JP5143634B2 - Imaging device - Google Patents

Description

  The present invention relates to an imaging apparatus including a solid-state imaging device to which a circuit board on which electronic components are mounted is connected, and more particularly, to an imaging apparatus disposed at a distal end portion of an electronic endoscope.

  Conventionally, an elongated insertion part is inserted into a body cavity, and an organ in the body cavity is displayed on a monitor screen using an imaging device including a solid-state imaging device provided at the distal end of the insertion part for examination or diagnosis. Electronic endoscopes that can perform the above are widely used. It is known that a solid-state imaging device provided in an imaging device has its electrical characteristics deteriorated when heated to a predetermined temperature or higher.

  In recent years, in an electronic endoscope used in the medical field, the diameter of an insertion portion has been reduced for the purpose of reducing pain given to a patient as much as possible. As the diameter of the insertion portion is reduced, the imaging device is also reduced in size, and thus there is a possibility that the electrical characteristics of the solid-state imaging device deteriorate due to a decrease in heat dissipation due to a reduction in the surface area of the imaging device. In addition, as the number of pixels of the imaging device increases, the characteristics of the solid-state imaging device may deteriorate due to the influence of heat generated by the electronic components due to high-frequency driving, and thus the temperature rise of the solid-state imaging device must be prevented.

For example, Patent Document 1 discloses a semiconductor device that obtains high optical performance by preventing deformation of the semiconductor device due to heat generation. In this semiconductor device, the heat radiation plate to which the optical functional element is fixed is formed with a protrusion extending in the longitudinal direction perpendicular to the element fixing surface on which the optical functional element of the heat radiation plate is fixed. In addition, the optical function can be stably secured by reducing the fluctuation of the posture. In addition, a hole is provided in the heat radiating plate for fixing the optical functional element so as to increase the surface area of the heat radiating plate and to release the heat generated from the optical functional element to the atmosphere.
JP 2006-86985 A

  However, since the solid-state imaging device is unitized in an imaging device that has been downsized to reduce the diameter of the insertion portion or the like, heat dissipation with a hole that increases the surface area, as in the semiconductor device of Patent Document 1. Even if the solid-state image sensor is fixed to the plate, the heat of the solid-state image sensor is not directly released to the atmosphere, and the temperature of the solid-state image sensor may rise in the unit.

  The present invention has been made in view of the above circumstances, and provides an image pickup apparatus suitable for miniaturization that releases heat generated from an image sensor and heat generated from an electronic component to suppress a temperature rise of the solid-state image sensor. The purpose is to provide.

An imaging apparatus according to the present invention includes an objective optical unit configured by fixing an optical member to a lens frame, an element frame fixed to the lens frame, and fixed to the element frame and passing through the objective optical unit. An image sensor having a light receiving surface on which an optical image is formed, a circuit board electrically connected to the image sensor and mounted with an electronic component, a signal cable having a signal line connected to the circuit board, and these image sensors , e Bei an imaging unit composed of the imaging device exterior frame surround a portion of the circuit board, signal cables, before Symbol imaging unit has been mounted before Symbol image sensor heat generated, or on the circuit board The heat generated from the electronic component is transmitted, and the heat radiating member formed by the heat conductive member having high heat transfer property that releases the transmitted heat to the outside communicates with the heat radiating through hole. As above An imaging apparatus comprising a composed unit through holes in the through hole formed on the image on the exterior frame, the heat radiating member is, with respect to the imaging apparatus longitudinal axis of the circuit board installed in the imaging unit It also serves as a substrate angle setting unit for setting the arrangement angle .

  According to this configuration, the heat generated from the image sensor and the heat generated from the electronic component are transmitted to the heat radiating member. The heat transmitted to the heat radiating member is released to the outside of the imaging unit from a unit through hole formed by a heat radiating through hole of the heat radiating member and a through hole formed in the imaging device exterior frame.

  ADVANTAGE OF THE INVENTION According to this invention, the heat which generate | occur | produces from the image sensor and the heat which generate | occur | produces from an electronic component is discharge | released, and the imaging device suitable for size reduction which suppresses the temperature rise of a solid-state image sensor is realizable.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 6 relate to an embodiment of the present invention, FIG. 1 is a perspective view illustrating an electronic endoscope including an imaging device, and FIG. 2 illustrates a configuration of a distal end side of an insertion portion of the endoscope. FIG. 3 is a cross-sectional view for explaining the configuration of an image pickup apparatus including an image pickup unit provided with an objective optical unit and a heat radiating member, and FIG. 4 is a view taken in the direction of arrow A in FIG. FIG. 5 is a diagram for explaining the operation of the unit through hole, FIG. 5 is a diagram for explaining another configuration example of the heat dissipation member, and FIG. 6 is a diagram for explaining another configuration example of the heat dissipation member.

  As shown in FIG. 1, an electronic endoscope (hereinafter abbreviated as an endoscope) 1 includes an insertion portion 2 inserted into a body cavity, an operation portion 3 provided on the proximal end side of the insertion portion 2, A universal cord 4 extending from the operation unit 3 is provided. An endoscope connector (not shown) is provided at the proximal end portion of the universal cord 4.

  The insertion portion 2 is configured by connecting, in order from the distal end side, a rigid distal end portion 2a, for example, a bending portion 2b that can be bent in the vertical and horizontal directions, and a long flexible flexible tube portion 2c. Yes.

  The operation unit 3 also serves as a gripping unit. The operation unit 3 includes an up / down bending knob 3a for bending the bending portion 2b in the up / down direction, a left / right bending knob 3b for bending in the left / right direction, an air / water supply button 3c, and a suction button 3d. , And a plurality of remote buttons 3e for instructing drive control and the like of an imaging device described later built in the distal end portion 2a.

  Further, the operation section 3 is provided with a treatment instrument insertion port 3f that constitutes a proximal end portion of a treatment instrument channel (see reference numeral 12 in FIG. 2) described later. A treatment tool (not shown) such as a grasping forceps is introduced from the treatment tool insertion port 3f, passes through an opening (reference numeral 18b in FIG. 2) provided in the treatment tool channel 12 and the distal end portion 2a, and is led into, for example, a body cavity. .

  The endoscope connector is connected to, for example, a camera control unit. The camera control unit is provided with an image processing circuit that generates an image signal that is photoelectrically converted by a solid-state imaging device (hereinafter, abbreviated as an imaging device), which will be described later, provided in the imaging device, and generates a video signal. The video signal generated by the image processing circuit of the camera control unit is output to a display device (not shown), and an endoscopic image is displayed on the screen of the display device.

  As shown in FIG. 2, the bending portion 2 b constituting the insertion portion 2 of the endoscope 1 is configured by connecting a plurality of annular bending pieces 5 in a rotatable manner. The outer periphery of each of the plurality of bending pieces 5 is covered with a bending blade 6 formed into a tubular shape by braiding a thin wire or the like, and the outer periphery of the bending blade 6 is covered with a bending rubber 7 for ensuring watertightness. . The outer peripheral portion of the distal end of the curved rubber 7 is integrally fixed to the distal end hard portion 11 constituting the distal end portion 2a of the insertion portion 2 by providing, for example, a bobbin adhering portion 8.

  On the other hand, for example, four wire guards 5a are integrally fixed to the inner peripheral surface of the bending piece 5 by welding, joining or the like. When four wire guards 5a are fixedly provided on the inner peripheral surface of one bending piece 5, the wire guards 5a are provided, for example, at approximately 90 ° intervals around the insertion portion axis. In this case, four bending operation wires 9 are inserted into the insertion portion 2.

  The distal end portion of each bending wire 9 is fixed to a plurality of stationary rings 10 provided in the distal end portion 2a. In the present embodiment, like the wire guard 5a, the fixed ring 10 is joined to the inner peripheral surface of the distal bending piece 5f, which is the first bending piece, at approximately 90 ° intervals around the insertion axis.

  Each bending wire 9 is inserted through the wire guard 5 a fixed to the bending piece 5 and extended into the operation unit 3. And the base end part of each bending wire 9 is each fixed to the bending operation mechanism part which is not shown in figure connected with bending knob 3a, 3b.

  The distal end portion 2 a is mainly composed of the distal end hard portion 11 and the distal end cover portion 18. The distal end hard portion 11 is formed in a cylindrical shape with a hard metal member such as stainless steel. A distal end cover portion 18 is fixed to the distal end side surface of the distal end rigid portion 11, and a distal end bending piece 5f is fixed to the outer periphery of the proximal end portion.

  A plurality of through holes 11 a, 11 b, 11 c,... Having a center line parallel to the central axis of the distal end hard portion 11 are formed in the distal end hard portion 11. The first through-hole 11a is, for example, a through-hole constituting the treatment instrument channel 12, and a channel base 13 is fixed thereto. A distal end portion of a flexible channel tube 14 constituting the treatment instrument channel 12 is fixed to the proximal end portion of the channel cap 13. The second through-hole 11b is, for example, a through-hole constituting the front water supply channel 15, and a front water supply base 16 is fixedly provided. A distal end portion of a flexible front water supply tube 17 constituting the front water supply channel 15 is fixed to a proximal end portion of the front water supply base 16.

  The 3rd through-hole 11c is a through-hole for arrange | positioning the imaging device 20 which comprises an observation optical system. The imaging device 20 includes an objective optical unit 30 and an imaging unit 40, and the objective optical unit 30 is fixedly installed in the third through hole 11c. Reference numeral 44 denotes a signal cable extending from the imaging unit 40 constituting the imaging device 20. Reference numeral 48 denotes a unit through hole, which is provided on the side of the imaging unit 40. The unit through hole 48 is a hole for heat dissipation described later.

  In addition to the through holes 11a, 11b, and 11c, the distal end rigid portion 11 is a through hole constituting an air / water supply channel hole for supplying liquid or gas to an air / water supply nozzle (not shown), or an illumination optical system. A through-hole or the like for arranging a certain lighting unit is formed.

  The tip cover portion 18 provided on the tip end side of the tip hard portion 11 has a cylindrical shape, and a plurality of communication holes 18b communicating with the through holes 11a, 11b, 11c,. , 18c, 18d, ... are formed. The first communication hole 18 b constitutes the distal end opening of the treatment instrument channel 12. The second communication hole 18 c constitutes the tip opening of the front water supply channel 15. The distal end portion of the objective optical unit 30 is arranged in the third communication hole 18d.

  As shown in FIG. 3, the imaging device 20 includes an objective optical unit 30 and an imaging unit 40. The objective optical unit 30 includes, for example, optical members such as a plurality of optical lenses 31 and a plurality of diaphragms 32, and a lens frame 33 on which the optical lenses 31 and the diaphragms 32 are fixed.

  On the other hand, the imaging unit 40 includes an imaging element 41, an element frame 42, a circuit board 43, a signal cable 44, a heat radiating member 45, and an imaging device exterior frame (hereinafter referred to as an imaging frame) 46. It is configured.

  The image sensor 41 is a CCD (Charge Coupled Device), a CMOS (Complementary Metal-Oxide Semiconductor), or the like. On the light receiving surface side of the image sensor 41, for example, two cover lenses 47a and 47b, which are optical members, are bonded and fixed. The second cover lens 47 b is disposed on the light receiving surface of the image sensor 41.

  The element frame 42 is made of, for example, stainless steel, and of the two cover lenses 47 a and 47 b disposed on the light receiving surface side of the image sensor 41, the first cover lens 47 a is the inner surface of the base end portion of the element frame 42. Are integrally fixed to each other by bonding. That is, the image sensor 41 is fixed to the element frame 42 via the cover lenses 47a and 47b. The base end of the lens frame 33 is disposed on the inner surface of the distal end portion of the element frame 42, and after the position adjustment of the focus or the like is completed, the lens frame 33 and the element frame 42 are integrally joined by solder 51, for example.

  The circuit board 43 is a flexible printed board having flexibility, for example. Various electronic components 52, 53, 54,... Are mounted on the circuit board 43. The front end side of the circuit board 43 on which these electronic components 52, 53, and 54 are mounted is electrically connected to the image sensor 41.

  A plurality of signal lines 44a, 44b, 44c,... Are inserted into the signal cable 44. The tip portions of the plurality of signal lines 44 a, 44 b, 44 c,... Are connected to electrical connection portions (not shown) provided on the circuit board 43. A base end portion of the signal cable 44 is inserted through the insertion portion 2, the operation portion 3, and the universal cord 4 and extends into the endoscope connector. Reference numeral 55 denotes a cable protection member that protects the signal lines 44a, 44b, 44c,.

  The heat radiating member 45 is, for example, a metal member that is a heat conductive member having high heat transfer properties, and is formed in, for example, a trapezoidal column or a triangular column in accordance with the size and shape of the internal space in the imaging unit 40. In the present embodiment, the heat dissipation member 45 includes an image sensor contact surface 45a and an electronic component contact surface 45b. The electronic component contact surface 45b is configured as an inclined surface having a preset inclination angle.

  Insulating members 56 that prevent electrical contact are disposed between the image sensor contact surface 45a and the image sensor 41 and between the electronic component contact surface 45b and the various electronic components 52, 53, and 54, respectively. Has been. The insulating member 56 is a resin member having a high heat transfer property.

  The electronic component contact surface 45 b also serves as a board angle setting unit that determines the installation angle of the circuit board 43. That is, when the circuit board 43 is disposed in the imaging unit 40, the electronic components 52, 53, and 54 mounted on the circuit board 43 are brought into contact with the electronic component contact surface 45b via the insulating member 56. Fix in state. Accordingly, the flexible circuit board 43 can be easily fixed by being arranged at a desired angle with respect to the longitudinal axis of the imaging device 20, and the outer shape of the imaging unit 40 and the rigidness in the longitudinal axis direction can be fixed. Variation in length can be reduced.

  The heat radiating member 45 is formed with at least one heat radiating through hole 45 h as a heat radiating means constituting the unit through hole 48. In the present embodiment, the opening of the heat radiating through hole 45h is different from the image sensor contact surface 45a and the surface facing the image sensor contact surface 45a, and faces the electronic component contact surface 45b and the electronic component contact surface 45b. Two are formed on the substantially trapezoidal side surface 45s which is a surface different from the surface.

  The imaging frame 46 is a member that constitutes the exterior of the imaging unit 40, and includes a circuit board 43 on which the imaging element 41 and electronic components 52, 53, and 54 are mounted, a part of the signal cable 44 connected to the circuit board 43, and the like. Wrap up. The imaging frame 46 is formed in a predetermined shape by, for example, rounding or bending a single rectangular thin plate made of stainless steel. The imaging frame 46 is provided with a communication hole 46 h that is a through hole constituting the unit through hole 48. As shown in FIG. 4, the communication hole 46 h communicates with the heat radiating through hole 45 h and radiates heat to the imaging unit 40 by fixing the imaging frame 46 to the element frame 42 in a predetermined state in a predetermined state. It is provided as a unit through hole 48 as a means.

A distal end portion of a thin heat-shrinkable tube 57 having a high heat transfer property is disposed on the outer surface of the base end portion of the imaging frame 46. The proximal end portion of the heat shrinkable tube 57 is disposed on the outer surface of the distal end portion of the cable protection member 55.
Reference numerals 58a, 58b, and 58c are insulating sealing resins. The first sealing resin 58a is provided so as to cover the periphery of the electrical connection portion between the circuit board 43 and the imaging element 41. The second sealing resin 58b is provided so as to cover the connection portion between the signal lines 44a, 44b, 44c,... And the circuit board 43 and the periphery of the electronic components 52, 53, and 54 mounted on the circuit board 43. Yes. The third sealing resin 58c is a space mainly composed of the imaging frame 46, the heat dissipation member 45, the element frame 42, the imaging element 41, and the cover lenses 47a and 47b, and the imaging frame 46, the heat shrinkable tube 57, and the heat dissipation member 45. The space mainly composed of the signal cable 44 is filled.

  In the imaging unit 40 provided in the imaging device 20, heat generated from the imaging element 41 is transmitted to the heat dissipation member 45 via the insulating member 56. Further, the heat generated from the electronic components 52, 53 and 54 is transmitted to the heat radiating member 45 through the insulating member 56. Thereafter, the heat transmitted to the heat radiating member 45 passes through a unit through hole 48 formed by a heat radiating through hole 45 h formed in the heat radiating member 45 and a communication hole 46 h formed in the imaging frame 46, for example, as shown in FIG. As indicated by the arrow 4, the light is emitted to the outside of the imaging unit 40.

  As described above, the heat dissipating member having a high heat transfer property and the heat dissipating through hole is disposed in the vicinity of the image pickup element and the heat generating electronic component provided in the image pickup apparatus, and the image pickup frame constituting the exterior of the image pickup apparatus. A communication hole communicating with the heat radiating through hole is provided, and a unit through hole is provided in the imaging unit. Then, the heat generated from the image sensor and the heat generated from the electronic component are transmitted to the heat radiating member, and then imaged through the unit through hole constituted by the heat radiating through hole and the communication hole without trapping in the image pickup unit. Released outside the unit. As a result, it is possible to prevent the electrical characteristics from deteriorating due to the influence of heat generated from the electronic component, etc., causing the temperature of the image sensor to rise above a predetermined temperature.

  In addition, the heat generated by the image sensor and the electronic component can be efficiently conducted to the heat radiating member by bringing the image sensor and the heat radiating member and the electronic component and the heat radiating member into close contact with each other through an insulating member having a high heat transfer property. In addition, it is possible to reliably prevent an electrical failure such as a short circuit and improve the assemblability.

  In addition, the structure which makes a part of inner surface of the imaging frame 46 and the thermal radiation member 45 contact may be sufficient. According to this configuration, the heat transmitted to the heat radiating member 45 is transmitted to the imaging frame 46 through the contact portion, and then released from the imaging frame 46 to the outside of the imaging unit 40. As a result, the heat radiating member 45 functions as a heat radiating means for transferring heat to the imaging frame 46, and the temperature rise of the imaging element 41 can be prevented more effectively.

  In the present embodiment, the sealing resins 58a, 58b, and 58c provided in the imaging unit 40 may be sealing resins having high heat transfer properties. According to this configuration, the heat generated in the image sensor 41 and the electronic components 52, 53, 54 is transmitted to the heat radiating member 45 or the image frame 46 via the sealing resins 58 a, 58 b, 58 c and the temperature of the image sensor 41. The rise can be prevented.

  Further, when the sealing resins 58a, 58b, and 58c are made to have a high heat transfer property, a heat radiation hole is formed in a sealing portion that includes these sealing resins 58a, 58b, and 58c, and the imaging device The temperature rise may be prevented.

  Further, the unit through hole 48 provided in the imaging unit 40 may be a channel through hole through which a channel for supplying air or water or a tube constituting the channel is inserted. As a result, the heat radiating member 45 to which heat is transmitted can be cooled by the gas and fluid for supplying air and water, and the temperature rise of the image sensor 41 can be prevented.

  Moreover, in this embodiment, although the heat radiating member 45 is made into the triangular prism and the trapezoid pillar, the shape of the heat radiating member 45 is not limited to these shapes. The heat radiating member may be a tubular heat radiating member 45P having a heat radiating through hole 45h as shown in FIG.

  The heat radiating member 45P shown in FIG. 5 is tubular, so-called pipe shape. In the heat radiating member 45P, the outer peripheral surface of the heat radiating member 45P is in contact with the insulating member 56 provided in the imaging element 41, the insulating member 56 provided in the electronic components 52, 53, and 54, and the inner surface of the imaging frame 46. It is formed with a diameter. The heat radiating through hole 45 h of the heat radiating member 45 </ b> P is configured to communicate with the communication hole 46 h of the imaging frame 46.

  Thus, heat generated from the image sensor 41 and the electronic components 52, 53, and 54 is transmitted to the heat dissipation member 45P via the insulating member 56 or the sealing resins 58a, 58b, and 58c. After that, a part of the heat is released outside the imaging unit 40 through the unit through hole 48 like the above-described heat radiating member 45 without being trapped in the imaging unit 40. In addition, a part of the heat is transmitted to the imaging frame 46 via the contact portion between the heat radiation member 45P and the imaging frame 46 and released to the outside of the imaging unit 40, and the same effect as described above can be obtained. it can.

  Note that the number of the heat radiation members 45P provided in the imaging unit 40 is not limited to one, and a plurality of heat radiation members 45P may be provided. When a plurality of heat radiating members 45P are provided in the internal space in the image pickup unit 40, the outer dimensions and the inner diameter of each heat radiating member 45P are appropriately set according to the size and shape of the internal space. .

  Further, as shown in FIG. 6, for example, an end surface that is at least a part of the end portion of the heat radiating member 45 </ b> P or an outer surface of the end portion is brought into contact with the distal bending piece 5 f that constitutes the bending portion 2 b of the insertion portion 2. Also good. In this configuration, an insertion hole 46i through which the heat radiating member 45P is inserted is formed in the imaging frame 46 instead of the communication hole 46h, and at least one end of the heat radiating member 45P protrudes from the imaging frame 46. In this embodiment, the unit through hole 48 is configured only by the heat radiating through hole 45h of the heat radiating member 45P.

  In this way, by making the heat dissipating member provided in the image pickup unit protrude from the image pickup frame and contact the tip bending piece, a part of the heat transferred to the heat dissipating member is transferred to the tip bending piece. Thus, the temperature rise of the image sensor can be prevented more efficiently. Other operations and effects are the same as those of the above-described embodiment.

  In the embodiment described above, the heat radiating member 45 or the heat radiating member 45P is provided in the imaging unit 40. However, in addition to the heat radiating member 45 or the heat radiating member 45P, another heat radiating member may be provided in the imaging unit 40 as shown in FIGS.

  FIG. 7 is a diagram illustrating a configuration of an imaging unit including two types of heat dissipation members, FIG. 8 is a diagram illustrating a configuration example of a heat dissipation member that also serves as a light shielding member, and FIG. 9 is an imaging unit in which an imaging frame is configured with a heat dissipation member. It is a figure explaining.

First, an imaging unit including a heat radiating member that also serves as a light shielding member will be described with reference to FIGS. 7 and 8.
The imaging unit 40A of this embodiment shown in FIG. 7 has a heat radiating member 60 including heat radiating fins 62 as a heat radiating means in addition to the heat radiating member 45P as a heat radiating means. The heat radiating member 60 is an annular member made of a heat conductive member having a high heat transfer property, and is disposed on the front surface side of the light receiving surface of the image sensor 41 and also serves as a light shielding member. For this reason, the heat radiating member of this embodiment is hereafter described as the combined heat radiating member 60.

  The dual-purpose heat radiating member 60 includes an imaging hole 61 through which the light beam that has passed through the objective optical unit 30 passes, and a plurality of heat radiating fins 62 provided on the outer peripheral surface of the dual-purpose heat radiating member 60. The radiating fins 62 are configured by forming a plurality of grooves on the outer peripheral surface of the dual-purpose radiating member 60. The dual-purpose heat radiation member 60 is sandwiched between the second cover lens 47 b and the optical member 63 and is disposed in the element frame 42.

The operation of the dual-purpose heat dissipation member 60 of this embodiment will be described.
The heat generated in the image sensor 41 is transmitted to the dual-purpose heat radiating member 60 via the second cover lens 47 b, and the heat transmitted to the dual-purpose heat radiating member 60 is radiated from the radiating fins 62. The heat radiated from the radiation fins 62 is transmitted to the element frame 42 and also transmitted to the lens frame 33 through the element frame 42.

  In the present embodiment, the outer peripheral surface of the radiating fin 62 is in contact with the inner peripheral surface of the element frame 42. Thus, the heat transmitted to the dual-purpose heat radiating member 60 is transmitted to the element frame 42 not only by radiation but also by conduction.

  As described above, by providing the dual-purpose heat dissipation member including the heat dissipation fin in the element frame constituting the image pickup unit, the heat generated from the image pickup element is radiated from the heat dissipation fin of the dual-purpose heat dissipation member and transmitted to the element frame. Thus, it is possible to prevent the temperature of the image sensor from rising.

  The heat transmitted to the dual-purpose heat radiating member is transmitted to the lens frame through the element frame, and then transmitted to the optical lens fixed to the lens frame. As a result, the optical lens is warmed by the heat transmitted to the lens frame, and fogging can be prevented.

  Furthermore, by providing a dual heat radiating member in addition to the heat radiating member in the image pickup unit, the temperature rise of the image pickup element can be more effectively prevented.

  In the above-described embodiment, the heat radiation fins 62 are configured by forming a plurality of grooves on the outer peripheral surface of the dual-purpose heat radiation member 60. However, as shown in FIG. 8, two types of thin plates 66 and 67 having a through hole 65 constituting an imaging hole 61 of a predetermined size and having different outer diameters, for example, disk shapes, are sequentially stacked and integrated. The dual heat radiation member 60 </ b> A having a heat radiation fin portion including a plurality of heat radiation fins 68 may be fixed. The thin plates 66 and 67 are heat conductive members having high heat transfer properties, and have a thickness dimension of, for example, 0.5 mm or less, and are formed by etching. In the present embodiment, the first thin plate 66 has a larger diameter than the second thin plate 67.

  In this way, the first thin disk and the second thin disk having a predetermined outer shape are sequentially laminated to form the dual-purpose heat dissipation member, thereby forming a plurality of grooves and forming heat dissipation fins. By setting the surface area of the radiating fin of the radiating fin portion large, it is possible to obtain a dual-purpose radiating member having a large radiating efficiency.

  In addition, a 1st thin plate and a 2nd thin plate may be laminated | stacked, and you may make it comprise a pipe-shaped heat radiating member like the said heat radiating member 45P. In this case, the first thin plate and the second thin plate having the same outer diameter and different hole diameters are stacked to form a pipe-shaped heat dissipation member. As a result, a heat radiating member having a predetermined outer diameter and a plurality of heat radiating fins in the through hole is formed. As described above, according to the heat radiating member including a plurality of heat radiating fins in the through hole, the heat transmitted to the heat radiating member is quickly released to the outside of the imaging unit 40 through the unit through hole 48.

Next, an imaging unit in which the imaging frame also serves as a heat radiating member will be described with reference to FIG.
The imaging unit 40B of the present embodiment illustrated in FIG. 9 includes, for example, an imaging frame 46A including a radiation fin 71 as a heat radiation unit in addition to the heat radiation member 45P and the dual heat radiation member 60 as a heat radiation unit.

  The imaging frame 46A of the present embodiment is a circular pipe having a circular cross section, or a square pipe having a square cross section, a hexagonal shape, etc., and a plurality of recesses 72 constituting the heat radiation fins 71 are formed on the outer surface of the imaging frame 46A. Has been. The imaging frame 46A includes a communication hole (not shown) that communicates with the heat dissipation through hole 45h or an insertion hole (not shown) through which the heat dissipation member 45P is inserted.

  In the heat radiating member 45P, the outer peripheral surface of the heat radiating member 45P is in contact with the insulating member 56 provided in the imaging element 41, the insulating member 56 provided in the electronic components 52, 53, and 54, and the inner surface of the imaging frame 46A. ing. Other configurations are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.

  Note that the radiation fins 71 of the imaging frame 46A of the present embodiment are configured by forming a plurality of recesses 72 on the outer surface. However, as shown in FIG. 8, the imaging frame 46 </ b> A including the radiation fins 71 may be configured by sequentially superposing a plurality of thin plates having a predetermined outer shape. The imaging frame 46A having this configuration is formed by sequentially laminating two types of thin plates having different external dimensions and having openings with predetermined shapes and dimensions.

  In the imaging unit 40B of the present embodiment, heat generated from the imaging device 41 and the electronic components 52, 53, and 54 is transmitted to the heat dissipation member 45P via the insulating member 56 or the sealing resins 58a, 58b, and 58c. . Thereafter, the heat is released to the outside of the imaging unit 40 through the unit through hole 48 without being trapped in the imaging unit 40, and is transmitted from the heat radiation member 45 </ b> P to the imaging frame 46 </ b> A and from the heat radiation fin 71 to the imaging unit. 40 is discharged to the outside.

  In this way, by providing the imaging unit with an imaging frame including a radiation fin in addition to the heat radiating member, the heat generated from the imaging element and the electronic component is radiated from the radiation fin of the imaging frame to the outside of the imaging unit. The temperature rise of the image sensor can be prevented more effectively. Other operations and effects are the same as those of the above-described embodiment.

  In the above-described embodiment, the imaging element 41 and the heat radiating members 45 and 45P are brought into contact with each other via the insulating member 56. However, a configuration in which the heat radiating members 45 and 45P and the image sensor 41 are brought into contact with each other via a heat radiating member 76 including an insulating member 56 and a heat radiating fin 75 as shown in the figure for explaining the configuration of the cylindrical heat radiating member in FIG. Anyway. Thus, before the heat transmitted from the image sensor 41 to the heat radiating member 76 is transmitted to the heat radiating members 45 and 45P, the heat transmitted from the heat radiating fins 75 and the heat transmitted to the heat radiating members 45 and 45P are Since heat is radiated from the heat radiating through hole 45h, the heat transmitted from the electronic components 52, 53, 54 to the heat radiating members 45, 45P becomes difficult to be transmitted to the image sensor 41, and temperature rise of the image sensor 41 can be prevented. . In addition, the heat radiating member 76 provided with the heat radiating fin 75 of this embodiment is a solid member.

Another configuration example of the imaging unit will be described with reference to FIGS. 11 to 14.
FIG. 11 is a diagram illustrating a configuration example of an imaging unit including a heat conductive member whose shape changes as a heat radiating unit, FIG. 12 is a diagram illustrating an operation of the heat conductive member included in the imaging unit of FIG. 11, and FIG. FIG. 14 is a diagram illustrating a configuration example of an imaging unit including another heat conductive member whose shape changes, and FIG. 14 is a diagram illustrating an operation of the heat conductive member included in the imaging unit of FIG.

  As shown in FIG. 11, the imaging unit 40 </ b> C of the present embodiment includes a shape memory alloy 80 that is a heat conductive member having high thermal conductivity as a heat radiating member of the image sensor 41 and is configured to reversibly change its shape. ing. One end of the shape memory alloy 80 is fixed to the image sensor 41 via an insulating member 56.

  The shape memory alloy 80 includes, for example, a plurality of bent portions 81 having a bending angle of θ1, and by absorbing heat, the bent portion 81 starts from the bending angle θ1 as shown in FIG. It changes to θ2. Then, the other end portion 82 side of the shape memory alloy 80 is deformed in a direction away from the image sensor 41 as a heat source, and releases heat.

That is, the shape memory alloy 80 prevents the temperature of the image sensor 41 from rising by converting the thermal energy transmitted and accumulated to the shape memory alloy 80 into kinetic energy. The shape memory alloy 80 is restored to the original state of FIG. 11 by changing the bending angle of the bent portion 81 from θ2 to θ1 after heat release.
Note that the imaging unit 40C includes a moving space portion 85 in which the other end portion 82 moves without filling the space portion with the sealing resin 58c so that the shape memory alloy 80 can be deformed by heat.

  As described above, by providing the heat radiating member made of the shape memory alloy in the image pickup unit, the heat generated in the image pickup device is once accumulated in the shape memory alloy, and then converted into kinetic energy and released. As a result, the same operations and effects as those of the above-described embodiment can be obtained.

When the bending angle of the bent portion 81 of the shape memory alloy 80 is changed from θ1 to θ2 so that the other end 82 is moved away from the image sensor 41, the other end 82 is, for example, the inner surface of the image pickup frame 46. The heat accumulated in the shape memory alloy 80 can be transmitted to the imaging frame 46 and the temperature rise of the imaging device can be prevented more effectively.
Moreover, the shape of the shape memory alloy 80 may be a spring structure, and the same effect as described above can be obtained.

  Further, instead of fixing the shape memory alloy 80 to the image sensor 41, the electronic components 52, 53, and 54 in which the bimetal 83 in a straight state is mounted on the circuit board 43 via the insulating member 56 as shown in FIG. You may make it contact on the top.

According to this configuration, heat is transmitted to and stored in the bimetal 83, whereby the bimetal 83 is deformed in a direction away from the electronic component 54, which is a heat source, as shown in FIG. At this time, by bringing the end portion 84 of the bimetal 83 into contact with the inner surface of the imaging frame 46, the heat accumulated in the bimetal 83 is transmitted to the imaging frame 46, and the temperature rise of the imaging element is more effectively prevented. be able to.
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

1 to 6 relate to an embodiment of the present invention, and FIG. 1 is a perspective view illustrating an electronic endoscope including an imaging device. Sectional drawing for demonstrating the structure by the side of the front-end | tip part of the insertion part of an endoscope Sectional drawing explaining the structure of an imaging device provided with the imaging unit provided with the objective optical unit and the heat radiating member FIG. 4 is a diagram illustrating the operation of a unit through hole provided in the imaging unit, as viewed from an arrow A in FIG. 3. The figure explaining the other structural example of a heat radiating member The figure explaining another structural example of a heat radiating member FIGS. 7 to 9 are diagrams for explaining an imaging unit including a heat radiating member having another configuration, and FIG. 7 is a diagram for explaining a configuration of an imaging unit including two types of heat radiating members. The figure explaining the structural example of the thermal radiation member which serves as a light-shielding member The figure explaining the imaging unit which has the imaging frame comprised with the heat radiating member The figure explaining the structure of a cylindrical-shaped heat radiating member FIGS. 11 to 14 are diagrams illustrating another configuration example of the imaging unit, and FIG. 11 is a diagram illustrating a configuration example of the imaging unit including a heat conductive member whose shape changes as a heat radiating unit. The figure explaining the effect | action of the heat conductive member with which the imaging unit of FIG. The figure explaining the structural example of an imaging unit provided with the other heat conductive member from which a shape changes as a thermal radiation means. The figure explaining the effect | action of the heat conductive member with which the imaging unit of FIG. 13 is provided.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Endoscope 2 ... Insertion part 2a ... Tip part 2b ... Curved part 5f ... Tip curve piece 11 ... Hard tip part 20 ... Imaging device 30 ... Objective optical unit 31 ... Optical lens 32 ... Diaphragm 33 ... Lens frame 40 ... Imaging Unit 41 ... Image sensor
42 ... element frame 43 ... circuit board 44 ... signal cable 45 ... heat radiation member 45a ... imaging element contact surface 45b ... electronic component contact surface 45h ... heat dissipation through hole 46 ... imaging frame 46h ... communication hole 47a ... first cover lens
47b ... second cover lens 48 ... unit through hole 52, 53, 54 ... electronic component 56 ... insulating member

Claims (4)

An objective optical unit configured by fixing an optical member to the lens frame, an element frame fixed to the lens frame, and an optical image fixed to the element frame and passing through the objective optical unit is formed. An image sensor having a light receiving surface, a circuit board electrically connected to the image sensor and mounted with electronic components, a signal cable having a signal line connected to the circuit board, and the image sensor, circuit board, and signal cable e Bei an imaging unit composed of the imaging device exterior frame surround a part,
Before SL imaging unit, heat generated from the previous SL imaging device, or heat generated from the mounted electronic component on the circuit board is transmitted, a high thermal conductive heat transfer property of releasing the transferred heat to the outside and radiating holes provided in the heat radiating member formed of a member, you and a composed unit through-hole in said imaging device through hole formed in the outer frame so as to communicate with the heat dissipation through holes Taking In the imaging device ,
The heat radiation member also serves as a substrate angle setting unit that sets an arrangement angle of the circuit board installed in the image pickup unit with respect to the longitudinal axis of the image pickup device. The imaging device according to claim 1 , wherein the unit through hole is a channel through hole constituting a channel for air supply or water supply. The imaging apparatus according to claim 1, wherein the heat dissipation member is a tubular member.     The imaging device according to claim 1, wherein the heat radiating member protrudes through a through-hole formed in the imaging device exterior frame.

Images