JP4590932B2 - Method for manufacturing electroluminescence device - Google Patents

Description

  The present invention relates to an electroluminescence (hereinafter abbreviated as EL) device, a manufacturing method thereof, and an electronic apparatus, and more particularly to a sealing structure of an EL device.

Conventionally, electro-optical devices such as organic EL display devices have a structure in which an anode, a hole injection layer, a light-emitting layer made of an electro-optical material such as an EL material, and a cathode are stacked on a substrate. Yes. The organic EL element constituting such an organic EL display device has a lifetime as a light-emitting element due to deterioration of the electro-optical material forming the light-emitting layer due to oxygen, moisture, etc., or decrease in conductivity due to oxygen, moisture, etc. of the cathode. There was a problem of shortening.
As a technique for solving such a problem, conventionally, for example, an organic EL element is formed on a substrate, and another substrate is bonded via a resin or the like so as to cover the organic EL element on the substrate. The structure which seals is known (for example, refer patent document 1). In Patent Document 1, a substrate on which an organic EL element is formed and a color conversion filter are bonded together while forming a filler layer therebetween, and finally the peripheral portion is sealed with a sealing resin (adhesive). It has stopped.
JP 2004-31102 A

  However, when the organic EL element substrate and the sealing substrate are bonded together using a resin or the like as in the technique described in Patent Document 1, the resin applied so as to cover the element at the time of bonding is used for sealing. It flows out to the outside of the substrate and protrudes. Then, for example, the resin covers the external connection terminals on the peripheral edge of the organic EL element substrate, and there arises a problem that mounting failure of the external substrate connected later on the external connection terminals occurs. In addition, when the sealing substrate is bonded to the organic EL element substrate, it is necessary to precisely control the gap (interval) between the organic EL element substrate and the sealing substrate so that the entire panel thickness is constant. is there. However, since the resin flows out of the substrate in the above-described conventional technology, especially when the organic EL element substrate becomes large, it is difficult to control the gap between the substrates, and the substrate is in a state of being bent or stressed. There were problems such as being fixed.

  The present invention has been made to solve the above-described problem, and in an EL device having a sealing structure in which a sealing member is solidly bonded with a resin, the protrusion of the resin can be reliably suppressed and the element It is an object of the present invention to provide an EL device that can easily control a gap between a substrate and a sealing member and that is less likely to be bent, stressed, and the like, a manufacturing method thereof, and an electronic apparatus using the EL device.

  In order to achieve the above object, a first method for manufacturing an EL device according to the present invention includes an element substrate provided with an EL element, and an adhesive layer on a surface of the element substrate on which the EL element is provided. A sealing member provided between the element substrate and the sealing member in a state in which the element substrate and the sealing member are arranged to face each other. A step of curing the first adhesive disposed in the portion, and after the first adhesive is cured, disposed inside the first adhesive on the opposing surface of the element substrate and the sealing member And a step of curing the second adhesive.

  In the first EL device manufacturing method of the present invention, when the element substrate and the sealing member are arranged to face each other in plan view, the center portion and the peripheral portion are sealed twice with an adhesive. Based on. And as an order of sealing, after carrying out the process of first curing the first adhesive disposed on the peripheral portion of the opposing surface of the element substrate and the sealing member, after the first adhesive is cured, A step of curing the second adhesive disposed in the central portion (region inside the first adhesive) on the opposing surface of the element substrate and the sealing member is performed next.

  In this method, the first adhesive at the peripheral edge first hardens and plays the role of a bank, and the second adhesive that exists in the state having fluidity before hardening is directed outward. Stop spilling out. By this action, it is possible to prevent the adhesive from protruding to the outside of the sealing member and cover, for example, the external connection terminal, thereby causing a mounting failure. Further, the cured first adhesive itself serves as a gap material, and can hold the gap between the element substrate and the sealing member. In addition, for example, when the entire resin including the central portion is cured at once, curing shrinkage occurs, and the substrate is fixed in a bent state, but in this method, the second adhesive in the central portion is cured later, The bending and stress of the element substrate and the sealing member are naturally relieved during the curing time of the second adhesive.

For example, as one of the methods of first curing the first adhesive at the peripheral portion and subsequently curing the second adhesive inside the first adhesive, the first adhesive is composed of an ultraviolet curable resin, What is necessary is just to take the method of comprising a 2nd adhesive agent with a thermosetting resin and irradiating an ultraviolet-ray in the process of hardening a 1st adhesive agent.
When comparing the ultraviolet curable resin and the thermosetting resin, the ultraviolet curable resin is superior in quick action, and therefore the first adhesive that is cured first without being wet spread is UV curable. It is desirable that the second adhesive, which is made of resin and requires a time sufficient to relieve the bending and stress of the element substrate and the sealing member, is made of a thermosetting resin.

  Further, when the first and second adhesives are made of different types of resins, for example, the first adhesive at the peripheral edge is particularly excellent in moisture resistance, or in the case of a top emission type EL device. The second adhesive in the central part is transparent, while the first adhesive in the peripheral part can be colored, and so on, with the first and second adhesives as necessary. You can use the functions properly.

Further, as another method of first curing the peripheral first adhesive and curing the second inner adhesive later, the first adhesive and the second adhesive are both ultraviolet curable resins. In the step of curing the first adhesive, a method of irradiating ultraviolet rays in a state where the region where the second adhesive is disposed is shielded from light may be adopted.
According to this method, although a mask for locally shielding the region where the second adhesive is disposed is necessary, it is possible to use an ultraviolet curable resin for both the first adhesive and the second adhesive. And only one type of adhesive is required.

  The second EL device manufacturing method of the present invention includes an element substrate provided with an EL element, a sealing member provided via an adhesive layer on the surface of the element substrate on which the EL element is provided, and A first adhesive is disposed on a peripheral portion of a facing surface between the element substrate and the sealing member in a state in which the element substrate and the sealing member are disposed to face each other. At the same time, a step of disposing a second adhesive having a slower curing speed than the first adhesive inside the position of the first adhesive, and the first adhesive and the second adhesive And a step of curing the agent.

  Similarly to the first manufacturing method, the second EL device manufacturing method of the present invention is first cured with the first adhesive disposed on the periphery of the element substrate and the sealing member, and the central portion (first bonding). The second adhesive disposed in the region on the inner side of the adhesive is cured later. However, in the second EL device manufacturing method of the present invention, a first adhesive having a relatively fast curing speed is used, and a second adhesive having a relatively slow curing speed is used. Is limited. Therefore, in the case of this method, for example, an ultraviolet curable resin or a thermosetting resin is used for both the first adhesive and the second adhesive, and the first adhesive and the second adhesive are simultaneously used (ultraviolet curing). Even if the resin is cured (without using a mask), the outer first adhesive inevitably cures first.

  The following operation is the same as that of the first manufacturing method, and the first adhesive that has been hardened previously blocks the second adhesive from flowing outward, so that mounting failure occurs due to the protrusion of the adhesive. Can be prevented. Furthermore, the cured first adhesive serves as a gap material, and can hold the gap between the element substrate and the sealing member. In addition, since the inner second adhesive is cured later, the deflection and stress of the element substrate and the sealing member are naturally relieved during the curing time of the second adhesive.

In the first and second EL device manufacturing methods of the present invention, the first adhesive is disposed so as to substantially surround the display region along the peripheral edge of the opposing surface between the element substrate and the sealing member. Is desirable.
In the present invention, the formation position of the first adhesive is not particularly limited as long as it is a peripheral portion of the opposing surface between the element substrate and the sealing member, but the peripheral edge of the opposing surface between the element substrate and the sealing member. When arranged so as to substantially surround the display area along the portion, the effect of blocking the flow of the second adhesive and the effect of maintaining the gap between the element substrate and the sealing member are sufficiently exhibited over the entire substrate. . As a result, the protrusion of the second adhesive can be prevented more reliably, and the gap between the element substrate and the sealing member becomes more uniform over the entire substrate.

In this configuration, in the state where the first adhesive is further provided with a communication hole for communicating the space in which the second adhesive is accommodated and the space outside the first adhesive, the second adhesive is used. It is desirable to cure.
According to this configuration, the first adhesive is not completely closed in an annular shape, and the communication hole for providing communication between the accommodation space for the second adhesive and the external space is provided. When curing the adhesive, for example, if the amount of the second adhesive is larger than the actual volume of the accommodation space, the excess flows out from the communication hole, so that the central portion of the substrate is convex. Generation | occurrence | production of the bending | flexion of the board | substrates, such as swelling, can be prevented. In this case, the second adhesive protrudes to the outside of the first adhesive. However, since this protrusion is only from the portion of the communication hole, there is a particular problem if the communication hole is provided at a position where there is no problem. Does not occur.

Further, in the configuration in which the communication holes are provided, it is also desirable that the element substrate and the sealing member are disposed in a reduced-pressure atmosphere before the second adhesive is cured.
For example, when the second adhesive is applied, bubbles may be mixed in the adhesive. Even in such a case, if the element substrate and the sealing member are arranged in a reduced-pressure atmosphere before the second adhesive is cured, bubbles can be extracted from the communication hole. In particular, since the second adhesive is located in the display area at the center of the substrate, the display quality can be improved by removing such bubbles.

  A third EL device manufacturing method of the present invention includes an element substrate on which an EL element is provided, a sealing member provided on the surface of the element substrate on which the EL element is provided via an adhesive layer, The display device is substantially surrounded by a peripheral portion of a facing surface between the element substrate and the sealing member in a state where the element substrate and the sealing member are arranged to face each other. And curing the first adhesive disposed so as to provide a communication hole that communicates the space in which the second adhesive is accommodated and the space outside the first adhesive; A step of injecting a second adhesive from the communication hole into the gap between the element substrate and the sealing member and a step of curing the second adhesive after the first adhesive is cured; It is characterized by that.

  In the first and second EL device manufacturing methods of the present invention, after the first and second adhesives are disposed between the element substrate and the sealing member, the first adhesive is first cured. On the other hand, the third EL device manufacturing method of the present invention does not arrange the second adhesive between the element substrate and the sealing member in the step of curing the first adhesive, After the first adhesive is cured, the second adhesive is injected into the space surrounded by the element substrate, the sealing member, and the first adhesive through the communication hole. In this method, for example, the second adhesive can be injected by a method similar to the liquid crystal vacuum injection method in the manufacturing process of the liquid crystal panel, and is surrounded by the element substrate, the sealing member, and the first adhesive. A predetermined amount of the second adhesive can be accommodated in the space.

  Unlike the first and second manufacturing methods, the second adhesive is not present on the substrate when the first adhesive is cured, so that the mounting failure due to the protruding adhesive is prevented. Can do. Furthermore, the cured first adhesive serves as a gap material, and can hold the gap between the element substrate and the sealing member. In addition, since the second adhesive is cured later, the deflection and stress of the element substrate and the sealing member are naturally relieved during the curing time of the second adhesive.

In the first to third EL device manufacturing methods of the present invention, a gap material that holds the element substrate and the sealing member at a predetermined interval may be included in the first adhesive.
For example, when it is difficult to cause the first adhesive itself to function as a gap material due to only the viscosity of the first adhesive, if the gap material is included in the first adhesive, the element substrate and the sealing member Can be reliably held at a predetermined interval. In the case of the present invention, the gap between the element substrate and the sealing member can be reliably maintained only by including the gap material in the first adhesive, and the gap material needs to be included in the second adhesive at the center. There is no adverse effect on the display of the gap material.

An EL device according to the present invention is manufactured by the above-described method for manufacturing an EL device according to the present invention.
An EL device according to the present invention includes an element substrate provided with an EL element, and a sealing member provided on a surface of the element substrate on the side where the EL element is provided via an adhesive layer. In the apparatus, a first adhesive made of an ultraviolet curable resin is disposed so as to substantially surround a display region along a peripheral portion of a facing surface between the element substrate and the sealing member, and the first A second adhesive made of a thermosetting resin is arranged inside the position of the adhesive.
According to another EL device of the present invention, a first adhesive is disposed so as to substantially surround a display region along a peripheral portion of a facing surface between the element substrate and the sealing member. The second adhesive having a slower curing speed than that of the first adhesive is disposed inside the position of the adhesive.

  According to the EL device of the present invention, as described above, since the first adhesive blocks the flow of the second adhesive, it is possible to prevent the occurrence of mounting defects due to the protruding adhesive. Further, the first adhesive serves as a gap material, and can hold the gap between the element substrate and the sealing member. Further, the bending and stress of the element substrate and the sealing member are naturally relieved during the curing time of the second adhesive.

An electronic apparatus according to the present invention includes the above-described EL device according to the present invention.
According to this configuration, it is possible to realize an electronic device including an EL display unit that is excellent in reliability and display quality and can be enlarged.

[First Embodiment]
Hereinafter, an organic EL device and a manufacturing method thereof according to a first embodiment of the present invention will be described with reference to FIGS. The organic EL device of the present embodiment has a sealing structure in which the sealing substrate is solidly bonded using an adhesive, and can be of any type of top emission type or bottom emission type. good. 1 is an equivalent circuit diagram of the organic EL device of the present embodiment, FIG. 2 is a plan view of the organic EL device, FIG. 3 is a cross-sectional view taken along the line AA ′ of FIG. 2, and FIG. It is a figure which shows 1 process of the manufacturing process of an apparatus. In the following drawings, the scale of each layer and each member is shown to be different from the actual scale so that each layer and each member has a size that can be recognized on the drawings.

  As shown in FIG. 1, the organic EL device 1 of the present embodiment includes a plurality of scanning lines 101, a plurality of signal lines 102 extending in a direction intersecting the scanning lines 101, and extending in parallel with the signal lines 102. A plurality of power supply lines 103 are wired. An area partitioned by the scanning line 101 and the signal line 102 is configured as a pixel area. Connected to the signal line 102 is a data side driving circuit 104 including a shift register, a level shifter, a video line, and an analog switch. Further, a scanning side driving circuit 105 including a shift register and a level shifter is connected to the scanning line 101.

  In each pixel region, a switching thin film transistor (hereinafter abbreviated as TFT) 112 to which a scanning signal is supplied to the gate electrode via the scanning line 101 and a signal line 102 via the switching TFT 112 are provided. A storage capacitor cap that holds a pixel signal shared from the storage capacitor cap, a driving TFT 123 to which a pixel signal held by the storage capacitor cap is supplied to the gate electrode, and the power supply line 103 via the driving TFT 123. A pixel electrode (anode) 111 into which a drive current flows from the power supply line 103 when connected, and a functional layer 110 sandwiched between the pixel electrode 111 and the counter electrode (cathode) 12 are provided. The pixel electrode 111, the counter electrode 12, and the functional layer 110 constitute an organic EL element A, and the organic EL device 1 includes a plurality of organic EL elements A in a matrix.

  According to the above configuration, when the scanning line 101 is driven and the switching TFT 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor cap, and the driving TFT 123 is changed according to the state of the holding capacitor cap. ON / OFF state is determined. Then, a current flows from the power supply line 103 to the pixel electrode 111 through the channel of the driving TFT 123, and further a current flows to the counter electrode 12 through the functional layer 110. The functional layer 110 emits light according to the amount of current flowing through it.

  In the organic EL device 1 of the present embodiment, as shown in FIG. 2, four element substrates 20 on which a plurality of organic EL elements A are formed are arranged in two rows and two columns vertically and horizontally, and these four element substrates 20 are arranged. Is fixed on another support substrate 21. As described above, a method of forming a larger substrate by combining a plurality of substrates is called “tiling”, and is suitable for manufacturing an organic EL panel used for applications such as a large television. Each element substrate 20 is provided with a display area in which a plurality of organic EL elements A are arranged in a matrix. In this embodiment, the element substrates 20 are arranged in two rows and two columns, so two adjacent sides (for example, In the upper right element substrate 20 of FIG. 2, the left side and the lower side) are sides connected to other element substrates 20. Then, driving circuits such as a data side driving circuit and a scanning side driving circuit and various wirings (both not shown) are provided along other sides (for example, the right side and the upper side in the upper right element substrate 20 in FIG. 2). A terminal portion 23 in which a plurality of mounting connection terminals 22 are arranged at a predetermined pitch is provided. The terminal portion 23 is connected to a driving flexible board on which electronic components such as a driving IC are mounted in a later process.

  A sealing substrate 24 (sealing member) is provided on the four element substrates 20 at a predetermined interval, and a gap between the sealing substrate 24 and the element substrate 20 is filled with an adhesive. The sealing substrate 24 constitutes a sealing structure that seals the organic EL element A together with an adhesive, and preferably has a function such as pressure resistance, abrasion resistance, external light antireflection, gas barrier properties, and the like. Good. Specifically, a glass substrate, a plastic film having an outermost surface coated with a diamond-like carbon layer, a silicon oxide layer, a titanium oxide layer, or the like is preferably used. In the organic EL device 1 of the present embodiment, when the top emission type is used, it is necessary to make the sealing substrate 24 have a light-transmitting property. Absent. In addition, the size of the sealing substrate 24 is slightly smaller than the entire four element substrates, and the terminal portions 23 on each element substrate 20 are located outside the sealing substrate 24.

  In the present embodiment, the adhesive has a double structure at the peripheral portion and the central portion of the sealing substrate 24, and the peripheral portion of the sealing substrate 24 (for example, within a range of several mm to 1 cm from the edge). A first adhesive 31 is filled, and a region inside the first adhesive 31 is filled with a second adhesive 32. The first adhesive 31 is made of a resin material such as an acrylic, epoxy, urethane, or polyolefin having ultraviolet curing properties, while the second adhesive 32 is an acrylic having thermosetting properties, It is composed of resin materials such as epoxy, urethane and polyolefin. For example, an adhesive of different resin material may be used, such as an acrylic adhesive for the first adhesive 31 and an epoxy adhesive for the second adhesive 32, but the various properties of the resin are similar. It is desirable to use one.

  In addition, during the manufacturing process, the first adhesive 31 is provided with a communication hole 33 that allows communication between the inner space surrounded by the first adhesive 31 and the outer space. In the case of the present embodiment, two communication holes 33 are formed in each element substrate 20, and any of the communication holes 33 is formed at a position that does not reach the terminal portion 23. In the completed state, the communication hole 33 is sealed with the first adhesive 31 or the second adhesive 32.

  As for the cross-sectional structure, as shown in FIG. 3, a driving TFT 123 is formed on each element substrate 20, and a pixel electrode (anode) 111 electrically connected to the driving TFT 123 is formed. A partition wall structure 35 made of silicon oxide, acrylic resin, or the like is provided so as to partition the pixel electrodes 111, and the organic EL element A is formed in a region surrounded by the partition wall structure 35. Specifically, the hole injection / transport layer 36, the organic light emitting layer 37, and the electron injection / transport layer 38 are sequentially stacked on each pixel electrode 111 to form the functional layer 110, and a plurality of organic EL elements A A counter electrode (cathode) 12 is formed over the entire area. The counter electrode 12 is formed to extend to the outside of the outermost organic EL element A, the first adhesive 31 is formed on the outside of the counter electrode 12, and the element substrate 20, the sealing substrate 24, A space surrounded by the first adhesive 31 is filled with the second adhesive 32. Further, the terminal portion 23 is located outside the first adhesive 31.

  More specifically, the pixel electrode 111 does not need to be a transparent material as long as it is a top emission type, and an arbitrary conductive material such as a metal material can be used. Needless to say, a transparent conductive material such as indium tin oxide (hereinafter abbreviated as ITO) may be used. If it is a bottom emission type, it is essential to use a transparent conductive material such as ITO. For the hole injection / transport layer 36, for example, a polythiophene derivative, a polypyrrole derivative, or a doped body thereof is used. Specifically, 3,4-polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) or the like is used.

  As a material for forming the organic light emitting layer 37, a known light emitting material capable of emitting fluorescence or phosphorescence can be used. Specifically, (poly) fluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), polyvinyl carbazole (PVK), polythiophene derivative, polymethyl Polysilanes such as phenylsilane (PMPS) are preferably used. In addition, these polymer materials include polymer materials such as perylene dyes, coumarin dyes, rhodamine dyes, rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, and quinacridone. It can also be used by doping a low molecular weight material such as. In addition, it replaces with the polymeric material mentioned above, a conventionally well-known low molecular material can also be used. For the electron injection / transport layer 38, a metal or a metal compound containing calcium, magnesium, lithium, sodium, strontium, barium, cesium as a main component is used.

  Hereinafter, a method for manufacturing the organic EL device 1 having the above configuration will be described. In addition, about the method of forming TFT, various wiring, and an organic EL element in each element board | substrate 20, since a conventionally well-known method can be used, description is abbreviate | omitted. In the present embodiment, as described above, the partition wall structure 35 for partitioning each organic EL element A is formed on the element substrate 20, and a function made of a polymer organic material by a droplet discharge method such as an inkjet method. It is assumed that the layer 110 is formed.

  After preparing four element substrates 20 provided with TFTs, various wirings, and organic EL elements, these four element substrates 20 are bonded to a predetermined position on the support substrate 21 with an adhesive to obtain a large substrate. Thereafter, the liquid second adhesive 32 is applied to the central portion of the entire four element substrates 20, and the liquid first adhesive 31 is applied to the peripheral portion. The order of application of the first and second adhesives 31 and 32 may be either first or second. In addition, it is preferable to add a silane coupling agent, alkoxysilane, or the like to these adhesives 31 and 32 because adhesion between the adhesives 31 and 32 and the element substrate 20 is further improved. For the application of the first and second adhesives 31 and 32, for example, a coating device such as a dispenser used for drawing a sealing material of a liquid crystal display device can be used. As described above, in particular, the first adhesive 31 applied to the peripheral portion is drawn so as to provide the communication holes 33 at a plurality of locations as shown in FIG. Furthermore, as the first adhesive 31, it is preferable to select an adhesive having a certain degree of viscosity so that the adhesive does not flow largely before the ultraviolet ray is irradiated in the next step.

  Next, as shown in FIG. 4, after the sealing substrate 24 is superimposed on the element substrate 20 to which the first and second adhesives 31 and 32 are applied, the entire surface is irradiated with ultraviolet rays (UV). At this time, since at least one of the element substrate 20 and the support substrate 21 or the sealing substrate 24 is light transmissive according to any of the top emission type and the bottom emission type, the light transmissive property is obtained. Irradiation with ultraviolet rays may be performed from the substrate side. In the present embodiment, since the first adhesive 31 is an ultraviolet curable resin and the second adhesive 32 is a thermosetting resin, only the first adhesive can be cured in this step.

  Next, after the 1st adhesive agent 31 hardens | cures, the 2nd adhesive agent 32 is hardened by heating the whole. And after the 2nd adhesive agent 32 hardens | cures, either the 1st adhesive agent 31 or the 2nd adhesive agent 32 is filled in the part of the communicating hole 33 of the 1st adhesive agent 31, and it is a predetermined method. By curing, the organic EL device 1 of the present embodiment is completed.

  After the first adhesive 31 is cured, before the second adhesive 32 is cured, the element substrate 20 and the sealing substrate 24 are accommodated in, for example, a chamber, and the interior of the chamber is evacuated to reduce the pressure. It may be arranged inside. For example, when the second adhesive 32 is applied, bubbles may be mixed in the adhesive. In such a case, if the element substrate 20 and the sealing substrate 24 are arranged in a reduced pressure atmosphere, bubbles can be extracted from the communication hole 33. In particular, since the second adhesive 32 is located in the display area at the center of the substrate, the display quality can be improved by removing such bubbles.

  In the manufacturing method of the organic EL device 1 according to the present embodiment, the first adhesive 31 on the peripheral edge of the substrate is cured first to serve as a bank, and has fluidity before curing inside. The second adhesive 32 is blocked from flowing outward. Due to this action, it is possible to prevent the adhesive from protruding outside the sealing substrate 24 and, for example, covering the mounting connection terminals 22 to cause mounting defects. Furthermore, the first adhesive 31 has a certain degree of viscosity, and the thickness (height from the element substrate surface) of the first adhesive 31 can be controlled by controlling the coating amount and the curing time. it can. Accordingly, the cured first adhesive itself serves as a gap material, and the gap between the element substrate 20 and the sealing substrate 24 can be maintained. In addition, for example, when the entire resin including the central portion is cured at once, curing shrinkage occurs, and the substrate is fixed in a bent state, whereas in this method, the second adhesive 32 in the central portion is heated later. Accordingly, the bending and stress of the element substrate 20 and the sealing substrate 24 are naturally relieved during the curing time of the second adhesive 32. As a result, it is possible to realize an organic EL device with high flatness that is free from mounting defects and the like and does not bend the substrate.

  In the present embodiment, the first adhesive 31 is UV-cured as one method of first curing the peripheral first adhesive 31 and later curing the second adhesive 32 inside. The resin and the second adhesive 32 are made of a thermosetting resin, and a method of irradiating ultraviolet rays in the process of curing the first adhesive 31 is adopted. Thus, when the 1st, 2nd adhesives 31 and 32 are comprised with another kind of resin, the 1st adhesive 31 of a peripheral part uses the thing especially excellent in moisture resistance, or top emission In the case of the organic EL device of the type, the second adhesive 32 in the central part uses a transparent one, while the first adhesive 31 in the peripheral part can also use a colored one. The functions can be properly used by the first and second adhesives 31 and 32.

  Further, since the communication hole 33 is provided in the first adhesive 31, when the second adhesive 32 is cured, for example, the amount of the second adhesive 32 applied is larger than the actual capacity of the accommodation space. Since the surplus flows out from the communication hole 33, it is possible to prevent the substrate from being bent such that the central portion of the substrate swells in a convex shape. In this case, the second adhesive 32 protrudes outside the first adhesive 31, but this protrusion is only from the portion of the communication hole 33, and in this embodiment, the communication hole 33 is connected to the terminal. Since it is provided at a position that does not cover the portion 23, no particular problem occurs even if there is some protrusion.

  In addition, although it mentioned above that the 1st adhesive agent 31 itself hardened | cured previously played the role of a gap material, only making the 1st adhesive agent function as a gap material only with the viscosity which the 1st adhesive agent 31 has. If difficult, a gap material may be included in the first adhesive 31. As the gap material, resin balls or beads having a predetermined diameter can be used. In that case, the element substrate 20 and the sealing substrate 24 can be reliably held at a predetermined interval. However, the element substrate 20 and the sealing substrate 24 can be obtained by simply including a gap material in the first adhesive 31. The gap is surely maintained, and since there is no need to include the gap material in the second adhesive 32 in the center, there is no adverse effect on the display of the gap material.

[Second Embodiment]
Hereinafter, a method of manufacturing the organic EL device according to the second embodiment of the present invention will be described with reference to FIG.
The basic configuration of the organic EL device of this embodiment is the same as that of the first embodiment, and only the adhesive used and the manufacturing method are different. Therefore, in the following, description of the organic EL device itself is omitted, and only different parts of the manufacturing process are described.

  In the manufacturing method of the organic EL device according to the present embodiment, the first adhesive 41 disposed on the peripheral edge of the substrate is a relatively fast curing agent, and the second adhesive 42 disposed on the central portion of the substrate is relatively used. In particular, a material having a slow curing rate is used. Specifically, for example, the first adhesive 41 is an ultraviolet curable epoxy resin, the second adhesive 42 is an ultraviolet curable acrylic resin, or the first adhesive 41 is a thermosetting epoxy resin, and a second adhesive. For example, a thermosetting acrylic resin may be used as the agent 42, and the same curing method, different resin materials, and different curing speeds may be used. Alternatively, both the first and second adhesives 41 and 42 may be ultraviolet curable epoxy resins, or the curing speed may be different depending on factors such as the addition amount of the ultraviolet curing accelerator being different.

  For example, when an ultraviolet curable resin is used for both the first and second adhesives 41 and 42, the liquid second adhesive 42 is applied to the central portion of the element substrate 20 as in the first embodiment, and the peripheral portion In this case, a liquid first adhesive 41 is applied. The order of application of the first and second adhesives 41 and 42 may be either first or second. For the application of the first and second adhesives 41 and 42, for example, a coating device such as a dispenser used for drawing a sealing material of a liquid crystal display device can be used. The first adhesive 41 applied to the peripheral edge is provided with a plurality of communication holes at a plurality of locations, and has a certain degree of viscosity so that the adhesive does not flow largely until the next step is irradiated with ultraviolet rays. Is preferably selected.

  Next, as shown in FIG. 5, after the sealing substrate 24 is overlaid on the element substrate 20 coated with the first and second adhesives 41 and 42, the entire surface is irradiated with ultraviolet rays. At this time, since at least one of the element substrate 20 and the support substrate 21 or the sealing substrate 24 is light transmissive according to any of the top emission type and the bottom emission type, the light transmissive property is obtained. Irradiation with ultraviolet rays may be performed from the substrate side. In the present embodiment, the first adhesive 41 cures faster than the second adhesive 42, so the first adhesive 41 cures first. Then, further ultraviolet irradiation is continued to completely cure the second adhesive 42. Then, after the second adhesive 42 is cured, the communication hole portion of the first adhesive 41 is filled with either the first adhesive 41 or the second adhesive 42 and cured by a predetermined method. By doing so, the organic EL device of this embodiment is completed. A thermosetting resin may be used for the first and second adhesives 41 and 42.

  In the case of this embodiment, the ultraviolet curable resin and the thermosetting resin are not properly used as in the first embodiment, but both the first adhesive and the second adhesives 41 and 42 are ultraviolet curable resin or heat. Even if the first and second adhesives 41 and 42 are simultaneously cured using a curable resin, the outer first adhesive 41 is inevitably cured first, which simplifies the process. . The operation and effect are the same as in the first embodiment, and the first cured adhesive 41 dams the second adhesive 42 from flowing outward. Can be prevented. Further, the cured first adhesive 41 serves as a gap material, and can hold the gap between the element substrate 20 and the sealing substrate 24. In addition, since the inner second adhesive 42 is cured later, the bending and stress of the element substrate 20 and the sealing substrate 24 are naturally relieved during the curing time of the second adhesive 42. Other actions and effects are the same as those in the first embodiment.

[Third Embodiment]
Hereinafter, a method for manufacturing an organic EL device according to a third embodiment of the present invention will be described with reference to FIG.
The basic configuration of the organic EL device of this embodiment is the same as that of the first embodiment, and only the adhesive used and the manufacturing method are different. Therefore, in the following, description of the organic EL device itself is omitted, and only different parts of the manufacturing process are described.

  In the first embodiment, an adhesive having a different “curing method” is used at the peripheral portion of the substrate and the central portion, and an adhesive having a different “curing speed” is used at the peripheral portion and the central portion of the substrate in the second embodiment. On the other hand, the manufacturing method of the organic EL device according to the present embodiment uses the same adhesive for both the substrate peripheral portion and the central portion, and then hardens the central portion after the peripheral portion first. . Therefore, in the claims, the names of the adhesives are divided for convenience, such as the first adhesive and the second adhesive, but the concept of the present invention is that the first adhesive and the second adhesive are divided. It includes that it may be the exact same adhesive.

  Specifically, for example, an ultraviolet curable epoxy resin is used as the adhesive 50, and the liquid adhesive 50 is applied to the entire surface of the element substrate 20. For the application of the adhesive 50, for example, a coating device such as a dispenser can be used. As the adhesive 50, it is preferable to select an adhesive having a certain degree of viscosity so that the adhesive 50 does not flow largely before the ultraviolet ray is irradiated in the next step.

  Next, as shown in FIG. 6, after the sealing substrate 24 is overlaid on the element substrate 20 to which the adhesive 50 is applied, ultraviolet rays are irradiated through a mask 51. At this time, since at least one of the element substrate 20 and the support substrate 21 or the sealing substrate 24 is light transmissive according to any of the top emission type and the bottom emission type, the light transmissive property is obtained. Irradiation with ultraviolet rays may be performed from the substrate side. The mask 51 has an opening for transmitting light at a position corresponding to the peripheral edge of the sealing substrate 24, and has a pattern in which other portions are shielded. By irradiating ultraviolet rays through the mask 51, only the portion corresponding to the peripheral edge of the sealing substrate 24 in the adhesive 50 is exposed, so only this portion is cured first. At this time, similarly to the above embodiment, when it is desired to provide the communication hole in the cured portion of the peripheral portion, a mask having a pattern in which the communication hole portion is shielded may be used. Next, by removing the mask 51 and irradiating with ultraviolet rays, the adhesive 50 corresponding to the central portion is cured. When the communication hole is provided, the adhesive 50 is filled again in the communication hole and then cured to complete the organic EL device of this embodiment. A thermosetting resin can also be used if only the peripheral edge of the adhesive 50 can be locally heated.

  In the case of this embodiment, it is not necessary to use the adhesive 50 separately at the peripheral edge portion and the central portion of the substrate, so that the adhesive can be easily applied. The operation and effect are the same as in the above embodiment, and the adhesive 50 at the peripheral edge that has been hardened previously blocks the adhesive 50 at the center from flowing outward. Occurrence can be prevented. Further, the cured peripheral edge adhesive 50 serves as a gap material, and the gap between the element substrate 20 and the sealing substrate 24 can be maintained. Further, since the adhesive 50 at the center is cured later, the deflection and stress of the element substrate 20 and the sealing substrate 24 are naturally relieved during the curing time of the adhesive 50. Other actions and effects are the same as those in the above embodiment.

[Fourth Embodiment]
Hereinafter, a method for manufacturing an organic EL device according to a fourth embodiment of the present invention will be described with reference to FIG.
The basic configuration of the organic EL device of this embodiment is the same as that of the first embodiment, and only the manufacturing method is different. Therefore, in the following, description of the organic EL device itself is omitted, and only different parts of the manufacturing process are described.

  In all the above embodiments, the adhesive has already been arranged in the center when the adhesive at the peripheral edge of the substrate is cured. On the other hand, the manufacturing method of the organic EL device of this embodiment is an empty state in which the adhesive does not exist at the center at the time when the adhesive at the peripheral edge of the substrate is cured, and the adhesive at the peripheral edge of the substrate does not exist. After curing, the adhesive at the center is filled.

  Specifically, for example, an ultraviolet curable epoxy resin is used as the first adhesive 61, and the liquid first adhesive 61 is applied to the peripheral portion of the element substrate. For the application of the adhesive 61, for example, a coating device such as a dispenser used for drawing a sealing material of a liquid crystal panel can be used. In addition, as the first adhesive 61, it is preferable to select an adhesive having a certain degree of viscosity so that the adhesive does not flow largely before the ultraviolet ray is irradiated in the next step. In the case of this embodiment, it is essential to provide a communication hole as described in the above embodiment when the first adhesive 61 is applied. Note that a thermosetting resin can also be used as the first adhesive 61.

  Next, as shown in FIG. 7, after the sealing substrate 24 is overlaid on the element substrate 20 to which the first adhesive 61 is applied, the first adhesive 61 is cured by irradiating ultraviolet rays. At this time, since at least one of the element substrate 20 and the support substrate 21 or the sealing substrate 24 is light transmissive according to any of the top emission type and the bottom emission type, the light transmissive property is obtained. Irradiation with ultraviolet rays may be performed from the substrate side. Next, for example, a method similar to the vacuum injection method of liquid crystal in the manufacturing process of the liquid crystal panel, that is, after immersing the communicating hole portion in the liquid second adhesive in the chamber kept in a reduced pressure atmosphere, By returning the interior to atmospheric pressure, the second adhesive can be injected into the gap between the element substrate 20 and the sealing substrate 24. As the second adhesive, either an ultraviolet curable resin or a thermosetting resin may be used. Next, when the ultraviolet curable resin is used as the second adhesive, the second adhesive is cured by performing ultraviolet irradiation, and when the thermosetting resin is used, heating is performed. Then, the organic EL device of this embodiment is completed by refilling the communication hole with one of the first and second adhesives and curing it.

  In the present embodiment, since the second adhesive does not exist on the substrate when the first adhesive 61 is cured, it is possible to prevent the occurrence of mounting failure due to the protruding adhesive. Further, the cured first adhesive 61 serves as a gap material, and the gap between the element substrate 20 and the sealing substrate 24 can be maintained. In addition, since the second adhesive is cured later, the deflection and stress of the element substrate 20 and the sealing substrate 24 are naturally relieved during the curing time of the adhesive. Other actions and effects are the same as in the above embodiment.

[Electronics]
FIG. 8 is a perspective configuration diagram of a thin large-screen television 1200 that is an example of the electronic apparatus according to the invention. A thin large-screen television 1200 shown in the figure is mainly configured by a display unit 1201 including the organic EL device of the previous embodiment, a housing 1201, and an audio output unit 1203 such as a speaker. In this thin large-screen television, a flat display screen by the organic EL device of the previous embodiment can be obtained, and the reliability of the display unit is also excellent.
The organic EL device according to the present invention can be applied not only to the display unit of the television shown in FIG. 8 but also to the display unit of various electronic devices. For example, the organic EL device is suitable for display units of portable electronic devices, personal computers, and the like. Can be used.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, the specific configuration and material of each part of the organic EL device exemplified in the above embodiment are merely examples, and can be changed as appropriate. In the above embodiment, an example in which an organic EL material is used for the light emitting layer has been described. However, the present invention may be applied to a device using an inorganic EL material for the light emitting layer (that is, an inorganic EL display device). Of course it is possible. Further, in the above-described embodiment, an example in which the EL device of the present invention is used as a display device has been described. It is also applicable to a light source used for optical communication.

1 is an equivalent circuit diagram of an organic EL device according to a first embodiment of the present invention. 2 is a schematic plan view of the organic EL device. FIG. FIG. 3 is a cross-sectional view taken along line A-A ′ of FIG. 2. It is a figure which shows 1 process of the manufacturing process of an organic electroluminescent apparatus. It is a figure which shows 1 process of the manufacturing process of the organic electroluminescent apparatus of 2nd Embodiment of this invention. It is a figure which shows 1 process of the manufacturing process of the organic electroluminescent apparatus of 3rd Embodiment of this invention. It is a figure which shows 1 process of the manufacturing process of the organic electroluminescent apparatus of 4th Embodiment of this invention. It is a perspective view which shows an example of the electronic device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Organic EL apparatus, 20 ... Element substrate, 21 ... Support substrate, 22 ... Mounting connection terminal, 23 ... Terminal part, 24 ... Sealing substrate, 31, 41, 61 ... 1st adhesive agent, 32, 42 ... 2nd adhesive agent, 33 ... communication hole, 50 ... adhesive agent, 51 ... mask, A ... organic EL element.

Claims (3)

An electroluminescence device comprising: an element substrate provided with a plurality of electroluminescence elements; and a sealing member provided on a surface of the element substrate on the side where the plurality of electroluminescence elements are provided via an adhesive layer. A manufacturing method comprising:
By arranging a plurality of the element substrate on the supporting substrate, a first step of forming the display area consisting of a set of the electroluminescence element is formed regions in each of the element substrate,
While arrange | positioning the said 1st adhesive agent which consists of an ultraviolet curable resin in the position which surrounds the said display area between the peripheral part of the said sealing member, and the edge part of each said element substrate facing the said sealing member. The second adhesive made of a thermosetting resin is disposed on the display area surrounded by the first adhesive, and at least the first adhesive is irradiated with ultraviolet rays, so that the second In the second step of selectively curing the first adhesive disposed so as to provide a plurality of communication holes for communicating the space in which the adhesive is accommodated and the space outside the first adhesive Yes,
After the first adhesive is cured, before the second adhesive disposed inside the first adhesive on the opposing surface of the element substrate and the sealing member is cured, A third step of disposing the element substrate and the sealing member in a reduced-pressure atmosphere, and then curing the second adhesive; and a method of manufacturing an electroluminescent device. An electroluminescence device comprising: an element substrate provided with a plurality of electroluminescence elements; and a sealing member provided on a surface of the element substrate on the side where the plurality of electroluminescence elements are provided via an adhesive layer. A manufacturing method comprising:
By arranging a plurality of the element substrate on the supporting substrate, a first step of forming the display area consisting of a set of the electroluminescence element is formed regions in each of the element substrate,
While arrange | positioning the said 1st adhesive agent which consists of an ultraviolet curable resin in the position which surrounds the said display area between the peripheral part of the said sealing member, and the edge part of each said element substrate facing the said sealing member. The second adhesive made of an ultraviolet curable resin is disposed on the display region surrounded by the first adhesive, and the region where the second adhesive is disposed is shielded from light . The first adhesive disposed so as to provide a plurality of communication holes that communicate the space in which the second adhesive is accommodated with the space outside the first adhesive is irradiated with ultraviolet rays, and the first adhesive a second step of curing the adhesive selectively,
After the first adhesive is cured and before the second adhesive is cured, the element substrate and the sealing member are disposed in a reduced-pressure atmosphere, and then the second adhesive is cured. And a third step . A method of manufacturing an electroluminescence device. An electroluminescence device comprising: an element substrate provided with a plurality of electroluminescence elements; and a sealing member provided on a surface of the element substrate on the side where the plurality of electroluminescence elements are provided via an adhesive layer. A manufacturing method comprising:
A first step of disposing the plurality of element substrates on a support substrate;
In a state where a plurality of the element substrates and the sealing member are arranged to face each other, a display region is generally surrounded between a peripheral edge portion of the sealing member and a peripheral edge portion of each element substrate facing the sealing member. A first adhesive is disposed so as to surround the plurality of electroluminescent elements, and a second adhesive having a slower curing speed than the first adhesive is disposed on the inner side of the position of the first adhesive. A second step of:
A third step of curing the first adhesive and the second adhesive, and
The first step is a step of arranging the plurality of element substrates on the support substrate to form the display region composed of a set of regions where the electroluminescent elements are formed on each of the element substrates. And
In the third step, the first adhesive and the second adhesive are cured in parallel, and the first adhesive and the second adhesive are cured in this order due to a difference in curing speed. In a state where the first adhesive is provided with a plurality of communication holes for communicating the space in which the second adhesive is accommodated and the space outside the first adhesive, The step of curing the second adhesive and the element substrate and the sealing member are placed in a reduced-pressure atmosphere after the first adhesive is cured and before the second adhesive is cured. A method for manufacturing an electroluminescent device.

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