JP2007228757A - Electrical connection box - Google Patents

Electrical connection box Download PDF

Info

Publication number
JP2007228757A
JP2007228757A JP2006049118A JP2006049118A JP2007228757A JP 2007228757 A JP2007228757 A JP 2007228757A JP 2006049118 A JP2006049118 A JP 2006049118A JP 2006049118 A JP2006049118 A JP 2006049118A JP 2007228757 A JP2007228757 A JP 2007228757A
Authority
JP
Japan
Prior art keywords
board
substrate
semiconductor relay
wiring board
ecu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006049118A
Other languages
Japanese (ja)
Inventor
Yutaka Kamimura
豊 神村
Hisao Honma
久雄 本間
Shin Hasegawa
慎 長谷川
Masami Takase
正己 高瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2006049118A priority Critical patent/JP2007228757A/en
Publication of JP2007228757A publication Critical patent/JP2007228757A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To achieve compaction or to sustain suitable durability by arranging a semiconductor relay and its control section rationally. <P>SOLUTION: In the electrical connection box 1, the substrate is formed of a wiring board 2 where substrate connectors 7, 7 are arranged oppositely along a pair of parallel end edges and a semiconductor relay 3 is arranged between the substrate connectors 7, 7, and an ECU substrate 4 where a control section 5 is arranged on the upper surface and a terminal portion 12 connected electrically with the wiring board 2, is provided on the lower surface along a pair of parallel end edges. The ECU substrate 4 is attached onto the wiring board 2 between the substrate connectors 7, 7 in such a direction as the terminal portions 12, 12 intersect the substrate connectors 7, 7 perpendicularly. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、自動車に搭載される電気接続箱に関するものである。   The present invention relates to an electrical junction box mounted on an automobile.

自動車用の電気接続箱は、車載バッテリの電源と、電気負荷となるエンジン用電子制御ユニットやヘッドライト等の補器等との間を導通/遮断して、各電子制御ユニット(以下「ECU」と略称する。)への電力供給を制御する周知の装置である。例えば特許文献1には、カバー内に、電線が配索された布線プレートとバスバーが配設される配線板とによって所望の回路が形成される回路部と、この回路部に接続され、半導体リレーモジュールやその半導体リレーモジュールを制御する制御部を搭載した制御基板とからなる電気接続箱が開示されている。   The electric junction box for automobiles connects / disconnects between the power source of the on-vehicle battery and the electronic control unit for engines and auxiliary devices such as headlights, etc., which become electric loads, and each electronic control unit (hereinafter referred to as “ECU”). This is a well-known device for controlling the power supply to the abbreviation. For example, in Patent Document 1, a circuit unit in which a desired circuit is formed in a cover by a wiring plate in which wires are arranged and a wiring board in which a bus bar is arranged is connected to the circuit unit. An electrical junction box comprising a relay module and a control board on which a control unit for controlling the semiconductor relay module is mounted is disclosed.

特開2003−18725号公報JP 2003-18725 A

この電気接続箱においては、同じ基板上に半導体リレーとその制御部とが配置されるため、制御基板の平面形状が大きくなり、全体のコンパクト化を阻害する。また、半導体リレーの発熱によって制御部を構成するマイコン等の電子部品が影響を受けやすく、耐久性の低下にも繋がる。   In this electrical junction box, since the semiconductor relay and its control unit are arranged on the same board, the planar shape of the control board becomes large, and the overall compactness is hindered. In addition, electronic components such as a microcomputer constituting the control unit are easily affected by heat generated by the semiconductor relay, leading to a decrease in durability.

そこで、本発明は、半導体リレーとその制御部とを合理的に配置して、コンパクト化や好適な耐久性の維持が達成可能な電気接続箱を提供することを目的としたものである。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electrical junction box in which a semiconductor relay and its control unit are rationally arranged to achieve compactness and suitable durability.

上記目的を達成するために、請求項1に記載の発明は、半導体リレーと、その半導体リレーを制御する制御部と、ワイヤハーネスと接続される基板コネクタとを基板に搭載した電気接続箱であって、基板を、複数の基板コネクタが平行な一対の端縁に沿って対向状に配置され、半導体リレーが基板コネクタの間に配置される第1の基板と、上面又は下面に制御部が配置され、下面に、第1の基板と電気的接続される端子部が平行な一対の端縁に沿って設けられて、第1の基板よりも小さい第2の基板とで形成し、第2の基板を、対向する基板コネクタの間で、端子部が基板コネクタと直交する向きで第1の基板上に組み付けたことを特徴とするものである。
請求項2に記載の発明は、請求項1の目的に加えて、製造工程の合理化を達成するために、第1の基板上の半導体リレー及び基板コネクタと、第2の基板の端子部とが夫々第1の基板上に表面実装される構成としたものである。
In order to achieve the above object, an invention according to claim 1 is an electrical junction box in which a semiconductor relay, a control unit for controlling the semiconductor relay, and a board connector connected to the wire harness are mounted on the board. The board is arranged so as to be opposed along a pair of parallel edges of the plurality of board connectors, and the semiconductor relay is arranged between the board connectors, and the control unit is arranged on the upper surface or the lower surface. A terminal portion electrically connected to the first substrate is provided on the lower surface along a pair of parallel edges, and is formed with a second substrate smaller than the first substrate; The board is assembled on the first board between the board connectors facing each other so that the terminal portions are perpendicular to the board connector.
In order to achieve the rationalization of the manufacturing process in addition to the object of the first aspect, the invention according to the second aspect includes a semiconductor relay and a board connector on the first board, and a terminal portion of the second board. Each is configured to be surface-mounted on the first substrate.

請求項1に記載の発明によれば、半導体リレーとその制御部とを上下2つの基板に分けて合理的に配置でき、全体のコンパクト化が可能となる。特に、第2の基板の向きの設定により、第1の基板上に実装部品があってもリフローの際に熱風がムラなく行き渡るため、基板を重ねても組み付けの信頼性は確保できる。
また、第2の基板の制御部が半導体リレーの発熱による影響を受けないので、熱的負荷が小さくなって耐久性の維持が期待できる上、発熱量が大きい第1の基板をメタルコア基板として均熱化を図る一方、第2の基板を安価なガラエポ基板で形成して低コスト化を図るといった合理的な選択も可能となる。
請求項2に記載の発明によれば、請求項1の効果に加えて、リフローによって第1の基板上の各実装部品が一度に電気的接続可能となり、製造工程の合理化が図られる。
According to the first aspect of the present invention, the semiconductor relay and its control unit can be rationally arranged by dividing it into two upper and lower substrates, and the overall size can be reduced. In particular, by setting the orientation of the second board, even if there are mounted components on the first board, the hot air is distributed evenly during reflow, so that the assembly reliability can be ensured even if the boards are stacked.
In addition, since the control unit of the second board is not affected by the heat generated by the semiconductor relay, the thermal load is reduced and the durability can be expected to be maintained. In addition, the first board having a large heat generation amount is used as the metal core board. On the other hand, it is possible to rationally select the second substrate with an inexpensive glass-epoxy substrate for cost reduction while achieving heat.
According to the second aspect of the present invention, in addition to the effect of the first aspect, each mounting component on the first board can be electrically connected at a time by reflow, and the manufacturing process can be rationalized.

以下、本発明の実施の形態を図面に基づいて説明する。
図1は、本発明の電気接続箱の一例を示す六面図、図2は斜視図、図3は基板の分解斜視図である。電気接続箱1は、車載バッテリの電源と、電気負荷となる各ECUや補器との間を導通/遮断して、各ECUや補器への電力供給を制御する周知の装置であるが、ここでは、半導体リレー3,3・・が搭載されて所定の回路が形成される第1の基板としての平面矩形状の配線基板2上に、制御マイコン等の電子部品によって制御部5が構成される第2の基板としてのECU基板4が組み付けられる形態となっている。配線基板2の下面には、外部から電源が供給されるバスバー6が組み付けられ、上下両面には、外部のECUを繋ぐワイヤハーネスのコネクタが接続される基板コネクタ7,7・・が組み付けられている。これらの構成部は、ワイヤハーネスやヒューズの接続部等を除いて全体が図示しない上下カバーによって覆われる。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a hexahedral view showing an example of the electrical junction box of the present invention, FIG. 2 is a perspective view, and FIG. 3 is an exploded perspective view of a substrate. The electrical junction box 1 is a well-known device that controls the power supply to each ECU and auxiliary device by conducting / interrupting between the power source of the on-vehicle battery and each ECU and auxiliary device serving as an electric load. Here, the control unit 5 is configured by electronic parts such as a control microcomputer on a planar rectangular wiring board 2 as a first board on which the semiconductor relays 3, 3... Are mounted to form a predetermined circuit. The ECU board 4 as the second board is assembled. A bus bar 6 to which power is supplied from the outside is assembled on the lower surface of the wiring board 2, and board connectors 7, 7... To which a connector of a wire harness for connecting an external ECU is connected are assembled on the upper and lower surfaces. Yes. These components are entirely covered by an upper and lower cover (not shown) except for a wire harness, a fuse connecting portion, and the like.

基板コネクタ7は、ワイヤハーネスのコネクタが差し込み接続される差込孔を配線基板2の端縁側に開口させた合成樹脂製で横長箱状のコネクタハウジング8と、そのコネクタハウジング8の閉塞側に設けられて配線基板2の回路に電気的接続される複数の端子9,9・・とからなり、ここでは、配線基板2の上下両面において、配線基板2の互いに平行な一対の端縁に沿って夫々対向状に組み付けられている。一方、バスバー6は、長手方向の端縁に複数のヒューズ端子10,10・・を一体形成して、これと対になるヒューズ端子11と共に、配線基板2の下面側で、基板コネクタ7と直交する一方の端縁に沿って組み付けられている。   The board connector 7 is made of a synthetic resin horizontally long box-shaped connector housing 8 in which an insertion hole into which the connector of the wire harness is inserted and connected is opened on the edge side of the wiring board 2, and is provided on the closing side of the connector housing 8. And a plurality of terminals 9, 9... Electrically connected to the circuit of the wiring board 2. Here, along the pair of parallel edges of the wiring board 2 on the upper and lower surfaces of the wiring board 2. Each is assembled in an opposing manner. On the other hand, the bus bar 6 is integrally formed with a plurality of fuse terminals 10, 10... At the edge in the longitudinal direction, and together with the fuse terminals 11 paired therewith, is orthogonal to the board connector 7 on the lower surface side of the wiring board 2. It is assembled along one edge.

そして、ECU基板4は、配線基板2よりも一回り小さい矩形状を呈し、下面には、互いに平行な一対の端縁に沿って端子部12,12が設けられて、各端子部12内で下向きに突設された複数のL型端子13,13・・が、配線基板2上の回路に夫々電気的接続されている。ここで、ECU基板4は、基板コネクタ7,7の間で、端子部12が基板コネクタ7と直交する向きに配置されている。
なお、ここでは配線基板2がメタルコア基板、ECU基板4がガラエポ基板となっている。また、配線基板2上の半導体リレー3及び基板コネクタ7、ECU基板4の端子部12は、夫々リフローによって配線基板2に半田付けされる表面実装となっている。よって、基板コネクタ7のコネクタハウジング8とECU基板4の端子部12との間には、リフローの際に熱風が通過できるように所定の隙間が確保されている。
The ECU board 4 has a rectangular shape that is slightly smaller than the wiring board 2, and the lower surface is provided with terminal portions 12 and 12 along a pair of edges parallel to each other. A plurality of L-shaped terminals 13, 13... Projecting downward are electrically connected to circuits on the wiring board 2. Here, the ECU board 4 is arranged between the board connectors 7 and 7 so that the terminal portions 12 are orthogonal to the board connector 7.
Here, the wiring board 2 is a metal core board, and the ECU board 4 is a glass epoxy board. Further, the semiconductor relay 3 and the board connector 7 on the wiring board 2 and the terminal portion 12 of the ECU board 4 are each surface-mounted to be soldered to the wiring board 2 by reflow. Therefore, a predetermined gap is secured between the connector housing 8 of the board connector 7 and the terminal portion 12 of the ECU board 4 so that hot air can pass during reflow.

以上の如く構成された電気接続箱1は、バスバー6に供給された電気は、配線基板2上の回路を介してECU基板4に流れる。ECU基板4は、各半導体リレー3の電流値を制御して各半導体リレー3をスイッチング動作させて、バスバー6に組み付けられたヒューズを介して外部の各ECUへの電力供給を制御するものとなる。このとき、ECU基板4は、半導体リレー3が搭載される配線基板2と別体となっているため、半導体リレー3が動作時に発熱してもECU基板4上の制御部5が影響を受けることがない。   In the electrical junction box 1 configured as described above, the electricity supplied to the bus bar 6 flows to the ECU board 4 via the circuit on the wiring board 2. The ECU board 4 controls the current value of each semiconductor relay 3 to perform switching operation of each semiconductor relay 3 to control power supply to each external ECU via a fuse assembled to the bus bar 6. . At this time, since the ECU board 4 is separate from the wiring board 2 on which the semiconductor relay 3 is mounted, even if the semiconductor relay 3 generates heat during operation, the control unit 5 on the ECU board 4 is affected. There is no.

このように、上記形態の電気接続箱1によれば、基板を、基板コネクタ7,7が平行な一対の端縁に沿って対向状に配置され、半導体リレー3が基板コネクタ7,7の間に配置される配線基板2と、上面に制御部5が配置され、下面に、配線基板2と電気的接続される端子部12,12が平行な一対の端縁に沿って設けられて、配線基板2よりも小さいECU基板4とで形成し、ECU基板4を、対向する基板コネクタ7,7の間で、端子部12,12が基板コネクタ7,7と直交する向きで配線基板2上に組み付けたことで、半導体リレー3とその制御部5とを上下2つの基板に分けて合理的に配置でき、全体のコンパクト化が可能となる。特に、ECU基板4の向きにより、リフローの際に各実装部品へ熱風がムラなく行き渡るため、基板を重ねても組み付けの信頼性は確保できる。
また、ECU基板4の制御部5が半導体リレー3の発熱による影響を受けないので、熱的負荷が小さくなって耐久性の維持が期待できる上、発熱量が大きい配線基板2をメタルコア基板として均熱化を図る一方、ECU基板4を安価なガラエポ基板で形成して低コスト化を図るといった合理的な選択も可能となる。
Thus, according to the electrical junction box 1 of the said form, a board | substrate is arrange | positioned in opposition along a pair of edge where the board connectors 7 and 7 are parallel, and the semiconductor relay 3 is between board | substrate connectors 7 and 7. The wiring board 2 disposed on the upper surface, the control unit 5 is disposed on the upper surface, and the terminal portions 12 and 12 electrically connected to the wiring substrate 2 are provided on the lower surface along a pair of parallel edges, The ECU board 4 is formed on the wiring board 2 between the opposing board connectors 7 and 7 so that the terminal portions 12 and 12 are orthogonal to the board connectors 7 and 7. By assembling, the semiconductor relay 3 and its control unit 5 can be rationally arranged by dividing them into two upper and lower substrates, and the whole can be made compact. In particular, depending on the orientation of the ECU board 4, the hot air is evenly distributed to each mounted component during reflow, so that the reliability of assembly can be ensured even if the boards are stacked.
In addition, since the control unit 5 of the ECU board 4 is not affected by the heat generated by the semiconductor relay 3, it is possible to reduce the thermal load and maintain durability. In addition, the wiring board 2 that generates a large amount of heat is used as the metal core board. On the other hand, it is possible to make a rational selection by reducing the cost by forming the ECU board 4 with an inexpensive glass epoxy board while achieving heat.

特にここでは、配線基板2上の半導体リレー3及び基板コネクタ7と、ECU基板4の端子部12とが夫々配線基板2上に表面実装されることで、リフローによって配線基板2上の各実装部品が一度に電気的接続可能となり、製造工程の合理化が図られる。   In particular, here, the semiconductor relay 3 and the board connector 7 on the wiring board 2 and the terminal portion 12 of the ECU board 4 are surface-mounted on the wiring board 2, so that each mounted component on the wiring board 2 is reflowed. Can be electrically connected at a time, thereby streamlining the manufacturing process.

なお、配線基板の端縁に配置される基板コネクタは、上記形態のように一つずつ配置するものに限らず、端縁に複数並設されるものであっても差し支えない。
また、第1の基板上の部品は必ずしも全て実装部品とする必要はなく、一部をスルーホール接続等の他の接続形態で組み付けるようにしても良い。
さらに、第1及び第2の基板は、上記形態のような平面矩形状に限らず、基板コネクタや端子部が対向状に組み付けられる一対の平行な端縁を有するものであれば、平面L字状等の他の平面形状を採用することは可能である。また、制御部は第2の基板の下面に設けることもできる。
その他、基板コネクタの端子形状や第2の基板の端子部の端子形状等も、適宜設計変更して差し支えない。
また、本実施形態で表面実装(リフロー)した各箇所、例えば端子部12等においては、L型端子13に代えてプレスフィット端子を用いることもできる。
In addition, the board | substrate connector arrange | positioned at the edge of a wiring board is not restricted to what is arrange | positioned one by one like the said form, A plurality may be arranged in parallel at an edge.
Further, all the components on the first substrate are not necessarily mounted components, and some of them may be assembled in other connection forms such as through-hole connection.
Further, the first and second substrates are not limited to a flat rectangular shape as in the above-described form, and are flat L-shaped as long as they have a pair of parallel edges to which the board connector and the terminal portion are assembled in an opposing manner. It is possible to adopt other planar shapes such as a shape. The control unit can also be provided on the lower surface of the second substrate.
In addition, the terminal shape of the board connector, the terminal shape of the terminal portion of the second board, and the like may be appropriately changed in design.
Moreover, in each location surface-mounted (reflowed) by this embodiment, for example, the terminal part 12 grade | etc., It can replace with the L-shaped terminal 13 and can also use a press fit terminal.

電気接続箱の一例を示す六面図である。It is a 6-face drawing which shows an example of an electrical junction box. 電気接続箱の斜視図である。It is a perspective view of an electrical junction box. 電気接続箱の分解斜視図である。It is a disassembled perspective view of an electrical junction box.

符号の説明Explanation of symbols

1・・電気接続箱、2・・配線基板、3・・半導体リレー、4・・ECU基板、5・・制御部、7・・基板コネクタ、12・・端子部。
1 .... Electric junction box, 2 .... Wiring board, 3 .... Semiconductor relay, 4 .... ECU board, 5 .... Control part, 7 .... Board connector, 12 .... Terminal part.

Claims (2)

半導体リレーと、その半導体リレーを制御する制御部と、ワイヤハーネスと接続される基板コネクタとを基板に搭載した電気接続箱であって、
前記基板を、複数の前記基板コネクタが平行な一対の端縁に沿って対向状に配置され、前記半導体リレーが前記基板コネクタの間に配置される第1の基板と、
上面又は下面に前記制御部が配置され、下面に、前記第1の基板と電気的接続される端子部が平行な一対の端縁に沿って設けられて、前記第1の基板よりも小さい第2の基板とで形成し、
前記第2の基板を、対向する前記基板コネクタの間で、前記端子部が前記基板コネクタと直交する向きで前記第1の基板上に組み付けたことを特徴とする電気接続箱。
A semiconductor relay, a control unit for controlling the semiconductor relay, and a board connector to be connected to the wire harness, is an electrical connection box mounted on the board,
A plurality of the substrate connectors arranged in a facing manner along a pair of parallel edges, and the semiconductor relay is disposed between the substrate connectors;
The control unit is disposed on an upper surface or a lower surface, and terminal portions that are electrically connected to the first substrate are provided on the lower surface along a pair of parallel edges, and are smaller than the first substrate. With two substrates,
An electrical junction box, wherein the second board is assembled on the first board between the board connectors facing each other, with the terminal portion being orthogonal to the board connector.
第1の基板上の半導体リレー及び基板コネクタと、第2の基板の端子部とが夫々前記第1の基板上に表面実装される請求項1に記載の電気接続箱。
The electrical junction box according to claim 1, wherein the semiconductor relay and the board connector on the first board and the terminal portion of the second board are surface-mounted on the first board, respectively.
JP2006049118A 2006-02-24 2006-02-24 Electrical connection box Pending JP2007228757A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006049118A JP2007228757A (en) 2006-02-24 2006-02-24 Electrical connection box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006049118A JP2007228757A (en) 2006-02-24 2006-02-24 Electrical connection box

Publications (1)

Publication Number Publication Date
JP2007228757A true JP2007228757A (en) 2007-09-06

Family

ID=38549997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006049118A Pending JP2007228757A (en) 2006-02-24 2006-02-24 Electrical connection box

Country Status (1)

Country Link
JP (1) JP2007228757A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2224564A1 (en) * 2007-12-21 2010-09-01 Yazaki Corporation Junction block
DE112008003099T5 (en) 2007-11-21 2010-10-07 Sumitomo Wiring Systems, Ltd., Yokkaichi Electric distribution box for a vehicle
WO2011102468A1 (en) * 2010-02-19 2011-08-25 古河電気工業株式会社 Vehicle-mounted electric junction box, and circuit material and circuit unit to be used therefor
FR2982433A1 (en) * 2011-11-07 2013-05-10 Aton Systemes Connection device for connecting e.g. electronic components to computer of e.g. motor bus, has interface panel coupled to and uncoupled from connection panel by respectively assembling and disassembling multipoint and input connectors
JP7404309B2 (en) 2021-07-14 2023-12-25 矢崎総業株式会社 Energization control device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001016746A (en) * 1999-06-30 2001-01-19 Yazaki Corp Electric junction box
JP2004120837A (en) * 2002-09-24 2004-04-15 Honda Elesys Co Ltd Electronic control unit and method of manufacturing the same
JP2006006079A (en) * 2004-06-21 2006-01-05 Furukawa Electric Co Ltd:The Electrical junction box

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001016746A (en) * 1999-06-30 2001-01-19 Yazaki Corp Electric junction box
JP2004120837A (en) * 2002-09-24 2004-04-15 Honda Elesys Co Ltd Electronic control unit and method of manufacturing the same
JP2006006079A (en) * 2004-06-21 2006-01-05 Furukawa Electric Co Ltd:The Electrical junction box

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112008003099T5 (en) 2007-11-21 2010-10-07 Sumitomo Wiring Systems, Ltd., Yokkaichi Electric distribution box for a vehicle
US8310085B2 (en) 2007-11-21 2012-11-13 Sumitomo Wiring Systems, Ltd. Electrical junction box for vehicle
EP2224564A1 (en) * 2007-12-21 2010-09-01 Yazaki Corporation Junction block
EP2224564A4 (en) * 2007-12-21 2012-03-07 Yazaki Corp Junction block
US8587931B2 (en) 2007-12-21 2013-11-19 Yazaki Corporation Junction block
WO2011102468A1 (en) * 2010-02-19 2011-08-25 古河電気工業株式会社 Vehicle-mounted electric junction box, and circuit material and circuit unit to be used therefor
JP2011172392A (en) * 2010-02-19 2011-09-01 Furukawa Electric Co Ltd:The In-vehicle electrical junction box, circuit material used for the same, and circuit unit
FR2982433A1 (en) * 2011-11-07 2013-05-10 Aton Systemes Connection device for connecting e.g. electronic components to computer of e.g. motor bus, has interface panel coupled to and uncoupled from connection panel by respectively assembling and disassembling multipoint and input connectors
JP7404309B2 (en) 2021-07-14 2023-12-25 矢崎総業株式会社 Energization control device

Similar Documents

Publication Publication Date Title
JP4055662B2 (en) Electrical junction box
US20100231038A1 (en) Electrical junction box for vehicle
JP4868928B2 (en) Junction block
JP2009189193A (en) Electrical junction box
JP2007228757A (en) Electrical connection box
JP4234687B2 (en) Electrical junction box for automobiles
JP5806012B2 (en) Fuse block and electric junction box having the same
JP2011082390A (en) Circuit structure and electrical junction box
JP2007259571A (en) Electrical connection box for vehicle
JP2014180145A (en) Fuse block
JP2007043827A (en) Device layout structure and fuse circuitry used therewith
JP2007227169A (en) Bus bar and electrical junction box
JP5800605B2 (en) Electrical junction box
JP5367669B2 (en) Electrical junction box for vehicles
JP2006054931A (en) Electric connection box
JP5381617B2 (en) Electrical junction box
JP4720525B2 (en) Electrical junction box for automobile
JP5644223B2 (en) Electrical junction box
JP5531565B2 (en) Electrical junction box and method of manufacturing electrical junction box
JP2014217254A (en) Electrical junction box and electrical junction box assembly
JP5198198B2 (en) Electrical junction box
JP5582347B2 (en) Circuit structure and electrical junction box
JP2000134766A (en) Electrical connection box
JP2014023245A (en) Electronic unit
KR200458485Y1 (en) Power supply connector for junction box of vehicle

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081001

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100713

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100720

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101116