JP4844695B2 - Positive-type radiation-sensitive composition for discharge nozzle type coating method, interlayer insulating film for display element and method for forming the same - Google Patents

Description

  The present invention is formed from a positive radiation sensitive composition for a discharge nozzle type coating method suitable as a material for forming an interlayer insulating film for a display element of a display element such as a liquid crystal display element and an organic EL display element, and the composition. The present invention relates to an interlayer insulating film for display elements and a method for forming the same.

  The display element is generally provided with a display element interlayer insulating film for the purpose of insulating between wirings arranged in layers. As a material for forming an interlayer insulating film for a display element, a positive radiation sensitive composition is required because the number of steps for obtaining a necessary pattern shape is small and a high level of flatness is required for the obtained interlayer insulating film for a display element. Things are widely used.

  Regarding such a positive radiation sensitive composition, JP 2004-264623 A discloses a positive radiation sensitive resin composition containing an acetal structure and / or a ketal structure, a resin containing an epoxy group, and an acid generator. Proposed. However, this positive radiation sensitive resin composition has insufficient radiation sensitivity, and is not satisfactory as a material for forming an interlayer insulating film for display elements.

  On the other hand, JP-A-2002-131896 discloses a spin coating method as a method for applying a radiation-sensitive composition to a small substrate. This spin coating method is a coating method in which a radiation-sensitive composition is dropped onto the center of a substrate and then the substrate is spun. Good coating uniformity can be obtained. However, when applying to a large substrate by this spin coating method, the radiation sensitive composition that is shaken off by the spin is discarded, the substrate can be cracked by high-speed rotation, and the tact time is secured. There are inconveniences such as the need to do. In addition, when applied to a larger substrate, a custom motor is required to obtain the acceleration required for spinning, which is disadvantageous in terms of manufacturing cost.

  Therefore, as a coating method instead of the spin coating method, a discharge nozzle type coating method in which a radiation-sensitive composition is discharged from a nozzle and applied onto a substrate has been adopted. The discharge nozzle type coating method is a coating method in which the coating nozzle is swept in a certain direction to form a coating film on the substrate, and the amount of radiation-sensitive composition required for coating is reduced compared to the spin coating method. It is possible to reduce the coating time and is advantageous in terms of manufacturing cost. However, when applied by a discharge nozzle type coating method using a conventional radiation-sensitive composition, uneven coating may occur, and a high level of flatness required as a characteristic of the interlayer insulating film for display elements is realized. Has become an obstacle. Further, for example, in JP 2009-98673 A, there is a description that the radiation-sensitive composition described in this publication can be applied by a method other than the spin coating method, but a suitable viscosity, solid content concentration, Solvents and the like are not specifically disclosed, and in the examples, application by a discharge nozzle type application method or the like is not performed.

  In view of such circumstances, it is possible to form an interlayer insulating film for display elements having high radiation sensitivity and high flatness (thickness uniformity) without application unevenness, and in addition to this, high-speed application Development of a positive radiation-sensitive composition for a discharge nozzle type coating method that can be applied is desired.

JP 2004-264623 A JP 2002-131896 A JP 2009-98673 A

  The present invention has been made based on the above circumstances, and provides an interlayer insulating film for a display element having high radiation sensitivity and high flatness (film thickness uniformity) without coating unevenness. It is an object of the present invention to provide a positive-type radiation-sensitive composition for a discharge nozzle type coating method that can be formed at a high speed, an interlayer insulating film for a display element, and a method for forming the same.

（式（１）中、Ｒ^１及びＲ^２は、それぞれ独立して水素原子、アルキル基、シクロアルキル基又はアリール基である。但し、上記アルキル基、シクロアルキル基及びアリール基が有する水素原子の一部又は全部は、置換されていてもよい。また、Ｒ^１及びＲ^２が共に水素原子である場合はない。Ｒ^３は、アルキル基、シクロアルキル基、アラルキル基、アリール基又は−Ｍ（Ｒ^３ｍ）_３で表される基である。但し、これらの基が有する水素原子の一部又は全部は、置換されていてもよい。Ｍは、Ｓｉ、Ｇｅ又はＳｎである。Ｒ^３ｍは、アルキル基である。但し、Ｒ^１とＲ^３とが連結して、これらが結合している炭素原子と共に環状エーテルを形成してもよい。） The invention made to solve the above problems is
[A] A polymer having a structural unit (I) containing a group represented by the following formula (1) in the same or different polymer molecule and an epoxy group-containing structural unit (hereinafter referred to as “[A] polymer”) )
[B] at least one compound selected from the group consisting of an oxime sulfonate compound and an onium salt compound (hereinafter also referred to as “[B] compound”), and [C] an organic solvent,
The solid content concentration is 10% by mass or more and 30% by mass or less, the viscosity at 25 ° C. is 2.0 mPa · s or more and 12 mPa · s or less, and [C] as an organic solvent, at least (C1) vapor pressure at 20 ° C. Is a positive radiation sensitive composition for a discharge nozzle type coating method containing an organic solvent of 0.1 mmHg or more and less than 1 mmHg.

(In formula (1), R ¹ and R ² are each independently a hydrogen atom, an alkyl group, a cycloalkyl group or an aryl group, provided that the hydrogen atom of the alkyl group, cycloalkyl group and aryl group is A part or all of them may be substituted, and R ¹ and R ² are not both hydrogen atoms, and R ³ is an alkyl group, a cycloalkyl group, an aralkyl group, an aryl group, or —M ( R ^3m) is a group represented by _3. However, some or all of the hydrogen atoms with these groups may .M be substituted, Si, a Ge or Sn ^{.R 3m} is An alkyl group, provided that R ¹ and R ³ may be linked to form a cyclic ether together with the carbon atom to which they are bonded.)

  Since the said composition contains the said [A] polymer, a [B] compound, and a [C] organic solvent, it has a high radiation sensitivity at the time of exposure. In addition, by setting the solid content concentration of the composition within the specific range, it is possible to effectively suppress the occurrence of coating unevenness, and by maintaining the viscosity of the composition within the specific range, film thickness uniformity is maintained. However, even if coating unevenness occurs, a viscosity that can be leveled spontaneously can be achieved in a well-balanced manner, and high-speed coating properties can be realized. In addition, by using the [C] organic solvent having a vapor pressure in the specific range, high-speed coating is possible while preventing coating unevenness even when a discharge nozzle type coating method is employed.

  In the composition, the [C] organic solvent further includes (C2) an organic solvent having a vapor pressure of 1 mmHg or more and 20 mmHg or less at 20 ° C., and (C2) the content of the organic solvent is (C1) C2) It is preferable that it is 10 mass% or more and 90 mass% or less with respect to the total amount of an organic solvent, and (C2) content of an organic solvent is with respect to the total amount of (C1) organic solvent and (C2) organic solvent. More preferably, it is 10 mass% or more and 50 mass% or less. By setting the mass ratio of the organic solvent having a low vapor pressure (C1) and the organic solvent having a high vapor pressure (C2) within the above specific range, the amount of the residual solvent in the coating film after pre-baking is optimized. As a result, it is possible to suppress the occurrence of coating unevenness (such as streak unevenness, pin mark unevenness, and mist unevenness), and to improve the film thickness uniformity. Further, by optimizing the residual solvent amount, the acid generation amount and the acid dissociable group are highly balanced, and the radiation sensitivity tends to be better.

  The composition further contains at least one surfactant selected from the group consisting of [D] fluorine-based surfactant or silicone-based surfactant (hereinafter also referred to as “[D] surfactant”). And it is preferable that content of [D] surfactant is 0.01 mass part or more and 2 mass parts or less with respect to 100 mass parts of [A] polymers. When the composition further contains [D] surfactant, the surface smoothness of the coating film can be improved, and as a result, the thickness uniformity of the interlayer insulating film for a display element to be formed can be further improved. It can be improved. Furthermore, the surface smoothness of a coating film can be improved more by making content of [D] surfactant into the said specific range.

  The composition preferably further contains an [E] polyfunctional (meth) acrylate compound. When the composition further contains an [E] polyfunctional (meth) acrylate compound, the transmittance and heat-resistant transparency of the interlayer insulating film for display elements can be improved.

  The composition preferably further contains [F] antioxidant. When the composition further contains [F] antioxidant, the transmittance and heat-resistant transparency of the interlayer insulating film for display elements can be improved.

  The composition preferably further contains a [G] epoxy compound. When the composition further contains a [G] epoxy compound, the transmittance and heat-resistant transparency of the interlayer insulating film for display elements can be improved.

  (C1) The organic solvent is preferably at least one organic solvent selected from the group consisting of diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, benzyl alcohol, and dipropylene glycol monomethyl ether. ) Organic solvents are diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanone, n-butyl acetate, methyl isobutyl ketone, 3-methoxypropionic acid At least one organic solvent selected from the group consisting of methyl Door is preferable. By selecting the (C1) organic solvent and the (C2) organic solvent from the specific compound, the occurrence of coating unevenness can be further suppressed, and the film thickness uniformity can be further improved.

  The present invention suitably includes an interlayer insulating film for display elements formed from the composition.

The method for forming an interlayer insulating film for a display element of the present invention includes
(1) A step of applying the composition to the substrate while relatively moving the discharge nozzle and the substrate to form a coating film;
(2) A step of irradiating at least a part of the formed coating film with radiation,
(3) a step of developing the coating film irradiated with the radiation; and (4) a step of heating the developed coating film.

  According to the formation method, the composition can be applied at a high speed, has excellent radiation sensitivity, and can form an interlayer insulating film for display elements with excellent film thickness uniformity. By forming a pattern by exposure, development, and heating, a display element interlayer insulating film having a fine and elaborate pattern can be easily formed. Furthermore, the interlayer insulating film for a display element thus formed has no unevenness in coating and has high flatness, and can be suitably used for a display element such as a liquid crystal display element or an organic EL display element.

  In addition, the “discharge nozzle type coating method” referred to in the present specification means a method of discharging and applying the composition to an object to be coated through a nozzle. For example, a plurality of nozzle holes are arranged in a line. Examples include a method of applying the composition using a nozzle having a discharge port, a method of applying the composition using a nozzle having a slit-like discharge port, and the like, after applying the composition on a substrate, This is a concept including an operation of adjusting the film thickness by spinning the substrate. The polymer [A] referred to in the present specification has the structural unit (I) in one polymer molecule, and has an epoxy group-containing structural unit in a polymer molecule different from the one polymer molecule. It is a concept that includes cases. The “radiation” of the “radiation sensitive resin composition” in the present specification is a concept including visible light, ultraviolet light, far ultraviolet light, X-rays, charged particle beams and the like.

  As described above, the positive radiation-sensitive composition for the discharge nozzle type coating method of the present invention has high radiation sensitivity and has high flatness (film thickness uniformity) without coating unevenness. An element interlayer insulating film can be formed, and high-speed coating is possible. Therefore, the composition is suitable as a material for forming an interlayer insulating film for a display element such as a liquid crystal display element or an organic EL display element.

  The positive radiation-sensitive composition for a discharge nozzle type coating method of the present invention contains a [A] polymer, a [B] compound, and a [C] organic solvent. Moreover, the said composition may contain [D] surfactant, [E] polyfunctional (meth) acrylate compound, [F] antioxidant, and [G] epoxy compound as a suitable component. Furthermore, other optional components may be contained as long as the effects of the present invention are not impaired. Hereinafter, each component will be described in detail.

<[A] polymer>
[A] The polymer has the structural unit (I) and the epoxy group-containing structural unit in the same or different polymer molecules, and may have other structural units as necessary. The embodiment of the [A] polymer having the structural unit (I) and the epoxy group-containing structural unit is not particularly limited,
(I) When both the structural unit (I) and the epoxy group-containing structural unit are contained in the same polymer molecule, and one polymer molecule is present in [A] in the polymer;
(Ii) One polymer molecule has the structural unit (I), and a polymer molecule different from the structural unit (I) has an epoxy group-containing structural unit, and [A] in the polymer has two types of polymer molecules. Is present;
(Iii) having both the structural unit (I) and the epoxy group-containing structural unit in one polymer molecule, and having the structural unit (I) in a different polymer molecule; When the polymer molecule has an epoxy group-containing structural unit, and there are three polymer molecules in [A] in the polymer;
(Iv) In addition to the polymer molecules specified in (i) to (iii), there may be mentioned a case where the polymer [A] further contains one or more polymer molecules.

[Structural unit (I)]
The structural unit (I) contains a group represented by the above formula (1), and this group is present as a group (acid dissociable group) that dissociates in the presence of an acid to generate a polar group. The [A] polymer, which was dissociated by the acid generated from the [B] compound by the irradiation of [B] and thus was insoluble in alkali, becomes alkali-soluble. The acid dissociable group has an acetal structure or a ketal structure that is relatively stable with respect to an alkali, and these are dissociated by the action of an acid.

In said formula (1), R < ¹ > and R < ² > are respectively independently a hydrogen atom, an alkyl group, a cycloalkyl group, or an aryl group. However, one part or all part of the hydrogen atom which the said alkyl group, a cycloalkyl group, and an aryl group have may be substituted. Further, there is no case where R ¹ and R ² are both hydrogen atoms. R ³ is an alkyl group, a cycloalkyl group, an aralkyl group, an aryl group, or a group represented by —M (R ^3m ) ₃ . However, some or all of the hydrogen atoms contained in these groups may be substituted. M is Si, Ge, or Sn. R ^3m is an alkyl group. However, R ¹ and R ³ may be linked to form a cyclic ether together with the carbon atom to which they are bonded.

The alkyl group represented by R ¹ and R ² is preferably a linear or branched alkyl group having 1 to 30 carbon atoms. Moreover, this alkyl group may have an oxygen atom, a sulfur atom, or a nitrogen atom in the alkyl chain. Examples of the linear and branched alkyl group having 1 to 30 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, an n-hexyl group, and an n-octyl group. , N-dodecyl group, n-tetradecyl group, n-octadecyl group and other linear alkyl groups, i-propyl group, i-butyl group, t-butyl group, neopentyl group, 2-hexyl group, 3-hexyl group And a branched alkyl group such as.

The cycloalkyl group represented by R ¹ and R ² is preferably a cycloalkyl group having 3 to 20 carbon atoms. Moreover, this C3-C20 cycloalkyl group may be polycyclic and may have an oxygen atom in the ring. Examples of the cycloalkyl group having 3 to 20 carbon atoms include cyclopropyl group, cyclopentyl group, cyclohexyl group, cycloheptyl, cyclooctyl, bornyl group, norbornyl group, adamantyl group and the like.

The aryl group represented by R ¹ and R ² is preferably an aryl group having 6 to 14 carbon atoms. The aryl group having 6 to 14 carbon atoms may be a single ring, a structure in which single rings are connected, or a condensed ring. Examples of the aryl group having 6 to 14 carbon atoms include a phenyl group and a naphthyl group.

Examples of the optionally substituted alkyl group, cycloalkyl group and aryl group represented by R ¹ and R ² include a halogen atom, a hydroxyl group, a nitro group, a cyano group, a carboxyl group, a carbonyl group, a cyclo group. An alkyl group (eg, cyclopropyl group, cyclopentyl group, cyclohexyl group, cycloheptyl, cyclooctyl, bornyl group, norbornyl group, adamantyl group, etc.), aryl group (eg, phenyl group, naphthyl group, etc.), alkoxy group (eg, methoxy group) , An ethoxy group, a propoxy group, an n-butoxy group, a pentyloxy group, a hexyloxy group, a heptyloxy group, an octyloxy group and the like, and an acyl group (for example, an acetyl group and a propionyl group). , Butyryl group, i-butyryl group and the like having 2 to 20 carbon atoms A siloxy group), an acyloxy group (for example, an acetoxy group, an ethylyloxy group, a butyryloxy group, a t-butyryloxy group, a t-amylyloxy group, etc., an acyloxy group having 2 to 10 carbon atoms), an alkoxycarbonyl group (for example, a methoxycarbonyl group) C2-C20 alkoxycarbonyl groups such as ethoxycarbonyl group and propoxycarbonyl group), haloalkyl groups (for example, methyl group, ethyl group, n-propyl group, n-butyl group, n-pentyl group, n-hexyl group) , N-octyl group, n-dodecyl group, n-tetradecyl group, n-octadecyl group and the like linear alkyl group, i-propyl group, i-butyl group, t-butyl group, neopentyl group, 2-hexyl group Alkyl groups such as branched alkyl groups such as 3-hexyl groups; perfluoromethyl groups, perfluoro A group in which some or all of the hydrogen atoms of a cycloalkyl group such as an ethyl group, a perfluoropropyl group, a fluorocyclopropyl group, and a fluorocyclobutyl group are substituted with a halogen atom).

As examples of the alkyl group, cycloalkyl group and aryl group represented by R ³ , for example, the groups exemplified for R ¹ and R ² can be applied. Examples of the aralkyl group represented by R ³ include aralkyl groups having 7 to 20 carbon atoms such as a benzyl group, a phenethyl group, a naphthylmethyl group, and a naphthylethyl group. The ^{-M (R} _{3m) 3} represented by ^{R 3,} for example trimethylsilanyl group, trimethylgermyl group and the like. As the aralkyl group represented by R ³ or the substituent of —M (R ^3m ) ₃ , the substituents exemplified for R ¹ and R ² can be applied.

Examples of the cyclic ether which may be formed together with the carbon atom to which R ¹ and R ³ are linked to each other include 2-oxetanyl group, 2-tetrahydrofuranyl group, 2-tetrahydropyranyl group, 2- A dioxanyl group etc. are mentioned.

  The structural unit (I) can have an acetal structure or a ketal structure by having a functional group that should have an acetal structure or a ketal structure by bonding to another carbon atom.

  Examples of the functional group that should have an acetal structure by bonding to the other carbon atom include 1-methoxyethoxy group, 1-ethoxyethoxy group, 1-n-propoxyethoxy group, 1-i-propoxyethoxy. Group, 1-n-butoxyethoxy group, 1-i-butoxyethoxy group, 1-sec-butoxyethoxy group, 1-t-butoxyethoxy group, 1-cyclopentyloxyethoxy group, 1-cyclohexyloxyethoxy group, 1- Norbornyloxyethoxy group, 1-bornyloxyethoxy group, 1-phenyloxyethoxy group, 1- (1-naphthyloxy) ethoxy group, 1-benzyloxyethoxy group, 1-phenethyloxyethoxy group, (cyclohexyl) (Methoxy) methoxy group, (cyclohexyl) (ethoxy) methoxy group (Cyclohexyl) (n-propoxy) methoxy group, (cyclohexyl) (i-propoxy) methoxy group, (cyclohexyl) (cyclohexyloxy) methoxy group, (cyclohexyl) (phenoxy) methoxy group, (cyclohexyl) (benzyloxy) methoxy group , (Phenyl) (methoxy) methoxy group, (phenyl) (ethoxy) methoxy group, (phenyl) (n-propoxy) methoxy group, (phenyl) (i-propoxy) methoxy group, (phenyl) (cyclohexyloxy) methoxy group , (Phenyl) (phenoxy) methoxy group, (phenyl) (benzyloxy) methoxy group, (benzyl) (methoxy) methoxy group, (benzyl) (ethoxy) methoxy group, (benzyl) (n-propoxy) methoxy group, Benzyl) (i-propo Ii) methoxy group, (benzyl) (cyclohexyloxy) methoxy group, (benzyl) (phenoxy) methoxy group, (benzyl) (benzyloxy) methoxy group, 2-tetrahydrofuranyloxy group, 2-tetrahydropyranyloxy group, 1 -A trimethylsilanyloxyethoxy group, 1-trimethylgermyloxyethoxy group, etc. are mentioned. Of these, 1-ethoxyethoxy group, 1-cyclohexyloxyethoxy group, 2-tetrahydropyranyloxy group, 1-n-propoxyethoxy group, 1-n-butoxyethoxy group, and 2-tetrahydropyranyloxy group are preferable. .

  Examples of the functional group that should have a ketal structure by bonding to the other carbon atom include 1-methyl-1-methoxyethoxy group, 1-methyl-1-ethoxyethoxy group, 1-methyl-1 -N-propoxyethoxy group, 1-methyl-1-i-propoxyethoxy group, 1-methyl-1-n-butoxyethoxy group, 1-methyl-1-i-butoxyethoxy group, 1-methyl-1-sec -Butoxyethoxy group, 1-methyl-1-t-butoxyethoxy group, 1-methyl-1-cyclopentyloxyethoxy group, 1-methyl-1-cyclohexyloxyethoxy group, 1-methyl-1-norbornyloxyethoxy 1-methyl-1-bornyloxyethoxy group, 1-methyl-1-phenyloxyethoxy group, 1-methyl-1- (1-naphth Ruoxy) ethoxy group, 1-methyl-1-benzyloxyoxyethoxy group, 1-methyl-1-phenethyloxyethoxy group, 1-ethyl-1-methoxyethoxy group, 1-ethyl-1-ethoxyethoxy group, 1- Ethyl-1-n-propoxyethoxy group, 1-ethyl-1-i-propoxyethoxy group, 1-ethyl-1-n-butoxyethoxy group, 1-ethyl-1-i-butoxyethoxy group, 1-ethyl- 1-sec-butoxyethoxy group, 1-ethyl-1-t-butoxyethoxy group, 1-ethyl-1-cyclopentyloxyethoxy group, 1-ethyl-1-cyclohexyloxyethoxy group, 1-ethyl-1-norbol Nyloxyethoxy group, 1-ethyl-1-bornyloxyethoxy group, 1-ethyl-1-phenyloxyethoxy group, 1-ethyl -1- (1-naphthyloxy) ethoxy group, 1-ethyl-1-benzyloxyoxyethoxy group, 1-ethyl-1-phenethyloxyethoxy group, 1-cyclohexyl-1-methoxyethoxy group, 1-cyclohexyl-1 -Ethoxyethoxy group, 1-cyclohexyl-1-n-propoxyethoxy group, 1-cyclohexyl-1-i-propoxyethoxy group, 1-cyclohexyl-1-cyclohexyloxyethoxy group, 1-cyclohexyl-1-phenoxyethoxy group, 1-cyclohexyl-1-benzyloxyethoxy group, 1-phenyl-1-methoxyethoxy group, 1-phenyl-1-ethoxyethoxy group, 1-phenyl-1-n-propoxyethoxy group, 1-phenyl-1-i -Propoxyethoxy group, 1-phenyl-1-cyclohexylo Xylethoxy group, 1-phenyl-1-phenyloxyethoxy group, 1-phenyl-1-benzyloxyethoxy group, 1-benzyl-1-methoxyethoxy group, 1-benzyl-1-ethoxyethoxy group, 1-benzyl-1 -N-propoxyethoxy group, 1-benzyl-1-i-propoxyethoxy group, 1-benzyl-1-cyclohexyloxyethoxy group, 1-benzyl-1-phenyloxyethoxy group, 1-benzyl-1-benzyloxyethoxy Group, 2- (2-methyl-tetrahydrofuranyl) oxy group, 2- (2-methyl-tetrahydropyranyl) oxy group, 1-methoxy-cyclopentyloxy group, 1-methoxy-cyclohexyloxy group and the like. Of these, a 1-methyl-1-methoxyethoxy group and a 1-methyl-1-cyclohexyloxyethoxy group are preferable.

  Examples of the structural unit (I) having the acetal structure or ketal structure include structural units represented by the following formulas (1-1) to (1-3).

In said formula (1-1)-(1-3), R < ¹ >, R < ² > and R < ³ > are synonymous with said formula (1). In said formula (1-1) and (1-3), R 'is a hydrogen atom or a methyl group.

Examples of monomers that give structural units represented by the above formulas (1-1) to (1-3) (hereinafter also referred to as “acetal structure-containing monomers”) include, for example, (meth) acrylic acid 1-alkoxy Alkyl, 1- (cycloalkyloxy) alkyl (meth) acrylate, 1- (haloalkoxy) alkyl (meth) acrylate, 1- (aralkyloxy) alkyl (meth) acrylate, tetrahydropyranyl (meth) acrylate (Meth) acrylate-based acetal structure-containing monomers such as
2,3-di (1- (trialkylsilanyloxy) alkoxy) carbonyl) -5-norbornene, 2,3-di (1- (trialkylgermyloxy) alkoxy) carbonyl) -5-norbornene, 2, 3-di (1-alkoxyalkoxycarbonyl) -5-norbornene, 2,3-di (1- (cycloalkyloxy) alkoxycarbonyl) -5-norbornene, 2,3-di (1- (aralkyloxy) alkoxycarbonyl ) Norbornene-based acetal structure-containing monomers such as -5-norbornene;
Examples thereof include styrene-based acetal structure-containing monomers such as 1-alkoxyalkoxystyrene, 1- (haloalkoxy) alkoxystyrene, 1- (aralkyloxy) alkoxystyrene, and tetrahydropyranyloxystyrene.

  More specific examples of the (meth) acrylate-based acetal structure-containing monomer include, for example, 1-ethoxyethyl methacrylate, 1-methoxyethyl methacrylate, 1-n-butoxyethyl methacrylate, 1-isomethacrylate. Butoxyethyl, 1-t-butoxyethyl methacrylate, 1- (2-chloroethoxy) ethyl methacrylate, 1- (2-ethylhexyloxy) ethyl methacrylate, 1-n-propoxyethyl methacrylate, 1-cyclohexyl methacrylate Oxyethyl, 1- (2-cyclohexylethoxy) ethyl methacrylate, 1-benzyloxyethyl methacrylate, 2-tetrahydropyranyl methacrylate, 1-ethoxyethyl acrylate, 1-methoxyethyl acrylate, 1-n acrylic acid -Butoxyethyl, acrylic 1-isobutoxyethyl, 1-t-butoxyethyl acrylate, 1- (2-chloroethoxy) ethyl acrylate, 1- (2-ethylhexyloxy) ethyl acrylate, 1-n-propoxyethyl acrylate, acrylic acid Examples include 1-cyclohexyloxyethyl, 1- (2-cyclohexylethoxy) ethyl acrylate, 1-benzyloxyethyl acrylate, 2-tetrahydropyranyl acrylate, and the like.

  More specific examples of the norbornene-based acetal structure-containing monomer include 2,3-di (1- (trimethylsilanyloxy) ethoxy) carbonyl) -5-norbornene and 2,3-di (1- (Trimethylgermyloxy) ethoxy) carbonyl) -5-norbornene, 2,3-di (1-methoxyethoxycarbonyl) -5-norbornene, 2,3-di (1- (cyclohexyloxy) ethoxycarbonyl) -5 Examples include norbornene and 2,3-di (1- (benzyloxy) ethoxycarbonyl) -5-norbornene.

  More specific examples of the styrene-based acetal structure-containing monomer include, for example, p or m-1-ethoxyethoxystyrene, p or m-1-methoxyethoxystyrene, p or m-1-n-butoxyethoxystyrene. , P or m-1-isobutoxyethoxystyrene, p or m-1- (1,1-dimethylethoxy) ethoxystyrene, p or m-1- (2-chloroethoxy) ethoxystyrene, p or m-1- (2-ethylhexyloxy) ethoxystyrene, p or m-1-n-propoxyethoxystyrene, p or m-1-cyclohexyloxyethoxystyrene, p or m-1- (2-cyclohexylethoxy) ethoxystyrene, p or m Examples include -1-benzyloxyethoxystyrene.

  As the structural unit (I), a structural unit represented by the above formula (1-1) is preferable. As the acetal structure-containing monomer, 1-alkoxyalkyl (meth) acrylate, tetrahydropyranyl (meth) acrylate, 1-alkoxyalkoxystyrene (meth) acrylate, tetrahydropyranyloxystyrene are preferable, and (meth) 1-alkoxyalkyl acrylate is more preferable, and 1-ethoxyethyl methacrylate, 1-n-butoxyethyl methacrylate, 2-tetrahydropyranyl methacrylate, and 1-benzyloxyethyl methacrylate are particularly preferable.

  As the acetal structure-containing monomer, a commercially available product may be used, or a monomer synthesized by a known method may be used. For example, the acetal structure-containing monomer that gives the structural unit represented by the above formula (1-1) can be obtained by, for example, a method of reacting (meth) acrylic acid with vinyl ether in the presence of an acid catalyst as shown below. Can be synthesized.

In the above formulas, R ', ^{R 1} and ^{R 3} is as defined in the above formula (1-1). R ²¹ and R ²² are the same as R ² in the above formula (1-1) as —CH (R ²¹ ) (R ²² ).

  [A] The polymer may have one or more structural units (I). [A] The content of the structural unit (I) in the polymer is not particularly limited as long as the [A] polymer is alkali-soluble by an acid and exhibits the desired heat resistance of the interlayer insulating film for display elements. When both the structural unit (I) and the epoxy group-containing structural unit are contained in one polymer molecule, the monomer charge ratio is preferably 5% by mass to 70% by mass, and more preferably 10% by mass to 60% by mass. Preferably, 20% by mass to 50% by mass is particularly preferable.

  On the other hand, when one polymer molecule has a structural unit (I) and another polymer molecule has an epoxy group-containing structural unit, the structural unit in one polymer molecule having the structural unit (I) As content of (I), 40 mass%-99 mass% are preferable at monomer preparation ratio, 50 mass%-98 mass% are more preferable, 55 mass%-95 mass% are especially preferable.

[Epoxy group-containing structural unit]
[A] The polymer has an epoxy group-containing structural unit together with the structural unit (I). The epoxy group-containing structural unit is a structural unit derived from an epoxy group-containing monomer. The epoxy group is a concept including an oxiranyl group (1,2-epoxy structure) and an oxetanyl group (1,3-epoxy structure). [A] When a polymer has an epoxy group containing structural unit in a molecule | numerator, the hardness of the interlayer insulation film for display elements obtained from the said composition can be improved, and heat resistance can be improved more.

Examples of the epoxy group-containing monomer that gives an epoxy group-containing structural unit include glycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3-methyl-3,4-epoxybutyl acrylate, methacryl 3-ethyl-3,4-epoxybutyl acid, 5,6-epoxyhexyl (meth) acrylate, 5-methyl-5,6-epoxyhexyl methacrylate, 5-ethyl-5,6-epoxyhexyl methacrylate, (Meth) acrylic acid 6,7-epoxyheptyl, 3,4-epoxycyclohexyl methacrylate, 3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexylethyl (meth) acrylate, methacrylic acid 3,4-epoxycyclohexylpropyl, 3,4-epoxycyclohexylbutyl methacrylate, (meth T) 3,4-epoxycyclohexylhexyl acrylate, 3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexylethyl acrylate, 3,4-epoxycyclohexylpropyl acrylate, acrylic acid Oxiranyl group-containing (meth) acrylic compounds such as 3,4-epoxycyclohexylbutyl and 3,4-epoxycyclohexylhexyl acrylate;
o-vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether, α-methyl-o-vinyl benzyl glycidyl ether, α-methyl-m-vinyl benzyl glycidyl ether, α-methyl-p-vinyl Vinyl benzyl glycidyl ethers such as benzyl glycidyl ether;
vinyl phenyl glycidyl ethers such as o-vinyl phenyl glycidyl ether, m-vinyl phenyl glycidyl ether, p-vinyl phenyl glycidyl ether;
3- (acryloyloxymethyl) oxetane, 3- (acryloyloxymethyl) -3-methyloxetane, 3- (acryloyloxymethyl) -3-ethyloxetane, 3- (acryloyloxymethyl) -3-phenyloxetane, 3- (2-acryloyloxyethyl) oxetane, 3- (2-acryloyloxyethyl) -3-ethyloxetane, 3- (2-acryloyloxyethyl) -3-ethyloxetane, 3- (2-acryloyloxyethyl) -3 -Phenyloxetane, 3- (methacryloyloxymethyl) oxetane, 3- (methacryloyloxymethyl) -3-methyloxetane, 3- (methacryloyloxymethyl) -3-ethyloxetane, 3- (methacryloyloxymethyl) -3-phenyl Oxetane, -(2-methacryloyloxyethyl) oxetane, 3- (2-methacryloyloxyethyl) -3-ethyloxetane, 3- (2-methacryloyloxyethyl) -3-ethyloxetane, 3- (2-methacryloyloxyethyl)- 3-phenyloxetane, 2- (acryloyloxymethyl) oxetane, 2- (acryloyloxymethyl) -2-methyloxetane, 2- (acryloyloxymethyl) -2-ethyloxetane, 2- (acryloyloxymethyl) -2- Phenyloxetane, 2- (2-acryloyloxyethyl) oxetane, 2- (2-acryloyloxyethyl) -2-ethyloxetane, 2- (2-acryloyloxyethyl) -2-ethyloxetane, 2- (2-acryloyl) Oxyethyl) -2-fe Luoxetane, 2- (methacryloyloxymethyl) oxetane, 2- (methacryloyloxymethyl) -2-methyloxetane, 2- (methacryloyloxymethyl) -2-ethyloxetane, 2- (methacryloyloxymethyl) -2-phenyloxetane, 2- (2-methacryloyloxyethyl) oxetane, 2- (2-methacryloyloxyethyl) -2-ethyloxetane, 2- (2-methacryloyloxyethyl) -2-ethyloxetane, 2- (2-methacryloyloxyethyl) Examples include oxetanyl group-containing (meth) acrylic compounds such as 2-phenyloxetane.

  Among the above epoxy group-containing monomers, glycidyl methacrylate, 2-methylglycidyl methacrylate, 3,4-epoxycyclohexyl methacrylate, 3,4-epoxycyclohexylmethyl methacrylate, 3- (methacryloyloxymethyl) -3- Methyl oxetane and 3- (methacryloyloxymethyl) -3-ethyloxetane are preferable from the viewpoint of copolymerization reactivity with other radical polymerizable monomers and developability of the composition.

  [A] The polymer may have one or more epoxy group-containing structural units. [A] The content of the epoxy group-containing structural unit in the polymer is not particularly limited as long as the desired heat resistance of the interlayer insulating film for display elements is exhibited. The structural unit (I) When the epoxy group-containing structural unit is included, the monomer charge ratio is preferably 1% by mass to 60% by mass, and 15% by mass to 55% by mass with respect to the structural unit (I) contained in the [A] polymer. Is more preferable, and 20% by mass to 50% by mass is particularly preferable.

  On the other hand, when one polymer molecule has a structural unit (I) and another polymer molecule has an epoxy group-containing structural unit, it is included in one polymer molecule having an epoxy group-containing structural unit. As content of an epoxy group containing structural unit, 1 mass%-80 mass% are preferable by monomer preparation ratio, 30 mass%-70 mass% are more preferable, and 35 mass%-65 mass% are especially preferable.

[Other structural units]
[A] The polymer may contain other structural units other than the structural unit (I) and the epoxy group-containing structural unit. Examples of the monomer that gives other structural units include a monomer having a carboxyl group or a derivative thereof, a monomer having a hydroxyl group, and other monomers.

  Examples of the monomer having a carboxyl group or a derivative thereof include acrylic acid, methacrylic acid, crotonic acid, 2-acryloyloxyethyl succinic acid, 2-methacryloyloxyethyl succinic acid, 2-acryloyloxyethyl hexahydrophthalic acid, Examples thereof include monocarboxylic acids such as 2-methacryloyloxyethyl hexahydrophthalic acid; dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, and itaconic acid; and acid anhydrides of the above dicarboxylic acids. Of these monomers having a carboxyl group or a derivative thereof, methacrylic acid is preferred.

  Examples of the monomer having a hydroxyl group include hydroxyalkyl acrylates such as 2-hydroxyethyl acrylate, 3-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, 4-hydroxymethylcyclohexylmethyl acrylate; methacrylic acid 2 -Hydroxyethyl, 3-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, 5-hydroxypentyl methacrylate, 6-hydroxyhexyl methacrylate, 4-hydroxymethyl methacrylate-hydroxyalkyl methacrylate and the like. It is done. Of these monomers having a hydroxyl group, 2-hydroxyethyl acrylate, 3-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, and methacrylic acid 2 are used from the viewpoint of heat resistance of the obtained interlayer insulating film for display elements. -Hydroxyethyl, 4-hydroxybutyl methacrylate, 4-hydroxymethyl-cyclohexylmethyl acrylate, 4-hydroxymethyl-cyclohexylmethyl methacrylate are preferred.

Examples of other monomers include alkyl acrylates such as methyl acrylate and i-propyl acrylate;
Alkyl methacrylates such as methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, t-butyl methacrylate;
Cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl acrylate, 2- (tricyclo [5.2.1.0 ^2,6 ] acrylate Decyl-8-yloxy) ethyl, cycloaliphatic alkyl acrylates such as isobornyl acrylate;
Cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, tricyclo [5.2.1.0 ^2,6 ] decane-8-yl methacrylate, 2- (tricyclo [5.2.1.0 ^2,6 ] methacrylate) Decane-8-yloxy) ethyl, cycloaliphatic alkyl methacrylates such as isobornyl methacrylate;
Aryl esters of acrylic acid such as phenyl acrylate and benzyl acrylate or aralkyl of acrylic acid;
Aryl esters of methacrylic acid such as phenyl methacrylate and benzyl methacrylate or aralkyl of methacrylic acid;
Dialkyl dicarboxylates such as diethyl maleate, diethyl fumarate, diethyl itaconate;
Unsaturated hetero 5-membered methacrylic acid ester or unsaturated hetero 6-membered methacrylic acid containing 1 atom of oxygen such as tetrahydrofurfuryl methacrylate, tetrahydrofuryl methacrylate, tetrahydropyran-2-methyl methacrylate;
4-methacryloyloxymethyl-2-methyl-2-ethyl-1,3-dioxolane, 4-methacryloyloxymethyl-2-methyl-2-isobutyl-1,3-dioxolane, 4-methacryloyloxymethyl-2-cyclohexyl- 2 oxygen atoms such as 1,3-dioxolane, 4-methacryloyloxymethyl-2-methyl-2-ethyl-1,3-dioxolane, 4-methacryloyloxymethyl-2-methyl-2-isobutyl-1,3-dioxolane An unsaturated heterocyclic 5-membered methacrylic acid containing:
4-acryloyloxymethyl-2,2-dimethyl-1,3-dioxolane, 4-acryloyloxymethyl-2-methyl-2-ethyl-1,3-dioxolane, 4-acryloyloxymethyl-2, 2-diethyl- 1,3-dioxolane, 4-acryloyloxymethyl-2-methyl-2-isobutyl-1,3-dioxolane, 4-acryloyloxymethyl-2-cyclopentyl-1,3-dioxolane, 4-acryloyloxymethyl-2- Cyclohexyl-1,3-dioxolane, 4-acryloyloxyethyl-2-methyl-2-ethyl-1,3-dioxolane, 4-acryloyloxypropyl-2-methyl-2-ethyl-1,3-dioxolane, 4- Acryloyloxybutyl-2-methyl-2-ethyl-1,3-dioxola Unsaturated five-membered heterocyclic acrylic acid containing oxygen 2 atoms and the like;
Vinyl aromatic compounds such as styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, p-methoxystyrene, 4-isopropenylphenol;
N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidocaproate, N-succinimidyl-3 -N-substituted maleimides such as maleimide propionate, N- (9-acridinyl) maleimide;
Conjugated diene compounds such as 1,3-butadiene, isoprene and 2,3-dimethyl-1,3-butadiene;
And unsaturated compounds such as acrylonitrile, methacrylonitrile, acrylamide, methacrylamide, vinyl chloride, vinylidene chloride and vinyl acetate.

Among these other monomers, styrene, 4-isopropenylphenol, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl methacrylate, tetrahydrofurfuryl methacrylate, 1,3-butadiene 4-acryloyloxymethyl-2-methyl-2-ethyl-1,3-dioxolane, N-cyclohexylmaleimide, N-phenylmaleimide, benzyl methacrylate is a monomer having the above carboxyl group or a derivative thereof, a hydroxyl group From the viewpoints of copolymerization reactivity with a monomer having a photopolymerization property and developability of the composition.

[A] Polystyrene conversion weight average molecular weight (Mw) by gel permeation chromatography (GPC) of the polymer is preferably 2.0 × 10 ^{3 to} 1.0 × 10 ⁵ , more preferably 5.0 × 10. ^{3 to} 5.0 × 10 ⁴ . [A] By making Mw of a polymer into the said specific range, the radiation sensitivity and alkali developability of the said composition can be improved.

[A] The number average molecular weight (Mn) in terms of polystyrene by GPC of the polymer is preferably 2.0 × 10 ^{3 to} 1.0 × 10 ⁵ , more preferably 5.0 × 10 ^{3 to} 5.0 × 10. ⁴ . [A] By making Mn of a polymer into the said specific range, the curing reactivity at the time of hardening of the coating film of the said composition can be improved.

  [A] The molecular weight distribution (Mw / Mn) of the polymer is preferably 3.0 or less, more preferably 2.6 or less. [A] By setting Mw / Mn of the polymer to 3.0 or less, the developability of the obtained interlayer insulating film for display elements can be enhanced.

Mw and Mn were measured by GPC under the following conditions.
Apparatus: GPC-101 (made by Showa Denko)
Column: GPC-KF-801, GPC-KF-802, GPC-KF-803 and GPC-KF-804 are combined Mobile phase: Tetrahydrofuran Column temperature: 40 ° C
Flow rate: 1.0 mL / min Sample concentration: 1.0% by mass
Sample injection volume: 100 μL
Detector: Differential refractometer Standard material: Monodisperse polystyrene

<[A] Polymer Synthesis Method>
[A] The polymer can be synthesized by radical copolymerization of monomers giving the above structural units. In the case of synthesizing the [A] polymer containing both the structural unit (I) and the epoxy group-containing structural unit in the same polymer molecule, a mixture containing at least an acetal structure-containing monomer and an epoxy group-containing monomer May be used for copolymerization. On the other hand, in the case of synthesizing the [A] polymer having the structural unit (I) in one polymer molecule and the epoxy group-containing structural unit in a different polymer molecule, at least the acetal structure-containing monomer A polymer solution containing the structural unit (I) is obtained by radical polymerization of a polymerizable solution containing, and a polymer solution containing at least an epoxy group-containing monomer is radically polymerized to have an epoxy group-containing structural unit. What is necessary is just to obtain a polymer molecule | numerator and finally mix both to make [A] polymer.

  [A] Solvents used in the polymerization reaction of the polymer include, for example, alcohols, ethers, glycol ethers, ethylene glycol alkyl ether acetates, diethylene glycol alkyl ethers, propylene glycol monoalkyl ethers, propylene glycol monoalkyl ether acetates, propylene glycols Examples include monoalkyl ether propionates, aromatic hydrocarbons, ketones, and other esters.

  Examples of alcohols include methanol, ethanol, benzyl alcohol, 2-phenylethyl alcohol, 3-phenyl-1-propanol and the like.

  Examples of ethers include tetrahydrofuran.

  Examples of glycol ethers include ethylene glycol monomethyl ether and ethylene glycol monoethyl ether.

  Examples of the ethylene glycol alkyl ether acetate include methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate, and ethylene glycol monoethyl ether acetate.

  Examples of the diethylene glycol alkyl ether include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and diethylene glycol ethyl methyl ether.

  Examples of the propylene glycol monoalkyl ether include propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether and the like.

  Examples of the propylene glycol monoalkyl ether acetate include propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate and the like.

  Examples of the propylene glycol monoalkyl ether propionate include propylene monoglycol methyl ether propionate, propylene glycol monoethyl ether propionate, propylene glycol monopropyl ether propionate, propylene glycol monobutyl ether propionate and the like. .

  Examples of aromatic hydrocarbons include toluene and xylene.

  Examples of ketones include methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, and the like.

  Examples of other esters include methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, hydroxy Methyl acetate, ethyl hydroxyacetate, butyl hydroxyacetate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate Methyl 2-hydroxy-3-methylbutanoate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, Methyl ropoxyacetate, ethyl propoxyacetate, propylpropoxyacetate, butyl propoxyacetate, methyl butoxyacetate, ethyl butoxyacetate, propylbutoxyacetate, butylbutoxyacetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, 2-methoxypropion Propyl acid, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, methyl 2-butoxypropionate, 2-butoxypropionic acid Ethyl, propyl 2-butoxypropionate, butyl 2-butoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, 3-methyl Butyl xylpropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate, 3-propoxy Examples include propyl propionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate, and butyl 3-butoxypropionate.

  Of these solvents, ethylene glycol alkyl ether acetate, diethylene glycol alkyl ether, propylene glycol monoalkyl ether, propylene glycol monoalkyl ether acetate, and butyl methoxyacetate are preferred. Diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether acetate, propylene More preferred are glycol monomethyl ether and butyl methoxyacetate.

As the polymerization initiator used in the polymerization reaction, those generally known as radical polymerization initiators can be used. For example, 2,2′-azobisisobutyronitrile, 2,2′-azobis- ( 2,4-dimethylvaleronitrile) (ADVN), 2,2′-azobis- (4-methoxy-2,4-dimethylvaleronitrile), 2,2′-azobis (methyl 2-methylpropionate), etc. Compound;
And organic peroxides such as benzoyl peroxide, lauroyl peroxide, t-butylperoxypivalate, 1,1′-bis- (t-butylperoxy) cyclohexane; and hydrogen peroxide.

  [A] In the polymerization reaction for producing the polymer, a molecular weight modifier may be used to adjust the molecular weight. Examples of the molecular weight modifier include halogenated hydrocarbons such as chloroform and carbon tetrabromide; mercaptans such as n-hexyl mercaptan, n-octyl mercaptan, n-dodecyl mercaptan, t-dodecyl mercaptan, and thioglycolic acid; Examples thereof include xanthogens such as dimethylxanthogen sulfide and diisopropylxanthogen disulfide; terpinolene and α-methylstyrene dimer.

<[B] Compound>
[B] The compound is at least one compound selected from the group consisting of an oxime sulfonate compound and an onium salt compound, and is a compound that generates an acid upon irradiation with radiation. Here, as the radiation, for example, visible light, ultraviolet light, far ultraviolet light, electron beam, X-ray or the like can be used. By including the [B] compound and the [A] polymer having an acid dissociable group, the composition can exhibit positive radiation sensitive characteristics.

[Oxime sulfonate compound]
Examples of the oxime sulfonate compound include a compound containing an oxime sulfonate group represented by the following formula (2).

In the above formula (2), R ^B1 is a linear, branched or cyclic alkyl group which may be substituted, or an aryl group which may be substituted.

The alkyl group represented by R ^B1 is preferably a linear or branched alkyl group having 1 to 10 carbon atoms. The linear or branched alkyl group having 1 to 10 carbon atoms may be substituted. Examples of the substituent include an alkoxy group having 1 to 10 carbon atoms and 7,7-dimethyl-2-oxonorbornyl. And an alicyclic group containing a bridged alicyclic group such as a group. A preferred alicyclic group is a bicycloalkyl group. As the aryl group represented by R ^B1 , an aryl group having 6 to 11 carbon atoms is preferable, and a phenyl group or a naphthyl group is more preferable. The aryl group may be substituted, and examples of the substituent include an alkyl group having 1 to 5 carbon atoms, an alkoxy group, and a halogen atom.

  Examples of the compound containing an oxime sulfonate group represented by the above formula (2) include an oxime sulfonate compound represented by the following formula (3).

In the above formula (3), R ^B1 has the same ^{meaning as} in the above formula (2). X is an alkyl group, an alkoxy group, or a halogen atom. m is an integer of 0-3. However, when there are a plurality of Xs, the plurality of Xs may be the same or different.

  The alkyl group that can be represented by X is preferably a linear or branched alkyl group having 1 to 4 carbon atoms. The alkoxy group represented by X is preferably a linear or branched alkoxy group having 1 to 4 carbon atoms. The halogen atom represented by X is preferably a chlorine atom or a fluorine atom. As m, 0 or 1 is preferable. In the above formula (3), a compound in which m is 1, X is a methyl group, and the substitution position of X is ortho is preferable.

  Examples of the oxime sulfonate compound represented by the above (3) include compounds represented by the following formulas (i) to (v).

  The above compound (i) (5-propylsulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile, compound (ii) (5-octylsulfonyloxyimino-5H-thiophene-2- Ylidene)-(2-methylphenyl) acetonitrile, compound (iii) (camphorsulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile, compound (iv) (5-p-toluenesulfonyloxy) Imino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile and compound (v) (5-octylsulfonyloxyimino)-(4-methoxyphenyl) acetonitrile are commercially available.

[Onium salt]
Examples of the onium salt include diphenyliodonium salt, triphenylsulfonium salt, sulfonium salt, benzothiazonium salt, and tetrahydrothiophenium salt.

  Examples of the diphenyliodonium salt include diphenyliodonium tetrafluoroborate, diphenyliodonium hexafluorophosphonate, diphenyliodonium hexafluoroarsenate, diphenyliodonium trifluoromethanesulfonate, diphenyliodonium trifluoroacetate, diphenyliodonium-p-toluenesulfonate, diphenyliodonium Butyltris (2,6-difluorophenyl) borate, 4-methoxyphenylphenyliodonium tetrafluoroborate, bis (4-t-butylphenyl) iodonium tetrafluoroborate, bis (4-t-butylphenyl) iodonium hexafluoroarsenate Bis (4-t-butylphenyl) iodonium trifluorome Sulphonate, bis (4-t-butylphenyl) iodonium trifluoroacetate, bis (4-t-butylphenyl) iodonium-p-toluenesulfonate, bis (4-t-butylphenyl) iodonium camphorsulfonic acid, etc. .

  Examples of the triphenylsulfonium salt include triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium camphorsulfonic acid, triphenylsulfonium tetrafluoroborate, triphenylsulfonium trifluoroacetate, triphenylsulfonium-p-toluenesulfonate, triphenylsulfonium. And butyl tris (2,6-difluorophenyl) borate.

  Examples of the sulfonium salt include alkylsulfonium salts, benzylsulfonium salts, dibenzylsulfonium salts, substituted benzylsulfonium salts and the like.

  Examples of the alkylsulfonium salt include 4-acetoxyphenyldimethylsulfonium hexafluoroantimonate, 4-acetoxyphenyldimethylsulfonium hexafluoroarsenate, dimethyl-4- (benzyloxycarbonyloxy) phenylsulfonium hexafluoroantimonate, dimethyl-4- (Benzoyloxy) phenylsulfonium hexafluoroantimonate, dimethyl-4- (benzoyloxy) phenylsulfonium hexafluoroarsenate, dimethyl-3-chloro-4-acetoxyphenylsulfonium hexafluoroantimonate and the like can be mentioned.

  Examples of the benzylsulfonium salt include benzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, benzyl-4-hydroxyphenylmethylsulfonium hexafluorophosphate, 4-acetoxyphenylbenzylmethylsulfonium hexafluoroantimonate, benzyl-4-methoxyphenyl. Methylsulfonium hexafluoroantimonate, benzyl-2-methyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, benzyl-3-chloro-4-hydroxyphenylmethylsulfonium hexafluoroarsenate, 4-methoxybenzyl-4-hydroxyphenyl Examples include methylsulfonium hexafluorophosphate.

  Examples of the dibenzylsulfonium salt include dibenzyl-4-hydroxyphenylsulfonium hexafluoroantimonate, dibenzyl-4-hydroxyphenylsulfonium hexafluorophosphate, 4-acetoxyphenyldibenzylsulfonium hexafluoroantimonate, and dibenzyl-4-methoxyphenylsulfonium. Hexafluoroantimonate, dibenzyl-3-chloro-4-hydroxyphenylsulfonium hexafluoroarsenate, dibenzyl-3-methyl-4-hydroxy-5-t-butylphenylsulfonium hexafluoroantimonate, benzyl-4-methoxybenzyl- Examples include 4-hydroxyphenylsulfonium hexafluorophosphate.

  Examples of substituted benzylsulfonium salts include p-chlorobenzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, p-nitrobenzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, and p-chlorobenzyl-4-hydroxyphenylmethyl. Sulfonium hexafluorophosphate, p-nitrobenzyl-3-methyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, 3,5-dichlorobenzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, o-chlorobenzyl-3- Examples include chloro-4-hydroxyphenylmethylsulfonium hexafluoroantimonate.

  Examples of the benzothiazonium salt include 3-benzylbenzothiazonium hexafluoroantimonate, 3-benzylbenzothiazonium hexafluorophosphate, 3-benzylbenzothiazonium tetrafluoroborate, and 3- (p-methoxybenzyl). ) Benzothiazonium hexafluoroantimonate, 3-benzyl-2-methylthiobenzothiazonium hexafluoroantimonate, 3-benzyl-5-chlorobenzothiazonium hexafluoroantimonate, and the like.

  Examples of tetrahydrothiophenium salts include 4,7-di-n-butoxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate and 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium trifluoromethane. Sulfonate, 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium nonafluoro-n-butanesulfonate, 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium-1,1 , 2,2-Tetrafluoro-2- (norbornan-2-yl) ethanesulfonate, 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium-2- (5-t-butoxycarbonyloxybicyclo) [2.2.1] Heptan-2-yl) -1,1, , 2-tetrafluoroethanesulfonate, 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium-2- (6-t-butoxycarbonyloxybicyclo [2.2.1] heptan-2-yl ) -1,1,2,2-tetrafluoroethanesulfonate and the like.

  The [B] compound may include a sulfonimide compound, a halogen-containing compound, a diazomethane compound, a sulfone compound, a sulfonic acid ester compound, a carboxylic acid ester compound, and the like.

  Examples of the sulfonimide compound include N- (trifluoromethylsulfonyloxy) succinimide, N- (camphorsulfonyloxy) succinimide, N- (4-methylphenylsulfonyloxy) succinimide, N- (2-trifluoromethylphenylsulfonyloxy). ) Succinimide, N- (4-fluorophenylsulfonyloxy) succinimide, N- (trifluoromethylsulfonyloxy) phthalimide, N- (camphorsulfonyloxy) phthalimide, N- (2-trifluoromethylphenylsulfonyloxy) phthalimide, N -(2-fluorophenylsulfonyloxy) phthalimide, N- (trifluoromethylsulfonyloxy) diphenylmaleimide, N- (camphorsulfonyloxy) diphenyl monomer Imido, 4-methylphenylsulfonyloxy) diphenylmaleimide, N- (2-trifluoromethylphenylsulfonyloxy) diphenylmaleimide, N- (4-fluorophenylsulfonyloxy) diphenylmaleimide, N- (4-fluorophenylsulfonyloxy) Diphenylmaleimide, N- (phenylsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (4-methylphenylsulfonyloxy) bicyclo [2.2.1] Hept-5-ene-2,3-dicarboxylimide, N- (trifluoromethanesulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (nonafluorobutane Sulfonyloxy) bicyclo [2.2.1] Pto-5-ene-2,3-dicarboxylimide, N- (camphorsulfonyloxy) bicyclo [2.2.1] hept-5-en-2,3-dicarboxylimide, N- (camphorsulfonyloxy) -7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (trifluoromethylsulfonyloxy) -7-oxabicyclo [2.2.1] hept-5 -Ene-2,3-dicarboxylimide, N- (4-methylphenylsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (4-methylphenyl) Sulfonyloxy) -7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (2-trifluoromethylphenylsulfonyl) Ruoxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (2-trifluoromethylphenylsulfonyloxy) -7-oxabicyclo [2.2.1] hept- 5-ene-2,3-dicarboxylimide, N- (4-fluorophenylsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (4-fluoro Phenylsulfonyloxy) -7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (trifluoromethylsulfonyloxy) bicyclo [2.2.1] heptane-5 , 6-oxy-2,3-dicarboxylimide, N- (camphorsulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-di Ruboxylimide, N- (4-methylphenylsulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboxylimide, N- (2-trifluoromethylphenylsulfonyloxy) bicyclo [2.2.1] Heptane-5,6-oxy-2,3-dicarboxylimide, N- (4-fluorophenylsulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2 , 3-dicarboxylimide, N- (trifluoromethylsulfonyloxy) naphthyl dicarboxylimide, N- (camphorsulfonyloxy) naphthyl dicarboxylimide, N- (4-methylphenylsulfonyloxy) naphthyl dicarboxylimide, N- (Phenylsulfonyloxy) naphthyl dicarboxylimide, N- 2-trifluoromethylphenylsulfonyloxy) naphthyl dicarboxylimide, N- (4-fluorophenylsulfonyloxy) naphthyl dicarboxylimide, N- (pentafluoroethylsulfonyloxy) naphthyl dicarboxylimide, N- (heptafluoropropylsulfonyl) Oxy) naphthyl dicarboxylimide, N- (nonafluorobutylsulfonyloxy) naphthyl dicarboxylimide, N- (ethylsulfonyloxy) naphthyl dicarboxylimide, N- (propylsulfonyloxy) naphthyl dicarboxylimide, N- (butylsulfonyl) Oxy) naphthyl dicarboxylimide, N- (pentylsulfonyloxy) naphthyl dicarboxylimide, N- (hexylsulfonyloxy) naphthyl dicarbo Xylimide, N- (heptylsulfonyloxy) naphthyl dicarboxylimide, N- (octylsulfonyloxy) naphthyl dicarboxylimide, N- (nonylsulfonyloxy) naphthyl dicarboxylimide, and the like.

  Examples of the halogen-containing compound include haloalkyl group-containing hydrocarbon compounds and haloalkyl group-containing heterocyclic compounds.

  Examples of the diazomethane compound include bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, bis (p-tolylsulfonyl) diazomethane, and bis (2,4-xylylsulfonyl) diazomethane. Bis (p-chlorophenylsulfonyl) diazomethane, methylsulfonyl-p-toluenesulfonyldiazomethane, cyclohexylsulfonyl (1,1-dimethylethylsulfonyl) diazomethane, bis (1,1-dimethylethylsulfonyl) diazomethane, phenylsulfonyl (benzoyl) diazomethane Etc.

  Examples of the sulfone compounds include β-ketosulfone compounds, β-sulfonylsulfone compounds, diaryldisulfone compounds, and the like.

  Examples of the sulfonate compound include alkyl sulfonate, haloalkyl sulfonate, aryl sulfonate, and imino sulfonate.

  Examples of the carboxylic acid ester compound include carboxylic acid o-nitrobenzyl ester.

  As the oxime sulfonate compound, a compound containing an oxime sulfonate group represented by the above formula (2) is preferable, an oxime sulfonate compound represented by the above formula (3) is more preferable, and is available as a commercially available product (5 -Propylsulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile, (5-octylsulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile, (5 -P-toluenesulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile, (camphorsulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile, (5 -Octylsulf Niruokishiimino) - (4-methoxyphenyl) acetonitrile are particularly preferred. As the onium salt, tetrahydrothiophenium salt and benzylsulfonium salt are preferable, and 4,7-di-n-butoxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate and benzyl-4-hydroxyphenylmethylsulfonium hexafluorophosphate are preferable. More preferred.

  [B] A compound may be used independently and may be used in mixture of 2 or more types. The content of the [B] compound in the composition is preferably 0.1 parts by mass to 10 parts by mass, more preferably 1 part by mass to 5 parts by mass with respect to 100 parts by mass of the [A] polymer. . [B] By setting the content of the compound within the above specific range, it is possible to optimize the radiation sensitivity of the composition and form an interlayer insulating film for a display element having high surface hardness while maintaining transparency.

<[C] Organic solvent>
The composition is dissolved or dispersed in [C] organic solvent by mixing [A] polymer, [B] compound and, if necessary, suitable component such as [D] surfactant and other optional components. Prepared. [C] The organic solvent contains at least (C1) an organic solvent having a vapor pressure at 20 ° C. of 0.1 mmHg or more and less than 1 mmHg. Moreover, (C2) It is preferable to contain the organic solvent whose vapor pressure in 20 degreeC is 1 mmHg or more and 20 mmHg or less as an organic solvent. By using the organic solvent [C] having a vapor pressure in the specific range, high-speed coating is possible while preventing coating unevenness even when a discharge nozzle type coating method is employed. In addition, although a well-known method can be used for the measurement of vapor pressure, in this specification, it means the value measured by the transfection method (gas flow method).

  [C] As the organic solvent, a solvent in which each component is uniformly dissolved or dispersed and does not react with each component is preferably used. [C] Examples of the organic solvent include benzyl alcohol, ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, diethylene glycol monoalkyl ethers, diethylene glycol dialkyl ethers, diethylene glycol monoalkyl ether acetates, Examples include dipropylene glycol monoalkyl ethers, dipropylene glycol dialkyl ethers, dipropylene glycol monoalkyl ether acetates, lactic acid esters, aliphatic carboxylic acid esters, amides, and ketones. These may be used alone or in admixture of two or more.

(C1) As an organic solvent, for example, benzyl alcohol;
Ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether;
Ethylene glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dipropyl ether;
Propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether;
Diethylene glycol monoalkyl ethers such as diethylene glycol monomethyl ether and diethylene glycol monoethyl ether;
Diethylene glycol dialkyl ethers such as diethylene glycol diethyl ether and diethylene glycol ethyl methyl ether;
Diethylene glycol monoalkyl ether acetates such as diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monobutyl ether acetate;
Dipropylene glycol monoalkyl ethers such as dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether;
Dipropylene glycol dialkyl ethers such as dipropylene glycol dimethyl ether and dipropylene glycol diethyl ether;
Dipropylene glycol monoalkyl ether acetates such as dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monopropyl ether acetate, dipropylene glycol monobutyl ether acetate;
Lactic acid esters such as n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, n-amyl lactate, isoamyl lactate;
Ethyl hydroxyacetate, ethyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-3-methylbutyrate, ethyl ethoxyacetate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate, 3-methyl-3-methoxybutyl butyrate, methyl acetoacetate, ethyl acetoacetate, methyl pyruvate Aliphatic carboxylic acid esters such as ethyl pyruvate;
Amides such as N-methylformamide, N, N-dimethylformamide, N-methylacetamide, N, N-dimethylacetamide;
Examples thereof include ketones such as N-methylpyrrolidone and γ-butyrolactone.

  (C1) An organic solvent may be used independently and may be used in mixture of 2 or more types. (C1) The organic solvent is preferably at least one organic solvent selected from the group consisting of diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, benzyl alcohol, and dipropylene glycol monomethyl ether.

  (C2) Examples of the organic solvent include diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanone, ethyl acetate, and acetic acid. Examples include propyl, n-butyl acetate, methyl propyl ketone, methyl isobutyl ketone, methyl 3-methoxypropionate, methyl lactate, and ethyl lactate.

  (C2) The organic solvent may be used alone or in combination of two or more. (C2) Organic solvents include diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanone, n-butyl acetate, methyl isobutyl ketone, 3- It is preferably at least one organic solvent selected from the group consisting of methyl methoxypropionate.

  When (C1) organic solvent and (C2) organic solvent are used in combination, diethylene glycol ethyl methyl ether / diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether / propylene glycol monomethyl ether acetate, diethylene glycol ethyl methyl ether / cyclohexanone, diethylene glycol diethyl Ether / diethylene glycol dimethyl ether, diethylene glycol diethyl ether / propylene glycol monomethyl ether acetate, diethylene glycol diethyl ether / cyclohexanone, diethylene glycol diethyl ether / 3-methoxymethyl propionate, diethylene glycol diethyl ether / methyl isobutyl ketone, diethylene glycol The combination of ethyl ether / acetic acid n- butyl are preferred.

  As content of (C2) organic solvent, 10 mass% or more and 90 mass% or less are preferable with respect to the total amount of (C1) organic solvent and (C2) organic solvent, and 10 mass% or more and 50 mass% or less are more preferable. . By setting the mass ratio of the organic solvent having a low vapor pressure (C1) and the organic solvent having a high vapor pressure (C2) within the above specific range, the amount of the residual solvent in the coating film after pre-baking is optimized. As a result, the occurrence of coating unevenness (such as streak unevenness, pin mark unevenness, and mist unevenness) can be suppressed, and the film thickness uniformity can be further improved. Further, by optimizing the residual solvent amount, the acid generation amount and the acid dissociable group are highly balanced, and the radiation sensitivity tends to be good.

  The solid content concentration of the composition is 10% by mass or more and 30% by mass or less. Preferably, it is 20 mass% or more and 25 mass% or less. By setting the solid content concentration of the composition within the specific range, it is possible to effectively suppress the occurrence of coating unevenness.

  The viscosity of the composition at 25 ° C. is 2.0 mPa · s or more and 12 mPa · s or less. Preferably, they are 2.0 mPa * s or more and 10 mPa * s or less. By keeping the viscosity of the composition within the above specified range, it is possible to achieve a well-balanced viscosity that can be evenly distributed even if coating unevenness is maintained while maintaining film thickness uniformity, and realize high-speed coating properties. it can.

<[D] Surfactant>
The composition can further contain a surfactant [D] as a suitable component in order to further improve the film-forming property of the composition. Examples of the surfactant include a fluorine-based surfactant and a silicone-based surfactant. When the said composition contains [D] surfactant, the surface smoothness of a coating film can be improved and the film thickness uniformity of the interlayer insulation film for display elements formed as a result can be improved more.

  As the fluorosurfactant, a compound having a fluoroalkyl group and / or a fluoroalkylene group at at least one of the terminal, main chain and side chain is preferable. For example, 1,1,2,2-tetrafluoro n- Octyl (1,1,2,2-tetrafluoro n-propyl) ether, 1,1,2,2-tetrafluoro n-octyl (n-hexyl) ether, hexaethylene glycol di (1,1,2,2 , 3,3-hexafluoro n-pentyl) ether, octaethylene glycol di (1,1,2,2-tetrafluoro n-butyl) ether, hexapropylene glycol di (1,1,2,2,3,3) -Hexafluoro n-pentyl) ether, octapropylene glycol di (1,1,2,2-tetrafluoro n-butyl) ether, Sodium fluoro n-dodecanesulfonate, 1,1,2,2,3,3-hexafluoro n-decane, 1,1,2,2,3,3,9,9,10,10-decafluoro n- Dodecane, sodium fluoroalkylbenzenesulfonate, sodium fluoroalkylphosphate, sodium fluoroalkylcarboxylate, diglycerin tetrakis (fluoroalkylpolyoxyethylene ether), fluoroalkylammonium iodide, fluoroalkylbetaine, fluoroalkylpolyoxyethylene ether, Fluoroalkyl polyoxyethanol, perfluoroalkyl alkoxylate, carboxylic acid fluoroalkyl ester and the like can be mentioned.

  Examples of commercially available fluorosurfactants include BM-1000, BM-1100 (above, manufactured by BM CHEMIE), MegaFuck F142D, F172, F173, F183, F178, F191, F191, and F471. F476 (above, manufactured by Dainippon Ink and Chemicals), Florard FC-170C, FC-171, FC-430, FC-431 (above, manufactured by Sumitomo 3M), Surflon S-112, S-113, S-131, S-141, S-145, S-382, SC-101, SC-102, SC-103, SC-104, SC-105, SC-105, SC-106 (and above) Asahi Glass Co., Ltd.), F-top EF301, EF303, EF352 (above, manufactured by Shin-Akita Kasei), Footent FT-100, FT-110, FT-140A, FT-150, FT-250, FT-251, FT-300, FT-310, FT-400S, FTX-218, FT-251 (above, Neos), etc. Is mentioned.

  Examples of the silicone-based surfactant include Torre Silicone DC3PA, DC7PA, SH11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH-190, SH-193, SZ-6032, and SF-8428. DC-57, DC-190, SH 8400 FLUID (made by Toray Dow Corning Silicone), TSF-4440, TSF-4300, TSF-4445, TSF-4446, TSF-4460, TSF-4442 ( As mentioned above, GE Toshiba Silicone), organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.) and the like can be mentioned.

  [D] Surfactants may be used alone or in admixture of two or more. The content of [D] surfactant in the composition is preferably 0.01 parts by mass or more and 2 parts by mass or less, more preferably 0.05 parts by mass with respect to 100 parts by mass of the [A] polymer. Part to 1 part by mass. [D] By making content of surfactant into the said specific range, the surface smoothness of a coating film can be improved more.

<[E] polyfunctional (meth) acrylate>
The said composition can further contain [E] polyfunctional (meth) acrylate as a suitable component. When the composition further contains an [E] polyfunctional (meth) acrylate compound, the transmittance and heat-resistant transparency of the interlayer insulating film for display elements can be improved. [E] Examples of polyfunctional (meth) acrylates include bifunctional (meth) acrylates and trifunctional or higher (meth) acrylates.

  Examples of the bifunctional (meth) acrylate include ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and 1,6-hexanediol di ( And (meth) acrylate, 1,9-nonanediol di (meth) acrylate, and the like.

  Examples of commercially available bifunctional (meth) acrylates include Aronix M-210, M-240, M-6200 (above, manufactured by Toagosei), KAYARAD HDDA, HX-220, R-604 (above, Nippon Kayaku Co., Ltd.), Biscoat 260, 312 and 335HP (Osaka Organic Chemical Co., Ltd.), Light Acrylate 1,9-NDA (Kyoeisha Chemical Co., Ltd.) and the like.

  Examples of the tri- or higher functional (meth) acrylate include trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, Dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, ethylene oxide modified dipentaerythritol hexaacrylate, tri (2-acryloyloxyethyl) phosphate , Tri (2-methacryloyloxyethyl) phosphate, succinic acid-modified pentaerythritol triacrylate, a straight-chain alkylene group and a compound having two or more isocyanate groups, and one in the molecule Examples thereof include polyfunctional urethane acrylate compounds obtained by reacting a compound having the above hydroxyl group and having 3 to 5 (meth) acryloyloxy groups.

  Examples of commercially available trifunctional or higher functional (meth) acrylates include Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, TO-1450 (above, manufactured by Toagosei), KAYARAD TMPTA, DPHA, DPCA-20, DPCA-30, DPCA-60, DPCA-60, DPCA-12, DPEA-12 (above, Nippon Kayaku) Biscoat 295, 300, 360, GPT, 3PA, 400 (above, manufactured by Osaka Organic Chemical Industry). As a commercial item containing a polyfunctional urethane acrylate type compound, New Frontier R-1150 (Daiichi Kogyo Seiyaku Co., Ltd.), KAYARAD DPHA-40H (Nippon Kayaku Co., Ltd.) etc. are mentioned, for example.

  Among these [E] polyfunctional (meth) acrylates, ethylene glycol di (meth) acrylate, ω-carboxypolycaprolactone monoacrylate, 1,9-nonanediol dimethacrylate, diethylene glycol dimethacrylate, trimethylolpropane triacrylate, trimethylol Methylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, ethylene oxide modified dipentaerythritol hexaacrylate , Succinic acid modified pentaerythritol triacrelane Commercial product containing a polyfunctional urethane acrylate compounds are preferable.

  [E] Polyfunctional (meth) acrylates can be used alone or in admixture of two or more. The content of [E] polyfunctional (meth) acrylate in the composition is preferably 1 part by mass to 30 parts by mass, more preferably 5 parts by mass to 15 parts by mass with respect to 100 parts by mass of the [A] polymer. Part. [E] By making content of polyfunctional (meth) acrylate into the said specific range, the transmittance | permeability and heat-resistant transparency of the interlayer insulation film for display elements can be improved more.

<[F] Antioxidant>
The composition may further contain [F] antioxidant as a suitable component. When the composition further contains [F] antioxidant, the transmittance and heat-resistant transparency of the interlayer insulating film for display elements can be improved. [F] Antioxidant in this specification refers to a phenol compound, a compound having a hindered phenol structure, a compound having a hindered amine structure, a compound having an alkyl phosphate structure, and a compound having a thioether structure.

  Examples of the phenol compound include 4-methoxyphenol and 4-ethoxyphenol.

  Examples of the compound having a hindered phenol structure include 2,6-di-tert-butyl-4-cresol, pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], Thiodiethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, 1,3 , 5-Trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, N, N′-hexane-1,6-diylbis [3- (3,5- Di-tert-butyl-4-hydroxyphenylpropionamide), 3,3 ′, 3 ″, 5 ′, 5 ″ -hexa-tert Butyl-a, a ′, a ″-(mesitylene-2,4,6-triyl) tri-p-cresol, 4,6-bis (octylthiomethyl) -o-cresol, 4,6-bis (dodecyl) Thiomethyl) -o-cresol, ethylenebis (oxyethylene) bis [3- (5-tert-butyl-4-hydroxy-m-tolyl) propionate, hexamethylenebis [3- (3,5-di-tert- Butyl-4-hydroxyphenyl) propionate], 1,3,5-tris (3,5-di-tert-butyl-4-hydroxybenzyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 1,3,5-tris [(4-tert-butyl-3-hydroxy-2,6-xylin) methyl] -1,3,5-triazine-2,4,6 (1H 3H, 5H) -trione, 2,6-di-tert-butyl-4- (4,6-bis (octylthio) -1,3,5-triazin-2-ylamine) phenol, tris- (3,5- And di-t-butyl-4-hydroxybenzyl) -isocyanurate.

  Examples of commercially available compounds having a hindered phenol structure include ADK STAB AO-20, AO-30, AO-40, AO-50, AO-60, AO-70, AO-80, and AO-80. AO-330 (above, manufactured by ADEKA), sumizer GM, GS, MDP-S, BBM-S, WX-R, GA-80 (above, manufactured by Sumitomo Chemical), IRGANOX 1010, 1035, 1076, Same 1098, Same 1135, Same 1330, Same 1726, Same 1425WL, Same 1520L, Same 245, Same 259, Same 3114, Same 565, IRGAMOD295 (Made by Ciba Japan), Yoshinox BHT, Same BB, Same 2246G, Same 425 , 250, 930, SS, TT, 917, 314 (above, API Corporation) Emissions, Ltd.), and the like.

  Examples of commercially available compounds having a hindered amine structure include ADK STAB LA-52, LA57, LA-62, LA-67, LA-63P, LA-68LD, LA-77, LA-82, LA-87 (manufactured by ADEKA), sumilizer 9A (manufactured by Sumitomo Chemical), CHIMASSORB119FL, 2020FDL, 944FDL, TINUVIN622LD, 144, 765, and 770DF (manufactured by Ciba Japan).

  Examples of commercially available compounds having an alkyl phosphate structure include ADK STAB PEP-4C, PEP-8, PEP-8W, PEP-24G, PEP-36, HP-10, 2112, 260, and the like. 522A, 1178, 1500, C, 135A, 3010, TPP (manufactured by ADEKA), IRGAFOS168 (manufactured by Ciba Japan), and the like.

  Examples of commercially available compounds having a thioether structure include ADK STAB AO-412S, AO-503 (above, manufactured by ADEKA), Sumitizer TPL-R, TPM, TPS, TTP-D, MB (above, Sumitomo Chemical). Product), IRGANOXPS800FD, PS802FD (manufactured by Ciba Japan), DLTP, DSTP, DMTP, DTTP (manufactured by API Corporation) and the like.

  Of these [F] antioxidants, phenol compounds and compounds having a hindered phenol structure are preferred, such as 4-methoxyphenol, 2,6-di-t-butyl-4-cresol, and 1,3,5-trimethyl. -2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, tris- (3,5-di-tert-butyl-4-hydroxybenzyl) -isocyanurate, penta Erythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] is more preferred.

  [F] Antioxidants can be used alone or in admixture of two or more. The content of the [F] antioxidant in the composition is preferably 0.1 to 10 parts by mass, more preferably 0.2 to 5 parts by mass with respect to 100 parts by mass of the [A] polymer. Part by mass. [F] By making content of antioxidant into the said specific range, the transmittance | permeability and heat-resistant transparency of the interlayer insulation film for display elements can be improved more.

<[G] Epoxy compound>
The said composition can further contain the compound which further contains the compound which has a 2 or more epoxy group in 1 molecule as a suitable component. When the composition further contains a [G] epoxy compound, the transmittance and heat-resistant transparency of the interlayer insulating film for display elements can be improved.

  [G] The epoxy compound is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule, but the [A] polymer is excluded. Examples of the epoxy group include an oxiranyl group (1,2-epoxy structure), an oxetanyl group (1,3-epoxy structure), and a 3,4-epoxycyclohexyl group.

Examples of the compound having two or more oxiranyl groups in one molecule include bisphenol A diglycidyl ether (polycondensate of 4,4′-isopropylidenediphenol and 1-chloro-2,3-epoxypropane), Bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol AD diglycidyl ether, brominated bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether Diglycidyl ethers of bisphenol compounds such as ethers, brominated bisphenol S diglycidyl ethers;
Polyhydric alcohols such as 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, polyethylene glycol diglycidyl ether, and polypropylene glycol diglycidyl ether Glycidyl ether;
Polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides to aliphatic polyhydric alcohols such as ethylene glycol, propylene glycol and glycerin;
Phenol novolac type epoxy resin;
Cresol novolac type epoxy resin;
Polyphenol type epoxy resin;
Cycloaliphatic epoxy resin;
Diglycidyl esters of aliphatic long-chain dibasic acids;
Glycidyl esters of higher fatty acids;
Examples include epoxidized soybean oil and epoxidized linseed oil.

  Examples of the compound having two or more oxetanyl groups (1,3-epoxy structure) in one molecule include 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, bis {[1- Ethyl (3-oxetanyl)] methyl} ether and the like.

  Examples of the compound having two or more 3,4-epoxycyclohexyl groups in one molecule include 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, 2- (3,4-epoxycyclohexyl). -5,5-spiro-3,4-epoxy) cyclohexane-meta-dioxane, bis (3,4-epoxycyclohexylmethyl) adipate, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4 -Epoxy-6-methylcyclohexyl-3 ', 4'-epoxy-6'-methylcyclohexanecarboxylate, methylenebis (3,4-epoxycyclohexane), dicyclopentadiene diepoxide, di (3,4-epoxy) of ethylene glycol (Cyclohexylmethyl) ether Ethylenebis (3,4-epoxycyclohexane carboxylate), lactone-modified 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexane carboxylate and the like.

[G] Commercially available epoxy compounds include, for example, Epicoat 1001, 1002, 1003, 1004, 1007, 1007, 1009, 1010, and 828 (above, made by Japan Epoxy Resin) as a bisphenol A type epoxy resin. etc;
As bisphenol F type epoxy resin, Epicoat 807 (made by Japan Epoxy Resin) and the like;
As a phenol novolac type epoxy resin, Epicoat 152, 154, 157S65 (above, made by Japan Epoxy Resin), EPPN201, 202 (above, made by Nippon Kayaku), etc .;
As cresol novolac type epoxy resin, EOCN102, 103S, 104S, 1020, 1025, 1027 (manufactured by Nippon Kayaku Co., Ltd.), Epicoat 180S75 (manufactured by Japan Epoxy Resin) and the like;
As a polyphenol type epoxy resin, Epicoat 1032H60, XY-4000 (made by Japan Epoxy Resin) and the like;
Cyclic aliphatic epoxy resins include CY-175, 177, 179, Araldite CY-182, 192, 184 (above, manufactured by Ciba Specialty Chemicals), ERL-4234, 4299, 4221, 4206 (above, U C.C), Shodyne 509 (Showa Denko), Epicron 200, 400 (above, Dainippon Ink), Epicoat 871, 872 (above Japan Epoxy Resin), ED-5661, 5562 (Celanese coating)
As an aliphatic polyglycidyl ether, Epolite 100MF (manufactured by Kyoeisha Chemical Co., Ltd.), Epiol TMP (manufactured by NOF Corporation), 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, bis {[1-ethyl (3 -Oxetanyl)] methyl} ether and the like.

  Among these, bisphenol A diglycidyl ether (polycondensate of 4,4′-isopropylidene diphenol and 1-chloro-2,3-epoxypropane), bisphenol F diglycidyl ether, 1,4-bis [(3 -Ethyl-3-oxetanylmethoxy) methyl] benzene, bis {[1-ethyl (3-oxetanyl)] methyl} ether, 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate.

  [G] An epoxy compound can be used individually or in mixture of 2 or more types. The content of the [G] epoxy compound in the composition is preferably 1 part by mass to 30 parts by mass, more preferably 3 parts by mass to 15 parts by mass with respect to 100 parts by mass of the polymer [A]. It is. [G] By making content of an epoxy compound into the said specific range, the transmittance | permeability and heat-resistant transparency of the interlayer insulation film for display elements can be improved more.

<Other optional components>
In addition to the components [A] to [G], the composition includes [H] adhesion assistant, [I] basic compound, [J] quinonediazide compound and the like as long as the desired effect is not impaired. Other optional components may be contained. These other optional components may be used alone or in combination of two or more. Hereinafter, each component will be described in detail.

[[H] Adhesion aid]
The adhesion aid can be used to improve the adhesion between an insulating material and an inorganic substance serving as a substrate, for example, a silicone compound such as silicone, silicone oxide, or silicon nitride, or a metal such as gold, copper, or aluminum. As the adhesion assistant, a functional silane coupling agent is preferable. Examples of the functional silane coupling agent include a silane coupling agent having a reactive substituent such as a carboxyl group, a methacryloyl group, an isocyanate group, an epoxy group (preferably an oxiranyl group), and a thiol group.

  Examples of the functional silane coupling agent include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-glycidoxypropyltri Examples include methoxysilane, γ-glycidoxypropylalkyldialkoxysilane, γ-chloropropyltrialkoxysilane, γ-mercaptopropyltrialkoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and the like. Of these, γ-glycidoxypropylalkyldialkoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and γ-methacryloxypropyltrimethoxysilane are preferred.

  The content of the [H] adhesion assistant in the composition is preferably 0.5 parts by mass or more and 20 parts by mass or less, and preferably 1 part by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the [A] polymer. More preferred. [H] By setting the content of the adhesion assistant in the above specific range, the adhesion between the formed interlayer insulating film for display elements and the substrate is further improved.

[[I] Basic compound]
[I] The basic compound can be arbitrarily selected from those used in chemically amplified resists. Examples include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxides, carboxylic acid quaternary ammonium salts, and the like. By containing the [I] basic compound in the composition, the diffusion length of the acid generated from the [B] compound by exposure can be appropriately controlled, and the pattern developability can be improved.

  Examples of the aliphatic amine include trimethylamine, diethylamine, triethylamine, di-n-propylamine, tri-n-propylamine, di-n-pentylamine, tri-n-pentylamine, diethanolamine, triethanolamine, dicyclohexylamine, Examples include dicyclohexylmethylamine.

  Examples of the aromatic amine include aniline, benzylamine, N, N-dimethylaniline, diphenylamine and the like.

  Examples of the heterocyclic amine include pyridine, 2-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, N-methyl-4-phenylpyridine, 4 -Dimethylaminopyridine, imidazole, benzimidazole, 4-methylimidazole, 2-phenylbenzimidazole, 2,4,5-triphenylimidazole, nicotine, nicotinic acid, nicotinamide, quinoline, 8-oxyquinoline, pyrazine, pyrazole , Pyridazine, purine, pyrrolidine, piperidine, piperazine, morpholine, 4-methylmorpholine, 1,5-diazabicyclo [4,3,0] -5-nonene, 1,8-diazabicyclo [5,3,0] -7undecene Etc.

  Examples of the quaternary ammonium hydroxide include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetra-n-butylammonium hydroxide, tetra-n-hexylammonium hydroxide, and the like.

  Examples of the carboxylic acid quaternary ammonium salt include tetramethylammonium acetate, tetramethylammonium benzoate, tetra-n-butylammonium acetate, and tetra-n-butylammonium benzoate.

  Of these [I] basic compounds, heterocyclic amines are preferable, and 4-dimethylaminopyridine and 1,5-diazabicyclo [4,3,0] -5-nonene are more preferable.

  As content of the [I] basic compound in the said composition, 0.001 mass part-1 mass part are preferable with respect to 100 mass parts of [A] polymers, and 0.005 mass part-0.2 mass part. Is more preferable. [I] By making content of a basic compound into the said specific range, pattern developability improves more.

[[J] quinonediazide compound]
[J] A quinonediazide compound is a compound that generates a carboxylic acid upon irradiation with radiation. [J] As the quinonediazide compound, a condensate of a phenolic compound or an alcoholic compound (hereinafter also referred to as “mother nucleus”) and 1,2-naphthoquinonediazidesulfonic acid halide can be used.

  Examples of the mother nucleus include trihydroxybenzophenone, tetrahydroxybenzophenone, pentahydroxybenzophenone, hexahydroxybenzophenone, (polyhydroxyphenyl) alkane, and other mother nuclei.

  Examples of trihydroxybenzophenone include 2,3,4-trihydroxybenzophenone and 2,4,6-trihydroxybenzophenone.

  Examples of tetrahydroxybenzophenone include 2,2 ′, 4,4′-tetrahydroxybenzophenone, 2,3,4,3′-tetrahydroxybenzophenone, 2,3,4,4′-tetrahydroxybenzophenone, 2,3 , 4,2′-tetrahydroxy-4′-methylbenzophenone, 2,3,4,4′-tetrahydroxy-3′-methoxybenzophenone, and the like.

  Examples of pentahydroxybenzophenone include 2,3,4,2 ', 6'-pentahydroxybenzophenone.

  Examples of hexahydroxybenzophenone include 2,4,6,3 ', 4', 5'-hexahydroxybenzophenone and 3,4,5,3 ', 4', 5'-hexahydroxybenzophenone.

  Examples of (polyhydroxyphenyl) alkanes include bis (2,4-dihydroxyphenyl) methane, bis (p-hydroxyphenyl) methane, tris (p-hydroxyphenyl) methane, 1,1,1-tris (p-hydroxy). Phenyl) ethane, bis (2,3,4-trihydroxyphenyl) methane, 2,2-bis (2,3,4-trihydroxyphenyl) propane, 1,1,3-tris (2,5-dimethyl-) 4-hydroxyphenyl) -3-phenylpropane, 4,4 ′-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol, bis (2,5-dimethyl) -4-hydroxyphenyl) -2-hydroxyphenylmethane, 3,3,3 ', 3'-tetramethyl-1,1'-spirobiy Den -5,6,7,5 ', 6', 7'-hexanol, 2,2,4-trimethyl -7,2 ', 4'-trihydroxy flavan like.

  Examples of other mother nuclei include 2-methyl-2- (2,4-dihydroxyphenyl) -4- (4-hydroxyphenyl) -7-hydroxychroman, 1- [1- (3- {1- (4 -Hydroxyphenyl) -1-methylethyl} -4,6-dihydroxyphenyl) -1-methylethyl] -3- (1- (3- {1- (4-hydroxyphenyl) -1-methylethyl} -4 , 6-dihydroxyphenyl) -1-methylethyl) benzene, 4,6-bis {1- (4-hydroxyphenyl) -1-methylethyl} -1,3-dihydroxybenzene, and the like.

  Among these mother nuclei, 2,3,4,4′-tetrahydroxybenzophenone, 1,1,1-tri (p-hydroxyphenyl) ethane, 4,4 ′-[1- [4- [1- [ 4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol is preferred.

  As the 1,2-naphthoquinone diazide sulfonic acid halide, 1,2-naphthoquinone diazide sulfonic acid chloride is preferable. Examples of 1,2-naphthoquinonediazide sulfonic acid chloride include 1,2-naphthoquinonediazide-4-sulfonic acid chloride, 1,2-naphthoquinonediazide-5-sulfonic acid chloride, and the like. Of these, 1,2-naphthoquinonediazide-5-sulfonic acid chloride is preferred.

  As a condensate of a phenolic compound or an alcoholic compound and 1,2-naphthoquinone diazide sulfonic acid halide, 1,1,1-tri (p-hydroxyphenyl) ethane and 1,2-naphthoquinone diazide-5-sulfonic acid Condensate with chloride, 4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol and 1,2-naphthoquinonediazide-5-sulfonic acid chloride A condensate with is preferred.

  In the condensation reaction between the phenolic compound or the mother nucleus and 1,2-naphthoquinonediazidesulfonic acid halide, the number of OH groups in the phenolic compound or alcoholic compound is preferably 30 mol% to 85 mol%, more preferably 1,2-naphthoquinonediazide sulfonic acid halide corresponding to 50 mol% to 70 mol% can be used. The condensation reaction can be carried out by a known method.

  [J] As the quinonediazide compound, 1,2-naphthoquinonediazidesulfonic acid amides in which the ester bond of the mother nucleus exemplified above is changed to an amide bond, for example, 2,3,4-triaminobenzophenone-1,2-naphthoquinonediazide -4-sulfonic acid amide and the like are also preferably used.

<Preparation method of positive radiation sensitive composition for discharge nozzle type coating method>
The said composition is prepared in the state melt | dissolved or disperse | distributed by mixing a [A] polymer, a [B] compound, a suitable component as needed, and another arbitrary component in the [C] organic solvent. For example, the said composition can be prepared by mixing each component in a predetermined ratio in [C] organic solvent.

<Method for forming interlayer insulating film for display element>
The present invention suitably includes an interlayer insulating film for display elements formed from the composition. The method for forming an interlayer insulating film for a display element of the present invention includes
(1) A step of applying the composition to the substrate while relatively moving the discharge nozzle and the substrate to form a coating film;
(2) A step of irradiating at least a part of the formed coating film with radiation,
(3) a step of developing the coating film irradiated with the radiation; and (4) a step of heating the developed coating film.

  According to the formation method, the composition can be applied at a high speed, has excellent radiation sensitivity, and can form an interlayer insulating film for display elements with excellent film thickness uniformity. By forming a pattern by exposure, development, and heating, a display element interlayer insulating film having a fine and elaborate pattern can be easily formed. Furthermore, the interlayer insulating film for a display element thus formed has no unevenness in coating and has high flatness, and can be suitably used for a display element such as a liquid crystal display element or an organic EL display element.

[Step (1)]
In this step, the composition is applied onto the substrate by a discharge nozzle type coating method while relatively moving the discharge nozzle and the substrate to form a coating film. Preferably, the [C] organic solvent is removed by pre-baking the coated surface.

  Examples of the substrate include glass, quartz, silicone, and resin. Examples of the resin include polyethylene terephthalate, polybutylene terephthalate, polyethersulfone, polycarbonate, polyimide, a ring-opening polymer of cyclic olefin, and a hydrogenated product thereof. As prebaking conditions, although it changes also with kinds, compounding ratios, etc. of each component, it can be set as 70 degreeC-120 degreeC, about 1 minute-10 minutes.

[Step (2)]
In this step, at least a part of the formed coating film is exposed to radiation and exposed. When exposing, it exposes normally through the photomask which has a predetermined pattern. As the radiation used for exposure, radiation having a wavelength in the range of 190 nm to 450 nm is preferable, and radiation containing ultraviolet light of 365 nm is more preferable. Energy of exposure intensity at the wavelength 365nm radiation, by the value measured by luminometer (OAI model356, OAI Optical Ltd. ^Associates), is preferably ^{500J / m 2 ~6,000J / m 2} , 1,500J / m 2 ˜1,800 J / m ² is more preferable.

[Step (3)]
In this step, the coating film irradiated with the radiation is developed. By developing the coated film after exposure, unnecessary portions (radiation irradiated portions) are removed to form a predetermined pattern. As the developer used in the development step, an alkaline aqueous solution is preferable. Examples of the alkali include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, and ammonia; quaternary ammonium salts such as tetramethylammonium hydroxide and tetraethylammonium hydroxide. .

  An appropriate amount of a water-soluble organic solvent such as methanol or ethanol, or a surfactant can be added to the alkaline aqueous solution. The concentration of alkali in the aqueous alkali solution is preferably from 0.1% by mass to 5% by mass from the viewpoint of obtaining appropriate developability. Examples of the developing method include a liquid piling method, a dipping method, a rocking dipping method, and a shower method. The development time varies depending on the composition of the composition, but is about 10 seconds to 180 seconds. Subsequent to such development processing, for example, washing with running water is performed for 30 seconds to 90 seconds, and then a desired pattern can be formed by, for example, air drying with compressed air or compressed nitrogen.

[Step (4)]
In this step, the developed coating film is heated. For heating, a heating device such as a hot plate or an oven is used to heat the patterned thin film, thereby promoting the curing reaction of the [A] polymer and obtaining a cured product. As heating temperature, it is about 120 to 250 degreeC, for example. The heating time varies depending on the type of heating device, but for example, it is about 5 to 30 minutes for a hot plate and about 30 to 90 minutes for an oven. Moreover, the step baking method etc. which perform a heating process 2 times or more can also be used. In this way, a patterned thin film corresponding to the target display element interlayer insulating film can be formed on the surface of the substrate.

  The film thickness of the formed interlayer insulation film for display elements is preferably 0.1 μm to 8 μm, more preferably 0.1 μm to 6 μm, and particularly preferably 0.1 μm to 4 μm.

  EXAMPLES Hereinafter, although this invention is explained in full detail based on an Example, this invention is not interpreted limitedly based on description of this Example.

<[A] Synthesis of polymer>
[Synthesis Example 1]
A flask equipped with a condenser and a stirrer was charged with 7 parts by mass of ADVN as a polymerization initiator and 200 parts by mass of diethylene glycol ethyl methyl ether as a solvent. Subsequently, 40 parts by mass of 1-ethoxyethyl methacrylate giving structural unit (I), 40 parts by mass of glycidyl methacrylate giving structural unit containing epoxy group, 5 parts by mass of methacrylic acid giving other structural units, 5 parts by mass of styrene, and After 10 parts by mass of 2-hydroxyethyl methacrylate and 3 parts by mass of α-methylstyrene dimer as a molecular weight modifier were charged and purged with nitrogen, stirring was started gently. The temperature of the solution was raised to 70 ° C., and this temperature was maintained for 5 hours to obtain a polymer solution containing the polymer (A-1). Mw of the polymer (A-1) was 9,000. The solid content concentration of the polymer solution was 32.1% by mass.

[Synthesis Example 2]
A flask equipped with a condenser and a stirrer was charged with 7 parts by mass of ADVN as a polymerization initiator and 200 parts by mass of diethylene glycol ethyl methyl ether as a solvent. Continuing,
40 parts by mass of 2-tetrahydropyranyl methacrylate for giving structural unit (I), 40 parts by mass of glycidyl methacrylate for giving structural unit containing epoxy group, 5 parts by mass of methacrylic acid for giving other structural units, 5 parts by mass of styrene and methacrylic acid After 10 parts by mass of 2-hydroxyethyl acid and 3 parts by mass of α-methylstyrene dimer as a molecular weight regulator were charged and purged with nitrogen, stirring was started gently. The temperature of the solution was raised to 70 ° C., and this temperature was maintained for 5 hours to obtain a polymer solution containing the polymer (A-2). Mw of the polymer (A-2) was 9,000. The solid content concentration of the polymer solution was 31.3% by mass.

[Synthesis Example 3]
A flask equipped with a condenser and a stirrer was charged with 8 parts by mass of 2,2′-azobis (methyl 2-methylpropionate) as a polymerization initiator and 300 parts by mass of methyl isobutyl ketone as a solvent. Subsequently, 40 parts by mass of 2-tetrahydropyranyl methacrylate which gives structural unit (I), 40 parts by mass of 3- (methacryloyloxymethyl) -3-ethyloxetane, and 5 parts by mass of methacrylic acid and methacryl which give other structural units After charging 15 parts by mass of 2-hydroxyethyl acid and replacing with nitrogen, stirring was started gently. The temperature of the solution was raised to 80 ° C., and this temperature was maintained for 6 hours to obtain a polymer solution. The resulting polymer solution was then poured into excess heptane to reprecipitate the polymer. The supernatant heptane was removed by decantation. Then, it filtered and the obtained polymer was vacuum-dried for 24 hours and the polymer (A-3) was obtained. Mw of the polymer (A-3) was 8,000. The solid content concentration of the polymer solution was 29.8% by mass.

[Synthesis Example 4]
A flask equipped with a condenser and a stirrer was charged with 7 parts by mass of ADVN as a polymerization initiator and 200 parts by mass of diethylene glycol ethyl methyl ether as a solvent. Continuing,
Nitrogen substitution was carried out by adding 35 parts by mass of 1-n-butoxyethyl methacrylate giving structural unit (I), 30 parts by mass of glycidyl methacrylate giving epoxy group-containing structural units, and 35 parts by mass of benzyl methacrylate giving other structural units. After that, stirring was started gently. The temperature of the solution was raised to 80 ° C., and this temperature was maintained for 6 hours to obtain a polymer solution containing the polymer (A-4). Mw of the polymer (A-4) was 10,000. The solid content concentration of the polymer solution was 32.3% by mass.

[Synthesis Example 5]
A flask equipped with a condenser and a stirrer was charged with 7 parts by mass of 2,2′-azobis (methyl 2-methylpropionate) as a polymerization initiator and 200 parts by mass of propylene glycol monomethyl ether acetate as a solvent. Subsequently, 67 parts by mass of 1-n-butoxyethyl methacrylate giving structural unit (I) and 10 parts by mass of methacrylic acid and 23 parts by mass of benzyl methacrylate giving other structural units were charged with nitrogen, and then gently stirred. Started. The temperature of the solution was raised to 80 ° C., and this temperature was maintained for 6 hours to obtain a polymer solution containing the polymer (a-1). Mw of the polymer (a-1) was 9,000. The solid content concentration of the polymer solution was 30.3% by mass.

[Synthesis Example 6]
A flask equipped with a condenser and a stirrer was charged with 7 parts by mass of 2,2′-azobis (methyl 2-methylpropionate) as a polymerization initiator and 200 parts by mass of propylene glycol monomethyl ether acetate as a solvent. Subsequently, 90 parts by mass of 1-benzyloxyethyl methacrylate giving the structural unit (I) and 6 parts by mass of 2-hydroxyethyl methacrylate and 4 parts by mass of methacrylic acid giving the other structural units were charged and gradually replaced with nitrogen. Stirring was started. The temperature of the solution was raised to 80 ° C., and this temperature was maintained for 6 hours to obtain a polymer solution containing the polymer (a-2). The polymer (a-2) Mw was 9,000. The solid content concentration of the polymer solution was 31.2% by mass.

[Synthesis Example 7]
A flask equipped with a condenser and a stirrer was charged with 7 parts by mass of 2,2′-azobis (methyl 2-methylpropionate) as a polymerization initiator and 200 parts by mass of propylene glycol monomethyl ether acetate as a solvent. Subsequently, 85 parts by mass of 2-tetrahydropyranyl methacrylate giving structural unit (I) and 7 parts by mass of 2-hydroxyethyl methacrylate and 8 parts by mass of methacrylic acid giving other structural units were charged, and the gas was gradually replaced. Stirring was started. The temperature of the solution was raised to 80 ° C., and this temperature was maintained for 6 hours to obtain a polymer solution containing the polymer (a-3). Mw of the polymer (a-3) was 10,000. The solid content concentration of the polymer solution was 29.2% by mass.

[Synthesis Example 8]
A flask equipped with a condenser and a stirrer was charged with 7 parts by mass of ADVN as a polymerization initiator and 200 parts by mass of diethylene glycol ethyl methyl ether as a solvent. Subsequently, 52 parts by mass of glycidyl methacrylate giving an epoxy group-containing structural unit and 48 parts by mass of benzyl methacrylate giving another structural unit were charged and purged with nitrogen, and then gently stirring was started. The temperature of the solution was raised to 80 ° C., and this temperature was maintained for 6 hours to obtain a polymer solution containing the polymer (a-4). Mw of the polymer (a-4) was 10,000. The solid content concentration of the polymer solution was 32.3% by mass.

[Synthesis Example 9]
A flask equipped with a condenser and a stirrer was charged with 7 parts by mass of ADVN as a polymerization initiator and 200 parts by mass of diethylene glycol ethyl methyl ether as a solvent. Subsequently, 45 parts by mass of 3,4-epoxycyclohexylmethyl methacrylate that gives an epoxy group-containing structural unit, and 45 parts by mass of benzyl methacrylate and 10 parts by mass of methacrylic acid that give other structural units were charged with nitrogen, and then gently. Stirring started. The temperature of the solution was raised to 80 ° C., and this temperature was maintained for 6 hours to obtain a polymer solution containing the polymer (a-5). Mw of the polymer (a-5) was 10,000. The solid content concentration of the polymer solution was 33.2% by mass.

<Preparation of positive-type radiation-sensitive composition for discharge nozzle type coating method>
Hereinafter, the components used for the preparation of the radiation-sensitive compositions of Examples and Comparative Examples will be described in detail.

<[B] Compound>
B-1 to B-5 are oxime sulfonate compounds. B-6 and B-7 are onium salts (B-6 is a tetrahydrothiophenium salt and B-7 is a sulfonium salt).

B-1: (5-propylsulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile (IRGACURE PAG 103, manufactured by Ciba Specialty Chemicals) represented by the above compound (i)
B-2: (5-octylsulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile (IRGACURE PAG 108, manufactured by Ciba Specialty Chemicals) represented by the above compound (ii)
B-3: (5-p-toluenesulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile represented by the above compound (iv) (IRGACURE PAG 121, manufactured by Ciba Specialty Chemicals)
B-4: (Camphorsulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile represented by the above compound (iii) (CGI 1380, manufactured by Ciba Specialty Chemicals)
B-5: (5-octylsulfonyloxyimino)-(4-methoxyphenyl) acetonitrile represented by the above compound (v) (CGI 725, manufactured by Ciba Specialty Chemicals)
B-6: 4,7-di-n-butoxy-1-naphthyltetrahydrothiophenium trifluoromethanesulfonate B-7: benzyl-4-hydroxyphenylmethylsulfonium hexafluorophosphate

<[C] Organic solvent>
(C1) Organic solvent (vapor pressure at 20 ° C. is not less than 0.1 mmHg and less than 1 mmHg)
C-1-1: Diethylene glycol ethyl methyl ether (20 ° C., 0.75 mmHg)
C-1-2: Dipropylene glycol dimethyl ether (20 ° C., 0.38 mmHg)

(C2) Organic solvent (vapor pressure at 20 ° C. is 1 mmHg to 20 mmHg)
C-2-1: Diethylene glycol dimethyl ether (20 ° C., 1.3 mmHg)
C-2-2: Propylene glycol monomethyl ether acetate (20 ° C., 3.75 mmHg)
C-2-3: Cyclohexanone (20 ° C., 3.4 mmHg)

Solvent 1,4-dioxane used in Comparative Example (20 ° C., 29 mmHg)
Ethylene glycol (20 ° C, 0.08mmHg)

<[D] Surfactant>
D-1: Silicone-based surfactant (manufactured by Dow Corning Toray, SH 8400 FLUID)
D-2: Fluorosurfactant (manufactured by Neos, Factent FTX-218)

<[E] polyfunctional (meth) acrylate compound>
E-1: Ethylene glycol dimethacrylate E-2: Trimethylolpropane trimethacrylate E-3: Pentaerythritol tetraacrylate

<[F] Antioxidant>
F-1: 2,6-di-t-butyl-4-cresol F-2: 4-methoxyphenol

<[G] Epoxy compound>
G-1: 2 bisphenol A diglycidyl ether (polycondensate of 4,4′-isopropylidenediphenol and 1-chloro-2,3-epoxypropane)
G-2: 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate

<[H] Adhesion aid>
H-1: γ-glycidoxypropyltrimethoxysilane H-2: β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane H-3: γ-methacryloxypropyltrimethoxysilane

<[I] Basic compound>
I-1: 4-Dimethylaminopyridine I-2: 1,5-diazabicyclo [4,3,0] -5-nonene

[Example 1]
In a solution containing the polymer (A-1) (amount corresponding to 100 parts by mass (solid content) of the polymer (A-1)), 3 parts by mass of (B-1) as a compound [B], (C1) organic (C-1-1) as a solvent is added so as to have a desired solid content concentration, [D] 0.2 part by mass of (D-1) as a surfactant is mixed, and a membrane filter having a pore size of 0.2 μm The positive type radiation sensitive composition for discharge nozzle type coating methods was prepared by filtering with (3).

[Examples 2 to 16 and Comparative Examples 1 to 4]
Each composition was prepared in the same manner as in Example 1 except that the type and amount of each component were as described in Table 1. In addition, the numerical value of [C] organic solvent in Table 1 is a mass% ratio of (C1) organic solvent and (C2) organic solvent. Moreover, “-” in Table 1 means that the corresponding component was not used.

<Evaluation>
The following evaluation was implemented using each prepared composition. The results are shown in Table 1.

[Viscosity (mPa · s)]
Using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., VISCONIC ELD.R), the viscosity (mPa · s) of the composition at 25 ° C. was measured.

[Solid content concentration (% by mass)]
After 0.3 g of each composition is precisely grounded in an aluminum dish and about 1 g of diethylene glycol dimethyl ether is added, it is dried on a hot plate at 175 ° C. for 60 minutes, and the solid content in each composition is determined from the mass before and after drying. The concentration (mass%) was determined.

[Appearance of coating film]
Each composition prepared was applied onto a 550 × 650 mm chromium film using a slit die coater (manufactured by Tokyo Ohka Kogyo Co., Ltd., TR6322105-CL), dried under reduced pressure to 0.5 Torr, and then heated to 100 ° C. on a hot plate. Was prebaked for 2 minutes to form a coating film, and further exposed at an exposure amount of 2,000 J / m ² to form a film having a film thickness of 4 μm from the upper surface of the chromium-deposited glass. Under the sodium lamp, the appearance of the coating film was observed with the naked eye. At this time, streak unevenness (one or a plurality of straight line unevenness that can be applied or crossed in the direction of application), haze unevenness (cloudy unevenness), pin mark unevenness (points that can be formed on the substrate support pins) The appearance situation of the unevenness of the shape was investigated. "A" (determined as good) when almost none of these unevenness is visible, "B" (determined as slightly bad) when any of them is slightly visible, "C" (determined as bad) when clearly visible It was.

[Thickness uniformity (%)]
The film thickness of the coating film on the chromium film-formed glass produced as described above was measured using a film thickness measuring device (Da Nippon Screen, Lambda Ace). The film thickness uniformity was calculated from the following equation by measuring the film thickness at nine measurement points. The nine measurement points are (X [mm], Y [mm]) are (275, 20), (275, 30), (275, 60), where X is the minor axis direction of the substrate and Y is the major axis direction. ), (275, 100), (275, 325), (275, 550), (275, 590), (275, 620), (275, 630). The case where the film thickness uniformity exceeded 1.80% and was 2% or less was judged to be slightly good, and the case where the film thickness uniformity was 1.80% or less was judged to be good.

  Film thickness uniformity (%) = {FT (X, Y) max−FT (X, Y) min} × 100 / {2 × FT (X, Y) avg. }

  In the above formula, FT (X, Y) max is the maximum value in the film thickness at nine measurement points, FT (X, Y) min is the minimum value in the film thickness at nine measurement points, and FT (X, Y) Avg. Is an average value in the film thickness at nine measurement points.

[High speed applicability (mm / sec.)]
Coating is performed on a 550 mm x 650 mm non-alkali glass substrate using a slit die coater, and the coating solution is discharged from the nozzle so that the coating conditions are a distance of 150 μm between the base and the nozzle and a film thickness after exposure of 2.5 μm. , The nozzle moving speed is 120 mm / sec. -220 mm / sec. The maximum speed at which streaky unevenness due to liquid breakage does not occur was determined. At this time, 180 mm / sec. When streaky unevenness did not occur even at the above speed, it was judged that the high-speed coating property was good.

[Radiation sensitivity (J / m ² )]
Hexamethyldisilazane was applied on a 550 × 650 mm chromium-deposited glass and heated at 60 ° C. for 1 minute. Each composition was applied onto the chromium film-formed glass after the hexamethyldisilazane treatment using a slit die coater (manufactured by Tokyo Ohka Kogyo Co., Ltd., TR6321005-CL), the ultimate pressure was set to 100 Pa, and the solvent was removed under vacuum. Then, the film was further pre-baked at 90 ° C. for 2 minutes to form a coating film having a thickness of 3.0 μm. Subsequently, using an exposure machine (manufactured by Canon, MPA-600FA), the coating film was irradiated with radiation with a variable exposure amount through a mask having a 60 μm line and space (10: 1) pattern. Thereafter, the film was developed by a puddle method at 25 ° C. with an aqueous tetramethylammonium hydroxide solution having the concentration shown in Table 1. The development time was 80 seconds when a developer having a tetramethylammonium hydroxide concentration of 0.40% by mass was used, and 50 seconds when a 2.38% by mass developer was used. Next, washing with running ultrapure water for 1 minute was performed, followed by drying to form a pattern on the chromium-deposited glass substrate after the HMDS treatment. At this time, the exposure amount necessary for completely dissolving the 6 μm space pattern was examined. When this value was 500 J / m ² or less, the sensitivity was judged good.

[Transmissivity (%)]
Each composition prepared was applied onto a glass substrate using a spinner and then pre-baked on a hot plate at 90 ° C. for 2 minutes to form a coating film having a thickness of 3.0 μm. The coating film was exposed at an exposure amount of 700 J / m ² and then heated at 220 ° C. for 1 hour in a clean oven to obtain a cured film. Subsequently, the transmittance at a wavelength of 400 nm was measured using a spectrophotometer (manufactured by Hitachi, Ltd., 150-20 type double beam). The measured value (%) was the transmittance. The closer the value was to 100%, the better the transmittance. When the value was less than 90%, the transparency was judged to be poor.

[Heat resistance transparency (%)]
About the board | substrate measured by evaluation of the said transmittance | permeability, after heating at 250 degreeC for 1 hour further in a clean oven, after measuring the light transmittance before and behind a heating similarly to the evaluation of the said transmittance | permeability, heat resistant transparency from a following formula (%) Was calculated. The closer this value is to 0%, the better the heat-resistant transparency. When it exceeds 4%, the heat-resistant transparency was judged to be poor.
Heat-resistant transparency (%) = transmittance before heating-transmittance after heating

Examples 1-16 using the said composition from the result of Table 1 can form the coating film which has a high radiation sensitivity and the outstanding film thickness uniformity compared with the composition of Comparative Examples 1-4, It was also revealed that high-speed coating was possible and the appearance of the coating film was good.
Furthermore, Examples 3 to 16 in which (C1) an organic solvent and (C2) an organic solvent are combined as the [C] organic solvent have a uniform film thickness as compared with Examples 1 and 2 in which only the (C1) organic solvent is used. It became clear that it was excellent by the property. Moreover, Examples 3-11 whose content of (C2) organic solvent is 50 mass% or less with respect to the total amount of (C1) organic solvent and (C2) organic solvent are (C2) Content of organic solvent However, compared with Example 12 which is 70 mass% with respect to the total amount of (C1) organic solvent and (C2) organic solvent, it became clear that the external appearance of a coating film and film thickness uniformity are especially excellent.
On the other hand, Examples 13 to 16 containing [E] polyfunctional (meth) acrylate compound, [F] antioxidant and [G] epoxy compound, which are suitable components of the composition, do not contain these components. It turned out that it is excellent with the transmittance | permeability and heat-resistant transparency compared with Examples 1-12.

  The positive radiation sensitive composition for the discharge nozzle type coating method of the present invention forms an interlayer insulating film for display elements having high radiation sensitivity and high flatness (film thickness uniformity) without coating unevenness. Furthermore, high-speed application is possible. Therefore, the composition is suitable as a material for forming an interlayer insulating film for a display element such as a liquid crystal display element or an organic EL display element.

Claims (9)

[A] a polymer having a structural unit (I) containing a group represented by the following formula (1) and an epoxy group-containing structural unit in the same or different polymer molecules;
[B] at least one compound selected from the group consisting of oxime sulfonate compounds and onium salt compounds ;
[ C] an organic solvent , and
[E] a polyfunctional (meth) acrylate compound ,
The solid content concentration is 10% by mass or more and 30% by mass or less, the viscosity at 25 ° C. is 2.0 mPa · s or more and 12 mPa · s or less, and [C] as an organic solvent, at least (C1) vapor pressure at 20 ° C. There seen containing an organic solvent of less than 0.1 mmHg 1 mmHg, the (C1) an organic solvent, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, is selected from benzyl alcohol, the group consisting of dipropylene glycol monomethyl ether A positive radiation sensitive composition for a discharge nozzle type coating method, which is at least one organic solvent .

(In formula (1), R ¹ and R ² are each independently a hydrogen atom, an alkyl group, a cycloalkyl group or an aryl group, provided that the hydrogen atom of the alkyl group, cycloalkyl group and aryl group is A part or all of them may be substituted, and R ¹ and R ² are not both hydrogen atoms, and R ³ is an alkyl group, a cycloalkyl group, an aralkyl group, an aryl group, or —M ( R ^3m) is a group represented by _3. However, some or all of the hydrogen atoms with these groups may .M be substituted, Si, a Ge or Sn ^{.R 3m} is An alkyl group, provided that R ¹ and R ³ may be linked to form a cyclic ether together with the carbon atom to which they are bonded.) [C] As an organic solvent, (C2) further contains an organic solvent having a vapor pressure at 20 ° C. of 1 mmHg or more and 20 mmHg or less,
The positive for discharge nozzle type coating method according to claim 1, wherein the content of (C2) organic solvent is 10 mass% or more and 90 mass% or less with respect to the total amount of (C1) organic solvent and (C2) organic solvent. Type radiation sensitive composition. [C] As an organic solvent, (C2) further contains an organic solvent having a vapor pressure at 20 ° C. of 1 mmHg or more and 20 mmHg or less,
The positive for discharge nozzle type coating method according to claim 1, wherein the content of (C2) organic solvent is 10% by mass or more and 50% by mass or less with respect to the total amount of (C1) organic solvent and (C2) organic solvent. Type radiation sensitive composition. [D] further containing at least one surfactant selected from the group consisting of a fluorine-based surfactant and a silicone-based surfactant;
The discharge nozzle according to claim 1, 2 or 3, wherein the content of [D] surfactant is 0.01 parts by mass or more and 2 parts by mass or less with respect to 100 parts by mass of [A] polymer. A positive-type radiation-sensitive composition for a coating method. [F] The positive radiation sensitive composition for a discharge nozzle type coating method according to any one of claims 1 to 4 , further comprising an antioxidant. [G] The positive radiation sensitive composition for discharge nozzle type coating method according to any one of claims 1 to 5 , further comprising a compound having two or more epoxy groups in one molecule. (C2) The organic solvent is diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanone, n-butyl acetate, methyl isobutyl ketone, 3-methoxy The positive radiation sensitive composition for a discharge nozzle type coating method according to any one of claims 1 to 6 , which is at least one organic solvent selected from the group consisting of methyl propionate. Display element for an interlayer insulating film formed from the ejection nozzle type coating method for a positive-type radiation-sensitive composition according to any one of claims 1 to 7. (1) Applying the positive radiation sensitive composition for a discharge nozzle type coating method according to any one of claims 1 to 7 on a substrate while relatively moving the discharge nozzle and the substrate. And forming a coating film,
(2) A step of irradiating at least a part of the formed coating film with radiation,
(3) A method of forming an interlayer insulating film for a display element, comprising: a step of developing the coating film irradiated with the radiation; and (4) a step of heating the developed coating film.