JP2005331572A - Method for manufacturing organic el device, the organic el device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an organic EL device in which cured adhesives 15b will not be arranged, projecting from active surfaces 21 of element substrates 20. <P>SOLUTION: The method for manufacturing the large-sized organic EL device, by tiling has (a) a process of applying the adhesives 15 of a photosetting type having anaerobiosis, (b) a process of aligning and arranging a plurality of the element substrates 20 on a large-sized support substrate 10 via the adhesives 15, (c) a process of curing the adhesives 15 by irradiating the adhesives with light 18 from the rear side of the transparent support substrate 10, and (d) a process of cleaning the respective element substrates 20 and removing the uncured adhesives overflowing to the active surfaces 21 of the respective element substrates 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an organic EL device, an organic EL device, and an electronic apparatus.

  In recent years, a display panel using an organic electroluminescence element (hereinafter referred to as an organic EL element) has been promising as a light-weight, thin, self-luminous display device capable of clear display. However, a relatively large current is required for driving the organic EL element, and it is necessary to use a high-performance element such as a thin film transistor by a low-temperature polysilicon process for driving. The low-temperature polysilicon process has a problem that it is difficult to cope with an increase in the size of the substrate, such as a crystallization process using a laser, and it is difficult to obtain a large panel. Therefore, a method (tiling) for manufacturing a large panel by arranging a plurality of small panels in parallel has been proposed (see, for example, Patent Document 1).

  FIG. 8 is a cross-sectional configuration diagram of an organic EL device manufactured by tiling. First, a plurality of element substrates 20 provided with driving TFTs and pixel electrodes (both not shown) of the organic EL element 200 are formed. Next, the photocurable adhesive 15 is applied to the surface of the large support substrate 10, and the element substrates 20 are aligned on the surface. And by irradiating light from the back side of the support substrate 10 and hardening the photocurable adhesive 15, each element substrate 20 is bonded to the support substrate 10, and the side surfaces of the adjacent element substrates 20r and 20s are bonded to each other. Adhere to each other.

Thereafter, a hole injection / transport layer 70, an organic light emitting layer 60, a cathode 50, and the like are formed on the surface of a pixel electrode (not shown) in each element substrate 20 to form a plurality of organic EL elements 200. Further, a sealing substrate (not shown) is disposed above each element substrate 20 to hermetically seal all the organic EL elements 200. The large organic EL device 1 is thus completed.
JP 2001-1000066 A

  FIG. 7 is an explanatory diagram of a process of bonding each element substrate to a support substrate. As shown in FIG. 7A, in the bonding step of each element substrate 20, the adhesive 15c overflows from the gap between the adjacent element substrates 20r and 20s to the active surface 21 thereof. Therefore, as shown in FIG. 7B, each element substrate 20 is bonded with the protective sheet (masking tape) 24 attached to the active surface 21 of each element substrate 20. In this case, the adhesive 15 c overflows and hardens on the protective sheet 24, but the active surface 21 of each element substrate 20 can be exposed by removing the protective sheet 24.

  However, even if the protective sheet 24 is removed, the upper end surface of the adhesive 15b protrudes from the active surface of the element substrate 20 as shown in FIG. Then, as shown in FIG. 8, when the cathode 50 is formed on the active surface 21 of each element substrate 20, the cathode 50 is disconnected at the step 51 of the adhesive 15b. This makes it impossible to conductively connect the cathodes 50r and 50s formed on the adjacent element substrates 20r and 20s.

  By the way, it is desirable to form functional layers such as the hole injection / transport layer 70 and the organic light emitting layer 60 by a droplet discharge method. The droplet discharge method is a method of forming a functional layer by discharging a liquid containing a functional layer forming material from a droplet discharge head, and a functional layer having a predetermined thickness can be accurately formed at a predetermined position. . However, in order to increase the accuracy of the landing of the liquid to be discharged, it is necessary to make the interval between the droplet discharge head and the element substrate very narrow. If the cured adhesive 15b protrudes from the active surface 21 of the element substrate 20, the moving liquid droplet ejection head collides with the adhesive 15b, and the formation using this method cannot be applied.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing an organic EL device in which a hardened adhesive does not protrude from an active surface of an element substrate.
Another object of the present invention is to provide an organic EL device and an electronic apparatus with excellent reliability.

In order to achieve the above object, a method for manufacturing an organic EL device of the present invention is a method for manufacturing a large organic EL device by bonding side surfaces of a plurality of element substrates on which organic EL elements are to be formed, It has the process of adhere | attaching the side surfaces of each said element board | substrate with an anaerobic adhesive agent.
According to this configuration, it is possible to remove the adhesive overflowing on the active surface of each element substrate. Therefore, the cured adhesive is not disposed so as to protrude from the active surface of the element substrate.

Moreover, it is desirable to have the process of wash | cleaning each said element substrate and removing the said non-hardened anaerobic adhesive after the said adhesion process.
According to this configuration, excess adhesive can be easily removed by substrate cleaning. That is, it is possible to produce a large-sized substrate without an adhesive step at the joint without adding an extra step. Therefore, the manufacturing cost of the organic EL device can be reduced.

Further, it is desirable that the adhesive and the element substrate are made of a material having visible light permeability, and the refractive index of the adhesive is approximately equal to the refractive index of the element substrate.
By using an adhesive having a refractive index close to the refractive index of the element substrate, the reflection and scattering of light at the interface between the element substrate and the adhesive is reduced in the case of a bottom emission type organic EL device. It is possible to reduce the influence on the display of the joint portion.

Moreover, it is desirable to have a step of forming a functional layer on the active surface of each element substrate by a droplet discharge method after the bonding step.
The droplet discharge method is a method in which functional layers are sequentially discharged and formed on each pixel while moving the droplet discharge head. Even when the substrate is enlarged, it can be handled simply by changing the moving range of the droplet discharge head. can do. For this reason, a functional layer can be efficiently formed with respect to the large sized board | substrate after joining.
According to the above configuration, since the cured adhesive is not disposed so as to protrude from the active surface of the element substrate, the moving droplet discharge head does not collide with the protruded adhesive. Therefore, the functional layer can be formed safely and accurately.

In addition, it is desirable to form a common electrode of the organic EL element on the active surface of each element substrate after the bonding step.
According to the above configuration, the hardened adhesive is not disposed so as to protrude from the active surface of the element substrate. Therefore, by forming the common electrode of the organic EL element on the active surface, the common electrode is disconnected. Can be prevented.

On the other hand, the organic EL device of the present invention is manufactured using the above-described method for manufacturing an organic EL device.
According to the method for manufacturing the organic EL device described above, the cured adhesive is not disposed so as to protrude from the active surface of the element substrate, and therefore, the common electrode is continuously formed on the active surface of the element substrate without being disconnected. be able to. Therefore, an organic EL device with excellent reliability can be provided.

On the other hand, an electronic apparatus according to the present invention includes the above-described organic EL device.
According to this configuration, it is possible to provide an electronic device that is excellent in reliability and includes a large display screen.

  Embodiments of the present invention will be described below with reference to the drawings. In each drawing referred to below, in order to make the drawing easy to see, the film thickness, the ratio of dimensions, etc. of each component are appropriately changed.

[Organic EL device]
(Circuit configuration)
FIG. 1 is a circuit configuration diagram showing a wiring structure of an organic EL device (organic electroluminescence device) according to an embodiment. The organic EL device 1 is of an active matrix type using thin film transistors (TFTs) as switching elements, and has a plurality of scanning lines 101 and a plurality of signal lines 102 extending in a direction orthogonal to the scanning lines 101. And a plurality of power supply lines 103 extending in parallel to each signal line 102, and a pixel region X is formed in the vicinity of each intersection between the scanning line 101 and the signal line 102. A data line driving circuit 100 including a shift register, a level shifter, a video line, an analog switch, and the like is connected to the signal line 102. In addition, a scanning line driving circuit 80 including a shift register, a level shifter, and the like is connected to the scanning line 101.

  Further, in each pixel region X, a switching TFT 112 to which a scanning signal is supplied to the gate electrode via the scanning line 101 and a pixel signal to be supplied from the signal line 102 via the switching TFT 112 are held. A capacitor 113, a driving TFT 123 to which a pixel signal held by the holding capacitor 113 is supplied to the gate electrode, and a driving current from the power source line 103 when electrically connected to the power source line 103 via the driving TFT 123 are supplied. A pixel electrode 23 that flows in and a functional layer 110 sandwiched between the pixel electrode 23 and a cathode (counter electrode) 50 are provided. By providing at least an organic light emitting layer as the functional layer 110, an organic EL element is configured.

  In the organic EL device 1 having the above configuration, when the scanning line 101 is driven and the switching TFT 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor 113, and the holding capacitor 113 is in the state. Accordingly, the on / off state of the driving TFT 123 is determined. Then, a current flows from the power supply line 103 to the pixel electrode 23 through the channel of the driving TFT 123, and further a current flows to the cathode 50 through the functional layer 110. Then, the functional layer 110 emits light according to the amount of current flowing through it.

(Plane configuration)
Next, a specific structure of the organic EL device 1 of the present embodiment will be described with reference to FIGS.
FIG. 2 is a diagram schematically illustrating a planar configuration of the organic EL device according to the embodiment. In the organic EL device 1 according to the present embodiment, a plurality of small element substrates 20 are aligned on the surface of a large support substrate 10. In FIG. 2, four element substrates 20 are arranged in 2 rows × 2 columns, but the number of element substrates 20 is not limited to this, and may be at least two. An element formation region 4 is provided in the central portion of the organic EL device 1. In the element formation region 4, the organic EL elements 200 are regularly arranged in a matrix in a plan view. In addition, a spacing member 35 described later is formed on the peripheral portion of the element forming region 4, and a plurality of external connection terminals 22 are provided outside the spacing member 35.

(Cross section configuration)
FIG. 3 is a diagram schematically illustrating a cross-sectional configuration of the organic EL device according to the embodiment, and is a side cross-sectional view taken along the line AA in FIG. 2. As shown in FIG. 3, in the organic EL device 1 of this embodiment, a plurality of small element substrates 20 are fixed to the surface of a large support substrate 10 with an adhesive 15. Each element substrate 20 mainly includes a substrate body 20A and a circuit unit 11 disposed on the surface of the substrate body 20A. A plurality of organic EL elements 200 are formed on the surface of the circuit unit 11. An adhesive layer 33 is formed so as to cover the organic EL element, and is further hermetically sealed by a sealing substrate 30 to constitute the organic EL device 1.

  In the case of a so-called top emission type organic EL device, since display light is taken out from the sealing substrate 30 side, either a transparent substrate or an opaque substrate may be used as the substrate body 20A. As the opaque substrate, for example, a ceramic sheet such as alumina, or a metal sheet such as stainless steel that has been subjected to an insulation treatment such as surface oxidation can be used. It is also possible to use a plastic resin or a film (plastic film) thereof. On the other hand, in the case of a bottom emission type organic EL device, since display light is extracted from the substrate body 20A side, it is necessary to use a transparent substrate as the substrate body 20A. For example, glass or quartz can be used as the transparent substrate.

  On the substrate body 20A, a circuit unit 11 including a driving TFT 123 and the like is formed. The driving TFT 123 and the like are connected to the data line driving circuit 100 and the scanning line driving circuit 80 shown in FIG. On the other hand, a plurality of pixel electrodes 23 are arranged in a matrix on the surface of the circuit section 11 shown in FIG. The energization of the pixel electrode 23 is controlled by the driving TFT 123 and the like. A partition wall structure (bank) 221 is disposed around the pixel electrode 23 on the surface of the circuit unit 11. The partition wall structure 221 is made of an electrically insulating material such as an organic material (for example, polyimide), and has an opening 221 a in the formation region of the pixel electrode 23.

  A hole injection / transport layer 70 that injects / transports holes from the pixel electrode 23 on the surface of the pixel electrode 23 that functions as an anode inside the opening 221a, and an electro-optic material. An organic light emitting layer 60 including a single organic EL material and a cathode 50 are sequentially stacked to form an organic EL element 200. Under such a configuration, the holes injected from the hole injection / transport layer 70 and the electrons supplied from the cathode 50 are combined in the organic light emitting layer 60, whereby the organic EL element 200 emits light. It is supposed to be. The organic EL element 200 may include an electron injection / transport layer, a hole blocking layer (hole blocking layer), an electron blocking layer (electron blocking layer), and the like in addition to the above-described layers.

In the case of a top emission type organic EL device, the pixel electrode 23 does not need to be transparent, and is formed of an appropriate conductive material such as a metal material. In the case of a bottom emission type organic EL device, the pixel electrode 23 is formed of a transparent conductive material such as ITO (indium tin oxide).
As a material for forming the hole injection / transport layer 70, for example, a polythiophene derivative, a polypyrrole derivative, or a doped body thereof is used. Specifically, 3,4-polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) or the like is preferably used.

As a material for forming the organic light emitting layer 60, a known light emitting material capable of emitting fluorescence or phosphorescence can be used. Specifically, (poly) fluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), polyvinylcarbazole (PVK), polythiophene derivative, polymethyl Polysilanes such as phenylsilane (PMPS) are preferably used.
In addition, these polymer materials include polymer materials such as perylene dyes, coumarin dyes, rhodamine dyes, rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, and quinacridone. It can also be used by doping a low molecular weight material such as.
In addition, it replaces with the polymeric material mentioned above, a conventionally well-known low molecular material can also be used.
Further, if necessary, an electron injection layer made of a metal or a metal compound mainly composed of calcium, magnesium, lithium, sodium, strontium, barium, or cesium may be formed on the organic light emitting layer 60. .

  The cathode 50 is disposed so as to cover the surfaces of the organic light emitting layer 60 and the partition structure 221. In the case of a top emission type organic EL device, a transparent conductive material such as ITO is used as a material for forming the cathode 50. In the case of a bottom emission type organic EL device, an appropriate conductive material such as a metal material is used as a material for forming the cathode 50. In this case, it is desirable that the cathode 50 be made of a metal material such as calcium (Ca) having a small work function. Furthermore, it is desirable to form a film made of aluminum (Al) or the like having high conductivity as the cap layer of the cathode 50.

  The cathode 50 is connected to a cathode wiring 202 formed on the peripheral edge of the element substrate 20. The cathode wiring 202 is conductively connected to the external connection terminal 22 together with other wiring. Thereby, the cathode 50 can be connected to a drive IC (drive circuit) (not shown).

(tiring)
As shown in FIG. 3, the organic EL device 1 according to the present embodiment has a plurality of small element substrates 20 arranged on the surface of a large support substrate 10. An adhesive 15 is disposed between the front surface of the support substrate 10 and the back surface of the element substrate 20 (for example, a gap of about 30 μm) and between adjacent element substrates 20r and 20s (for example, a gap of about 160 μm). It is fixed. As the adhesive 15, an anaerobic adhesive whose curing speed is reduced by contact with air is employed. For example, Benefix S105 (product name) manufactured by Adel Co., Ltd. is a photo-curing adhesive having anaerobic properties, and has a property that the thickness of about 0.2 mm from the air interface hardly cures. In addition, when a photocurable adhesive is employed as the anaerobic adhesive, it is desirable to employ a light transmissive substrate as the support substrate 10.

  The adhesive 15b disposed in the gap between the adjacent element substrates 20r and 20s is filled to the same height as the active surface 21 of each element substrate 20r and 20s. Therefore, the cathode 50 disposed on the upper end surface of the adhesive 15b and the active surface 21 of each element substrate 20r, 20s is continuously formed without disconnection. Thereby, the cathodes 50r and 50s formed on the element substrates 20r and 20s can be electrically connected to each other.

  A separation member 35 made of an organic material such as acrylic resin, an inorganic material such as silicon oxide, or the like is erected on the peripheral portion of the element substrate group arranged in this manner. A sealing substrate 30 is disposed on the upper end surface of the spacing member 35. A space surrounded by the separation member 35 and the sealing substrate 30 is filled with the adhesive layer 33. The adhesive layer 33 is made of, for example, a resin material such as urethane, acrylic, epoxy, or polyolefin. In addition to the function of adhering the sealing substrate 30, the adhesion of the organic EL element 200 is prevented from entering oxygen, moisture, and the like. It has a function to do.

In the case of a top emission type organic EL device, the adhesive layer 33 and the sealing substrate 30 are required to have light transmittance. Therefore, the sealing substrate 30 is made of a transparent material such as glass or quartz. The adhesive layer 33 preferably has a light transmittance of 80% or more in the visible light region by appropriately adjusting the material and film thickness of the resin material.
Further, in the case of a bottom emission type organic EL device, the cured adhesive 15 needs to have light transmittance. Here, the refractive index of the constituent material of the adhesive 15 is desirably equal to the refractive index of the constituent material of the support substrate 10 and / or the element substrate 20. According to this configuration, it is possible to reduce the reflection and scattering of light at the interface between the support substrate 10 and / or the element substrate 20 and the adhesive 15, and the influence on the display of the joint portion can be reduced. .

[Method for Manufacturing Organic EL Device]
Next, a method for manufacturing the organic EL device according to this embodiment will be described with reference to FIGS. 4 and 5 are process diagrams of the method for manufacturing the organic EL device according to the embodiment. 4 and 5, the circuit portion of the element substrate 20 is not shown in order to simplify the drawings and facilitate understanding.
First, as shown in FIG. 4A, a photocurable adhesive 15 is applied to the surface of the support substrate 10. An adhesive may be applied from the back surface to the side surface of the element substrate.

  Next, as shown in FIG. 4B, the element substrates 20 are aligned and arranged at predetermined positions on the surface of the support substrate 10. Each element substrate 20 has a circuit unit including a pixel electrode and a partition structure (bank) formed in advance on a substrate body. When the instruction substrate 10 is pressed against the support substrate 10 so that the distance between each element substrate 20 is a predetermined distance, the adhesive 15 applied on the support substrate 10 has a low viscosity. It is pushed out into the gaps 20r and 20s to fill the gaps. Furthermore, the excess adhesive 15b overflows to the active surface 21 of the element substrates 20r and 20s.

Next, as shown in FIG. 4C, the adhesive 15 is cured by irradiating light 18 from the back surface of the transparent support substrate 10. For example, visible light may be irradiated as the light 18. In the present embodiment, an anaerobic adhesive is employed as the adhesive 15. Since the adhesive 15c overflowing to the active surfaces of the element substrates 20r and 20s is in contact with air, it does not cure even when irradiated with light. On the other hand, since the adhesive 15a disposed in the gap between the support substrate 10 and the element substrate 20 and the adhesive 15b filled in the gap between the adjacent element substrates 20r and 20s are not in contact with air, light irradiation is performed. To cure.
Here, by adjusting the irradiation conditions such as the intensity and irradiation time of the light 18 and the composition of the adhesive 15, the adhesive 15b filled in the gap between the adjacent element substrates 20r and 20s, and the support substrate 10 and the element It is desirable to cure only the adhesive 15a filled between the substrate 20 and the substrate 20. That is, the adhesive 15b filled in a position lower than the active surface 21 of the element substrate 20 is cured, and the adhesive 15c overflowing to a position higher than the active surface 21 is left uncured.

  Next, as shown in FIG. 4D, the active surface 21 of the element substrate 20 is washed to remove the uncured adhesive 15c. For this cleaning, a cleaning liquid such as an organic solvent or an alkaline detergent generally used for panel cleaning can be used. As a result, the uncured adhesive 15c overflowing to the active surface of the element substrate 20 is removed, and the cured adhesive filled in the gap between the adjacent element substrates 20r and 20s remains. As described above, each element substrate 20 is fixed onto the support substrate 10.

  On the other hand, as shown in FIG. 5A, a partition wall structure (bank) 221 is formed in advance so as to surround a pixel electrode (not shown) on the active surface 21 of the element substrate 20. The partition structure 221 may be formed on the active surface 21 of the element substrate 20 after the element substrates 20 are fixed on the support substrate 10. In particular, when the recess is formed when the upper end surface of the adhesive 15b at the joint between the adjacent element substrates 20r and 20s is lower than the active surface 21 of the element substrate 20, the formation is simultaneously performed with the formation of the partition wall structure 221. If the concave portion is filled with the material, the joint portion can be flattened without adding an extra step.

  A hole injection / transport layer 70 and an organic light emitting layer 60 are sequentially formed on the surface of the pixel electrode inside the opening 221a of the partition wall structure 221. It is desirable to use a droplet discharge method for forming each layer. In the droplet discharge method, a minute amount of droplets containing the functional layer forming material is selectively discharged from the droplet discharge head to the opening 221a of the partition wall structure 221 and dried and fired to thereby function the functional layer. Is deposited. As described above, the functional layer is sequentially ejected and formed on each pixel while moving the droplet ejection head, so that even when the substrate is enlarged, it is possible to cope with it by changing the moving range of the droplet ejection head. . For this reason, a functional layer can be efficiently formed with respect to the large sized board | substrate after joining.

By the way, in the droplet discharge method, in order to improve the accuracy of the landing of the liquid to be discharged, it is necessary to make the interval between the droplet discharge head and the element substrate very narrow. Here, when the hardened adhesive 15b protrudes from the active surface 21 of the element substrate 20, the moving liquid drop ejection head collides with the adhesive 15b, and the functional layer using the liquid drop ejection method is formed. Formation cannot be adopted.
However, in the present embodiment, since the cured adhesive 15b does not protrude from the active surface 21 of the element substrate 20, the moving liquid droplet ejection head does not collide with the adhesive 15b. Accordingly, each layer can be accurately formed using a droplet discharge method. In this case, the upper end surface of the cured adhesive 15 b may be disposed below the height of the active surface 21 of the element substrate 20.

  Further, the cathode 50 is formed on the entire active surface of the arrayed element substrate group. For the formation of the cathode 50, a vacuum deposition method, a sputtering method, or the like can be used. The cathode 50 is also formed on the upper end surface of the adhesive 15b disposed in the gap between the adjacent element substrates 20r and 20s, and functions as a common electrode for the entire organic EL device. Here, since the upper end surface of the adhesive 15b is substantially flush with the active surface 21 of each element substrate 20, no step is formed between them. Therefore, the cathode 50 can be formed continuously without disconnection. Accordingly, the cathodes 50r and 50s formed on the adjacent element substrates 20r and 20s can be electrically connected to each other, and can function as a common electrode of the organic EL device.

Next, as shown in FIG. 5B, an adhesive layer 33 is formed and the sealing substrate 30 is mounted. Specifically, after applying a liquid photocurable resin on the surface of the cathode 50 and disposing the sealing substrate 30 thereon, light is irradiated from above the transparent sealing substrate 30 to form the adhesive layer 33. Curing is performed and the sealing substrate 30 is bonded. The sealing substrate 30 and the adhesive layer 33 can prevent moisture and the like from entering from the outside, and can protect the organic EL element 200.
Thus, the organic EL device 1 according to this embodiment is completed.

  As described in detail above, the method of manufacturing the organic EL device according to this embodiment has a configuration including a step of bonding the side surfaces of a plurality of element substrates with an anaerobic adhesive. According to this configuration, the curing rate of the adhesive overflowing on the active surface of each element substrate is slower due to contact with air than the curing rate of the adhesive disposed in the gap between adjacent element substrates. Therefore, the cured adhesive is not disposed so as to protrude from the active surface of the element substrate. This makes it possible to continuously form functional layers on the active surface of each element substrate without disconnection. Further, when the functional layer is formed by the droplet discharge method, the droplet discharge head can be prevented from colliding with the cured adhesive.

  Moreover, in the manufacturing method of the organic EL device of this embodiment, the active surface of each element substrate is washed to remove the uncured anaerobic adhesive. According to this configuration, excess anaerobic adhesive can be easily removed by substrate cleaning. This makes it possible to protect the active surface without attaching a protective sheet to the active surface of each element substrate. In addition, it is possible to manufacture a large substrate without an adhesive step at the joint without adding an extra step, and the manufacturing cost of the organic EL device can be reduced.

[Electronics]
FIG. 6 is a perspective configuration diagram of a thin large-screen television 1200 that is one configuration example of the electronic apparatus according to the invention. A thin large-screen television 1200 shown in the figure is mainly configured by a display unit 1201 including the organic EL device of the above-described embodiment, a housing 1202, and an audio output unit 1203 such as a speaker. In this thin large-screen television, the organic EL device of the above embodiment has excellent display unit reliability.
The organic EL device according to the present invention can be applied not only to the display unit of the television shown in FIG. 6 but also to the display unit of various electronic devices. For example, the organic EL device is suitable for display units of portable electronic devices, personal computers, and the like. Can be used.

1 is a circuit configuration diagram of an organic EL device according to an embodiment. It is a plane lineblock diagram of an organic EL device concerning an embodiment. It is a section lineblock diagram of an organic EL device concerning an embodiment. It is process drawing of the manufacturing method of the organic electroluminescent apparatus which concerns on embodiment. It is process drawing of the manufacturing method of the organic electroluminescent apparatus which concerns on embodiment. It is a perspective view of a thin large screen television. It is explanatory drawing of the process of adhere | attaching each element board | substrate on a support substrate. It is a section lineblock diagram of an organic EL device manufactured by tiling.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Support substrate 15, 15b ... Adhesive 18 ... Light 20 ... Element substrate 21 ... Active surface

Claims (7)

A method of manufacturing a large organic EL device by bonding side surfaces of a plurality of element substrates on which an organic EL element is to be formed,
A method for manufacturing an organic EL device, comprising a step of bonding side surfaces of each element substrate with an anaerobic adhesive.   2. The method of manufacturing an organic EL device according to claim 1, further comprising a step of cleaning each element substrate and removing the uncured anaerobic adhesive after the bonding step. The adhesive and the element substrate are made of a material having visible light permeability,
The method of manufacturing an organic EL device according to claim 1, wherein a refractive index of the adhesive is substantially equal to a refractive index of the element substrate.   4. The method of manufacturing an organic EL device according to claim 1, further comprising a step of forming a functional layer on an active surface of each element substrate by a droplet discharge method after the bonding step. Method.   5. The method of manufacturing an organic EL device according to claim 1, wherein a common electrode of the organic EL element is formed on an active surface of each element substrate after the bonding step.   An organic EL device manufactured using the method for manufacturing an organic EL device according to claim 1.   An electronic apparatus comprising the organic EL device according to claim 6.

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