JP4431716B2 - Collective supercomputer - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a collective supercomputer in which a large number of computers are cluster-connected.
[0002]
[Prior art]
A large number of computers are connected in a cluster to form a collective supercomputer, which can be used as a server that constitutes an ASP (Application Service Provider) data center, or as a supercomputer that performs large-scale scientific calculations. Has been done in the past.
[0003]
[Problems to be solved by the invention]
When a large number of computers are connected in a cluster to form a collective supercomputer, the total collective volume increases and the amount of heat generated also increases. In particular, collective supercomputers used in servers used in networks are driven continuously for 24 hours, and each computer must incorporate a radiator and a fan, making it difficult to reduce the size of the collective computer. However, there was a problem that the size would be increased.
The present invention aims to solve the above problems.
[0004]
[Means for Solving the Problems]
In order to achieve the above-described problems, the present invention arranges a large number of thin computers 10 on a subrack 8 having an open bottom and top so that their wide side surfaces are perpendicular to the floor surface. The sub-rack 8 is stored in a plurality of stages in the rack 2 in the vertical direction, and is a collective supercomputer in which the computers 10 are cluster-connected. The computer 10 has a width at which the LAN connection port 62 and the COM port 64 open. A sandwiched rectangular front panel 18, a wide rectangular side panel 20 fixed at right angles to the front panel 18, a circuit board 24 fixed to the inner surface of the side panel 20, and the circuit board 24 Computer components such as a CPU 34 and a memory IC 44 which are arranged facing each other and attached to the side panel 20 with screws and arranged on the circuit board 24 The presser panel 22 is held in a sandwich shape with the side panel 20, and the front panel 18, the side panel 20, and the presser panel 22 are made of an aluminum heat sink, and a large number of heat dissipation is performed on the outer surface of the presser panel 22. Fins 70 are provided integrally, and a large number of air flow passages 68 having a U-shaped cross section extending in a direction perpendicular to the floor surface are formed by the heat radiating fins 70.
Further, in the present invention, the fan 4 is provided at the upper part of the rack 2 so that the air in the rack 2 is discharged to the discharge port above the rack 2 through the air flow path 68 by the vacuum force of the fan 4. It is a thing.
Further, in the present invention, the side panel 20 is extended rearward by a predetermined length from the presser panel 22, and a large number of heat radiation fins 70 are integrally provided on the extended portion 20 a of the side panel 20. An air flow path 68 having a U-shaped cross section extending in a direction perpendicular to the surface is formed.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
In FIG. 2, reference numeral 2 denotes a box-shaped rack, and a fan 4 is provided at an air discharge port on the upper wall of the rack. Subrack slide holding mechanisms (not shown) are formed in a plurality of stages on both side walls of the rack 2. Subrack insertion openings 6 are formed in a plurality of stages on the open front surface of the rack 2 by the subrack slide holding mechanism.
[0006]
When each of the prepared subrack 8 is inserted into the opening 6 of each step, both sides of the subrack 8 are held slidable in the horizontal direction by the subrack slide holding mechanism. When each sub-rack 8 is pushed inward from the opening 6 to the limit position, the plurality of sub-racks 8 are accommodated horizontally with respect to each other in the rack 2 over a plurality of stages with their front surfaces positioned on the same vertical plane. The rack 2 is provided with three air ducts 9 for each second stage.
[0007]
Each air duct 9 opens to the front surface of the rack 2, and guides the air taken in from the opening portion toward the back of the rack 2. Vent holes (not shown) are formed in the upper and lower tube walls of each air duct 9, and air is also circulated up and down from the vent holes.
As shown in FIG. 4, the sub-rack 8 includes a front frame 8a, both side frames 8b and 8c, an upper frame 8d, a bottom frame, and a rear frame, and six sides are open.
[0008]
In the storage space portion opened in the six-plane direction of the subrack 8, 16 thin, substantially rectangular parallelepiped computers 10 are arranged and stored in parallel, each having a wide side surface vertical. A plurality of power supply packs 12 are disposed in the back of the subrack 8, a plurality of connectors 14 are connected to the power supply packs 12, and the connector 14 is connected to a connector 16 connected to a regulator IC 36 of the corresponding computer 10. Are connected.
[0009]
The casing of the computer 10 is composed of an oblong rectangular front panel 18, a wide rectangular side panel 20, and a wide rectangular holding panel 22, all of which are made of an aluminum plate as a heat dissipation material. Yes. One end of the side panel 20 is fixed to one side of the surface panel 18 with a right angle relationship thereto.
[0010]
A circuit board 24 is fixed to the inner side surface of the side panel 20. On the surface of the circuit board 24, LAN modules 26, 28 and 30, a serial port interface 32, a CPU 34 (central processing unit), a regulator IC 36, a general-purpose FD controller 38, a hard disk controller 40, a hard disk device 42, a memory IC 44 and other computers. The components are mounted and connected to electronic circuits formed on the circuit board 24, respectively.
[0011]
On the surface of the circuit board 24, the presser panel 22 is disposed opposite to the circuit board 24, and is attached to the side panel 20 by screws 46 and 48. The inner wall surface of the presser panel 22 is pressed against various computer components mounted on the circuit board 24 by the tightening force of the screws 46 and 48, and the presser panel 22 and the side panel 20, together with the circuit board 24, It is sandwiched between sandwiches. A high thermal conductive sheet 50 is disposed on the surface of each computer component that comes into contact with the presser panel 22 so that heat generated by the computer component is efficiently transmitted to the presser panel 22.
[0012]
The sandwich structure in which the circuit board 24 and the computer components on the circuit board 24 are sandwiched between the panels 20 and 22 which are two aluminum heat sinks can increase the heat dissipation efficiency of the computer 10 and can be made extremely thin. Thereby, a large number of computers 10 can be stored in the subrack 8 at a high density. A fitting recess 52 for receiving these components is formed in a portion of the presser panel 22 that comes into contact with various computer components.
[0013]
Connectors 54, 56, 58 and 60 are attached to the back surface of the front panel 18, and a LAN port 62 and a COM port 64 constituted by the connectors 54, 56, 58 and 60 are opened on the surface of the front panel 18. Yes. The connectors 54, 56, 58 and 60 are connected to the corresponding LAN modules 26, 28 and 30 and the serial port interface 32, respectively. A power connector 16 is attached to one side of the presser panel 22, and the connector 16 is connected to a regulator IC 36.
[0014]
A number of strip-like fins 66 extending in a direction parallel to the surface panel 18 are integrally formed on the presser panel 22, and the direction between the fins 66 is U-shaped and perpendicular to the floor surface. An air flow path 68 is formed extending in the direction. A large number of fins 70 are integrally formed in parallel with the fins 66 in the extended portion 20 a of the side panel 20 extended with respect to the presser panel 22. Fin notches 72 are formed in the rear portions of the presser panel 22 and the side panel 20, and the connectors 14 and 16 are disposed in the notches 72.
[0015]
Each computer 10 is arranged so that the longitudinal direction of the front panel 18 is perpendicular to the open bottom surface of the subrack 8 and the surface of the front panel 18 is parallel to the open front surface of the subrack 8. Arranged in the storage space of the subrack 8, each front panel 18 is detachably fixed to the front frame 8 a of the subrack 8 by screws 74. The air flow paths 68 of the computers 10 corresponding to the respective stages housed in the rack 2 communicate with each other in the vertical direction as shown in FIG.
[0016]
As shown in FIG. 7, each computer 10 is connected in a cluster to form a collective supercomputer 76, and is connected to the Internet to form a server that constitutes an ASP (Application Service Provider) data center. The cluster-connected collective supercomputer 76 can be a computer for scientific calculation that performs a large-scale scientific calculation conventionally performed by a supercomputer, or a computer for other purposes.
[0017]
【The invention's effect】
As described above, the present invention is configured such that each computer is sandwiched between two heat radiating panels by sandwiching computer components such as a CPU between two heat radiating panels, so that each computer can be made extremely thin. . In addition, a large number of U-shaped air flow passages extending in a direction perpendicular to the floor surface are formed in adjacent portions of the computer by heat radiating fins integrally formed with the panel. The heat of the computer can be radiated efficiently. Therefore, there is an effect that a heat radiation effect that can be sufficiently used can be obtained without providing a fan or a heat radiator for each computer, and the whole can be extremely miniaturized.
[Brief description of the drawings]
FIG. 1 is a plan sectional view of an essential part of the present invention.
FIG. 2 is an overall front view of the present invention.
FIG. 3 is an overall side sectional view of the present invention.
FIG. 4 is an external view of a subrack containing a computer.
FIG. 5 is a side view of a computer.
FIG. 6 is a block circuit diagram of a computer.
FIG. 7 is a block diagram of a collective supercomputer according to the present invention.
[Explanation of symbols]
2 Rack 4 Fan 6 Subrack insertion opening 8 Subrack 9 Air duct 10 Computer 12 Power pack 14 Connector 16 Connector 18 Front panel 20 Side panel 22 Press panel 24 Circuit board 26 LAN module 28 LAN module 30 LAN module 32 Serial port interface 34 CPU
36 Regulator IC
38 General-purpose FD controller 40 Hard disk controller 42 Hard disk device 44 Memory IC
46 screw 48 screw 50 high / heat conductive sheet 52 fitting recess 54 connector 56 connector 58 connector 60 connector 62 LAN port 64 COM port 66 fin 68 air passage 70 fin 72 fin notch 74 screw 76 collective supercomputer

Claims (3)

A large number of thin computers (10) are arranged side by side on the subrack (8) whose bottom and top are open so that their wide sides are perpendicular to the floor surface, and the subrack (8) is placed in a rack ( 2) A collective supercomputer in which a plurality of stages are housed in the vertical direction and each computer (10) is connected in a cluster, and the computer (10) includes a LAN connection port (62) and a COM port (64). A wide rectangular surface panel (18) having an opening, a wide rectangular side panel (20) fixed at right angles to the front panel (18), and an inner surface of the side panel (20). A fixed circuit board (24), and a CPU (34) and a memory arranged on the circuit board (24) that are arranged facing the circuit board (24) and attached to the side panel (20) with screws. I A holding panel (22) that holds a computer component such as (44) in a sandwich shape with the side panel (20). The top panel (18), the side panel (20), and the pressing panel (22) A cross section U formed of an aluminum heat dissipation plate, integrally provided with a large number of heat dissipating fins (70) on the outer surface of the holding panel (22), and extending in a direction perpendicular to the floor surface by the heat dissipating fins (70). A collective supercomputer characterized by forming a large number of air flow passages (68) in the shape of a letter. A fan (4) is provided at the top of the rack (2), and the air in the rack (2) is placed above the rack (2) through the air flow path (68) by the vacuum force of the fan (4). The collective supercomputer according to claim 1, wherein the collective supercomputer is discharged to a discharge port. The side panel (20) is extended rearward by a predetermined length from the presser panel (22), and a plurality of radiating fins (70) are integrally provided on an extended portion (20a) of the side panel (20), The collective supercomputer according to claim 1, wherein an air flow path (68) having a U-shaped cross section extending in a direction perpendicular to the floor surface is formed by a heat radiating fin (70).

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