JP5216550B2 - Electrical junction box - Google Patents

Electrical junction box Download PDF

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JP5216550B2
JP5216550B2 JP2008298499A JP2008298499A JP5216550B2 JP 5216550 B2 JP5216550 B2 JP 5216550B2 JP 2008298499 A JP2008298499 A JP 2008298499A JP 2008298499 A JP2008298499 A JP 2008298499A JP 5216550 B2 JP5216550 B2 JP 5216550B2
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board
sub
case
junction box
electrical junction
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JP2010124660A (en
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学 橋倉
達哉 角田
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Description

本発明は、電気接続箱に関する。   The present invention relates to an electrical junction box.

従来より、車両に搭載されて車載電装品のスイッチングを実行する電気接続箱として、特許文献１に記載のものが知られている。このものは、ケースと、ケース内に配された回路基板と、を備える。ケースの壁部のうち、回路基板の板面と直交して位置する壁部の外面には、外部コネクタと接続するために構成されたコネクタ部が形成されている。コネクタ部内には端子の一方の端部が配されており、端子の他方の端部はケース内に導入された後、直角に曲げ形成されて回路基板に電気的に接続されている。
特開２００６−３４５６５６公報 Conventionally, the thing of patent document 1 is known as an electrical connection box mounted in a vehicle and performing switching of vehicle-mounted electrical equipment. This includes a case and a circuit board arranged in the case. Of the wall portion of the case, a connector portion configured to connect to an external connector is formed on the outer surface of the wall portion that is positioned orthogonal to the plate surface of the circuit board. One end of the terminal is disposed in the connector, and the other end of the terminal is bent into a right angle after being introduced into the case and electrically connected to the circuit board.
JP 2006-345656 A

外部コネクタをコネクタ部に接続したり、又は離脱させたりすると、外部コネクタに配された端子と、コネクタ部に配された端子との摩擦により、コネクタ部に配された端子には力が加わる。この力により、端子と回路基板との間の接続部分に力が加わる。すると、例えば端子と回路基板とが半田付けされている場合には、半田付け部分にクラックが発生する等により、端子と回路基板との間の電気的な接続信頼性が低下することが懸念される。同様に、回路基板に端子が圧入された場合や、端子の先端にプレスフィット端子を設けた場合等においても、端子と回路基板との間の電気的な接続信頼性が低下するおそれがある。   When the external connector is connected to or disconnected from the connector portion, a force is applied to the terminals disposed in the connector portion due to friction between the terminals disposed in the external connector and the terminals disposed in the connector portion. Due to this force, a force is applied to the connection portion between the terminal and the circuit board. Then, for example, when the terminal and the circuit board are soldered, there is a concern that the reliability of electrical connection between the terminal and the circuit board may decrease due to a crack occurring in the soldered portion. The Similarly, even when a terminal is press-fitted into the circuit board or when a press-fit terminal is provided at the tip of the terminal, the electrical connection reliability between the terminal and the circuit board may be reduced.

本発明は上記のような事情に基づいて完成されたものであって、端子金具の電気的な接続信頼性の低下が抑制された電気接続箱を提供することを目的とする。   This invention is completed based on the above situations, Comprising: It aims at providing the electrical connection box by which the fall of the electrical connection reliability of the terminal metal fitting was suppressed.

本発明は、電気接続箱であって、開口を有するケースと、前記ケースの側壁の内面に沿って前記ケース内に配された第１副基板と、前記ケースに組み付けられて前記ケースの開口を塞ぐと共に相手側部材と嵌合可能な嵌合部が外方に開口して形成された蓋部と、前記嵌合部内に一方の端部が配されて前記相手側部材と電気的に接続可能とされると共に他方の端部が前記ケース内に導入された端子金具と、前記ケース内に前記蓋部の内面に沿って配され、且つ前記端子金具の他方の端部と電気的に接続されると共に前記第１副基板と電気的に接続された第２副基板と、前記ケース内に配されて、前記ケースのうち前記開口と反対側に位置する壁部の内面と当接する第１当接部を有すると共に、前記端子金具に対して前記相手側部材を接続する方向の力が加えられたときに、前記第２副基板と当接する第２当接部を有する支持部材と、を備え、前記蓋部の内面は、前記端子金具に対して前記相手側部材を離脱させる方向の力が加えられたときに、前記第２副基板と当接する。   The present invention is an electrical connection box, a case having an opening, a first sub-board disposed in the case along an inner surface of a side wall of the case, and an opening of the case assembled to the case. A lid portion that is formed by opening a fitting portion that can be closed and fitted with a mating member to the outside, and one end portion is arranged in the fitting portion so that it can be electrically connected to the mating member. And the other end of the terminal fitting introduced into the case, the inner end of the lid being disposed along the inner surface of the lid, and electrically connected to the other end of the terminal fitting. And a second sub-board electrically connected to the first sub-board and a first contact disposed in the case and abutting against an inner surface of a wall portion located on the opposite side of the opening from the case. One having a contact portion and connecting the mating member to the terminal fitting And a support member having a second abutting portion that abuts against the second sub-board when the force is applied, and the inner surface of the lid portion separates the mating member with respect to the terminal fitting When a force in the direction to be applied is applied, it comes into contact with the second sub-board.

本発明によれば、相手側部材を接続する際に、相手側部材との摩擦によって端子金具に加えられる力は、端子金具が接続された第２副基板から支持部材を介して、ケースのうち開口と反対側に位置する壁部に伝達され、ケースで受けることができる。また、相手側部材を離脱させる際に、相手側部材との摩擦によって端子金具に加えられる力は、端子金具が接続された第２副基板から蓋部に伝達され、蓋部が組み付けられたケースで受けることができる。これにより、相手側部材の挿抜時に端子金具に加えられた力をケースで受けることができる。この結果、端子金具の電気的な接続信頼性を向上させることができる。   According to the present invention, when the mating member is connected, the force applied to the terminal fitting due to friction with the mating member is from the second sub-board to which the terminal fitting is connected via the support member, out of the case. It is transmitted to the wall located on the opposite side of the opening and can be received by the case. In addition, when the mating member is detached, the force applied to the terminal fitting by friction with the mating member is transmitted from the second sub-board to which the terminal fitting is connected to the lid, and the lid is assembled. Can be received at. Thereby, the force applied to the terminal fitting when the mating member is inserted and removed can be received by the case. As a result, the electrical connection reliability of the terminal fitting can be improved.

本発明の実施態様としては以下の態様が好ましい。
前記第１副基板及び前記第２副基板は、折り曲げ可能な主基板を第１折り曲げ部で折り曲げて一体に形成される構成としてもよい。 As embodiments of the present invention, the following embodiments are preferable.
The first sub-board and the second sub-board may be integrally formed by folding a foldable main board at a first folding section.

上記の構成によれば、第１副基板と第２副基板とを電気的に接続するための部材が不要となるので、部品点数を削減できる。   According to said structure, since the member for electrically connecting a 1st sub board | substrate and a 2nd sub board | substrate becomes unnecessary, a number of parts can be reduced.

前記ケース内には前記ケースのうち前記開口と反対側に位置する壁部の内面に沿って配されると共に前記第１副基板と電気的に接続される第３副基板が収容されていてもよい。   The case accommodates a third sub-board disposed along the inner surface of the wall located on the opposite side of the opening from the case and electrically connected to the first sub-board. Good.

上記の構成によれば、電気接続箱の配線密度を向上させることができる。   According to said structure, the wiring density of an electrical-connection box can be improved.

前記第１副基板及び前記第３副基板は、折り曲げ可能な主基板を第２折り曲げ部で折り曲げて一体に形成される構成としてもよい。   The first sub-board and the third sub-board may be integrally formed by folding a foldable main board at a second folding section.

上記の構成によれば、第１副基板と第３副基板とを電気的に接続するための部材が不要となるので、部品点数を削減できる。   According to said structure, since the member for electrically connecting a 1st sub board | substrate and a 3rd sub board | substrate becomes unnecessary, a number of parts can be reduced.

前記ケース内には、前記第１副基板の板面と実質的に平行に配されると共に、前記第３副基板と電気的に接続される第４副基板が収容されていてもよい。   The case may contain a fourth sub-board that is disposed substantially parallel to the plate surface of the first sub-board and is electrically connected to the third sub-board.

上記の構成によれば、電気接続箱の配線密度を向上させることができる。なお、実質的に平行とは、第４副基板と第１副基板とが平行である場合を含み、且つ、平行でない場合であっても、略平行と認められる場合を含む。   According to said structure, the wiring density of an electrical-connection box can be improved. Note that “substantially parallel” includes a case where the fourth sub-substrate and the first sub-substrate are parallel, and includes a case where the fourth sub-substrate and the first sub-substrate are recognized as being substantially parallel even when they are not parallel.

前記第３副基板は、前記第４副基板と接続される接続部を有し、前記第３副基板及び前記接続部は、折り曲げ可能な主基板を第３折り曲げ部で折り曲げて一体に形成されていてもよい。   The third sub-board has a connection part connected to the fourth sub-board, and the third sub-board and the connection part are integrally formed by bending a foldable main board at a third folding part. It may be.

上記の構成によれば、電気接続箱の配線密度を向上させることができる。また、第３副基板と第４副基板とを電気的に接続するための部材が不要になるので部品点数を削減できる。   According to said structure, the wiring density of an electrical-connection box can be improved. In addition, since a member for electrically connecting the third sub board and the fourth sub board is not necessary, the number of parts can be reduced.

前記第１副基板、前記第２副基板、前記第３副基板、及び前記接続部は、前記主基板を、それぞれ、前記第１折り曲げ部、前記第２折り曲げ部、及び前記第３折り曲げ部で折り曲げて、一体に形成される構成としてもよい。   The first sub-board, the second sub-board, the third sub-board, and the connection portion are the main board at the first bent portion, the second bent portion, and the third bent portion, respectively. It is good also as a structure bent and formed integrally.

第１副基板、第２副基板、第３副基板、及び第４副基板を電気的に接続するための部材が不要になるので、部品点数を削減できる。   Since a member for electrically connecting the first sub-board, the second sub-board, the third sub-board, and the fourth sub-board is not necessary, the number of parts can be reduced.

前記第４副基板は前記支持部材に設けられた係止部に保持されていてもよい。   The fourth sub-board may be held by a locking portion provided on the support member.

上記の構成によれば、支持部材と第４副基板との相対的位置がずれることが抑制される。これにより、例えば振動により第４副基板が位置ずれすることが抑制されるので、第４副基板の電気的な接続信頼性を向上させることができる。   According to said structure, it is suppressed that the relative position of a supporting member and a 4th sub board | substrate shifts | deviates. Thereby, for example, it is possible to suppress the displacement of the fourth sub-board due to vibration, so that the electrical connection reliability of the fourth sub-board can be improved.

本発明によれば、蓋部に配設された端子金具の電気的な接続信頼性を向上させることができる。   ADVANTAGE OF THE INVENTION According to this invention, the electrical connection reliability of the terminal metal fitting arrange | positioned at a cover part can be improved.

本発明を車両用の電気接続箱１０に適用した一実施形態について図１ないし図１８を参照して説明する。このものは、バッテリー等の電源（図示せず）とヘッドランプ、ワイパー等の車載電装品（図示せず）との間に接続されて、各種車載電装品のスイッチングを行う。この電気接続箱１０は、ケース１１内に第１副基板１２、第２副基板１３、第３副基板１４、および第４副基板１５を収容してなる。   An embodiment in which the present invention is applied to an electric junction box 10 for a vehicle will be described with reference to FIGS. This is connected between a power source (not shown) such as a battery and in-vehicle electrical components (not shown) such as a headlamp and a wiper, and performs switching of various in-vehicle electrical components. The electrical junction box 10 includes a first sub board 12, a second sub board 13, a third sub board 14, and a fourth sub board 15 contained in a case 11.

なお、以下の説明においては、図２における上方を上方とし、下方を下方として説明する。また、図２における左方を左方とし、右方を右方として説明する。また、図３における左側を表側とし、右側を裏側として説明する。   In the following description, the upper side in FIG. 2 is described as the upper side, and the lower side is described as the lower side. Further, the left side in FIG. 2 will be described as the left side, and the right side will be described as the right side. Further, the left side in FIG. 3 will be described as the front side, and the right side will be described as the back side.

（ケース１１等）
図３に示すように、ケース１１は、下方（図３における下方）に開口しており、且つ、全体として扁平形状をなしている。ケース１１の開口は、ケース１１に取り付けられた蓋部１６によって塞がれている。図１７に示すように、蓋部１６の外側面には複数のロック部１７Ａが外方に突出して形成されており、ケース１１には、ロック部１７Ａに対応する位置に複数のロック受け部１８Ａが形成されている。ロック部１７Ａとロック受け部１８Ａとが弾性的に係合することにより、蓋部１６はケース１１に取り付けられている（図２参照）。 (Case 11 etc.)
As shown in FIG. 3, the case 11 opens downward (downward in FIG. 3) and has a flat shape as a whole. The opening of the case 11 is closed by a lid portion 16 attached to the case 11. As shown in FIG. 17, a plurality of lock portions 17A are formed on the outer surface of the lid portion 16 so as to protrude outward, and the case 11 has a plurality of lock receiving portions 18A at positions corresponding to the lock portions 17A. Is formed. The lid portion 16 is attached to the case 11 by elastically engaging the lock portion 17A and the lock receiving portion 18A (see FIG. 2).

蓋部１６には、図示しない相手側コネクタ（特許請求の範囲に記載の相手側部材に相当）を接続可能な嵌合部１９が、外方（図３においては下方）に開口して形成されている。相手側コネクタは、図示しない電線を介して車載電装品と接続されている。   The lid portion 16 is formed with a fitting portion 19 to which a mating connector (not shown) (corresponding to the mating member described in the claims) can be connected, opening outward (downward in FIG. 3). ing. The mating connector is connected to the in-vehicle electrical component via an electric wire (not shown).

図３に示すように、嵌合部１９には相手側コネクタと電気的に接続可能な複数の端子金具２０が配されている。この嵌合部１９内には、端子金具２０の下端部（特許請求の範囲に記載の一方の端部に相当）が配されている。端子金具２０の上端部（特許請求の範囲に記載の他方の端部に相当）は、蓋部１６を貫通してケース１１内に導入されている。   As shown in FIG. 3, the fitting part 19 is provided with a plurality of terminal fittings 20 that can be electrically connected to the mating connector. In the fitting portion 19, a lower end portion (corresponding to one end portion described in claims) of the terminal fitting 20 is disposed. An upper end portion (corresponding to the other end portion described in the claims) of the terminal fitting 20 is introduced into the case 11 through the lid portion 16.

相手側コネクタが嵌合部１９に装着される際には、端子金具２０には、相手側コネクタとの摩擦により、上向きの力が加えられる。また、相手側コネクタが嵌合部１９から離脱される際には、端子金具２０には、相手側コネクタとの摩擦により、下向きの力が加えられる。   When the mating connector is attached to the fitting portion 19, an upward force is applied to the terminal fitting 20 due to friction with the mating connector. Further, when the mating connector is detached from the fitting portion 19, a downward force is applied to the terminal fitting 20 due to friction with the mating connector.

蓋部１６の上面（図３における上面）は、端子金具２０に対して相手側コネクタが離脱される方向（図３における下向き）の力が加えられた場合に、第２副基板１３と下方から当接するようになっている。本実施形態においては、通常時においては、蓋部１６の上面と第２副基板１３の下面とは離間している。なお、蓋部１６の上面と第２副基板１３の下面とは、通常時において当接していてもよい。   The upper surface (the upper surface in FIG. 3) of the lid portion 16 extends from the lower side of the second sub-board 13 when a force in the direction in which the mating connector is detached (downward in FIG. 3) is applied to the terminal fitting 20. It comes to contact. In the present embodiment, the upper surface of the lid portion 16 and the lower surface of the second sub-substrate 13 are separated from each other in normal times. In addition, the upper surface of the cover part 16 and the lower surface of the 2nd subboard | substrate 13 may contact | abut in normal time.

図１に示すように、蓋部１６には、相手側コネクタから導出された電線を覆う電線カバー２１が取り付けられている。図１７に示すように、蓋部１６の外側面には複数のロック部１７Ｂが外方に突出して形成されており、電線カバー２１には、蓋部に設けられたロック部１７Ｂに対応する位置に複数のロック受け部１８Ｂが形成されている。ロック部１７Ｂとロック受け部１８Ｂとが弾性的に係合することにより、電線カバー２１は蓋部１６に取り付けられている。電線カバー２１には、電線を導出するための電線導出口２２が開口して設けられている。   As shown in FIG. 1, an electric wire cover 21 that covers the electric wire led out from the mating connector is attached to the lid portion 16. As shown in FIG. 17, a plurality of lock portions 17 </ b> B are formed to protrude outward on the outer surface of the lid portion 16, and the wire cover 21 has a position corresponding to the lock portion 17 </ b> B provided on the lid portion. A plurality of lock receiving portions 18B are formed. The wire cover 21 is attached to the lid portion 16 by elastically engaging the lock portion 17B and the lock receiving portion 18B. The electric wire cover 21 is provided with an electric wire outlet 22 for leading out the electric wire.

（第１副基板１２）
図３に示すように、ケース１１内には、図３における右側に位置するケース１１の裏壁２３（特許請求の範囲に記載されたケース１１の側壁に相当）の内面に沿って、第１副基板１２が配されている。 (First sub-board 12)
As shown in FIG. 3, in the case 11, a first wall is formed along the inner surface of the back wall 23 (corresponding to the side wall of the case 11 described in the claims) of the case 11 located on the right side in FIG. A sub-board 12 is arranged.

第１副基板１２は、絶縁基板の裏面（図３における右側面）に絶縁性の接着層（図示せず）を介して複数のバスバー２４を接着してなる。接着層としては、接着剤を塗布してもよく、また接着シートを貼付してもよい。バスバー２４は金属板材を所定の形状にプレス加工してなる。   The first sub-board 12 is formed by bonding a plurality of bus bars 24 to the back surface of the insulating substrate (the right side surface in FIG. 3) via an insulating adhesive layer (not shown). As the adhesive layer, an adhesive may be applied, or an adhesive sheet may be attached. The bus bar 24 is formed by pressing a metal plate into a predetermined shape.

また、第１副基板１２の表面（図３における左側面）には、プリント配線技術により導電路（図示せず）が形成されている。この導電路には、図４に示すように、機械式リレー２５、半導体リレー２６、ヒューズ２７等の電子部品が接続されている。   A conductive path (not shown) is formed on the surface of the first sub-board 12 (left side in FIG. 3) by a printed wiring technique. As shown in FIG. 4, electronic components such as a mechanical relay 25, a semiconductor relay 26, and a fuse 27 are connected to the conductive path.

（第２副基板１３）
図３に示すように、ケース１１内には、蓋部１６の内面（図３における蓋部１６の上面）に沿って、第２副基板１３が配されている。第２副基板１３は、絶縁基板の下面（図３における下面）に絶縁性の接着層（図示せず）を介して複数のバスバー２４を接着してなる。接着層としては、接着剤を塗布してもよく、また接着シートを貼付してもよい。バスバー２４は金属板材を所定の形状にプレス加工してなる。第２副基板１３の上面（図３における上面）には、プリント配線技術により導電路（図示せず）が形成されている。 (Second sub-board 13)
As shown in FIG. 3, the second sub-board 13 is disposed in the case 11 along the inner surface of the lid portion 16 (the upper surface of the lid portion 16 in FIG. 3). The second sub-board 13 is formed by bonding a plurality of bus bars 24 to the lower surface of the insulating substrate (the lower surface in FIG. 3) via an insulating adhesive layer (not shown). As the adhesive layer, an adhesive may be applied, or an adhesive sheet may be attached. The bus bar 24 is formed by pressing a metal plate into a predetermined shape. A conductive path (not shown) is formed on the upper surface (the upper surface in FIG. 3) of the second sub-board 13 by a printed wiring technique.

（第３副基板１４）
図３に示すように、ケース１１内には、ケース１１の開口と反対側に位置する上壁２８（特許請求の範囲に記載の壁部に相当）の内面に沿って、第３副基板１４が配されている。第３副基板１４は、絶縁基板の下面（図３における下面）は、プリント配線技術により導電路（図示せず）が形成されてなる。この導電路は第３副基板１４の両面に形成されていてもよい。 (Third sub-board 14)
As shown in FIG. 3, in the case 11, the third sub-board 14 extends along the inner surface of the upper wall 28 (corresponding to the wall portion described in the claims) located on the opposite side of the opening of the case 11. Is arranged. The third sub-board 14 has a conductive path (not shown) formed on the lower surface (lower surface in FIG. 3) of the insulating substrate by a printed wiring technique. This conductive path may be formed on both surfaces of the third sub-substrate 14.

（第４副基板１５）
図３に示すように、ケース１１内には、ケース１１の表壁（図３における左側壁）の内面に沿って、第４副基板１５が配されている。第４副基板１５は、第１副基板１２の板面と実質的に平行に配されている。なお、実質的に平行とは、第４副基板１５と第１副基板１２とが平行である場合を含み、且つ、平行でない場合であっても、略平行と認められる場合を含む。第４副基板１５は、絶縁基板の表面（図３における左側面）及び裏面（図３における右側面）の一方又は双方にプリント配線技術により導電路（図示せず）が形成されてなる。この導電路は絶縁基板の両面に形成されていてもよい。第４副基板１５の裏面（図３における右側面）には、マイコン２９等の電子部品が実装されて、導電路と接続されている。 (Fourth sub-board 15)
As shown in FIG. 3, a fourth sub-board 15 is arranged in the case 11 along the inner surface of the front wall (the left side wall in FIG. 3) of the case 11. The fourth sub-board 15 is disposed substantially parallel to the plate surface of the first sub-board 12. Note that “substantially parallel” includes the case where the fourth sub-substrate 15 and the first sub-substrate 12 are parallel, and also includes the case where they are recognized as being substantially parallel even when they are not parallel. The fourth sub-board 15 has a conductive path (not shown) formed on one or both of the front surface (left side surface in FIG. 3) and the back surface (right side surface in FIG. 3) of the insulating substrate by a printed wiring technique. This conductive path may be formed on both surfaces of the insulating substrate. Electronic components such as the microcomputer 29 are mounted on the back surface (right side surface in FIG. 3) of the fourth sub-board 15 and connected to the conductive path.

（支持部材３０）
図３に示すように、ケース１１内には、合成樹脂製の支持部材３０が収容されている。また、図１４に示すように、この支持部材３０の上縁（図１４における
上縁）には、ケース１１の上壁２８の内面と下方から当接する第１当接部３１を有する。 (Supporting member 30)
As shown in FIG. 3, a support member 30 made of synthetic resin is accommodated in the case 11. Further, as shown in FIG. 14, the upper edge (the upper edge in FIG. 14) of the support member 30 has a first contact portion 31 that contacts the inner surface of the upper wall 28 of the case 11 from below.

また、支持部材３０は、図３に示すように、ケース１１の上壁２８の内面との間で、第３副基板１４を挟持するようになっている。また、支持部材３０は、図５に示すように、ケース１１の裏壁２３の内面との間で、第１副基板１２を挟持するようになっている。   Further, as shown in FIG. 3, the support member 30 sandwiches the third sub board 14 between the support member 30 and the inner surface of the upper wall 28 of the case 11. Further, as shown in FIG. 5, the support member 30 is configured to sandwich the first sub-board 12 between the inner surface of the back wall 23 of the case 11.

図３に示すように、支持部材３０の下端部は、蓋部１６の上面に、上方から当接している。また、支持部材３０の下端部寄りの位置には、端子金具２０に対して相手側コネクタが接続される方向（図３における上向き）の力が加えられた場合に、第２副基板１３と上方から当接する第２当接部３２が形成されている。図９及び図１０に示すように、第２当接部３２は、支持部材３０の表面側（図９及び図１０における上側）から、裏面側（図９及び図１０における下側）に向かって柱状に突出して複数形成されている。各第２当接部３２の下面（図１０において紙面を貫通する方向手前側の面）は、面一に形成されている。この第２当接部３２は、通常時において、第２副基板１３と上方から当接していてもよく、また、第２副基板１３と離間していてもよい。   As shown in FIG. 3, the lower end portion of the support member 30 is in contact with the upper surface of the lid portion 16 from above. Further, when a force in the direction in which the mating connector is connected to the terminal fitting 20 (upward in FIG. 3) is applied to the position near the lower end portion of the support member 30, A second abutting portion 32 that abuts from is formed. As shown in FIGS. 9 and 10, the second contact portion 32 is directed from the front surface side (upper side in FIGS. 9 and 10) to the back surface side (lower side in FIGS. 9 and 10) of the support member 30. A plurality of protrusions are formed in a columnar shape. The lower surface of each second contact portion 32 (the surface on the near side in the direction passing through the paper surface in FIG. 10) is formed flush. The second contact portion 32 may be in contact with the second sub-board 13 from above or may be separated from the second sub-board 13 in a normal state.

図１５に示すように、支持部材３０の表側（図１５における左側）には、表側に突出すると共に、第４副基板１５の側縁部を保持する係止部３３が形成されている。図１４に示すように、係止部３３は、支持部材３０の上縁部（図１４における上縁）のうち、右端寄りの位置に板状をなして形成されると共に、支持部材３０の左端部寄り（図１４における左側）の位置に、略Ｃ字状をなして形成されている。この係止部３３により、第４副基板１５は支持部材３０に保持されている。図１６には、支持部材３０の上端部に位置する係止部３３が、第４副基板１５を保持する構造を示す。   As shown in FIG. 15, on the front side (left side in FIG. 15) of the support member 30, a locking portion 33 that protrudes to the front side and holds the side edge portion of the fourth sub-board 15 is formed. As shown in FIG. 14, the locking portion 33 is formed in a plate shape at a position near the right end of the upper edge portion (upper edge in FIG. 14) of the support member 30, and the left end of the support member 30. It is formed in a substantially C-shape at a position close to the part (left side in FIG. 14). The fourth sub-board 15 is held by the support member 30 by the locking portion 33. FIG. 16 shows a structure in which the locking portion 33 located at the upper end portion of the support member 30 holds the fourth sub-board 15.

図５に示すように、支持部材３０の下端部寄りの位置（図５における下側）には、表裏方向（図５における左右方向）を向いて穿設されたねじ孔３４が形成されている。また、蓋部１６の上端部には、板状をなす取り付け部３５が、ねじ孔３４に対応する位置に形成されており、取り付け部３５には、ねじ孔３４と整合する挿通孔３６が、表裏方向に貫通して形成されている。蓋部１６と、支持部材３０とは、挿通孔３６及びねじ孔３４にボルト３７を螺合することにより組み付けられる。   As shown in FIG. 5, a screw hole 34 drilled in the front-back direction (left-right direction in FIG. 5) is formed at a position near the lower end of the support member 30 (lower side in FIG. 5). . Further, a mounting portion 35 having a plate shape is formed at a position corresponding to the screw hole 34 at the upper end portion of the lid portion 16, and an insertion hole 36 that matches the screw hole 34 is formed in the mounting portion 35. It is formed to penetrate in the front and back direction. The lid portion 16 and the support member 30 are assembled by screwing bolts 37 into the insertion holes 36 and the screw holes 34.

（端子金具２０の接続構造）
図３に示すように、複数の端子金具２０のなかには、バスバー２４を貫通して、半田付け、溶接、ろう付け等の公知の手法により、バスバー２４と電気的に接続されるものがある。 (Connection structure of terminal fitting 20)
As shown in FIG. 3, some of the plurality of terminal fittings 20 penetrate the bus bar 24 and are electrically connected to the bus bar 24 by a known method such as soldering, welding, or brazing.

また、図４に示すように、複数の端子金具２０のなかには、第２副基板１３を貫通し、この第２副基板１３に形成された導電路と、半田付け等の公知の手法により、電気的に接続されるものがある。蓋部１６と第２副基板１３との間には台座３８Ａが配されており、この台座３８Ａに端子金具２０が貫通して配されている。この台座３８Ａにより、端子金具２０同士のアライメントが保持されるようになっている。図４に示された端子金具２０は、表裏方向（図４における左右方向）に２段に並んで配設されている。   Further, as shown in FIG. 4, the plurality of terminal fittings 20 penetrate the second sub-board 13, and the conductive paths formed on the second sub-board 13 are electrically connected by a known method such as soldering. Some are connected. A pedestal 38A is disposed between the lid portion 16 and the second sub-board 13, and the terminal fitting 20 is disposed through the pedestal 38A. By this pedestal 38A, the alignment of the terminal fittings 20 is maintained. The terminal fittings 20 shown in FIG. 4 are arranged in two steps in the front and back direction (left and right direction in FIG. 4).

図６に示すように、複数の端子金具２０の中には、蓋部１６を貫通してケース１１内に導入された後、表側に直角に曲げられて、第４副基板１５を貫通して第４副基板１５に形成された導電路と電気的に接続されるものがある。端子金具２０は台座３８Ｂに配されており、この台座３８Ｂにより各端子金具２０同士のアライメントが保持されるようになっている。   As shown in FIG. 6, some of the terminal fittings 20 are inserted into the case 11 through the lid portion 16, and then bent at a right angle to the front side to penetrate through the fourth sub-board 15. Some are electrically connected to a conductive path formed in the fourth sub-substrate 15. The terminal fitting 20 is disposed on the pedestal 38B, and the alignment between the terminal fittings 20 is maintained by the pedestal 38B.

（基板の構造）
図７に示すように、第１副基板１２、第２副基板１３、及び第３副基板１４は、繊維基材及び合成樹脂からなり、折り曲げ可能な主基板３９を折り曲げて形成される。部品実装する部分の繊維基材としては、織布、不織布などを用いることができる。繊維基材の材質としては、公知の材料を用いることができるが、寸法安定性、耐熱性、及び曲げ性を得る観点から、ガラス繊維の織布、すなわちガラスクロスが好ましい。合成樹脂としては、成形性、耐熱性、及び絶縁性に優れることから、熱硬化性樹脂が好ましい。熱硬化性樹脂としては、公知の材料を用いることができるが、耐熱性、機械的特性、電気的特性に優れることから、エポキシ樹脂が好ましい。また、折り曲げ部分は、折り曲げ性を確保する観点からフレキシブルな基材が好ましく、例えばポリアミドやポリエチレンナフタレート（ＰＥＮ）、ポリエチレンテレフタレート（ＰＥＴ）などの絶縁材料が好ましい。尚、部品実装部分に、この基材を適用してもよい。 (Substrate structure)
As shown in FIG. 7, the first sub-board 12, the second sub-board 13, and the third sub-board 14 are made of a fiber base material and a synthetic resin, and are formed by bending a foldable main board 39. A woven fabric, a non-woven fabric, or the like can be used as a fiber base for the part mounting part. As a material of the fiber base material, a known material can be used, but from the viewpoint of obtaining dimensional stability, heat resistance, and bendability, a woven fabric of glass fiber, that is, a glass cloth is preferable. As the synthetic resin, a thermosetting resin is preferable because it is excellent in moldability, heat resistance, and insulation. A known material can be used as the thermosetting resin, but an epoxy resin is preferable because of excellent heat resistance, mechanical properties, and electrical properties. In addition, the bent portion is preferably a flexible base material from the viewpoint of ensuring bendability, and for example, an insulating material such as polyamide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET) is preferable. In addition, you may apply this base material to a component mounting part.

図１５に示すように、第１副基板１２及び第２副基板１３は、主基板３９を第１折り曲げ部４０で折り曲げることにより、一体に形成されている。主基板３９は、第１副基板１２のうち電子部品が実装された面の側に直角曲げされている。第１副基板１２に形成された導電路と、第２副基板１３に形成された導電路とは連続している。また、第１副基板１２に接着されたバスバー２４と、第２副基板１３に接着されたバスバー２４とは、一体のバスバー２４を折り曲げて形成されている。このように、第１副基板１２と第２副基板１３は、電気的に接続されている。   As shown in FIG. 15, the first sub-substrate 12 and the second sub-substrate 13 are integrally formed by bending the main substrate 39 with a first bending portion 40. The main board 39 is bent at a right angle to the side of the first sub board 12 on which electronic components are mounted. The conductive path formed on the first sub-substrate 12 and the conductive path formed on the second sub-substrate 13 are continuous. The bus bar 24 bonded to the first sub-board 12 and the bus bar 24 bonded to the second sub-board 13 are formed by bending the integrated bus bar 24. In this way, the first sub board 12 and the second sub board 13 are electrically connected.

図１５に示すように、第１副基板１２及び第３副基板１４は、主基板３９を第２折り曲げ部４１で折り曲げることにより、一体に形成されている。主基板３９は、第１副基板１２のうち電子部品が実装された面の側に直角曲げされている。第１副基板１２に形成された導電路と、第３副基板１４に形成された導電路とは連続している。これにより、第１副基板１２と第３副基板１４は、電気的に接続されている。   As shown in FIG. 15, the first sub-substrate 12 and the third sub-substrate 14 are integrally formed by bending the main substrate 39 with the second bending portion 41. The main board 39 is bent at a right angle to the side of the first sub board 12 on which electronic components are mounted. The conductive path formed on the first sub-substrate 12 and the conductive path formed on the third sub-substrate 14 are continuous. Thereby, the first sub-board 12 and the third sub-board 14 are electrically connected.

図３に示すように、第４副基板１５の裏面（図３における右側面）に形成された導電路は、第３副基板１４（主基板３９）を第３折り曲げ部４２で折り曲げて形成した接続部４３と接続されている。これにより、第４副基板１５と第３副基板１４とは、電気的に接続されている。なお、接続部４３は、第４副基板１５の表面（図３における左側面）に形成された導電路と接続されていてもよい。   As shown in FIG. 3, the conductive path formed on the back surface (right side surface in FIG. 3) of the fourth sub-substrate 15 is formed by bending the third sub-substrate 14 (main substrate 39) at the third bending portion 42. A connection unit 43 is connected. As a result, the fourth sub-board 15 and the third sub-board 14 are electrically connected. The connecting portion 43 may be connected to a conductive path formed on the surface of the fourth sub-board 15 (left side surface in FIG. 3).

上述したように、第１副基板１２、第２副基板１３、第３副基板１４、及び接続部４３は、主基板３９を、第１折り曲げ部４０、第２折り曲げ部４１、及び第３折り曲げ部４２で折り曲げることにより、一体に形成されている。   As described above, the first sub-board 12, the second sub-board 13, the third sub-board 14, and the connection portion 43 are the main substrate 39, the first bent portion 40, the second bent portion 41, and the third bent portion. It is integrally formed by bending at the part 42.

主基板３９には、車載電装品に電力を供給するためのものであって、比較的に大きな電流が流れる大電流回路が形成されている。一方、第４基板には、且つ機械式リレー２５、半導体リレー２６のスイッチングを制御するためのものであって、比較的に小さな電流が流れる制御回路が形成されている。   The main board 39 is provided with a large current circuit for supplying electric power to the on-vehicle electrical components and through which a relatively large current flows. On the other hand, the fourth substrate is formed with a control circuit for controlling switching of the mechanical relay 25 and the semiconductor relay 26 and through which a relatively small current flows.

次に、本実施形態に係る電気接続箱１０の製造工程の一例を示す。まず、プリント配線技術により主基板３９の一方又は双方の面に導電路を形成する。その後、主基板３９を所定の形状に切断する。導電路は、主基板３９を切断した後に形成してもよい。ついで、金属板材を所定の形状にプレス加工してバスバー２４を形成する。   Next, an example of the manufacturing process of the electrical junction box 10 according to the present embodiment will be shown. First, a conductive path is formed on one or both surfaces of the main board 39 by a printed wiring technique. Thereafter, the main substrate 39 is cut into a predetermined shape. The conductive path may be formed after the main substrate 39 is cut. Next, the bus bar 24 is formed by pressing a metal plate material into a predetermined shape.

ついで、主基板３９の一方の面に、接着層を介してバスバー２４を接着する。また、主基板３９の接続部４３と、第４副基板１５の導電路とを半田付け等の公知の手法により接続する。   Next, the bus bar 24 is bonded to one surface of the main substrate 39 via an adhesive layer. Further, the connection portion 43 of the main board 39 and the conductive path of the fourth sub board 15 are connected by a known method such as soldering.

その後、図７に示すように、主基板３９のうち、バスバー２４が接着された面とは、反対側の面に、機械式リレー２５、半導体リレー２６、ヒューズ２７等の電子部品を、リフロー半田付け等の公知の手法により実装する。また、第４副基板１５に、マイコン２９等の電子部品を、リフロー半田付け等の公知の手法により実装する。   Thereafter, as shown in FIG. 7, electronic components such as a mechanical relay 25, a semiconductor relay 26, and a fuse 27 are reflow soldered on the surface of the main board 39 opposite to the surface to which the bus bar 24 is bonded. It is mounted by a known method such as attaching. In addition, electronic components such as the microcomputer 29 are mounted on the fourth sub-board 15 by a known method such as reflow soldering.

次に、端子金具２０、及び端子金具２０を台座３８Ａ，３８Ｂに配設したものを、バスバー２４、及び主基板３９に、フロー半田付け等の公知の手法により接続する。   Next, the terminal fitting 20 and the terminal fitting 20 disposed on the bases 38A and 38B are connected to the bus bar 24 and the main board 39 by a known method such as flow soldering.

ついで、図８に示すように、主基板３９及びバスバー２４を第１折り曲げ部４０において、電子部品の実装面側に直角曲げを行い、第２副基板１３を形成する。   Next, as shown in FIG. 8, the main substrate 39 and the bus bar 24 are bent at right angles to the mounting surface side of the electronic component at the first bent portion 40 to form the second sub-substrate 13.

その後、図１１に示すように、支持部材３０を主基板３９に組み付けた後、主基板３９を、第２折り曲げ部４１において、電子部品の実装面側に直角曲げを行うことで、第１副基板１２、及び第３副基板１４を形成する。さらに、図１２に示すように、主基板３９（第３副基板１４）を第３折り曲げ部４２において、折り曲げる。その後、第４副基板１５を支持部材３０の係止部３３に保持させる。   Thereafter, as shown in FIG. 11, after the support member 30 is assembled to the main board 39, the main board 39 is bent at right angles to the mounting surface side of the electronic component at the second bent portion 41, thereby A substrate 12 and a third sub-substrate 14 are formed. Further, as shown in FIG. 12, the main substrate 39 (third sub-substrate 14) is bent at the third bending portion 42. Thereafter, the fourth sub-board 15 is held by the locking portion 33 of the support member 30.

続いて、図１３に示すように、蓋部１６を、図１３における矢線に示す方向から支持部材３０に組み付けた後、ボルト３７によりねじ止めする。図１４に、蓋部１６が支持部材３０に螺合された状態を示す。これにより、第１ないし第４副基板１５、支持部材３０、及び蓋部１６が一体に組み付けられる。このとき、蓋部１６の嵌合部１９内には、端子金具２０が配されるようになっている。   Subsequently, as shown in FIG. 13, the lid portion 16 is assembled to the support member 30 from the direction indicated by the arrow in FIG. FIG. 14 shows a state where the lid portion 16 is screwed to the support member 30. As a result, the first to fourth sub-boards 15, the support member 30, and the cover 16 are assembled together. At this time, the terminal fitting 20 is arranged in the fitting portion 19 of the lid portion 16.

その後、図１７に示すように、ケース１１内に、第１ないし第４副基板１２，１３，１４，１５、支持部材３０、及び蓋部１６を一体に組み付けたものを収容し、蓋部１６に形成されたロック部１Ａ７と、ケース１１に形成されたロック受け部１８Ａとを弾性的に係合させる。   Thereafter, as shown in FIG. 17, the case 11 in which the first to fourth sub-boards 12, 13, 14, 15, the support member 30, and the lid portion 16 are assembled together is accommodated in the case 11. The lock portion 1A7 formed on the cover 11 and the lock receiving portion 18A formed on the case 11 are elastically engaged.

その後、図示しない相手側コネクタを蓋部１６の嵌合部１９と嵌合させる。   Thereafter, a mating connector (not shown) is fitted to the fitting portion 19 of the lid portion 16.

次いで、図１８に示すように、蓋部１６に形成されたロック部１７Ｂと、電線カバー２１のロック受け部１８Ｂとを弾性的に係合させることにより、図１８における矢線で示す方向から電線カバー２１を蓋部１６に組み付ける。このとき、電線導出口２２から、相手側コネクタに接続された電線を外部に導出する。以上により、電気接続箱１０が完成する。   Next, as shown in FIG. 18, the lock portion 17 </ b> B formed on the lid portion 16 and the lock receiving portion 18 </ b> B of the wire cover 21 are elastically engaged, so that the electric wire is viewed from the direction indicated by the arrow in FIG. 18. The cover 21 is assembled to the lid portion 16. At this time, the electric wire connected to the counterpart connector is led out from the electric wire outlet port 22. Thus, the electrical junction box 10 is completed.

続いて、本実施形態の作用、効果について説明する。本実施形態によれば、支持部材３０は、端子金具２０に対して相手側コネクタを接続する方向の力が加えられたときに、第２副基板１３と当接する第２当接部３２を有する。これにより、相手側コネクタを装着する際に、相手側コネクタとの摩擦によって端子金具２０に加えられる力は、端子金具２０が接続された第２副基板１３から支持部材３０を介して、ケース１１のうち開口と反対側に位置する壁部（上壁２８）に伝達され、ケース１１で受けることができる。   Then, the effect | action and effect of this embodiment are demonstrated. According to this embodiment, the support member 30 has the second contact portion 32 that contacts the second sub-board 13 when a force in the direction of connecting the mating connector to the terminal fitting 20 is applied. . Thus, when the mating connector is mounted, the force applied to the terminal fitting 20 due to friction with the mating connector is applied from the second sub-board 13 to which the terminal fitting 20 is connected via the support member 30 to the case 11. Is transmitted to the wall portion (upper wall 28) located on the opposite side of the opening, and can be received by the case 11.

また、端子金具２０を台座３８Ａに配設した場合、相手側コネクタを装着する際に、相手側コネクタとの摩擦によって端子金具２０に加えられる力は、端子金具２０から台座３８Ａを介して第２副基板１３から支持部材３０へ伝達され、さらに支持部材３０からケース１１のうち開口と反対側に位置する壁部（上壁２８）に伝達され、ケース１１で受けることができる。   When the terminal fitting 20 is disposed on the pedestal 38A, the force applied to the terminal fitting 20 due to friction with the mating connector when the mating connector is mounted is the second force from the terminal fitting 20 via the pedestal 38A. It is transmitted from the sub-board 13 to the support member 30, further transmitted from the support member 30 to the wall portion (upper wall 28) located on the opposite side of the opening of the case 11, and can be received by the case 11.

また、蓋部１６の内面は、端子金具２０に対して相手側コネクタを離脱させる方向の力が加えられたときに、第２副基板１３と当接する。これにより、相手側コネクタを離脱させる際に、相手側コネクタとの摩擦によって端子金具２０に加えられる力は、端子金具２０が接続された第２副基板１３から蓋部１６に伝達され、蓋部１６が組み付けられたケース１１で受けることができる。   Further, the inner surface of the lid portion 16 comes into contact with the second sub-board 13 when a force is applied to the terminal fitting 20 in a direction for detaching the mating connector. As a result, when the mating connector is detached, the force applied to the terminal fitting 20 due to friction with the mating connector is transmitted from the second sub-board 13 to which the terminal fitting 20 is connected to the lid portion 16, and the lid portion. 16 can be received by the case 11 assembled.

このように、本実施形態によれば、相手側コネクタの挿抜時に端子金具２０に加えられた力をケース１１で受けることができる。この結果、端子金具２０と第２副基板１３との間の接続部分に加わる力を小さくすることができるので、端子金具２０の電気的な接続信頼性を向上させることができる。   Thus, according to the present embodiment, the case 11 can receive the force applied to the terminal fitting 20 when the mating connector is inserted and removed. As a result, since the force applied to the connection portion between the terminal fitting 20 and the second sub-board 13 can be reduced, the electrical connection reliability of the terminal fitting 20 can be improved.

また、本実施形態によれば、第１副基板１２及び第２副基板１３は、折り曲げ可能な主基板３９を第１折り曲げ部４０で折り曲げて一体に形成されている。これにより、第１副基板１２と第２副基板１３とを電気的に接続するための部材が不要となるので、部品点数を削減できる。   Further, according to the present embodiment, the first sub-board 12 and the second sub-board 13 are integrally formed by bending the foldable main board 39 with the first bending section 40. As a result, a member for electrically connecting the first sub-board 12 and the second sub-board 13 becomes unnecessary, and the number of parts can be reduced.

そして、本実施形態によれば、第１副基板１２及び第３副基板１４は、折り曲げ可能な主基板３９を第２折り曲げ部４１で折り曲げて一体に形成されている。これにより、第１副基板１２と第３副基板１４とを電気的に接続するための部材が不要となるので、部品点数を削減できる。   According to the present embodiment, the first sub-substrate 12 and the third sub-substrate 14 are integrally formed by bending the foldable main substrate 39 with the second bending portion 41. This eliminates the need for a member for electrically connecting the first sub-board 12 and the third sub-board 14, thereby reducing the number of components.

さらに、本実施形態によれば、第３副基板１４は、第４副基板１５と接続される接続部４３を有し、第３副基板１４及び接続部４３は、折り曲げ可能な主基板３９を第３折り曲げ部４２で折り曲げて一体に形成されている。これにより、電気接続箱１０の配線密度を向上させることができる。また、第３副基板１４と第４副基板１５とを電気的に接続するための部材が不要になるので部品点数を削減できる。   Furthermore, according to the present embodiment, the third sub-board 14 has the connection part 43 connected to the fourth sub-board 15, and the third sub-board 14 and the connection part 43 have the main board 39 that can be bent. The third bent portion 42 is integrally formed by bending. Thereby, the wiring density of the electrical junction box 10 can be improved. In addition, since a member for electrically connecting the third sub board 14 and the fourth sub board 15 is not required, the number of parts can be reduced.

また、本実施形態によれば、ケース１１内にはケース１１のうち開口と反対側に位置する壁部の内面に沿って配されると共に第１副基板１２と電気的に接続される第３副基板１４が収容されている。これにより、電気接続箱１０の配線密度を向上させることができる。   Further, according to the present embodiment, the case 11 is arranged along the inner surface of the wall portion located on the opposite side of the opening in the case 11 and electrically connected to the first sub-board 12 in the case 11. The sub board | substrate 14 is accommodated. Thereby, the wiring density of the electrical junction box 10 can be improved.

そして、本実施形態によれば、ケース１１内には、第１副基板１２の板面と実質的に平行に配されると共に、第３副基板１４と電気的に接続される第４副基板１５が収容されている。これにより、電気接続箱１０の配線密度を向上させることができる。なお、実質的に平行とは、第４副基板１５と第１副基板１２とが平行である場合を含み、且つ、平行でない場合であっても、略平行と認められる場合を含む。   According to the present embodiment, the fourth sub-board is arranged in the case 11 substantially in parallel with the plate surface of the first sub-board 12 and electrically connected to the third sub-board 14. 15 is housed. Thereby, the wiring density of the electrical junction box 10 can be improved. Note that “substantially parallel” includes the case where the fourth sub-substrate 15 and the first sub-substrate 12 are parallel, and also includes the case where they are recognized as being substantially parallel even when they are not parallel.

また、本実施形態によれば、第４副基板１５は支持部材３０に設けられた係止部３３に保持されている。これにより、支持部材３０と第４副基板１５との相対的位置がずれることが抑制される。これにより、振動により第４副基板１５が位置ずれすることが抑制されるので、第４副基板１５の電気的な接続信頼性を向上させることができる。   Further, according to the present embodiment, the fourth sub-board 15 is held by the locking portion 33 provided on the support member 30. As a result, the relative position between the support member 30 and the fourth sub-substrate 15 is suppressed from shifting. Thereby, since the displacement of the fourth sub-board 15 due to vibration is suppressed, the electrical connection reliability of the fourth sub-board 15 can be improved.

また、蓋部１６に配設された端子金具２０のうちケース１１内に導入された端部を第１副基板１２側に折り曲げて、第１副基板１２に接続する構成とすると、端子金具２０を折り曲げるための空間が必要となる。このため、第１副基板１２に実装できる電子部品が少なくなってしまうことが懸念される。本実施形態によれば、端子金具２０は、第２副基板１３に接続されている。これにより、端子金具２０を折り曲げる必要がないので第１副基板１２に実装される電子部品が少なくなることを抑制できる。特に、本実施形態のように、端子金具２０が表裏方向に複数段に並んで配されている場合には、第１副基板１２の表側（図４における左側）の位置に端子金具２０を配索する必要がないので、一層効果的である。   In addition, when the end portion introduced into the case 11 of the terminal fitting 20 disposed in the lid portion 16 is bent toward the first sub-board 12 and connected to the first sub-board 12, the terminal fitting 20 is provided. A space for bending is required. For this reason, there is a concern that the number of electronic components that can be mounted on the first sub-board 12 is reduced. According to the present embodiment, the terminal fitting 20 is connected to the second sub-board 13. Thereby, since it is not necessary to bend the terminal metal fitting 20, it can suppress that the electronic component mounted in the 1st subboard 12 decreases. In particular, when the terminal fittings 20 are arranged in a plurality of stages in the front and back direction as in this embodiment, the terminal fittings 20 are arranged at the front side (left side in FIG. 4) of the first sub-board 12. There is no need to search, so it is more effective.

また、本実施形態によれば、マイコン２９が実装される制御基板と、電力回路が形成される電力基板とを、別体に形成し、ケース１１内に離間して配することができるので、制御基板に実装されたマイコン２９に、電力回路基板で発生した熱が伝達されることを抑制できる。   Further, according to the present embodiment, the control board on which the microcomputer 29 is mounted and the power board on which the power circuit is formed can be formed separately and arranged separately in the case 11. It is possible to suppress the heat generated in the power circuit board from being transmitted to the microcomputer 29 mounted on the control board.

＜他の実施形態＞
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
（１）本実施形態においては、相手側部材は相手側コネクタとしたが、これに限られず、ヒューズ等の電子部品であってもよい。
（２）本実施形態においては、第１副基板１２、第２副基板１３、第３副基板１４、及び接続部４３は、１枚の主基板３９を折り曲げることで、電気的に接続する構成としたが、これに限られず、各副基板１２，１３，１４，１５は別体とし、各副基板１２，１３，１４，１５の間、又は第３副基板１４と接続部４３との間は、ＦＰＣ、ジャンパ線、バスバー２４等、必要に応じて任意の導電部材を用いて電気的に接続する構成としてもよい。
また、各副基板１２，１３，１４は、バスバーとプリント基板を貼り合わせた基板構成としたが、一般的な厚銅基板や、メタルコア基板、メタルベース基板等、必要に応じて、任意の構成を有する基板を用いることができる。
（３）第３副基板１４、及び第４副基板１５は、必要に応じて省略できる。 <Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the present embodiment, the mating member is a mating connector, but is not limited thereto, and may be an electronic component such as a fuse.
(2) In the present embodiment, the first sub-board 12, the second sub-board 13, the third sub-board 14, and the connection portion 43 are electrically connected by bending one main board 39. However, the present invention is not limited to this, and each sub-board 12, 13, 14, 15 is a separate body, and between each sub-board 12, 13, 14, 15, or between the third sub-board 14 and the connection portion 43. May be configured to be electrically connected using an arbitrary conductive member such as an FPC, a jumper line, a bus bar 24 or the like as necessary.
In addition, each of the sub-boards 12, 13, and 14 has a board configuration in which a bus bar and a printed board are bonded to each other. A substrate having the following can be used.
(3) The third sub-board 14 and the fourth sub-board 15 can be omitted as necessary.

本発明の一実施形態に係る電気接続箱を示す全体斜視図1 is an overall perspective view showing an electrical junction box according to an embodiment of the present invention. 電気接続箱を示す側面図Side view showing electrical junction box 図２におけるＩＩＩ−ＩＩＩ線断面図Sectional view taken along line III-III in FIG. 図２におけるＩＶ−ＩＶ線断面図Sectional view along line IV-IV in FIG. 図２におけるＶ−Ｖ線断面図Sectional view taken along line VV in FIG. 図２におけるＶＩ−ＶＩ線断面図Sectional view taken along line VI-VI in FIG. 各基板に電子部品等が実装された状態を示す斜視図The perspective view which shows the state in which the electronic components etc. were mounted in each board | substrate 第２副基板を折り曲げ形成した後、支持部材を組み付ける前の状態を示す斜視図The perspective view which shows the state before assembling a support member, after forming the 2nd sub board | substrate by bending. 支持部材を示す斜視図The perspective view which shows a supporting member 支持部材を示す正面図Front view showing support member 第１副基板及び第２副基板に支持部材を配設した状態を示す斜視図The perspective view which shows the state which has arrange | positioned the supporting member to the 1st sub board | substrate and the 2nd sub board | substrate. 主基板を折り曲げる工程を示す斜視図Perspective view showing the process of bending the main board 蓋部を組み付ける工程を示す斜視図The perspective view which shows the process of assembling a cover part 蓋部を支持部材とがねじ止めされた状態を示す正面図The front view which shows the state by which the cover part was screwed with the support member 図１４におけるＸＶ−ＸＶ線断面図XV-XV sectional view in FIG. 図１４におけるＸＶＩ−ＸＶＩ線断面図XVI-XVI line sectional view in FIG. ケース内に、各基板、支持部材、及び蓋部を組み付けたものを収容する工程を示す斜視図The perspective view which shows the process of accommodating what assembled | attached each board | substrate, the supporting member, and the cover part in a case. ケースに電線カバーを組み付ける工程を示す斜視図The perspective view which shows the process of attaching an electric wire cover to a case

符号の説明Explanation of symbols

１０…電気接続箱
１１…ケース
１２…第１副基板
１３…第２副基板
１４…第３副基板
１５…第４副基板
１６…蓋部
１９…嵌合部
２０…端子金具
３０…支持部材
３１…第１当接部
３２…第２当接部
３３…係止部
３９…主基板
４０…第１折り曲げ部
４１…第２折り曲げ部
４２…第３折り曲げ部
４３…接続部 DESCRIPTION OF SYMBOLS 10 ... Electrical junction box 11 ... Case 12 ... 1st subboard 13 ... 2nd subboard 14 ... 3rd subboard 15 ... 4th subboard 16 ... Cover part 19 ... Fitting part 20 ... Terminal metal fitting 30 ... Support member 31 ... 1st contact part 32 ... 2nd contact part 33 ... Locking part 39 ... Main board 40 ... 1st bending part 41 ... 2nd bending part 42 ... 3rd bending part 43 ... Connection part

Claims (8)

開口を有するケースと、前記ケースの側壁の内面に沿って前記ケース内に配された第１副基板と、前記ケースに組み付けられて前記ケースの開口を塞ぐと共に相手側部材と嵌合可能な嵌合部が外方に開口して形成された蓋部と、前記嵌合部内に一方の端部が配されて前記相手側部材と電気的に接続可能とされると共に他方の端部が前記ケース内に導入された端子金具と、前記ケース内に前記蓋部の内面に沿って配され、且つ前記端子金具の他方の端部と電気的に接続されると共に前記第１副基板と電気的に接続された第２副基板と、前記ケース内に配されて、前記ケースのうち前記開口と反対側に位置する壁部の内面と当接する第１当接部を有すると共に、前記端子金具に対して前記相手側部材を接続する方向の力が加えられたときに、前記第２副基板と当接する第２当接部を有する支持部材と、を備え、
前記蓋部の内面は、前記端子金具に対して前記相手側部材を離脱させる方向の力が加えられたときに、前記第２副基板と当接する電気接続箱。 A case having an opening; a first sub-board disposed in the case along an inner surface of the side wall of the case; and a fitting assembled to the case to close the opening of the case and fit with a mating member. A lid part formed by opening the joint part outward, and one end part is arranged in the fitting part so that it can be electrically connected to the counterpart member and the other end part is the case A terminal fitting introduced into the casing, and disposed in the case along the inner surface of the lid, and is electrically connected to the other end of the terminal fitting and electrically connected to the first sub-board. A second sub-board connected, and a first abutting portion disposed in the case and abutting against an inner surface of a wall portion located on the opposite side of the opening of the case; When a force in the direction of connecting the mating member is applied, And a support member having a second auxiliary substrate and the second contact portion that abuts,
The inner surface of the lid portion is an electrical junction box that comes into contact with the second sub-board when a force is applied to the terminal fitting in a direction to detach the counterpart member. 前記第１副基板及び前記第２副基板は、折り曲げ可能な主基板を第１折り曲げ部で折り曲げて一体に形成される請求項１に記載の電気接続箱。 2. The electrical junction box according to claim 1, wherein the first sub-board and the second sub-board are integrally formed by folding a foldable main board at a first folding portion. 前記ケース内には前記ケースのうち前記開口と反対側に位置する壁部の内面に沿って配されると共に前記第１副基板と電気的に接続される第３副基板が収容されている請求項１または請求項２に記載の電気接続箱。 The case accommodates a third sub-board disposed along the inner surface of the wall located on the opposite side of the opening in the case and electrically connected to the first sub-board. The electrical junction box according to claim 1 or claim 2. 前記第１副基板及び前記第３副基板は、折り曲げ可能な主基板を第２折り曲げ部で折り曲げて一体に形成される請求項３に記載の電気接続箱。 4. The electrical junction box according to claim 3, wherein the first sub-board and the third sub-board are integrally formed by folding a foldable main board at a second folding portion. 前記ケース内には、前記第１副基板の板面と実質的に平行に配されると共に、前記第３副基板と電気的に接続される第４副基板が収容されている請求項３または請求項４に記載の電気接続箱。 The fourth case is accommodated in the case, wherein the fourth sub-board is disposed substantially parallel to the plate surface of the first sub-board and is electrically connected to the third sub-board. The electrical junction box according to claim 4. 前記第３副基板は、前記第４副基板と接続される接続部を有し、前記第３副基板及び前記接続部は、折り曲げ可能な主基板を第３折り曲げ部で折り曲げて一体に形成される請求項５に記載の電気接続箱。 The third sub-board has a connection part connected to the fourth sub-board, and the third sub-board and the connection part are integrally formed by bending a foldable main board at a third folding part. The electrical junction box according to claim 5. 前記第１副基板、前記第２副基板、前記第３副基板、及び前記接続部は、前記主基板を、それぞれ、前記第１折り曲げ部、前記第２折り曲げ部、及び前記第３折り曲げ部で折り曲げて、一体に形成される請求項６に記載の電気接続箱。 The first sub-board, the second sub-board, the third sub-board, and the connection portion are the main board at the first bent portion, the second bent portion, and the third bent portion, respectively. The electrical junction box according to claim 6, wherein the electrical junction box is integrally formed by bending. 前記第４副基板は前記支持部材に設けられた係止部に保持されている請求項５ないし請求項７のいずれか一項に記載の電気接続箱。 The electrical junction box according to any one of claims 5 to 7, wherein the fourth sub-board is held by a locking portion provided on the support member.
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