JP4671841B2 - Degassing method and degassing apparatus between objects - Google Patents

Degassing method and degassing apparatus between objects Download PDF

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JP4671841B2
JP4671841B2 JP2005324652A JP2005324652A JP4671841B2 JP 4671841 B2 JP4671841 B2 JP 4671841B2 JP 2005324652 A JP2005324652 A JP 2005324652A JP 2005324652 A JP2005324652 A JP 2005324652A JP 4671841 B2 JP4671841 B2 JP 4671841B2
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contact
objects
degassing
region
separating
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JP2007134433A (en
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幸弘 前川
和司 東
直樹 鈴木
健太郎 西脇
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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本発明は、半導体などの製造に利用される真空装置に適用され、特にウエハ貼合せ装置やプラズマ処理装置において用いられ、重ね合わされた2枚の対象物の間のガスを排気する技術に関するものである。   The present invention is applied to a vacuum apparatus used for manufacturing semiconductors and the like, and more particularly to a technique for exhausting a gas between two stacked objects used in a wafer bonding apparatus or a plasma processing apparatus. is there.

従来より、減圧雰囲気において対象物である基板の貼り合わせを行う際に、大気圧雰囲気下で2枚の基板の位置合わせを行った後で減圧する場合が多い。この減圧時に2枚の基板間に存在するエアーを取り除くための様々な技術が提案されている。   Conventionally, when bonding substrates, which are objects, in a reduced pressure atmosphere, the pressure is often reduced after aligning the two substrates in an atmospheric pressure atmosphere. Various techniques for removing air existing between two substrates at the time of decompression have been proposed.

例えば、特許文献1の基板の貼り合わせ方法では、減圧雰囲気において、2枚の半導体基板間の複数箇所に配置されるスペーサ治具によって下側に第1の基板を配置し、上側に第2の基板を配置して両基板が接触しない状態として、2枚の基板を貼り合わせる際に減圧化でスペーサ治具を引き抜く技術が開示されている。
特開2000−216365号公報
For example, in the method of bonding substrates of Patent Document 1, the first substrate is disposed on the lower side and the second substrate is disposed on the upper side by spacer jigs disposed at a plurality of locations between two semiconductor substrates in a reduced pressure atmosphere. A technique is disclosed in which a spacer jig is pulled out under reduced pressure when two substrates are bonded together in a state where the substrates are placed and the two substrates are not in contact with each other.
JP 2000-216365 A

しかしながら、特許文献1に記載の構成では、スペーサ治具を引き抜く際に基板の位置ずれが発生する。このために、貼り合わせようとする2枚の基板間に厳しい位置決め精度が求められるような場合に、この方法では、目的を達成することができないという問題があった。   However, in the configuration described in Patent Document 1, the substrate is displaced when the spacer jig is pulled out. For this reason, when strict positioning accuracy is required between the two substrates to be bonded, this method has a problem that the object cannot be achieved.

本発明は、前記従来技術の問題を解決することに指向するものであり、2つの対象物(基板)の位置を高精度で保持するとともに、2つの接触する対象物の面間のエアーを短時間で取り除く対象物間の脱ガス方法および脱ガス装置を提供することを目的とする。   The present invention is directed to solving the above-described problems of the prior art, and maintains the position of two objects (substrates) with high accuracy and shortens the air between the surfaces of the two objects to be contacted. An object of the present invention is to provide a degassing method and a degassing apparatus between objects to be removed in time.

前記の目的を達成するために、本発明に係る対象物間の脱ガス方法は、大気圧雰囲気で第1対象物の所望の面と第2対象物の所望の面を接触させ、接触による接触面の一部の第1領域を、第1対象物と第2対象物を接触させた方向と同一の方向に押さえ、第1領域とは別の接触面の一部である第2領域を、第1対象物と第2対象物を離反させる方向に離し、大気圧雰囲気を真空雰囲気にし、離反させた第1対象物と第2対象物の第2領域を接触させる、工程を有し、前記第2領域を離反させる工程は、前記第1対象物の所望の面の面積は、第2対象物の所望の面の面積より大きく、前記第2対象物と接触していない前記第1対象物の所望の面での領域の一部を、前記第1対象物と前記第2対象物の接触面を離反させる方向に移動し、前記第2領域を離反させることを特徴とする。 In order to achieve the above-mentioned object, the degassing method between objects according to the present invention is to bring a desired surface of a first object into contact with a desired surface of a second object in an atmospheric pressure atmosphere, and contact by contact. The first region of a part of the surface is pressed in the same direction as the direction in which the first object and the second object are contacted, and the second region which is a part of the contact surface different from the first region is apart in the direction of separating the first object and the second object, the atmospheric pressure in the vacuum atmosphere, contacting the second region of the first object and the second object was separated, have a step, wherein In the step of separating the second region, the area of the desired surface of the first object is larger than the area of the desired surface of the second object, and the first object is not in contact with the second object. A part of the area on the desired surface of the first object and the second object are moved away from each other, and the second object is moved to the second surface. Characterized in that to separate the band.

また、本発明に係る対象物間の脱ガス装置は、接触させた第1対象物と第2対象物を載置する載置手段と、接触させた第1対象物あるいは第2対象物の一部の表面を押さえる押さえ手段と、接触させた第1対象物あるいは第2対象物の一部を離反させる離反手段とを備え、前記離反手段は、第2対象物と接触していない第1対象物の領域を、前記第1対象物と前記第2対象物の接触面を離す方向に移動させる突き上げ手段であることを特徴とする Further, the degassing apparatus between objects according to the present invention includes a placing means for placing the first object and the second object in contact with each other, one of the first object or the second object in contact with each other. A pressing means for pressing the surface of the part, and a separating means for separating a part of the first object or the second object in contact with each other, wherein the separating means is a first object that is not in contact with the second object It is a pushing-up means for moving an object region in a direction in which a contact surface between the first object and the second object is separated .

前記対象物間の脱ガス方法および装置によれば、第1対象物と第2対象物の一部の領域を押さえて互いにずれないように保持し、第1対象物の外周部を第2対象物から離れる方向に変形させることで、第1,第2対象物の面間のエアーを取り除くことができる。   According to the degassing method and apparatus between the objects, a part of the first object and the second object is pressed and held so as not to be displaced from each other, and the outer periphery of the first object is the second object. By deforming in a direction away from the object, air between the surfaces of the first and second objects can be removed.

本発明によれば、2つの対象物の位置を高精度で保持するとともに、2つの接触する対象物の面間のエアーを短時間で取り除くことができるという効果を奏する。   According to the present invention, it is possible to hold the position of two objects with high accuracy and to remove air between the surfaces of the two objects in contact in a short time.

以下、図面を参照して本発明における実施の形態を詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図1は本発明の実施の形態における脱ガス装置の概略構成を示す断面図である。本実施の形態の脱ガス装置は、略円板状のシリコン基板である第1対象物1と同形状のシリコン基板である第2対象物2を重ね合わせた状態で脱ガスを行う装置である。   FIG. 1 is a cross-sectional view showing a schematic configuration of a degassing apparatus according to an embodiment of the present invention. The degassing apparatus according to the present embodiment is an apparatus that performs degassing in a state where the second object 2 that is a silicon substrate having the same shape as the first object 1 that is a substantially disk-shaped silicon substrate is overlapped. .

図1に示すように、脱ガス装置は第1対象物1および第2対象物2を内部に収容して外気から隔離するチャンバー3と、チャンバー3内において、チャンバー3内を減圧するための真空ポンプ(図示せず)に接続されている排気配管4と、第1対象物1と第2対象物2を位置合わせした状態で保持する載置手段のベースプレート6と対象物固定部7からなる治具、および治具を載置するためのステージ5と、対象物の固定,解除を行う対象物固定部7の突き上げシャフト8および突き上げシャフト駆動部9と、第1対象物1と第2対象物2がずれないように押さえる押さえ手段の対象物押さえ部10および対象物押さえ駆動部11と、第1対象物1の一部を持ち上げるための離反手段である吸着配管12(真空吸着手段)を備える。   As shown in FIG. 1, the degassing apparatus includes a chamber 3 that houses a first object 1 and a second object 2 inside and isolates them from the outside air, and a vacuum for depressurizing the inside of the chamber 3 in the chamber 3. An exhaust pipe 4 connected to a pump (not shown), a base plate 6 of mounting means for holding the first target object 1 and the second target object 2 in an aligned state, and a target fixing part 7. A stage 5 for placing a tool and a jig, a push-up shaft 8 and a push-up shaft drive part 9 of a target fixing part 7 for fixing and releasing a target, a first target 1 and a second target 2 includes an object pressing unit 10 and an object pressing drive unit 11 of a pressing unit for pressing so as not to deviate, and an adsorption pipe 12 (vacuum adsorption unit) which is a separation unit for lifting a part of the first object 1. .

ここで、吸着配管12は第1対象物1の外周部に複数個を均等に設置されており、その吸着面(図1では下端)には対象物を吸着しやすくするために弾性体の吸着パッドが設けられていることが望ましい。また、吸着配管12の真空源はチャンバー3の排気配管4に接続されている真空ポンプと共用としてもよい。ただし、共用する場合は、吸着配管12からの排気とチャンバー3の排気配管4からの排気を個別に制御できるように各々にバルブをつける必要がある。   Here, a plurality of suction pipes 12 are equally installed on the outer periphery of the first object 1, and the suction surface (lower end in FIG. 1) adsorbs an elastic body to make it easier to suck the object. It is desirable that a pad is provided. Further, the vacuum source of the adsorption pipe 12 may be shared with the vacuum pump connected to the exhaust pipe 4 of the chamber 3. However, when sharing, it is necessary to attach a valve to each so that the exhaust from the adsorption pipe 12 and the exhaust from the exhaust pipe 4 of the chamber 3 can be controlled individually.

また、対象物押さえ部10の先端部(対象物に接する側)は球面に加工、または弾性体を取り付けるなど対象物に損傷を与えないようにする。さらに、対象物固定部7はバネなどを用いて構成され、2枚の対象物がずれないよう外周部に複数個を均等に配置するのがよい。   In addition, the tip of the object pressing part 10 (the side in contact with the object) is processed into a spherical surface or attached with an elastic body so as not to damage the object. Furthermore, the object fixing portion 7 is configured using a spring or the like, and it is preferable that a plurality of the object fixing portions 7 are evenly arranged on the outer peripheral portion so that the two objects do not shift.

図2−1(a)〜(f),図2−2(g)〜(j)は脱ガス装置の動作の流れを示す図である。まず、第1対象物1および第2対象物2をあらかじめ位置合わせして治具(ベースプレート6,対象物固定部7)に固定された状態で大気圧状態のチャンバー3内のステージ5上に載置する(図2−1(a)参照)。次に、対象物押さえ部10を下降させて第1対象物1と第2対象物2を押さえる(図2−1(b)参照)。次に、突き上げシャフト8を上昇させることにより、対象物固定部7を上昇させて対象物の固定を解除する(図2−1(c)参照)。次に、吸着配管12を下降させて第1対象物1の上面に接触させる(図2−1(d)参照)。次に、吸着配管12から排気を行い、第1対象物1を吸着したら(図2−1(e)参照)、吸着配管12を上昇させる(図2−1(f)参照)。   FIGS. 2-1 (a) to (f) and FIGS. 2-2 (g) to (j) are diagrams illustrating the operation flow of the degassing apparatus. First, the first object 1 and the second object 2 are aligned in advance and mounted on the stage 5 in the atmospheric pressure chamber 3 while being fixed to a jig (base plate 6, object fixing unit 7). (See FIG. 2-1 (a)). Next, the object pressing part 10 is lowered to hold the first object 1 and the second object 2 (see FIG. 2-1 (b)). Next, by raising the push-up shaft 8, the object fixing unit 7 is raised to release the object (see FIG. 2-1 (c)). Next, the suction pipe 12 is lowered and brought into contact with the upper surface of the first object 1 (see FIG. 2-1 (d)). Next, after exhausting from the adsorption pipe 12 and adsorbing the first object 1 (see FIG. 2-1 (e)), the adsorption pipe 12 is raised (see FIG. 2-1 (f)).

次に、排気配管4から排気を行い、チャンバー3内を減圧する(図2−2(g)参照)。ここで、チャンバー3内の圧力が吸着配管12内の圧力以下になると、吸着配管12に吸着されていた第1対象物1の外周部が吸着配管12から外れ、第2対象物2と接触する(図2−2(h)参照)。そして、対象物固定部7を下降させて対象物を固定した後(図2−2(i)参照)、対象物押さえ部10および吸着配管12を上昇させる(図2−2(j)参照)。   Next, exhaust is performed from the exhaust pipe 4, and the pressure in the chamber 3 is reduced (see FIG. 2-2 (g)). Here, when the pressure in the chamber 3 becomes equal to or lower than the pressure in the adsorption pipe 12, the outer peripheral portion of the first object 1 adsorbed on the adsorption pipe 12 comes off from the adsorption pipe 12 and comes into contact with the second object 2. (See FIG. 2-2 (h)). Then, after lowering the object fixing part 7 to fix the object (see FIG. 2-2 (i)), the object pressing part 10 and the suction pipe 12 are raised (see FIG. 2-2 (j)). .

以上に、本実施の形態について説明したが、本発明は前述の実施の形態に限定されるものではなく、様々な変更が可能である。   Although the present embodiment has been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made.

例えば、実施の形態では、2枚の対象物を重ねていたが、この材質は、半導体,ガラス,金属,セラミック,樹脂などどのようなものでもよく、その形状についても、略円形,多角形,その他どのような形状についても実施することが可能である。   For example, in the embodiment, two objects are stacked, but this material may be any material such as semiconductor, glass, metal, ceramic, resin, and the shape is also substantially circular, polygonal, Any other shape can be implemented.

また、対象物固定の方法についても、重ね合わせた2つの対象物がずれなければ、どのような構成になっていてもかまわない。さらに、対象物押さえ部10および吸着配管12の位置について、本実施の形態では、対象物の中央を押さえて外周部に均等に吸着配管12を配置しているが、それぞれの個数、配置場所は様々であり、外周部の1点を押さえてその反対側の外周部の1点あるいは複数箇所に吸着配管12を配置してもかまわない。   Further, the object fixing method may be any configuration as long as the two superimposed objects are not displaced. Furthermore, with respect to the positions of the object pressing unit 10 and the suction pipe 12, in the present embodiment, the suction pipes 12 are evenly arranged on the outer peripheral part while pressing the center of the object. The suction pipe 12 may be arranged at one point or a plurality of locations on the opposite outer peripheral portion while pressing one point on the outer peripheral portion.

本実施の形態では、2枚の対象物を水平に置いて上側の対象物を吸着して持ち上げているが、真空吸着以外にも例えば、粘着性のある材料を用いても構成が可能であり、第1対象物1が第2対象物2より面積が大きい場合は、フックなどの機構によっても同様の効果が得られる。   In the present embodiment, two objects are placed horizontally and the upper object is adsorbed and lifted, but other than vacuum adsorption, for example, a configuration using an adhesive material is possible. When the area of the first object 1 is larger than that of the second object 2, the same effect can be obtained by a mechanism such as a hook.

また、第1対象物1を上に持ち上げているがこれ以外にも、上下逆の構成、あるいは対象物を垂直方向に保持しても実施可能である。   In addition, the first object 1 is lifted up, but other than this, the present invention can be carried out by turning the object upside down or holding the object in the vertical direction.

また、本実施の形態では、対象物の外周部を真空吸着によって持ち上げる離反手段の例を示したが、これ以外にも、図3に示すように第1対象物1が第2対象物2に比べて大きい場合には、突き上げ手段として突き上げピン13により第1対象物1の外周部を持ち上げることで同様の効果が得られる。さらに、図4に示すように第2対象物2に貫通穴14があいている場合には突き上げピン13をこの穴と同じ位置に配置し、この貫通穴14を通して第1対象物1を持ち上げることができる。   Moreover, in this Embodiment, although the example of the separation means which lifts the outer peripheral part of a target object by vacuum suction was shown, the 1st target object 1 becomes the 2nd target object 2 as shown in FIG. In the case where it is larger than that, the same effect can be obtained by lifting the outer peripheral portion of the first object 1 by the push-up pin 13 as the push-up means. Furthermore, as shown in FIG. 4, when the second object 2 has a through hole 14, the push-up pin 13 is disposed at the same position as this hole, and the first object 1 is lifted through the through hole 14. Can do.

具体的には、図5に示すように、第1対象物1を持ち上げる高さを「H」とすると、対象物押さえ部10で第1対象物1を押さえている位置Aと吸着配管12の位置Bの間の距離を「L」としたときの関係は(数1)の範囲にするのがよい。
(数1)
1/1000 ≦ H/L ≦ 1/10
H/Lが1/1000より小さいと脱ガスの効果は小さくなり、H/Lが1/10より大きくなると吸着配管12の外径を大きくする、あるいは、本数を増やすなどの装置構成上の問題が発生するとともに、2枚の対象物がずれる可能性が生じる。
Specifically, as shown in FIG. 5, assuming that the height at which the first object 1 is lifted is “H”, the position A of the object pressing unit 10 holding the first object 1 and the suction pipe 12. The relationship when the distance between the positions B is “L” is preferably in the range of (Equation 1).
(Equation 1)
1/1000 ≦ H / L ≦ 1/10
When H / L is less than 1/1000, the effect of degassing is reduced, and when H / L is greater than 1/10, problems in the apparatus configuration such as increasing the outer diameter of the adsorption pipe 12 or increasing the number of the pipes. As a result, there is a possibility that the two objects will be displaced.

本発明に係る対象物間の脱ガス方法および脱ガス装置は、2つの対象物の位置を高精度で保持するとともに、2つの接触する対象物の面間のエアーを短時間で取り除くことができ、半導体などの製造に利用される真空装置に適用され、特にウエハ貼合せ装置やプラズマ処理装置において用いられ、重ね合わされた2枚の対象物の間のガスを排気する技術として有用である。   The degassing method and degassing apparatus between objects according to the present invention can maintain the position of two objects with high accuracy and remove air between the surfaces of two objects in contact in a short time. The present invention is applied to a vacuum apparatus used for manufacturing semiconductors and the like, particularly used in a wafer bonding apparatus and a plasma processing apparatus, and is useful as a technique for exhausting a gas between two superimposed objects.

本発明の実施の形態における脱ガス装置の概略構成を示す断面図Sectional drawing which shows schematic structure of the degassing apparatus in embodiment of this invention 本実施の形態における脱ガス装置の動作の流れを示す図The figure which shows the flow of operation | movement of the degassing apparatus in this Embodiment. 本実施の形態における脱ガス装置の動作の流れを示す図The figure which shows the flow of operation | movement of the degassing apparatus in this Embodiment. 本実施の形態における別の脱ガス装置の概略構成を示す断面図Sectional drawing which shows schematic structure of another degassing apparatus in this Embodiment. 本実施の形態におけるもうひとつ別の脱ガス装置の概略構成を示す断面図Sectional drawing which shows schematic structure of another degassing apparatus in this Embodiment. 本実施の形態における第1対象物と対象物押さえ部と吸着配管の関係を示す図The figure which shows the relationship between the 1st target object, target object holding | suppressing part, and adsorption | suction piping in this Embodiment.

符号の説明Explanation of symbols

1 第1対象物
2 第2対象物
3 チャンバー
4 排気配管
5 ステージ
6 ベースプレート
7 対象物固定部
8 突き上げシャフト
9 突き上げシャフト駆動部
10 対象物押さえ部
11 対象物押さえ駆動部
12 吸着配管
13 突き上げピン
14 貫通穴
DESCRIPTION OF SYMBOLS 1 1st target object 2 2nd target object 3 Chamber 4 Exhaust piping 5 Stage 6 Base plate 7 Target fixing part 8 Pushing shaft 9 Pushing shaft drive part 10 Object pressing part 11 Object pressing drive part 12 Suction piping 13 Pushing pin 14 Through hole

Claims (2)

大気圧雰囲気で第1対象物の所望の面と第2対象物の所望の面を接触させ、
前記接触による接触面の一部の第1領域を、前記第1対象物と前記第2対象物を接触させた方向と同一の方向に押さえ、
前記第1領域とは別の前記接触面の一部である第2領域を、前記第1対象物と前記第2対象物を離反させる方向に離し、
前記大気圧雰囲気を真空雰囲気にし、前記離反させた前記第1対象物と第2対象物の第2領域を接触させる、
工程を有し、前記第2領域を離反させる工程は、前記第1対象物の所望の面の面積は、第2対象物の所望の面の面積より大きく、前記第2対象物と接触していない前記第1対象物の所望の面での領域の一部を、前記第1対象物と前記第2対象物の接触面を離反させる方向に移動し、前記第2領域を離反させることを特徴とする対象物間の脱ガス方法。
Contacting a desired surface of the first object and a desired surface of the second object in an atmospheric pressure atmosphere;
A first region of a part of the contact surface by the contact is pressed in the same direction as the direction in which the first object and the second object are brought into contact;
Separating a second region that is a part of the contact surface different from the first region in a direction to separate the first object and the second object;
The atmospheric pressure atmosphere is changed to a vacuum atmosphere, and the separated first object and the second area of the second object are brought into contact with each other.
And the step of separating the second region includes a step in which an area of a desired surface of the first object is larger than an area of a desired surface of the second object and is in contact with the second object. A part of a region on a desired surface of the first object that is not present is moved in a direction in which the contact surface between the first object and the second object is separated, and the second region is separated. A degassing method between objects.
接触させた第1対象物と第2対象物を載置する載置手段と、
前記接触させた第1対象物あるいは第2対象物の一部の表面を押さえる押さえ手段と、
前記接触させた第1対象物あるいは第2対象物の一部を離反させる離反手段と
を備え、前記離反手段は、第2対象物と接触していない第1対象物の領域を、前記第1対象物と前記第2対象物の接触面を離す方向に移動させる突き上げ手段であることを特徴とする対象物間の脱ガス装置。
Placing means for placing the first and second objects in contact with each other;
A pressing means for pressing a part of the surface of the contacted first object or second object;
Separating means for separating a part of the first object or the second object brought into contact with each other, wherein the separating means defines a region of the first object that is not in contact with the second object as the first object. A degassing apparatus between objects, wherein the apparatus is a push-up means for moving the object and a contact surface of the second object away from each other.
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