and the second relay module 15 is turned on and off at a position above the first relay module 14 and the second relay module 15. A control board 30 on which a microcomputer 41 (corresponding to a control unit described in claims) is mounted is accommodated in a posture perpendicular to the first relay module 14 and the second relay module 15. The microcomputer 41 is mounted on the lower surface of the control board 30.

  As shown in FIG. 1, the control board 30 has a rectangular shape when viewed from above. The control board 30 has conductive paths (not shown) formed on both the front and back surfaces of the insulating board by a printed wiring technique. An electronic component 42 is mounted on the conductive path. Positioning pins 43 projecting upward are formed in the case 12, and pin insertion holes 44 through which the positioning pins 43 are inserted are formed in the control board 30.

  As shown in FIG. 18, the case 12 is formed with an escape space 45 for allowing the electronic component 42 mounted on the back surface of the control board 30 to escape. Thereby, the electrical junction box 10 is made low-profile.

  The control board 30 is formed with a screw insertion hole 46 through which the screw 36 is inserted. The case 12 is formed with a screw hole 51 into which the screw 50 inserted through the screw insertion hole 46 is screwed. The control board 30 is attached to the case 12 by screwing the screw 50 into the screw hole 51.

  As shown in FIG. 1, a plurality of through holes 47 are formed in the control board 30. Board connection terminals 29 and 129 formed so as to protrude from the first relay module 14 and the second relay module 15 toward the control board 30 are inserted into the through holes 47, and the control board 30 is formed by known flow soldering. It is connected to the conductive path.

  Further, one end of a plurality of rod-shaped male tabs 48 is inserted into the through hole 47 of the control board 30 and is soldered by flow soldering. The male tab 48 is fixed to the pedestal 49 while being penetrated by the pedestal 49. The other end of the male tab 48 is disposed in the connector housing 16.

(Function, effect)
Then, the effect | action and effect of this embodiment are demonstrated. First, the first relay module 14 is inserted into the first housing portion 19 of the case 12 from above. Since the shape of the first accommodating portion 19 viewed from above is formed following the shape of the first relay module 14 viewed from above, the first relay module 14 can be easily inserted into the first accommodating portion 19. be able to.

  When the first relay module 14 is accommodated in the first accommodating portion 19, the output terminal 31 and the input terminal 28 that protrude downward from the lower end of the first relay module 14 are inserted into the terminal insertion hole 21, and the connector It protrudes into the housing 16.

  The attachment portion 33 of the first relay module 14 is placed on the upper surface of the placement table 34 of the first housing portion 19. The module-side inclined surface 39 of the first relay module 14 and the case-side inclined surface 35 of the first accommodating portion 19 are in contact with each other in the up-down direction in a aligned state.

  The screw 36 is inserted from above into the insertion part 38 formed in the attachment part 33 of the first relay module 14. Thereafter, the screw 36 is screwed into a screw hole 37 formed in the case-side inclined surface 35 of the mounting table 34.

  Then, the mounting portion 33 of the first relay module 14 is pressed against the mounting table 34 from above. Thus, the first relay module 14 slides along the case-side inclined surface 35 of the mounting table 34 so as to approach the side wall 40 of the case 12. At this time, since the insertion part 38 of the attachment part 33 has a substantially U shape with the side opposite to the side wall 40 of the case 12 cut out, interference between the screw 36 and the insertion part 38 is suppressed. As a result, the first relay module 14 can approach the side wall 40 of the case 12.

  By sliding the first relay module 14 so as to approach the side wall 40 of the case 12, the mold part 24 of the first relay module 14 is pressed against the inner surface of the side wall 40 of the case 12. As a result, the mold part 24 comes into close contact with the side wall 40 of the case 12. As described above, the first relay module 14 is fixed to the first housing portion 19 of the case 12.

  Similarly to the above, the second relay module 15 is inserted into the second housing part 20 of the case 12, and the second relay module 15 is screwed to the mounting table 134 of the second housing part 20. Thereby, the mold part 124 of the second relay module 15 is fixed to the case 12 in a state of being in close contact with the inner surface of the side wall 140 of the case 12. In addition, the description which overlaps with the attachment process of the 1st relay module 14 is abbreviate | omitted.

  Subsequently, the control board 30 is accommodated in the case 12 from above the first relay module 14 and the second relay module 15. The control board 30 is moved downward while aligning the board connection terminals 29 and 129 protruding upward from the upper edges of the first relay module 14 and the second relay module 15 with the through holes 47 formed in the control board 30. Let Further, the control board 30 is moved downward while the positioning pins 43 of the case 12 are inserted into the pin insertion holes 44 of the control board 30.

  After the control board 30 is arranged at a predetermined position in the case 12, the screw 50 is inserted into the screw insertion hole 46 of the control board 30 and screwed into the screw hole 51 of the case 12. As a result, the control board 30 is fixed to the case 12. Thereafter, the substrate connection terminal 29 and the through hole 47 are flow soldered. At this time, since the microcomputer 41 is connected to the lower surface of the control board 30, the microcomputer 41 can be protected from the heat of the flow soldering process.

  Subsequently, the cover 13 is assembled from above the case 12. The cover 13 and the case 12 are assembled together by the lock receiving portion 18 of the cover 13 being elastically engaged with the lock protrusion 17 of the case 12. Thereby, the electrical junction box 10 is completed. In the present embodiment, the configuration of the electrical junction box 10 has been described with reference to the vertical direction in FIG. 1, but the electrical junction box 10 can be arranged in any posture in the vehicle.

  According to the present embodiment, when the screw 36 is screwed into the screw hole 37, the first relay module 14 and the second relay module 15 are pressed against the side walls 40 and 140 of the case 12, respectively. The mold parts 24 and 124 of the first relay module 14 and the second relay module 15 are in close contact with the side walls 40 and 140 of the case 12. Thereby, the heat generated in the switching elements 23 and 123 during energization is reliably transmitted to the case 12 after being transmitted from the switching elements 23 and 123 to the mold parts 24 and 124. Thereby, it can suppress that the inside of the electrical junction box 10 becomes high temperature locally.

  Further, according to the present embodiment, in the case 12, the control board 30 including the microcomputer 41 that controls on / off of the switching elements 23 and 123 is perpendicular to the first relay module 14 and the second relay module 15. Contained in posture. As a result, since the area covered with the first relay module 14 and the second relay module 15 is not formed on the surface of the control board 30, the first relay module 14 or the second relay module 15 is superimposed on the control board 30. The wiring density of the control board 30 can be improved as compared with the case of arranging As a result, the electrical junction box 10 can be reduced in size.

  In addition, according to the present embodiment, the first relay module 14 and the second relay module 15 protrude from the mold parts 24 and 124 toward the control board 30 and are connected to the control board 30. The board connection terminals 29 and 129 are formed with stress relaxation portions 32 and 132 formed by bending. Accordingly, when the first and second relay modules 15 and 15 are brought into close contact with the side walls 40 and 140 of the case 12 by screwing the screws 36 and 136 into the screw holes 37 and 137, the first relay module 14 and Even if the second relay module 15 slides so as to approach the side walls 40 and 140 of the case 12, the force applied to the control board 30 by the stress relaxation portions 32 and 132 is alleviated. Adding is suppressed. Thereby, damage etc. of the control board 30 are suppressed.

  More specifically, the tips of the board connection terminals 29 and 129 are flow soldered in a state where they are inserted into through holes 47 formed in the control board 30. Since the stress relaxation portions 32 and 132 are formed on the board connection terminals 29 and 129, it is possible to suppress a force from being applied to a soldered portion between the board connection terminals 29 and 129 and the control board 30. As a result, breakage of a soldered portion formed between the board connection terminals 29 and 129 and the control board 30 is suppressed, so that the board connection terminals 29 and 129 and the control board 30 are electrically connected. Reliability can be improved.

  Further, when the mating connector is fitted in or detached from the connector housing 16, force may be applied from the mating connector to the input terminals 28 and 128 and the output terminals 31 and 131. There is a concern that this force is transmitted to the board connection terminals 29 and 129 via the first module 14 or the second module 15. Even in such a case, the stress transmitted to the substrate connection terminals 29 and 129 can be relaxed by the stress relaxation portions 32 and 132. As a result, it is possible to suppress stress from being applied to the soldered portion between the board connection terminals 29 and 129 and the control board 30.

  Further, according to the present embodiment, the bus bars 22 and 122 are arranged in a posture parallel to the side walls 40 and 140 of the case 12 in the mold parts 24 and 124, and the switching elements 23 and 123 are the plates of the bus bars 22 and 122. Of the surfaces, the mold parts 24 and 124 are connected to the surfaces on the side walls 40 and 140 side of the case 12 in close contact. As a result, the heat generated in the switching elements 23 and 123 during energization is transmitted to the mold parts 24 and 124, and from the mold parts 24 and 124 to the side walls 40 and 140 of the case 12 in close contact with the mold parts 24 and 124. Will be communicated more quickly. Thereby, it can further suppress that the inside of electric junction box 10 becomes high temperature locally.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the present embodiment, the insertion portions 38 and 138 are formed by notching the attachment portions 33 and 133, but the present invention is not limited thereto, and the insertion portions 38 and 138 are formed on the side walls 40 and 140. It may be a long hole formed extending in an orthogonal direction.
(2) In the present embodiment, two relay modules 14 and 15 are accommodated in one case 12, but the present invention is not limited to this, and one relay module is accommodated in one case 12. It is good also as a structure and it is good also as a structure in which three or more relay modules are accommodated.
(3) The stress relaxation portions 32 and 132 formed in the substrate connection portion may be omitted.
(4) In the present embodiment, the switching elements 23 and 123 are connected to the plate surfaces on the side walls 40 and 140 side of the case 12 with which the mold parts 24 and 124 are in close contact, of the plate surfaces of the bus bars 22 and 122. However, the switching elements 23 and 123 may be connected to the plate surface opposite to the side walls 40 and 140 of the case 12 with which the mold parts 24 and 124 are in close contact, of the plate surfaces of the bus bars 22 and 122. Good.
(5) In this embodiment, the microcomputer 41 is used as the control unit. However, the present invention is not limited to this, and the control unit may be configured by a control circuit formed by the electronic components 42 mounted on the control board 30. Good.
(6) In the present embodiment, the board connection terminals 29 and 129 are flow soldered to the control board 30, but the present invention is not limited to this. For example, in the through hole 47 formed in the control board 30. It may be configured to be press-fitted, or may be configured to be reflow soldered to a conductive path formed on the control board 30.

DESCRIPTION OF SYMBOLS 10 ... Electrical junction box 11 ... Opening part 12 ... Case 13 ... Cover 14 ... 1st relay module (relay module)
15 ... Second relay module (relay module)
DESCRIPTION OF SYMBOLS 22 ... Bus bar 23 ... Switching element 24 ... Mold part 29 ... Board | substrate connection terminal 30 ... Control board 32 ... Stress relaxation part 33 ... Mounting part 34 ... Mounting stand 35 ... Case side inclined surface 36 ... Screw 37 ... Screw hole 38 ... Insertion part 39 ... Module side inclined surface 40 ... Side wall 41 ... Microcomputer (control unit)
DESCRIPTION OF SYMBOLS 122 ... Bus bar 123 ... Switching element 124 ... Mold part 129 ... Board | substrate connection terminal 130 ... Control board 132 ... Stress relaxation part 133 ... Mounting part 134 ... Mounting stand 135 ... Case side inclined surface 136 ... Screw 137 ... Screw hole 138 ... Insertion part 139 ... Module side inclined surface 140 ... Side wall

Claims (4)

A relay comprising a case having an opening opening upward, a cover for closing the opening of the case, and a switching element housed in the case and connected to the bus bar surrounded by a mold portion made of synthetic resin An electrical junction box comprising a module,
A mounting table on which the relay module is mounted is formed in the vicinity of one side wall of the case, and a case-side inclined surface inclined downward as approaching the one side wall is formed on the upper surface of the mounting table. Formed, and the case side inclined surface is formed with a screw hole into which a screw is screwed in the vertical direction,
The mold part is formed with an attachment part that is attached to the mounting table, and the lower surface of the attachment part is formed with a module-side inclined surface that is aligned with the case-side inclined surface. An insertion portion through which the screw is inserted is formed through the attachment portion at a position corresponding to the screw hole in a state where the attachment portion is placed on the mounting table.
The electrical connection in which the mold part is brought into close contact with the one side wall when the screw inserted into the insertion part is screwed into the screw hole in a state where the attachment part is placed on the mounting table. box. The electrical connection box according to claim 1, wherein a control board including a control unit that controls on / off of the switching element is accommodated in the case in a posture perpendicular to the relay module. The relay module has a board connection terminal protruding from the mold part toward the control board and connected to the control board, and the board connection terminal has a bent stress relaxation part. The electrical junction box according to claim 2 formed. The said bus bar is distribute | arranged with the attitude | position parallel to the said one side wall in the said mold part, The said switching element is connected to the surface of the said one side wall side among the said bus bars. The electrical junction box according to claim 1.

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