JP4655735B2 - LED unit - Google Patents

Description

  The present invention relates to an LED unit in which a surface-mounted LED is mounted on a wiring board.

  Conventionally, LED chips are combined with LED chips and phosphors (fluorescent pigments, fluorescent dyes, etc.) as wavelength conversion materials that are excited by light emitted from the LED chips and emit light of a different emission color from the LED chips. Research and development of light-emitting devices that emit light of a color different from the color of the light is being conducted in various places. As this type of light-emitting device, for example, a white light-emitting device (generally called a white LED) that obtains white light (white light emission spectrum) by combining an LED chip that emits blue light or ultraviolet light and a phosphor. Has been commercialized. Here, the white LED is not limited to a bullet-type LED, but an LED chip, a package in which a housing recess for housing the LED chip is formed, a silicone resin for sealing the LED in the housing housing recess, and the like There is provided a surface mount type LED including a color conversion part in which the phosphor is dispersed in a transparent resin.

  By the way, not only white LEDs but also LEDs have advantages in that they can be reduced in size, weight and power saving as compared to conventional incandescent bulbs and fluorescent lamps. It is widely used as an alternative light source for light bulbs (incandescent light bulbs, halogen light bulbs, etc.), a light source for liquid crystal panels of mobile phones (backlight for liquid crystal panels), and the like.

In addition, with the recent increase in output of white LEDs, research and development for expanding white LEDs into lighting applications has become active, but the above-mentioned white LEDs require a relatively large light output, such as general lighting. When using for a purpose, it is impossible to obtain a desired light output with one white LED. Therefore, an LED unit in which a plurality of surface-mounted LEDs are mounted on one wiring board is configured, and the entire LED unit is desired. Is generally ensured (see, for example, Patent Documents 1, 2, and 3). In such an LED unit, the electrode portion of each surface-mounted LED is connected to the terminal portion in the circuit pattern of the wiring board via a joint portion made of a joining material such as solder.
Japanese Patent Laid-Open No. 2005-18048 JP 2004-71908 A JP 2005-12155 A

  By the way, in the LED unit in which a plurality of surface mount LEDs are mounted on one wiring board as described above, although the amount of heat generated by each surface mount LED is relatively small, the number of surface mount LEDs is increased. As the amount of heat generated increases, heat tends to accumulate on the wiring board, and the temperature of the entire LED unit tends to rise.

  In addition, in the lighting fixture using the above-mentioned LED unit, the fixture main body tends to be smaller than the fixture main body of the conventional lighting fixture in order to take advantage of the small size of the LED. Other circuit components such as the control unit and the control unit are also arranged close to each other, but since these circuit components act as a heat source for the LED unit, the LED unit is further heated by the heat source around the LED unit. Happens.

  As described above, when the LED unit is used for lighting or the like, the LED unit expands and contracts repeatedly by repeating the temperature increase after starting lighting and the temperature decreasing after extinguishing the light. It has become clear that cracks may occur in the joints due to the difference in the thermal expansion coefficient between them and the joints may peel off from the electrode parts of the surface mount LED.

  The present invention has been made in view of the above-mentioned reasons, and the purpose thereof is due to the difference in thermal expansion coefficient between the surface-mounted LED and the wiring board, and the circuit of the electrode portion of the surface-mounted LED and the wiring board. An LED that can prevent cracks from being formed in the joints connecting between the terminal parts in the pattern or that the joints are peeled off from the electrode parts of the surface-mounted LED, and can improve reliability. To provide a unit.

The invention of claim 1 includes a wiring board on which a circuit pattern is formed through a resin layer on one surface of the metal plate, that Do a bonding material terminal portion and the electrode portion of the surface-mounted LED in a circuit pattern No. a LED unit connected via one of the junction, the wiring board, the stress generated in the first junction due to the difference in thermal expansion coefficient between the surface-mounted LED and the wiring board The terminal part can be displaced so as to relax , and in the surface-mounted LED, an LED chip is mounted on one surface side of the mounting board, and an electrode part is provided on the peripheral part on the other surface of the mounting board. The wiring board is formed so that the one surface of the metal plate is exposed in the mounting area of the surface-mount type LED, and the terminal part in the circuit pattern protrudes to the inside of the mounting area, so that the terminal part becomes the stress. I will ease The heat dissipating pad disposed in the central portion of the other surface of the mounting substrate is thermally connected to the one surface of the metal plate through a second joint portion made of a joining material. The projecting part to be coupled to the projecting part is projected, and the projecting dimension of the projecting part is set so that the surface of each circuit pattern is flush with the surface of the projecting part .

According to the present invention, since the terminal portion is a displaceable so as to alleviate the stress generated in the first junction due to the difference in thermal expansion coefficient between the surface-mounted LED and the wiring board, When the LED unit expands and contracts due to heat generation of the surface-mounted LED during lighting or changes in ambient temperature, the electrode of the surface-mounted LED is caused by the difference in coefficient of thermal expansion between the surface-mounted LED and the wiring board. parts as the first junction which Ri crack occurs in the first junction that are connected between the terminals provided on the circuit pattern of the wiring substrate is peeled off from the electrode portion of the surface mount LED Can be prevented and reliability can be improved.

Further, according to this invention, the end terminal portion so as to alleviate the stress generated in the first junction due to the difference in thermal expansion coefficient between the wiring board and the surface mount LED flexes end terminal part becomes to be displaced by, that the first junction which Ri crack occurs in the first junction is prevented from being peeled off from the electrodes of the surface mount LED I can . Further, according to the present invention, the one surface of the metal plate is thermally connected to the heat-dissipating pad disposed in the central portion of the other surface of the mounting substrate via the second bonding portion made of the bonding material. The projecting part to be coupled to the projecting part is projected, and the projecting dimension of the projecting part is set so that the surface of each circuit pattern and the surface of the projecting part are flush with each other. The heat generated in step 1 can be transferred to the metal plate through the heat dissipating pad and the second bonding portion to be dissipated, so that the temperature rise of the surface mount LED can be suppressed.

According to a second aspect of the present invention , there is provided a wiring board in which a circuit pattern is formed on one surface of a metal plate via a resin layer, and a terminal portion in the circuit pattern is formed of a bonding material and an electrode portion of a surface mount LED. LED unit connected via a bonding portion of the wiring board, wherein the wiring board relieves stress generated in the first bonding portion due to a difference in thermal expansion coefficient between the surface-mounted LED and the wiring board. The surface mount type LED has an LED chip mounted on one surface side of the mounting substrate and an electrode portion formed on the peripheral surface of the other surface of the mounting substrate. becomes, wiring substrate is Litan terminal portion by the forming a plurality of grooves at least reach the resin layer depth around the terminal portion can be displaced so as to relieve the stress, the grooves , Surface mount type L on wiring board D is formed along the direction perpendicular to the direction connecting the pair of terminal portions of the surface-mounted LED in a plane parallel to the one surface of the metal plate outside the mounting region of D, and is formed on the one surface of the metal plate. Each of the circuit patterns is provided with a projecting base portion in which a heat dissipating pad disposed in the central portion of the other surface of the mounting substrate is thermally coupled via a second joint portion made of a joining material. The projecting dimension of the projecting part is set so that the surface of the projecting part and the surface of the projecting part are flush with each other.

According to this invention, since the terminal portion can be displaced so as to relieve the stress generated in the first joint due to the difference in thermal expansion coefficient between the surface-mounted LED and the wiring board, When the LED unit expands and contracts due to heat generation of the surface-mounted LED or changes in ambient temperature, the electrode portion of the surface-mounted LED is caused by the difference in coefficient of thermal expansion between the surface-mounted LED and the wiring board. To prevent cracks from being generated in the first joints connecting the terminal parts of the circuit pattern of the wiring board and the terminal parts from the electrode parts of the surface-mounted LED. Can improve reliability. Further, according to this invention, by a groove around the ends of the terminal portions that put the wiring substrate is formed, due to the difference in thermal expansion coefficient between the wiring board and the surface mount type LED becomes the ends of the terminal portions are displaced so as to relax the stress generated in the first junction, the first junction is conductive of surface mount type LED which Ri crack occurs in the first junction It is possible to prevent peeling from the pole portion . Further, according to the present invention, the one surface of the metal plate is thermally connected to the heat-dissipating pad disposed in the central portion of the other surface of the mounting substrate via the second bonding portion made of the bonding material. The projecting part to be coupled to the projecting part is projected, and the projecting dimension of the projecting part is set so that the surface of each circuit pattern and the surface of the projecting part are flush with each other. The heat generated in step 1 can be transferred to the metal plate through the heat dissipating pad and the second bonding portion to be dissipated, so that the temperature rise of the surface mount LED can be suppressed.

In the first and second aspects of the invention, the electrode portion of the surface mount LED and the terminal portion of the wiring pattern of the wiring board are connected due to the difference in thermal expansion coefficient between the surface mount LED and the wiring substrate. effect that the first junction Ru Tei can first junction where Ri crack occurs can be prevented from peeled off from the electrode portion of the surface mount LED, it is possible to improve reliability There is.

(Embodiment 1)
As shown in FIG. 1, the LED unit of the present embodiment includes a surface-mounted LED 1 and a wiring board 3 on which the surface-mounted LED 1 is mounted on one surface side (upper surface side in FIG. 1). In FIG. 1, only one surface-mounted LED 1 is shown, but a plurality of surface-mounted LEDs 1 are mounted on the wiring board 3.

  The surface-mounted LED 1 includes an LED chip 10 and a mounting substrate 20 made of ceramic (for example, alumina) on which the LED chip 10 is mounted. The mounting substrate 20 also serves as a package, and a housing recess 21 for housing the LED chip 10 is formed on one surface (upper surface in FIG. 1A), and each pad (not shown) of the LED chip 10 is formed. ) Includes two wiring patterns 22 and 22 made of a conductive material to be electrically connected. Here, each wiring pattern 22 straddles the inner bottom surface and inner peripheral surface of the housing recess 21 of the mounting substrate 20 and the one surface, side surface, and other surface (the lower surface in FIG. 1A) of the mounting substrate 20. One end portion formed on the inner bottom surface of the storage recess 21 constitutes the chip connection portion 22a, and the other end portion formed on the peripheral portion on the other surface constitutes the electrode portion 22b. Yes. In addition, the outer peripheral shape of the mounting substrate 20 is rectangular, and the opening of the storage recess 21 in the mounting substrate 20 increases as the distance from the inner bottom surface of the storage recess 21 increases.

  The LED chip 10 is a GaN-based blue LED chip that emits light in a blue wavelength range, and sapphire whose light-emitting portion made of a GaN-based compound semiconductor material is a base substrate that is transparent to the light emitted from the light-emitting portion. It is formed on one surface side of the substrate, and is flip-chip mounted with the light emitting portion facing the inner bottom surface of the housing recess 21 of the mounting substrate 20. In short, in the LED chip 10, each pad (not shown) is electrically connected to the chip connecting portions 22a and 22a of the wiring patterns 22 and 22 via the bumps 12 and 12 made of a metal material (for example, gold). And it mounts on the mounting board | substrate 20 so that the other surface of the said sapphire board | substrate may become a light extraction surface, The light light-emitted in the light emission part of the LED chip 10 is taken out through the said sapphire board | substrate.

  The surface-mount LED 1 includes a color conversion unit (not shown) having a particulate yellow phosphor that emits light when excited by light emitted from the LED chip 10, and is emitted from the LED chip 10. White light consisting of the combined light of the light and the light emitted from the yellow phosphor is obtained. In addition, the above-described color conversion unit may be configured by dispersing a yellow phosphor in a transparent resin such as a silicone resin that seals the LED chip 10 in the housing recess 21 of the mounting substrate 20. A mixture of resin and yellow phosphor may be formed into a sheet shape and fixed to the mounting substrate 20 so as to close the opening surface of the storage recess 21.

  Therefore, in the surface-mounted LED 1, when power is supplied from a power supply unit (not shown) between the electrode units 22b and 22b, the LED chip 10 emits light and the yellow phosphor of the color conversion unit emits light. Is output. Here, as the power supply unit, for example, a configuration including a rectifier circuit including a diode bridge that rectifies and smoothes an AC power supply and a smoothing capacitor that smoothes the output of the rectifier circuit may be employed.

The wiring board 3 is made of a metal material through a resin layer 32 made of an insulating resin such as a glass epoxy resin on one surface of a metal plate 31 made of a metal material having a high thermal conductivity such as copper or aluminum. A circuit pattern 33 is formed. The circuit pattern 33 is formed by patterning a thin metal plate. Here, the wiring board 3 is connected to the terminal portion 33a of the circuit pattern 33 via the bonding portion (first bonding portion) 4 made of a bonding material such as solder and the electrode portion 22b of the surface mount LED 1 .

Further, a protrusion 31a is provided on the one surface of the metal plate 31 of the wiring board 3 and is disposed at the center of the protrusion 31a and the other surface of the mounting board 20 for heat dissipation. The pad 23 is thermally coupled to the pad 23 via a joint portion (second joint portion) 5 made of a joining material such as solder. That is, the heat generated in each surface-mounted LED 1 can be transferred to the metal plate 31 through the heat-dissipating pad 23 and the joint 5 to be dissipated, so that the surface-mounted LED 1 and the LED chip 10 mounted therein can be dissipated. Temperature rise can be suppressed. Note that the wiring board 3 has the protruding dimension of the protruding part 31a set so that the surface of each circuit pattern 33 and the surface of the protruding part 31a are substantially flush with each other.

  By the way, the wiring board 3 exposes the one surface of the metal plate 31 in the mounting region of the surface-mounted LED 1 (region overlapping the surface-mounted LED), and the terminal portion 33a in the circuit pattern 33 protrudes to the inside of the mounting region. A gap 38 is formed between the terminal portion 33a and the one surface of the metal plate 31 so that the terminal portion 33a can be bent in the thickness direction. That is, in the wiring board 3, the thickness dimension of the metal thin plate is set to a dimension that allows the terminal portion 33a to bend in the thickness direction and support the surface-mounted LED. The terminal portion 33a can be deformed so as to relieve the stress generated in the joint portion 4 due to the difference in thermal expansion coefficient with the substrate 3, in other words, the difference in thermal expansion coefficient between the surface mount LED 1 and the wiring substrate 3. The terminal portion 33a can be displaced so as to relieve the stress generated in the joint portion 4 due to the above.

  In the LED unit of the present embodiment described above, the terminal portion 33a is displaced in a direction to relieve the stress generated in the joint portion 4 due to the difference in thermal expansion coefficient between the surface-mounted LED 1 and the wiring board 3. Therefore, when the LED unit expands and contracts due to heat generation of the surface-mounted LED 1 during lighting or a change in ambient temperature, the surface mounting is caused by the difference in coefficient of thermal expansion between the surface-mounted LED 1 and the wiring board 3. A crack occurs in the joint portion 4 connecting the electrode portion 22b of the LED 1 and the terminal portion 33a in the circuit pattern 33 of the wiring board 3, or the joint portion 4 is peeled off from the electrode portion 22b of the surface mount LED 1 Can be prevented, and reliability can be improved.

(Embodiment 2)
The basic configuration of the LED unit of the present embodiment is substantially the same as that of the first embodiment, and the structure of the surface-mounted LED 1 is different as shown in FIG. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  In the surface-mounted LED in the first embodiment, the LED chip 1 is flip-chip mounted on the mounting substrate 20 face down, whereas in the surface-mounted LED 1 in the present embodiment, the LED chip 10 is a flat mounting substrate. 20 is mounted face-up on one surface side, and each pad (not shown) of the LED chip 10 is electrically connected to the wiring patterns 22 and 22 via bonding wires W. Further, in the surface-mounted LED 1 in the present embodiment, a sealing portion 24 made of a sealing resin such as a silicone resin is provided on the one surface side of the mounting substrate 20, and a sheet-like color is provided on the sealing portion 24. A conversion unit (not shown) is provided.

  Also in the LED unit of the present embodiment, as in the first embodiment, the terminal portion 33a is relieved so as to relieve the stress generated in the joint portion 4 due to the difference in coefficient of thermal expansion between the surface-mounted LED 1 and the wiring board 3. Can be displaced, so that when the LED unit expands and contracts due to heat generation of the surface-mounted LED 1 during lighting or changes in ambient temperature, the difference in thermal expansion coefficient between the surface-mounted LED 1 and the wiring board 3 As a result, a crack occurs in the joint 4 connecting the electrode portion 22b of the surface mount LED 1 and the terminal portion 33a in the circuit pattern 33 of the wiring board 3, or the joint 4 is an electrode of the surface mount LED 1. It can prevent peeling from the part 22b, and can improve reliability.

(Embodiment 3)
The configuration of the LED unit of the present embodiment is substantially the same as that of the first embodiment, and the structure of the wiring board 3 is different as shown in FIG. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  The wiring board 3 of the present embodiment is obtained by patterning a metal foil (for example, copper foil) formed on the surface of the glass epoxy substrate 34 in which the circuit pattern 33 is laminated on the resin layer 32 on the metal plate 31. In this embodiment, the resin layer 32 and the glass epoxy substrate 34 constitute a resin layer interposed between the metal plate 31 and the circuit pattern 33. The glass epoxy substrate 34 is formed with a rectangular insertion hole 34a through which the protruding portion 31a of the metal plate 31 is inserted.

  Further, in the wiring board 3 of the present embodiment, the terminal portion 33a can be displaced so as to relieve the stress generated in the joint portion 4 due to the difference in thermal expansion coefficient between the surface-mounted LED 1 and the wiring board 3. For this purpose, a plurality of grooves 35 having a depth reaching the one surface of the metal plate 31 are formed around the terminal portions 33a and 33a. Here, the grooves 35 formed around each of the terminal portions 33a and 33a are both terminal portions in a plane parallel to the one surface of the metal plate 31 outside the mounting region of the surface-mounted LED 1 on the wiring board 3. Each circuit pattern 33 is formed in a U-shape in which the planar shape of the portion in the vicinity of the terminal portion 33 a bypasses the groove 35.

  Therefore, in the LED unit of the present embodiment, the groove 35 is formed around the terminal portion 33a in the wiring board 3, which is caused by the difference in thermal expansion coefficient between the surface-mounted LED 1 and the wiring board 3. The terminal portion 33a is displaced so as to relieve the stress generated in the joint portion 4, and the joint portion 4 is prevented from being cracked or from being separated from the electrode portion 22b of the surface mount LED 1. be able to.

  In the example shown in FIG. 3, each groove 35 of the wiring board 3 is formed to a depth reaching the metal plate 31. However, each groove 35 is not necessarily formed to a depth reaching the metal plate 31. As shown in FIG. 4, the groove 35 may have a depth reaching the resin layer 32.

(Embodiment 4)
The structure of the LED unit of this embodiment is shown in FIG. The basic configuration is substantially the same as that of the third embodiment, and in the third embodiment, a projecting portion 31a that is thermally coupled to the heat dissipating pad 23 on the other surface of the surface-mounted LED 1 is continuously projected from the metal plate 31. In contrast, in the present embodiment, in the metal plate 31, the region that overlaps the surface-mounted LED 1 includes a part of the resin layer 32, a part of the glass epoxy substrate 34, and a part of the metal foil. A groove 37 different from the groove 35 is provided in the wiring board 3 so that a plurality of (three in the illustrated example) land portions 36 are formed, and the metal foil portion in each land portion 36 is soldered. It is thermally coupled to the heat dissipating pad 23 through the joint portion 5 made of an appropriate joining material. Here, the planar shape of each land portion 36 is an elongated rectangular shape orthogonal to the direction connecting both terminal portions 33 a and 33 a in a plane parallel to the one surface of the metal plate 31. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 3, and description is abbreviate | omitted.

  Thus, in the LED unit of the present embodiment, the groove 35 is formed around the terminal portion 33a in the wiring board 3, and the groove 37 is formed around each land portion 36, so that the surface-mounted LED 1 is formed. The metal foil portions in the terminal portion 33a and the land portion 36 are displaced so as to relieve the stress generated in the respective joint portions 4 and 5 due to the difference in the thermal expansion coefficient between the terminal portion 33a and the wiring board 3. 4 and 5 can be prevented from being cracked, the bonding portion 4 can be peeled off from the electrode portion 22b of the surface-mount LED 1, and the bonding portion 5 can be prevented from peeling off from the heat dissipation pad 23.

  In the example shown in FIG. 5, the grooves 35 and 37 of the wiring board 3 are formed to a depth that reaches the metal plate 31, but the depth of the grooves 35 and 37 is reduced as shown in FIG. Alternatively, the resin layer 32 may be formed partway.

1 is a schematic cross-sectional view showing a first embodiment. FIG. 6 is a schematic cross-sectional view showing a second embodiment. Embodiment 3 is shown, (a) is a schematic sectional view, and (b) is a schematic plan view of a wiring board. The other example of a structure same as the above is shown, (a) is a schematic sectional drawing, (b) is a schematic plan view of a wiring board. Embodiment 4 is shown, (a) is a schematic sectional view, and (b) is a schematic plan view of a wiring board. The other example of a structure same as the above is shown, (a) is a schematic sectional drawing, (b) is a schematic plan view of a wiring board.

Explanation of symbols

1 Surface-mount LED
DESCRIPTION OF SYMBOLS 3 Wiring board 4 Junction part 10 LED chip 12 Bump 20 Mounting board 21 Storage recess 22 Wiring pattern 22a Chip connection part 22b Electrode part 31 Metal plate 32 Resin layer 33 Circuit pattern 33a Terminal part 38 Gap

Claims (2)

Comprising a wiring board having a circuit pattern through the resin layer formed on one surface of the metal plate, through the first junction that Do a bonding material terminal portion and the electrode portion of the surface-mounted LED in a circuit pattern a LED unit connected Te, wiring board, the terminal portion so as to alleviate the stress generated in the first junction due to the difference in thermal expansion coefficient between the surface-mounted LED and the wiring board The surface mount type LED has an LED chip mounted on one surface side of the mounting substrate and an electrode portion formed on the peripheral portion on the other surface of the mounting substrate. The one surface of the metal plate is exposed in the mounting area of the surface mount type LED, and the terminal part can be displaced so as to relieve the stress by protruding the terminal part in the circuit pattern to the inside of the mounting area. Become And a heat sink that is thermally coupled to the one surface of the metal plate via a second bonding portion made of a bonding material and a heat-dissipating pad disposed in the central portion of the other surface of the mounting substrate. The LED unit is characterized in that the projecting dimension of the projecting part is set so that the part protrudes and the surface of each circuit pattern and the surface of the projecting part are flush with each other . A wiring board having a circuit pattern formed on one surface of a metal plate via a resin layer is provided, and a terminal portion of the circuit pattern is connected to an electrode portion of a surface mount LED via a first bonding portion made of a bonding material. In the LED unit, the wiring board has a terminal portion that can be displaced so as to relieve stress generated in the first joint due to a difference in thermal expansion coefficient between the surface-mounted LED and the wiring board. are those that are made, the surface mount LED, together with the LED chip is mounted on one surface side of the mounting board, it and the electrode portion is formed on the peripheral portion of the other surface of the mounting substrate, wiring substrate, around the terminal portion and the end terminal part by forming a plurality of grooves at least reach the resin layer depth can be displaced so as to relax the stress, grooves, surface-mounted LED in the wiring substrate Outside the mounting area In the plane parallel to the one surface of the metal plate in the direction orthogonal to the direction connecting the pair of terminal portions of the surface-mounted LED, the one surface of the metal plate is formed on the surface of the mounting substrate. A projecting portion is provided with a heat-dissipating pad disposed in the center of the other surface through a second bonding portion made of a bonding material, and the surface of each circuit pattern and the protruding portion. L ED unit characterized in that the surface has been set the projecting dimension of the support block so as to be flush.

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