JP2003060374A - Electronic apparatus and rack housing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the heat radiation of a thin type server unit. SOLUTION: Offset flat portions 106, 107 connected with a stepped plane 109 are formed on a back panel 102 of a server unit 101 and the stepped plane 109 has heat-radiating openings 114. By utilizing this plane 109 for forming the radiation openings, heat is effectively radiated from the unit 101, without sacrificing the area for mounting connectors 112, 113, 115, 116, 117.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure for electronic equipment. For example, the present invention relates to a heat dissipation structure of server units that are stacked in multiple stages.

[0002]

2. Description of the Related Art A server system connected to a large-scale network is provided with a plurality of server units in order to prevent a decrease in processing speed and to allow a processing margin, and the processing is distributed. Has become.
In such a server system, a case accommodating each server unit is vertically stacked and stored in a rack.

The server system is required to have high processing capability. Further, since the server system is arranged in a limited space such as an office, a structure that can be arranged in a smaller occupied space is required.

In order to realize a high processing capacity required for a server system, a built-in CPU having a higher processing speed is adopted. Further, as the performance and functionality of the server system are increased and the server unit is made thinner, the mounting density of electronic components such as a hard disk device and a memory unit stored in the server unit is increasing. For the same reason, the types and the number of various connectors provided on the rear panel of the server unit tend to increase.

To meet the demand for reducing the space occupied by the server system, a structure is adopted in which the server units are vertically stacked and stored in a rack. In addition, each server is endeavored to have a thinner shape so that more server units can be stored in a rack.

As a standard for a case in which a rack is housed,
ANSI / EIA standard (ANSI / EIA-310-
D) is known. According to the ANSI / EIA standard,
The width of the case (server unit) is 482.6 m.
m (19 inches) and the thickness are multiples of 44.45 mm (1.75 inches). The basic thickness of 44.45 mm is referred to as 1U, and when it is doubled, it is called 2U and when it is tripled, it is called 3U (same below). Generally, 1 U is used as the standard for the thinnest case. The depth and height of the rack itself can be freely selected according to the size of the server system body. However, as a practical matter, the depth of the rack is often about 800 mm to 900 mm and the height is about 2 m due to installation and wiring work.
Limited to (42U).

FIG. 9 is a diagram illustrating the appearance of a typical server unit. FIG. 10 is a diagram showing the server unit of FIG. 9 viewed from the rear panel side. The server unit 901 includes a rear panel 904 and a front panel 90.
Equipped with 3. A power supply connector 905, an opening 906 for heat dissipation, and various connectors 907 are arranged on the back panel 904. On the front panel 903, operation lamps and warning lamps (not shown), and a power switch (not shown) are arranged. Inside the server unit 901, a CPU, a hard disk device, and the like (not shown) are stored.

A CPU (not shown) stored in the server unit 901 is vulnerable to heat. Therefore, the server unit 90
The heat generated inside 1 must be effectively discharged to the outside. Cooling in the server unit 901 is performed by the function of a cooling fan (not shown) arranged in the server unit 901. That is, by the action of the cooling fan (not shown), air is sucked in through an intake opening (not shown) provided in the front panel 903, and the warmed air inside the server unit 901 is discharged through the opening 906, and the server unit 901 is discharged. The inside is cooled.

FIG. 11 is a diagram showing a state in which the server unit 901 illustrated in FIGS. 9 and 10 is stored in the rack 908. Inside the rack 908, the slide rail 9
11 is arranged, and the server unit 901 is slidably held. A plurality of server units 901 are vertically stacked and stored in the rack 908.

On the front side 912 of the rack 908, a transparent decorative plate or punching metal plate (not shown) is attached. When a transparent makeup slope is used, a gap is provided so that outside air can flow in. On the back side 909, a space for routing various wiring cables (not shown) is provided. Although not shown, a punching metal plate is attached to the back side 909 in the use state. The top plate of the rack 908 has a heat dissipation opening 910.
Is provided so that the exhaust gas from the server unit 901 is released to the outside.

FIG. 12 is a view showing another conventional structure of the server unit 901. In the structure shown in FIG. 12, the slanted portion 91 faces the rear panel 904 behind the server unit.
5 is formed, and an opening 91 for exhaust is formed in the inclined portion 915.
4 are formed.

[0012]

As described above, the component mounting density in the server unit 901 tends to be high. This tendency becomes more noticeable when the server unit 901 is made thinner. When the server unit 901 is thinned, how to handle heat generated inside the server unit 901 becomes a big problem.

On the other hand, with the multi-functionalization of the server unit, many connectors must be arranged on the rear panel 904, and a large space for the heat radiation opening 906 cannot be secured. For example, when 1U size is adopted as the server unit 901 and a large number of connectors are arranged, it is difficult to form an opening for heat dissipation or the like at the portion where the various connectors 907 are arranged as shown in FIG. .

If the opening area of the exhaust opening 906 is small, the ability to exhaust the heat in the server unit 901 is lowered, and the temperature in the server unit 901 rises. To alleviate this problem, a structure in which an opening for heat dissipation is additionally formed in a place other than the back panel 904 can be considered. However, this structure is difficult to realize for the following reasons:
Even if it could be realized, it would not be so effective.

As shown in FIG. 11, in order to make the occupied volume as small as possible, the server units 901 are vertically stacked with almost no space. This is to store as many server units 901 as possible in the rack 908 in a place such as an office where the height to the ceiling is limited. In the structure shown in FIG. 11, since there is almost no gap between the vertically adjacent server units 901, even if an opening for exhaust is further provided on the upper surface or the lower surface of the server unit 901, air permeability cannot be obtained. Even if the vertically adjacent server units 901 are separated from each other by about several mm and an opening for exhaust is further provided on the upper surface or the lower surface of the server unit 901, effective ventilation is not obtained, and heat dissipation efficiency is hardly improved.

The server units 90 that are vertically adjacent to each other
If 1 is separated by about several cm and a fan is added to create a flow of air in the formed gap, the air permeability inside the server unit 901 becomes high and the heat dissipation efficiency is improved. However, this structure is not preferable because the storage density of the server unit 901 is reduced and a new fan is added, which complicates the structure.

Generally, there is a gap of several cm between the rack 908 and the side surface of the stacked server unit 901 913. However, a slide rail 911 for holding the server unit 901 is arranged in the gap 913, and a power distribution unit of a power source (not shown) is arranged in the gap 913. Therefore, the gap 913 has poor air permeability. Therefore, even if the exhaust opening is provided on the side surface of the server unit 901, the required improvement in heat dissipation efficiency cannot be obtained.

In the structure shown in FIG. 12, since the inclined portion 915 is provided, the space for arranging the connector on the rear panel 904 is sacrificed. Therefore, the structure shown in FIG. 12 is not suitable when the arrangement density of the connectors must be increased.

An object of the present invention is to provide an electronic device in which an opening for heat dissipation is effectively formed without sacrificing a space for arranging a connector and the like. It is another object of the present invention to provide a structure in which heat dissipation is improved without sacrificing a space for arranging a connector or the like in an electronic device arranged vertically in a rack.

[0020]

The outline of the invention of the present application is as follows. That is, it includes a first flat portion, a second flat portion that is formed differently from the first flat portion, and a step surface that connects the first flat portion and the second flat portion. It is an electronic device including a panel surface, an electric component arranged on the first or second flat portion, and a ventilation portion formed on the step surface. In the present invention, by forming the panel surface in a stepped shape, the usable area is increased, and the ventilation portion is secured without reducing the area for mounting the electrical component such as the connector. That is, according to the present invention, a connector arranged on a panel is formed by forming a step-like step on a panel surface of an electronic device and forming a ventilation portion such as an opening on the step surface (a surface formed in the step portion). The structure does not reduce the occupied area of electrical parts such as.

According to the present invention, for example, in a rear panel of an electronic device, an opening for ventilation can be secured without sacrificing a space for arranging various connectors. In addition, since the connector is arranged so as to be displaced front and back due to the step, a ventilation path that bypasses the mounting portion of the connector is secured inside the electronic device. When the connectors are arranged side by side on the same plane, it is difficult to secure a ventilation path because there is a portion to be joined with the mating connector and a flange portion for fixing the connector to the panel surface. However, when the connectors are arranged so as to be shifted forward and backward, a ventilation path that bypasses the connector is secured, and the ventilation is improved.

The present invention is effective when a large number of connectors must be arranged in an electronic device having a thin case. The present invention can be understood as a rack that stores the electronic device having the above-described configuration.

Examples of electric parts include parts having a specific function such as a connector in electronic equipment. As electrical parts, various connectors, expansion card inlets,
IC card slot, CD-ROM (compact
Disc-read only memory (DVD-ROM), DVD-ROM (digital video player)
sk-read only memory)
Examples include a replacement port for a hard disk device, a replacement port for a power supply unit, a display, an indicator lamp, a toggle switch, a rotary switch, a push switch, a slide switch, a rotary dial for adjustment or a slide adjuster.

Examples of electronic equipment include various server units, personal computers, various measuring equipment, modems, routers, broadcasting equipment, audio equipment, portable electronic equipment or communication equipment.

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. However, the present invention can be implemented in many different modes and should not be construed as being limited to the description of this embodiment. Note that the same elements are denoted by the same numbers throughout the embodiments.

(Embodiment 1) FIG. 1 is a diagram illustrating an outline of a rear structure of a server unit utilizing the present invention. In the present embodiment, a step is provided in the vertical direction on the back panel side of the electronic device. The present embodiment is an example in which the heat dissipation is improved while the area for installing the connector is secured by forming the heat dissipation opening on the stepped surface.

The server unit 101, which is an electronic device,
Includes a back panel side 102, a top panel 103 and a side panel 104. Here, the upper panel 103 and the facing surface (lower panel) (not shown) are not shown in the server unit 10.
It becomes the main aspect of 1. The other four surfaces (front and rear panel surfaces and both side surfaces) are end surfaces. On the side panel 104, a guide 105 for holding the server unit 101 in a rack described later is arranged. Also, the server unit 1
In 01, a CP required for a server function (not shown)
A U, a hard disk device, a memory unit, an interface unit and the like are stored.

In the structure shown in FIG. 1, the rear panel side 102
There is a step at 100. Flat portion 106
And 107 are formed in different steps, and both are connected by a step surface 109. The flat portions 106 and 107 respectively form the back panel of the server unit 101.

The flat portion 106 has a power connector 110,
A heat dissipation opening 111, a connector group 112, and a connector group 113 are arranged. A connector 115, a connector group 116, and a connector group 117 are arranged on the flat portion 107.

Connector groups 112, 113, 116, 11
7 and the connector 115 are for exchanging data signals, and are, for example, a modular connector for connecting a LAN cable or the like, a square or round connector for a multi-core cable, a connector compatible with the USB standard. , An optical fiber cable connector or various coaxial connectors. The external size of the plug cable tends to be thin and compact, as represented by a coaxial cable and an optical fiber cable. The same applies to plugs used in server products.

FIG. 2 shows the server unit 101 shown in FIG.
It is a figure which shows the state which stored in the rack 201. The server units 101 are stored in the rack 201 so as to be vertically stacked. A slide rail 202 is arranged inside the rack 201. Slide rail 2
02, the server unit 101 becomes the rack 201
Can be easily attached to or removed from the rack 201. The server unit 101 is held on the rack 201 by the slide rail 202. The vertically adjacent server units 101 have a gap (for example, about 2 mm) that does not hinder the movement of the server units 101.

On the front side 203 of the rack 201, a transparent decorative plate or punching metal plate (not shown) is attached. When a transparent makeup slope is used, a gap is provided between the rack 201 and the transparent makeup plate so that outside air can flow in. The rear side 204 is provided with a space for routing various wiring cables (not shown). A punching metal plate (not shown) is attached to the back side 204 in the use state. The top plate 205 of the rack 201 is provided with an opening 206 for heat dissipation so that the exhaust air from the server unit 101 escapes to the outside. Further, a fan (not shown) is attached to the opening 206 to enhance the exhaust efficiency.

In the structure shown in FIG. 1, the arrangement portion of the connector is made into a two-step step shape to form two-step flat portions 106 and 107. Then, in the flat portions 106 and 107,
The connectors are distributed. Also, the step surface 10
An opening 114 for radiating heat is formed at 9. With this structure, the opening 114 for heat dissipation can be secured without sacrificing the space for disposing the connector. And this structure is
Despite being a thin case, high heat dissipation can be secured without sacrificing connector mounting density.

Further, the heat radiated from the opening 114 can utilize the phenomenon that the air warmed inside moves upward, so that the heat radiating effect can be further enhanced. Small external size plug
If you select the cable and place the connector, the opening 114
It does not become an obstacle when radiating the warm air that moves upward from.

When this embodiment is adopted, the size of the server unit 101 in the front-rear direction is increased by several cm.
However, since there is a certain degree of freedom in the dimension of the rack 201 in the depth direction, this does not cause any particular problem.

(Embodiment 2) In the present embodiment, a step is formed in the horizontal direction on the rear panel side of an electronic device to secure an installation area for a connector and to provide an opening for ventilation. is there. FIG. 3 is a diagram illustrating an outline of a rear structure of a server unit using the present invention. In FIG. 3, the type and number of connectors are the same as in FIG.

In the structure shown in FIG. 3, the rear panel side 102
In, there are three steps in the horizontal direction. That is,
Forming the flat portions 301, 302 and 303 in a staircase shape,
Stepped surfaces 304 and 305 are formed.

On the flat portion 301, connector groups 113 and 1
17 are arranged. Connector groups 112 and 116 and a connector 115 are arranged on the flat portion 302. An opening 111 for heat dissipation is formed in the flat portion 303, and the power supply connector 110 is arranged therein.

Step surface 304 between the flat portions 301 and 302
An opening 306 for heat dissipation is formed in the. In addition, an opening 307 for heat dissipation is formed on the step surface 305 between the flat portions 302 and 303.

When the structure of this embodiment is adopted, the number of openings for heat dissipation can be increased as compared with the conventional structure without reducing the arrangement density of the connectors.

(Embodiment 3) In the present embodiment, a step is provided vertically and horizontally on the rear panel side of an electronic device to secure an installation area for the connector and to provide a ventilation hole on the step surface. Is. FIG. 4 is a diagram exemplifying an outline of a rear structure of a server unit using the present invention. In FIG. 4, the type and number of connectors are the same as those in FIG.

The structure shown in FIG. 4 is similar to that shown in FIG.
It is a combination of the structure shown in. In the structure shown in FIG. 4, one step is formed in three places and two steps are formed in one place.

The following three points are formed in one step. First, the first location is a location configured by the flat portions 401 and 403 and the step surface 402 connecting the flat portions 401 and 403.
The second portion is a portion formed by the flat portions 406 and 408 and the step surface 407 connecting the flat portions 406 and 408. The third location is a location formed by the flat portions 403 and 408 and the step surface 405 connecting the flat portions 403 and 408.

The two steps have flat portions 401 and 406, a step surface 404 connecting them, and flat portions 406 and 41.
0, and a stepped surface 409 connecting the two.

A connector group 117 is arranged on the flat portion 401. A connector group 113 is arranged on the flat portion 403. A connector 115 and a connector group 112 are arranged on the flat portion 406. The connector group 112 is arranged on the flat portion 408. Flat portion 410
A heat-dissipating opening 111 is formed in the, and a power supply connector 110 is further arranged.

An opening 411 for heat dissipation is formed on the step surface 402. The step surface 404 has a heat dissipation opening 41.
2 is formed. A heat dissipation opening 413 is formed in the step surface 405. An opening 414 for heat dissipation is formed in the step surface 407. A heat dissipation opening 415 is formed in the step surface 409.

In the structure illustrated in FIG. 4, in addition to the opening 111, the openings 411, 414, 412, 413 and 41.
5 is formed. Therefore, in this structure, a higher heat radiation effect can be obtained even with the same connector arrangement density as in the case of the server unit having the conventional structure illustrated in FIG.

(Embodiment 4) The present embodiment relates to a structure in which the structure illustrated in FIG. 1 is improved and the heat dissipation effect is further enhanced. FIG. 5: is a figure which illustrates the outline of the back surface structure of the server unit which utilized this invention.

In this embodiment, a step is formed at the corner portion on the back panel side to further secure an opening for heat dissipation. That is, in the structure illustrated in FIG. 5, a step is provided in the corner portion 501 on the rear panel side 102, and the flat portion 50 is formed.
2 and a step surface 503 are formed. And FIG.
In the structure illustrated in FIG. 3, openings 504 and 505 for heat dissipation are formed in the flat portion 502 and the step surface 503.

By adopting the configuration shown in this embodiment, the heat dissipation from the inside of the server unit 101 can be further improved. The present embodiment may be used for a structure other than that illustrated in FIG.

(Embodiment 5) This embodiment is an example in which the present invention is applied to a server unit having an expansion card insertion slot. FIG. 6 is a diagram exemplifying an outline of a rear structure of a server unit using the present invention. In this embodiment, in the structure shown in FIG. 1, instead of the connector group 113, an expansion card (for example, PCI bus standard expansion card) is used.
This is an example in which insertion ports 601 and 602 are provided.

As the server unit becomes more sophisticated, it may be necessary to provide various expansion card insertion ports in addition to the connector. By adopting the structure shown in FIG. 6,
Even with the structure in which the insertion port for the expansion card is arranged, the opening 114 for heat dissipation can be secured.

(Embodiment 6) This embodiment is an example in which the heat dissipation is further improved by devising the method of storing the server unit in the rack. FIG. 7: is a figure which illustrates the outline of the back surface structure of the server unit which utilized this invention. FIG. 8 is a diagram exemplifying a storage state of a server unit in a rack using the present invention.

Here, as the server unit 101,
An example in which the structure illustrated in FIG. 1 is adopted will be described. In this embodiment, a heat dissipation opening 701 is further formed in the top panel 103, which is the main surface of the server unit 101.
The opening 701 is formed on the rear panel side 102 of the upper panel 103.
Is formed in a portion close to.

In this embodiment, the server unit 101a, the server unit 101b, and the server unit 101c are vertically stacked and stored in a rack (not shown) while being displaced by a distance L. L has a size such that the opening 701 is exposed. Here, the server unit is arranged so as to be displaced forward by the distance L as it goes upward.
The mechanism for storing the server unit 101 in the rack is the same as that illustrated in FIG.

In this storage structure, the server unit 101
a, server unit 101b and server unit 10
An opening 701 is formed in a portion adjacent to the back panel side 102 of the top panel 103 of 1c. And the opening 701
However, it is exposed at the position where the vertically adjacent server units are displaced. Therefore, a heat radiation effect from the inside of the server unit by the function of the opening 701 can be obtained. Also, FIG.
In the structure shown in (1), more heat radiation paths in the upward direction are secured compared to the rack storage structure shown in FIG.
The heat dissipation effect can be enhanced.

FIG. 8 shows a structure in which the server units are stacked in three stages. The number of stacks of server units is 3
It is not limited to steps. When the number of layers to be stacked is large, for example, a structure in which five server units are stacked is one unit, and a plurality of units are further stacked. In addition, an appropriate gap, a dummy case, a distributor, a power supply unit, or the like is arranged between the units so that the opening 701 formed in the upper panel 103 is not blocked and air permeability is ensured.

Although not shown, there is also a portion where vertically adjacent server units are displaced on the front panel side. That is, the upper server unit has a portion protruding forward by the distance L with respect to the lower server unit. An intake opening may be provided in the lower panel portion of the protruding server unit.

Although the example of using the server unit having the structure shown in FIG. 1 has been described here, the server unit shown in another embodiment may be used. Also, not all server units need to have the same structure. Alternatively, the server unit may be displaced rearward as it goes upward. Moreover, it is not necessary that all the displaced dimensions L be the same.
For example, the dislocation dimension L may be changed stepwise or alternately.

Although the present invention has been specifically described above based on the embodiments, the present invention is not limited to the above-mentioned embodiments and can be modified within the scope of the invention.

In the above-described embodiment, the structure for radiating heat from the rear panel side has been described as an example, but a structure for cooling the inside of the case may be a structure for sucking air from the rear panel side. Further, the layout design of the connectors and the types of the connectors can be appropriately changed according to the embodiment.
Further, the structure of the ventilation part is not limited to the slit shape, and any shape such as a rectangular shape, a round shape, or a polygonal shape can be used. Further, the structure of the ventilation part may be configured such that the part to be ventilated is made of mesh instead of forming the opening. Further, the ventilation part may ensure the ventilation as a mere opening. In addition, a fan may be arranged close to the ventilation part to enhance the exhaust (or intake) capacity.

The present invention may be applied to the front panel side. For example, if there is not enough space to provide an opening for ventilation on the front panel side of an electronic device such as a server unit,
A step may be formed on the front panel side, and an opening for ventilation may be formed in the step portion. In the present embodiment, the server unit has been described as an example of the electronic device, but the electronic device may be another electronic device.

The application of the present invention is not limited to only electronic equipment stacked and stored in a rack. For example, the present invention
It can be used in a personal computer or the like when it is difficult to secure a place for forming a heat dissipation opening on the panel surface due to the presence of a connector, an insertion port for an expansion card, or the like.

Further, the present invention may be applied to a part of the server unit stored in the rack. For example, in the case where a server unit stored in a rack generates a large amount of heat, the present invention may be used only for that server unit and other server units may have a conventional structure. Further, the present invention may be used in a configuration in which electronic devices are vertically arranged and horizontally arranged. In this case, the upper surface and the lower surface of the electronic device are in a positional relationship of being rotated by 90 degrees.

Further, as shown in the embodiment, the step may be formed in a plurality of steps. Further, the steps may be arranged by combining those having different sizes.
In addition, steps formed in different directions may be arranged in combination. Further, an opening for ventilation may be formed in one or more of the flat portions arranged in different steps via the step surface. Further, the flat portions formed in different steps need not be parallel to each other. For example, for design reasons,
The other flat portion may be inclined with respect to one flat portion. Further, the flat portion does not have to be a completely flat surface. That is, the flat portion may include a flatness or a flat portion to the extent that an electronic component can be arranged.

[0066]

By adopting the present invention, there is provided an electronic device in which an opening for heat dissipation is effectively formed without sacrificing a space for arranging a connector and the like. Further, in an electronic device vertically stacked on a rack, there is provided a structure with improved heat dissipation without sacrificing a space for arranging a connector and the like.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an outline of a rear structure of a server unit using the present invention.

FIG. 2 is a diagram illustrating a state where the server unit shown in FIG. 1 is stored in a rack.

FIG. 3 is a diagram exemplifying an outline of a back structure of a server unit using the present invention.

FIG. 4 is a diagram exemplifying an outline of a back structure of a server unit using the present invention.

FIG. 5 is a diagram exemplifying an outline of a back structure of a server unit using the present invention.

FIG. 6 is a diagram illustrating an outline of a rear structure of a server unit using the present invention.

FIG. 7 is a diagram exemplifying an outline of a rear structure of a server unit using the present invention.

FIG. 8 is a diagram illustrating a storage state of a server unit in a rack using the present invention.

FIG. 9 is a diagram illustrating an appearance of a typical server unit.

FIG. 10 is a diagram showing a state where the server unit of FIG. 9 is viewed from the rear panel side.

FIG. 11 is a diagram showing a state where the server unit illustrated in FIGS. 9 and 10 is stored in a rack.

FIG. 12 is a view showing another conventional structure of the server unit.

[Explanation of symbols]

101 ... server unit, 101A ... server unit,
101B ... Server unit, 101C ... Server unit, 102 ... Rear panel side, 103 ... Top panel, 10
4 ... Side panel, 105 ... Guide, 106 ... Flat part, 1
07 ... Flat part, 109 ... Step surface, 110 ... Power supply connector, 111 ... Opening, 112 ... Connector group, 113 ... Connector group, 114 ... Opening, 115 ... Connector, 116 ... Connector group, 117 ... Connector group, 201 ... Rack , 20
2 ... Slide rail, 203 ... Front side, 204 ... Back side, 205 ... Top plate, 206 ... Opening, 301 ... Flat part, 3
02 ... Flat part, 303 ... Flat part, 304 ... Step surface, 30
5 ... step surface, 306 ... opening, 307 ... opening, 401 ... flat portion, 402 ... step surface, 403 ... flat portion, 404 ... step surface, 405 ... step surface, 406 ... flat portion, 407 ... step surface, 408 ... Flat part, 409 ... step surface, 410 ... flat part, 411 ... opening, 412 ... opening, 413 ... opening, 41
4 ... Opening, 415 ... Opening, 501 ... Stepped surface, 502 ... Flat part, 503 ... Stepped surface, 504 ... Opening, 601 ... Insertion opening, 701 ... Opening, 901 ... Server unit, 903 ...
Front panel, 904 ... Rear panel, 905 ... Power connector, 906 ... Opening, 907 ... Connector, 908 ... Rack, 909 ... Rear side, 910 ... Opening, 911 ... Slide rail, 912 ... Front side, 913 ... Gap, 914 ... Opening, 915 ... Inclined part.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masatoshi Anzai             1623 1423 Shimotsuruma, Yamato-shi, Kanagawa Japan             BM Co., Ltd. Daiwa Office (72) Inventor Shigeki Mori             1623 1423 Shimotsuruma, Yamato-shi, Kanagawa Japan             BM Co., Ltd. Daiwa Office F-term (reference) 5E322 BA01 EA11

Claims (7)

[Claims] 1. A first flat portion, a second flat portion formed differently from the first flat portion, and a step surface connecting the first flat portion and the second flat portion. An electronic device, comprising: a panel surface including :, an electric component disposed on the first or second flat portion, and a ventilation portion formed on the step surface. 2. The electronic device according to claim 1, wherein the panel surface is a case end surface, and the electric component is a connector. 3. The electronic device according to claim 1, wherein the panel surface is a case end surface, and further includes a ventilation portion formed in a portion of an upper surface or a lower surface of the case adjacent to the panel surface. 4. A first flat portion, a second flat portion formed differently from the first flat portion, and a step surface connecting the first flat portion and the second flat portion. A rack storing an electronic device including: a panel surface including an electric component, an electric component disposed on the first or second flat portion, and a ventilation portion formed on the step surface. 5. The electrical component is a connector.
A rack that stores the described electronic devices. 6. A first flat portion, a second flat portion formed in a step different from that of the first flat portion, and a step surface connecting the first flat portion and the second flat portion. , A panel surface including, an electric component disposed on the first or second flat portion, a first ventilation portion formed on the step surface, and a panel surface on an upper surface or a lower surface of the case. A rack storing an electronic device, which has a structure in which a plurality of electronic devices including a second ventilation part formed in a part are shifted and overlapped, and the second ventilation part is located in the shifted part. 7. The electrical component is a connector.
A rack that stores the described electronic devices.