JP4649067B2 - Dicing jig - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a dicing jig transferred to a dicing unit together with a workpiece positioned and placed on a jig main body.
[0002]
[Prior art]
As an example of a semiconductor package, a case where a CSP (Chip / Size / Package) is manufactured will be described. A plurality of semiconductor chips are mounted in a matrix on a circuit board using a glass epoxy resin material, a polyimide resin material, or the like, and the semiconductor chip mounting surface side is resin-sealed to form a package portion. The circuit board on which the package portion is formed is placed on a dicing jig and supplied to the XY table of the dicing apparatus by the work supply apparatus.
[0003]
When the dicing jig transferred to the XY table is sucked and held together with the circuit board, the XY table is aligned with the cutting line of the dicing blade and then scanned in the X direction, for example. One side is cut (for example, when scanning the forward path), and the operation of moving one line in the Y direction is repeated every time the reciprocating scanning in the X direction ends. When the cutting of one side is completed, the XY table is rotated by 90 degrees, and the XY table is also reciprocated in the X direction, for example, on the adjacent other side, and moved by one line in the Y direction. Is repeatedly cut. As a result, the circuit board is cut into individual pieces in a matrix while being placed on the dicing jig.
[0004]
When cutting is completed, the circuit board is transferred to the spin cleaning unit together with the dicing jig. In the spin cleaning unit, the cleaning stage is rotationally driven in the sealed space at a high speed in a state where the dicing jig is held by suction on the cleaning stage together with the circuit board. At this time, cleaning is performed by spraying the cleaning liquid from the spray nozzle toward the circuit board. After cleaning, the substrate is dried by spraying air onto the circuit board while rotating the cleaning stage.
[0005]
When the circuit board is cut out from the supply magazine, the circuit board is transferred to a separately waiting dicing jig by a work transfer unit having suction pads and the like. Then, the circuit board is transferred onto the XY table of the dicing unit by the work supply device while being placed on the dicing jig. Hereinafter, a dicing jig on which the circuit board is placed and transferred to the dicing unit will be described.
[0006]
5 (a) and 5 (b), the workpiece supply apparatus 101 transfers the workpiece to the XY table with the circuit board 103 placed on the dicing jig 102. A holding arm 105 for holding the dicing jig 102 from both sides is slidably provided on the base portion 104. A holding portion 106 is provided at the distal end portion of the holding arm 105, and holding claws 108 that can be locked in locking holes 107 provided on both side surfaces of the dicing jig 102 body protrude from the holding portion 106. Has been. The holding arm 105 is connected to the cylinder rod 110 of the cylinder portion 109 provided on the base portion 104. The holding arm 105 is provided so as to be movable along the slide rail 111 by operating the cylinder portion 109. The circuit board 103 is placed on the dicing jig 102 with the package portion 103a facing downward. For example, as shown in FIG. 6, the circuit board 103 is positioned by inserting a pin 112 erected on the mounting surface of the jig body into a hole drilled in the board portion 103 b. Then, the holding arm 105 is slid so that the dicing jig 102 is held by the holding unit 106 and transferred to the XY table of the dicing unit. When the dicing jig 102 is transferred to the XY table, the circuit board 103 is sucked and held through a suction hole (not shown) provided in the dicing jig 102.
[0007]
[Problems to be solved by the invention]
In the dicing jig 102 shown in FIGS. 5A and 5B, the circuit board 103 is positioned on the dicing jig 102 with pins 112 as shown in FIG. When the vibration of the device applied inside or the warp of the package portion 103a occurs, the substrate portion 103b may be detached from the pin 112 and may be displaced.
Further, if the circuit board 103 is cut while being warped, even if suction is performed through the suction holes of the dicing jig 102, the suction fixation is likely to be insufficient. Further, if the circuit board 103 is cut with warping, it does not hit the dicing blade at an appropriate angle, so that the cutting line may be shifted and a defective product may be generated.
[0008]
An object of the present invention is to provide a dicing jig that solves the above-described problems of the prior art and that can be placed without causing the workpiece to warp and to be displaced until the dicing operation is completed with the workpiece placed. It is in.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, the present invention has the following configuration.
That is, a dicing jig transferred to a dicing unit together with a workpiece placed on the jig body, and placed on the placement surface of the jig body with the resin sealing portion down and the circuit board facing up. A workpiece pressing member that exposes the circuit board from above the workpiece and exposes the circuit board to be positioned on the jig body and presses the workpiece, and the workpiece pressing member has comb teeth formed facing the opening. And a relief hole of a dicing blade formed around the circuit board including between the pressing parts, and the tip of the work pressing part is a board part outside the resin sealing part. It is characterized by holding down .
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of a dicing jig according to the present invention will be described in detail with reference to the accompanying drawings.
1A and 1B are a top view and a front view of a dicing jig on which a circuit board is placed, FIG. 2 is an explanatory view showing a positional relationship between the circuit board, a pressing member, and the dicing jig, and FIG. FIG. 4 is an explanatory diagram of the dicing operation, and FIG. 4 is an explanatory plan view showing the entire configuration of the dicing apparatus.
[0011]
First, the overall configuration of the dicing apparatus will be described with reference to FIG.
Reference numeral 1 denotes a workpiece supply unit, which can supply one by one from a supply magazine 3 in which a plurality of circuit boards 2 for CSP, which is an example of workpieces, are stored. The circuit board 2 has semiconductor chips mounted on one side in a matrix and is collectively resin-molded, and is sent from the supply magazine 3 to the cutout section 4 by a pusher or the like. At this time, the type of the circuit board 2 is discriminated by an imaging device or the like.
The circuit board 2 sent out to the cutout unit 4 is sucked and held by a workpiece transport unit X1 as a workpiece supply device, and placed on a dicing jig 5 waiting at a workpiece supply position A with the package unit facing down. It is held together with the dicing jig 5 and transferred to the dicing position B.
[0012]
Reference numeral 6 denotes a dicing unit. The circuit board 2 is transferred to the dicing table 7 together with the dicing jig 5. The dicing table 7 is provided so as to be rotatable in the X and Y directions, and holds the circuit board 2 together with the dicing jig 5 by suction. When the dicing table 7 is aligned with the cutting line of the dicing blade 8 and scanned in the X direction (for example, on the left side in FIG. 4), one side is cut and returned again in the X direction (to the right side in FIG. 4). , And cut in the same way after moving one line in the Y direction. When the cutting of one side is completed, the dicing table 7 is rotated 90 degrees, and the dicing table 7 is also reciprocated in the X direction on the adjacent other side. Is done. Thereby, the circuit board 2 is cut into individual pieces in a matrix form from the board side while being mounted on the dicing jig 5. By cutting from the substrate side, cutting is performed so that the substrate side that is the mounting surface does not become a burr surface.
[0013]
Reference numeral 9 denotes a spin cleaning section. The diced circuit board 2 is transferred from the dicing position B to the cleaning position C by the work transport section Y1 while being placed on the dicing table 7 together with the dicing jig 5, and is diced by the cleaning stage 10. The table 7 is sucked and held on the cleaning stage 10 to perform spin cleaning on the substrate side which is a cut surface. In the spin cleaning unit 9, cleaning is performed by spraying a cleaning liquid toward the circuit board 2 from a spray nozzle (not shown) in which the cleaning stage 10 is rotationally driven in a sealed space at a high speed. After the cleaning is completed, air is sprayed onto the circuit board 2 while the cleaning stage 10 is rotated, and the substrate is dried.
[0014]
Reference numeral 11 denotes a work transfer device. A work (circuit board 2) that has been diced and spin cleaned is transferred from the cleaning position C to the pickup position D together with the dicing jig 5, and taken out to the pickup stage 12. Then, only the circuit board 2 is taken out from the dicing jig 5 by the work transfer unit X2 and transferred to the post-processing step. In this embodiment, the post-processing process includes a work cleaning / drying process, a work inspection process, and the like.
[0015]
Reference numeral 13 denotes a workpiece cleaning / drying unit. The circuit substrate 2 diced from the pickup stage 12 and spin-cleaned on one surface is collectively held and conveyed by the workpiece conveyance unit X2, and the other surface is washed and dried. The workpiece cleaning / drying unit 13 performs wet cleaning on the side of the package portion of the circuit board 2 that has not been subjected to spin cleaning with the cleaning roller 14, performs drying cleaning with the drying roller 15, and then removes cutting waste with the air blowing unit 16. Is performed continuously.
[0016]
Reference numeral 17 denotes a work placement unit, on which the circuit board 2 after washing and drying is placed on an XY-θ table 18 that can be rotated and slid, and the circuit board 2 can be supplied with the orientation thereof aligned. The XY-θ table 18 is provided so as to be rotatable in the θ direction and movable along a movement guide 19 provided in the XY direction. As shown in FIG. 4, the XY-θ table 18 is rotated 90 degrees in the clockwise direction and changes its direction when the circuit board 2 is transferred from the work transport unit X2. In the vicinity of the XY-θ table 18, a reversing pickup 20 is provided so as to be able to move up and down, rotate, and slide. When the circuit board 2 is sucked and held on the XY-θ table 18 and rotated 90 degrees, the reversing pickup 20 moves up and down and sucks and holds the separated chips 2a. Then, the reversing pickup 20 rotates (reverses) 180 degrees and transfers the chip 2a to the inspection table 22 shown in FIG.
[0017]
Reference numeral 21 denotes a work inspection unit, and inspection including image processing inspection and continuity inspection is performed on the chip transferred from the work mounting unit 17 to the inspection table 22. Workpiece holding portions (chip mounting recesses) 23 are provided at a plurality of locations on the peripheral edge of the inspection table 22, and the chips 2 a transferred from the reversing pickup 20 are sucked and held on the work holding portion 23. Yes. Specifically, the inspection table 22 is provided at four locations that are swung by 90 degrees on the peripheral edge. The chip 2a sucked and held by each work holding unit 23 is sent to the inspection stage as the inspection table 22 rotates by 90 degrees.
[0018]
Reference numeral 24 denotes a work pick-up unit, and pick-up heads 25 capable of holding a work (chip 2a) at intervals corresponding to the work holding unit 23 provided on the inspection table 22 of the work inspection unit 21 are provided at a plurality of locations. Specifically, the work pickup unit 24 is provided with four positions at which the pickup head 25 is swung by 90 degrees. The inspection table 19 and the work pickup unit 24 are rotatably provided in synchronization. The work holding unit 23 and the pickup head 25 rotate so as to overlap at least at two places.
[0019]
Reference numeral 26 denotes a work storage unit, and the chip 2a after the inspection carried by the inspection table 22 is held by the storage pickup 39 and divided into a non-defective product storage tray 26a and a defective product storage tray 26b. Separately stored. When each storage tray is full, an empty tray 26c is supplied.
[0020]
The dicing jig 5 on which the circuit board 2 can be mounted is disposed at any one of the workpiece supply position A, the dicing position B, the cleaning position C, and the pickup position D, and corresponds to the plurality of dicing jigs 5. The circuit board 2 is repeatedly conveyed by circulating the dicing jig 5 by any one of the workpiece conveying sections X1, Y1, X3, and Y2.
[0021]
In FIG. 4, the dicing jig 5 on which the circuit board 2 is mounted is transported from the work supply position A to the dicing position B by using the upper rail by the work transport section X1. Further, the dicing jig 5 on which the cut circuit board 2 is mounted is transported from the dicing position B to the cleaning position C by the work transport unit Y1 using the lower rail. The dicing jig 5 on which the spin-cleaned circuit board 2 is mounted is transported from the cleaning position C to the pickup position D by the work transport unit X3 using the upper rail. When the circuit board 2 is sucked and held by the work transport unit X2, the dicing jig 5 is transported from the pickup position D to the work supply position A by the work transport unit Y2 using the lower rail.
[0022]
Here, the configuration of the dicing jig will be described with reference to FIGS. The dicing jig 5 is transported to the dicing unit 6 while being held by the work transport unit X1 while the work (circuit board 2) is placed thereon. As shown in FIG. 2, the circuit board 2 is placed on the jig body 5a of the dicing jig 5, and the work pressing member 27 is placed thereon to position the circuit board 2 on the jig body 5a. It is supposed to hold down.
[0023]
1 (a) and 1 (b), positioning pins 28, which are examples of positioning portions, are projected from four places on the mounting surface 5b of the jig body 5a. In this embodiment, the positioning pins 28 are provided at positions corresponding to the corner portions of the work pressing member 27, and chamfered contact portions 29 are formed at the corresponding corner portions of the circuit board 2. A positioning hole (concave portion) may be provided instead of the positioning pin 28. In this case, a pin (convex portion) may be provided at a corresponding position of the work pressing member 27.
The work pressing member 27 is positioned by bringing the contact portion 29 into contact with the positioning pin 28 and mounted on the jig main body 5a, and the circuit board 2 is exposed from the opening 30 and pressed against the jig main body 5a. is there. On the work pressing member 27, a pressing portion 31 capable of pressing a part of the circuit board 2 is formed facing the opening 30. The work pressing member 27 is made of a relatively hard resin plate material such as a metal plate material such as a stainless steel material or an aluminum material, or a ceramic material.
[0024]
A comb-like pressing portion 31 is formed on the work pressing member 27 so as to face the opening 30, and a clearance hole 32 for a dicing blade is formed between the pressing portions 31. The escape holes 32 are formed at equal pitches parallel to the short direction of the circuit board 2, and the escape holes 33 are formed on both sides of the circuit board 2 in the longitudinal direction. The opening 30 and the escape holes 32 and 33 provide an entry space for the dicing blade 8 for dicing the circuit board 2.
The tip of the pressing portion 31 formed facing the opening 30 presses the substrate portion 2 c outside the resin sealing portion (package portion) 2 b of the circuit board 2.
[0025]
As shown in FIG. 3, the circuit board 2 is placed on the jig body 5 a with the package portion 2 b side down, and the workpiece pressing member 27 is positioned along the positioning pins 28 and placed thereon. Then, the substrate portion 2 c is transferred to the dicing portion 6 while being pressed by the pressing portion 31. Then, the dicing table 7 is aligned with the cutting line of the dicing blade 8, and one side is cut when scanning in the X direction (for example, on the left side in FIG. 3), and returns to the X direction (to the right side in FIG. 3) again. The cutting operation is repeatedly performed by moving the Y direction by one line. Then, the dicing table 7 is rotated by 90 degrees, and the cutting operation is repeated in the same manner on the Y direction side, and the whole is cut into a matrix.
[0026]
According to the above configuration, the circuit board 2 is transferred to the dicing unit 6 while being held down by the jig body 5a by the work holding member 27, so that the circuit board 2 is not misaligned during the transfer. Further, since the circuit board 2 is held by the work pressing member 27 until the dicing operation is completed, the circuit board 2 is effectively prevented from warping and the circuit board 2 is brought into close contact with the dicing jig 5 on the dicing table 7. Can be adsorbed. Therefore, since the dicing blade 8 contacts the circuit board 2 at a constant angle, the cutting line is not shifted, and cutting defects can be reduced and the yield can be improved.
Further, comb-shaped escape holes 32 and 33 are formed in the X-Y direction in the opening 30 of the work pressing member 27, and the tip of the pressing portion 31 is formed on the substrate portion 2c outside the package portion 2b. Since the pressing is performed, interference between the dicing blade 8 and the pressing member 27 can be prevented, and processing reliability can be improved.
[0027]
As described above, various preferred embodiments of the present invention have been described. However, the present invention is not limited to the above-described embodiments, and the type of work is not limited to an epoxy resin-based resin substrate, but is suitable for a tape substrate or the like. Of course, the material of the work pressing member 27 is not limited to the metal plate material, and other members may be used. Of course, many modifications can be made without departing from the spirit of the invention.
[0028]
【The invention's effect】
When the dicing jig according to the present invention is used, the workpiece is transferred to the dicing portion while being pressed by the jig main body by the workpiece pressing member, so that the workpiece is not displaced during the transfer. In addition, since the workpiece is pressed by the workpiece pressing member until the dicing operation is completed, the workpiece can be effectively prevented from warping, and the workpiece can be brought into close contact with the dicing jig on the dicing table. Therefore, since the dicing blade comes into contact with the workpiece at a constant angle, the cutting line is not shifted, and cutting defects can be reduced and the yield can be improved.
In addition, a relief hole is formed in the X-Y direction at the opening of the work pressing member, and the tip of the pressing part presses the substrate part outside the package part. Interference between members can be prevented, and processing reliability can be improved.
[Brief description of the drawings]
FIG. 1 is a top view and a front view of a dicing jig on which a circuit board is placed.
FIG. 2 is an explanatory diagram showing a positional relationship among a circuit board, a pressing member, and a dicing jig.
FIG. 3 is an explanatory diagram of a dicing operation.
FIG. 4 is an explanatory plan view showing the entire configuration of the dicing apparatus.
FIGS. 5A and 5B are a front view and a top view of a workpiece supply apparatus for transferring a conventional dicing jig. FIGS.
FIG. 6 is an explanatory diagram showing warpage of a circuit board.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Work supply part 2 Circuit board 2a Chip 2b Package part 2c Substrate part 3 Supply magazine 4 Cutting part 5 Dicing jig 5a Jig body 5b Placement surface 6 Dicing part 7 Dicing table 8 Dicing blade 9 Spin cleaning part 10 Cleaning stage 11 Work transfer device 12 Pickup stage 13 Work washing / drying unit 14 Washing roller 15 Drying roller 16 Air blowing unit 17 Work placement unit 18 XY-θ table 19 Moving guide 20 Reverse pick-up 21 Work inspection unit 22 Inspection table 23 Work holding unit 24 Work pickup unit 25 Pickup head 26 Work storage unit 26a Non-defective product storage tray 26b Defective product storage tray 26c Empty tray 27 Work holding member 28 Positioning pin 29 Contact portion 30 Opening portion 31 Pressing portions 32, 33 Escape hole 9 storage for pickup

Claims (1)

A dicing jig transferred to a dicing unit together with a workpiece placed on the jig body ,
The workpiece is positioned on the jig body by exposing the circuit board through an opening from above the work placed on the mounting surface of the jig body with the resin sealing portion down and the circuit board facing up. It has a work holding member to hold down,
The workpiece pressing member is formed with a comb-shaped pressing portion formed facing the opening, and a dicing blade clearance hole formed around the circuit board including the space between the pressing portions. The dicing jig is characterized in that the tip of the work pressing part presses the substrate part outside the resin sealing part .

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